CN115763439A - Partitioned electromagnetic shielding module, preparation method, circuit board and electronic product - Google Patents
Partitioned electromagnetic shielding module, preparation method, circuit board and electronic product Download PDFInfo
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Abstract
The invention discloses a partitioned electromagnetic shielding module, a preparation method, a circuit board and an electronic product. This module includes the base plate, the ground connection pad, flip chip, chip or components and parts, shielding line arc, plastic-sealed body and electromagnetic shield layer, flip chip's the surface of keeping away from the base plate is provided with the weldable line metal layer, the ground connection pad is located the base plate, and be located between flip chip and chip or the components and parts, the plastic-sealed body covers the ground connection pad, flip chip, chip or components and parts, shielding line arc, the electromagnetic shield level is in the surface of plastic-sealed body, shielding line arc sets up between flip chip and chip or components and parts, and the weldable line metal layer is connected to the one end of shielding line arc, the electromagnetic shield layer is connected to the other end. The invention can reduce the arc height of the shielding wire, improve the packaging quality, simplify the process difficulty and improve the packaging integration level to a certain extent.
Description
Technical Field
The invention relates to a partitioned electromagnetic shielding module, a preparation method of the partitioned electromagnetic shielding module, a circuit board with the partitioned electromagnetic shielding module and an electronic product, and belongs to the technical field of chip packaging.
Background
With the integration of electronic components becoming higher and higher, the distance between each component in the integrated circuit becomes smaller and smaller, resulting in the problem of mutual interference between the components becoming more and more serious. In order to prevent the chip or the chip and the device from generating electromagnetic interference, a wire bonding method or a method of filling a groove in a plastic package with a shielding medium is generally used to achieve partitioned electromagnetic shielding. The specific wire bonding method includes: and forming a metal net, a metal fence, a metal vertical line and the like on the substrate by routing, so that the electromagnetic shielding layer covered on the surface of the plastic package body is connected with the shielding wire arc to realize electromagnetic shielding.
In the chinese patent No. ZL 202110202607.8, an electromagnetic shielding package structure and an electromagnetic shielding package method are disclosed. The electromagnetic shielding packaging structure comprises a substrate, at least two chips attached to the substrate, a shielding line arc arranged on the substrate, a plastic packaging body covering the chips and the shielding line arc and a metal shielding layer covering the surface of the plastic packaging body, wherein the shielding line arc is arranged on a grounding bonding pad around the chips. However, the wire-bonding method uses a high height of wire loop, which results in a difficult wire-bonding operation and poor stability of wire loop.
Disclosure of Invention
The invention provides a module for partitioned electromagnetic shielding.
Another technical problem to be solved by the present invention is to provide a method for manufacturing a module with partitioned electromagnetic shielding.
Another object of the present invention is to provide a circuit board having the partitioned electromagnetic shielding module.
Another object of the present invention is to provide an electronic product having the partitioned electromagnetic shielding module.
In order to achieve the technical purpose, the invention adopts the following technical scheme:
according to a first aspect of the embodiments of the present invention, there is provided a partitioned electromagnetic shielding module, which includes a substrate, a ground connection pad, a flip chip, a chip or a component, a shielding wire loop, a plastic package body, and an electromagnetic shielding layer,
the surface of the flip chip away from the substrate is provided with a layer of solderable wire metal,
the ground connection pad is located on the substrate and between the flip chip and the chip or component,
the plastic package body covers the grounding connecting pad, the flip chip, the chip or the component and the shielding wire arc,
the electromagnetic shielding layer is positioned on the surface of the plastic package body,
the shielding wire arc is arranged between the flip chip and the chip or the component, one end of the shielding wire arc is connected with the weldable wire metal layer, and the other end of the shielding wire arc is connected with the electromagnetic shielding layer.
Wherein preferably said shield wire arcs comprise a first wire arc and a second wire arc, said first wire arc connecting said solderable wire metal layer and said electromagnetic shield layer; the second wire arc is connected with the grounding connecting pad and the electromagnetic shielding layer.
Preferably, the wire-bondable metal layer covers the entire back surface of the flip chip or covers the outer periphery of the flip chip.
Preferably, the shield wire arc is linear, L-shaped or square.
Preferably, when the shielding wire arc is linear or L-shaped, the solderable wire metal layer covers the outer periphery of the flip chip; when the shielding wire arc is in a square shape, the weldable wire metal layer covers the whole back of the flip chip.
According to a second aspect of the embodiments of the present invention, there is provided a method for manufacturing a partitioned electromagnetic shielding module, including the following steps:
s1: forming a ground connection pad on a substrate;
s2: mounting a flip chip and a chip or a component on a substrate;
s3: forming a solderable wire metal layer on the back surface of the flip chip;
s5: routing between the grounding connecting pad and the weldable wire metal layer to form a shielding wire arc;
s5: forming a plastic package body on the substrate, and exposing the top end of the shielding wire arc to the surface of the plastic package body;
s6: forming an electromagnetic shielding layer on the back of the plastic package body, so that the electromagnetic shielding layer is electrically connected with the shielding wire arc;
s7: and cutting the substrate into single pieces.
According to a third aspect of the embodiments of the present invention, there is provided a method for manufacturing a module of a partitioned electromagnetic shield, including the following steps:
s1: forming a ground connection pad on a substrate;
s2: mounting a flip chip and a chip or a component on a substrate;
s3: forming a solderable wire metal layer on the back surface of the flip chip;
s5: routing between the grounding connecting pad and the weldable metal layer to form a shielding wire arc;
s5: forming a plastic package body on the substrate, thinning the plastic package body to cut off the routing to form a shielding line arc and expose the shielding line arc;
s6: forming an electromagnetic shielding layer on the back of the plastic package body, so that the electromagnetic shielding layer is electrically connected with the shielding wire arc;
s7: and cutting the substrate into single pieces.
According to a fourth aspect of the embodiments of the present invention, there is provided a method for manufacturing a partitioned electromagnetic shielding module, including the steps of:
s1: forming a ground connection pad on a substrate;
s2: mounting a flip chip and a chip or a component on a substrate;
s3: forming a solderable wire metal layer on the back surface of the flip chip;
s5: routing between the grounding connecting pad and the weldable wire metal layer to form a shielding wire arc;
s5: forming a plastic package body on the substrate, and exposing the top end of the shielding wire arc to the surface of the plastic package body;
s6: singulating the substrate;
s7: and forming an electromagnetic shielding layer for the single packaging body, and enabling the electromagnetic shielding layer to be electrically connected with the shielding wire arc.
According to a fifth aspect of the embodiments of the present invention, there is provided a method for manufacturing a partitioned electromagnetic shielding module, including the steps of:
s1: forming a grounding connecting pad on the substrate;
s2: mounting a flip chip and a chip or a component on a substrate;
s3: forming a solderable wire metal layer on the back surface of the flip chip;
s5: routing between the grounding connecting pad and the weldable metal layer to form a shielding wire arc;
s5: forming a plastic package body on the substrate, thinning the plastic package body to cut off the routing to form a shielding line arc and expose the shielding line arc;
s6: singulating the substrate;
s7: and forming an electromagnetic shielding layer for the single packaging body, and enabling the electromagnetic shielding layer to be electrically connected with the shielding wire arc.
According to a sixth aspect of the embodiments of the present invention, a circuit board is provided, wherein the circuit board includes the partitioned electromagnetic shielding module.
According to a seventh aspect of the embodiments of the present invention, an electronic product is provided, which includes the module with the partitioned electromagnetic shield.
Compared with the prior art, the invention has the following technical effects: the back of the flip chip and the grounding connection pads around the back of the flip chip are wired, so that electromagnetic shielding between the chip and the component or between the chip and the chip is realized. By the routing method, the height of a shielding wire arc can be reduced, the packaging quality is improved, the process difficulty is simplified, the space utilization rate of the substrate is improved to a certain extent, and the requirement of improving the packaging integration level is met.
Drawings
Fig. 1 to 7 are flow charts of a method for manufacturing a partitioned electromagnetic shielding module according to a first embodiment of the present invention;
fig. 8 to 9 are schematic diagrams illustrating a method for manufacturing a partitioned electromagnetic shielding module according to a second embodiment of the present invention, and illustrating different steps of the partitioned electromagnetic shielding module according to the first embodiment;
fig. 10 is a schematic view of a solderable wire metal layer of a flip chip in an embodiment of the invention;
fig. 11 (a) is a schematic illustration of one form of the solderable line metal layer of fig. 10;
fig. 11 (b) is a schematic view of another form of the solderable line metal layer of fig. 10;
fig. 12 (a) -12 (b) are schematic structural diagrams of an implementation manner of a module for partitioned electromagnetic shielding in a third embodiment of the present invention;
fig. 13 (a) -13 (b) are schematic structural diagrams of another implementation manner of the module for partitioned electromagnetic shielding in the third embodiment of the present invention;
FIGS. 14-16 are flow charts illustrating a method for fabricating a partitioned electromagnetically shielded module according to a fourth embodiment of the present invention;
fig. 17 to 18 are schematic diagrams of different steps of an alternative method for manufacturing a partitioned electromagnetically shielded module according to a fourth embodiment of the present invention.
Detailed Description
The technical contents of the invention are described in detail below with reference to the accompanying drawings and specific embodiments.
< first embodiment >
As shown in fig. 1 to 7, a first embodiment of the present invention discloses a method for manufacturing a module with partitioned electromagnetic shielding, which includes the following steps:
s1: a ground connection pad 11 is formed on a substrate 12.
As shown in fig. 1, the substrate 12 includes a base 121, a functional circuit 122, and a substrate sidewall ground 123. The base material 121 is a dielectric material such as ceramic, PP, epoxy, or the like, and is preferably provided in a multilayer arrangement. The functional circuit 122 is distributed on the multilayer substrate 121. The layout of the functional circuit 122 is different according to the specific application scenario as understood by those skilled in the art, and therefore, the description thereof is omitted here. The substrate sidewall grounding lines 123 are distributed on the sidewalls of the substrate 12, one end of each of the substrate sidewall grounding lines is grounded, and the other end of each of the substrate sidewall grounding lines is exposed on the sidewalls of the substrate 12, so as to facilitate connection with the electromagnetic shielding layer 17 covering the surface of the sidewalls of the substrate 12, thereby preventing external electromagnetic interference.
The grounding pad 11 is located on the upper surface of the substrate 12 for providing electrical connection for the subsequent wire bonding package, and the material thereof may be one or more of Cu, al, au, ag, sn, and the like, or an alloy thereof. The ground connection pads 11 may be formed during the manufacturing process of the substrate 12, or may be formed by attaching metal bumps to the substrate 12 by SMT (surface mount technology) or other methods. The grounding connection pads 11 may be distributed independently, or may be partially connected into a strip, or may be entirely connected into a whole strip.
S2: a flip chip 13 and a chip or component 14 are mounted on the substrate 12.
As shown in fig. 2, in the present embodiment, the flip chip 13 is a chip such as SAW, BAW, etc. having requirements against electromagnetic interference, and is an electromagnetic interference sensitive device. The chip or component 14 is a source of electromagnetic interference that interferes with the flip chip 13. Therefore, it is necessary to shield the flip chip 13 from the chip or component 14 by wire bonding.
The front side (substrate-facing surface) of the flip chip 13 includes bumps 21 and the back side has a layer of solderable wire metal 22 (described in more detail below). The flip chip 13 can solder the bumps 21 to the substrate 12 by using an FC packaging method or an SMT mounting method. The bump 21 is a material capable of performing soldering and electrical connection, and is generally a solder ball. But its thickness of bonding wire metal level 22 need be greater than 1um for increase flip chip 13 and shielding line arc 15's cohesion, the follow-up routing operation of being convenient for.
The electrical connection between the chip or component 14 and the substrate 12 may be Wire Bonding (WB), flip Chip (FC), surface Mount Technology (SMT), or other processes commonly used in semiconductor packaging.
The ground connection pad 11 is located between two devices interfering with each other, i.e. between the flip chip 13 and the chip or device 14, and can be flexibly designed according to the circuit wiring requirement.
S3: a layer of solderable wire metal 22 is formed on the back side of the flip chip 13.
Solderable line metal layer 22 is formed using evaporation techniques in this embodiment, but other techniques, such as sputtering, may be used. The following description will be made by taking vapor deposition as an example.
Solderable wire metal layer 22 is a three-layer metal technology structure that can function as an adhesion layer, a transition layer, and a conductive layer, respectively. Upper adhesive layer (contact layer): generally, a material with good adhesion, a coefficient of thermal expansion close to that of a wafer material and a small ohmic contact coefficient with the wafer material is selected; in the present embodiment, the wafer material is a silicon wafer, so chromium or titanium may be selected, and titanium metal is used herein.
Lower adhesive layer (protective layer): the solder layer is the outermost layer on the back of the chip, has stable performance, is not easy to oxidize, is easy to weld the solder layer, and has good electric conduction and heat conduction performance. Metals such as gold and silver may be used. Silver is selected in this example.
Barrier layer (filling layer): the transition function is realized between the contact layer and the conducting layer, and the gold and silver films can not be directly made on the chromium and titanium metal films. Because gold and silver films are easily dissolved in solders such as tin and silver, the solders are directly contacted with metal films of titanium and chromium, but the metals are difficult to weld, and the welding performance of the chip is poor; a barrier layer, typically nickel, is provided between the two metals.
In this embodiment, a titanium layer (1 KA) is deposited, a nickel layer (2 KA) is deposited, and a silver layer (10 KA) is deposited.
S4: wire bonding is performed between the ground pads 11 and the solderable metal layer 22 to form shield wire loops 15.
As shown in fig. 3, the shield wire loop 15 has a first end 151 that is landed on the ground connection pad 11 and a second end 152 that is landed on the solderable wire metal layer 22 of the flip-chip 13. The bonding wire used for routing can be one or more of conductive bonding wires such as Au, cu, al and the like.
Due to the high height of the flip-chip 13, the distance L1 from the first end 151 to the top a of the wire bond is smaller than the distance L2 from the second end 152 to the top a of the wire bond (i.e., L1< L2). In the conventional technique, the first end and the second end of the wire bonding are both led out from the substrate or the grounding connection pad, so that the distance from the first end to the top end of the wire bonding is basically the same as the distance from the second end to the top end of the wire bonding, and thus, the length L of the whole wire bonding is approximately equal to 2 × L2. However, in the embodiment of the present invention, the length L = L1+ L2<2 × L2 of the whole wire bonding, so that the length L of the whole wire bonding is shortened. It is known that the longer the length of the slender bonding wire is, the poorer the ability of the slender bonding wire to withstand the mold pressing in the plastic molding process is, and the more easily the slender bonding wire is displaced or collapsed, which results in the deterioration of the electromagnetic shielding effect. Therefore, the embodiment of the invention shortens the length of the L1 by utilizing the height of the flip chip, shortens the length L of the whole routing and is beneficial to improving the electromagnetic shielding effect.
Moreover, the whole routing length L is shortened, and the routing operation difficulty is reduced.
S5: and forming a plastic package body 16 on the substrate 12, thinning the plastic package body 16 to cut off the routing to form a shielding wire arc 15 and expose the shielding wire arc 15.
As shown in fig. 4, a molding compound 16 is formed on the substrate 12 to encapsulate the flip chip 13, the chip or component 14, the shield wire 15, and the ground connection pad 11. At this time, the shielding wire arc 15 is not exposed to the plastic-sealed body 16, i.e. the height of the plastic-sealed body 16 is significantly greater than the height of the top a of the shielding wire arc 15.
Then, as shown in fig. 5, the plastic package body 16 is thinned by a back grinding process or the like, so that the top ends of the wire bonds are cut off to form two segments of shielding wire arcs 15, and the top ends of the two segments of shielding wire arcs 15 are exposed from the back surface (the surface far from the substrate) where the plastic package body 16 is exposed.
S6: and forming an electromagnetic shielding layer 17 on the back surface of the plastic package body 16, so that the electromagnetic shielding layer 17 is electrically connected with the shielding wire arcs 15.
As shown in fig. 6, a metal electromagnetic shielding layer 17 is formed on the back surface of the plastic package 16 by sputtering, coating, or the like. And, the electromagnetic shield layer 17 is electrically connected to the exposed tip of the shield wire loop 15. In this embodiment, the electromagnetic shielding layer 17 is formed by covering the surface of the plastic package 16 with an electromagnetic shielding layer 17 by electroplating or sputtering on the surface of the entire (strip level, also referred to as "board level") package structure. And, the shielding wire arc 15 exposed on the surface of the plastic package body 16 is connected to the grounding connection pad 11 or the bonding wire metal layer 22, so as to achieve electromagnetic shielding.
The wire-bondable metal layer 22 is used for mechanically connecting and electrically connecting the shielding wire arcs 15 on the flip chip 13, and interference signals are conducted to the electromagnetic shielding layer 17 through the shielding wire arcs 15 and then conducted to the grounding connection pad 11 through the electromagnetic shielding layer 17, so that electromagnetic shielding is realized.
In this embodiment, the electromagnetic shielding layer 17 is a metal layer, and includes three layers, namely a stainless steel layer, a copper layer and a stainless steel layer, which cover the surface of the plastic package body 16.
S7: the substrate 12 is singulated.
As shown in fig. 7, the substrate 12 with completed electromagnetic shielding is cut to form a single partitioned electromagnetic shielding module.
< second embodiment >
Alternatively, after the steps described in S1 to S5 in the first embodiment, that is, after the back grinding of the plastic package 16, as shown in fig. 8, the substrate 12 is cut, and then as shown in fig. 9, the electromagnetic shielding layer 17 is covered under a single package (unit level). In this way, the electromagnetic shielding layer 17 covers all surfaces except the bottom surface of a single module, and the electromagnetic shielding layer 17 can be connected with the ground wire through the shielding wire arcs 15 and also can be connected with the substrate side wall ground wire 123.
< third embodiment >
The embodiment provides a module obtained by adopting the preparation method of the partitioned electromagnetic shielding module.
As shown in fig. 7 and 9, the partitioned electromagnetically shielded module includes a ground connection pad 11, a substrate 12, a flip chip 13, a chip or component 14, a shielding wire loop 15, a molding compound 16, and an electromagnetic shielding layer 17.
With reference to fig. 10, 11 (a) and 11 (b), the solderable wire metal layer 22 on the back side of flip-chip 13 may have different shapes. The layer of solderable wire metal 22 may cover the entire back side of the flip chip 13 or may cover only the outer perimeter of the flip chip 13.
The routing of the shield wire 15 may vary depending on the shielding requirements. In the foregoing embodiment, the shield wire 15 is located only between the flip chip 13 and the chip or component 14, that is, the shield wire 15 is only one straight line. However, the shield wire 15 may have an L shape or a square shape depending on the shield requirements. Preferably, when the shield wire arc 15 is linear or L-shaped, the solderable wire metal layer 22 covers the outer periphery of the flip chip; when shield wire loop 15 is square, solderable wire metal layer 22 covers the entire back of the flip chip.
As shown in fig. 12 (a) and 12 (b), the partitioned electromagnetic shielding module includes a ground connection pad 11, a substrate 12, a flip chip 13, a chip or a component 14, a shielding wire loop 15, a plastic package 16, an electromagnetic shielding layer 17, and a second component 18. In the figure, the right side of the flip chip 13 is the chip or component 14 and the front side of the flip chip 13 is the second component 18.
As shown in fig. 12 (a), the ground connection pads 11 are formed between the flip chip 13 and the second component 18, and between the flip chip 13 and the chip or the component 14, so that the shielding wire arcs 15 strike the ground connection pads 11 and the flip chip 13 to form an L shape, and the flip chip 13 and the component 18 are electromagnetically shielded, and the flip chip 13 and the chip or the component 14 are electromagnetically shielded.
As shown in fig. 12 (b), the ground pads 11 surround the flip chip 13 to form a ring-shaped region, and the shielding wire arcs 15 are distributed around the flip chip 13 to electromagnetically shield the flip chip 13 and the second component 18, the chip or the device 14. The shielding effect of the electromagnetic shield achieved by the wire bonding in the shape of a Chinese character 'kou' is better than that of the shielding wire loop 15 in the L-shaped arrangement shown in fig. 12 (a).
Fig. 13 (a) and 13 (b) illustrate that the flip chip 13 is provided with a second component 19 and a third component 20, which need to be electromagnetically shielded, on the left and right sides, respectively, and the first component 18 is on the front side of the flip chip 13. Similarly, the wire bonding method can be L-shaped (shown in fig. 13 (a)) or square (shown in fig. 13 (b)). The shield wire arcs on the flip-chip 13 may isolate the flip-chip 13 or the second component 19 from interference from the third component 20. Similarly, interference from the flip-chip 13 or the second component 19 can also be isolated by shielding arcs on the flip-chip 13 to avoid interference with the third component 20.
Therefore, the electromagnetic interference phenomenon between the chips or the components or between the chips and the components can be prevented.
< fourth embodiment >
The embodiment discloses another method for manufacturing a partitioned electromagnetic shielding module. The present embodiment is different from the first embodiment in that, when the chip is subjected to plastic molding, the height of the plastic package body 16 is low, as shown in fig. 14, so that the top end a of the shielding wire arc 15 is exposed on the surface of the plastic package body 16, and the plastic package body 16 does not need to be subjected to back grinding.
Specifically, as shown in fig. 14 to 16, the method for preparing the partitioned electromagnetic shielding module includes the following steps:
s1: forming a ground connection pad 11 on a substrate 12;
s2: mounting a flip chip 13 and a chip or component 14 on a substrate 12;
s3: forming a solderable wire metal layer 22 on the back side of the flip chip 13;
s5: routing between the grounding connecting pad 11 and the weldable metal layer 22 to form a shielding wire arc 15;
s5: forming a plastic package body 16 on the substrate 12, and exposing the top end A of the shielding wire arc 15 to the surface of the plastic package body 16;
s6: forming an electromagnetic shielding layer 17 on the back surface of the plastic package body 16, so that the electromagnetic shielding layer 17 is electrically connected with the shielding wire arc 15;
s7: the substrate 12 is singulated.
Alternatively, after the steps shown in S1 to S5, as shown in fig. 17, the substrate 12 is singulated, and then as shown in fig. 18, the individual modules are covered with the electromagnetic shielding layer 17. In this manner, the electromagnetic shielding layer 17 covers all surfaces except the bottom surface of the single module, and the electromagnetic shielding layer 17 can be connected to the ground line not only through the shielding wire arcs 15, but also through the substrate sidewall ground line 123.
< fifth embodiment >
The invention also provides a circuit board with the partitioned electromagnetic shielding module. The circuit board can be used for electronic products such as smart phones and tablet computers.
< sixth embodiment >
The invention also provides an electronic product with the partitioned electromagnetic shielding module. The electronic product can be a smart phone, a tablet personal computer, wearable electronic equipment, an intelligent networking automobile and the like.
In various embodiments of the present invention, electromagnetic shielding between chips and devices or between chips is achieved by wire bonding on the back side of the flip chip and the ground connection pads around the back side of the flip chip. By the routing method, the height of a shielding wire arc can be reduced, the packaging quality is improved, the process difficulty is simplified, the space utilization rate of the substrate is improved to a certain extent, and the requirement for improving the packaging integration level is met.
The present invention provides a module with partitioned electromagnetic shielding, a method for manufacturing the module, a circuit board and an electronic product. It will be apparent to those skilled in the art that any obvious modifications thereto can be made without departing from the spirit of the invention in its broadest form, and it is the infringement of the claims that follow, and the corresponding legal obligations are to be afforded.
Claims (11)
1. The utility model provides a module of subregion electromagnetic shield, includes base plate, ground connection gasket, flip chip, chip or components and parts, shielding line arc, plastic-sealed body and electromagnetic shield layer, its characterized in that:
the surface of the flip chip remote from the substrate is provided with a solderable wire metal layer,
the ground connection pad is located on the substrate and between the flip chip and the chip or component,
the plastic package body covers the grounding connecting pad, the flip chip, the chip or the component and the shielding wire arc,
the electromagnetic shielding layer is positioned on the surface of the plastic package body,
the shielding wire arc is arranged between the flip chip and the chip or the component, one end of the shielding wire arc is connected with the weldable wire metal layer, and the other end of the shielding wire arc is connected with the electromagnetic shielding layer.
2. The partitioned electromagnetically shielded module of claim 1, wherein:
the shielding wire arcs comprise a first wire arc and a second wire arc, and the first wire arc is connected with the weldable wire metal layer and the electromagnetic shielding layer; the second wire arc is connected with the grounding connecting pad and the electromagnetic shielding layer.
3. The partitioned electromagnetically shielded module of claim 2, wherein:
the wire bondable metal layer covers the entire back surface of the flip chip or covers the outer perimeter of the flip chip.
4. A zoned electromagnetic shielding module according to claim 2, wherein:
the shielding line arc is linear, L-shaped or square.
5. The partitioned electromagnetically shielded module of claim 4, wherein:
when the shielding wire arc is in a linear shape or an L shape, the weldable wire metal layer covers the outer periphery of the flip chip; when the shielding wire arc is in a square shape, the solderable wire metal layer covers the whole back of the flip chip.
6. A preparation method of a partitioned electromagnetic shielding module is characterized by comprising the following steps:
s1: forming a ground connection pad on a substrate;
s2: mounting a flip chip and a chip or a component on a substrate;
s3: forming a solderable wire metal layer on the back surface of the flip chip;
s5: routing between the grounding connecting pad and the weldable metal layer to form a shielding wire arc;
s5: forming a plastic package body on the substrate, and exposing the top end of the shielding wire arc to the surface of the plastic package body;
s6: forming an electromagnetic shielding layer on the back of the plastic package body, so that the electromagnetic shielding layer is electrically connected with the shielding wire arc;
s7: and singulating the substrate.
7. A preparation method of a partitioned electromagnetic shielding module is characterized by comprising the following steps:
s1: forming a ground connection pad on a substrate;
s2: mounting a flip chip and a chip or a component on a substrate;
s3: forming a solderable wire metal layer on the back surface of the flip chip;
s5: routing between the grounding connecting pad and the weldable metal layer to form a shielding wire arc;
s5: forming a plastic package body on the substrate, thinning the plastic package body to cut off the routing to form a shielding line arc and expose the shielding line arc;
s6: forming an electromagnetic shielding layer on the back of the plastic package body, so that the electromagnetic shielding layer is electrically connected with the shielding wire arc;
s7: and cutting the substrate into single pieces.
8. A preparation method of a partitioned electromagnetic shielding module is characterized by comprising the following steps:
s1: forming a ground connection pad on a substrate;
s2: mounting a flip chip and a chip or a component on a substrate;
s3: forming a solderable wire metal layer on the back surface of the flip chip;
s5: routing between the grounding connecting pad and the weldable metal layer to form a shielding wire arc;
s5: forming a plastic package body on the substrate, and exposing the top end of the shielding wire arc to the surface of the plastic package body;
s6: singulating the substrate;
s7: and forming an electromagnetic shielding layer for the single packaging body, and enabling the electromagnetic shielding layer to be electrically connected with the shielding wire arc.
9. A preparation method of a partitioned electromagnetic shielding module is characterized by comprising the following steps:
s1: forming a ground connection pad on a substrate;
s2: mounting a flip chip and a chip or a component on a substrate;
s3: forming a solderable wire metal layer on the back surface of the flip chip;
s5: routing between the grounding connecting pad and the weldable wire metal layer to form a shielding wire arc;
s5: forming a plastic package body on the substrate, thinning the plastic package body to cut off the routing to form a shielding wire arc and expose the shielding wire arc;
s6: singulating the substrate;
s7: and forming an electromagnetic shielding layer for the single packaging body, and enabling the electromagnetic shielding layer to be electrically connected with the shielding wire arc.
10. A circuit board, comprising the partitioned electromagnetically shielded module as claimed in any one of claims 1 to 5.
11. An electronic product, characterized in that it comprises a partitioned electromagnetically shielded module as claimed in any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211394540.3A CN115763439A (en) | 2022-11-08 | 2022-11-08 | Partitioned electromagnetic shielding module, preparation method, circuit board and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211394540.3A CN115763439A (en) | 2022-11-08 | 2022-11-08 | Partitioned electromagnetic shielding module, preparation method, circuit board and electronic product |
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| Publication Number | Publication Date |
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| CN115763439A true CN115763439A (en) | 2023-03-07 |
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| CN202211394540.3A Pending CN115763439A (en) | 2022-11-08 | 2022-11-08 | Partitioned electromagnetic shielding module, preparation method, circuit board and electronic product |
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| US20070163802A1 (en) * | 2006-01-19 | 2007-07-19 | Triquint Semiconductors, Inc. | Electronic package including an electromagnetic shield |
| US20080014678A1 (en) * | 2006-07-14 | 2008-01-17 | Texas Instruments Incorporated | System and method of attenuating electromagnetic interference with a grounded top film |
| US20170127581A1 (en) * | 2015-10-30 | 2017-05-04 | Avago Technologies General Ip (Singapore) Pte. Ltd | Circuit package with internal and external shielding |
| US20180228016A1 (en) * | 2017-02-09 | 2018-08-09 | Qualcomm Incorporated | Wire-bond cage in conformal shielding |
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