CN115756134A

CN115756134A - Computing device

Info

Publication number: CN115756134A
Application number: CN202211443289.5A
Authority: CN
Inventors: 杨成建; 曹权根
Original assignee: XFusion Digital Technologies Co Ltd
Current assignee: XFusion Digital Technologies Co Ltd
Priority date: 2022-11-17
Filing date: 2022-11-17
Publication date: 2023-03-07

Abstract

An embodiment of the present application provides a computing device, including: a circuit board, a processor and a power connector; the processor is arranged on the circuit board and is electrically connected with the circuit board through a ball grid array; the power connector is arranged on the circuit board and is electrically connected with the circuit board; the circuit board comprises a multilayer Printed Circuit Board (PCB) and at least one conductive piece, wherein the PCB is arranged in a stacked mode; the conductive piece penetrates through at least one layer of the PCB; the conductive piece is used for electrically connecting the processor and the power connector; the conductive member is electrically connected with a plurality of solder balls in the ball grid array, and the solder balls are arranged in a row. The computing equipment supplies power to the processor through the conductive pieces electrically connected with the row of the solder balls on the circuit board, and has lower resistance and higher circulation capacity so as to meet the power supply requirement of the processor with high power consumption.

Description

Computing device

Technical Field

The present application relates to the field of servers, and more particularly, to a computing device.

Background

With the continuous improvement of the computing performance of processors of computing equipment such as servers and the like, the power consumption of the processors is also continuously increased, and therefore, the requirements of the processors on board-level power supply are also increased more and more. The current capacity of the vias on the Printed Circuit Board (PCB) directly affects the power supply capability of the power supply to the processor. However, the PCB via hole at the bottom of the processor has a small aperture and a low flow capacity, and cannot meet the power supply requirement of the high-performance processor.

How to improve the circulation capacity of the PCB through hole at the bottom of the processor is limited, and the power supply requirement of the high-power processor cannot be met.

Disclosure of Invention

The embodiment of the application provides a circuit board and a computing device, wherein the computing device supplies power to a processor through a conductive piece which is electrically connected with a row of solder balls on the circuit board, and the computing device has lower resistance and higher circulation capacity so as to meet the power supply requirement of the processor with high power consumption.

In a first aspect, an embodiment of the present application provides a computing device, including: a circuit board, a processor and a power connector;

the processor is arranged on the circuit board and is electrically connected with the circuit board through a ball grid array; the power connector is arranged on the circuit board and is electrically connected with the circuit board;

the circuit board comprises a multilayer Printed Circuit Board (PCB) and at least one conductive piece, wherein the PCB is arranged in a stacked mode;

the conductive piece penetrates through at least one layer of the PCB; the conductive piece is used for electrically connecting the processor and the power connector; the conductive member is electrically connected with a plurality of solder balls in the ball grid array, and the solder balls are arranged in a row.

The computing equipment supplies power to the processor through the conductive pieces electrically connected with the row of the solder balls on the circuit board, and has lower resistance and higher circulation capacity so as to meet the power supply requirement of the processor with high power consumption.

In a possible implementation, the thickness of the conductive member is less than or equal to the thickness of the circuit board.

In one possible implementation, the conductive member penetrates through the circuit board;

the circuit board comprises a first surface and a second surface which are opposite;

the processor is arranged on the first surface of the circuit board;

the power connector is arranged on the second surface of the circuit board;

the conductive piece comprises a first surface and a second surface along the thickness direction of the circuit board; the first surface of the conductive piece is used for electrically connecting the plurality of solder balls; the second surface is used for electrically connecting the power connector.

According to the computing equipment, the processor and the power supply assembly are directly conducted through the conductive piece, and the connection resistance between the processor and the power supply connector can be further reduced.

In a possible implementation, a first surface of the conductive member is provided with a plurality of pads; the processor is electrically connected with the power connector through the plurality of solder balls, the plurality of bonding pads and the conductive piece.

In a possible implementation, the width of the conductive member is greater than or equal to the diameter of the solder ball and less than the distance between two adjacent solder balls.

The conductive piece in the circuit board of the computing equipment has a larger cross section, and the circulation capacity of the conductive piece is improved.

In one possible implementation, the conductive member is a rectangular parallelepiped.

In one possible implementation, the conductive member is made of copper or silver.

In a possible implementation, the second surface of the conductive member is provided with a plurality of connector pads, and the power connector is electrically connected with the circuit board through the connector pads.

In one possible implementation, the circuit board further includes a power plane and a conductor post penetrating the circuit board; the conductive piece penetrates through the circuit board;

the processor and the power connector are positioned on the same surface of the circuit board; one surface of the conductive piece is electrically connected with the processor; the side surface of the conductive piece is electrically connected with the power supply layer; one end of the conductor column is electrically connected with the power connector; the side wall of the conductor post is electrically connected with the power supply layer.

Above-mentioned computing device supplies power for the treater through electrically conductive piece, power supply layer and conductor post, because electrically conductive piece has lower resistance, higher circulation ability, can satisfy the power supply demand of the treater that the consumption is big.

In one possible implementation, the circuit board includes a power plane and a conductor post that penetrates a portion of the layer of the PCB; the processor and the power connector are respectively positioned on the first surface and the second surface of two opposite sides of the circuit board; the first surface of the conductive piece is electrically connected with the processor; the second surface of the conductive piece is electrically connected with the power supply layer; the first end of the conductor column is electrically connected with the power connector; the second end of the conductor column is electrically connected with the power supply layer.

In a second aspect, an embodiment of the present application provides a circuit board, including:

the PCB comprises a plurality of layers of PCBs (printed Circuit boards) and at least one conductive piece which are arranged in a stacked manner;

each layer of the PCB comprises an insulating layer and a wiring layer;

the conductive piece penetrates through at least one layer of the PCB;

the conductive piece is used for connecting a plurality of solder balls used for supplying power on the processor with the power connector or the power converter, and the solder balls are arranged in a row.

The circuit board supplies power to the processor through the conductive piece, and has lower resistance and higher circulation capacity so as to meet the power supply requirement of the processor with high power consumption.

In a possible implementation, the width of the conductive piece is not less than the diameter of the solder ball and not greater than the distance between two adjacent solder balls; the length of the conductive piece is the length of a smallest rectangle or a fillet rectangle surrounding the plurality of solder balls.

The conductive piece in the circuit board has a larger cross section, and the flow capacity of the conductive piece is improved.

In one possible implementation, the conductive member penetrates the multilayer PCB.

In one possible implementation, the first surface of the conductive member is used for electrically connecting the plurality of solder balls; the second surface of the conductive piece is used for electrically connecting the power connector or the power converter.

The circuit board can directly conduct the processor and the power supply assembly through the conductive piece, and can further reduce the connection resistance between the processor and the power supply assembly. Here, the power supply unit includes a power supply connector or a power converter.

In one possible implementation, the circuit board further comprises a plurality of conductor columns; the multilayer PCB comprises a power supply layer; one surface of the conductive piece is electrically connected with the plurality of solder balls, and the side surface of the conductive piece is electrically connected with the power supply layer; the conductor post penetrates through the multilayer PCB, one end of the conductor post is electrically connected with the power supply connector or the power supply converter, and the side wall of the conductor post is electrically connected with the power supply layer.

In one possible implementation, the circuit board further comprises a plurality of conductor columns; the multilayer PCB comprises a power supply layer; the conductive piece penetrates through part of the layers of the PCB; the first surface of the conductive piece is electrically connected with the plurality of solder balls, the second surface of the conductive piece is electrically connected with the power supply layer, and the first surface and the second surface are two opposite surfaces on the conductive piece; the first end of the conductor column is electrically connected with the power supply connector or the power supply converter, and the second end of the conductor column is electrically connected with the power supply layer.

Above-mentioned circuit board supplies power for the treater through electrically conductive piece, power supply layer and conductor post, because electrically conductive piece has lower resistance, higher circulation ability, can satisfy the power supply demand of the treater that the consumption is big.

In a third aspect, an embodiment of the present application provides a method for manufacturing a circuit board, where the method includes:

providing a circuit board, and forming a slotted hole penetrating through the circuit board in an area of the circuit board corresponding to each group of first BGA solder balls; each first BGA welding ball in the group of first BGA welding balls is used for supplying power to the processor, and the group of first BGA welding balls are arranged in a row;

and forming a first metal layer on the inner wall of the slotted hole and the surface of the circuit board by a hole metallization process.

A metal sheet is inserted into the metallized slot.

And electroplating to form a second metal layer on the hole wall of the metalized groove hole, the surface of the first metal layer and the surface of the metal sheet, wherein the metal sheet filled in the groove hole, the first metal layer and the second metal layer form a conductive piece.

According to the method, the conductive piece is formed by inserting the metal sheet into the large-size slot and electroplating, and then the processor is powered through the conductive piece, so that the processor has lower resistance and higher circulation capacity, and the power supply requirement of the processor with high power consumption is met.

In one possible implementation, the method further comprises: and generating BGA welding pads at positions corresponding to the first BGA welding balls and the second BGA welding balls on the surface of the circuit board, wherein the second BGA welding balls are used for transmitting signals by the processor.

In a fourth aspect, an embodiment of the present application further provides a motherboard, including: a processor, a power supply component, and, as in the first aspect above or any one thereof, a circuit board; or comprises a processor, a power supply component and a circuit board prepared according to the third aspect or any implementation method thereof.

It is understood that the motherboards provided by the fourth aspect provided above may each include the circuit board provided by the second aspect or the circuit board prepared by the method provided by the third aspect. Therefore, the beneficial effects that can be achieved by the method can refer to the corresponding beneficial effects in the first aspect or the third aspect, and are not described herein again.

Drawings

Fig. 1 is a diagram illustrating an exemplary hardware architecture of a power supply system of an electronic device or a processor according to an embodiment of the present disclosure;

fig. 2A is a schematic perspective view of a main board provided in an embodiment of the present application;

FIG. 2B is a schematic cross-sectional view of the motherboard along line AB shown in FIG. 2A;

FIG. 2C is a cross-sectional view of the main board shown in FIG. 2A along the CD line;

FIG. 2D is a schematic top view of the circuit board in the motherboard shown in FIG. 2A;

FIG. 3 is a schematic diagram of a distribution of solder balls in a BGA on a processor according to an embodiment of the present application;

fig. 4 is a cross-sectional view of a circuit board according to an embodiment of the present disclosure;

fig. 5A is a schematic perspective view of another motherboard provided in the present application;

FIG. 5B is a schematic cross-sectional view of the main board shown in FIG. 5A along line AB;

FIG. 5C is a cross-sectional view of the main board shown in FIG. 5A along the CD line;

FIG. 5D is a schematic top view of the circuit board in the motherboard shown in FIG. 5A;

fig. 6 is a cross-sectional view illustrating a circuit board according to an embodiment of the present disclosure;

FIG. 7 is a cross-sectional view of the main plate shown in FIG. 2A along the CD line;

fig. 8 is a schematic flow chart of a method for manufacturing a circuit board according to an embodiment of the present disclosure;

fig. 9A to 9G are schematic cross-sectional views of structures formed in a manufacturing process of a circuit board according to an embodiment of the present application.

Detailed Description

First, terms related to embodiments of the present application will be described.

(1) Vias are drilled holes in multilayer PCBs (also referred to as circuit boards) that provide electrical connections between the PCB layers, i.e., signals are transmitted from one layer to another on the multilayer PCB. Vias may include, but are not limited to, three types, through holes, blind holes, and buried holes. Wherein, the through holes are also called through holes, are connecting holes between the top layer and the bottom layer of the PCB, and can also provide interconnection of the inner PCB layers. Blind vias are vias that connect the surface and internal layers of a PCB but do not extend through the circuit board and can be used to interconnect the top or bottom layers of the PCB to the internal layers. A buried via is a via that connects the inner layers but is not visible on the surface layers for interconnection between the inner PCB layers.

The method for improving the flow capacity of the through hole can comprise the following steps: the hole wall is plated with thick copper, a copper needle is plugged in the hole, and paste (such as copper paste, silver paste and the like) is filled in the hole. However, the hole wall copper plating technology is suitable for large aperture (more than 0.3 mm), and the thickness of the hole wall copper plating is limited (usually within 3 mil), so that the flow capacity is insufficient in the large flow field scene; the technology of plugging the copper needle in the hole is not suitable for a scene with a small aperture (if the aperture is too small, the diameter of the needed copper needle is small, and the needle insertion is difficult); although the technology of plugging the conductive paste into the hole is suitable for small-aperture scenes, the resistance of the paste (such as copper paste, silver paste and the like) is high, the conductivity is poor, and the circulation capacity is insufficient.

The aperture of the PCB through hole at the bottom of the processor is only 6-8mil, the through-current capacity is low, and the power supply requirement of the high-performance processor cannot be met by the conventional through-hole through-current technology.

(2) A circuit board, also called a circuit board, is a laminated multilayer PCB, i.e. a multilayer wiring layer, which usually includes a signal layer, a ground layer, a power supply layer, and the like. The number of layers of the signal layer, the ground layer and the power supply layer can be one or more, and the specific number of layers and the position of each layer are determined based on the function of the circuit to be realized. In the embodiment of the present application, the power plane is not an essential plane, and may not include the power plane. Wherein the top and bottom layers of the circuit board are typically used for component placement and trace routing. In the embodiment of the application, the top layer of the circuit board is used for placing the processor. The circuit board is generally in an even number of layers and may be 4-layer, 6-layer, 8-layer, 12-layer, 14-layer or more.

As shown in fig. 1, an exemplary diagram of a hardware architecture of an electronic device according to an embodiment of the present disclosure is provided, where the electronic device is also referred to as a computing device, and may be a server, a gateway device or a network device such as a base station and a router, or a terminal device such as a notebook computer, a desktop computer, a tablet computer, and a mobile phone. The Server may be a file Server (file Server), a domain Server (domain Server), a database Server (database Server), a mail Server (mail Server), a Web Server (Web Server), a multimedia Server (multimedia Server), a communication Server (communication Server), a terminal Server (terminal Server), an infrastructure Server (infrastructure Server), a virtualization Server (virtualization Server), or the like. The servers may be tower, rack, blade, etc. The electronic device may employ, but is not limited to, an X86 architecture, a Reduced Instruction Set Computer (RISC) architecture, an advanced reduced instruction set machine (ARM) architecture, and the like.

The electronic device may include, but is not limited to: one or more processors 11, one or more memories 12, a power connector 13, and other electronic components, among others. The one or more processors 11 are coupled to the one or more memories 12 through a bus, the power connector 13 is electrically connected to the processors 11, and the like.

It should be understood that the electronic device is not limited to the electronic device shown in fig. 1, and the electronic device may further include more or less units/electronic components, and the structure illustrated in the embodiment of the present invention is not a specific limitation to the electronic device. In other embodiments of the present application, an electronic device may include more or fewer components than shown, or some components may be combined, some components may be split, or a different arrangement of components may be used. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

The processor 11 may be a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a neural Network Processing Unit (NPU), a deep learning unit (DPU), a Tensor Processing Unit (TPU), an Accelerated Processing Unit (APU), or other various processors. The processor 11 may also be a system on chip (SoC) composed of a CPU and other peripheral devices (e.g., memory, GPU, etc.).

The storage 12 may include an internal storage (also referred to as a memory), an external storage (e.g., a hard disk, a flash memory, etc.). Wherein the memory 12 may store executable program code comprising instructions. The processor 11 implements various functions of the electronic device and data processing by executing instructions stored in the memory 12.

The power connector 13 is used for receiving input of power and supplying power to devices in the electronic device, such as the processor 11 and the memory 12.

The processor 11, the memory 12 and the power connector 13 may be disposed on a motherboard, and may be connected to the motherboard by soldering or a connector.

The motherboard is used for implementing communication connection between electronic components in the electronic device, such as connection between the processor 11 and other electronic components, such as the memory 12, the power connector 13, and the like, so as to implement communication between the electronic components.

Wherein the main board, also called circuit board, comprises a multi-layer PCB (not shown in fig. 1). Among them, the multi-layer PCB may be 4-layer, 6-layer, 8-layer, 12-layer, or more layers, etc. Each layer of PCB may be used for wiring or copper cladding. Each layer can have different functions, and the layers can be connected with each other through holes, blind holes and buried holes.

In some embodiments, the electronic device may further include a power converter (not shown). The power converter can be connected with the power connector and is arranged on the surface (the top layer or the bottom layer) of the circuit board. In some implementations, the power converter, i.e., a Voltage Regulator Module (VRM), is configured to receive a power input and convert a voltage of the power input, including but not limited to one or more of a Buck circuit (e.g., a Buck circuit), a Boost circuit (e.g., a Boost circuit), or a Buck-Boost circuit, and the like, according to a voltage required by the processor 11 and the input voltage.

Not limited to the power connector 13 connected to the processor 11 shown in fig. 1, the processor 11 may also be connected to other communication interfaces through a motherboard to realize information interaction between the processor 11 and electronic components such as the memory 12 and other processors.

It should also be understood that the electronic device is not limited to the electronic device shown in fig. 1, but may also include more or fewer units.

It is to be understood that the illustrated structure of the embodiment of the present invention does not limit the electronic device. In other embodiments of the present application, an electronic device may include more or fewer components than illustrated, or some components may be combined, or some components may be split, or a different arrangement of components may be used. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

The power supply system and the circuit board structure of the processor according to the embodiments of the present application are described below in two embodiments.

Example one

The motherboard can be applied to the electronic device in fig. 1 as shown in fig. 2A, in a perspective view of the motherboard, in a cross-sectional view at line AB of the motherboard in fig. 2B, in a cross-sectional view at line CD of the motherboard in fig. 2A, in a cross-sectional view at line CD of the motherboard in fig. 2C, and in a top view of the upper surface of the circuit board in fig. 2A, in fig. 2D. The motherboard may include, but is not limited to, a processor 11, a circuit board 14, and a power connector 13. The processor 11 and the power connector 13 are disposed on different surfaces of the circuit board 14, for example, the processor 11 is disposed on a surface of a top layer of the circuit board 14, and the power connector 13 is disposed on a surface of a bottom layer of the circuit board 14. It should be understood that the power connector 13 may also be a power converter, or a combination of a power converter and a power connector. Fig. 2B and 2C illustrate the power connector 13. When the main board comprises the power converter, the power converter can be connected with a power connector, and the power connector can be connected with a power supply.

Wherein the surface of the processor 11 abutting the top layer of the circuit board 14 may comprise a Ball Grid Array (BGA). The BGA includes a plurality of solder balls, also known as BGA solder balls, for soldering to the top layer of the PCB. The BGA array includes BGA solder balls 111a for supplying power to the processor 11 and BGA solder balls 111b for transmitting signals.

In general, the distribution of the connection terminals (solder balls 111 a) for supplying a large current in a high-power chip such as the processor 11 is concentrated. Fig. 3 is a diagram illustrating an exemplary distribution of solder balls in the BGA of processor 11, wherein solder balls 111a for the same power supply are distributed in a line or concentrated at one or more locations. The area 301 is concentrated with a plurality of rows and columns of solder balls 111a, for example, the area may be divided into a plurality of areas 3011, and the solder balls 111a in each area 3011 are arranged in a row, or may be in a longitudinal linear distribution; or the balls 111a in the region 302 are diagonally arranged at an angle of 45 ° and arranged in a row, and the balls 111a in the region 303 are linearly arranged in a transverse direction and arranged in a row. The solder balls are arranged in a row or in a linear distribution, which means that a plurality of adjacent solder balls can be connected into a line, and the line can be a straight line, an oblique line or a broken line. The two solder balls are adjacent to each other, which means that one solder ball is located on the upper, lower, left, right, or diagonal of the other solder ball and there is no solder ball between the two solder balls (the view angle of fig. 3 is used as a reference).

It should be understood that the large current herein refers to a current of not less than 100A, for example, 300-600A or 400-500A. It should also be understood that the number of solder balls, the distribution of solder balls 111a, and the distribution of solder balls 111b in fig. 1 are exemplary to illustrate the "concentration" of solder balls 111a, and do not represent the number or distribution in an actual processor product.

In order to increase the power supply requirement of the processor 11 with large current, the embodiment of the present application forms a slot penetrating the circuit board 14 in the area of the circuit board 14 corresponding to the row of BGA solder balls 111a, and fills the slot with a conductive material to form a conductive member. The conductive member has a larger cross-sectional area than the via hole, thereby greatly improving the flow-through capability.

As shown in fig. 2B-2D, circuit board 14 includes one or more conductive elements 141 extending through circuit board 14, each conductive element corresponding to a row of BGA solder balls 111a for supplying high current to processor 11. The conductive member 141 may be formed of a conductive material such as copper or silver. It should be understood that the conductive element 141 may also be formed of other metals or alloys, and is not limited herein. One surface of each conductive member 141 is used to electrically connect a plurality of BGA solder balls 111a distributed in a linear shape, and the other surface is used to electrically connect the power connector 13.

The conductive member 141 may be a rectangular parallelepiped, a rounded rectangular parallelepiped, or the like, and the thickness thereof may be equal to or less than the thickness of the circuit board 14, for example, 1mm to 10mm, such as 2mm; the width of the BGA solder ball is not less than the diameter of 1 BGA solder ball 111a and is less than the distance between two adjacent BGA solder balls 111a, such as 0.1-0.3mm or 6-14mil, and is also 0.2mm; the length thereof may be generally the length of the smallest rectangle or rounded rectangle surrounding the plurality of BGA solder balls 111a in a line shape, for example, 1-20mm. As shown in fig. 2D, the surface of the conductive member 141 is a minimum rounded rectangle surrounding the corresponding positions of the 4 BGA solder balls 111a.

The circuit board 14 may include a plurality of conductive members 141 disposed at intervals, and each conductive member 141 supplies power to the processor 11 differently. By "power supply differential" is meant that the voltage and/or current supplied is different. Fig. 2B and fig. 2D illustrate an example of 5 conductive members 141 disposed in the circuit board.

In some embodiments, a BGA pad 142 is disposed on the surface of the conductive member 141 at a position corresponding to each BGA solder ball (111 a,111 b) for soldering with the corresponding BGA solder ball (111 a,111 b). A connector pad 143 may be provided on the bottom layer of the circuit board 14 at a position corresponding to each BGA solder ball 111a. The connector pads 143 are used for soldering with the power connector 13. At this time, one end of each conductive element 141 is connected to the BGA pad 142 corresponding to the conductive element 141, and the other end is connected to the connector pad 143. The BGA pad 142 corresponding to each conductor 141 is used for soldering with its corresponding solder ball 111a. The power connector 13 may include connector solder balls 131 for soldering with the connector pads 143. The processor 11 is connected to the power connector 13 through the BGA ball 111a, the BGA pad 142, the conductive member 141, the connector pad 143, and the connector ball 131 in this order to receive power from the power source.

The circuit board 14 may be a multi-layer PCB structure, taking 12 layers as an example, as shown in fig. 4, and as shown in the cross-sectional view of a circuit board, the circuit board 14 may include: L1-L12 wiring layers. L1-L12 can be signal layers or grounding layers, and any two adjacent wiring layers are isolated by an insulating PP plate. In fig. 2B or fig. 3, the circuit board 14 may not include a power plane. The circuit board 14 may also include vias (not shown). The BGA solder balls 111b on the processor 11 for transmitting signals are coupled to one or more signal layers in the circuit board 14 through via holes, and the signal layers may be connected to each other through via holes, blind vias, and buried vias, so as to couple the processor 11 to the signal layers.

Example two

Fig. 5A is a schematic perspective view of another motherboard, fig. 5B is a schematic cross-sectional view of the motherboard shown in fig. 5A taken along line AB, fig. 5C is a schematic cross-sectional view of the motherboard shown in fig. 5A taken along line CD, and fig. 5D is a schematic cross-sectional view of the surface of the circuit board shown in fig. 5A taken along line CD, and the structure can be applied to the electronic device shown in fig. 1. The motherboard may include, but is not limited to, a processor 11, a circuit board 14, and a power connector 13. Wherein the processor 11 and the power connector 13 are disposed on the same surface of the circuit board 14, for example, both the processor 11 and the power connector 13 are disposed on the surface of the top layer of the circuit board 14. It should be understood that the power connector 13 may also be a power converter, or a combination of the power connector 13 and a power converter. Fig. 5B illustrates the power connector 13 as an example. When the motherboard includes the power converter, the power converter may be connected to the power connector 13, and the power connector 13 may be connected to a power supply.

As in the first embodiment, the processor 11 includes BGA solder balls 111a for supplying power and BGA solder balls 111b for transmitting signals.

As shown in fig. 5B-5D, the circuit board 14 includes a plurality of PCB layers including at least one power layer 144a and a plurality of conductive elements 141, wherein each conductive element 141 may penetrate the entire circuit board 14 or only penetrate the PCB layer on the power layer 144a, a surface of each conductive element 141 is coupled to a plurality of BGA solder balls 111a distributed in a line shape, a side surface thereof is coupled to the power layer 144a, and the power layer 144a is coupled to the power connector 13.

It should be understood that the conductive member 141 may be formed of a conductive material such as copper or silver. It should be understood that the conductive member 141 may also be formed of other metals or alloys, and is not limited herein. The conductive member 141 may be a rectangular parallelepiped or a rounded rectangular parallelepiped, and has a thickness equal to the thickness of the circuit board 14, for example, 1mm to 10mm, such as 2mm; the width of the BGA solder ball is not less than the diameter of 1 BGA solder ball 111a and is less than the distance between two adjacent BGA solder balls 111a, such as 0.1-0.3mm or 6-14mil, and is also 0.2mm; the length thereof is at least greater than the sum of the diameters of the 2 BGA solder balls 111a, and may be generally the length of the smallest rectangular or rounded rectangular region surrounding the plurality of BGA solder balls 111a in a line shape, for example, 1-20mm. As shown in fig. 5D, the surface of the conductive member 141 is a minimum rounded rectangle surrounding the corresponding positions of the 4 BGA solder balls 111a.

The circuit board 14 may include a plurality of conductive members 141 arranged at intervals, and each conductive member 141 may supply power to the processor 11 differently.

Fig. 6 is a cross-sectional structure diagram of the circuit board in fig. 5A at line AB, the circuit board 14 may be a multi-layer PCB structure, and fig. 6 illustrates 12 layers as an example. The circuit board 14 includes a two-layer power layer 144a, at least one first PCB layer 144b disposed on a first surface of the two-layer power layer 144a, at least one second PCB layer 144c disposed on a second surface of the two-layer power layer 144a, and a plurality of conductive members 141 penetrating the circuit board 14 and a plurality of conductive posts 145 penetrating the circuit board 14, wherein the conductive members 141 and the conductive posts 145 are both coupled to the power layer 144a, wherein one surface of the conductive members 141 is electrically connected to a row of BGA solder balls 111a, and a side surface thereof is electrically connected to the power layer 144a; one end of the conductive post is electrically connected to the power connector, and the sidewall thereof is electrically connected to the power layer 144a. Alternatively, each of the conductive member 141 and the conductive pillar 145 may only penetrate through the first PCB layer 144b on the power layer 144a to be connected to the power layer 144a. The circuit board 14 may include two power layers 144a, one for wiring to input the power signal received by the power connector 13 to the conductive member 141; the other layer is used for grounding and providing a conductive loop. The circuit board 14 may further include more power layers 144a and more conductive members 141; and is not limited herein. The voltage or current passed through each conductor 141 may be the same or different, determined by the power requirements of processor 11, and is not limited thereto.

Alternatively, each of the conductive member 141 and the conductive pillar 145 may only penetrate through the first PCB layer 144b on the power layer 144a and be coupled with the power layer 144a. At this time, one surface of the conductive element 141 is electrically connected to a row of BGA solder balls 111a, and the other surface is electrically connected to the power layer 144a; one end of the conductive post 145 is electrically connected to the power supply connector 13, and the other surface is electrically connected to the power supply layer 144a.

Processor 11 is coupled to power layer 144a through conductive element 141a on circuit board 14, and power connector 13 is coupled to power layer 144a through conductive pillar 145, so that power connector 13 supplies power to processor 21 through conductive pillar 145, power layer 144a and conductive element 141. It is understood that some of the conductive elements 141 are coupled to a power plane 144a; another part of the conductive elements 141 is coupled to another power layer 144a; a portion of the conductive pillar 145 is coupled to a power plane 144a; another portion of the conductive pillars 145 is coupled to another power plane 144a.

The conductive pillar 145 may be a solid copper pillar, a silver pillar, or the like, or may be other metals or alloys, which is not limited herein. In addition, the conductor post 145 may have a diameter greater than or equal to that of the first conductive member 141a, and may be 0.15 to 1mm or more.

In some embodiments, a BGA pad 142 is disposed on the top layer of the circuit board 14 at a position corresponding to each BGA solder ball (111 a,111 b) for soldering with the corresponding BGA solder ball (111 a,111 b). At this time, one end of each conductive member 141 is connected to the BGA pads 142 corresponding to the BGA solder balls 111a distributed in a line, and the other end is connected to a power layer 144a; one end of each conductor pillar 145 is connected to a power plane 144a, and the other end is connected to the power connector 13.

It should be understood that the conductive post 145 may alternatively be other conductive components, such as a via. Since the power connector 13 is juxtaposed with the processor 11 on the top layer of the circuit board 14, the diameter of the via hole on the side of the circuit board 14, which is located at the power connector 13, is not limited by the BGA array of the processor 11, the via hole may have a larger diameter, and a conductive liquid may be injected into the via hole or a conductive pin may be inserted into the via hole.

The power connector 13 may be connected to the conductor pillar 145 (or via hole) by soldering, wire or the like. For example, the top layer of the circuit board 14 also includes connector pads through which the power connectors 13 can be soldered to the conductor posts 145.

The circuit board 14 may be a multi-layer PCB structure, for example, 12 layers, as shown in fig. 6, which is a cross-sectional view of the circuit board, and the circuit board 14 may include: L1-L12 wiring layers. Wherein, each of the layers L1-L5, L8-L12 may be a signal layer or a ground layer, respectively, and L6-L7 may be a power layer 144a.

In another embodiment, as shown in fig. 7, which is another cross-sectional view of the main board shown in fig. 2A along the CD line, the circuit board 14 includes one or more power layers 144a, the conductive element 141 and the conductive post 145 may be respectively disposed on two sides of the power layer 144a, the processor 11 and the power connector 13 may be respectively disposed on two opposite surfaces of the circuit board 14, one surface of the conductive element 141 is electrically connected to the row of BGA solder balls 111a, and the other surface is electrically connected to the power layer 144a; one end of the conductive post 145 is electrically connected to the power connector 13, and the other surface is electrically connected to the power layer 144a.

In the first and second embodiments described above, the thickness T of each PCB including the circuit board 14 may be 0.1mm to 5mm, for example, 2mm.

In fig. 2A-7, the circuit board 14 may also include vias (not shown) therein. The BGA solder balls 111b on the processor 11 for transmitting signals are coupled to one or more signal layers in the circuit board 14 through vias, and the signal layers may be connected to each other through vias, blind vias, and buried vias, so as to couple the processor 11 to the signal layers.

It should be understood that the BGA may also include solder balls (not shown) for supplying power to the processor 11 with small current, and the solder balls may be connected to the power connector 13 or the power layer 144a of the circuit board 14 by means of vias or conductor posts.

It should also be understood that the power connector 13 may also be replaced with a power converter. Here, the power supply connector 13 is explained as an example.

It should also be understood that one PCB layer corresponds to one wiring layer, each wiring layer is attached to a substrate, and wiring layers may be attached to both opposing surfaces of one substrate, and thus, the number of PCB layers may not coincide with the number of PCB layers. In this embodiment, the PCB layer includes a wiring layer and a substrate supporting the wiring layer, and different PCB layers may share the substrate. The substrate may be a polypropylene (PP) board, an epoxy board, a polyester resin board, a phenolic resin board, or the like.

It is also to be understood that "connected" as described in the above embodiments one and two may be understood as a direct connection and an indirect connection. Two components/parts are directly connected, meaning that one component/part directly contacts the other component/part; while an indirect connection means that one component/part is electrically connected to another component/part through some other electrically conductive component (e.g., solder ball pads, metal wiring, etc.).

The method of manufacturing the circuit board of fig. 2A to 7 is described as follows.

A flow diagram of a manufacturing method of a circuit board shown in fig. 8, and a diagram of a structure formed in the manufacturing flow shown in fig. 9A to 9G. The method may include, but is not limited to, some or all of the following steps:

s01: providing a circuit board, and forming a slot penetrating the circuit board in the area of the circuit board corresponding to each group of BGA solder balls 111a. Wherein each solder ball in a group of BGA solder balls 111a is used to power the processor, the group of BGA solder balls 111a is arranged in a line, i.e., in a linear distribution, also referred to as a row of BGA solder balls 111a.

In fig. 9A, which is a top view of a circuit board and a cross-sectional view of the circuit board at a-B line and a-D line, a circuit board 801 includes a plurality of PCBs (not shown) and two adjacent PCBs are bonded to each other by an adhesive layer. The circuit board is obtained by laminating a plurality of layers of PCBs and adhesive layers. Each layer of the PCB may include an insulating substrate and wiring layers covering one or both sides of the substrate.

It should be understood that fig. 9A shows the position on the surface of the circuit board opposite to the distribution of BGA solder balls 111a and BGA solder balls 111b, rather than solder balls or vias. As to the

BGA solder balls

111a and 111b and their distribution, reference may be made to the related descriptions in the first and second embodiments, which are not repeated herein.

In some embodiments, the circuit board 801 may be provided with slots in the areas corresponding to each set of BGA solder balls 111a by mechanical drilling or laser drilling. Wherein, in some implementations, the slot may extend through the circuit board 801. In other implementations, the circuit board 801 includes at least one power plane therein, and the slot may extend through the PCB above the power plane.

In the embodiment of the present application, a slot hole penetrating through the circuit board 801 is taken as an example. Among them, a power supply layer, such as the circuit boards shown in fig. 2A to 2D, which are prepared, may be included in the circuit board 801; a power supply layer, such as the circuit boards shown in fig. 5A-5D, may also be excluded.

As shown in the top views of the circuit boards and the sectional views thereof at the lines a-B and C-D of fig. 9B and 9C, a specific implementation of forming slots in the circuit board 801 may be to drill holes at positions corresponding to each of the BGA solder balls for supplying a large current (also referred to as power source pad positions) to obtain power source holes 802 corresponding to the BGA solder balls 111a for supplying power one by one, as shown in fig. 9B, and then to connect the power source holes 802 into a slot 803 by using a multi-drilling technique among the power source holes, as shown in fig. 9C.

The length of the slot 803 is the length of the line connecting a group of BGA balls 111a, and the width of the slot 803 may be larger than the diameter of the BGA balls 111a. The size of the slot 803 is equal to the size of the conductive element 114 in the first embodiment or the second embodiment, and reference may be made to the description of the size of the conductive element 114 in the first embodiment or the second embodiment, which is not repeated herein.

S02: a first metal layer 804 is formed on the inner wall of the slot 803 and the surface of the circuit board 801 by a hole metallization process.

A top view of the circuit board as shown in fig. 9D and a cross-sectional view thereof at lines a-B and C-D. The metallization of the holes refers to plating a metal layer, also called a first metal layer 804, on the insulated hole walls by using an electroless plating and electroplating method in the slots.

S03: a metal sheet 805 is inserted into the metallized slot 803.

A top view of the circuit board as shown in fig. 9E and a cross-sectional view thereof at lines a-B and C-D. Specifically, a plurality of metal sheets 805 are provided, and the metal sheets 805 are respectively inserted into the groove holes 803. Wherein the length of each metal sheet 805 can be different, and is determined based on the size of the slot 803 into which it is plugged. The length l may be equal to the length of the slot 803 so that the metal plate 805 is electrically connected with the slot 805; the width h of the metal plate 805 may be equal to the thickness of the circuit board 801 or greater than the thickness of the circuit board 801, and the thickness d of the metal plate 805 is smaller than the diameter of the power supply hole 802, for example, 4-12mil.

S04: and a second metal layer 806 is formed on the walls of the metalized slots, the surface of the first metal layer 804 and the surface of the metal sheet 805 in an electroplating mode, and the metal sheet 805 filled in the slots 803, the first metal layer 804 and the second metal layer 806 form conductive pieces. A top view of the circuit board as shown in fig. 9F and a cross-sectional view thereof at lines a-B and C-D.

It should be understood that the corresponding positions of the BGA solder balls 111b may also be punched (not shown), and may be through holes or blind vias, etc., or the holes may be metalized, and a metal layer may be electroplated to form conductive vias for signal transmission between the processor and the circuit board 801.

Alternatively, both surfaces of the circuit board 801 may also be planarized by a grinding or the like process to provide a planarized surface for the preparation of surface wiring layers, pads, and the like.

S05: and generating BGA welding pads on the surface of the circuit board corresponding to the BGA welding balls.

In which both surfaces of the circuit board 801 may be patterned to form wiring layers on the surface of the circuit board 801 before forming the pads.

A top view of the circuit board as shown in fig. 9G and a cross-sectional view thereof at lines a-B and C-D. BGA pads 806a and 806b are formed on the surface of the circuit board 801 at positions corresponding to the

BGA solder balls

111a and 111b, respectively, wherein the BGA pads 806a and 806b are used for soldering with the corresponding BGA solder balls 111a and 806b on the processor 11, respectively.

In the specific preparation, a resin via hole electroplating filling (POFV) process can be adopted to form the BGA pads (111a, 111b), and in this case, the BGA pads can also be referred to as POFV pads.

The materials of the first metal layer 804, the second metal layer 806 and the metal sheet 805 may be the same or different, and may be metals such as copper, silver, aluminum, palladium, and the like.

Further, after the circuit board is prepared, it may be soldered with the processor 11, the power connector 13, and the like to form the main board shown in fig. 2A to 7.

It should be noted that the flow chart described in the embodiments of the present invention is only one embodiment. The steps in the various flow diagrams may be modified or changed in various ways, such as by performing the steps in the flow diagrams in a different order, or by deleting, adding, or modifying certain steps, without departing from the spirit of the invention.

Technical terms used in the embodiments of the present invention are only used for illustrating specific embodiments and are not intended to limit the present invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Further, the use of "including" and/or "comprising" in the specification is intended to specify the presence of stated features, integers, steps, operations, elements, and/or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, and/or components.

It should also be understood that in the embodiments of the present application, "at least one", "one or more" means one, two or more. The term "and/or" is used to describe an association relationship that associates objects, meaning that three relationships may exist; for example, a and/or B, may represent: a exists singly, A and B exist simultaneously, and B exists singly, wherein A and B can be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.

Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise.

The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below, if any, are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed.

Claims

1. A computing device, comprising: a circuit board, a processor and a power connector;

the processor is arranged on the circuit board and is electrically connected with the circuit board through a ball grid array;

the power connector is arranged on the circuit board and is electrically connected with the circuit board;

the conductive piece penetrates through at least one layer of the PCB;

the conductive piece is used for electrically connecting the processor and the power connector; the conductive member is electrically connected with a plurality of solder balls in the ball grid array, and the solder balls are arranged in a row.

2. The computing device of claim 1, wherein a thickness of the conductive member is less than or equal to a thickness of the circuit board.

3. The computing device of claim 1 or 2, wherein the conductive member extends through the circuit board;

the processor is arranged on the first surface of the circuit board;

the power connector is arranged on the second surface of the circuit board;

the conductive piece comprises a first surface and a second surface along the thickness direction of the circuit board;

the first surface of the conductive piece is used for electrically connecting the plurality of solder balls;

the second surface is used for electrically connecting the power connector.

4. The computing device of claim 3, wherein the first surface of the conductive member is provided with a plurality of pads; the processor is electrically connected with the power connector through the plurality of solder balls, the plurality of bonding pads and the conductive piece.

5. The computing device of any of claims 1-4, wherein a width of the conductive piece is greater than or equal to a diameter of the solder ball and less than a distance between two adjacent solder balls.

6. The computing device of any of claims 1-5, wherein the conductive piece is a cuboid.

7. The computing device of any of claims 1-6, wherein the conductive member is copper or silver.

8. The computing device of any of claims 1-7, wherein the second surface of the electrically conductive member is provided with a plurality of connector pads, the power connector being electrically connected to the circuit board through the connector pads.

9. The computing device of claim 1 or 2, wherein the circuit board further comprises a power plane and a conductor post extending through the circuit board; the conductive piece penetrates through the circuit board;

the processor and the power connector are positioned on the same surface of the circuit board;

one surface of the conductive piece is electrically connected with the processor;

the side surface of the conductive piece is electrically connected with the power supply layer;

one end of the conductor column is electrically connected with the power connector;

the side wall of the conductor column is electrically connected with the power supply layer.

10. The computing device of claim 1 or 2, wherein the circuit board comprises a power layer and a conductor post that extends through a portion of the PCB layer;

the processor and the power connector are respectively positioned on the first surface and the second surface of two opposite sides of the circuit board; the first surface of the conductive piece is electrically connected with the processor;

the second surface of the conductive piece is electrically connected with the power supply layer;

the first end of the conductor column is electrically connected with the power connector; the second end of the conductor post is electrically connected with the power supply layer.