CN115752867A - Redundancy intelligent pressure sensor - Google Patents

Redundancy intelligent pressure sensor Download PDF

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Publication number
CN115752867A
CN115752867A CN202211356915.7A CN202211356915A CN115752867A CN 115752867 A CN115752867 A CN 115752867A CN 202211356915 A CN202211356915 A CN 202211356915A CN 115752867 A CN115752867 A CN 115752867A
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CN
China
Prior art keywords
pressure
signal processing
processing circuit
pressure sensor
installation detection
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CN202211356915.7A
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Chinese (zh)
Inventor
董奎
梁文武
李晶晶
徐林鹏
赵虎
王淞立
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Xi'an Siwei Sensor Technology Co ltd
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Xi'an Siwei Sensor Technology Co ltd
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Priority to CN202211356915.7A priority Critical patent/CN115752867A/en
Publication of CN115752867A publication Critical patent/CN115752867A/en
Pending legal-status Critical Current

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Abstract

The invention relates to the technical field of sensors, in particular to a redundancy intelligent pressure sensor, which comprises: the middle part of the upper end of the pressure interface is fixedly connected with a shunting block, the front side, the rear side, the left side, the right side and the upper end surface of the outer side of the shunting block are fixedly connected with a sintering base, an installation detection cavity is formed in the sintering base, and a pressure chip and a corrugated diaphragm are arranged in the installation detection cavity; the outer side of the lower end of the signal processing circuit top plate is connected with four signal processing circuit side plates in an annular array mode, and the signal processing circuit side plates are connected with corresponding welding pins on the outer side of the sintering base. Through the overall structure of equipment, the problem that the redundancy pressure sensor must encapsulate into the core with the pressure chip earlier and encapsulate is solved to can dispose inside channel quantity according to the redundancy needs, make redundancy pressure sensor have intelligent function simultaneously, each inside channel measuring result can compare the judgement.

Description

Redundancy intelligent pressure sensor
Technical Field
The invention relates to the technical field of sensors, in particular to a redundancy intelligent pressure sensor.
Background
The pressure sensor is widely applied to the fields of aerospace, industrial control, automotive electronics and the like. The piezoresistive pressure chip based on the MEMS (micro-mechanical system) has the characteristics of high precision, low cost, good stability and the like, and the piezoresistive pressure sensor has the characteristics of simple structure, high reliability and the like, so the piezoresistive pressure chip is very suitable for the application of high-reliability operating flight equipment, and in order to further improve the safety and the reliability of the flight equipment, a plurality of sensors of the same type are often installed at important parts to play a role of backup on one hand, and on the other hand, signals output by the plurality of sensors enter a system, and the system performs more accurate analysis and judgment on measured data.
In the prior art, a plurality of single-redundancy sensors are installed at one position, even if the redundancy sensors are installed, a pressure chip needs to be packaged into a pressure core body firstly, then the pressure core body is packaged into a shell to be packaged into the sensors, the shell needs to be manufactured respectively according to the requirements of the sensors with different redundancies to meet the structural requirements of packaging, so that the reliability of multiple packaged products is poor, the sensor occupies valuable space on flight equipment due to overlarge size, the problems of redundancy cannot be flexibly solved due to the fact that the products need to be customized and designed under most conditions, the sensors only have independent functions of pressure measurement and signal output, cannot be resolved and do not have an analysis and judgment function, and therefore the redundancy intelligent pressure sensor is provided.
Disclosure of Invention
The application provides a redundancy intelligence pressure sensor to it is many to solve the step that current pressure sensor caused the encapsulation, and the product reliability is poor, the sensor size greatly occupies valuable space on the flight equipment, the product will customize the design under most of the circumstances, the problem of solution redundancy that can not be nimble, and the sensor can only solitary ressure measurement and signal output's function moreover, and self can't be solved, does not have the problem of analysis and judgement function.
Alternatively, the first and second electrodes may be,
in order to solve the above technical problem or at least partially solve the above technical problem, the present application provides a redundancy intelligent pressure sensor, including:
the middle part of the upper end of the pressure interface is fixedly connected with a shunting block, the front, back, left and right side surfaces and the upper end surface of the outer side of the shunting block are fixedly connected with a sintering base, an installation detection cavity is formed in the sintering base, and a pressure chip and a corrugated diaphragm are arranged in the installation detection cavity;
the lower end of the signal processing circuit top plate is connected with four signal processing circuit side plates in an annular array mode, the signal processing circuit side plates are connected with welding pins on the outer side of the corresponding sintering base, and the signal processing circuit top plate is connected with the welding pins on the sintering base at the upper end.
Optionally, the upper part of the outer side of the pressure interface is in a nut shape, and a pressure channel is formed in the middle of the pressure interface.
Optionally, the flow splitting block is square, the middle of the flow splitting block is provided with staggered transmission channels, the lower ends of the transmission channels are communicated with the pressure channel, and the outer ends of the transmission channels are respectively communicated with the internal installation detection cavities of the corresponding sintering bases.
Optionally, the outer upper part of the pressure port is hermetically connected with a housing through a thread, and the upper end of the housing is connected with a housing cap through a thread.
Optionally, a cable is welded in the middle of the upper end of the top plate of the signal processing circuit, and the cable is hermetically inserted in the middle of the shell cap.
Optionally, the corrugated diaphragm is welded to the inner side surface of the installation detection cavity in a fixed and sealed mode, the inner side wall of the installation detection cavity is provided with a pressure chip, the pressure chip is connected with the corresponding welding foot on the inner side of the sintering base, and pins are inserted into the outer side of the installation detection cavity in a sealed mode.
Optionally, the top board of the signal processing circuit and the four side boards of the signal processing circuit are connected by wires.
The invention has the beneficial effects that:
through the overall structure of the equipment, the pressure of fluid enters the shunting block through the pressure channel of the pressure interface, the pressure is applied to each corrugated membrane respectively, the unnecessary pressure channel can plug the corresponding channel port on the shunting block, the corrugated membrane is elastically deformed to extrude the internal silicon oil when being pressed, the silicon oil transmits the pressure generated by extrusion to the pressure chip, the pressure chip does not need to be packaged, the pressure chip converts the pressure signal into an electric signal, the electric signal is transmitted to the signal processing circuit top plate after being processed by the signal processing circuit side plate, the signal processing circuit top plate analyzes and judges the signal after resolving, the operation result is output through a cable, the problem that the redundancy pressure sensor needs to be packaged into a core body firstly by the pressure chip and then packaged is solved, the number of internal channels can be configured according to the redundancy requirement, meanwhile, the redundancy pressure sensor has an intelligent function, and the measurement results of the internal channels can be compared and judged.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a sectional view showing the overall structure of an embodiment of the present invention.
Fig. 2 is a top cross-sectional view of an embodiment of the present invention.
Fig. 3 is an internal structural view of the embodiment of the present invention.
FIG. 4 is a circuit diagram of an embodiment of the present invention.
The labels in the figure are: 1. the pressure chip, 2, the sintering base, 3, the corrugated diaphragm, 4, the pin, 5, the signal processing circuit side plate, 6, the signal processing circuit top plate, 7, the cable, 8, the shell cap, 9, the shunt block, 10, the shell and 11, the pressure interface.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators in the embodiments of the present invention, such as up, down, left, right, front, and back, 8230, are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture as shown in the drawings, and if the specific posture is changed, the directional indicator is changed accordingly.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B", including either A or B or both A and B. In addition, technical solutions between the embodiments may be combined with each other, but must be based on the realization of the technical solutions by a person skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
In the prior art, a plurality of single redundancy sensors are installed at one position, even if the redundancy sensors are installed, a pressure chip needs to be firstly packaged into a pressure core body, then the pressure core body is packaged into a shell to be packaged into the sensor, and the shell needs to be manufactured respectively according to the requirements of the sensors with different redundancies so as to meet the packaging structural requirements.
In order to solve the problems, the invention provides a redundancy intelligent pressure sensor which is used for solving the problems that in the prior art, the pressure sensor has multiple packaging steps, the product reliability is poor, the sensor is overlarge in size and occupies valuable space on flight equipment, the product needs to be designed in a customized mode under most conditions, the redundancy cannot be flexibly solved, the sensor only has the functions of independent pressure measurement and signal output, cannot be solved, and does not have the function of analysis and judgment.
As shown in fig. 1 to 4, the present embodiment provides a redundancy intelligent pressure sensor, including:
the device comprises a pressure interface 11, wherein the middle part of the upper end of the pressure interface 11 is fixedly connected with a shunting block 9, the front, back, left and right side surfaces and the upper end surface of the outer side of the shunting block 9 are fixedly connected with a sintering base 2, an installation detection cavity is formed in the sintering base 2, and a pressure chip 1 and a corrugated diaphragm 3 are arranged in the installation detection cavity;
the signal processing circuit top plate 6, the lower extreme outside of signal processing circuit top plate 6 is the annular array and is connected with four signal processing circuit curb plates 5, and signal processing circuit curb plate 5 links to each other with the welding foot in the corresponding sintering base 2 outside to signal processing circuit top plate 6 links to each other with the welding foot on the sintering base 2 of upper end.
Specifically, the method comprises the following steps: the pressure chip 1 can be installed without packaging, a pressure interface 11 is welded on the lower side of the shell 10, a shell cap 8 is connected to the upper end of the shell 10 through threads, and a cable 7 is inserted in the middle of the shell cap 8 in a sealing mode, so that the inner cavity of the sensor is sealed;
the sensor comprises at most 5 pressure chips 1, one side of each pressure chip 1 is adhered to the side wall of the inner part of the installation detection cavity of the pressure sintering base 2, the sintering base 2 is made of stainless steel materials through a glass sintering kovar alloy pin, and the other side of each pressure chip 1 is connected with the pin on the sintering base 2 through a gold wire.
Sintering base 2, ripple diaphragm 3 and reposition of redundant personnel piece 9 are welded connection, and sintering base 2 internally mounted detects behind the chamber fill the stable silicon oil of nature and seal through welding pin 4.
The flow distribution block 9 is connected with the pressure interface 11 in a welding mode, the pressure of fluid enters the flow distribution block through the pressure channel of the pressure interface 11 and is applied to each corrugated membrane 3 respectively, the pressure channel which is not needed can plug the corresponding channel opening in the flow distribution block, the corrugated membranes 3 are pressed to generate elastic deformation to extrude the silicon oil inside, the silicon oil conducts the pressure generated by extrusion to the pressure chip 1, the pressure chip 1 converts the pressure signal into an electric signal, the electric signal is processed by the signal processing circuit side plate 5 and then transmitted to the signal processing circuit top plate 6, the signal processing circuit top plate 6 resolves the signal and then analyzes and judges the signal, and an operation result is output through the cable 7.
In this embodiment, as shown in fig. 1: the upper part of the outer side of the pressure interface 11 is in a nut shape, and the middle part of the pressure interface 11 is provided with a pressure channel.
Specifically, the method comprises the following steps: the pressure connection 11 is provided for the purpose of fluid entry, and thus the interior of the transmission channel.
In this embodiment, as shown in fig. 1: the flow distribution block 9 is square, staggered transmission channels are formed in the middle of the flow distribution block 9, the lower ends of the transmission channels are communicated with the pressure channel, and the outer ends of the transmission channels are respectively communicated with the corresponding inner installation detection cavities of the sintering bases 2.
Specifically, the method comprises the following steps: after the detected fluid enters the transmission channel, a squeezing force is applied to the corrugated diaphragm 3.
In this embodiment, as shown in fig. 1: the upper part of the outer side of the pressure connector 11 is sleeved with a shell 10 through thread sealing, and the upper end of the shell 10 is connected with a shell cap 8 through threads.
Specifically, the method comprises the following steps: the outer shell 10 serves as a protector, and the joint of the shell cap 8 and the outer shell 10 is in a sealed state.
In the present embodiment, as shown in fig. 1: and a cable 7 is welded in the middle of the upper end of the signal processing circuit top plate 6, and the cable 7 is hermetically inserted in the middle of the shell cap 8.
Specifically, the method comprises the following steps: the cable 7 is used for transmitting signals detected by the sensor.
In the present embodiment, as shown in fig. 1 and 2: the fixed seal welding of medial surface in installation detection chamber has ripple diaphragm 3, the inside wall in installation detection chamber is equipped with pressure chip 1, pressure chip 1 links to each other through 2 inboard welding feet with corresponding sintering base, and the outside in installation detection chamber all seals up the grafting and has pin 4.
Specifically, the method comprises the following steps: the sintering base 2 is internally provided with a detection cavity which is filled with silicone oil with stable property and then sealed by a welding pin 4.
In the present embodiment, as shown in fig. 1 and 3: the signal processing circuit top plate 6 is connected with the four signal processing circuit side plates 5 through leads.
Specifically, the method comprises the following steps: the pressure chip 1 converts the pressure signal into an electric signal, the electric signal is transmitted to the signal processing circuit top plate 6 after being processed by the signal processing circuit side plate 5, the signal processing circuit top plate 6 resolves the signal and then analyzes and judges the signal, and an operation result is output through the cable 7.
When the pressure sensor measures pressure, a measured medium acts on a corrugated diaphragm 3 in a sensor core through a medium inlet on a pressure interface 11, the corrugated diaphragm 3 is extruded, the corrugated diaphragm 3 transmits the extrusion force to a pressure chip 1 through silicon oil in an installation detection cavity, namely the installation detection cavity is internally filled with the silicon oil and sealed through a pin 4, the internal silicon oil is extruded by the corrugated diaphragm 3 and transmits the extrusion force to the pressure chip 1, the pressure chip 1 converts the sensed pressure into change of resistance value by utilizing piezoresistive effect, an equivalent circuit of the pressure chip is shown in figure 4, the pressure chip 1 integrates 4 piezoresistors to form a Wheatstone bridge, when the pressure is exerted, the resistance values of R1 and R3 are increased, the resistance values of R2 and R4 are reduced, an external power supply supplies power to the sensor through a shielding cable 7, the voltage conversion chip converts the external voltage into a stable reference voltage signal (+ 5V power supply voltage) and supplies the stable reference voltage signal to the temperature compensation conditioning chip, the internal excitation voltage of the temperature compensation cable conditioning chip is supplied to the pressure chip 1 through an internal excitation voltage Vs of the temperature compensation cable conditioning chip, when the pressure changes, an output signal V0 of the pressure chip 1 is conditioned and then is fed back to the temperature conditioning chip, the temperature compensation chip, the external signal processing chip and the monitoring chip through the monitoring circuit, and the external signal processing chip, and the monitoring circuit, and the output signal processing chip are respectively, and the monitoring circuit are respectively welded on a side plate, and the temperature compensation chip, and the side plate.
The above description is merely illustrative of particular embodiments of the invention that enable those skilled in the art to understand or practice the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (7)

1. A redundant intelligent pressure sensor, comprising:
the pressure interface (11), the middle part of the upper end of the pressure interface (11) is fixedly connected with a shunting block (9), the front side, the rear side, the left side, the right side and the upper end face of the outer side of the shunting block (9) are fixedly connected with a sintering base (2), an installation detection cavity is formed in the sintering base (2), and a pressure chip (1) and a corrugated diaphragm (3) are arranged in the installation detection cavity;
the signal processing circuit top plate (6), the lower extreme outside of signal processing circuit top plate (6) is the annular array and is connected with four signal processing circuit curb plates (5), and signal processing circuit curb plate (5) link to each other with the welding foot in corresponding sintering base (2) outside to signal processing circuit top plate (6) link to each other with the welding foot on sintering base (2) of upper end.
2. The intelligent redundancy pressure sensor of claim 1, wherein: the upper part of the outer side of the pressure interface (11) is in a nut shape, and the middle part of the pressure interface (11) is provided with a pressure channel.
3. The intelligent pressure sensor of claim 1, wherein: the flow dividing block (9) is square, staggered transmission channels are formed in the middle of the flow dividing block (9), the lower ends of the transmission channels are communicated with the pressure channel, and the outer ends of the transmission channels are respectively communicated with the corresponding inner installation detection cavities of the sintering base (2).
4. The intelligent pressure sensor of claim 1, wherein: the upper part of the outer side of the pressure connector (11) is connected with a shell (10) through a threaded sealing sleeve, and the upper end of the shell (10) is connected with a shell cap (8) through a thread.
5. The intelligent pressure sensor of claim 1, wherein: and a cable (7) is welded in the middle of the upper end of the signal processing circuit top plate (6), and the cable (7) is hermetically inserted in the middle of the shell cap (8).
6. The intelligent pressure sensor of claim 1, wherein: the fixed seal welding of medial surface in installation detection chamber has ripple diaphragm (3), the inside wall in installation detection chamber is equipped with pressure chip (1), pressure chip (1) links to each other through the inboard welding foot with corresponding sintering base (2), and the outside in installation detection chamber all seals up the grafting and has pin (4).
7. The intelligent pressure sensor of claim 1, wherein: the signal processing circuit top plate (6) is connected with the four signal processing circuit side plates (5) through leads.
CN202211356915.7A 2022-11-01 2022-11-01 Redundancy intelligent pressure sensor Pending CN115752867A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211356915.7A CN115752867A (en) 2022-11-01 2022-11-01 Redundancy intelligent pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211356915.7A CN115752867A (en) 2022-11-01 2022-11-01 Redundancy intelligent pressure sensor

Publications (1)

Publication Number Publication Date
CN115752867A true CN115752867A (en) 2023-03-07

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ID=85355086

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211356915.7A Pending CN115752867A (en) 2022-11-01 2022-11-01 Redundancy intelligent pressure sensor

Country Status (1)

Country Link
CN (1) CN115752867A (en)

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