CN115746562A - Modified polyimide material in 5G field and preparation method thereof - Google Patents

Modified polyimide material in 5G field and preparation method thereof Download PDF

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Publication number
CN115746562A
CN115746562A CN202211645159.XA CN202211645159A CN115746562A CN 115746562 A CN115746562 A CN 115746562A CN 202211645159 A CN202211645159 A CN 202211645159A CN 115746562 A CN115746562 A CN 115746562A
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China
Prior art keywords
antioxidant
fluoride
field
preparation
modified polyimide
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CN202211645159.XA
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Chinese (zh)
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毕经彬
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Huai'an Yueshuo Engineering Technology Service Studio
Shanghai Spite Rubber&plastic Co ltd
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Huai'an Yueshuo Engineering Technology Service Studio
Shanghai Spite Rubber&plastic Co ltd
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Priority to CN202211645159.XA priority Critical patent/CN115746562A/en
Publication of CN115746562A publication Critical patent/CN115746562A/en
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Abstract

The invention relates to the technical field of communication materials, in particular to a modified polyimide material in the field of 5G and a preparation method thereof, wherein the Polyimide (PI) material reduces dielectric loss through a fluoride formula and meets the requirement of a millimeter wave frequency band; the raw materials comprise the following components in percentage by mass: 65-70% of thermoplastic polyimide, 5-15% of aramid fiber, 14-30% of fluoride and 0.5-1% of antioxidant, wherein the thermoplastic polyimide, the aramid fiber, the fluoride and the antioxidant are mixed according to weight percentage by adopting a high-temperature internal mixer, the uniformly mixed materials are added into a hopper of a double-screw extruder, and the materials are subjected to melt blending, extrusion and granulation to prepare the Polyimide (PI) material for 5G communication.

Description

Modified polyimide material in 5G field and preparation method thereof
Technical Field
The invention relates to the technical field of communication materials, in particular to a modified polyimide material in the field of 5G and a preparation method thereof.
Background
Polyimide (PI) can be used as a Flexible Printed Circuit (FPC) substrate for 4G and Sub-6 bands, but the millimeter wave band has a further demand for a material that can control transmission loss and has lower dielectric characteristics. The PI base material has high water absorption rate, high dielectric constant and high dielectric loss factor, and particularly has obvious influence on products with the working frequency exceeding 10GHz, so that the requirement of a millimeter wave frequency band is difficult to meet.
The dielectric properties of PI used for 5G communication can be improved by modification, such as reducing dielectric loss through fluoride formulation, and the performance of PI on 10-15GHz high-frequency signals is comparable to that of LCP. High heat-resistant PI film product Pixeo for millimeter wave frequency band, for example, promoted by clock TM IB, dielectric loss at high frequency is as low as 0.0025. Compared with LCP, MPI has the advantages that MPI is easier to process and produce, can be produced in quantity and is priced for the people, and MPI and LCP are considered to be a situation of coexistence in the industry.
Disclosure of Invention
In order to solve the technical problems, the invention provides a modified polyimide material in the field of 5G and a preparation method thereof, wherein the dielectric loss of the Polyimide (PI) material is reduced through a fluoride formula, and the requirement of a millimeter wave frequency band is met.
The invention relates to a modified polyimide material in the field of 5G and a preparation method thereof, wherein the modified polyimide material comprises the following raw materials in percentage by mass: 65-70% of thermoplastic polyimide, 5-15% of aramid fiber, 14-30% of fluoride and 0.5-1% of antioxidant, wherein the thermoplastic polyimide, the aramid fiber, the fluoride and the antioxidant are mixed according to weight percentage by adopting a high-temperature internal mixer, the uniformly mixed materials are added into a hopper of a double-screw extruder, and the materials are subjected to melt blending, extrusion and granulation to prepare the Polyimide (PI) material for 5G communication.
The invention relates to a modified polyimide material in the field of 5G and a preparation method thereof, wherein the modified polyimide material comprises the following raw materials in percentage by mass: 70% of thermoplastic polyimide, 15% of aramid fiber, 14.3% of fluoride and 0.7% of antioxidant.
The invention relates to a modified polyimide material in the field of 5G and a preparation method thereof, wherein the modified polyimide material comprises the following raw materials in percentage by mass: 70% of thermoplastic polyimide, 10% of aramid fiber, 19.3% of fluoride and 0.7% of antioxidant.
The invention relates to a modified polyimide material in the field of 5G and a preparation method thereof, wherein the modified polyimide material comprises the following raw materials in percentage by mass: 70% of thermoplastic polyimide, 5% of aramid fiber, 24.3% of fluoride and 0.7% of antioxidant.
The invention relates to a modified polyimide material in the field of 5G and a preparation method thereof, wherein the modified polyimide material comprises the following raw materials in percentage by mass: 65% of thermoplastic polyimide, 5% of aramid fiber, 29.3% of fluoride and 0.7% of antioxidant.
The invention relates to a modified polyimide material in the field of 5G and a preparation method thereof, wherein the molecular weight of aramid fiber is 300000-500000.
The invention relates to a modified polyimide material in the field of 5G and a preparation method thereof, wherein fluoride is polytetrafluoroethylene.
The invention relates to a modified polyimide material in the field of 5G and a preparation method thereof, and specifically relates to an antioxidant 1010.
The invention relates to a modified polyimide material in the field of 5G and a preparation method thereof.A double-screw extruder has the processing conditions that the temperature of a first zone is 320 ℃, the temperature of a second zone is 335 ℃, the temperature of a third zone to a fifth zone is 345 ℃, the temperature of a sixth zone to an eighth zone is 350 ℃, the temperature of a machine head is 340 ℃, and the rotating speed of a main machine is 160 r/min.
Compared with the prior art, the invention has the beneficial effects that: 1. according to the invention, through the use of the thermoplastic polyimide, the modified polyimide amorphous material disclosed by the invention has good high temperature resistance, wear resistance and dimensional stability, and through the design of the aramid fiber, the modified polyimide amorphous material disclosed by the invention has good flexibility and impact resistance.
2. The modified polyimide non-crystalline material of the invention improves the defects of high friction coefficient, poor processing performance, high wear rate and the like of polyimide.
3. According to the invention, the dielectric loss can be reduced by adding the fluoride, the requirement of a millimeter wave frequency band can be met, and the antioxidant performance can be improved by adding the antioxidant. .
Drawings
FIG. 1 is a schematic view of the material composition of a modified Polyimide (PI) material for 5G communication according to the present invention;
FIG. 2 is a flow chart of a process for making a modified Polyimide (PI) material for 5G communication according to the present invention;
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Example 1:
a modified Polyimide (PI) material for 5G communication comprises the following raw materials in percentage by mass: 70% of thermoplastic polyimide, 15% of aramid fiber, 14.3% of fluoride and 0.7% of antioxidant, mixing the thermoplastic polyimide, the aramid fiber, the fluoride and the antioxidant according to weight percentage by adopting a high-temperature internal mixer, adding the uniformly mixed materials into a hopper of a double-screw extruder, and carrying out melt blending, extrusion and granulation to prepare the Polyimide (PI) material for 5G communication.
Furthermore, the molecular weight of the aramid fiber is 300000-500000.
Further, the fluoride is polytetrafluoroethylene in particular.
Further, the antioxidant is specifically antioxidant 1010.
Further, the processing conditions of the double-screw extruder are that the temperature of the first zone is 320 ℃, the temperature of the second zone is 335 ℃, the temperature of the third zone to the fifth zone is 345 ℃, the temperature of the sixth zone to the eighth zone is 350 ℃, the temperature of a machine head is 340 ℃, and the rotating speed of a main machine is 160 revolutions per minute.
Example 2:
a modified Polyimide (PI) material for 5G communication comprises the following raw materials in percentage by mass: 70% of thermoplastic polyimide, 10% of aramid fiber, 19.3% of fluoride and 0.7% of antioxidant, mixing the thermoplastic polyimide, the aramid fiber, the fluoride and the antioxidant according to weight percentage by adopting a high-temperature internal mixer, adding the uniformly mixed materials into a hopper of a double-screw extruder, and carrying out melt blending, extrusion and granulation to prepare the Polyimide (PI) material for 5G communication.
Furthermore, the molecular weight of the aramid fiber is 300000-500000.
Further, the fluoride is polytetrafluoroethylene in particular.
Further, the antioxidant is specifically antioxidant 1010.
Further, the processing conditions of the double-screw extruder are that the temperature of the first zone is 320 ℃, the temperature of the second zone is 335 ℃, the temperature of the third zone to the fifth zone is 345 ℃, the temperature of the sixth zone to the eighth zone is 350 ℃, the temperature of a machine head is 340 ℃, and the rotating speed of a main machine is 160 revolutions per minute.
Example 3:
a modified Polyimide (PI) material for 5G communication comprises the following raw materials in percentage by mass: 70% of thermoplastic polyimide, 5% of aramid fiber, 24.3% of fluoride and 0.7% of antioxidant, mixing the thermoplastic polyimide, the aramid fiber, the fluoride and the antioxidant according to weight percentage by adopting a high-temperature internal mixer, adding the uniformly mixed materials into a hopper of a double-screw extruder, and carrying out melt blending, extrusion and granulation to prepare the Polyimide (PI) material for 5G communication.
Furthermore, the molecular weight of the aramid fiber is 300000-500000.
Further, the fluoride is polytetrafluoroethylene in particular.
Further, the antioxidant is specifically antioxidant 1010.
Further, the processing conditions of the double-screw extruder are that the temperature of the first zone is 320 ℃, the temperature of the second zone is 335 ℃, the temperature of the third zone to the fifth zone is 345 ℃, the temperature of the sixth zone to the eighth zone is 350 ℃, the temperature of a machine head is 340 ℃, and the rotating speed of a main machine is 160 revolutions per minute.
Example 4:
a modified Polyimide (PI) material for 5G communication comprises the following raw materials in percentage by mass: the preparation method comprises the following steps of mixing 65% of thermoplastic polyimide, 5% of aramid fiber, 29.3% of fluoride and 0.7% of antioxidant by a high-temperature internal mixer, adding the mixed materials into a hopper of a double-screw extruder, and carrying out melt blending, extrusion and granulation to obtain the Polyimide (PI) material for 5G communication.
Furthermore, the molecular weight of the aramid fiber is 300000-500000.
Further, the fluoride is polytetrafluoroethylene in particular.
Further, the antioxidant is specifically antioxidant 1010.
Further, the processing conditions of the double-screw extruder are that the temperature of the first zone is 320 ℃, the temperature of the second zone is 335 ℃, the temperature of the third zone to the fifth zone is 345 ℃, the temperature of the sixth zone to the eighth zone is 350 ℃, the temperature of a machine head is 340 ℃, and the rotating speed of a main machine is 160 revolutions per minute.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims (9)

1. A modified polyimide material in the 5G field and a preparation method thereof are characterized in that the modified polyimide material comprises the following raw materials by mass percent: 65-70% of thermoplastic polyimide, 5-15% of aramid fiber, 14-30% of fluoride and 0.5-1% of antioxidant, wherein the thermoplastic polyimide, the aramid fiber, the fluoride and the antioxidant are mixed according to weight percentage by adopting a high-temperature internal mixer, the uniformly mixed materials are added into a hopper of a double-screw extruder, and the materials are subjected to melt blending, extrusion and granulation to prepare the Polyimide (PI) material for 5G communication.
2. The modified polyimide material in the 5G field and the preparation method thereof according to claim 1 are characterized in that the modified polyimide material comprises the following raw materials in percentage by mass: 70% of thermoplastic polyimide, 15% of aramid fiber, 14.3% of fluoride and 0.7% of antioxidant.
3. The modified polyimide material in the 5G field and the preparation method thereof as claimed in claim 2, wherein the raw material composition comprises, by mass: 70% of thermoplastic polyimide, 10% of aramid fiber, 19.3% of fluoride and 0.7% of antioxidant.
4. The modified polyimide material in the 5G field and the preparation method thereof as claimed in claim 3, wherein the raw material composition comprises, by mass: 70% of thermoplastic polyimide, 5% of aramid fiber, 24.3% of fluoride and 0.7% of antioxidant.
5. The modified polyimide material in the 5G field and the preparation method thereof as claimed in claim 4, wherein the raw materials comprise, by mass: 65% of thermoplastic polyimide, 5% of aramid fiber, 29.3% of fluoride and 0.7% of antioxidant.
6. The modified polyimide material in the 5G field and the preparation method thereof as claimed in claim 5, wherein the molecular weight of the aramid fiber is 300000-500000.
7. The modified polyimide material in the 5G field and the preparation method thereof as claimed in claim 6, wherein the fluoride is polytetrafluoroethylene.
8. The modified polyimide material in the 5G field and the preparation method thereof as claimed in claim 7, wherein the antioxidant is specifically antioxidant 1010.
9. The modified polyimide material in the 5G field and the preparation method thereof as claimed in claim 7, wherein the processing conditions of the twin-screw extruder are that the temperature of the first zone is 335 ℃ in the second zone, 345 ℃ in the third to fifth zones, 340 ℃ in the sixth to eighth zones, and 160 rpm of the main engine.
CN202211645159.XA 2022-12-21 2022-12-21 Modified polyimide material in 5G field and preparation method thereof Pending CN115746562A (en)

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Citations (14)

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US6121171A (en) * 1997-04-08 2000-09-19 Sumitomo Chemical Company, Ltd. Composite film comprising low-dielectric resin and paraoriented aromatic polyamide
DE10326758A1 (en) * 2003-06-13 2005-01-05 Friz Biochem Gmbh Substrate for controlled binding reactions, useful for (high throughput) nucleic acid hybridization assays, comprises carrier having a depression in which there are many test sites, separated by embankments
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CN203881978U (en) * 2014-02-10 2014-10-15 江苏通光电子线缆股份有限公司 Novel aviation high-temperature resistant signal transmission cable
CN106328267A (en) * 2016-09-20 2017-01-11 芜湖航天特种电缆厂股份有限公司 Flat and tensile signal transmission composite cable and preparation method thereof, and transmission composite cable assembly
CN106675025A (en) * 2016-12-21 2017-05-17 南通汇平高分子新材料有限公司 Polyimide-modified material and preparation method and application thereof
CN106957528A (en) * 2017-02-04 2017-07-18 王飞 A kind of thermoplastic resin-based fibrous composite of low dielectric and application thereof
CN107604532A (en) * 2017-08-24 2018-01-19 中国恩菲工程技术有限公司 Surface material, filter bag, smoke processing system and the processing method of filter bag
CN207441342U (en) * 2017-10-25 2018-06-01 正威科技(深圳)有限公司 A kind of low standing wave lightweight coaxial cable of high stable phase
CN109943286A (en) * 2019-04-10 2019-06-28 陕西科技大学 A kind of preparation method of biomass carbon nano-powder/resin composite materials
CN112778695A (en) * 2021-01-07 2021-05-11 南京工业大学 Wear-resistant liquid metal polymer self-lubricating composite material
CN113667305A (en) * 2021-09-01 2021-11-19 深圳市动盈先进材料有限公司 Modified polyimide non-crystalline material
CN115377609A (en) * 2022-08-11 2022-11-22 浙江大象新能源科技有限公司 Polymer insulating coating and preparation method thereof

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5726107A (en) * 1994-08-30 1998-03-10 Hoechst Aktiengesellschaft Non-wovens of electret fiber mixtures having an improved charge stability
US6121171A (en) * 1997-04-08 2000-09-19 Sumitomo Chemical Company, Ltd. Composite film comprising low-dielectric resin and paraoriented aromatic polyamide
DE10326758A1 (en) * 2003-06-13 2005-01-05 Friz Biochem Gmbh Substrate for controlled binding reactions, useful for (high throughput) nucleic acid hybridization assays, comprises carrier having a depression in which there are many test sites, separated by embankments
CN102174770A (en) * 2011-01-27 2011-09-07 深圳昊天龙邦复合材料有限公司 Prepreg containing aromatic synthetic fiber paper and printed circuit board manufactured from same
CN203881978U (en) * 2014-02-10 2014-10-15 江苏通光电子线缆股份有限公司 Novel aviation high-temperature resistant signal transmission cable
CN106328267A (en) * 2016-09-20 2017-01-11 芜湖航天特种电缆厂股份有限公司 Flat and tensile signal transmission composite cable and preparation method thereof, and transmission composite cable assembly
CN106675025A (en) * 2016-12-21 2017-05-17 南通汇平高分子新材料有限公司 Polyimide-modified material and preparation method and application thereof
CN106957528A (en) * 2017-02-04 2017-07-18 王飞 A kind of thermoplastic resin-based fibrous composite of low dielectric and application thereof
CN107604532A (en) * 2017-08-24 2018-01-19 中国恩菲工程技术有限公司 Surface material, filter bag, smoke processing system and the processing method of filter bag
CN207441342U (en) * 2017-10-25 2018-06-01 正威科技(深圳)有限公司 A kind of low standing wave lightweight coaxial cable of high stable phase
CN109943286A (en) * 2019-04-10 2019-06-28 陕西科技大学 A kind of preparation method of biomass carbon nano-powder/resin composite materials
CN112778695A (en) * 2021-01-07 2021-05-11 南京工业大学 Wear-resistant liquid metal polymer self-lubricating composite material
CN113667305A (en) * 2021-09-01 2021-11-19 深圳市动盈先进材料有限公司 Modified polyimide non-crystalline material
CN115377609A (en) * 2022-08-11 2022-11-22 浙江大象新能源科技有限公司 Polymer insulating coating and preparation method thereof

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