CN115740791A

CN115740791A - Laser cutting method, electronic device, system and storage medium

Info

Publication number: CN115740791A
Application number: CN202211227385.6A
Authority: CN
Inventors: 王硕硕; 郑武奎; 巫浩源; 王志伟; 万华
Original assignee: Shenzhen Hero Laser Equipment Co ltd
Current assignee: Shenzhen Hero Laser Equipment Co ltd
Priority date: 2022-10-09
Filing date: 2022-10-09
Publication date: 2023-03-07

Abstract

The application discloses a laser cutting method, electronic equipment, a system and a storage medium, wherein the laser cutting method comprises the following steps: detecting the actual material and the actual thickness of the plate to be cut; if the actual material is matched with a preset target material and the actual thickness is matched with a preset target thickness, determining target process parameters of the laser cutting according to the actual thickness and the actual material; and carrying out laser cutting on the plate to be cut according to the target process parameters. The technical problem that the debugging time of the technological parameters of laser cutting is long in the prior art is solved.

Description

Laser cutting method, electronic device, system and storage medium

Technical Field

The present disclosure relates to the field of laser cutting technologies, and in particular, to a laser cutting method, an electronic device, a system, and a storage medium.

Background

Laser cutting is the most important application technology in the laser processing industry, accounts for more than 70% of the whole laser processing industry, is an advanced cutting process in the world at present, and solves the problems that many conventional methods cannot solve in industrial production due to the advantages of precision manufacturing, flexible cutting, special-shaped processing, one-step forming, high speed, high efficiency and the like, and laser can cut most metal materials.

However, most of the current laser cutting process parameters are manually observed to cut the plate, trial cutting is carried out according to experience, the process parameters are adjusted according to trial cutting results, and the adjustment time is long as the final determination is carried out through repeated debugging.

Disclosure of Invention

The present application mainly aims to provide a laser cutting method, an electronic device, a system and a storage medium, and aims to solve the technical problem of long debugging time of process parameters of laser cutting in the prior art.

In order to achieve the above object, the present application provides a laser cutting method, including the steps of:

detecting the actual material and the actual thickness of the plate to be cut;

if the actual material is matched with a preset target material and the actual thickness is matched with a preset target thickness, determining target process parameters of the laser cutting according to the actual thickness and the actual material;

and carrying out laser cutting on the plate to be cut according to the target process parameters.

Optionally, the step of detecting the actual material and the actual thickness of the plate to be cut includes:

emitting X-ray fluorescence and ultrasonic waves to a plate to be cut through a detection probe of the plate detection device to generate an X-ray fluorescence detection result and an ultrasonic detection result;

and determining the actual material of the plate to be cut according to the X-ray fluorescence detection result, and determining the actual thickness of the plate to be cut according to the ultrasonic detection result.

Optionally, before the step of emitting X-ray fluorescence and ultrasonic waves to the plate to be cut by the detection probe of the plate detection device to generate an X-ray fluorescence detection result and an ultrasonic detection result, the method further includes:

and moving a detection probe of the plate detection device to a position where a detection window on the detection probe is attached to the plate to be cut.

Optionally, the step of moving the detection probe of the plate detection apparatus to a position where the detection window on the detection probe is attached to the plate to be cut includes:

moving a detection probe of a plate detection device to the direction of the plate to be cut, and detecting a first current capacitor in real time through a capacitance sensor on the detection probe;

when the first current capacitance is detected to be reduced to 0, stopping moving the detection probe.

Optionally, the detection probe and the cutting head of the laser cutting device are arranged on a movable back plate, and the detection probe is connected with the movable back plate in a sliding manner;

moving a detection probe of the plate detection device to the direction of the plate to be cut, and detecting a first current capacitor in real time through a capacitor sensor on the detection probe before the step of detecting the first current capacitor in real time, the method further comprises the following steps:

moving the detection probe to a preset initial position so that the distance between the detection probe and the plate to be cut is greater than the distance between the cutting head and the plate to be cut;

moving the movable back plate to the direction of the plate to be cut, and detecting a second current capacitance in real time through a capacitance sensor on the cutting head;

stopping moving the moving back plate when the second current capacitance is detected to be reduced to 0;

moving the movable back plate to a preset distance in a direction away from the plate to be cut;

and blowing compressed gas to the plate to be cut through a laser nozzle on the cutting head.

Optionally, the step of determining the target process parameter of the laser cutting according to the actual thickness and the actual material includes:

and matching corresponding target process parameters from a preset database according to the actual thickness and the actual material, wherein the target process parameters comprise a target focal length, a target laser nozzle model and a target auxiliary gas.

The present application further provides an electronic device, the electronic device is an entity device, the electronic device includes: a memory, a processor and a program of the laser cutting method stored on the memory and executable on the processor, the program of the laser cutting method when executed by the processor being operable to implement the steps of the laser cutting method as described above.

The present application further provides a laser cutting system comprising a laser cutting device, a sheet material detection device, and an electronic apparatus as described above, wherein,

the plate detection device is used for detecting the actual thickness and the actual material quality of the plate to be cut;

the laser cutting device is used for carrying out laser cutting on the plate to be cut.

Optionally, the plate detection device includes a detection probe and a capacitance sensor, and the detection probe includes an ultrasonic detection module and an X-ray fluorescence detection module;

the ultrasonic detection module is used for detecting the actual thickness of a plate to be cut;

the X-ray fluorescence detection module is used for detecting the actual material of the plate to be cut;

the capacitive sensor is arranged on a detection probe of the plate detection device and used for detecting the distance between the detection probe and the plate to be detected.

The present application also provides a storage medium, which is a computer-readable storage medium, on which a program for implementing the laser cutting method is stored, and when the program of the laser cutting method is executed by a processor, the steps of the laser cutting method are implemented as described above.

The application provides a laser cutting method, electronic equipment, system and storage medium, through actual thickness and the actual material that detects the panel of waiting to cut, realized before laser cutting to the actual thickness and the accurate affirmation of the actual material of waiting to cut panel, and then through if confirm actual material and preset target material phase-match, just actual thickness and preset target thickness phase-match, then according to actual thickness with actual material confirms this laser cutting's target technological parameter, according to target technological parameter is right wait to cut panel and carry out laser cutting, realized right whether the actual material and the actual thickness of waiting to cut panel accord with the affirmation that expects the requirement actual material and preset target material phase-match, just when actual thickness matches with preset target thickness, just further automatic matching corresponds technological parameter, right wait to cut panel and carry out laser cutting. Compare in the mode of manual observation and manual debugging, on the one hand, this application is through the automated inspection and the affirmation of actual thickness and actual material, can effectively reduce the error that artifical judgement produced, avoided because artifical judgement mistake leads to waiting to cut panel itself and choose for use the mistake, and then the condition of the whole batch reprocessing that leads to, on the other hand, after the technological parameter that corresponds is automatic to be matchd according to actual thickness and actual material, can directly carry out laser cutting processing, effectively practiced thrift and carried out the step and the time of technological parameter debugging many times repeatedly, the longer technical problem of technological parameter debugging time of prior art laser cutting has been overcome.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.

FIG. 1 is a schematic flow chart of an embodiment of a laser cutting method of the present application;

FIG. 2 is a schematic structural diagram illustrating one possible implementation of a movable backplate according to an embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram of a hardware operating environment related to a laser cutting method in an embodiment of the present application;

fig. 4 is a schematic structural diagram of an embodiment of a laser cutting system according to the present application.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name(s)
				10	Plate detection device	11	Detection probe
12	Detection window	20	Laser cutting device
				21	Cutting head	22	Laser nozzle
30	Track	40	Mobile backboard
				50	Electronic device

The objectives, features, and advantages of the present application will be further described with reference to the accompanying drawings.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. It should be apparent that the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.

However, most of the current laser cutting process parameters are manually observed for a plate to be cut, trial cutting is carried out according to experience, the process parameters are adjusted according to trial cutting results, and the final adjustment is carried out through repeated debugging, so that the debugging time is long. When the process parameters are adjusted, if basic information of a plate to be cut needs to be confirmed, visual observation or rough measurement is usually performed, for example, the thickness of the plate is measured by manually holding a caliper with a hand, and components, models and the like of the plate are looked up through label information, the manually measured thickness error is large, the information of the components, the models and the like of the plate is large and small in difference, and errors easily occur in a manual observation mode, so that the plate is often found to be selected incorrectly after the cutting is completed and is bent or otherwise processed, so that a whole batch of materials are scrapped, and time and resource waste is caused.

Based on this, the application provides a laser cutting method, an electronic device, a system and a storage medium, through detecting actual thickness and actual material of a plate to be cut, accurate determination of actual thickness and actual material of the plate to be cut before laser cutting is realized, and then through determining if the actual material is matched with a preset target material, and the actual thickness is matched with the preset target thickness, then according to the actual thickness and the actual material, the target process parameters of the laser cutting are determined, according to the target process parameters, the plate to be cut is subjected to laser cutting, and whether the actual material and the actual thickness of the plate to be cut meet the expected requirements is confirmed, when the actual material is matched with the preset target material, and the actual thickness is matched with the preset target thickness, the corresponding process parameters are further automatically matched, and the plate to be cut is subjected to laser cutting. This application is before laser cutting, can the accurate actual thickness and the actual material of confirming the panel of waiting to cut, if actual material and actual material are different with predetermined, then can in time discover and in time handle, if actual material and actual material are the same with predetermined, just can carry out follow-up operation, compare in the mode of artifical observation and artifical debugging, on the one hand, this application passes through the automated inspection and the affirmation of actual thickness and actual material, can effectively reduce the error that manual judgement produced, avoided because manual judgement mistake leads to waiting to cut panel itself and choose for use the mistake, and then the condition of the whole batch reprocessing that leads to, on the other hand, after the technological parameter that corresponds is automatic to be matchd according to actual thickness and actual material, can directly carry out laser cutting processing, effectively practiced thrift the step and the time of carrying out technological parameter debugging many times repeatedly, the longer technical problem of technological parameter debugging time of prior art laser cutting has been overcome, the technological parameter debugging time of prior art laser cutting is longer

In an embodiment of the present application, with reference to fig. 1, a laser cutting method is provided, including the following steps:

s10, detecting the actual material and the actual thickness of the plate to be cut;

in this embodiment, it should be noted that the laser cutting method is applied to a laser cutting system, the laser cutting system at least includes a laser cutting device, a board detection device, and an electronic device, the laser cutting device and the board detection device are respectively in communication connection with the electronic device, the communication connection includes a wireless communication connection or a wired communication connection, and in an implementable manner, the laser cutting device and the board detection device are respectively connected with the electronic device through an optical fiber for data transmission. The plate detection device is used for detecting the actual thickness and the actual material of a plate to be cut, the plate detection device at least comprises a detection probe, the detection probe at least comprises a thickness detection module and a material detection module, the thickness detection module can be an ultrasonic detection module, a laser detection module, an X-ray detection module and the like, the material detection module can be an X-ray fluorescence detection module and the like, and the detection device can further comprise a capacitance sensor, the capacitance sensor is arranged on the detection probe and used for detecting the distance between the detection probe and the plate to be detected; the laser cutting device is used for carrying out laser cutting on the plate to be cut and at least comprises a cutting head, a laser nozzle installation position is arranged on the cutting head, laser nozzles of different models can be installed or detached according to actual needs, and the laser nozzles are used for emitting laser to cut the plate to be cut.

The laser nozzle may vertically face the plate to be cut, or may form an arbitrary required angle with the plate to be cut, for convenience of description, the laser nozzle is subsequently used to vertically face the plate to be cut for description, and if the laser nozzle forms a certain angle with the plate to be cut, corresponding adjustment of process parameters and the like may be performed through angle conversion, which is not limited in this embodiment.

The plate to be cut is a metal plate, the material is a type of metal plate determined according to the composition of the metal plate, the metal plate is divided into a plurality of types according to the specific components, for example, stainless steel, carbon steel, aluminum alloy, brass, red copper alloy, and the like, each of which can be further subdivided, for example, the stainless steel can be further divided into austenite stainless steel (201, 202, 301, 304, 309S, 310S, 316L, 317L, 321, 347, 409, and the like according to the material labels), super austenite stainless steel (904L, 254SMo, and the like according to the material labels), martensite stainless steel (410, 420, 431, and the like according to the material labels), and the like, and the same or different process parameters may need to be set when the different types of metal are subjected to laser cutting.

Specifically, the actual thickness of the plate to be cut is detected through a thickness detection module in the laser cutting system, and the actual material of the plate to be cut is detected through a material detection module in the laser cutting system, wherein the thickness detection module can be an existing thickness detection instrument, the material detection module can be an existing material detection instrument, a specific detection method is similar to that of the prior art, and the description is omitted here.

s11, emitting X-ray fluorescence and ultrasonic waves to a plate to be cut through a detection probe of the plate detection device to generate an X-ray fluorescence detection result and an ultrasonic detection result;

in this embodiment, specifically, a detection probe of the sheet detecting device emits X-ray fluorescence and ultrasonic waves to a sheet to be cut, and the detection probe detects the attenuation of the intensity of the X-ray fluorescence after passing through the sheet to be cut, so as to determine components in the sheet to be cut, generate an X-ray fluorescence detection result, and detect the time elapsed from the emission of the ultrasonic waves to the reception of the reflected ultrasonic waves by the detection probe, so as to generate an ultrasonic detection result, where the method for performing X-ray fluorescence detection and ultrasonic detection on the material to be cut by the detection probe is similar to that of the prior art, and is not described herein.

Optionally, before the step of emitting X-ray fluorescence and ultrasonic waves to the sheet to be cut through a detection probe of the sheet detection apparatus to generate an X-ray fluorescence detection result and an ultrasonic detection result, the method further includes:

In this embodiment, specifically, a detection probe of the sheet detecting apparatus is moved toward the sheet to be cut until a detection window on the detection probe is just attached to the sheet to be cut, and the movement of the detection probe is stopped, wherein the movement speed of the detection probe may be a preset slow speed, so as to avoid the detection window from colliding with the sheet to be cut to cause abrasion or damage, the preset slow speed may be set according to actual conditions, and the movement speed of the detection probe may also be adjusted according to the distance between the detection probe and the sheet to be cut, for example, the movement speed may be proportional to the distance between the detection probe and the sheet to be cut, or different distance ranges may be preset, each distance range corresponds to a different movement speed, and the smaller the distance is, the slower the movement speed is, for example, v is 0 when the distance is 0, when the distance is in a 1-a 2 range, the movement speed is v1 when the distance is in a 2-a 3 range, the movement speed is v2 when the distance is greater than a2, the movement speed is v3, wherein a1 is less than a2, and v3 is less than a2 and v3 is less than a2 and less than v2 is less than a 2.

step A10, moving a detection probe of a plate detection device to the direction of the plate to be cut, and detecting a first current capacitance in real time through a capacitance sensor on the detection probe;

and step A20, when the first current capacitance is detected to be reduced to 0, stopping moving the detection probe.

In this embodiment, it should be noted that a detection probe of the plate detecting device is provided with a capacitance sensor, a position of the capacitance sensor and a position of a detection window of the detection probe are in the same horizontal plane, the capacitance sensor can measure a capacitance value between the capacitance sensor and the plate to be cut, that is, can measure a capacitance value between the detection window and the plate to be cut, the closer the capacitance sensor is to the plate to be cut, the larger the capacitance value is, but when the capacitance sensor is in contact with the plate to be cut, the capacitance value may become 0.

Specifically, a detection probe of the plate detection device is moved towards the direction of the plate to be cut, a first current capacitance is detected in real time through a capacitance sensor on the detection probe, the capacitance is increased along with the decrease of the distance between the detection probe and the plate to be detected, and when the detection probe is in contact with the plate to be detected, the capacitance is changed to 0, so that when the first current capacitance is detected to be reduced to 0, the detection probe is immediately stopped moving.

In an implementation manner, after the step of moving the detection probe of the sheet material detection apparatus to the direction of the sheet material to be cut and detecting the first current capacitance in real time by the capacitance sensor on the detection probe, the method may further include: determining the moving speed of the detection probe according to the first current capacitance, where the moving speed may be inversely proportional to the first current capacitance, or preset different capacitance value ranges, each capacitance value range corresponds to a different moving speed, the larger the capacitance value is, the slower the moving speed is, for example, when the capacitance value is 0, v is 0, when the capacitance value is greater than b3, the moving speed is v4, when the distance is in a range from b2 to b3, the moving speed is v5, and when the capacitance value is in a range from b1 to b2, the moving speed is v6, where b1 is smaller than b2 and smaller than b3, and v4 is smaller than v5 and smaller than v6.

before the step of moving the detection probe of the plate detection device to the direction of the plate to be cut and detecting a first current capacitance in real time through the capacitance sensor on the detection probe, the method further comprises:

step B10, moving the detection probe to a preset initial position so that the distance between the detection probe and the plate to be cut is larger than the distance between the cutting head and the plate to be cut;

in this embodiment, it should be noted that the detection probe and the cutting head of the laser cutting device are disposed on a movable back plate, wherein the cutting head is fixed on the movable back plate and moves along with the movable back plate, and the detection probe is slidably connected to the movable back plate, and can move along with the movable back plate or move relative to the movable back plate.

In an implementation manner, referring to fig. 2, in fig. 2, a movable back plate 40 is slidably connected to a vertical shaft through a sliding rail 30 and can move up and down along the vertical shaft, a cutting head 21 is fixed on the movable back plate 40, a laser nozzle 22 is installed at the lower part of the cutting head 21, laser can be vertically emitted downwards through the laser nozzle 22 to perform laser cutting on a plate to be cut located below the laser nozzle 22, the cutting head 11 is slidably connected to the movable back plate 40 through the sliding rail 30 and can move up and down along the vertical shaft, a detection window 12 is arranged at the lower part of the cutting head, and when the detection window 12 is attached to the plate to be cut, X-ray fluorescence and/or ultrasonic waves can be emitted through the detection window 12 to detect the actual thickness and the actual material of the plate to be cut.

The distance between the detection probe and the plate to be cut refers to the minimum distance between the detection probe and the plate to be cut, under normal conditions, a detection window on the detection probe is parallel to the plate to be cut and has the minimum distance with the plate to be cut, the distance between the detection window and the plate to be cut can be used as the distance between the detection probe and the plate to be cut, the distance between the cutting head and the plate to be cut refers to the minimum distance between the cutting head and the plate to be cut, under normal conditions, the distance between a nozzle outlet of a laser nozzle on the cutting head and the plate to be cut is the minimum distance, and the distance between the nozzle outlet of the laser nozzle and the plate to be cut can be used as the distance between the cutting head and the plate to be cut.

Specifically, the detection probe may be moved to a preset initial position at any time when the detection probe does not need to be used for detection, for example, after detection is completed each time, after program operation is completed, or when a program is started to be initialized, so that a distance between the detection probe and a plate to be cut is greater than a distance between the cutting head and the plate to be cut, and collision between the detection probe and the plate to be cut is avoided when the moving back plate moves.

Step B20, moving the movable back plate to the direction of the plate to be cut, and detecting a second current capacitance in real time through a capacitance sensor on the cutting head;

step B30, when the second current capacitance is detected to be reduced to 0, stopping moving the movable back plate;

in this embodiment, specifically, the moving back plate is moved towards the direction of the plate to be cut, a second current capacitance is detected in real time through a capacitance sensor on the cutting head, the capacitance is increased as the distance between the cutting head and the plate to be cut is decreased, and when the cutting head contacts the plate to be cut, the capacitance is changed to 0, so that when the second current capacitance is detected to be decreased to 0, the moving back plate is stopped.

Step B40, moving the movable back plate to a direction away from the plate to be cut by a preset distance;

and B50, blowing compressed gas to the plate to be cut through a laser nozzle on the cutting head.

In this embodiment, specifically, when it is detected that the first current capacitance is reduced to 0, it indicates that the cutting head is in contact with the plate to be cut, at this time, the moving back plate is moved by a preset distance, for example, lifted by 20mm, in a direction away from the plate to be cut, and a compressed gas is blown to the plate to be cut through a laser nozzle on the cutting head to blow off metal debris and sink and float on the surface of the plate to be cut, so as to reduce wear of a detection window in subsequent detection of the plate to be cut, and in an implementable manner, the compressed gas is compressed air.

And S12, determining the actual material of the plate to be cut according to the X-ray fluorescence detection result, and determining the actual thickness of the plate to be cut according to the ultrasonic detection result.

In this embodiment, specifically, the X-ray fluorescence detection result includes components and their contents in the sheet to be cut, a mapping relationship between preset materials and the components is queried, so as to determine an actual material corresponding to the X-ray fluorescence detection result, the ultrasonic detection result includes time elapsed from sending of the ultrasonic wave to receiving of the reflected ultrasonic wave, and a path traveled by the ultrasonic wave can be calculated according to a sound velocity and the time, so as to determine the thickness of the sheet to be cut, where the sound velocity may be preset to a fixed value, or the mapping relationship between the preset materials and the sound velocity may be queried according to the actual material determined by the X-ray fluorescence detection result, so as to determine an actual sound velocity corresponding to the actual material.

Step S20, if the actual material is matched with a preset target material and the actual thickness is matched with a preset target thickness, determining target process parameters of the laser cutting according to the actual thickness and the actual material;

in this embodiment, it should be noted that the process parameters refer to process parameters required to be determined for performing laser cutting, and include a focal length, a laser nozzle model, an auxiliary gas type, a laser moving speed, a laser power, a laser moving path, and the like, and after the process parameters are input into the laser cutting device, the laser cutting device can automatically adjust and process according to the process parameters.

Specifically, whether the actual material is matched with a preset target material or not and whether the actual thickness is matched with a preset target thickness or not are judged, wherein whether the actual thickness is matched with the preset target thickness or not means that the actual thickness is the same as the preset target thickness or the difference value between the actual thickness and the preset target thickness is within a preset error value range.

If the actual material quality is determined not to be matched with the preset target material quality and/or the actual thickness is determined not to be matched with the preset target thickness, the process of the laser cutting method can be stopped, prompt information can be output to remind relevant personnel of timely processing, and the prompt information can further comprise the detected actual material quality and actual thickness related information to enable the relevant personnel to confirm whether the detection error exists or not and timely process the detection error.

And if the actual material is matched with a preset target material and the actual thickness is matched with a preset target thickness, determining the target process parameters of the laser cutting according to the actual thickness and the actual material. The method for determining the target process parameters of the laser cutting according to the actual thickness and the actual material can be that the actual thickness and the actual material are input into a preset prediction model for prediction to obtain the process parameters of the laser cutting.

In this embodiment, it should be noted that the database stores process parameters of metal materials with different materials and different thicknesses, which may be set in advance according to big data or historical debugging results, and the focal length, the laser nozzle model, and the type of the auxiliary gas required for laser cutting may be determined according to the actual thickness and the actual material, where the type of the auxiliary gas includes air, nitrogen, oxygen, and the like, and the diameters and shapes of the laser nozzles with different models may be different, and when laser cutting is actually performed, other process parameters required for laser cutting may also be determined in other manners, for example, process parameters manually input by a user are obtained, which is not limited in this embodiment.

Specifically, searching is carried out in a preset database according to a mapping relation between a preset material and thickness and process parameters, and target process parameters matched with the actual thickness and the actual material are determined from the process parameters of the preset database, wherein the target process parameters comprise a target focal length, a target laser nozzle model and a target auxiliary gas.

And S30, carrying out laser cutting on the plate to be cut according to the target process parameters.

In this embodiment, specifically, the laser cutting device is adjusted according to the target process parameter, so that the laser cutting device performs laser cutting on the plate to be cut based on the target process parameter.

In one implementation, the target process parameter includes a target focal length, and the step of adjusting the laser cutting apparatus according to the target process parameter includes: and focusing based on the target focal length through an automatic focusing unit on the laser cutting device.

In one possible implementation, the target process parameter includes a target laser nozzle model, and the step of adjusting the laser cutting apparatus according to the target process parameter includes: and determining the target nozzle position of the target laser nozzle in a preset nozzle placing area according to the model of the target laser nozzle, moving the cutting head of the laser cutting device to the target nozzle position, and installing the target nozzle to a laser nozzle installation position arranged on the cutting head in a mechanical arm, pressure or movement mode and the like. In a real-time manner, before the step of moving the cutting head of the laser cutting device to the target nozzle position, if it is detected that the laser nozzle is installed on the laser nozzle installation position, determining a vacant nozzle position of the installed laser nozzle in a preset nozzle placement area, moving the cutting head of the laser cutting device to the vacant nozzle position, and detaching the installed laser nozzle from the laser nozzle installation position and placing the laser nozzle to the vacant nozzle position by means of a manipulator, pulling force, movement or the like.

In one possible implementation, the target process parameter includes a target assist gas, and the step of adjusting the laser cutting apparatus according to the target process parameter includes: and switching the connection mode of a gas pipeline in the laser cutting device according to the target auxiliary gas so as to connect the storage device of the target auxiliary gas with the auxiliary gas injection pipeline.

In the embodiment, the actual thickness and the actual material of the plate to be cut are detected, so that the actual thickness and the actual material of the plate to be cut are accurately determined before laser cutting is performed, the target process parameters of the laser cutting are determined according to the actual thickness and the actual material if the actual material is determined to be matched with the preset target material and the actual thickness is matched with the preset target thickness, the laser cutting is performed on the plate to be cut according to the target process parameters, the confirmation that whether the actual material and the actual thickness of the plate to be cut meet the expected requirements or not is realized, the actual material is matched with the preset target material and the actual thickness is matched with the preset target thickness, and the corresponding process parameters are further automatically matched when the actual thickness is matched with the preset target thickness, and the plate to be cut is subjected to laser cutting. Compare in the mode of manual observation and manual debugging, on the one hand, this application is through the automated inspection and the affirmation of actual thickness and actual material, can effectively reduce the error that artifical judgement produced, avoided because artifical judgement mistake leads to waiting to cut panel itself and choose for use the mistake, and then the condition of the whole batch reprocessing that leads to, on the other hand, after the technological parameter that corresponds is automatic to be matchd according to actual thickness and actual material, can directly carry out laser cutting processing, effectively practiced thrift and carried out the step and the time of technological parameter debugging many times repeatedly, the longer technical problem of technological parameter debugging time of prior art laser cutting has been overcome.

Further, an embodiment of the present invention provides an electronic device, where the electronic device includes: at least one processor; and a memory communicatively coupled to the at least one processor; the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the laser cutting method in the above embodiments.

Referring now to FIG. 3, shown is a schematic diagram of an electronic device suitable for use in implementing embodiments of the present disclosure. The electronic devices in the embodiments of the present disclosure may include, but are not limited to, mobile terminals such as mobile phones, notebook computers, digital broadcast receivers, PDAs (personal digital assistants), PADs (tablet computers), PMPs (portable multimedia players), in-vehicle terminals (e.g., car navigation terminals), and the like, and fixed terminals such as digital TVs, desktop computers, and the like. The electronic device shown in fig. 3 is only an example, and should not bring any limitation to the functions and the scope of use of the embodiments of the present disclosure.

As shown in fig. 3, the electronic device may include a processing apparatus (e.g., a central processing unit, a graphic processor, etc.) that may perform various appropriate actions and processes according to a program stored in a Read Only Memory (ROM) or a program loaded from a storage apparatus into a Random Access Memory (RAM). In the RAM, various programs and data necessary for the operation of the electronic apparatus are also stored. The processing device, the ROM, and the RAM are connected to each other by a bus. An input/output (I/O) interface is also connected to the bus.

Generally, the following systems may be connected to the I/O interface: input devices including, for example, touch screens, touch pads, keyboards, mice, image sensors, microphones, accelerometers, gyroscopes, and the like; output devices including, for example, liquid Crystal Displays (LCDs), speakers, vibrators, and the like; storage devices including, for example, magnetic tape, hard disk, etc.; and a communication device. The communication means may allow the electronic device to communicate wirelessly or by wire with other devices to exchange data. While the figures illustrate an electronic device with various systems, it is understood that implementing or having all of the illustrated systems is not a requirement. More or fewer systems may alternatively be implemented or provided.

In particular, according to an embodiment of the present disclosure, the processes described above with reference to the flowcharts may be implemented as computer software programs. For example, embodiments of the present disclosure include a computer program product comprising a computer program embodied on a computer-readable medium, the computer program comprising program code for performing the method illustrated by the flow chart. In such an embodiment, the computer program may be downloaded and installed from a network via the communication means, or installed from a storage means, or installed from a ROM. The computer program, when executed by a processing device, performs the functions defined in the methods of the embodiments of the present disclosure.

The electronic equipment provided by the invention adopts the laser cutting method in the embodiment, and solves the technical problem that the debugging time of the process parameters of laser cutting in the prior art is longer. Compared with the prior art, the beneficial effects of the electronic device provided by the embodiment of the invention are the same as the beneficial effects of the laser cutting method provided by the embodiment, and other technical features of the electronic device are the same as those disclosed by the embodiment method, which are not repeated herein.

It should be understood that portions of the present disclosure may be implemented in hardware, software, firmware, or a combination thereof. In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Further, referring to fig. 4, the present invention also provides a laser cutting system comprising the laser cutting device 20, the sheet material detection device 10 and the electronic device 50 as described above, wherein,

the plate detection device 10 is used for detecting the actual thickness and the actual material quality of a plate to be cut;

the laser cutting device 20 is configured to perform laser cutting on the plate to be cut.

In this embodiment, the laser cutting system at least includes a laser cutting device 20, a plate detecting device 10 and an electronic device 50, the laser cutting device 20 and the plate detecting device 10 are respectively in communication connection with the electronic device 50, the communication connection manner includes wireless communication connection or wired communication connection, and in an implementable manner, the laser cutting device 20 and the plate detecting device 10 are respectively in optical fiber connection with the electronic device 50 for data transmission. The plate detection device 10 is used for detecting the actual thickness and the actual material of a plate to be cut, the plate detection device 10 at least comprises a detection probe, the detection probe at least comprises a thickness detection module and a material detection module, the thickness detection module can be an ultrasonic detection module, a laser detection module, an X-ray detection module and the like, the material detection module can be an X-ray fluorescence detection module and the like, and the detection device can further comprise a capacitance sensor, the capacitance sensor is arranged on the detection probe and used for detecting the distance between the detection probe and the plate to be detected; the laser cutting device 20 is used for performing laser cutting on the plate to be cut and at least comprises a cutting head, a laser nozzle installation position is arranged on the cutting head, laser nozzles of different models can be installed or detached according to actual needs, and the laser nozzles are used for emitting laser to cut the plate to be cut.

Optionally, the plate detecting device 10 includes a detecting probe and a capacitive sensor, where the detecting probe includes an ultrasonic detecting module and an X-ray fluorescence detecting module;

the ultrasonic detection module is used for detecting the actual thickness of the plate to be cut;

the capacitive sensor is arranged on the detection probe of the plate detection device 10 and used for detecting the distance between the detection probe and the plate to be detected.

The application provides a laser cutting system has solved the longer technical problem of technological parameter debug time of prior art laser cutting. Compared with the prior art, the beneficial effects of the laser cutting equipment provided by the embodiment of the invention are the same as those of the laser cutting method provided by the embodiment, and the details are not repeated herein.

Further, the present embodiment provides a computer-readable storage medium having computer-readable program instructions stored thereon for performing the laser cutting method in the above-described embodiments.

The computer readable storage medium provided by the embodiments of the present invention may be, for example, a USB flash disk, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, or device, or any combination thereof. More specific examples of the computer readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the present embodiment, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, or device. Program code embodied on a computer readable storage medium may be transmitted using any appropriate medium, including but not limited to: electrical wires, optical cables, RF (radio frequency), etc., or any suitable combination of the foregoing.

The computer-readable storage medium may be embodied in an electronic device; or may be present alone without being incorporated into the electronic device.

The computer-readable storage medium carries one or more programs which, when executed by an electronic device, cause the electronic device to: detecting the actual material and the actual thickness of the plate to be cut; if the actual material is matched with a preset target material and the actual thickness is matched with a preset target thickness, determining target process parameters of the laser cutting according to the actual thickness and the actual material; and carrying out laser cutting on the plate to be cut according to the target process parameters.

Computer program code for carrying out operations for aspects of the present disclosure may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, smalltalk, C + +, and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet service provider).

The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

The modules described in the embodiments of the present disclosure may be implemented by software or hardware. Wherein the names of the modules do not in some cases constitute a limitation of the unit itself.

The computer-readable storage medium provided by the invention stores the computer-readable program instruction for executing the laser cutting method, and solves the technical problem that the debugging time of the process parameters of the laser cutting in the prior art is long. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided by the embodiment of the invention are the same as those of the laser cutting method provided by the embodiment, and are not repeated herein.

Further, the present application also provides a computer program product comprising a computer program which, when being executed by a processor, realizes the steps of the laser cutting method as described above.

The computer program product solves the technical problem that the debugging time of the process parameters of laser cutting in the prior art is long. Compared with the prior art, the beneficial effects of the computer program product provided by the embodiment of the invention are the same as those of the laser cutting method provided by the embodiment, and are not repeated herein.

The above description is only a preferred embodiment of the present application, and not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are included in the scope of the present application.

Claims

1. A laser cutting method, characterized by comprising the steps of:

detecting the actual material and the actual thickness of the plate to be cut;

2. The laser cutting method of claim 1, wherein the step of detecting the actual material and actual thickness of the sheet material to be cut comprises:

3. The laser cutting method according to claim 2, wherein the step of generating the X-ray fluorescence detection result and the ultrasonic detection result by emitting the X-ray fluorescence and the ultrasonic waves to the sheet material to be cut by the detection probe of the sheet material detection apparatus further comprises:

4. The laser cutting method according to claim 3, wherein the step of moving a detection probe of the sheet material detection apparatus to a position where a detection window of the detection probe is attached to the sheet material to be cut comprises:

5. The laser cutting method of claim 4, wherein the detection probe and the cutting head of the laser cutting device are disposed on a movable backboard, and the detection probe is slidably connected with the movable backboard;

when the second current capacitance is detected to be reduced to 0, stopping moving the movable back plate;

moving the movable back plate to a direction far away from the plate to be cut by a preset distance;

6. The laser cutting method of claim 1, wherein the step of determining the target process parameters of the current laser cutting according to the actual thickness and the actual material quality comprises:

7. An electronic device, characterized in that the electronic device comprises:

at least one processor; and (c) a second step of,

a memory communicatively coupled to the at least one processor; wherein,

the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the steps of the laser cutting method of any one of claims 1 to 6.

8. A laser cutting system comprising a laser cutting device, a sheet material detection device, and the electronic apparatus of claim 7,

the plate detection device is used for detecting the actual thickness and the actual material of the plate to be cut;

and the laser cutting device is used for carrying out laser cutting on the plate to be cut.

9. The laser cutting system of claim 8, wherein the sheet material detection device comprises a detection probe and a capacitive sensor, the detection probe comprising an ultrasonic detection module and an X-ray fluorescence detection module;

the X-ray fluorescence detection module is used for detecting the actual material quality of the plate to be cut;

the capacitive sensor is arranged on a detection probe of the plate detection device and is used for detecting the distance between the detection probe and the plate to be detected.

10. A storage medium, characterized in that the storage medium is a computer-readable storage medium having stored thereon a program for implementing a laser cutting method, the program being executed by a processor to implement the steps of the laser cutting method according to any one of claims 1 to 6.