CN115728322A - Mechanism for detecting position of silicon wafer on ceramic disc - Google Patents

Mechanism for detecting position of silicon wafer on ceramic disc Download PDF

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Publication number
CN115728322A
CN115728322A CN202211301790.8A CN202211301790A CN115728322A CN 115728322 A CN115728322 A CN 115728322A CN 202211301790 A CN202211301790 A CN 202211301790A CN 115728322 A CN115728322 A CN 115728322A
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China
Prior art keywords
camera
visual
detection frame
controller
support
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Pending
Application number
CN202211301790.8A
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Chinese (zh)
Inventor
白苏宁
黄盛军
菅明辉
曹锦伟
李仕权
王彦君
孙晨光
贠照新
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Zhonghuan Advanced Semiconductor Materials Co Ltd
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Zhonghuan Advanced Semiconductor Materials Co Ltd
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Priority to CN202211301790.8A priority Critical patent/CN115728322A/en
Publication of CN115728322A publication Critical patent/CN115728322A/en
Pending legal-status Critical Current

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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a mechanism for detecting the position of a silicon wafer on a ceramic disc, which comprises a detection frame, wherein an installation base is arranged on the surface of one side of the detection frame, an installation support is arranged on one side of the installation base, a round rod is sleeved on the surface of the installation support, a camera non-standard support is arranged on one side of the round rod, a camera is arranged on the camera non-standard support, a visual controller is arranged on the surface of one side of the detection frame, and a visual display is arranged on the surface of the detection frame on one side of the camera. This a mechanism for detecting silicon chip position on ceramic dish can know the quantity and the type of the current dish silicon chip of pasting through PLC, takes into the picture under the different situation in advance as the contrast picture in the vision controller, calls the picture that will contrast according to the condition when pasting through vision at every turn, if there is the lamination and wafts the piece then reports to the police and reminds the staff to handle, when the incomplete piece appears, the lamination, when wafing the piece scheduling problem, in time report to the police, reminds the staff to handle, has improved the production yield.

Description

Mechanism for detecting position of silicon wafer on ceramic disc
Technical Field
The invention relates to the technical field of silicon wafer detection, in particular to a mechanism for detecting the position of a silicon wafer on a ceramic disc.
Background
16 ten thousand transistors can be integrated on a silicon wafer with large grains of rice, which is another milestone of scientific and technical progress, the silicon element with the content of 25.8 percent in the crust provides an inexhaustible source for the production of monocrystalline silicon, and as the silicon element is one of the most abundant elements in the crust, for the products of solar cells which are destined to enter large-scale markets, the reserve is also one of the reasons that the silicon becomes the main material of photovoltaic, and after the production and processing of the silicon wafer are finished, the silicon wafer needs to be processed and processed through a chip mounting table.
At present, a normal chip mounting table does not have a detection device, when the lamination or the chip floating and other problems occur, equipment cannot be alarmed and stopped, the equipment is seen by gas operation completely, a ceramic disc with the problems can cause the whole vehicle to turn over when being polished, the economic loss is caused, the yield is influenced, and the equipment can be damaged irreversibly.
Disclosure of Invention
The invention aims to provide a mechanism for detecting the position of a silicon wafer on a ceramic disc, and aims to solve the problems that the conventional normal chip mounting table in the background art has no detection device, equipment cannot be alarmed and stopped after lamination or chip floating and other problems occur, the equipment is completely seen by gas, the ceramic disc with the problems can cause the whole vehicle to turn over during polishing, economic loss is caused, the yield is influenced, and irreversible damage can be caused to the equipment.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a mechanism for detecting silicon chip position on ceramic dish, includes the test jig, a side surface of test jig is provided with the installation base, one side of installation base is provided with erection support, erection support's surface cover is provided with the round bar, one side of round bar is provided with the nonstandard support of camera, be provided with the camera on the nonstandard support of camera, a side surface of test jig is provided with visual control ware, the test jig surface of camera one side is provided with visual display, the below of test jig is provided with the pressure head, the below of pressure head is provided with ceramic dish.
Preferably, one side of ceramic dish is provided with places the seat, and the surface of installation base is all arranged in the matrix and has been seted up the locating hole.
Preferably, the visual controller is electrically connected with the visual display through an Ethernet cable, and the visual controller is electrically connected with the camera through a sensor cable.
Preferably, the bottom side surface of the visual controller and the visual display is provided with a control line, and the round bar is made of stainless steel.
Preferably, the input ends of the visual controller, the visual display and the camera are electrically connected with the output end of the external power supply through wires.
Compared with the prior art, the invention has the beneficial effects that:
this a mechanism for detecting silicon chip position on ceramic dish, in-process carrying out daily use, can know the quantity and the type of the silicon chip that current dish pasted through PLC, take into the picture under the different situation in advance in the vision controller as the contrast picture, through the picture that the vision calls the picture that will contrast according to the condition at every turn when paster, warning staff's processing if there is the lamination that wafts, when the incomplete piece appears, the lamination, when wafing the piece scheduling problem, in time report to the police, remind staff's processing, the production yield has been improved, the emergence of production fault has been reduced, the ceramic dish of avoiding the existence problem simultaneously can lead to whole car turnover when the polishing, avoid causing economic loss to influence output simultaneously, also avoid probably causing irreversible damage to equipment.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is an electrical connection diagram of the apparatus device of the present invention;
fig. 3 is an exploded view of the camera mounting structure of the present invention.
In the figure: 1. a visual display; 2. a detection frame; 3. a pressure head; 4. a placing seat; 5. a ceramic pan; 6. a round bar; 7. a vision controller; 8. installing a base; 9. a camera; 10. a control line; 11. an Ethernet cable; 12. a sensor cable; 13. mounting a support; 14. a camera non-standard support; 15. and (7) positioning the holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a mechanism for detecting silicon chip position on ceramic dish, including test rack 2, a side surface of test rack 2 is provided with installation base 8, one side of installation base 8 is provided with erection support 13, erection support 13's surface cover is provided with round bar 6, one side of round bar 6 is provided with camera nonstandard support 14, can install and fix camera 9 in real time, conveniently carry out angle and the real-time regulation of height and support simultaneously, be provided with camera 9 on the camera nonstandard support 14, a side surface of test rack 2 is provided with visual controller 7, test rack 2 surface of camera 9 one side is provided with visual display 1, contrast photo that needs is shot through camera 9 is preserved, connect into PLC controller through visual controller 7IO line, contrast picture when shooing through PLC control, and accept the signal whether feedback contrast passes through, the below of test rack 2 is provided with 3, can compress tightly the silicon chip in real time and fix, avoid taking place to rock the skew in the testing process, the below of pressure head 3 is provided with ceramic dish 5, one side of ceramic dish 5 is provided with places seat 4, can carry out the support fixed and convenient the silicon chip that the removal is fixed, it can all set up the convenient to carry out the detection and the camera to take place the fixed mounting process and is not hard up the camera 15 and is arranged, it all to take place the camera to take place the fixed, it all to take place the drift to make things convenient to take place to detect the installation, the camera 15 to arrange.
Carry out electric connection through ethernet cable 11 between visual control unit 7 and the visual display 1, and pass through sensor cable 12 electric connection between visual control unit 7 and the camera 9, can conveniently carry out the real-time signal conversion and the transmission of picture, conveniently carry out automated processing and analysis contrast to the picture, visual control unit 7 and visual display 1's bottom side surface all is provided with control line 10, can conveniently carry out the real-time connection and the signal transmission of other equipment devices, and the material that pole 6 adopted is stainless steel, the corrosion resisting property of multiplicable pole 6, the effectual life who prolongs pole 6, visual control unit 7, the input of visual display unit 1 and camera 9 all passes through wire and external power supply's output electric connection, can be for controller 7, visual display unit 1 and camera 9 operation provide independent and sufficient electric power energy, avoid controller 7, visual display unit 1 and camera 9 operation process electric quantity is not enough influences detection progress and efficiency.
The working principle is as follows: when silicon chip detection work needs to be carried out, at first, the camera 9 position can be preliminarily fixed, adjust the camera 9 to reasonable height and angle, and connect the camera 9 to the visual controller 7, connect the visual display 1 to the visual controller 7, then start the trial run, adjust the angle of the visual camera 9 after looking over the eye environment, height and shooting brightness, the discernment degree of shooting the picture can be clear, in the normal paster process of equipment, the contrast picture that needs is shot through the camera 9 is preserved, access to the PLC controller through the 7IO line of the visual controller, contrast the picture when shooting through PLC control, and accept the signal whether the feedback contrast passes through, when the problems of incomplete piece, lamination, waft piece, etc. appear, in time report to the police, remind staff to handle.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides a mechanism for detecting silicon chip position on ceramic dish, includes testing stand (2), its characterized in that: one side surface of detection frame (2) is provided with installation base (8), one side of installation base (8) is provided with erection support (13), the surface cover of erection support (13) is provided with round bar (6), one side of round bar (6) is provided with camera nonstandard support (14), be provided with camera (9) on camera nonstandard support (14), a side surface of detection frame (2) is provided with visual control ware (7), detection frame (2) surface of camera (9) one side is provided with visual display (1), the below of detection frame (2) is provided with pressure head (3), the below of pressure head (3) is provided with ceramic dish (5).
2. The mechanism of claim 1, wherein the mechanism comprises: one side of ceramic dish (5) is provided with places seat (4), and the surface of installation base (8) all arranges in the matrix and has seted up locating hole (15).
3. The mechanism of claim 1, wherein the mechanism comprises: the visual controller (7) is electrically connected with the visual display (1) through an Ethernet cable (11), and the visual controller (7) is electrically connected with the camera (9) through a sensor cable (12).
4. The mechanism of claim 1, wherein the mechanism comprises: the visual display device is characterized in that control lines (10) are arranged on the surfaces of one side of the bottom of the visual controller (7) and one side of the bottom of the visual display device (1), and the round rod (6) is made of stainless steel.
5. The mechanism of claim 1, wherein the mechanism comprises: the input ends of the vision controller (7), the vision display (1) and the camera (9) are electrically connected with the output end of the external power supply through wires.
CN202211301790.8A 2022-10-24 2022-10-24 Mechanism for detecting position of silicon wafer on ceramic disc Pending CN115728322A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211301790.8A CN115728322A (en) 2022-10-24 2022-10-24 Mechanism for detecting position of silicon wafer on ceramic disc

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211301790.8A CN115728322A (en) 2022-10-24 2022-10-24 Mechanism for detecting position of silicon wafer on ceramic disc

Publications (1)

Publication Number Publication Date
CN115728322A true CN115728322A (en) 2023-03-03

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116448027A (en) * 2023-06-16 2023-07-18 浙江晶盛机电股份有限公司 Wafer measurement system and wafer measurement method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116448027A (en) * 2023-06-16 2023-07-18 浙江晶盛机电股份有限公司 Wafer measurement system and wafer measurement method
CN116448027B (en) * 2023-06-16 2023-10-13 浙江晶盛机电股份有限公司 Wafer measurement system and wafer measurement method

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