CN115696743A - Structure for improving assembling reliability of connector and electronic equipment - Google Patents

Abstract

The invention provides a structure for improving the assembling reliability of a connector and electronic equipment, wherein the structure for improving the assembling reliability of the connector comprises: the surface mounting device comprises a surface mounting device, a printed circuit board, a second bonding pad and a soldering tin layer; the lower surface of the surface mounting device is provided with a welding pin; the upper surface of the printed circuit board is provided with a first bonding pad, the first bonding pad is arranged corresponding to the welding pins, and the first bonding pad is provided with a first through hole; the second bonding pad is arranged on the upper surface of the first bonding pad, and the size of the second bonding pad is smaller than that of the first bonding pad; the second pad is provided with a second through hole which is communicated with the first through hole; the soldering tin layers are distributed between the welding pins and the first bonding pads, between the welding pins and the second bonding pads and inside the first through holes and the second through holes. According to the invention, the through holes are drilled on the first bonding pad and the second bonding pad, so that the contact area with the soldering tin layer is increased, the connection force is improved, the phenomenon of electrical short circuit caused by interconnection of solder paste is reduced, and the overall reliability of the connector is improved.

Description

Structure for improving assembling reliability of connector and electronic equipment

Technical Field

The invention relates to the technical field of connectors, in particular to a structure for improving the assembling reliability of a connector and electronic equipment.

Background

With the promotion and upgrade of the intel's Stream Platform, the transmission requirements of the fourth generation of the PCIE GEN4, which is a high-speed serial computer expansion bus standard (PCIE) connector, have evolved to the PCIE GEN5, so as to meet the requirements of the overall internet technology market. To meet this technical requirement, the board signal integrity is also oriented to higher level adjustment.

In order to improve the signal performance of the whole board card and meet the requirement of the pushed PCIE GEN5, a via penetration effect is generated when a conventional DIP (Dual inline Package) connector is used, so that the signal integrity is affected. However, although the SMD package connector is selected to improve the signal integrity, the SMD type connector uses the printed circuit board and the first metal pad on the connector, and is connected after soldering with solder paste, which is likely to cause reliability risks such as electrical short circuit due to solder paste interconnection compared with the conventional DIP package connector.

Therefore, it is necessary to provide a structure for improving the assembling reliability of the connector in view of the above-mentioned drawbacks of the prior art.

Disclosure of Invention

The invention provides a structure for improving the assembling reliability of a connector and electronic equipment, which are used for solving the problem of poor reliability of an SMD (surface mounted device) packaging connector in the prior art.

The invention provides a structure for improving the assembling reliability of a connector, which comprises: the surface mounting device comprises a surface mounting device, a printed circuit board, a second bonding pad and a soldering tin layer; the lower surface of the surface mounting device is provided with a welding pin; the upper surface of the printed circuit board is provided with a first bonding pad, the first bonding pad is arranged corresponding to the welding pins, and the first bonding pad is provided with a first through hole; the second bonding pad is arranged on the upper surface of the first bonding pad, and the size of the second bonding pad is smaller than that of the first bonding pad; the second bonding pad is provided with a second through hole which is communicated with the first through hole; the soldering tin layers are distributed between the welding pins and the first bonding pads, between the welding pins and the second bonding pads and inside the first through holes and the second through holes.

According to the structure for improving the assembling reliability of the connector, the printed circuit board is provided with a third through hole, and the third through hole is communicated with the second through hole and the first through hole; the soldering tin layer is distributed on a part of the third through hole, and the other part of the third through hole is used for arranging electronic components.

According to the structure for improving the assembling reliability of the connector provided by the present invention, the third through hole, the second through hole, or the first through hole is partially sealed.

According to the structure for improving the assembling reliability of the connector provided by the invention, the third through hole, the second through hole or the first through hole is partially plugged by electroplating and hole filling processing.

According to the structure for improving the assembling reliability of the connector provided by the invention, the inner walls of the second through hole, the first through hole and the third through hole are smoothly connected.

According to the structure for improving the assembling reliability of the connector provided by the invention, the inner walls of the second through hole, the first through hole and the third through hole are connected in a staggered manner.

According to the structure for improving the assembling reliability of the connector, provided by the invention, the printed circuit boards comprise a plurality of printed circuit boards which are sequentially stacked; the third through holes of the printed circuit boards are communicated; the third through holes of the printed circuit boards are communicated with the second through holes and the first through holes.

According to the structure for improving the assembling reliability of the connector, the first through hole, the second through hole and the third through hole are formed by laser drilling.

According to the structure for improving the assembling reliability of the connector, provided by the invention, the second bonding pad is arranged at the center of the first bonding pad.

According to the structure for improving the assembling reliability of the connector, the second bonding pad and the first bonding pad are the same in shape.

According to the structure for improving the assembling reliability of the connector, the first bonding pad and the second bonding pad are made of metal materials, and tin plating layers are arranged on the outer sides of the first bonding pad and the second bonding pad.

The present invention also provides an electronic device comprising: the structure for improving the assembling reliability of the connector according to any one of the above.

According to the structure for improving the assembling reliability of the connector and the electronic equipment, on the first aspect, the second bonding pad is arranged on the first bonding pad, so that the contact area between the soldering tin layer and the welding pins is increased, the contact area between the soldering tin paste and the second bonding pad is increased, the contact surfaces between the soldering tin paste and the second bonding pad and between the soldering tin paste and the first bonding pad are increased, and the connecting force between the opposite surface mounting device and the second bonding pad is greatly improved; in the second aspect, the second through hole is formed in the second bonding pad, the first bonding pad is provided with the first through hole, the second through hole is communicated with the first through hole, solder paste flows into the second through hole and the first through hole, and the inner walls of the second through hole and the first through hole are in contact with the solder paste layer, so that the contact area of the solder paste layer with the second bonding pad and the first bonding pad is further increased, the connection force is improved, and the overall reliability of the connector is improved; in a third aspect, after the surface mount device is placed on the printed circuit board, the excess solder paste flows into the second through hole, the first through hole and the third through hole along the inner walls of the second through hole, the first through hole and the third through hole, so that the transverse deformation of a solder paste layer is reduced, and the electrical short circuit phenomenon caused by interconnection of the solder pastes is reduced; in the fourth aspect, the third through hole is drilled in the printed circuit board, so that the electronic components of the printed circuit board can be arranged on the outer surface of the printed circuit board and in the third through hole of the printed circuit board, and the flexibility of the layout of the printed circuit board is improved.

Drawings

In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.

FIG. 1 is one of the structural schematic diagrams of a lifting connector assembly of the related art;

FIG. 2 is a second schematic structural view of a lifting connector assembly according to the related art;

FIG. 3 is a third schematic view of a lifting connector assembly according to the related art;

FIG. 4 is one of the schematic diagrams of structures for improving the reliability of connector assembly provided by some embodiments of the present invention;

FIG. 5 is a second schematic diagram of a structure for improving the reliability of the connector assembly according to some embodiments of the present invention;

FIG. 6 is a third schematic view of a structure for improving the assembling reliability of the connector according to some embodiments of the present invention;

FIG. 7 is a fourth schematic view of a structure for improving the reliability of the connector assembly according to some embodiments of the invention;

FIG. 8 is a fourth schematic view of a lifting connector assembly of the related art;

fig. 9 is a fifth schematic view of a structure for improving the assembling reliability of the connector according to some embodiments of the invention.

Reference numerals are as follows:

110: surface mounting a device; 111: welding pins; 120: a printed circuit board; 121: a first pad; 122: a second pad; 130: a solder layer; 140: an electronic component.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present invention, it should be noted that the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection, unless explicitly stated or limited otherwise; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. Specific meanings of the above terms in the embodiments of the present invention may be understood as specific cases by those of ordinary skill in the art.

In embodiments of the invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

In the related art, as shown in fig. 1 to 3 and 8, the second pad 122 is disposed on the first pad 121, so that the contact area between the solder layer 130 and the solder pin 111 is increased, solder cracking caused by the stress of assembly and unplugging is avoided to a certain extent, and the overall reliability of the connector is improved.

However, since the second bonding pad 122 is added, the area of the solder paste with the first bonding pad 121 and the second bonding pad 122 is increased, and the usage amount of the opposite solder paste is also increased, on the premise that the sizes of the first bonding pad 121 and the second bonding pad 122 are not changed, after the surface mount device 110 is placed on the printed circuit board 120, the solder paste is extruded and deformed and elongated in the transverse direction, and the phenomenon of solder paste interconnection is easily caused, which causes an electrical short circuit.

In view of the above-mentioned drawbacks of the prior art, the present invention provides a structure and an electronic device for improving the reliability of connector assembly.

The structure and the electronic device for improving the assembling reliability of the connector according to the present invention will be described with reference to fig. 4 to 7 and fig. 9.

As shown in fig. 4 and 5, the structure for improving the assembling reliability of the connector provided by the present invention includes a surface mount device 110, a printed circuit board 120, a second pad 122, and a solder layer 130; the lower surface of the surface mount device 110 is provided with a welding pin 111; the upper surface of the printed circuit board 120 is provided with a first bonding pad 121, the first bonding pad 121 is arranged corresponding to the welding pin 111, and the first bonding pad 121 is provided with a first through hole; the second bonding pad 122 is arranged on the side surface of the first bonding pad 121 facing the welding pin 111, and the size of the second bonding pad 122 is smaller than that of the first bonding pad 121; the second pad 122 is provided with a second through hole which is communicated with the first through hole; the solder layers 130 are distributed between the solder pins 111 and the first pads 121, between the solder pins 111 and the second pads 122, and inside the first through holes and the second through holes.

According to the structure for improving the assembling reliability of the connector, on one hand, the second bonding pad 122 is arranged on the first bonding pad 121, so that the contact area between the soldering tin layer 130 and the soldering pins 111 is increased, the contact area between the soldering tin and the second bonding pad 122 is increased, the contact surfaces between the soldering tin and the second bonding pad 122 and the contact surfaces between the soldering tin and the first bonding pad 121 are increased, and the connecting force between the surface mount device 110 and the second bonding pad 122 is greatly improved; on the other hand, through be equipped with the second through-hole on second pad 122, first pad 121 is equipped with first through-hole, the second through-hole is linked together with first through-hole, the tin cream flows into in first through-hole and the second through-hole, the inner wall and the tin cream contact of first through-hole and second through-hole, further increase tin cream layer and second pad 122, the area of contact of first pad 121, improve the connection strength, promote the whole reliability of connector, and simultaneously, after surface mounting device 110 placed printed circuit board 120 on, unnecessary tin cream flows into in second through-hole and first through-hole along the inner wall of second through-hole and first through-hole, reduce the lateral deformation on tin cream layer, reduce the electrical property short circuit phenomenon that the tin cream interconnection leads to.

In the process of mounting the surface mount device 110 and the printed circuit board 120, solder paste printing, mounting and soldering are key steps, which determine the quality of the connector.

The Surface mount device 110 is called Surface Mounted Devices in english and called Surface Mounted Devices in chinese for placing some simple pin elements.

The surface mount device 110 mainly includes a rectangular chip component, a cylindrical chip component, a composite chip component, and a special chip component.

The process steps for producing surface mount devices include standard wafer fabrication, wafer re-passivation, deposition of eutectic solder bumps on I/O pads, backgrinding (for thin products only), protective encapsulation coating, testing with a wafer selection platform, laser marking, and packaging in tape and reel format, and finally assembly on printed circuit board 120 using standard Surface Mount Technology (SMT).

A surface mount device is a Wafer Level Chip Scale Package (WLCSP) that has the following characteristics: the package size is consistent with the die size, no interposer is required between the chip and the printed circuit board 120, etc.

The soldering pin 111 is also called a soldering pin, the soldering pin 111 leads out a wiring from an internal circuit of an integrated circuit (chip) to a peripheral circuit, and a section of the tail end of the wiring is soldered to form a solder joint with a pad on the printed circuit board 120.

The solder pins 111 are distributed on the lower surface of the surface mount device 110 facing the printed circuit board 120.

The number and arrangement positions of the solder pins 111 can be set according to actual conditions.

For example, along the extending direction of the surface mount device 110, a plurality of soldering pins 111 are provided, and the plurality of soldering pins 111 are symmetrically distributed on two sides of the center line of the surface mount device 110 along the center line of the surface mount device 110.

For example, the plurality of soldering pins 111 are provided, and the plurality of soldering pins 111 are distributed along the extending direction of the surface mount device 110 according to the wiring requirement of the internal circuit of the integrated circuit (chip).

The printed circuit board 120 is a provider of electrical connections for the electronic components 140.

The printed circuit board 120 may be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board, and other multi-layer boards according to the number of layers of the circuit board.

On a single panel, parts are concentrated on one surface, wires are concentrated on the other surface, the cloth mode is rigid, and the cloth space is limited.

On the double-sided board, wiring is provided on both sides.

More single or double sided wiring boards are used for multilayer boards, increasing the area over which wiring can be routed.

The printed circuit board 120 is mainly designed as a layout; the main advantage of using a printed circuit board 120 is that wiring and assembly errors are greatly reduced, increasing the level of automation and production labor.

The printed circuit board 120 is provided with first pads 121 on an upper surface facing the surface mount device 110, and the number and the positions of the first pads 121 correspond to those of the solder pins 111.

The first pads 121 are basic constituent units of a surface mount device, and are used to form a pattern of the first pads 121 of the printed circuit board 120, i.e., various combinations of the first pads 121 designed for specific component types.

As shown in fig. 4, the second pads 122 are disposed on the upper surface of the first pads 121 facing the bonding pins 111, and the upper surface of the second pads 122 faces the lower surface of the bonding pins 111.

It can be understood that, as shown in fig. 4, the size of the second pad 122 is smaller than that of the first pad 121, and after the second pad 122 is placed on the upper surface of the first pad 121, the first pad 121 and the second pad 122 form a gradient, and compared with an assembly structure with only the first pad 121, the contact area of the solder layer 130 and the first pad 121 and the second pad 122 increases the lateral area of the second pad 122, so as to improve the connection strength of the connector as a whole, and avoid solder cracking caused by the stress of assembly and unplugging.

As shown in fig. 5, the second pad 122 has a second through hole, the first pad 121 has a first through hole, the first through hole is communicated with the second through hole, solder paste flows into the second through hole of the second pad 122 and the first through hole of the first pad 121 in sequence in a flowing state, and a solder paste layer is formed in the second through hole of the second pad 122 and the first through hole of the first pad 121 after the solder paste is solidified.

It can be understood that the second pad 122 is provided with a second through hole, the first pad 121 is provided with a first through hole, the first through hole is communicated with the second through hole, and compared with the arrangement of the gradient-shaped first pad 121 and the gradient-shaped second pad 122, the contact area between the solder layer 130 and the first pad 121 and the contact area between the solder layer 130 and the second pad 122 is increased by the inner surfaces of the first through hole and the second through hole, so that the overall connection strength of the connector is further improved, and solder cracking caused by the stress of assembly and pulling-inserting is avoided.

The solder layer 130 is a layer formed by solidifying solder paste.

The second bonding pad 122 is fixedly arranged on the upper surface of the first bonding pad 121, after the surface mount device 110 is arranged on the printed circuit board 120, a solder layer 130 is distributed between the upper surfaces of the soldering pin 111 and the second bonding pad 122, the side surface of the second bonding pad 122, the upper surfaces of the soldering pin 111 and the first bonding pad 121 which are not shielded by the second bonding pad 122, the side surface of the first bonding pad 121, the inner wall of the first through hole and the inner wall of the second through hole, and the contact area between the solder layer 130 and the first bonding pad 121 and the contact area between the solder layer 130 and the second bonding pad 122 are greatly increased, so that the overall connection strength of the connector is effectively improved, and tin cracking caused by assembling and plugging stress is avoided.

In some embodiments, as shown in fig. 4 and 5, the printed circuit board 120 is drilled with a third through hole, and the third through hole of the printed circuit board 120 is communicated with the second through hole of the second pad 122 and the first through hole of the first pad 121.

A solder layer 130 is disposed in a portion of the third through hole of the printed circuit board 120, and a portion is used for disposing an electronic component 140.

The flowing solder paste can sequentially flow into the second through-hole of the second pad 122, the first through-hole of the first pad 121, and the third through-hole of the printed circuit board 120.

It is understood that the following various effects can be produced by providing the second through-hole of the second pad 122, the first through-hole of the first pad 121, and the third through-hole of the printed circuit board 120.

In the first aspect, the excess solder paste can flow in, so as to avoid the excessive solder paste from generating a large lateral deformation when the surface mount device 110 is close to the printed circuit board 120, and avoid the problem of a short circuit caused by interconnection of the solder pastes.

In a second aspect, the increase of the third through hole of the printed circuit board 120 further increases the contact area between the solder paste layer and the to-be-welded component, thereby improving the connection strength and the overall reliability of the connector.

In the third aspect, in the case that the solder paste fills part of the third through hole of the printed circuit board 120, another part of the third through hole of the printed circuit board 120 may be used to arrange the electronic component 140 of the printed circuit board 120, and compared to the conventional method that only the electronic component 140 can be arranged on the surface of the printed circuit board 120, the arrangement of the electronic component 140 in the third through hole of the printed circuit board 120 increases the usability of arranging the electronic component 140 on the printed circuit board 120.

Further, as shown in fig. 6 and 7, the third through hole of the printed circuit board 120, the second through hole of the second land 122, or the first through hole of the first land 121 is partially closed.

In this embodiment, the third through hole, the second through hole, or the first through hole is partially sealed, so that it can be avoided that the solder paste in a flowing state flows out of the third through hole or flows into the third through hole, the second through hole, or the first through hole too much, which causes too little solder paste between the surface mount device 110 and the printed circuit board 120, and affects the connection strength.

Note that the blocking height of the third through hole of the printed circuit board 120, the second through hole of the second land 122, or the first through hole of the first land 121, that is, the drilling depth and the bore diameter size of the second through hole of the second land 122, the first through hole of the first land 121, and the third through hole of the printed circuit board 120 toward the end of the surface mount device 110 may be calculated based on the size of the first land 121, the size of the second land 122, and the volume of the solder paste recommended by the manufacturer.

In some embodiments, the blocking positions of the third through hole, the first through hole and the second through hole are determined according to the volume of the solder paste, the areas of the second pad 122 and the first pad 121.

For example, in the case where the volume of the solder paste is constant, the larger the area of the second pad 122 and the first pad 121 is, the closer the sealing position is to the upper surface of the second pad 122.

For example, in the case where the volume of the solder paste is constant, the smaller the area of the second pad 122 and the first pad 121 is, the farther the sealing position is from the upper surface of the second pad 122.

For example, in the case where the areas of the second pad 122 and the first pad 121 are constant, the larger the volume of the solder paste, the farther the sealing position is from the upper surface of the second pad 122.

For example, in the case where the areas of the second pad 122 and the first pad 121 are constant, the smaller the volume of the solder paste, the closer the sealing position is to the upper surface of the second pad 122.

As shown in fig. 7, the blocking position is located at an end of the third through hole of the printed circuit board 120 away from the upper surface of the second pad 122.

In some embodiments, the aperture sizes of the third through hole, the first through hole and the second through hole are determined according to the volume of the solder paste, the areas of the second pad 122 and the first pad 121.

For example, when the volume of the solder paste is constant, the smaller the area of the second pad 122 and the first pad 121 is, the larger the pore size of the third through-hole, the first through-hole, and the second through-hole becomes.

For example, when the volume of the solder paste is constant, the larger the areas of the second pad 122 and the first pad 121 are, the smaller the pore sizes of the third through-hole, the first through-hole, and the second through-hole are.

For example, when the areas of the second pad 122 and the first pad 121 are constant, the larger the volume of the solder paste, the larger the pore sizes of the third through-hole, the first through-hole, and the second through-hole.

For example, when the areas of the second pad 122 and the first pad 121 are constant, the pore sizes of the third through-hole, the first through-hole, and the second through-hole are smaller as the volume of the solder paste is larger.

In some embodiments, the aperture size and the blocking position of the third through hole, the first through hole and the second through hole are determined according to the volume of the solder paste, the area of the second pad 122 and the area of the first pad 121.

The aperture sizes of the third through hole, the first through hole and the second through hole are inversely proportional to the plugging position.

For example, when the volume of the solder paste and the areas of the second pad 122 and the first pad 121 are constant, the larger the aperture sizes of the third through-hole, the first through-hole, and the second through-hole, the closer the sealing position is to the upper surface of the second pad 122.

For example, when the volume of the solder paste and the areas of the second pad 122 and the first pad 121 are constant, the smaller the pore sizes of the third through-hole, the first through-hole, and the second through-hole, the farther the sealing position is from the upper surface of the second pad 122.

In some embodiments, the plugging position is located at a position in the third through hole of the printed circuit board 120, solder paste flows into the second through hole of the second pad 122, the first through hole of the first pad 121, and the third through hole of the printed circuit board 120 in sequence, and the solder layer 130 contacts with inner walls of the second pad 122, the first pad 121, and the third through hole of the printed circuit board 120, so as to increase a contact area and improve reliability of connector assembly.

Further, the process of partially plugging the third through hole of the printed circuit board 120, the second through hole of the second bonding pad 122 or the first through hole of the first bonding pad 121 may adopt a drilling plugging method known in the art.

In some embodiments, the partial plugging of the third through hole of the printed circuit board 120, the second through hole of the second pad 122 or the first through hole of the first pad 121 is performed by a plating hole filling technique.

Further, the drilling process of the third through hole of the printed circuit board 120, the second through hole of the second pad 122 or the first through hole of the first pad 121 may employ a drilling method known in the art.

In some embodiments, the third through-hole of the printed circuit board 120, the second through-hole of the second pad 122, or the first through-hole of the first pad 121 is drilled using a laser drilling technique.

The third through hole of the printed circuit board 120, the second through hole of the second pad 122, and the first through hole of the first pad 121 have at least the following two drilling methods.

First, the printed circuit board 120, the first bonding pad 121 and the second bonding pad 122 are drilled, and then the printed circuit board 120, the first bonding pad 121 and the second bonding pad 122 are placed.

In the drilling method, the printed circuit board 120, the first land 121, and the second land 122 are drilled one by one, and then the printed circuit board 120, the first land 121, and the second land 122 are fixedly placed in order after drilling, and the third through hole of the printed circuit board 120, the second through hole of the second land 122, and the first through hole of the first land 121 are communicated.

In this embodiment, the communication methods of the third through hole of the printed circuit board 120, the second through hole of the second land 122, and the first through hole of the first land 121 include the following two methods.

The central axes of the third through hole of the first and second printed circuit boards 120, the second through hole of the second bonding pad 122 and the first through hole of the first bonding pad 121 are positioned in an opposite position, the inner walls of the third through hole of the printed circuit board 120, the second through hole of the second bonding pad 122 and the first through hole of the first bonding pad 121 are smoothly connected, and the solder paste flows into the second through hole, the first through hole and the third through hole along the inner walls of the second through hole, the first through hole and the third through hole, so that the contact area between the solder paste and the printed circuit board 120, the second bonding pad 122 and the first bonding pad 121 is increased, and the connection strength is increased.

Second, the central axes of the third through hole of the printed circuit board 120, the second through hole of the second pad 122, and the first through hole of the first pad 121 are disposed in a staggered manner, the third through hole of the printed circuit board 120, the second through hole of the second pad 122, and the inner wall of the first through hole of the first pad 121 are connected in a staggered manner, and solder paste flows in along the inner wall of the second through hole of the second pad 122.

It can be understood that, because the inner walls of the third through hole of the printed circuit board 120, the second through hole of the second pad 122, and the first through hole of the first pad 121 are connected in a staggered manner, except that the inner walls of the second through hole, the first through hole, and the third through hole are exposed to the solder paste, a portion of the lower surface of the second pad 122 and a portion of the lower surface of the first pad 121 are also exposed to the solder paste, and a portion of the lower surface of the second pad 122 and a portion of the lower surface of the first pad 121 are in contact with the solder paste, the contact areas of the solder paste with the printed circuit board 120, the second pad 122, and the first pad 121 are further increased, and the connection strength is increased.

Second, the printed circuit board 120, the first pad 121 and the second pad 122 are placed, and then the printed circuit board 120, the first pad 121 and the second pad 122 are drilled.

In the drilling method, the printed circuit board 120, the first pad 121 and the second pad 122 are fixed and placed in sequence, and then the printed circuit board 120, the first pad 121 and the second pad 122 are drilled.

It can be understood that, because the positions of the printed circuit board 120, the first pad 121 and the second pad 122 are relatively fixed during drilling, the inner walls of the third through hole of the printed circuit board 120, the second through hole of the second pad 122 and the first through hole of the first pad 121 are smoothly connected after drilling, and the solder paste flows into the second through hole, the first through hole and the third through hole along the inner walls of the second through hole, the first through hole and the third through hole, so that the contact area between the solder paste and the printed circuit board 120, the second pad 122 and the first pad 121 is increased, and the connection strength is increased.

In the related art, as shown in fig. 8, the printed circuit board 120 includes a plurality of printed circuit boards 120, the plurality of printed circuit boards 120 are sequentially stacked, the electronic component 140 is disposed on an outer surface of the uppermost printed circuit board 120 closest to the surface mount device 110, and the layout space of the uppermost printed circuit board 120 is limited, and the flexibility of the layout is poor.

In some embodiments, as shown in fig. 9, the printed circuit board 120 includes a plurality of printed circuit boards 120, which are sequentially stacked; the third through holes of the plurality of printed circuit boards 120 are communicated; the third through holes of the plurality of printed circuit boards 120 are communicated with the second through holes of the second pads 122 and the first through holes of the first pads 121.

It is understood that due to the existence of the third through hole on the printed circuit board 120, the electronic component 140 of the printed circuit board 120 can be disposed on the outer surface of the printed circuit board 120 and in the third through hole of the printed circuit board 120, thereby increasing the flexibility of the layout of the printed circuit board 120.

In this embodiment, the plurality of printed circuit boards 120 are sequentially stacked, a gap exists between adjacent printed circuit boards 120, the third through holes of the plurality of printed circuit boards 120 are communicated, and the electronic component 140 can be disposed in the gap between adjacent printed circuit boards 120 or disposed in the third through hole of the printed circuit board 120, so as to increase the surface layout space of the printed circuit boards 120 and increase the availability of the layout space of the printed circuit boards 120.

In some embodiments, the placement position of the second pad 122 relative to the first pad 121 may be placed according to actual requirements.

For example, the second pad 122 is aligned with one side of the first pad 121, and the central axis of the second pad 122 is offset from the central axis of the first pad 121.

The second through-hole of the second pad 122 is located at the center of the second pad 122, the first through-hole of the first pad 121 is located at the center of the first pad 121, and the second through-hole of the second pad 122 is communicated with the first through-hole of the first pad 121 but has a displaced inner wall.

For example, the second pad 122 is disposed at the center of the first pad 121, and the center axis of the second pad 122 is aligned with the center axis of the first pad 121.

The outer edge of the first pad 121 protrudes from the second pad 122, and the solder layer 130 covers the upper surface of the second pad 122, the side surface of the second pad 122, the upper surface of the first pad 121 not covered by the second pad 122, and the side surface of the first pad 121.

In some embodiments, the second pad 122 is disposed at a center of the first pad 121, the second through hole of the second pad 122 is located at a center of the second pad 122, and the first through hole of the first pad 121 is located at a center of the first pad 121.

In this embodiment, the second pad 122 is disposed at the center of the first pad 121, and the contact areas of the solder layer 130, the second pad 122 and the first pad 121 are uniformly distributed, so as to avoid stress concentration and improve connection strength.

The shapes of the second pad 122 and the first pad 121 may be the same or different, and the shapes of the second pad 122 and the first pad 121 may be set according to specific requirements.

For example, the second pad 122 and the first pad 121 may each be provided in a circular shape, a rectangular shape, or a special shape.

Alternatively, the second pad 122 is provided in a circular shape and the first pad 121 is provided in a rectangular shape.

In some embodiments, the second pad 122 and the first pad 121 are the same shape.

For example, the second pad 122 and the first pad 121 are both circular in shape, and the second pad 122 and the first pad 121 are coaxially disposed.

The first bonding pad 121 and the second bonding pad 122 may be made of the same material or different materials, and may be specifically set according to actual requirements.

In some embodiments, the first pad 121 and the second pad 122 are made of the same material, and both are made of a metal material, and a tin plating layer is disposed outside the metal material.

For example, the first pad 121 and the second pad 122 may be pads made of ceramic, steel, copper pad, or the like.

In some embodiments, the first bonding pad 121 and the second bonding pad 122 are made of copper.

In this embodiment, the first pad 121 and the second pad 122 are made of the same material, so that the connection strength of the first pad 121, the second pad 122 and the solder layer 130 is the same, the uniformity of the connection force between the first pad 121, the second pad 122 and the solder layer 130 is ensured, stress concentration is avoided, tin cracking caused by the assembly pull-plug stress is avoided, and the overall reliability of the connector is improved.

In the structure for improving the assembling reliability of the connector, on the first aspect, the second bonding pad 122 is arranged on the first bonding pad 121, so that the contact area between the solder layer 130 and the soldering pin 111 is increased, the contact area between the solder paste and the second bonding pad 122 is increased, the contact surfaces between the solder paste and the second bonding pad 122 and the contact surfaces between the solder paste and the first bonding pad 121 are increased, and the connecting force between the opposite surface mount device 110 and the second bonding pad 122 is greatly improved; in the second aspect, the first through holes communicated with each other are drilled in the second bonding pad 122 and the first bonding pad 121, solder paste flows into the second through hole, the first through hole and the third through hole, and the inner walls of the second through hole, the first through hole and the third through hole are in contact with the solder paste layer, so that the contact area between the solder paste layer and the second bonding pad 122 and the contact area between the solder paste layer and the first bonding pad 121 are further increased, the connection force is improved, and the overall reliability of the connector is improved; in the third aspect, after the surface mount device 110 is placed on the printed circuit board 120, the excess solder paste flows into the second through hole, the first through hole and the third through hole along the inner walls of the second through hole, the first through hole and the third through hole, so that the transverse deformation of a solder paste layer is reduced, and the electrical short circuit phenomenon caused by interconnection of the solder pastes is reduced; in the fourth aspect, by drilling the third through hole in the printed circuit board 120, the electronic component 140 of the printed circuit board 120 can be disposed on the outer surface of the printed circuit board 120 and in the third through hole of the printed circuit board 120, thereby increasing the flexibility of the layout of the printed circuit board 120.

Preferably, the present embodiment further provides an electronic device including any one of the above structures for improving the assembling reliability of the connector.

The electronic device may be any electronic device using a connector, such as a mobile phone, a computer, a sweeping robot, a smart watch, and the like.

Specifically, since the electronic device shown in this embodiment includes the structure for improving the assembling reliability of the connector shown in the above embodiment, the electronic device shown in this embodiment includes all the technical solutions of the above embodiment, and therefore, at least all the beneficial effects obtained by all the technical solutions of the above embodiment are achieved, and are not repeated herein.

According to the electronic equipment provided by the invention, by arranging the structure for improving the assembling reliability of the connector, on the first aspect, the second bonding pad 122 is arranged on the first bonding pad 121, so that the contact area between the soldering tin layer 130 and the soldering pin 111 is increased, the contact area between the solder paste and the second bonding pad 122 is increased, the contact surfaces between the solder paste and the second bonding pad 122 and the contact surfaces between the solder paste and the first bonding pad 121 are more, and the connecting force between the opposite surface mount device 110 and the second bonding pad 122 is greatly improved; in the second aspect, the second through hole is formed in the second bonding pad 122, the first bonding pad 121 is provided with the first through hole, the second through hole is communicated with the first through hole, solder paste flows into the second through hole and the first through hole, and the inner walls of the second through hole and the first through hole are in contact with the solder paste layer, so that the contact area of the solder paste layer with the second bonding pad 122 and the first bonding pad 121 is further increased, the connection force is improved, and the overall reliability of the connector is improved; in the third aspect, after the surface mount device 110 is placed on the printed circuit board 120, the excess solder paste flows into the second through hole, the first through hole, and the third through hole along the inner walls of the second through hole, the first through hole, and the third through hole, so that the transverse deformation of a solder paste layer is reduced, and the electrical short circuit phenomenon caused by solder paste interconnection is reduced; in the fourth aspect, by drilling the third through hole in the printed circuit board 120, the electronic component 140 of the printed circuit board 120 can be disposed on the outer surface of the printed circuit board 120 and in the third through hole of the printed circuit board 120, thereby increasing the flexibility of the layout of the printed circuit board 120.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (12)

1. A structure for improving reliability of connector assembly, comprising:

the surface is pasted with a device, and the lower surface is provided with a welding pin;

the upper surface of the printed circuit board is provided with a first bonding pad, the first bonding pad is arranged corresponding to the welding pins, and the first bonding pad is provided with a first through hole;

the second bonding pad is arranged on the upper surface of the first bonding pad, and the size of the second bonding pad is smaller than that of the first bonding pad; the second bonding pad is provided with a second through hole which is communicated with the first through hole;

and the soldering tin layers are distributed between the welding pins and the first bonding pads, between the welding pins and the second bonding pads and inside the first through holes and the second through holes.

2. The structure for improving the assembling reliability of a connector according to claim 1,

the printed circuit board is provided with a third through hole, and the third through hole is communicated with the second through hole and the first through hole;

the soldering tin layer is distributed on a part of the third through hole, and the other part of the third through hole is used for arranging electronic components.

3. The structure for improving the assembling reliability of a connector according to claim 2,

and partially plugging the third through hole, the second through hole or the first through hole.

4. The structure for improving the assembling reliability of a connector according to claim 3,

the third through hole, the second through hole or the first through hole is partially plugged by adopting electroplating and hole filling processing.

5. The structure for improving the assembling reliability of a connector according to claim 2,

the inner walls of the second through hole, the first through hole and the third through hole are smoothly connected.

6. The structure for improving the assembling reliability of a connector according to claim 2,

and the inner walls of the second through hole, the first through hole and the third through hole are connected in a staggered manner.

7. The structure for improving the assembling reliability of a connector according to claim 2,

the printed circuit boards are sequentially stacked;

the third through holes of the printed circuit boards are communicated;

the third through holes of the printed circuit boards are communicated with the second through holes and the first through holes.

8. The structure for improving the assembling reliability of a connector according to any one of claims 2 to 7,

the first through hole, the second through hole and the third through hole are formed by laser drilling.

9. The structure for improving the assembling reliability of a connector according to any one of claims 1 to 7,

the second bonding pad is arranged at the center of the first bonding pad.

10. The structure for improving the assembling reliability of a connector according to any one of claims 1 to 7,

the second pad and the first pad have the same shape.

11. The structure for improving the assembling reliability of a connector according to any one of claims 1 to 7,

the first bonding pad and the second bonding pad are made of metal materials, and tin coatings are arranged on the outer sides of the first bonding pad and the second bonding pad.

12. An electronic apparatus comprising the structure for improving the assembling reliability of the connector according to any one of claims 1 to 11.

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