CN115684629A - Quantum acoustic wave sensor and quantum voiceprint recognition system - Google Patents
Quantum acoustic wave sensor and quantum voiceprint recognition system Download PDFInfo
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- 239000013307 optical fiber Substances 0.000 claims abstract description 45
- 238000001514 detection method Methods 0.000 claims abstract description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 38
- 229910052710 silicon Inorganic materials 0.000 claims description 38
- 239000010703 silicon Substances 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 21
- 239000000725 suspension Substances 0.000 claims description 20
- 238000012545 processing Methods 0.000 claims description 17
- 230000005236 sound signal Effects 0.000 claims description 9
- 239000012528 membrane Substances 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 230000009467 reduction Effects 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 3
- 230000007613 environmental effect Effects 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 abstract description 8
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000003909 pattern recognition Methods 0.000 abstract 1
- 239000000835 fiber Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000003745 diagnosis Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Abstract
The invention relates to the technical field of semiconductors, and particularly discloses a quantum acoustic wave sensor and a quantum acoustic pattern recognition system, wherein the quantum acoustic wave sensor comprises: one end of the cavity is an optical fiber port, the other end of the cavity is provided with a cover plate, and the cover plate is provided with a detection window; a fixed beam and an MEMS chip are arranged in the cavity, the fixed beam and the MEMS chip are arranged at intervals, the fixed beam is arranged close to one end of the optical fiber port, and the MEMS chip is arranged close to one end of the cover plate; the fixed beam is used for fixing the incident optical fiber and the emergent optical fiber; the MEMS chip can transmit incident light emitted by the incident optical fiber to the photoelectric detection device through the emergent optical fiber after reflecting the incident light for at least two times, and can block the light path of the reflected light according to the vibration of the cavity. The quantum acoustic wave sensor provided by the invention effectively improves the sound detection sensitivity.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a quantum acoustic wave sensor and a quantum voiceprint recognition system.
Background
The existing sound sensor is an electrical sensor, and is easily influenced by electromagnetic radio frequency, so that the problems of short transmission distance, high transmission loss, poor anti-interference performance and the like are caused, and the sensor formed by taking an electrical signal as a transmission medium has low sensitivity, so that the requirement of a current user on the high sensitivity of the sensor cannot be met.
Therefore, how to provide a quantum acoustic wave sensor with high sensitivity is a technical problem to be solved urgently by those skilled in the art.
Disclosure of Invention
The invention provides a quantum acoustic wave sensor and a quantum voiceprint recognition system, which solve the problem of low sensitivity of an acoustic wave sensor in the related technology.
As a first aspect of the present invention, there is provided a quantum acoustic wave sensor, comprising:
one end of the cavity is an optical fiber port, the other end of the cavity is provided with a cover plate, and the cover plate is provided with a detection window;
a fixed beam and an MEMS chip are arranged in the cavity, the fixed beam and the MEMS chip are arranged at intervals, the fixed beam is arranged close to one end of the optical fiber port, and the MEMS chip is arranged close to one end of the cover plate;
the fixed beam is used for fixing the incident optical fiber and the emergent optical fiber;
the MEMS chip can transmit incident light emitted by the incident optical fiber to the photoelectric detection device through the emergent optical fiber after reflecting the incident light for at least two times, and can block the light path of the reflected light according to the vibration of the cavity.
Further, the MEMS chip includes: the light valve structure comprises a first silicon substrate and a second silicon substrate which are symmetrically arranged at intervals, wherein a suspension film is formed between the first silicon substrate and the second silicon substrate, a reflecting surface capable of reflecting incident light is formed on the first silicon substrate and the second silicon substrate, and a light valve structure is formed on the suspension film and can block the light path of the reflected light when the suspension film vibrates.
Further, the light valve structure includes a pointed needle structure in an inverted triangular shape.
Further, a first reflection surface is formed on the surface of the first silicon base facing the second silicon base, the first reflection surface can perform first reflection on incident light emitted by the incident optical fiber to form first reflection light, a second reflection surface is formed on the surface of the second silicon base facing the first silicon base, the second reflection surface can perform second reflection on the first reflection light to form second reflection light, and the second reflection light can be transmitted to the photodetector through the emergent optical fiber.
Further, the light of the incident light emitted by the incident optical fiber is parallel to the light of the second reflected light, the light of the first reflected light is perpendicular to the light of the incident light, and the light of the second reflected light is perpendicular to the light of the first reflected light.
Further, the shape of the fixed beam is matched with the shape of the cavity.
Furthermore, the detection window is provided with a waterproof breathable film.
As another aspect of the present invention, there is provided a quantum voiceprint recognition system, comprising: a light source, a circulator, a photoelectric detector, an upper computer and a quantum acoustic wave sensor array, wherein the quantum acoustic wave sensor array comprises a plurality of the quantum acoustic wave sensors arranged in an array,
the light source is used for emitting an incident light signal;
the circulator is used for transmitting the incident light signal to the quantum acoustic wave sensor array and transmitting a reflected light signal to the photoelectric detector;
the quantum acoustic wave sensor array is used for detecting environmental acoustic signals and then enabling the MEMS chip to vibrate and blocking a light path of reflected light according to vibration;
the photoelectric detector can perform photoelectric conversion on the reflected light signal to obtain an electric signal corresponding to the reflected light signal;
the upper computer can carry out intelligent identification processing according to the electric signal to obtain a sound signal.
Further, the host computer includes:
the voice signal processing module is used for carrying out noise reduction enhancement processing on the electric signal to obtain a voice processing signal;
and the voice recognition module is used for recognizing the voice signal in the voice processing signal according to a recognition algorithm to obtain a voice signal.
Furthermore, the system also comprises a loudspeaker, wherein the loudspeaker is connected with the upper computer and used for playing the sound signal.
According to the quantum acoustic wave sensor provided by the invention, the MEMS chip can shield the light path of reflected light when the cavity vibrates slightly, so that the sensitivity of sound detection can be effectively improved, and the quantum acoustic wave sensor is free from the influence of electromagnetic radiation and the like, so that the anti-interference performance is good, and in addition, the quantum acoustic wave sensor also has the advantage of long transmission distance due to the adoption of optical fiber transmission.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.
Fig. 1 is a schematic structural diagram of a quantum acoustic wave sensor provided in the present invention.
Fig. 2 is a schematic structural diagram of a MEMS chip provided in the present invention.
Fig. 3 is a block diagram of a quantum voiceprint recognition system provided by the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances in order to facilitate the description of the embodiments of the invention herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In this embodiment, a quantum acoustic wave sensor is provided, and fig. 1 is a schematic structural diagram of a quantum acoustic wave sensor provided according to an embodiment of the present invention, as shown in fig. 1, including:
one end of the cavity 10 is an optical fiber port, the other end of the cavity is provided with a cover plate 11, and a detection window 12 is arranged on the cover plate 11;
a fixed beam 20 and an MEMS chip 30 are arranged in the cavity 10, the fixed beam 20 and the MEMS chip 30 are arranged at intervals, the fixed beam 20 is arranged close to one end of the optical fiber port, and the MEMS chip 30 is arranged close to one end of the cover plate 11;
the fixed beam 20 is used for fixing the incident optical fiber and the emergent optical fiber;
the MEMS chip 30 can transmit the incident light emitted from the incident optical fiber to the photodetection device through the emergent optical fiber after at least two reflections, and can block the optical path of the reflected light according to the vibration of the cavity 10.
In the embodiment of the present invention, the incident light emitted by the incident optical fiber can be transmitted to the photoelectric detection device through the emergent optical fiber after being reflected by the MEMS chip, and when the detection window of the cavity 10 detects a sound, the sound pressure can cause the MEMS chip to vibrate, and the MEMS chip can block the light path of the reflected light when vibrating, so as to change the light intensity of the reflected light, and then the light intensity of the reflected light received by the photoelectric detection device changes, and finally a sound signal can be obtained.
Therefore, according to the quantum acoustic wave sensor provided by the invention, the MEMS chip can shield the light path of reflected light when the cavity vibrates slightly, so that the sensitivity of sound detection can be effectively improved, and the quantum acoustic wave sensor is free from the influence of electromagnetic radiation and the like, so that the anti-interference performance is good, and in addition, the quantum acoustic wave sensor also has the advantage of long transmission distance due to the adoption of optical fiber transmission.
As shown in fig. 2, the MEMS chip 30 includes: the light valve structure comprises a first silicon substrate 31 and a second silicon substrate 32 which are symmetrically arranged at intervals, a suspension film 33 is formed between the first silicon substrate 31 and the second silicon substrate 32, reflecting surfaces capable of reflecting incident light are formed on the first silicon substrate 31 and the second silicon substrate 32, a light valve structure 34 is formed on the suspension film 33, and the light valve structure 34 can block the light path of the reflected light when the suspension film 33 vibrates.
In an embodiment of the present invention, the light valve structure 34 includes a sharp needle structure in the shape of an inverted triangle.
It should be understood that the length of the light valve structure 34 in the direction perpendicular to the suspension film 33 is preferably just not to affect the optical path of the emitted light when there is no vibration, so that even when a small sound is detected and the suspension film 33 vibrates slightly, the light valve structure 34 can block the optical path of the reflected light, thereby effectively improving the detection sensitivity of the quantum acoustic wave sensor.
It should be noted that the first silicon base 31, the second silicon base 32, the suspension film 33, and the light valve structure 34 are all formed by an etching process, and the basic manufacturing materials are all silicon.
In some embodiments, in order to form a reflective optical path, as shown in fig. 2, the first silicon base 31 forms a first reflective surface 311 facing the surface of the second silicon base 32, the first reflective surface 311 can reflect the incident light emitted from the incident optical fiber for a first time to form a first reflected light, the second silicon base 32 forms a second reflective surface 321 facing the surface of the first silicon base 31, the second reflective surface 321 can reflect the first reflected light for a second time to form a second reflected light, and the second reflected light can be transmitted to the photodetector through the exit optical fiber.
It should be understood that the first silicon substrate 31 and the second silicon substrate 32 may be etched to form smooth reflective surfaces so as to reflect incident light, and that the reflected light is reflected by the two reflective surfaces, so that the reflected light can both pass through the outgoing optical fiber and cooperate with the light valve structure to detect whether there is vibration of the suspension membrane caused by an acoustic signal.
In some embodiments, as shown by the arrows in fig. 1, the light of the incident light emitted by the incident optical fiber is parallel to the light of the second reflected light, the light of the first reflected light is perpendicular to the light of the incident light, and the light of the second reflected light is perpendicular to the light of the first reflected light.
In the embodiment of the present invention, since the incident fiber grooves and the emergent fiber grooves disposed on the fixed beam 20 are perpendicular to the upper and lower surfaces of the fixed beam 20, the fibers of the incident light emitted by the incident fibers are also perpendicular to the upper and lower surfaces of the fixed beam, and since the suspension film is parallel to the fixed beam, and the light valve structure is perpendicular to the suspension film, if the light valve structure can block the light path when the suspension film vibrates, it is necessary that the first reflected light formed by the first silicon substrate is exactly parallel to the suspension film, so that the light of the first reflected light is perpendicular to the light of the incident light, and the light of the second reflected light is perpendicular to the light of the first reflected light.
It should also be understood that the above requirement is satisfied where the first reflective surface of the first silicon base and the second reflective surface of the second silicon base are both at an angle of 135 ° to the suspended film.
In the present embodiment, the shape of the fixing beam 20 is adapted to the shape of the cavity 10.
Preferably, the chamber 10 is shaped as a cylinder, and the fixing beam 20 is also provided as a cylinder so as to be installed in the chamber 10.
In the embodiment of the present invention, the manufacturing material of the cavity 10 may be plastic, the manufacturing material of the fixing beam 20 may be resin, and two grooves are disposed on the fixing beam 20, one groove is an incident optical fiber groove, and the other groove is an emergent optical fiber groove.
Preferably, the fixed beam may be a fiber collimator.
In order not to influence sound detection and also to prevent water vapor and the like from entering the cavity to influence the detection result, the detection window 12 is provided with a waterproof breathable film.
In the embodiment of the present invention, the specific material for making the waterproof and breathable film may be polytetrafluoroethylene.
In summary, the quantum acoustic wave sensor provided by the invention can reflect incident light through the MEMS chip and block the light path of the reflected light when the vibration occurs due to sound detection, so that sound detection can be realized sensitively.
As another embodiment of the present invention, there is provided a quantum voiceprint recognition system 1, as shown in fig. 3, including: light source 100, circulator 200, photodetector 300, upper computer 400, and quantum acoustic wave sensor array 500, where quantum acoustic wave sensor array 500 includes a plurality of quantum acoustic wave sensors arranged in an array as described above,
the light source 100 is used for emitting an incident light signal;
the circulator 200 is used for transmitting the incident light signal to the quantum acoustic wave sensor array and transmitting the reflected light signal to the photodetector 300;
the quantum acoustic sensor array 500 is used for detecting the environmental acoustic signals and then enabling the MEMS chip to vibrate and blocking the light path of reflected light according to vibration;
the photodetector 300 can perform photoelectric conversion on the reflected light signal to obtain an electrical signal corresponding to the reflected light signal;
the upper computer 400 can perform intelligent recognition processing according to the electric signal to obtain a sound signal.
In the embodiment of the present invention, the light source 100 may specifically be a laser light source, laser light emitted by the laser light source is transmitted to the quantum acoustic wave sensor array 500 as an incident light signal through the circulator 200, a reflected light signal is formed after reflection by an MEMS chip of each quantum acoustic wave sensor in the quantum acoustic wave sensor array, the reflected light signal enters the photodetector 300 after passing through the circulator 200, the photodetector 300 performs photoelectric conversion on the reflected light signal to obtain an electrical signal, and then enters the upper computer to perform voice signal processing, and finally a voice signal is recognized through a recognition algorithm to obtain a voice signal.
Specifically, the host computer includes:
the voice signal processing module is used for carrying out noise reduction enhancement processing on the electric signal to obtain a voice processing signal;
and the voice recognition module is used for recognizing the voice signal in the voice processing signal according to a recognition algorithm to obtain a sound signal.
In the embodiment of the invention, the system further comprises a loudspeaker, wherein the loudspeaker is connected with the upper computer and is used for playing the sound signal.
It should be understood that a fiber collimator is packaged on each quantum acoustic wave sensor, and the fiber collimator of the double tail fiber is vertically aligned with the reflecting surface of the MEMS chip and is adjusted to a distance that is at the working distance. The light irradiates the reflecting surface of the MEMS chip along with the incident optical fiber through the optical fiber collimator, and the reflected light is coupled to the emergent optical fiber through the same optical fiber collimator to reach the photoelectric detector. The suspension membrane of the MEMS chip converts sound field vibration into mechanical vibration, so that the distance between the suspension membrane and the collimator is changed, the light quantity coupled to the collimator is influenced, and the sound signal can be recovered by detecting the change quantity of the suspension membrane through the photoelectric detector.
It should be understood that the circulator 200, the photodetector 300, and the like may all be implemented by using common structures on the market, and specific working processes and principles are not described herein, and processing of the voice signal and the like may all be implemented by using a voice recognition algorithm and the like on an upper computer.
The operation of the array voiceprint system provided by the present invention is described in detail below with reference to a specific example.
The power equipment monitoring and early warning system comprises a plurality of quantum acoustic wave sensors, and the distance between each quantum acoustic wave sensor and a transformer is set to be 1 meter.
(1) The quantum acoustic wave sensor is used to pick up the noise signal emitted by the transformer.
And a quantum acoustic wave sensor is respectively arranged on four sides of the transformer. The distance between the sensor and the transformer is 1 meter, the distance is the optimal range of the intensity of the signals collected by the sensor, and the information on the edge side of the collecting surface is not easy to lose, and is not easy to be interfered by external noise.
(2) And extracting the voiceprint characteristics of the transformer and performing noise reduction treatment. The quantum acoustic wave sensor can uninterruptedly pick up noise signals sent by the transformer and transmit the noise signals to the photoelectric detector through the optical fiber. Because the noise signal of the transformer is long and disordered, and the similarity of the noise of the transformer in the time domain and the frequency domain under different working conditions is high, the noise signal is difficult to be directly analyzed and identified, and therefore, the characteristics in the noise signal are extracted through various characteristic identification methods, and the subsequent noise analysis and identification are facilitated. The whole feature extraction method mainly comprises three parts of preprocessing, feature extraction and feature connection.
(3) And intelligently identifying the voiceprint of the transformer, and comparing and analyzing the voiceprint with voiceprint characteristic database data. After the voiceprint characteristics of the transformer are extracted, a target working condition is required to be modeled, the noise signal to be detected is compared and judged, the fault working condition type is identified, and a transformer working state acoustic characteristic database is established on the basis of a large number of simulation tests and field tests, wherein the transformer working state acoustic characteristic database comprises acoustic characteristics of the transformer in a normal state and different fault states and is important sample data of a voiceprint identification technology.
(4) After the voiceprint is identified and analyzed at the front end, the voiceprint is analyzed, monitored and early-warned at the rear end through a voiceprint analysis and monitoring platform used for man-machine interaction. The voiceprint recognition method based on the integrated voiceprint recognition platform has the advantages that the voiceprint information of the running of equipment is collected in real time through the integrated noise signal storage and voiceprint feature extraction platform, the real-time audio frequency spectrogram and the voiceprint features of each collection device are displayed, the audio playback and manual diagnosis functions are supported, and the voiceprint recognition algorithm can be used for comprehensively and comprehensively diagnosing the voiceprint data monitored on line to form a comprehensive diagnosis report of the running state of the equipment. Meanwhile, the transformer equipment management function is provided, the whole operation condition information of a plurality of transformers can be managed and checked, and dimension generation maintenance work orders and the like such as voiceprint intelligent diagnosis results, manufacturers, voltage classes, operation years, winding types, cooling modes and the like are synthesized.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A quantum acoustic wave sensor, comprising:
one end of the cavity is an optical fiber port, the other end of the cavity is provided with a cover plate, and a detection window is arranged on the cover plate;
a fixed beam and an MEMS chip are arranged in the cavity, the fixed beam and the MEMS chip are arranged at intervals, the fixed beam is arranged close to one end of the optical fiber port, and the MEMS chip is arranged close to one end of the cover plate;
the fixed beam is used for fixing the incident optical fiber and the emergent optical fiber;
the MEMS chip can transmit incident light emitted by the incident optical fiber to the photoelectric detection device through the emergent optical fiber after reflecting the incident light for at least two times, and can block the light path of the reflected light according to the vibration of the cavity.
2. The quantum acoustic wave sensor of claim 1, wherein the MEMS chip comprises: the light valve structure comprises a first silicon substrate and a second silicon substrate which are symmetrically arranged at intervals, wherein a suspension film is formed between the first silicon substrate and the second silicon substrate, a reflecting surface capable of reflecting incident light is formed on the first silicon substrate and the second silicon substrate, and a light valve structure is formed on the suspension film and can block the light path of the reflected light when the suspension film vibrates.
3. The quantum acoustic wave sensor of claim 2, wherein the light valve structure comprises an inverted triangular shaped spike structure.
4. The quantum acoustic wave sensor according to claim 2, wherein a surface of the first silicon base facing the second silicon base forms a first reflection surface, the first reflection surface can reflect incident light emitted from the incident optical fiber for a first time to form first reflection light, a surface of the second silicon base facing the first silicon base forms a second reflection surface, the second reflection surface can reflect the first reflection light for a second time to form second reflection light, and the second reflection light can be transmitted to the photodetector through the exit optical fiber.
5. The quantum acoustic wave sensor of claim 4, wherein the incident optical fiber emits incident light rays parallel to the second reflected light rays, the first reflected light rays perpendicular to the incident light rays, and the second reflected light rays perpendicular to the first reflected light rays.
6. The quantum acoustic wave sensor of any one of claims 1 to 5, wherein the shape of the fixed beam is adapted to the shape of the cavity.
7. The quantum acoustic wave sensor according to any one of claims 1 to 5, wherein the detection window is provided with a waterproof gas permeable membrane.
8. A quantum voiceprint recognition system, comprising: a light source, a circulator, a photoelectric detector, an upper computer and a quantum acoustic wave sensor array, wherein the quantum acoustic wave sensor array comprises a plurality of quantum acoustic wave sensors as claimed in any one of claims 1 to 7 arranged in an array,
the light source is used for emitting an incident light signal;
the circulator is used for transmitting the incident light signal to the quantum acoustic wave sensor array and transmitting a reflected light signal to the photoelectric detector;
the quantum acoustic wave sensor array is used for detecting environmental acoustic signals and then enabling the MEMS chip to vibrate and blocking a light path of reflected light according to vibration;
the photoelectric detector can perform photoelectric conversion on the reflected light signal to obtain an electric signal corresponding to the reflected light signal;
the upper computer can carry out intelligent identification processing according to the electric signal to obtain a sound signal.
9. The quantum voiceprint recognition system of claim 8 wherein the upper computer comprises:
the voice signal processing module is used for carrying out noise reduction enhancement processing on the electric signal to obtain a voice processing signal;
and the voice recognition module is used for recognizing the voice signal in the voice processing signal according to a recognition algorithm to obtain a voice signal.
10. The quantum voiceprint recognition system of claim 8 further comprising a speaker connected to the upper computer for playing the sound signal.
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| CN112556585A (en) * | 2020-11-19 | 2021-03-26 | 深圳中科飞测科技股份有限公司 | Measuring system and measuring method |
| CN112461766A (en) * | 2020-12-08 | 2021-03-09 | 国网安徽省电力有限公司电力科学研究院 | Optical fiber photoacoustic sensing probe and sensing system capable of resisting environmental noise interference |
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