CN115679400A - Treatment method before electroplating of ultra-micro and high-capacity MLCC - Google Patents
Treatment method before electroplating of ultra-micro and high-capacity MLCC Download PDFInfo
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- CN115679400A CN115679400A CN202211225685.0A CN202211225685A CN115679400A CN 115679400 A CN115679400 A CN 115679400A CN 202211225685 A CN202211225685 A CN 202211225685A CN 115679400 A CN115679400 A CN 115679400A
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000009713 electroplating Methods 0.000 title claims abstract description 24
- 238000007747 plating Methods 0.000 claims abstract description 30
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 26
- 239000000126 substance Substances 0.000 claims abstract description 26
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000005470 impregnation Methods 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 39
- 239000003093 cationic surfactant Substances 0.000 claims description 13
- -1 amine compound Chemical class 0.000 claims description 9
- 239000003945 anionic surfactant Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 4
- DDXLVDQZPFLQMZ-UHFFFAOYSA-M dodecyl(trimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)C DDXLVDQZPFLQMZ-UHFFFAOYSA-M 0.000 claims description 4
- 229960000776 sodium tetradecyl sulfate Drugs 0.000 claims description 3
- GGHPAKFFUZUEKL-UHFFFAOYSA-M sodium;hexadecyl sulfate Chemical compound [Na+].CCCCCCCCCCCCCCCCOS([O-])(=O)=O GGHPAKFFUZUEKL-UHFFFAOYSA-M 0.000 claims description 3
- NWZBFJYXRGSRGD-UHFFFAOYSA-M sodium;octadecyl sulfate Chemical compound [Na+].CCCCCCCCCCCCCCCCCCOS([O-])(=O)=O NWZBFJYXRGSRGD-UHFFFAOYSA-M 0.000 claims description 3
- UPUIQOIQVMNQAP-UHFFFAOYSA-M sodium;tetradecyl sulfate Chemical compound [Na+].CCCCCCCCCCCCCCOS([O-])(=O)=O UPUIQOIQVMNQAP-UHFFFAOYSA-M 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 2
- 230000006872 improvement Effects 0.000 abstract description 8
- 238000004140 cleaning Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 7
- 239000003985 ceramic capacitor Substances 0.000 abstract description 4
- 239000000919 ceramic Substances 0.000 description 15
- 230000008569 process Effects 0.000 description 13
- 238000007667 floating Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 238000002791 soaking Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 238000000861 blow drying Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L sulfate group Chemical group S(=O)(=O)([O-])[O-] QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 125000002252 acyl group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention relates to a treatment method before electroplating of an ultra-miniature and high-capacity MLCC (multilayer ceramic capacitor), which comprises the following steps of: s100: carrying out impregnation treatment on the MLCC subjected to end burning to coat a layer of hydrophobic substance on the surface of the MLCC; s102: cleaning the MLCC by using alcohol to remove hydrophobic substances on the surface of the MLCC end; s104: carrying out hydrophilic treatment on the MLCC by using a hydrophilic solution containing a hydrophilic agent to coat a layer of hydrophilic substance on the surface of the MLCC; s106: and carrying out electroplating treatment on the MLCC. The method can effectively improve the condition that the MLCC floats in the plating solution due to the hydrophobic characteristic of the surface of the MLCC during electroplating to cause product loss or unplating, and has simple operation and obvious improvement effect.
Description
Technical Field
The invention relates to the technical field of MLCC preparation, in particular to an ultra-micro MLCC and a treatment method before high-capacity MLCC electroplating.
Background
MLCC (Multi-layer Ceramic Capacitor), a chip multilayer Ceramic Capacitor, is also called a chip Ceramic Capacitor, a multilayer Capacitor, and the like, and is one of the most widely used capacitors. MLCC is formed by overlapping ceramic dielectric films printed with electrodes (inner electrodes) in a staggered mode, forming ceramic blocks through high-temperature sintering, and sealing metal layers (outer electrodes) at two ends of the ceramic blocks. MLCCs are generally prepared by: the method comprises the following processes of proportioning, casting, printing, laminating, cutting, discharging glue, sintering, chamfering, end sealing, end burning, electroplating and the like. Among them, in the end-capping step, copper paste is generally used for end-capping. The copper paste contains copper powder, resin, glass body, organic solvent and the like. In order to form a compact metal end head with good conductivity and connected with the inner electrode and the outer electrode, the end head needs to be subjected to an end burning process to remove resin and residual organic solvent in end slurry, so that a glass body and copper powder are sintered into a compact metal copper layer. However, due to the difference of parameters such as slurry ratio, particle size and viscosity, or the deviation of sintering process, the sintering of the end head is not dense, and holes are generated, which may cause poor Insulation Resistance (IR) of ultra-micro MLCC and high-capacity MLCC products and poor plating solution infiltration during electroplating.
At present, in order to solve the problems of poor Insulation Resistance (IR) of products caused by the holes of the terminals and the infiltration of plating solution in electroplating, the holes of the terminals are usually filled with a hydrophobic substance through an impregnation treatment in the MLCC after burning. However, when plating MLCCs which have been subjected to impregnation treatment to fill up the holes in the terminals, MLCCs tend to float in the plating solution, resulting in product loss or unplating. The smaller the product, the more buoyant.
Disclosure of Invention
Accordingly, an object of the present invention is to provide a method for treating an ultra-miniature and high-capacity MLCC before plating, which can effectively prevent the ultra-miniature and high-capacity MLCC from floating in a plating solution during plating and causing product loss or non-plating.
The invention is realized by the following technical scheme:
a treatment method before electroplating of ultra-miniature and high-capacity MLCC comprises the following steps:
s100: carrying out impregnation treatment on the MLCC subjected to end burning to coat a layer of hydrophobic substance on the surface of the MLCC;
s102: cleaning the MLCC by using alcohol to remove hydrophobic substances on the surface of the MLCC end;
s104: carrying out hydrophilic treatment on the MLCC by using a hydrophilic solution containing a hydrophilic agent to coat a layer of hydrophilic substance on the surface of the MLCC;
s106: and carrying out electroplating treatment on the MLCC.
Compared with the prior art, the method has the advantages that the MLCC before being electroplated is cleaned by alcohol to remove the hydrophobic substance layer coated on the surface of the MLCC, then the MLCC is subjected to hydrophilic treatment by using the hydrophilic agent, so that the surfaces of the ceramic body and two ends of the MLCC are coated with a layer of hydrophilic substance, the overall hydrophilicity of the MLCC is improved, and the condition that the MLCC floats in the plating solution due to the hydrophobic property of the surface of the MLCC during electroplating to cause product loss can be effectively improved. Moreover, the smaller the product size, the lighter the product weight, and the better the prevention of floating.
Further, the hydrophilic agent comprises a first hydrophilic agent and a second hydrophilic agent, wherein the first hydrophilic agent is an anionic surfactant, and the second hydrophilic agent is a cationic surfactant.
Further, the anionic surfactant is any one of sodium dodecyl sulfate, sodium tetradecyl sulfate, sodium hexadecyl sulfate, or sodium octadecyl sulfate.
Further, the cationic surfactant is an amine compound, and the HLB (Hydrophile-Lipophile Balance Number) value of the cationic surfactant is more than 15. When the MLCC is immersed into the hydrophilic agent, the cationic surfactant in the hydrophilic agent can be adsorbed on the surface of the MLCC ceramic body, and if the HLB of the cationic surfactant is too low, the hydrophilicity of the surface of the MLCC ceramic body can be weakened.
Further, the amino compound is dodecyl trimethyl ammonium chloride.
Further, the mass ratio of the anionic surfactant to the cationic surfactant is 1. If the ratio is too large, the MLCC is easy to agglomerate when hydrophilic treatment is carried out; if the ratio is too small, the hydrophilic effect is weakened.
Further, the mass ratio of the anionic surfactant to the cationic surfactant is 1:2.
Further, the hydrophobic substance is a resin.
For a better understanding and practice, the present invention is described in detail below with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic flow chart of a treatment method before electroplating according to the present invention;
FIG. 2 is a schematic diagram of an MLCC;
FIG. 3 is a schematic view showing a hydrophilic treatment in the treatment method before plating according to the present invention.
Reference numerals: 10-MLCC, 12-MLCC ceramic body, 14-MLCC two ends, 1-hydrophilic treatment groove, 2-mesh, 3-hydrophilic agent, A-first hydrophilic agent and B-second hydrophilic agent.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the preparation of MLCC, before plating the MLCC, impregnation treatment is usually performed on the MLCC after firing, so that the surface of the MLCC is coated with a layer of hydrophobic substance (such as resin) to fill the holes formed at the MLCC end after firing. However, the inventors found in the manufacturing practice that the hydrophobic layer on the surface of the MLCC causes a relatively large surface tension with the plating solution, and thus, when electroplating is performed, the MLCC floats in the plating solution, especially for the MLCC which is small in volume and light in weight. Therefore, the present inventors cleaned the impregnated MLCC with alcohol to remove the hydrophobic substances on the surface thereof. However, the alcohol-washed MLCC still floats on the plating solution during plating. The research of the inventor on the alcohol cleaning process finds that the removal of resin by the alcohol cleaning process is difficult to accurately control, so that the hydrophobic substances on the surface of the MLCC are difficult to completely remove actually, and the residual hydrophobic substances can cause the MLCC to float in the plating solution, thereby causing the product or the unplated condition. Based on the above, the present inventors propose a method for pre-plating MLCCs, which comprises, before performing an electroplating process on MLCCs, performing alcohol cleaning to remove hydrophobic substances on the surfaces of the MLCCs, and then performing hydrophilic treatment on the MLCCs. Referring to fig. 1, fig. 1 shows a method for processing an MLCC before plating, comprising the steps of:
s100: carrying out impregnation treatment on the MLCC subjected to end burning to coat a layer of hydrophobic substance on the surface of the MLCC;
since the burn-in of the MLCC is prior art, it is not described herein. The impregnation treatment is specifically to impregnate the MLCC into a liquid hydrophobic substance. In the present embodiment, the hydrophobic substance is a resin. Specifically, the impregnation treatment comprises the following steps: wrapping the MLCC product → impregnating the product in liquid resin → spin-drying → drying by cold air, because the impregnation treatment process is the prior art, the description is omitted here.
S102: and cleaning the MLCC by using alcohol to remove the hydrophobic substances on the surface of the MLCC end.
Specifically, MLCC is soaked and cleaned in 98% industrial alcohol, and the industrial alcohol or common alcohol can be used. And after soaking, carrying out cold air blow-drying and hot air blow-drying on the MLCC in sequence until the resin in the holes at the two ends of the MLCC is hardened. The amount of alcohol used may be selected based on the number of samples to be treated, as long as it is ensured that the level of alcohol will be above all the MLCCs during immersion.
S104: carrying out hydrophilic treatment on the MLCC by using a hydrophilic solution containing a hydrophilic agent to coat a layer of hydrophilic substance on the surface of the MLCC;
specifically, the hydrophilic agent comprises a first hydrophilic agent and a second hydrophilic agent, wherein the first hydrophilic agent is an anionic surfactant, specifically containing sulfuric acid acyl (-SO) 3 H) Sodium alkyl sulfate of (1). Here, the sodium alkyl sulfate may be any one of sodium dodecyl sulfate, sodium tetradecyl sulfate, sodium hexadecyl sulfate, or sodium octadecyl sulfate. The second hydrophilic agent is a cationic surfactant with HLB value greater than 15, and specifically contains amino (-NH) 2 ) The amino compound of (2) is preferably dodecyltrimethylammonium chloride.
Preparing a hydrophilic solution by using a first hydrophilic agent and a second hydrophilic agent according to the mass ratio of 1.5-1. As shown in FIG. 2, the MLCC 10 comprises a ceramic body 12 in the middle and copper end terminals 14 at both ends, and when the MLCC is immersed in a hydrophilic solution, sodium alkyl sulfate in the hydrophilic solution is adsorbed on the surfaces of the terminals 14 at both sides of the MLCC due to negative charge, and contains hydrophilic acyl sulfate groups (-SO) 3 H) The hydrophobic membrane on the surface of the tip 14 is disrupted, thereby increasing the hydrophilicity of the surface. Meanwhile, since the amine salt in the hydrophilic solution is positively charged, it is adsorbed on the surface of the MLCC ceramic body 12, and it contains hydrophilic amino groups (-NH-) that are hydrophilic 2 ) Breaking the hydrophobic film on the surface of ceramic body 12, thereby increasing the hydrophilicity of the surface. Further, in order to achieve optimal hydrophilicity to both the ceramic body and the both-end terminal of the MLCC, the mass ratio of the first hydrophilic agent and the second hydrophilic agent is preferably 1:2.
S106: electroplating the MLCC;
specifically, the MLCC is immersed in a plating solution to perform an electroplating treatment. Since the MLCC plating process is prior art, it will not be described herein.
Further, the method for treating the MLCC before electroplating further comprises the following steps:
s105: and washing the MLCC by using pure water. Impurities adhering to the surface of the MLCC are removed by a cleaning process.
The pre-plating hydrophilic treatment process of the present invention will be further described below by taking 01005 (imperial) ultra-micro MLCC as an example.
Firstly, a first hydrophilic solution is prepared by a first hydrophilic agent and pure water, wherein the first hydrophilic agent specifically adopts sodium dodecyl sulfate, and the mass percent of the first hydrophilic agent in the first hydrophilic solution is 1%. Meanwhile, a second hydrophilic solution is prepared by using a second hydrophilic agent and pure water, wherein the second hydrophilic agent specifically adopts dodecyl trimethyl ammonium chloride, and the mass percentage of the second hydrophilic agent in the second hydrophilic solution is 0.99%.
500ml of the first hydrophilic solution and 1000ml of the second hydrophilic solution were prepared into 1500ml of the hydrophilic solution 3, which was then poured into the hydrophilic treatment tank 1. In practical application, the MLCC 10 to be treated can be directly placed into the hydrophilic solution 3 for soaking, or as shown in FIG. 3, the MLCC 10 to be treated is firstly loaded with the mesh fabric 2, and then the MLCC 10 wrapped by the mesh fabric 2 is placed into the hydrophilic treatment tank 1 for soaking for 10min. Wherein, the aperture of the mesh on the screen cloth 2 is smaller than the length of the shortest side of the MLCC 10, so as to ensure that the MLCC 10 does not leak. In the soaking process, the first hydrophilic agent A is adsorbed on the surfaces of the two side ends 14 of the MLCC 10, so that the hydrophilicity of the surfaces of the two side ends 14 is increased; meanwhile, the second hydrophilic agent B is adsorbed on the surface of the ceramic body 12 of the MLCC 10, and increases the hydrophilicity of the surface of the ceramic body 12, so as to improve the hydrophilicity of the whole MLCC 10. Preferably, the hydrophilic solution 3 in the hydrophilic treatment tank 1 can be heated to 30-40 ℃ before soaking to make the first hydrophilic agent A more compatible with the ends 14 of the MLCC 10 and the second hydrophilic agent B more compatible with the surface of the ceramic body 12 of the MLCC 10.
After completion of the soaking, the excess hydrophilic solution 3 attached to the surface of the MLCC 10 is removed by centrifugal drying and then dried. And cooling the dried MLCC 10, and performing an electroplating process. Preferably, the three steps of hydrophilic treatment, spin-drying and blow-drying are separated by no more than 1min to prevent the MLCC 10 from sticking together.
In practical application, the floating improvement effect of the 01005/C0G product is 97% (about 60000 reduction of single-batch floating products), and the floating improvement effect of the 01005/X5R (X7R) product is 91% (about 20000 reduction of single-batch floating products). Wherein, the improvement effect = (number of MLCCs floating before improvement-number of MLCCs floating after improvement)/number of MLCCs floating before improvement. Therefore, after the electroplating pretreatment process disclosed by the invention is used for treating, the effect of improving product loss or unplating is remarkable.
Compared with the prior art, the method has the advantages that the MLCC before electroplating is cleaned by alcohol to remove the hydrophobic substance layer coated on the surface of the MLCC, so that the hydrophobicity of the MLCC is weakened; and then, performing hydrophilic treatment on the MLCC by using a hydrophilic agent, so that a layer of hydrophilic substance is respectively coated on the surfaces of a ceramic body and two ends of the MLCC, the overall hydrophilicity of the MLCC is improved, and the condition that the MLCC floats in a plating solution due to the hydrophobic characteristic of the surface of the MLCC during electroplating to cause product loss or unplating can be effectively improved. The invention has simple operation and remarkable improvement effect. Moreover, the smaller the product size specification, the lighter the product weight, and the better the improvement.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, to those skilled in the art, changes and modifications may be made without departing from the spirit of the present invention, and it is intended that the present invention encompass such changes and modifications.
Claims (8)
1. A treatment method before electroplating of ultra-micro and high-capacity MLCC is characterized by comprising the following steps:
s100: carrying out impregnation treatment on the MLCC subjected to end burning to coat a layer of hydrophobic substance on the surface of the MLCC;
s102: washing the MLCC by using alcohol to remove hydrophobic substances on the surface of the MLCC end;
s104: carrying out hydrophilic treatment on the MLCC by using a hydrophilic solution containing a hydrophilic agent to coat a layer of hydrophilic substance on the surface of the MLCC;
s106: and carrying out electroplating treatment on the MLCC.
2. The method for pre-plating treatment of MLCCs as recited in claim 1, wherein:
the hydrophilic agent comprises a first hydrophilic agent and a second hydrophilic agent, wherein the first hydrophilic agent is an anionic surfactant, and the second hydrophilic agent is a cationic surfactant.
3. The method for pre-plating treatment of MLCCs as recited in claim 2, wherein:
the anionic surfactant is any one of sodium dodecyl sulfate, sodium tetradecyl sulfate, sodium hexadecyl sulfate and sodium octadecyl sulfate.
4. The method for pre-plating treatment of an MLCC as recited in claim 2, wherein:
the cationic surfactant is an amine compound, and the HLB value of the cationic surfactant is more than 15.
5. The method for pre-plating treatment of MLCCs according to claim 4, wherein:
the amino compound is dodecyl trimethyl ammonium chloride.
6. The method for pre-plating treatment of MLCC according to any of claims 2-5, wherein the method comprises the steps of:
the mass ratio of the anionic surfactant to the cationic surfactant is 1.5-1.
7. The method for pre-plating treatment of an MLCC according to claim 6, wherein:
the mass ratio of the anionic surfactant to the cationic surfactant is 1:2.
8. The method for pre-plating treatment of MLCCs as recited in claim 1, wherein:
the hydrophobic substance is resin.
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| CN202211225685.0A CN115679400B (en) | 2022-10-09 | 2022-10-09 | Processing method before plating of ultra-miniature and high-capacity MLCC |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10021490A1 (en) * | 2000-05-03 | 2001-11-15 | Lin Ching Bin | Micro fabrication of geometric three-dimensional micro structures forms a laminate of a hydrophilic polymer and a hydrophobic resin with structured recesses for electroplating and final separation |
| US20030007314A1 (en) * | 2001-03-26 | 2003-01-09 | Yukio Sanada | Ceramic electronic component and method of producing the same |
| JP2006265673A (en) * | 2005-03-25 | 2006-10-05 | Daicel Chem Ind Ltd | Plated resin formed body |
| JP2008081838A (en) * | 2006-08-28 | 2008-04-10 | Daicel Polymer Ltd | Plated resin-molded body |
| CN101894668A (en) * | 2009-05-18 | 2010-11-24 | 株式会社村田制作所 | Laminated electronic component and manufacture method thereof |
| JP2013125781A (en) * | 2011-12-13 | 2013-06-24 | Elpida Memory Inc | Method of manufacturing semiconductor device |
| JP6611110B1 (en) * | 2019-01-15 | 2019-11-27 | 三菱電機株式会社 | Film formation method |
-
2022
- 2022-10-09 CN CN202211225685.0A patent/CN115679400B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE10021490A1 (en) * | 2000-05-03 | 2001-11-15 | Lin Ching Bin | Micro fabrication of geometric three-dimensional micro structures forms a laminate of a hydrophilic polymer and a hydrophobic resin with structured recesses for electroplating and final separation |
| US20030007314A1 (en) * | 2001-03-26 | 2003-01-09 | Yukio Sanada | Ceramic electronic component and method of producing the same |
| JP2006265673A (en) * | 2005-03-25 | 2006-10-05 | Daicel Chem Ind Ltd | Plated resin formed body |
| JP2008081838A (en) * | 2006-08-28 | 2008-04-10 | Daicel Polymer Ltd | Plated resin-molded body |
| CN101894668A (en) * | 2009-05-18 | 2010-11-24 | 株式会社村田制作所 | Laminated electronic component and manufacture method thereof |
| JP2013125781A (en) * | 2011-12-13 | 2013-06-24 | Elpida Memory Inc | Method of manufacturing semiconductor device |
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