CN115673558A - Composite laser system, paint removing method using composite laser system and application - Google Patents
Composite laser system, paint removing method using composite laser system and application Download PDFInfo
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- CN115673558A CN115673558A CN202211411935.XA CN202211411935A CN115673558A CN 115673558 A CN115673558 A CN 115673558A CN 202211411935 A CN202211411935 A CN 202211411935A CN 115673558 A CN115673558 A CN 115673558A
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Abstract
The invention discloses a composite laser system, a method for removing paint by using the composite laser system and application. Relates to the technical field of laser. A composite laser system comprising a fiber laser and a semiconductor laser; wherein the wavelength of the fiber laser is greater than the wavelength of the semiconductor laser; wherein, the difference between the focal length of the optical fiber laser and the focal length of the semiconductor laser is 20-30mm. Under the cooperation of the optical fiber laser and the semiconductor laser, residual laser grains do not exist on the surface of the workpiece after paint stripping even if the surface is amplified by 100 times, which shows that the device of the invention does not damage the substrate of the workpiece.
Description
Technical Field
The invention relates to the technical field of laser, in particular to a composite laser system, a method for removing paint by using the composite laser system and application.
Background
The traditional enameled wire peeling modes comprise chemical paint removal, flame paint removal, mechanical paint removal and the like, and the modes have the problems of wire damage, unclean removal, environmental pollution and the like. The laser paint removal method is characterized in that high-energy-density laser is irradiated to a specified position (such as a welding area) of an enameled wire, and an insulating layer on the surface of the enameled wire absorbs energy and gasifies to expose copper materials. The laser processing has the advantages of no material consumption, non-contact, flexible operation and the like, and is convenient for realizing automation.
CO is used for laser stripping of the common flat enameled wire at present 2 Lasers and short pulse fiber lasers (MOPA lasers). Wherein CO with a wavelength of 9200nm-10600nm is used 2 When the laser is used for stripping paint, because the copper substrate has extremely low light absorptivity at the wavelength and even basically does not absorb the light, CO is adopted 2 The light source can be peeled without damaging the base material, and the surface of the peeled base material presents a smooth bright surface. However, a dense insulating film may be attached to the copper substrate after peeling, and a nonconducting state may occur when the peeled surface is tested by a test pencil. In addition, CO 2 Lasers are limited by their wavelength and are difficult to transmit through optical fibers, which poses certain difficulties for industrial applications. The copper is stripped by using an MOPA laser with the wavelength of 1060-1080nm, the near infrared light absorption rate of copper is higher than that of far infrared light, a small amount of damage can be caused to a copper substrate when the insulating paint is ablated and stripped, and the stripped surface is a rough surface. After stripping, the copper is exposed and oxidized, and the end part presents certain color difference. In addition, the MOPA laser has a small focusing spot, and when the energy density is higher than the ablation threshold of the insulating paint, the insulating paint can form a plasma (highly ionized unstable gas) which expands sharply after absorbing a large amount of energy, so that shock waves are generated, and the shock waves enable the paint layer to be broken into fragments and removed. Meanwhile, as the MOPA laser energy is higher than the ablation threshold of the insulating paint and is also higher than the ablation threshold of the copper substrate, shock waves can be formed to damage the substrate to a certain degree.
Therefore, a new laser and a method for removing the paint are needed to solve the above problems.
Disclosure of Invention
The first technical problem to be solved by the invention is as follows:
a composite laser system is provided.
The second technical problem to be solved by the invention is:
a method of stripping paint with the composite laser system is provided.
The third technical problem to be solved by the invention is:
use of the composite laser system.
In order to solve the first technical problem, the invention adopts the technical scheme that:
a composite laser system comprising a fibre laser and a semiconductor laser;
wherein the wavelength of the fiber laser is greater than the wavelength of the semiconductor laser;
and the difference between the focal length of the optical fiber laser and the focal length of the semiconductor laser is 20-30mm.
According to the embodiment of the invention, one of the technical solutions has at least one of the following advantages or beneficial effects:
1. in the actual operation of the composite laser system, a semiconductor laser beam emitted by a semiconductor laser firstly acts on the surface of a workpiece to play a role in preheating and slow cooling; the laser beam emitted by the fiber laser acts on the surface of the workpiece to strip paint. Specifically, the semiconductor laser is output as heat conduction, so that the paint layer to be peeled expands rapidly after absorbing energy to form thermal expansion pressure, thereby reducing the bonding force with the insulating paint layer and generating gasification and plasma cloud. When the fiber laser outputs high-energy pulse beams, the paint layer is broken into fragments by the generated vibration shock waves and removed. Under the cooperation of the two, the surface of the workpiece after paint stripping has no residual laser lines even if the surface is amplified by 100 times, which shows that the device of the invention does not damage the substrate of the workpiece.
2. In the composite laser system of the present invention, the focal length of the fiber laser is different from the focal length of the semiconductor laser by 20-30mm, preferably 25mm. According to the invention, the effect of one laser beam on the copper material is weakened in a defocusing mode, and secondary damage caused by the simultaneous action of the two laser beams on the processing surface is avoided. Due to the adoption of the light beam fitting mode, when the composite laser system is actually used, paint removal can be ensured, and adverse effects caused by overlapping are avoided.
The composite laser system comprises a fiber laser and a semiconductor laser, wherein the wavelength of the fiber laser is larger than that of the semiconductor laser, and the difference between the focal length of the fiber laser and the focal length of the semiconductor laser is 20-30mm. When the device is used, under the action of double beams, the laser of the fiber laser can reach the ablation threshold of the preheated insulating paint layer with smaller energy, so that the base material is protected from being damaged, the paint stripping efficiency is improved, and the energy consumption in industrial application is reduced.
According to an embodiment of the invention, the composite laser system further comprises a collimation system and a tailored scanning focusing system. And the special scanning focusing system controls the difference between the focal length of the optical fiber laser and the focal length of the semiconductor laser to be 20-30mm.
According to one embodiment of the invention, the wavelength of the optical fiber laser is 1060-1080nm; the wavelength of the semiconductor laser is 900-915nm.
According to one embodiment of the invention, the fiber laser comprises a short pulse fiber laser (MOPA).
In order to solve the second technical problem, the invention adopts the technical scheme that:
a method of stripping paint from said composite laser system comprising the steps of:
adjusting the composite laser system to enable the difference between the focal length of the optical fiber laser and the focal length of the semiconductor laser to be 20-30mm;
and applying the laser of the semiconductor laser to the surface of the workpiece, and then applying the laser of the optical fiber laser to the surface of the workpiece.
According to one embodiment of the present invention, the composite laser system has a percentage of pulse power of 80% or greater. When the pulse power is greater than or equal to 80%, paint can not be left on the surface of the workpiece after being stripped by the composite laser system.
According to one embodiment of the invention, the pulse defocus of the composite laser system is 0mm. The pulse defocusing amount is limited by 0 defocusing, the focal length of the semiconductor laser is close to 0 due to the pulse positive defocusing, and the copper surface is blackened due to excessive heat; when the pulse is negative through focus, the paint layer will appear cyan, since the energy is not sufficient to vaporize the paint. The difference between the focal length of the optical fiber laser and the focal length of the semiconductor laser is 20-30mm, so the size of the pulse defocusing amount of the composite laser system needs to take the focal length difference into consideration.
According to one embodiment of the invention, the composite laser system is used with a stage speed of workpiece transport of 5mm/s or less. When the feeding speed of the platform is higher than 5mm/s, a layer of film-like residues can be left on the surface of the workpiece after the paint is stripped by the composite laser system, so that the paint stripping effect is greatly reduced.
According to one embodiment of the invention, the scanning speed of the composite laser system is 8000mm/s or more when the system is in use. When the scanning speed is lower than 8000mm/s, obvious chromatic aberration is generated on the surface of the workpiece after the composite laser system is stripped.
According to one embodiment of the present invention, the pulse frequency of the composite laser system is 20-30KHz.
In another aspect, the invention also relates to the use of the composite laser system for paint removal. Comprising a composite laser system as described in the embodiment of aspect 1 above. Since the application adopts all technical solutions of the composite laser system, at least all the advantages brought by the technical solutions of the above embodiments are achieved.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic diagram of an apparatus of a composite laser system according to embodiments 1 to 6;
FIG. 2 is a schematic diagram of the focal length setting of the composite laser system of examples 1-6;
FIG. 3 is a schematic diagram of the composite laser system of examples 1-6 during paint removal;
FIG. 4 is a surface view of a copper workpiece treated by the apparatus and method of example 1;
FIG. 5 is an enlarged view of the surface of a copper workpiece treated by the apparatus and method of example 1;
FIG. 6 is an enlarged view of the surface of a copper workpiece treated by the apparatus and method of example 2;
FIG. 7 is an enlarged view of the surface of a copper workpiece treated by the apparatus and method of example 3;
FIG. 8 is an enlarged view of the surface of a copper workpiece treated by the apparatus and method of example 4;
FIG. 9 is an enlarged view of the surface of a copper workpiece treated by the apparatus and method of example 5;
FIG. 10 is an enlarged view of the surface of a copper workpiece treated by the apparatus and method of example 6;
FIG. 11 is an enlarged view of the surface of a copper workpiece treated by the apparatus and method of the comparative example.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the scope of the present invention.
The reagents, methods and equipment adopted by the invention are conventional in the technical field if no special description is given.
Examples 1-6 all include a composite laser system, specifically including a fiber laser and a semiconductor laser;
wherein the wavelength of the fiber laser is greater than the wavelength of the semiconductor laser;
wherein, the focal length of the optical fiber laser is 25mm different from that of the semiconductor laser.
Wherein the wavelength of the optical fiber laser is 1064nm; the wavelength of the semiconductor laser is 915nm.
The optical fiber laser is a short pulse optical fiber laser.
The device schematic diagram of the composite laser system is shown in fig. 1.
Fig. 2 shows a schematic diagram of the focal length setting of the composite laser system.
A method of paint removal using the composite laser system described above, comprising the steps of:
adjusting the composite laser system to enable the focal distance of the optical fiber laser to be 25mm different from the focal distance of the semiconductor laser;
and applying the laser of the semiconductor laser to the surface of the workpiece, and then applying the laser of the optical fiber laser to the surface of the workpiece.
The principle of the composite laser system acting on the surface of the copper workpiece to remove paint in the method for removing paint by using the composite laser system is shown in fig. 3.
Examples 1-6 and the protocol of the comparative example, the workpiece surface was de-painted with reference to the above-described composite laser system de-painting method, and the specific parameters of the de-painting were as shown in table 1.
TABLE 1
The embodiment 2 is different from the embodiment 1 only in that: the fiber lasers vary in pulse power percentage. The percentage of the pulse power of the fiber laser in example 1 was 80%, and the percentage of the pulse power of the fiber laser in example 2 was 70%.
Among them, the embodiment 3 is different from the embodiment 1 only in that: the platform speed is different. Wherein, the platform speed of the embodiment 1 is 5mm/s, and the platform speed of the embodiment 3 is 6mm/s.
Among them, example 4 differs from example 1 only in that: the scanning speed is different. Wherein, the scanning speed of the embodiment 1 is 6000mm/s, and the scanning speed of the embodiment 4 is 8000mm/s.
Among them, the embodiment 5 is different from the embodiment 1 only in that: the pulse defocuses differently. The pulse defocus amount of example 1 is 0mm, and the pulse defocus amount of example 5 is 1mm.
Among them, example 6 differs from example 1 only in that: the defocusing amount of the pulse is different. Wherein, the pulse defocusing amount of the embodiment 1 is 0mm, and the pulse defocusing amount of the embodiment 5 is-1 mm.
The comparative example differs from example 1 only in that: the device of the comparative example, did not include a semiconductor laser.
And (4) performance testing:
the surface of the copper workpiece treated by the apparatus of example 1 and the above-described method was observed, and as shown in FIG. 4, it was found that the surface of the copper workpiece was not damaged at all. Further, as shown in fig. 5, when the cross-sectional effect was observed under an optical microscope at a magnification of 100 times, it was found that the surface damage to the copper work was extremely small.
The surface of the copper workpiece treated by the apparatus of example 2 and the above method was observed, and as shown in fig. 6, the cross-sectional effect was observed under an optical microscope at a magnification of 100 times, and it was found that clear paint residue remained on the surface of the copper workpiece after stripping.
The surface of the copper workpiece treated by the apparatus of example 3 and the method described above was observed, and the cross-sectional effect was observed under an optical microscope at a magnification of 100 times as shown in fig. 7, and it was found that a film-like residue was formed on the surface of the copper workpiece after stripping.
The surface of the copper workpiece treated by the apparatus of example 4 and the method described above was observed, and as shown in fig. 8, the effect of the cross section was observed under an optical microscope at a magnification of 100 times, and it was found that the copper surface had a significant color difference.
The surface of the copper workpiece treated by the apparatus of example 5 and the above method was observed, as shown in fig. 9, and the effect of the cross section was observed under an optical microscope at a magnification of 100 times, and it was found that the pulse was out of focus, which resulted in excessive heat and blackened copper surface.
When the surface of the copper workpiece treated by the apparatus of example 6 and the method described above is observed and the cross-sectional effect is observed under an optical microscope at a magnification of 100 times, as shown in fig. 10, it is found that when the pulse negative defocus is applied, the paint layer will appear cyan due to insufficient energy to vaporize the paint.
The surface of the copper workpiece treated by the device of the comparative example and the method is observed, as shown in fig. 11, the cross section effect is observed under the condition that the magnification of an optical microscope is 100 times, and the residual laser grains on the surface of the copper workpiece can be clearly seen after the paint is stripped by a single MOPA laser, so that the substrate is damaged to a certain extent.
The above description is only an example of the present invention and is not intended to limit the scope of the present invention, and all equivalent modifications made by the present invention in the specification or the related technical fields, which are directly or indirectly applied, are included in the scope of the present invention.
Claims (10)
1. A composite laser system, characterized by: the device comprises a fiber laser and a semiconductor laser;
wherein the wavelength of the fiber laser is greater than the wavelength of the semiconductor laser;
wherein the difference between the focal length of the optical fiber laser and the focal length of the semiconductor laser is 20-30mm.
2. The composite laser system of claim 1, wherein: the composite laser system also includes a collimation system and a tailored scanning focusing system.
3. The composite laser system of claim 1, wherein: the wavelength of the optical fiber laser is 1060-1080nm; the wavelength of the semiconductor laser is 900-915nm.
4. A method of depainting with a composite laser system as claimed in any one of claims 1 to 3, characterized in that: the method comprises the following steps:
adjusting the composite laser system to enable the difference between the focal length of the optical fiber laser and the focal length of the semiconductor laser to be 20-30mm;
and applying the laser of the semiconductor laser to the surface of the workpiece, and then applying the laser of the optical fiber laser to the surface of the workpiece.
5. The method of claim 4, wherein: the composite laser system has a pulse power percentage greater than or equal to 80%.
6. The method of claim 4, wherein: the pulse defocusing amount of the composite laser system is 0mm.
7. The method of claim 4, wherein: when the composite laser system is used, the speed of a platform for conveying workpieces is less than or equal to 5mm/s.
8. The method of claim 4, wherein: the scanning speed of the composite laser system is more than or equal to 8000mm/s.
9. The method of claim 4, wherein: the pulse frequency of the composite laser system is 20-30KHz.
10. Use of a composite laser system as claimed in any one of claims 1 to 3 in paint removal.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211411935.XA CN115673558A (en) | 2022-11-11 | 2022-11-11 | Composite laser system, paint removing method using composite laser system and application |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211411935.XA CN115673558A (en) | 2022-11-11 | 2022-11-11 | Composite laser system, paint removing method using composite laser system and application |
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| CN115673558A true CN115673558A (en) | 2023-02-03 |
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| CN202211411935.XA Pending CN115673558A (en) | 2022-11-11 | 2022-11-11 | Composite laser system, paint removing method using composite laser system and application |
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