CN115672769A

CN115672769A - Detection device for automatically positioning and adsorbing silicon wafer and use method

Info

Publication number: CN115672769A
Application number: CN202211425335.9A
Authority: CN
Inventors: 徐新华
Original assignee: Hangzhou Semiconductor Wafer Co Ltd
Current assignee: Hangzhou Semiconductor Wafer Co Ltd
Priority date: 2022-11-14
Filing date: 2022-11-14
Publication date: 2023-02-03

Abstract

The invention discloses a detection device for automatically positioning and adsorbing a silicon wafer, which relates to the technical field of silicon wafer processing equipment and comprises a workbench, wherein a detection round platform is distributed on the workbench, a plurality of groups of bearing grooves for bearing the silicon wafer are formed in the detection round platform in a circumferential array, the detection round platform is fixedly connected with the output end of a first motor distributed at the bottom of the workbench, and a gluing device and a detection device are also distributed on one side of the detection round platform; the silicon wafer detection device is characterized by further comprising a feeding conveying mechanism and a feeding assembly, wherein the feeding conveying mechanism is arranged on one side of the workbench and used for conveying a silicon wafer to a feeding end on one side of the detection circular truncated cone, and the feeding assembly is used for adsorbing the silicon wafer conveyed to the feeding end and then transferring the silicon wafer to the bearing groove; the silicon wafer blanking device is provided with the clamping mechanism to be in contact with the side end of the silicon wafer, and is not in direct contact with the surface of the silicon wafer, so that glue solution on the surface of the silicon wafer is not influenced in the blanking process.

Description

Detection device for automatically positioning and adsorbing silicon wafer and use method

Technical Field

The invention relates to the technical field of silicon wafer processing equipment, in particular to a detection device for automatically positioning and adsorbing a silicon wafer and a using method thereof.

Background

In the semiconductor industry, a general photolithography process includes steps of cleaning and drying a silicon wafer surface, priming, photoresist coating, soft baking, alignment exposure, post-baking, developing, hard baking, etching and the like. The photolithography process is a process of spreading photoresist on the surface of a silicon wafer and then transferring the pattern on the mask onto the photoresist (i.e., a process of temporarily "copying" a device or a circuit structure onto the silicon wafer).

In the prior art, the silicon wafer after being glued is generally required to be detected, and the glue solution on the surface of the silicon wafer after being glued can be completely dried within a certain time, so that the gluing effect of the silicon wafer is easily influenced if the vacuum suction mechanical arm is adopted for directly adsorbing.

Disclosure of Invention

The invention aims to provide a detection device for automatically positioning and adsorbing a silicon wafer and a using method thereof, and solves the following technical problems:

for the glued silicon wafer, the glue solution on the surface of the glued silicon wafer can be completely dried within a certain time, so that the gluing effect of the silicon wafer is easily influenced if the vacuum material suction mechanical arm is adopted for direct adsorption.

The purpose of the invention can be realized by the following technical scheme:

a detection device for automatically positioning and adsorbing a silicon wafer comprises a workbench, wherein a detection round platform is distributed on the workbench, a plurality of groups of bearing grooves for bearing the silicon wafer are formed in the detection round platform in a circumferential array, the detection round platform is fixedly connected with the output end of a first motor distributed at the bottom of the workbench, and gluing equipment and detection equipment are further distributed on one side of the detection round platform;

the silicon wafer detection device is characterized by further comprising a feeding conveying mechanism and a feeding assembly, wherein the feeding conveying mechanism is arranged on one side of the workbench and used for conveying a silicon wafer to a feeding end on one side of the detection circular truncated cone, and the feeding assembly is used for adsorbing the silicon wafer conveyed to the feeding end and then transferring the silicon wafer to the bearing groove;

still include unloading conveying mechanism and unloading subassembly, unloading conveying mechanism lays in workstation one side, and unloading conveying mechanism and material loading conveying mechanism are the degree and lay perpendicularly for carry away the silicon chip after will detecting, the unloading subassembly is used for transporting the silicon chip after detecting in the bearing groove to unloading conveying mechanism on.

Preferably, a transfer bracket is distributed on one side of the detection circular table, a U-shaped frame is distributed among the transfer brackets, a balance wheel is rotationally distributed in the U-shaped frame, and the balance wheel is fixedly connected with the output end of a second motor distributed on the transfer bracket;

the end face of the balance wheel is respectively provided with a first supporting rod fixedly connected with the feeding assembly and a second supporting rod fixedly connected with the discharging assembly, and the first supporting rod and the second supporting rod are vertically arranged in a certain degree.

Preferably, the feeding assembly comprises a first support fixedly connected with the first support rod, a first air cylinder is arranged in the first support, and the first air cylinder is fixedly connected with the first L-shaped positioning plate;

the bottom of the first L-shaped positioning plate is connected with the negative pressure end head through a pipeline, and the other end of the pipeline is connected with vacuum equipment.

Preferably, the blanking assembly comprises a second support fixedly connected with the second support rod, a second cylinder is arranged in the second support, and the second cylinder is fixedly connected with the second L-shaped positioning plate;

and a clamping mechanism for fixing the silicon wafer is arranged at the bottom of the second L-shaped positioning plate.

Preferably, the clamping mechanism comprises a third motor arranged on the second L-shaped positioning plate, the output end of the third motor is fixedly connected with the turntable, a plurality of arc-shaped grooves are circumferentially arranged on the turntable in an array manner, the arc-shaped grooves extend from the near-center end of the turntable to the far-center end of the turntable, pin shafts are movably embedded in the arc-shaped grooves, the bottom ends of the pin shafts are fixedly connected with the clamping plate, and the other ends of the pin shafts are fixedly connected with a sliding seat arranged on the guide rod in a sliding manner;

wherein, the second L type locating plate is laid multiunit limiting plate towards the carousel direction, and guide arm and limiting plate fixed connection still are equipped with the reset spring with slide fixed connection on the guide arm.

Preferably, the device also comprises a jacking assembly, wherein the jacking assembly comprises a T-shaped through groove arranged in the bearing groove, a T-shaped ejector rod is arranged in the T-shaped through groove in a sliding manner, and the T-shaped ejector rod is connected with a lifting mechanism arranged at the bottom of the detection circular truncated cone.

Preferably, the lifting mechanism comprises a rack plate fixedly connected with the T-shaped ejector rod, the rack plate is meshed with a first gear distributed at the bottom of the detection circular truncated cone, and the first gear is fixedly mounted on the rotating shaft;

the end part of the rotating shaft is provided with a first bevel gear, the first bevel gear is meshed with a second bevel gear arranged below the detection round platform in a rotating mode, the bottom end of the second bevel gear is fixedly connected with a second gear, an arc-shaped rack which is meshed with the second gear is arranged on the workbench, the arc-shaped rack extends towards the rotation direction of the detection round platform, and the tail end of the arc-shaped rack is located right below the loading and unloading of the bearing groove.

Preferably, one side of the rack plate is also provided with a reset rod, the reset rod is slidably provided with a movable seat fixedly connected with the rack plate, and the reset rod is also provided with a telescopic spring fixedly connected with the movable seat; through setting up expanding spring to T type ejector pin resets fast.

A use method of a detection device for automatically positioning and adsorbing a silicon wafer comprises the following steps:

firstly, sequentially placing silicon wafers to be glued and detected on a feeding conveying mechanism for conveying;

secondly, when the silicon wafer is conveyed to a feeding end, the silicon wafer is transferred into a bearing groove through a feeding assembly;

step three, starting a first motor, driving the detection circular table to rotate by the first motor, stopping the detection circular table when the group of silicon wafers rotate to the gluing equipment, and gluing the silicon wafers by the gluing equipment;

step four, monitoring the glued silicon wafer by the detection equipment when the glued silicon wafer passes through the detection equipment along with the rotation of the detection circular table;

and fifthly, after the detection is finished, the silicon wafers in the bearing grooves are clamped and then transferred to the blanking conveying mechanism along with the continuous rotation of the detection round platform by the blanking assembly, the blanking conveying mechanism is normally started to convey the silicon wafers out for qualified detection, the blanking conveying mechanism reversely drives the silicon wafers for unqualified detection, the silicon wafers are conveyed to the discharging end, and the unqualified silicon wafers are uniformly collected by the workers.

The invention has the beneficial effects that:

(1) When the silicon wafer is blanked, the clamping mechanism is arranged to contact the side end of the silicon wafer and not to directly contact the surface of the silicon wafer, so that glue solution on the surface of the silicon wafer is not affected in the blanking process;

(2) In the feeding and discharging processes, the second motor drives the feeding assembly to reciprocate between the feeding conveying mechanism and the bearing groove through the first support rod respectively in the process of driving the balance wheel to rotate in a reciprocating mode, synchronously drives the discharging assembly to reciprocate between the discharging conveying mechanism and the bearing groove through the second support rod, and further enables the feeding assembly to transfer the silicon wafer to be glued and detected into the bearing groove again after the silicon wafer detected in the bearing groove is moved out by the discharging assembly.

Drawings

The invention is further described below with reference to the accompanying drawings.

FIG. 1 is a first structural diagram of a detection apparatus for automatically positioning and adsorbing a silicon wafer according to the present invention;

FIG. 2 is a schematic structural diagram II of a detection apparatus for automatically positioning and adsorbing a silicon wafer according to the present invention;

FIG. 3 is a third schematic structural diagram of a detection apparatus for automatically positioning and adsorbing a silicon wafer according to the present invention;

FIG. 4 is a schematic structural diagram of a detection stage in the detection apparatus for automatically positioning and adsorbing a silicon wafer according to the present invention;

FIG. 5 is a schematic structural diagram of a jacking assembly in the inspection device for automatically positioning and adsorbing a silicon wafer according to the present invention;

FIG. 6 is a schematic structural diagram of a feeding assembly in the detection apparatus for automatically positioning and adsorbing the silicon wafer according to the present invention;

FIG. 7 is a schematic structural diagram of a blanking assembly in the detection device for automatically positioning and adsorbing the silicon wafer according to the present invention;

FIG. 8 is a schematic structural diagram of a T-shaped lift pin in the detecting device for automatically positioning and adsorbing a silicon wafer according to the present invention.

In the figure: 1. a work table; 2. gluing equipment; 3. detecting equipment; 4. detecting the circular truncated cone; 5. a feeding conveyor mechanism; 6. a transfer scaffold; 7. a feeding assembly; 8. a blanking assembly; 9. a blanking conveying mechanism; 101. an arc-shaped rack; 401. a first motor; 402. a T-shaped through groove; 403. a bearing groove; 404. a T-shaped ejector rod; 405. a rack plate; 406. a first gear; 407. a rotating shaft; 408. a first bevel gear; 409. a second bevel gear; 410. a second gear; 411. a tension spring; 412. a reset lever; 601. a U-shaped frame; 602. a second motor; 603. a balance wheel; 701. a first support bar; 702. a first support; 703. a first cylinder; 704. a first L-shaped positioning plate; 705. a pipeline; 706. a negative pressure end; 801. a second support bar; 802. a second cylinder; 803. a second support; 804. a second L-shaped positioning plate; 805. a third motor; 806. a turntable; 807. an arc-shaped slot; 808. a clamping plate; 809. a pin shaft; 810. a slide base; 811. a guide bar; 812. a limiting plate; 813. a return spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the invention relates to a detection device for automatically positioning and adsorbing a silicon wafer, which comprises a workbench 1, wherein a detection circular table 4 is distributed on the workbench 1, a plurality of groups of bearing grooves 403 for bearing the silicon wafer are arranged on the detection circular table 4 in a circumferential array, the detection circular table 4 is fixedly connected with an output end of a first motor 401 distributed at the bottom of the workbench 1, a gluing device 2 and a detection device 3 are further distributed on one side of the detection circular table 4, the gluing device 2 is used for gluing the silicon wafer in the bearing groove 403, and the detection device 3 is used for detecting the glued silicon wafer; in an embodiment of the present invention, the gluing device 2 and the detecting device 3 are sequentially arranged at the rear end of the rotation direction of the detecting circular table 4, so that the silicon wafers in the bearing groove 403 can sequentially pass through the gluing device 2 and the detecting device 3;

the silicon wafer detection device is characterized by further comprising a feeding conveying mechanism 5 and a feeding assembly 7, wherein the feeding conveying mechanism 5 is arranged on one side of the workbench 1 and used for conveying a silicon wafer to a feeding end on one side of the detection circular truncated cone 4, and the feeding assembly 7 is used for adsorbing the silicon wafer conveyed to the feeding end and then transferring the silicon wafer to the bearing groove 403;

the silicon wafer detection device is characterized by further comprising a blanking conveying mechanism 9 and a blanking assembly 8, wherein the blanking conveying mechanism 9 is arranged on one side of the workbench 1, the blanking conveying mechanism 9 and the feeding conveying mechanism 5 are vertically arranged at an angle of 90 degrees and used for conveying out detected silicon wafers, and the blanking assembly 8 is used for transferring the detected silicon wafers in the bearing groove 403 to the blanking conveying mechanism 9; in one embodiment of the invention, firstly, silicon wafers to be glued and detected are sequentially placed on a feeding conveying mechanism 5 to be conveyed, when the silicon wafers are conveyed to a feeding end, the silicon wafers are conveyed into a bearing groove 403 through a feeding assembly 7, a first motor 401 is started, the first motor 401 drives a detection circular platform 4 to rotate, when the group of silicon wafers rotate to a gluing device 2, the detection circular platform 4 stops rotating, the silicon wafers are glued through the gluing device 2, the silicon wafers rotate along with the detection circular platform 4, when the glued silicon wafers pass through the detection device 3, the glued silicon wafers are monitored through the detection device 3, after detection is finished, the detection circular platform 4 continues to rotate, a blanking assembly 8 clamps the silicon wafers in the bearing groove and then conveys the silicon wafers to a blanking conveying mechanism 9, for qualified silicon wafers, the blanking conveying mechanism 9 is normally started to convey the silicon wafers 403, for unqualified silicon wafers detected silicon wafers, the blanking conveying mechanism 9 reversely transmits the silicon wafers to a discharging end, and a worker uniformly collects the unqualified silicon wafers;

referring to fig. 4, a transfer bracket 6 is disposed on one side of the detection circular table 4, a U-shaped frame 601 is disposed between the transfer brackets 6, a balance wheel 603 is rotatably disposed in the U-shaped frame 601, and the balance wheel 603 is fixedly connected to an output end of a second motor 602 disposed on the transfer bracket 6;

the end face of the balance wheel 603 is respectively provided with a first supporting rod 701 fixedly connected with the feeding assembly 7 and a second supporting rod 801 fixedly connected with the discharging assembly 8, and the first supporting rod 701 and the second supporting rod 801 are vertically arranged at 90 degrees; specifically, in the process of feeding and discharging, the second motor 602 is started, and in the process of driving the balance wheel 603 to rotate in a reciprocating manner, the second motor 602 drives the feeding assembly 7 to move in a reciprocating manner between the feeding conveying mechanism 5 and the carrying groove 403 through the first support rod 701 respectively, and synchronously drives the discharging assembly 8 to move in a reciprocating manner between the discharging conveying mechanism 9 and the carrying groove 403 through the second support rod 801, so that after the discharging assembly 8 moves out the silicon wafer detected in the carrying groove 403, the silicon wafer to be glued and detected is moved into the carrying groove 403 again by the feeding assembly 7;

referring to fig. 5, the feeding assembly 7 includes a first support 702 fixedly connected to the first support 701, a first cylinder 703 is disposed in the first support 702, and the first cylinder 703 is fixedly connected to a first L-shaped positioning plate 704;

the bottom of the first L-shaped positioning plate 704 is connected with a negative pressure end 706 through a pipeline 705, and the other end of the pipeline 705 is connected with vacuum equipment; in the process of transferring the silicon wafer from the feeding conveying mechanism 5 to the carrying groove 403, the first L-shaped positioning plate 704 is driven by the first air cylinder 703 to move downwards, so that the negative pressure end 706 is tightly attached to the silicon wafer, the vacuum equipment is started, the vacuum equipment generates vacuum negative pressure at the negative pressure end 706 through the pipeline 705, the silicon wafer can be adsorbed and fixed, the second motor 602 transfers the first support rod 701 to the carrying groove 403 through the balance wheel 603, and the vacuum equipment is closed, so that the silicon wafer is separated from the negative pressure end 706 and falls into the carrying groove 403;

referring to fig. 6, the blanking assembly 8 includes a second support 803 fixedly connected to the second support rod 801, a second cylinder 802 is disposed in the second support 803, and the second cylinder 802 is fixedly connected to a second L-shaped positioning plate 804;

the bottom of the second L-shaped positioning plate 804 is provided with a clamping mechanism for fixing a silicon wafer; in the process of transferring the silicon wafer from the bearing groove 403 to the blanking conveying mechanism 9, firstly, the side end of the silicon wafer is clamped and fixed by the clamping mechanism, then the second motor 602 transfers the second support rod 801 to the blanking conveying mechanism 9 through the balance wheel 603, and then the silicon wafer is placed on the blanking conveying mechanism 9;

the clamping mechanism comprises a third motor 805 arranged on the second L-shaped positioning plate 804, the output end of the third motor 805 is fixedly connected with a turntable 806, a plurality of arc-shaped grooves 807 are circumferentially arranged on the turntable 806 in an array manner, the arc-shaped grooves 807 extend from the near-center end of the turntable 806 to the far-center end direction, pin shafts 809 are movably embedded in the arc-shaped grooves 807, the bottom ends of the pin shafts 809 are fixedly connected with a clamping plate 808, and the other ends of the pin shafts 809 are fixedly connected with a sliding seat 810 arranged on a guide rod 811 in a sliding manner;

wherein, a plurality of groups of limiting plates 812 are arranged on the second L-shaped positioning plate 804 towards the direction of the rotating disc 806, the guide rod 811 is fixedly connected with the limiting plates 812, and the guide rod 811 is further provided with a return spring 813 fixedly connected with the sliding seat 810; when the silicon wafer is clamped, firstly, the clamping plate 808 is driven to be positioned on the periphery of the silicon wafer, the third motor 805 is started, the third motor 805 drives the rotating disc 806 to rotate in the rotating process, the pin shaft 809 moves from the far end to the near end in the arc-shaped groove 807 in the rotating process of the rotating disc 806, then the silicon wafer is clamped and fixed through the clamping plate 808, at the moment, the reset spring 813 contracts to generate elastic force, and when the silicon wafer is disassembled, the third motor 805 rotates reversely;

referring to fig. 7, the device further includes a jacking assembly, the jacking assembly includes a T-shaped through groove 402 provided in a bearing groove 403, a T-shaped push rod 404 is slidably disposed in the T-shaped through groove 402, and the T-shaped push rod 404 is connected to a lifting mechanism disposed at the bottom of the detection circular table 4; specifically, in the feeding and blanking process, in order to facilitate the attachment of the clamping plate 808 to the side surface of the silicon wafer, when the bearing groove 403 rotates to the feeding and blanking direction, the T-shaped ejector rod 404 is jacked up through the lifting mechanism, so that the silicon wafer is jacked up to a height difference with the detection circular table 4, and the clamping plate 808 and the outer end surface of the silicon wafer are attached and fixed;

referring to fig. 8, the lifting mechanism includes a rack plate 405 fixedly connected to the T-shaped lift rod 404, the rack plate 405 is engaged with a first gear 406 disposed at the bottom of the detection circular table 4, and the first gear 406 is fixedly mounted on a rotating shaft 407;

the end part of the rotating shaft 407 is provided with a first bevel gear 408, the first bevel gear 408 is meshed with a second bevel gear 409 which is rotatably arranged below the detection round platform 4, the bottom end of the second bevel gear 409 is fixedly connected with a second gear 410, the workbench 1 is provided with an arc-shaped rack 101 which is meshed with the second gear 410, the arc-shaped rack 101 extends towards the rotating direction of the detection round platform 4, and the tail end of the arc-shaped rack 101 is positioned right below the loading and unloading of the bearing groove 403; in an embodiment of the invention, with the rotation of the detection circular truncated cone 4, when the bearing groove 403 is about to rotate to the feeding and discharging ends, the second gear 410 drives the second bevel gear 409 to rotate by being meshed with the arc-shaped rack 101, the second bevel gear 409 drives the first gear 406 to rotate by being meshed with the first bevel gear 408, the first gear 406 drives the T-shaped ejector rod 404 to lift by being meshed with the rack plate 405, so that a silicon wafer is ejected, after the feeding and discharging are completed, the subsequent second gear 410 is not meshed with the arc-shaped rack 101 due to the length limitation of the arc-shaped rack 101, so that the rack plate 405 moves downwards to drive the T-shaped ejector rod 404 to reset;

further, a reset rod 412 is further arranged on one side of the rack plate 405, a movable seat fixedly connected with the rack plate 405 is slidably arranged on the reset rod 412, and a telescopic spring 411 fixedly connected with the movable seat is further arranged on the reset rod 412; by arranging the telescopic spring 411, the T-shaped ejector rod 404 can be reset quickly.

Example 2

firstly, placing silicon wafers to be glued and detected on a feeding conveying mechanism 5 in sequence for conveying;

secondly, when the silicon wafer is conveyed to a feeding end, the silicon wafer is transferred into a bearing groove 403 through a feeding assembly 7;

step three, starting a first motor 401, driving a detection circular table 4 to rotate by the first motor 401, stopping the detection circular table 4 when the group of silicon wafers rotate to the gluing equipment 2, and gluing the silicon wafers by the gluing equipment 2;

step four, along with the rotation of the detection circular truncated cone 4, when the glued silicon wafer passes through the detection equipment 3, the glued silicon wafer is monitored through the detection equipment 3;

after the detection is finished, the blanking assembly 8 clamps the silicon wafers in the bearing groove 403 and transfers the silicon wafers to the blanking conveying mechanism 9 along with the continuous rotation of the detection circular truncated cone 4, the blanking conveying mechanism 9 is normally started to convey the silicon wafers out for the silicon wafers qualified for detection, the blanking conveying mechanism 9 reversely transmits the silicon wafers unqualified for detection, the silicon wafers are conveyed to the discharging end, and the unqualified silicon wafers are uniformly collected by the worker.

In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation and a specific orientation configuration and operation, and thus, should not be construed as limiting the present invention. Furthermore, "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate a number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, the meaning of "a plurality" is two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate member, or they may be connected through two or more elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention and should not be taken as limiting the scope of the invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.

Claims

1. A detection device for automatically positioning and adsorbing a silicon wafer comprises a workbench (1) and is characterized in that a detection circular table (4) is distributed on the workbench (1), a plurality of groups of bearing grooves (403) used for bearing the silicon wafer are formed in the detection circular table (4) in a circumferential array, the detection circular table (4) is fixedly connected with the output end of a first motor (401) distributed at the bottom of the workbench (1), and a gluing device (2) and a detection device (3) are further distributed on one side of the detection circular table (4);

the silicon wafer detection device is characterized by further comprising a feeding conveying mechanism (5) and a feeding assembly (7), wherein the feeding conveying mechanism (5) is arranged on one side of the workbench (1) and used for conveying a silicon wafer to a feeding end on one side of the detection circular truncated cone (4), and the feeding assembly (7) is used for adsorbing the silicon wafer conveyed to the feeding end and then transferring the silicon wafer to the bearing groove (403);

still include unloading conveying mechanism (9) and unloading subassembly (8), unloading conveying mechanism (9) are laid in workstation (1) one side, and unloading conveying mechanism (9) are (90) degree with material loading conveying mechanism (5) and lay perpendicularly for carry away the silicon chip after detecting, unloading subassembly (8) are used for transporting the silicon chip after detecting in bearing groove (403) to unloading conveying mechanism (9) on.

2. The device for automatically positioning and adsorbing the silicon wafer according to claim 1, wherein a transfer bracket (6) is arranged on one side of the detection circular table (4), a U-shaped frame (601) is arranged between the transfer brackets (6), a balance wheel (603) is rotatably arranged in the U-shaped frame (601), and the balance wheel (603) is fixedly connected with the output end of a second motor (602) arranged on the transfer bracket (6);

the end face of the balance wheel (603) is respectively provided with a first support rod (701) fixedly connected with the feeding assembly (7) and a second support rod (801) fixedly connected with the discharging assembly (8), and the first support rod (701) and the second support rod (801) are vertically arranged at an angle of 90 degrees.

3. The detection device for automatically positioning and adsorbing the silicon wafer according to claim 2, wherein the feeding assembly (7) comprises a first support (702) fixedly connected with the first support rod (701), a first air cylinder (703) is arranged in the first support (702), and the first air cylinder (703) is fixedly connected with the first L-shaped positioning plate (704);

the bottom of the first L-shaped positioning plate (704) is connected with a negative pressure end head (706) through a pipeline (705), and the other end of the pipeline (705) is connected with vacuum equipment.

4. The detection device for automatically positioning and adsorbing the silicon wafer according to claim 3, wherein the blanking assembly (8) comprises a second support (803) fixedly connected with the second support rod (801), a second cylinder (802) is arranged in the second support (803), and the second cylinder (802) is fixedly connected with a second L-shaped positioning plate (804);

and a clamping mechanism used for fixing the silicon wafer is arranged at the bottom of the second L-shaped positioning plate (804).

5. The detection device for automatically positioning and adsorbing the silicon wafer as claimed in claim 4, wherein the clamping mechanism comprises a third motor (805) arranged on the second L-shaped positioning plate (804), the output end of the third motor (805) is fixedly connected with a turntable (806), a plurality of arc-shaped grooves (807) are circumferentially arranged on the turntable (806) in an array manner, the arc-shaped grooves (807) extend from the proximal end of the turntable (806) to the distal end, pin shafts (809) are movably embedded in the arc-shaped grooves (807), the bottom ends of the pin shafts (809) are fixedly connected with a clamping plate (808), and the other ends of the pin shafts (809) are fixedly connected with a sliding seat (810) arranged on a guide rod (811) in a sliding manner;

wherein, the second L-shaped locating plate (804) is provided with a plurality of groups of limiting plates (812) towards the direction of the rotating disc (806), the guide rod (811) is fixedly connected with the limiting plates (812), and the guide rod (811) is also provided with a return spring (813) fixedly connected with the sliding base (810).

6. The automatic detection device for positioning and adsorbing the silicon wafer as claimed in claim 5, further comprising a jacking assembly, wherein the jacking assembly comprises a T-shaped through groove (402) arranged in the bearing groove (403), a T-shaped ejector rod (404) is arranged in the T-shaped through groove (402) in a sliding manner, and the T-shaped ejector rod (404) is connected with a lifting mechanism arranged at the bottom of the detection round table (4).

7. The automatic silicon wafer positioning and adsorbing detection device as claimed in claim 6, wherein the lifting mechanism comprises a rack plate (405) fixedly connected with the T-shaped ejector rod (404), the rack plate (405) is meshed with a first gear (406) arranged at the bottom of the detection circular table (4), and the first gear (406) is fixedly arranged on a rotating shaft (407);

the end of the rotating shaft (407) is provided with a first bevel gear (408), the first bevel gear (408) is meshed with a second bevel gear (409) which is arranged below the detection round platform (4) in a rotating mode, the bottom end of the second bevel gear (409) is fixedly connected with a second gear (410), an arc-shaped rack (101) which is meshed with the second gear (410) is arranged on the workbench (1), the arc-shaped rack (101) extends towards the rotating direction of the detection round platform (4), and the tail end of the arc-shaped rack (101) is located right below the loading and unloading of the bearing groove (403).

8. The automatic silicon wafer positioning and adsorbing detection device as claimed in claim 7, wherein a reset rod (412) is further disposed on one side of the rack plate (405), a movable seat fixedly connected with the rack plate (405) is slidably disposed on the reset rod (412), and a telescopic spring (411) fixedly connected with the movable seat is further disposed on the reset rod (412); through setting up expanding spring (411), so that T type ejector pin (404) resets fast.

9. A use method of a detection device for automatically positioning and adsorbing a silicon wafer is characterized by comprising the following steps:

firstly, placing silicon wafers to be glued and detected on a feeding conveying mechanism (5) in sequence for conveying;

secondly, when the silicon wafer is conveyed to a feeding end, the silicon wafer is transferred into a bearing groove (403) through a feeding assembly (7);

step three, a first motor (401) is started, the first motor (401) drives a detection circular table (4) to rotate, when the group of silicon wafers rotate to the gluing equipment (2), the detection circular table (4) stops rotating, and gluing treatment is carried out on the silicon wafers through the gluing equipment (2);

with the rotation of the detection circular truncated cone (4), monitoring the glued silicon wafer through the detection equipment (3) when the glued silicon wafer passes through the detection equipment (3);

and step five, after the detection is finished, the blanking assembly (8) clamps the silicon wafers in the bearing groove (403) and transfers the silicon wafers to the blanking conveying mechanism (9) along with the continuous rotation of the detection circular truncated cone (4), the blanking conveying mechanism (9) is normally started to convey the silicon wafers out for qualified silicon wafers, the blanking conveying mechanism (9) reversely drives the silicon wafers for unqualified silicon wafers, the silicon wafers are conveyed to a discharging end, and the unqualified silicon wafers are uniformly collected by workers.