CN115666088B - Electronic equipment and liquid cooling heat dissipation flow control method thereof - Google Patents
Electronic equipment and liquid cooling heat dissipation flow control method thereof Download PDFInfo
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- CN115666088B CN115666088B CN202211343019.7A CN202211343019A CN115666088B CN 115666088 B CN115666088 B CN 115666088B CN 202211343019 A CN202211343019 A CN 202211343019A CN 115666088 B CN115666088 B CN 115666088B
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- 239000007788 liquid Substances 0.000 title claims abstract description 241
- 238000000034 method Methods 0.000 title claims abstract description 39
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 35
- 238000001816 cooling Methods 0.000 title claims abstract description 31
- 239000000110 cooling liquid Substances 0.000 claims abstract description 181
- 230000001276 controlling effect Effects 0.000 claims abstract description 30
- 230000001105 regulatory effect Effects 0.000 claims abstract description 30
- 230000002159 abnormal effect Effects 0.000 claims description 56
- 239000002826 coolant Substances 0.000 claims description 22
- 238000010586 diagram Methods 0.000 description 6
- 239000012809 cooling fluid Substances 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The application provides electronic equipment and a liquid cooling heat dissipation flow control method thereof. The cold plate is arranged adjacent to the electronic device and used for circulating cooling liquid so as to radiate heat for the electronic device, and the cold plate comprises a liquid inlet and a liquid outlet. The flow regulating unit is arranged at the liquid inlet and is used for regulating the flow of the cooling liquid flowing into the cold plate. The operation parameter acquisition unit is used for acquiring the operation parameters of the electronic device. The control unit is used for acquiring the operation parameters of the electronic device acquired by the operation parameter acquisition unit and controlling the flow regulating unit to regulate the flow of the cooling liquid flowing into the cold plate at least according to the acquired operation parameters. The electronic equipment can adjust the flow of the cooling liquid according to the actual use condition of the electronic equipment, so that the problems of thermal downtime and the like caused by insufficient flow of the cooling liquid are avoided.
Description
Technical Field
The application relates to the technical field of power electronic equipment heat dissipation, in particular to electronic equipment and a liquid cooling heat dissipation flow control method thereof.
Background
In the existing liquid cooling heat dissipation method of electronic equipment, cooling liquid is generally input into a cold plate at a fixed flow, and the electronic equipment is subjected to heat dissipation, and the heat dissipation mode ignores the actual use condition of the electronic equipment, and can cause downtime and even faults due to insufficient heat dissipation caused by insufficient cooling liquid.
Disclosure of Invention
In order to solve the technical problems, the application provides electronic equipment and a liquid cooling heat dissipation flow control method thereof, which can adjust the flow of cooling liquid according to the actual use condition of the electronic equipment, thereby avoiding downtime and even faults caused by insufficient cooling liquid.
The first aspect of the application provides an electronic device, which comprises an electronic device, a cold plate, a flow adjusting unit, an operation parameter acquisition unit and a control unit. The cold plate is arranged adjacent to the electronic device and used for circulating cooling liquid so as to radiate heat for the electronic device, and the cold plate comprises a liquid inlet and a liquid outlet. The flow regulating unit is arranged at the liquid inlet and is used for regulating the flow of the cooling liquid flowing into the cold plate. The operation parameter acquisition unit is used for acquiring the operation parameters of the electronic device. The control unit is used for acquiring the operation parameters of the electronic device acquired by the operation parameter acquisition unit and controlling the flow regulating unit to regulate the flow of the cooling liquid flowing into the cold plate at least according to the acquired operation parameters.
The second aspect of the present application provides a liquid cooling heat dissipation flow control method, which is applied to the electronic device, and includes: collecting operation parameters of the electronic device; acquiring the acquired operation parameters of the electronic device, and controlling and adjusting the flow of the cooling liquid flowing into the cold plate at least according to the acquired operation parameters.
According to the electronic equipment and the liquid cooling heat dissipation flow control method thereof, the operation parameters of the electronic devices in the electronic equipment are collected in real time, and the flow of the cooling liquid is regulated at least according to the collected operation parameters, so that the flow of the cooling liquid is regulated according to the actual use working condition of the electronic devices, and the problems of downtime even machine faults caused by insufficient flow of the cooling liquid and low working efficiency of the electronic devices caused by overlarge flow of the cooling liquid can be avoided.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a block diagram of an electronic device according to an embodiment of the present application.
Fig. 2 is a schematic connection diagram of part of components of an electronic device according to an embodiment of the present application.
Fig. 3 is a schematic diagram of a first preset correspondence provided in an embodiment of the present application.
Fig. 4 is a flowchart of a liquid cooling heat dissipation flow control method according to an embodiment of the present application.
Description of main reference numerals:
electronic device 100
Electronic device 10
Specific electronic device 11
Cold plate 20
Liquid inlet 21
Liquid outlet 22
Flow rate adjusting unit 30
An operation parameter acquisition unit 40
Control unit 50
First temperature acquisition unit 60
Second temperature acquisition unit 70
Flow collection unit 80
Coolant temperature adjustment assembly 90
Third temperature acquisition unit 95
Liquid supply line 110
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without undue burden, are within the scope of the present application.
In the description of the present application, the terms "first," "second," "third," and the like are used for distinguishing between different objects and not for describing a particular sequence, and furthermore, the terms "upper," "inner," "outer," and the like indicate an orientation or a positional relationship based on that shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
In the description of the present application, unless explicitly stated and limited otherwise, the term "coupled" is to be interpreted broadly, as for example, being either fixedly coupled, detachably coupled, or integrally coupled; can be directly connected, can also be indirectly connected through an intermediate medium, and can also be the communication between the two elements; may be a communication connection; may be an electrical connection. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
Referring to fig. 1, fig. 1 is a block diagram of an electronic device 100 according to an embodiment of the present application. As shown in fig. 1, the electronic apparatus 100 includes an electronic device 10, a cold plate 20, a flow rate adjustment unit 30, an operation parameter acquisition unit 40, and a control unit 50. The cold plate 20 is disposed adjacent to the electronic device 10, the cold plate 20 is used for circulating a cooling liquid to dissipate heat of the electronic device 10, and the cold plate 20 includes a liquid inlet and a liquid outlet. The flow rate adjusting unit 30 is disposed at the liquid inlet, and the flow rate adjusting unit 30 is used for adjusting the flow rate of the cooling liquid flowing into the cold plate 20. The operation parameter acquisition unit 40 is configured to acquire an operation parameter of the electronic device 10. The control unit 50 is configured to obtain the operation parameter of the electronic device 10 collected by the operation parameter collection unit 40, and control the flow rate adjustment unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 at least according to the collected operation parameter.
According to the electronic equipment 100 provided by the embodiment of the application, the operation parameters of the electronic device 10 are collected in real time, and the flow of the cooling liquid flowing into the cold plate 20 is controlled and regulated at least according to the collected operation parameters, so that the flow of the cooling liquid is regulated according to the actual use working condition of the electronic device 10, and the problems of machine faults caused by insufficient flow of the cooling liquid and low working efficiency of the electronic device 10 caused by overlarge flow of the cooling liquid can be avoided.
Wherein the control unit 50 and the operation parameter acquisition unit 40 and the flow rate adjustment unit 30 may be connected by a wired or wireless means.
The control unit 50 may be a processing chip such as a single chip microcomputer, a digital signal processor, a central processing unit, etc. The flow regulating unit 30 may be an electric valve, a speed-regulating water pump, a throttle valve, etc.
In some embodiments, the operating parameter may include an output power, and the operating parameter acquisition unit 40 is configured to acquire the output power of the electronic device 10.
The cooling plate 20 is provided with a cooling channel, a projection of the cooling channel on the electronic device 10 is located in a range of the electronic device 10, two ends of the cooling channel are respectively communicated with the liquid inlet and the liquid outlet, the liquid inlet is communicated with a liquid supply pipeline 110 (as shown in fig. 2) and is used for supplying cooling liquid to the cooling channel through the liquid supply pipeline 110, and the liquid outlet is used for supplying cooling liquid in the cooling channel to flow out. The cooling liquid flows into the cooling flow passage from the liquid supply pipeline 110 through the flow regulating unit 30 and the liquid inlet, absorbs heat generated by the electronic device 10 when flowing through the cooling flow passage, and flows out from the liquid outlet, thereby realizing heat dissipation of the electronic device 10.
Wherein the cooling liquid may be the same.
Referring to fig. 1 and fig. 2, fig. 2 is a schematic connection diagram of part of components of an electronic device 100 according to an embodiment of the disclosure. In some embodiments, as shown in fig. 2, the electronic device 100 further includes a first temperature acquisition unit 60 disposed at the liquid inlet 21, for acquiring a liquid inlet temperature of the cooling liquid flowing into the cold plate 20, and the control unit 50 is further configured to acquire the liquid inlet temperature acquired by the first temperature acquisition unit 60, determine a target flow range according to the acquired liquid inlet temperature and the acquired operation parameter, and control the flow adjustment unit 30 to adjust the flow of the cooling liquid flowing into the cold plate 20 to be within the target flow range.
The temperature of the cooling liquid flowing into the cold plate 20 and the operation parameters of the electronic device 10 are collected in real time, and the flow of the cooling liquid flowing into the cold plate 20 is controlled and regulated according to the collected inlet liquid temperature and the operation parameters, so that the flow of the cooling liquid can be regulated according to the actual use condition of the electronic device 10, and the flow of the cooling liquid can be regulated according to the temperature of the cooling liquid, wherein the flow of the cooling liquid is regulated according to the temperature of the cooling liquid and the use condition of the electronic device 10, so that the cooling liquid with more accurate and proper flow can be provided for the electronic device 10 to dissipate heat, and the temperature of the electronic device 10 is not too high or too low.
The first temperature acquisition unit 60 may be a temperature sensor, such as a thermistor type temperature sensor, a thermocouple type temperature sensor, or the like. The first temperature acquisition unit 60 may be connected to the control unit 50 by a wired or wireless means.
In some embodiments, the control unit 50 determines, according to a first preset correspondence between the preset inlet temperature, the preset operation parameter, and the preset flow range of the cooling liquid, that the flow range corresponding to the currently collected inlet temperature and the currently collected operation parameter is the target flow range.
Wherein the flow range may be a flow range, such as 10-12L/min; the flow range may also include a flow value, such as 10L/min.
The electronic device 100 may include a memory (not shown), and the first preset correspondence may be stored in the memory in advance.
In some embodiments, the first preset correspondence defines correspondence among a plurality of inlet temperatures, a plurality of operation parameters, and flow ranges of the cooling liquid, and when the control unit 50 obtains the current collected inlet temperatures and operation parameters, the control unit determines a target flow range corresponding to the current inlet temperatures and the current operation parameters according to the first preset correspondence.
For example, please refer to fig. 3, which is a schematic diagram of a first preset correspondence provided in an embodiment of the present application. Wherein the operating parameter is output power and the flow range includes a flow value. As shown in fig. 3, the abscissa represents the output power, the ordinate represents the flow value, and the curve represents the intake temperature. If the current collected inlet liquid temperature is 25 ℃, the current collected output power is 30kW, and the control unit 50 determines that the target flow range includes a flow value, specifically 8L/min, according to the first preset corresponding relation.
In other embodiments, the control unit 50 determines the target flow range directly from the collected operating parameters. Specifically, according to the preset corresponding relation between the operation parameters and the flow range of the cooling liquid, determining the current collected inlet liquid temperature and the flow range corresponding to the current collected operation parameters as the target flow range.
In some embodiments, as shown in fig. 1 and 2, the electronic device 10 includes a specific electronic device 11, and the electronic apparatus 100 further includes a second temperature acquisition unit 70, where the second temperature acquisition unit 70 is disposed on the specific electronic device 11, and is configured to acquire a temperature of the specific electronic device 11. The control unit 50 is further configured to obtain the temperature of the electronic device 10 collected by the second temperature collection unit 70, determine that the temperature of the specific electronic device 11 is abnormal when the collected temperature of the specific electronic device 11 is outside a first preset temperature range, and control the flow rate adjustment unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 according to the collected temperature of the electronic device 10 until the temperature of the specific electronic device 11 is within the first preset temperature range.
Wherein the specific electronic device 11 is an electronic device having an importance level higher than a preset level among the electronic devices 10.
In some embodiments, the electronic apparatus 100 includes a dc power source connected to the electronic device 10, the dc power source being configured to output a dc signal to the electronic device 10, and the electronic device 10 being configured to convert the dc signal into a preset electrical signal and output the same. The specific electronic device 11 may include a key device for converting the direct current signal into the preset electrical signal among the electronic devices 10. The preset electrical signal may be a square wave signal, a pulse signal, etc.
The first preset temperature range can be set according to actual requirements.
The second temperature collecting unit 70 may be a temperature sensor, for example, a thermistor type temperature sensor, a thermocouple type temperature sensor, or the like. The second temperature acquisition unit 70 may be connected to the control unit 50 by a wired or wireless means.
The method comprises the steps of collecting the temperature of a specific electronic device 11 with a higher importance level, and judging whether the temperature of the specific electronic device 11 is abnormal, so that whether the current flow of cooling liquid can meet the heat dissipation requirement of a key device can be accurately determined. And, when the temperature of the specific electronic device 11 is abnormal, the flow of the cooling liquid is adjusted in time to dissipate heat of the specific electronic device 11, so that the temperature of the specific electronic device 11 is in a normal range, the critical device can be prevented from being protected due to the fact that the temperature of the critical device is too high, and the working efficiency of the critical device can be improved due to the fact that the temperature of the critical device is prevented from being too low.
Wherein the control unit 50 determines that the temperature of the specific electronic device 11 is normal when the temperature of the specific electronic device 11 is within the first preset range.
In some embodiments, when the temperature of the specific electronic device 11 is abnormal, the control unit 50 controls the electronic device 10 to be powered off to protect the electronic device 10 until the temperature of the specific electronic device 11 is within the first temperature range, and the control unit 50 controls the electronic device 10 to be started again. In some embodiments, the control unit 50 may control the electronic device 10 to be powered off immediately or after a delay of a preset time when the temperature of the specific electronic device 11 is abnormal.
In some embodiments, as shown in fig. 1 and 2, the electronic device 100 further includes a flow collection unit 80 disposed between the liquid inlet 21 and the flow adjustment unit 30 and/or at the liquid outlet 22, for collecting the flow of the cooling liquid at the liquid inlet 21 and/or at the liquid outlet 22. The control unit 50 is further configured to obtain the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 collected by the flow rate collection unit 80, determine that the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal when the collected flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is outside the target flow rate range, and determine that the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is normal when the collected flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is within the target flow rate range.
Wherein, the flow collection unit 80 may be a flow meter.
Wherein, the flow collection unit 80 may be connected to the control unit 50 by a wired or wireless means.
By collecting the flow of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22, it may be determined whether the flow of the cooling liquid flowing through the cooling plate 20 is in the target flow range, so that the flow of the cooling liquid may be timely adjusted by the flow adjusting unit 30 when the flow is abnormal, so as to avoid poor heat dissipation effect caused by abnormal flow or overcooling of the electronic device 10 caused by too low temperature of the cooling liquid.
In some embodiments, when the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal, the control unit 50 controls the electronic device 10 to be powered off to protect the electronic device 10 until the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is normal, and the control unit 50 controls the electronic device 10 to be started again. In some embodiments, the control unit 50 may control the electronic device 10 to be powered off immediately or after a delay of a preset time when the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal.
In some embodiments, the control unit 50 controls the flow rate adjusting unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 when the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal until the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is within the target flow rate range.
In some embodiments, the control unit 50 is further configured to control the flow rate adjustment unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 by a first adjustment range when the temperature of the specific electronic device 11 is abnormal, until the temperature of the specific electronic device 11 is within the first preset temperature range, and determine whether the flow rate of the cooling liquid flowing into the cold plate 20 needs to be adjusted after a preset time interval when the temperature of the specific electronic device 11 is normal and the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal.
In some embodiments, when the temperature of the specific electronic device 11 is normal and the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal, the control unit 50 controls the flow rate acquisition unit 80 to acquire the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 again after a preset interval time, and when the acquired flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is out of the target flow rate range, controls the flow rate adjustment unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 by a second adjustment amplitude until the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is within the target flow rate range, and determines that there is no need to adjust the flow rate of the cooling liquid flowing into the cold plate 20 when the acquired flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 again is within the target flow rate range, wherein the first adjustment amplitude is different from the second adjustment amplitude.
If the flow of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 collected again is within the target flow range after the preset time interval, it is indicated that the flow of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is outside the target flow range and is caused by transient unstable infusion, and the flow of the cooling liquid is kept unchanged at this time, so that frequent adjustment of the flow of the cooling liquid can be avoided, the electronic device 100 maintains a stable and good working state, and power consumption can be reduced.
If the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 collected again is still outside the target flow rate range after the preset time period is separated, it is indicated that the flow rate of the cooling liquid is stabilized at the current value, and at this time, the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is made to be within the target range by adjusting the flow rate of the cooling liquid, so that the heat dissipation function caused by insufficient or excessive flow rate of the cooling liquid can be avoided.
In some embodiments, the first adjustment amplitude is greater than the second adjustment amplitude. The specific values of the first adjustment range and the second adjustment range may be set according to actual requirements, which are not limited herein.
In some embodiments, when the temperature of the specific electronic device 11 is abnormal and the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is normal, the control unit 50 controls the flow rate adjusting unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 by a first adjustment amplitude until the temperature of the specific electronic device 11 is within the first preset temperature range.
In some embodiments, when the temperature of the specific electronic device 11 is abnormal and the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal, the control unit 50 controls the flow rate adjusting unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 by a first adjustment amplitude until the temperature of the specific electronic device 11 is within the first preset temperature range.
Wherein, because the specific electronic device 11 is a key device, when the temperature of the specific electronic device 11 is abnormal, the flow of the cooling liquid is immediately controlled and regulated so that the temperature of the specific electronic device 11 is in a normal range, and the specific electronic device 11 can be timely prevented from being damaged.
Wherein, when the temperature of the specific electronic device 11 and the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 are abnormal, the control unit 50 preferably controls the flow rate adjusting unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 with a first adjusting amplitude, so as to more quickly adjust the temperature of the specific electronic device 11 to be within a normal range, thereby avoiding damage or insufficient efficiency of the specific electronic device 11 caused by long-time overheat or supercool state of the specific electronic device 11.
In some embodiments, as shown in fig. 1, the electronic device 100 further includes a coolant temperature adjustment assembly 90, and the coolant temperature adjustment assembly 90 is connected to the flow adjustment unit 30, for adjusting the inlet temperature. The control unit 50 is configured to control the cooling liquid temperature adjusting component 90 to heat or cool the cooling liquid when the inlet liquid temperature acquired by the first temperature acquiring unit 60 is out of a second preset temperature range, and the control unit 50 is also configured to control the cooling liquid to be input into the cold plate 20 when the inlet liquid temperature is adjusted to be within the second preset temperature range by the cooling liquid temperature adjusting component 90.
Wherein the coolant temperature adjustment assembly 90 may include a cooler and a heater, and when the inlet temperature of the coolant is lower than the lower limit value of the second preset temperature range, the control unit 50 controls the heater to heat the coolant until the inlet temperature of the coolant is within the second preset temperature range; when the inlet temperature of the cooling liquid is higher than the upper limit value of the second preset temperature range, the control unit 50 controls the cooler to cool the cooling liquid until the second temperature of the cooling liquid is within the second preset temperature range. The cooler and heater may be connected to the control unit 50 by wire or wirelessly.
The second preset temperature range may be set according to actual requirements, and in some embodiments, the preset temperature range may be 25-30 ℃.
Wherein, by adjusting the temperature of the cooling liquid to the second preset temperature range before the cooling liquid is input into the cold plate 20, it is possible to avoid that the temperature of the cooling liquid input into the cold plate 20 is too low or too high to affect the heat dissipation effect.
In some embodiments, during operation of the electronic device 10, when the inlet temperature of the cooling liquid is outside the second preset temperature range, the control unit 50 determines that the inlet temperature is abnormal, and controls the electronic device 10 to be powered off, so as to protect the electronic device 10, until the inlet temperature of the cooling liquid is adjusted to be within the second preset temperature range, and the control unit 50 controls to start the electronic device 10 again. In some embodiments, the control unit 50 may control the electronic device 10 to be powered off immediately or after a delay of a preset time when the inlet temperature of the cooling liquid is abnormal.
In some embodiments, after the electronic device 100 is powered on, before the electronic device 10 is first started, the control unit 50 is configured to adjust, by the coolant temperature adjustment assembly 90, the inlet temperature of the coolant to be within the second preset temperature range, and after the coolant with the temperature within the second preset temperature range is input to the cold plate 20 at a preset flow rate, control to start the electronic device 10.
The preset flow rate may be set according to actual requirements, and in some embodiments, the preset flow rate may be a maximum flow rate, or may obviously be other values.
Before the electronic device 10 is started for the first time, by inputting the cooling liquid to the cold plate 20 according to the preset flow, heat can be dissipated to devices except the electronic device 10 in the electronic apparatus 100, so that the temperature in the electronic apparatus 100 is not too high, the electronic device 10 can be prevented from being started at a higher temperature, and the electronic device 10 is further protected.
After the electronic device 10 is started, the control unit 50 obtains the operation parameters collected by the operation parameter collection unit 40, determines a target flow range at least according to the collected operation parameters, and controls the flow adjustment unit 30 to adjust the flow of the cooling liquid flowing into the cooling plate 20 from the preset flow to a value within the target flow range, so as to realize heat dissipation for the electronic device 10 according to the actual working condition of the electronic device 10.
Wherein in some embodiments the control unit 50 determines a target flow range based on the collected operating parameters. In other embodiments, the control unit 50 determines the target flow range based on the collected operating parameters and the feed liquid temperature.
In some embodiments, the electronic device 100 further includes a third temperature collecting unit 95 disposed at the liquid outlet 22, for collecting the liquid outlet temperature of the cooling liquid at the liquid outlet 22. The control unit 50 is further configured to obtain the liquid outlet temperature collected by the third temperature collecting unit 95, determine whether the electronic device 100 is abnormal according to the liquid outlet temperature, the liquid inlet temperature and the operation parameter that are currently collected, and control the electronic device 100 to send out an abnormality prompt message when determining that the electronic device 100 is abnormal, so that a user can overhaul the electronic device 100 in time.
The electronic device 100 may include an alarm component, and when the electronic device 100 is abnormal, the control unit 50 controls the alarm component to send out the abnormality prompt information. The alarm component may be a buzzer, a voice component, a warning light, etc., and the control unit 50 may control the buzzer to emit a buzzer, the voice component to emit a voice, the warning light to illuminate a red light, etc.
In some embodiments, the control unit 50 determines a target inlet-outlet temperature difference interval corresponding to the currently collected operation parameter according to a preset inlet-outlet temperature difference interval and a second preset corresponding relation of the operation parameter, determines a current inlet-outlet temperature difference according to the currently collected outlet temperature and the currently collected inlet-outlet temperature, and determines that the electronic device 100 is abnormal when the current inlet-outlet temperature difference is outside the target inlet-outlet temperature difference interval.
When the electronic device 10 operates with a certain operation parameter, the temperature rise generated by the cooling liquid absorbing the heat of the electronic device 10 is within a range corresponding to the operation parameter, that is, the difference between the liquid outlet temperature and the liquid inlet temperature is within a range corresponding to the operation parameter, and if the difference between the liquid outlet temperature and the liquid inlet temperature is outside the range, the electronic device 10 generates abnormal heat. For example, the difference between the outlet temperature and the inlet temperature is greater than the upper limit of the range, and the electronic device 10 may excessively generate heat; the difference between the outlet temperature and the inlet temperature is less than the lower limit of this range, and the electronic device 10 may be under powered or under efficient. In the embodiment of the present application, the current temperature difference of the liquid inlet and outlet is compared with the temperature difference interval of the target liquid inlet and outlet to determine whether the temperature difference of the liquid inlet and outlet is too large or too small, so as to determine whether the electronic device 100 is abnormal.
The second preset corresponding relation can be stored in the memory in advance. The second preset corresponding relation defines a plurality of liquid inlet and outlet temperature difference intervals and a corresponding relation of a plurality of operation parameters, and each liquid inlet and outlet temperature difference interval corresponds to one operation parameter. Wherein, the temperature difference interval of the liquid inlet and outlet can be a temperature difference range, such as 10-12 ℃; the temperature difference between the liquid inlet and the liquid outlet can comprise a temperature difference value, for example, 10 ℃.
Referring to fig. 4, a flow chart of a liquid cooling heat dissipation flow control method according to an embodiment of the present application is shown. The liquid cooling heat dissipation flow control method is applied to the electronic device 100 provided in any of the foregoing embodiments. As shown in fig. 4, the liquid cooling heat dissipation flow control method includes the following steps:
s10: the operating parameters of the electronic device 10 are collected.
S20: the acquired operating parameters of the electronic device 10 are acquired and the flow of the cooling liquid into the cold plate 20 is controlled and regulated at least in accordance with the acquired operating parameters.
Wherein the operation parameters of the electronic device 10 may be acquired by the operation parameter acquisition unit 40 as described above.
The flow rate of the coolant flowing into the cold plate 20 can be controlled by the control unit 50.
According to the liquid cooling heat dissipation flow control method provided by the embodiment of the application, through collecting the operation parameters of the electronic device 10 in the electronic equipment 100 in real time and controlling and adjusting the flow of the cooling liquid at least according to the collected operation parameters, the flow of the cooling liquid is adjusted according to the actual use working condition of the electronic device 10, so that the problems of machine faults caused by insufficient flow of the cooling liquid and low working efficiency of the electronic device 10 caused by overlarge flow of the cooling liquid can be avoided.
In some embodiments, the liquid-cooled heat dissipation flow control method further comprises: collecting the inlet temperature of the cooling liquid flowing into the cold plate 20; acquiring the acquired inlet liquid temperature, determining a target flow range according to the acquired inlet liquid temperature and the acquired operation parameters, and controlling and adjusting the flow of the cooling liquid flowing into the cold plate 20 to be in the target flow range.
The liquid inlet temperature may be collected by the aforementioned first temperature collecting unit 60, and the collected liquid inlet temperature may be obtained by the control unit 50, and the flow rate adjusting unit 30 may be controlled by the control unit 50 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 according to the collected liquid inlet temperature and the collected operation parameter.
In some embodiments, the controlling and adjusting the flow of the cooling fluid flowing into the cold plate 20 according to the collected inlet fluid temperature and the collected operation parameters includes: and determining the current collected liquid inlet temperature and the flow range corresponding to the current collected operation parameter as the target flow range according to a first preset corresponding relation among the preset liquid inlet temperature, the operation parameter and the flow range of the cooling liquid.
In some embodiments, the liquid-cooled heat dissipation flow control method further comprises: collecting the temperature of the specific electronic device 11; acquiring the acquired temperature of the specific electronic device 11, determining that the temperature of the specific electronic device 11 is abnormal when the acquired temperature of the specific electronic device 11 is out of a first preset temperature range, and controlling and adjusting the flow of the cooling liquid flowing into the cold plate 20 according to the acquired temperature of the specific electronic device 11 until the temperature of the specific electronic device 11 is in the first preset temperature range.
Wherein the temperature of the specific electronic device 11 may be acquired by the aforementioned second temperature acquisition unit 70.
In some embodiments, the liquid-cooled heat dissipation flow control method further comprises: collecting the flow of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22; acquiring the acquired flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22, and determining that the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal when the acquired flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is out of the target flow rate range.
The flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 can be collected by the flow rate collection unit 80.
In some embodiments, the liquid-cooled heat dissipation flow control method further comprises: when the temperature of the specific electronic device 11 is abnormal, controlling to adjust the flow rate of the cooling liquid flowing into the cold plate 20 with a first adjustment amplitude until the temperature of the specific electronic device 11 is within the first preset temperature range; and judging whether the flow of the cooling liquid flowing into the cold plate 20 needs to be regulated after a preset time interval when the temperature of the specific electronic device 11 is normal and the flow of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal.
In some embodiments, determining whether the flow of the coolant flowing into the cold plate 20 needs to be adjusted after the interval is preset for a period of time includes: when the temperature of the specific electronic device 11 is normal and the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is abnormal, collecting the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 again after a preset time interval; when the collected flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is out of the target flow rate range, controlling to adjust the flow rate of the cooling liquid flowing into the cold plate 20 by a second adjusting amplitude until the flow rate of the cooling liquid at the liquid inlet 21 and/or the liquid outlet 22 is in the target flow rate range, wherein the first adjusting amplitude is different from the second adjusting amplitude; and determining that the flow rate of the cooling liquid flowing into the cold plate 20 does not need to be regulated when the flow rate of the cooling liquid collected again at the liquid inlet 21 and/or the liquid outlet 22 is within the target flow rate range.
In some embodiments, the liquid-cooled heat dissipation flow control method further comprises: collecting the inlet temperature of the cooling liquid flowing into the cold plate 20; when the collected inlet liquid temperature is out of a second preset temperature range, controlling the cooling liquid to be heated or cooled; and controlling the cooling liquid to be input into the cold plate 20 when the temperature of the liquid inlet is regulated to be within the second preset temperature range.
Wherein the cooling fluid may be heated or cooled by the aforementioned cooling fluid temperature regulating assembly 90.
In some embodiments, during operation of the electronic device 10, when the inlet temperature of the cooling liquid is outside the second preset temperature range, the liquid cooling heat dissipation flow control method further includes: and controlling the electronic device 10 to be powered off to protect the electronic device 10, and controlling to start the electronic device 10 again until the inlet temperature of the cooling liquid is regulated to be within the second preset temperature range.
In some embodiments, after powering up the electronic device 100 and before first powering up the electronic device 10, the liquid cooling heat dissipation flow control method further includes: and adjusting the inlet temperature of the cooling liquid to be within the second preset temperature range, and controlling to start the electronic device 10 after the cooling liquid with the temperature within the second preset temperature range is input into the cold plate 20 at a preset flow rate.
Wherein, after the electronic device 10 is first started, the controlling the flow rate adjusting unit 30 to adjust the flow rate of the cooling liquid flowing into the cold plate 20 at least according to the collected operation parameters includes: determining a target flow range at least according to the collected operation parameters; and controlling to adjust the flow rate of the coolant flowing into the cold plate 20 from the preset flow rate to a value within the target flow rate range.
In some embodiments, the liquid-cooled heat dissipation flow control method further comprises: collecting the outlet temperature of the cooling liquid at the outlet 22; acquiring the current acquired liquid outlet temperature, liquid inlet temperature and operation parameters, and judging whether the electronic equipment 100 is abnormal according to the current acquired liquid outlet temperature, liquid inlet temperature and operation parameters; and when the electronic equipment 100 is determined to be abnormal, controlling the electronic equipment 100 to send out abnormal prompt information.
The outlet temperature of the cooling liquid at the outlet 22 can be collected by the aforementioned third temperature collecting unit 95.
In some embodiments, the determining whether the electronic device 100 is abnormal according to the currently collected outlet liquid temperature, inlet liquid temperature and operation parameters includes: determining a target inlet-outlet temperature difference interval corresponding to the currently acquired operation parameter according to a preset inlet-outlet temperature difference interval and a second preset corresponding relation of the operation parameter; determining the current liquid inlet and outlet temperature difference according to the current collected liquid outlet temperature and the current collected liquid inlet temperature; and determining that the electronic device 100 is abnormal when the current inlet-outlet temperature difference is outside the target inlet-outlet temperature difference interval.
In the foregoing method embodiments, the steps not specifically indicating the execution subject may be executed by the control unit 50.
The electronic device 100 may include a radio frequency power device or other type of electronic device.
The above-mentioned liquid cooling flow control method corresponds to the above-mentioned electronic device 100, and the more detailed description can be seen from the content of each embodiment of the above-mentioned electronic device 100, and the above-mentioned liquid cooling flow control method and the content of the above-mentioned electronic device 100 can also be referred to each other.
It should be noted that, for simplicity of description, the foregoing method embodiments are all expressed as a series of action combinations, but it should be understood by those skilled in the art that the present application is not limited by the order of actions described, as some steps may be performed in other order or simultaneously in accordance with the present application. Further, those skilled in the art will also appreciate that the embodiments described in the specification are all preferred embodiments, and that the acts and modules referred to are not necessarily required in the present application.
The foregoing is a description of embodiments of the present application, and it should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of the embodiments of the present application, and these improvements and modifications are also considered as the protection scope of the present application.
Claims (16)
1. An electronic device, the electronic device comprising:
an electronic device;
the cold plate is arranged adjacent to the electronic device and used for circulating cooling liquid so as to radiate the heat of the electronic device, and comprises a liquid inlet and a liquid outlet;
the flow regulating unit is arranged at the liquid inlet and is used for regulating the flow of the cooling liquid flowing into the cold plate;
the operation parameter acquisition unit is used for acquiring the operation parameters of the electronic device; and
the control unit is used for acquiring the operation parameters of the electronic device acquired by the operation parameter acquisition unit and controlling the flow adjustment unit to adjust the flow of the cooling liquid flowing into the cold plate at least according to the acquired operation parameters;
the electronic device comprises a specific electronic device, wherein the specific electronic device is an electronic device with an importance level higher than a preset level in the electronic device; the control unit is further configured to control the flow rate adjustment unit to adjust the flow rate of the cooling liquid flowing into the cold plate by a first adjustment range when the temperature of the specific electronic device is abnormal, until the temperature of the specific electronic device is within a first preset temperature range, and determine whether the flow rate of the cooling liquid flowing into the cold plate needs to be adjusted after a preset time interval when the temperature of the specific electronic device is normal and the flow rate of the cooling liquid at the liquid inlet and/or the liquid outlet is abnormal;
The electronic equipment further comprises a first temperature acquisition unit, wherein the first temperature acquisition unit is used for acquiring the inlet liquid temperature of the cooling liquid flowing into the cold plate, the control unit is further used for acquiring the inlet liquid temperature acquired by the first temperature acquisition unit, determining a target flow range according to the acquired inlet liquid temperature and the acquired operation parameters, and controlling the flow regulating unit to regulate the flow of the cooling liquid flowing into the cold plate to be in the target flow range.
2. The electronic device of claim 1, wherein the control unit determines that a flow range corresponding to the currently collected feed-liquid temperature and the currently collected operation parameter is the target flow range according to a first preset correspondence of the preset feed-liquid temperature, the operation parameter, and the flow range of the cooling liquid.
3. The electronic device of claim 1, further comprising a second temperature acquisition unit disposed on the specific electronic component for acquiring a temperature of the specific electronic component; the control unit is further configured to obtain the temperature of the specific electronic device collected by the second temperature collection unit, determine that the temperature of the specific electronic device is abnormal when the collected temperature of the specific electronic device is outside a first preset temperature range, and control the flow adjustment unit to adjust the flow of the cooling liquid flowing into the cold plate according to the collected temperature of the specific electronic device until the temperature of the specific electronic device is within the first preset temperature range.
4. The electronic device according to claim 3, further comprising a flow collection unit, disposed between the liquid inlet and the flow adjustment unit and/or at the liquid outlet, for collecting the flow of the cooling liquid at the liquid inlet and/or at the liquid outlet; the control unit is further used for acquiring the flow of the cooling liquid at the liquid inlet and/or the liquid outlet, which is acquired by the flow acquisition unit, and determining that the flow of the cooling liquid at the liquid inlet and/or the liquid outlet is abnormal when the acquired flow of the cooling liquid at the liquid inlet and/or the liquid outlet is out of the target flow range.
5. The electronic apparatus according to claim 1, wherein when the temperature of the specific electronic device is normal and the flow rate of the coolant at the liquid inlet and/or at the liquid outlet is abnormal, the flow rate of the coolant at the liquid inlet and/or at the liquid outlet is collected again after a preset period of time, and when the flow rate of the coolant at the liquid inlet and/or at the liquid outlet collected again is out of the target flow rate range, the flow rate adjustment unit is controlled to adjust the flow rate of the coolant flowing into the cold plate by a second adjustment amplitude until the flow rate of the coolant at the liquid inlet and/or at the liquid outlet is within the target flow rate range, and when the flow rate of the coolant at the liquid inlet and/or at the liquid outlet collected again is within the target flow rate range, it is determined that there is no need to adjust the flow rate of the coolant flowing into the cold plate, wherein the first adjustment amplitude is different from the second adjustment amplitude.
6. The electronic device of claim 1, further comprising a coolant temperature adjustment assembly coupled to the flow adjustment unit for adjusting the feed liquid temperature; the control unit is used for controlling the cooling liquid temperature adjusting component to heat or cool the cooling liquid when the inlet liquid temperature acquired by the first temperature acquisition unit is out of a second preset temperature range, and controlling the cooling liquid to be input into the cold plate when the cooling liquid temperature adjusting component adjusts the inlet liquid temperature to be in the second preset temperature range.
7. The electronic device of claim 1, further comprising a third temperature acquisition unit disposed at the liquid outlet for acquiring a liquid outlet temperature of the cooling liquid at the liquid outlet; the control unit is further used for acquiring the liquid outlet temperature acquired by the third temperature acquisition unit, judging whether the electronic equipment is abnormal according to the liquid outlet temperature, the liquid inlet temperature and the operation parameters which are acquired currently, and controlling the electronic equipment to send out abnormal prompt information when the electronic equipment is determined to be abnormal.
8. The electronic device of claim 7, wherein the control unit determines a target inlet-outlet temperature difference interval corresponding to a currently acquired operating parameter according to a second preset correspondence between a preset inlet-outlet temperature difference interval and the operating parameter, determines a current inlet-outlet temperature difference according to a currently acquired outlet temperature and a currently acquired inlet-outlet temperature, and determines that the electronic device is abnormal when the current inlet-outlet temperature difference is outside the target inlet-outlet temperature difference interval.
9. The liquid cooling heat dissipation flow control method is applied to electronic equipment and is characterized in that the electronic equipment comprises electronic devices and a cold plate, wherein the cold plate is arranged adjacent to the electronic devices and is used for circulating cooling liquid to dissipate heat of the electronic devices, the cold plate comprises a liquid inlet and a liquid outlet, the electronic devices comprise specific electronic devices, and the specific electronic devices are electronic devices with importance levels higher than a preset level in the electronic devices; the liquid cooling heat dissipation flow control method comprises the following steps:
collecting operation parameters of the electronic device;
acquiring the acquired operation parameters of the electronic device, and controlling and adjusting the flow of the cooling liquid flowing into the cold plate at least according to the acquired operation parameters;
When the temperature of the specific electronic device is abnormal, controlling to adjust the flow of the cooling liquid flowing into the cold plate by a first adjusting amplitude until the temperature of the specific electronic device is within a first preset temperature range; and
judging whether the flow of the cooling liquid flowing into the cold plate needs to be regulated after a preset time interval when the temperature of the specific electronic device is normal and the flow of the cooling liquid at the liquid inlet and/or the liquid outlet is abnormal;
the liquid cooling heat dissipation flow control method further comprises the following steps:
collecting the inlet temperature of the cooling liquid flowing into the cold plate;
acquiring the acquired liquid inlet temperature, determining a target flow range according to the acquired liquid inlet temperature and the acquired operation parameters, and controlling and regulating the flow of the cooling liquid flowing into the cold plate to be in the target flow range.
10. The liquid-cooled heat sink flow control method of claim 9, wherein determining the target flow range based on the collected feed liquid temperature and the collected operating parameters comprises:
and determining the current collected liquid inlet temperature and the flow range corresponding to the current collected operation parameter as the target flow range according to a first preset corresponding relation among the preset liquid inlet temperature, the operation parameter and the flow range of the cooling liquid.
11. The liquid-cooled heat sink flow rate control method as claimed in claim 9, wherein the liquid-cooled heat sink flow rate control method further comprises:
collecting the temperature of the specific electronic device;
acquiring the acquired temperature of the specific electronic device, determining that the temperature of the specific electronic device is abnormal when the acquired temperature of the specific electronic device is out of a first preset temperature range, and controlling and adjusting the flow of the cooling liquid flowing into the cold plate according to the acquired temperature of the specific electronic device until the temperature of the specific electronic device is in the first preset temperature range.
12. The liquid-cooled heat sink flow rate control method of claim 11, further comprising:
collecting the flow of the cooling liquid at the liquid inlet and/or the liquid outlet;
acquiring the acquired flow of the cooling liquid at the liquid inlet and/or the liquid outlet, and determining that the flow of the cooling liquid at the liquid inlet and/or the liquid outlet is abnormal when the acquired flow of the cooling liquid at the liquid inlet and/or the liquid outlet is out of the target flow range.
13. The liquid-cooled heat sink flow control method of claim 9, wherein determining whether the flow of the coolant flowing into the cold plate needs to be adjusted after the interval is preset for a period of time includes:
when the temperature of the specific electronic device is normal and the flow of the cooling liquid at the liquid inlet and/or the liquid outlet is abnormal, collecting the flow of the cooling liquid at the liquid inlet and/or the liquid outlet again after a preset time interval;
when the collected flow rate of the cooling liquid at the liquid inlet and/or the liquid outlet is out of the target flow rate range, controlling to adjust the flow rate of the cooling liquid flowing into the cold plate by a second adjusting amplitude until the flow rate of the cooling liquid at the liquid inlet and/or the liquid outlet is in the target flow rate range, wherein the first adjusting amplitude is different from the second adjusting amplitude; and
and when the flow rate of the collected cooling liquid at the liquid inlet and/or the liquid outlet is in the target flow rate range, determining that the flow rate of the cooling liquid flowing into the cold plate does not need to be regulated.
14. The liquid-cooled heat sink flow rate control method as claimed in claim 9, wherein the liquid-cooled heat sink flow rate control method further comprises:
Collecting the inlet temperature of the cooling liquid flowing into the cold plate;
when the collected inlet liquid temperature is out of a second preset temperature range, controlling the cooling liquid to be heated or cooled; and
and controlling the cooling liquid to be input into the cold plate when the temperature of the liquid inlet is regulated to be within the second preset temperature range.
15. The liquid-cooled heat sink flow rate control method as claimed in claim 9, wherein the liquid-cooled heat sink flow rate control method further comprises:
collecting the liquid outlet temperature of the cooling liquid at the liquid outlet;
acquiring the current acquired liquid outlet temperature, liquid inlet temperature and operation parameters, and judging whether the electronic equipment is abnormal according to the current acquired liquid outlet temperature, liquid inlet temperature and operation parameters; and
and when the electronic equipment is determined to be abnormal, controlling the electronic equipment to send out abnormal prompt information.
16. The liquid cooling heat dissipation flow control method as set forth in claim 15, wherein the determining whether the electronic device is abnormal according to the currently collected liquid outlet temperature, liquid inlet temperature and operation parameters includes:
determining a target inlet-outlet temperature difference interval corresponding to the currently acquired operation parameter according to a preset inlet-outlet temperature difference interval and a second preset corresponding relation of the operation parameter;
Determining the current liquid inlet and outlet temperature difference according to the current collected liquid outlet temperature and the current collected liquid inlet temperature; and
and determining that the electronic equipment is abnormal when the current inlet and outlet temperature difference is outside the target inlet and outlet temperature difference interval.
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Address after: 1101, Building D1, Nanshan Zhiyuan, No. 1001 Xueyuan Avenue, Changyuan Community, Taoyuan Street, Nanshan District, Shenzhen City, Guangdong Province, 518055 Patentee after: SHENZHEN HANQIANG TECHNOLOGY Co.,Ltd. Address before: Unit ghijklm, block B, 7 / F, building 7, Baoneng Science Park, Qinghu village, Qinghu community, Longhua street, Shenzhen, Guangdong 518000 Patentee before: SHENZHEN HANQIANG TECHNOLOGY Co.,Ltd. |