CN115663097A

CN115663097A - COB (chip on board) packaging module, packaging method thereof and Mini LED (light emitting diode) display screen

Info

Publication number: CN115663097A
Application number: CN202211231612.2A
Authority: CN
Inventors: 朱建晓
Original assignee: Suzhou Konig Electronic Technology Co ltd
Current assignee: Suzhou Konig Electronic Technology Co ltd
Priority date: 2021-10-13
Filing date: 2022-10-10
Publication date: 2023-01-31

Abstract

The application discloses a COB (chip on board) packaging module, a packaging method thereof and a Mini LED (light emitting diode) display screen, belonging to the technical field of circuit board packaging, wherein the COB packaging module comprises a substrate and a plurality of light emitting parts arranged on the substrate in an array manner; each of the light emitting parts includes at least one LED chip; the maximum height of the LED chip on the substrate is lower than 1mm; the packaging method of the COB packaging module comprises the following steps: and controlling an array type spray head with a plurality of spray holes which can be independently controlled to spray photocuring packaging glue solution towards the light-emitting part on the horizontally placed substrate in a horizontal linear reciprocating motion mode until a packaging body for coating the light-emitting part is formed. The COB packaging module, the packaging method thereof and the Mini LED display screen provided by the specification are suitable for reliable packaging of a substrate with low-height LED chips.

Description

COB (chip on board) packaging module, packaging method thereof and Mini LED (light emitting diode) display screen

Technical Field

The specification relates to the technical field of circuit board packaging, in particular to a COB packaging module, a packaging method of the COB packaging module and a Mini LED display screen.

Background

With the continuous development of the light emitting diode display industry, the light emitting diode device is changed from the original DIP structure to the chip structure at a high speed, and the light emitting device with the chip structure has the advantages of light weight, smaller size, automatic installation, large light emitting angle, uniform color, less attenuation and the like, and is more and more accepted by people. Although the general sheet type light emitting device has the advantages, the problems of low mechanical strength, low moisture resistance, low reliability, poor weather resistance and poor impact strength, and cracking, deformation and yellowing are easily caused by climate change in different regions, and particularly, the problem of bonding pad detachment failure caused by cracking caused by stress change under different climate conditions of a display module with small spacing still exists. In order to improve the mechanical strength, reliability, moisture resistance, impact resistance, temperature change resistance, weather resistance and global planarization of the product without changing the overall structure of the product, the product does not have the problems of cracking, deformation and yellowing under different weather conditions, and particularly a small-spacing high-density light emitting diode display screen does not have a better solution in the industry so far.

In the existing manufacturing of the light emitting diode display module or the display screen, a product with a PLCC4 structure or an IMD structure (such as 3528,2121,1010,4 and 1) is mounted on a circuit board through an SMT (surface mount technology), the products exist on the circuit board independently and are separated from each other, gaps exist among the products, the large gap is dozens of millimeters, and the small gap is zero-point millimeters; when the LED is pasted at high temperature (the temperature is higher than 200 ℃), because a product adopting a PLCC4 or IMD structure is a device composed of different materials, the materials are different in expansion with heat and contraction with cold, gaps are easily formed among the materials, moisture in air is easy to continuously permeate into the LED through the gaps when a client uses the LED, and water vapor entering the LED is easy to damage the internal structure of the LED when the LED is used at the later stage, so that the LED has the problems of rubber body burst, delamination, silver glue separation, anode and cathode short circuit, electrochemical reaction and the like, and directly shows serious problems of no light emission, cross light, uneven brightness, short circuit ignition and the like, and particularly shows more obvious performance in a humid season.

After the light-emitting diodes are attached to the circuit board and assembled into the LED display screen, gaps exist among the single light sources, so that the problems of dust accumulation, moisture accumulation, sweat accumulation and pollution after hand touch and the like are more likely to occur, and particularly, after the light-emitting diodes are accumulated for a certain time, the influence on the product is fatal; and is prone to safety issues (metal pins are exposed to the outside).

And at present, the commercial display intelligent terminal which can be touched by the LED electronic in a close range focuses more on man-machine interaction, the surface with the unevenness formed by a single light-emitting component is not suitable for the man-machine interaction, and the circuit is exposed and has potential safety hazards.

And the display screen formed by the light emitting diodes is used for showing the performance, so that the using environment, the using mode and the using time of a client are very bad, and the lamp beads are easy to damage and knock down during carrying and installation. In order to keep pace with the schedule, the screen detached in rainy days can be directly installed into the aviation case too soon to remove water; the storage time is different every time, which may be a month or a half year, so that the moisture in the air is accumulated and adsorbed, when the LED lamp is used next time, as long as the display screen is lightened, the temperature in the LED reaches about 100 ℃, the moisture permeating into the lamp body is vaporized, and then huge stress is released, so that the internal structure of the LED is damaged, and adverse conditions such as glue explosion, delamination, wire breakage, short circuit and the like occur.

COB display module assembly is that the cloth is provided with a plurality of LED and gives out light to the chip on the circuit board to at the upper surface encapsulating, seal up LED with the glue film and give out light to the chip, compare with the LED display module assembly that sets up LED lamp pearl and make on the circuit board, possess high reliability, with low costs, easily realize that the booth is apart from, the luminous, wear-resisting shock-resistant, easy washing, heat-sinking capability are strong a great deal of advantage.

At present, a method for encapsulating a COB display module by glue filling includes coating glue on a release film/release paper which is tiled, clamping a circuit board with an LED light emitting chip by a clamp, pressing the circuit board downwards on the glue, performing high-temperature curing or curing at normal temperature, and removing the release film/release paper.

In the packaging method, because the back surface (the surface back to the LED light-emitting chip) of the circuit board is provided with a large number of electronic elements, the circuit board is difficult to ensure the level when the circuit board is clamped by a clamp, and because the LED light-emitting chip and the electronic elements are distributed on the circuit board, the circuit board is easy to bend and deform under the action of gravity and cannot ensure the level, so that the intervals between the release film/release paper and the circuit board are not uniform, namely the thickness of the formed adhesive layer is not uniform, and the product quality is influenced.

In addition, the conventional COB display module package protects the LED light-emitting chip by using glue with an epoxy resin structure or a silica gel structure, and the glue with the epoxy structure has the characteristics of strong bonding force, high hardness and good moisture resistance, but has the defects of easy yellowing, large stress and poor high-low temperature resistance due to the product characteristics; the silica gel structural adhesive solves the problem of easy yellowing and large stress, but the silica gel has a coarse molecular structure, poor oxygen permeability and air permeability, poor water resistance, easily damaged surface and very difficult production, and the color difference is easily caused by liquid adhesive preparation and various additives in microgrammes; the scheme of adopting the two materials needs to be baked or cured after glue injection or glue pouring, the curing time is long, the production efficiency is low, and the curing process is easy to deform. The circuit board, the solid transparent adhesive layer and the transparent film are stacked in sequence, wherein the melting point of the transparent adhesive layer is lower than that of the transparent film, and when the transparent adhesive layer is molten and the transparent film is not molten, pressure is applied to press the transparent adhesive layer, the transparent adhesive layer and the transparent film together, but the adhesive force between the transparent adhesive layer and the transparent film is slightly insufficient.

Disclosure of Invention

In view of the defects of the prior art, an object of the present disclosure is to provide a COB package module, a packaging method thereof and a Mini LED display screen, which are suitable for reliable packaging of a substrate with low-height LED chips.

In order to achieve the above object, embodiments of the present disclosure provide a method for packaging a COB package module, where the COB package module includes a substrate, and a plurality of light-emitting portions arranged on the substrate in an array; each of the light emitting parts includes at least one LED chip; the maximum height of the LED chip on the substrate is lower than 1mm;

the packaging method comprises the following steps: and controlling an array type spray head with a plurality of spray holes which can be independently controlled to spray photocuring packaging glue solution towards the light-emitting part on the horizontally placed substrate in a horizontal linear reciprocating motion mode until a packaging body for coating the light-emitting part is formed.

As a preferred embodiment, the LED chip is a Mini LED chip or a Micro LED chip; the packaging method comprises the following steps: and controlling an array type spray head with a plurality of light emitting parts with the maximum spray areas capable of covering more than 10 light emitting parts to intermittently spray the packaging glue solution with a preset viscosity range capable of being cured by light towards the light emitting parts on the horizontally placed substrate at a preset glue spraying speed in a mode that the horizontal linear reciprocating movement is realized and the distance between the spray holes and the substrate is less than 1.5cm until the packaging body for covering the light emitting parts is formed.

In a preferred embodiment, the predetermined viscosity range is 7.623cP to 21.432cP at 40 ℃ to 50 ℃; the preset glue spraying rate is that at least 10000 glue drops per second through a single spray hole, and the single glue drop amount is 5-100 picoliters.

In a preferred embodiment, the array-type spray head intermittently sprays glue to any one of the light-emitting parts through horizontal linear reciprocating movement, and the glue is stacked layer by layer in the area where the light-emitting part is located to form the package body.

In a preferred embodiment, the array head has a maximum ejection area that covers 20 or more of the light-emitting portions, and the array head has a maximum ejection area that covers 50 or more of the light-emitting portions.

As a preferred embodiment, the packaging method includes:

a fence spraying process, wherein the array type spray head is controlled to spray first packaging glue solution towards the interval area between the adjacent light emitting parts in a horizontal linear reciprocating movement mode until fences which surround each light emitting part independently are formed;

and a filling and spraying process, wherein the array type spray head is controlled to spray second packaging glue solution towards the surrounding area of the fence in a horizontal linear reciprocating movement mode until a packaging body covering the light emitting part is formed.

As a preferred embodiment, the first encapsulation glue solution is a non-transparent glue solution; the second packaging glue solution is transparent glue solution, and the viscosity of the second packaging glue solution is lower than that of the first packaging glue solution.

As a preferred embodiment, there is a difference in injection area of at least two single-pass movements.

In a preferred embodiment, in the fence spraying step, the array-type heads are controlled to spray the fences to form a grid structure onto the substrate, and the light-emitting portions are located in grid holes in one-to-one correspondence.

In a preferred embodiment, the second potting adhesive is injected into the fence in the filling and injecting step until the filled second potting adhesive protrudes from the fence.

As a preferred embodiment, the packaging method includes: and a first curing process of controlling a first curing light source moving together with the array type spray head to irradiate the substrate while the array type spray head sprays the packaging glue solution so as to cure the sprayed packaging glue solution.

As a preferred embodiment, the packaging method further includes: and a second curing process of controlling a second curing light source to perform secondary curing on the packaging body after the glue spraying is finished.

As a preferred embodiment, the packaging method includes: and controlling the array type spray head to spray packaging glue solution to the substrate until a packaging layer of an integrated curing and forming structure which covers the surface of the substrate and covers all the light emitting parts is formed.

As a preferred embodiment, the packaging method includes:

a region acquisition step of acquiring a target encapsulation region including sub-encapsulation regions arranged in an array; the light emitting parts are correspondingly positioned in the sub-packaging areas;

and a glue spraying packaging process, wherein the array type spray heads are controlled to spray glue to the sub-packaging areas until bowl-shaped packaging bodies which correspondingly coat the light emitting parts one by one are formed.

As a preferred embodiment, one glue-spraying layer is formed by one linear single-pass movement, and two glue-spraying layers are formed by one linear reciprocating movement;

in the glue spraying and packaging process, after spraying a first number of first glue spraying layers to the sub-packaging region, spraying a second number of second glue spraying layers with reduced spraying areas to the first glue spraying layers, and circularly executing the steps until spraying an nth glue spraying layer with reduced spraying areas to the nth-1 glue spraying layer to form a bowl-shaped packaging body; wherein n is a positive integer greater than 2, and the reduced spray area is that the spray area of the nth spray glue layer is smaller than that of the (n-1) th spray glue layer.

In a preferred embodiment, two adjacent sub-package regions are disposed at a distance.

As a preferred embodiment, each of the light emitting parts includes 3 or more LED chips, and further, each of the light emitting parts includes 3 or 4 LED chips.

In a preferred embodiment, the package has a flat surface or a convex smooth spherical surface.

As a preferred embodiment, the substrate is provided with a mounting groove for accommodating the LED chip; the packaging method comprises the following steps:

filling, namely controlling the array type spray head to intermittently spray glue solution into the mounting groove in a horizontal linear reciprocating movement mode until the mounting groove is filled to be flush with the surface of the substrate;

and a packaging process, wherein the array type spray head is controlled to intermittently spray glue solution to the position of the filled mounting groove in a horizontal linear reciprocating movement mode until the packaging body is formed.

As a preferred embodiment, one glue-spraying layer is formed by one linear single-pass movement of the array type spray head, and two glue-spraying layers are formed by one linear reciprocating movement;

in the glue spraying and packaging process, spraying a preset number of glue spraying layers to the sub-packaging area, and curing to form a bowl-shaped packaging body; wherein the spraying areas of the glue spraying layers are the same;

and starting a first curing light source moving along with the array type spray head for curing while the array type spray head sprays glue.

The embodiment of the present specification further provides a COB package module, which includes a substrate, and a plurality of light-emitting portions arranged on the substrate in an array; each of the light emitting parts includes at least one LED chip; the maximum height of the LED chip on the substrate is lower than 1mm; the substrate is also provided with a packaging body made of light-cured resin and used for coating the light-emitting part.

In a preferred embodiment, the package body has a bowl-shaped structure with a spherical structure, and the light emitting portions are wrapped in the package body in a one-to-one correspondence.

In a preferred embodiment, two adjacent packages are spaced apart from each other.

In a preferred embodiment, the sealing body of each light emitting part is fused to form an integrally cured sealing layer covering the substrate.

As a preferred embodiment, the encapsulation layer is provided with a convex spherical structure corresponding to each of the light emitting parts one by one.

As a preferred embodiment, the package body has a fence surrounding the light emitting part and a transparent filling body filled in the fence; the filling body and the fence are made of different materials.

In a preferred embodiment, the fence is a rectangular frame, two adjacent fences share a fence edge, and the fences on the substrate form a grid structure.

As a preferred embodiment, each light emitting section comprises 3 or 4 LED chips.

As a preferred embodiment, the COB package module is a Mini LED backlight module or a Micro LED module.

The embodiment of this specification still provides a Mini LED display screen, includes: a backlight as claimed in any one of claims 22 to 30.

Has the advantages that:

the packaging method of the COB packaging module provided by the embodiment of the disclosure can control the array type spray head to spray the photocuring packaging glue solution towards the light-emitting part on the horizontally placed substrate in a horizontal linear reciprocating motion mode until a packaging body covering the light-emitting part is formed, and is suitable for reliable packaging of the substrate with the low-height LED chip. The packaging method can greatly improve the packaging efficiency by adopting the array type spray heads, and the packaging efficiency can be improved by more than 2 times and even can be improved by more than 3 times through actual tests.

This disclose COB encapsulation module that an embodiment provided, the LED chip is in the maximum height of base plate is less than 1mm, still is equipped with the packaging body with the luminous part cladding photocuring resin material on the base plate, and photocuring resin curing efficiency is fast, and then can realize reliably encapsulating the specific area of base plate fast, and production efficiency is high.

Specific embodiments of the present invention are disclosed in detail with reference to the following description and drawings, indicating the manner in which the principles of the invention may be employed. It should be understood that the embodiments of the invention are not so limited in scope.

Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.

It should be emphasized that the term "comprises/comprising" when used herein, is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive labor.

Fig. 1 is a schematic view of a COB package module packaging apparatus according to an embodiment of the present disclosure;

FIG. 2 is a schematic view of the internal glue-spraying assembly and the working table of FIG. 1;

FIG. 3 is a partial schematic view of FIG. 2;

FIG. 4 is a front view of FIG. 3;

FIG. 5 is a schematic structural view of the glue-spraying assembly of FIG. 2;

FIG. 6 is a schematic diagram illustrating an arrangement of orifices of a piezo array showerhead, according to an embodiment of the present disclosure;

FIG. 7 is a schematic view of an arrangement of orifices of a piezo array showerhead provided in accordance with another embodiment of the present disclosure;

fig. 8 is a schematic pitch diagram of a curing light source and an array head of a COB package module packaging apparatus according to an embodiment of the present disclosure;

FIG. 9 is a schematic view of the glue-spraying process of FIG. 1;

fig. 10 is a top view of a COB package module according to an embodiment of the present disclosure;

fig. 11 is a side view of a COB package module according to an embodiment of the present disclosure;

fig. 12 is a top view of a COB package module according to another embodiment of the present disclosure;

fig. 13 to 19 are photographs of a package of the packaging apparatus of fig. 1 for Mini LED packaging experiments.

Description of reference numerals:

1. an equipment housing; 2. an observation window; 3. an equipment door; 4. an equipment support; 5. mounting a platform; 6. a support frame; 7. a support plate; 10. spraying a glue component; 11. a spray head; 12. a glue solution input joint; 13. a glue solution output joint; 15. a first moving assembly; 16. a positioning part; 20. a curing light source; 21. a water-cooled input joint; 22. a water-cooled output joint; 23. a power supply connector; 25. mounting a plate; 30. a work table; 35. a second moving assembly; 36. a rotating assembly;

113. a group of spray holes; 114. spraying a hole row; 115. spraying a glue panel; 116. spraying a hole; 117. a spacer section; f1, a first direction; f2, a second direction; x, horizontal direction;

100. a substrate; 110. an electronic component; 120. a fence; 160. an LED chip; 170. a package body; 180. a light emitting section.

Detailed Description

In order to make those skilled in the art better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, shall fall within the scope of protection of the present invention.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1 to 5, one embodiment of the present disclosure provides a COB package module packaging apparatus. The COB package module packaging apparatus is suitable for the protection packaging of the electronic component 110 on the substrate 100. The COB package module includes a substrate 100 and an electronic component 110 disposed on the substrate 100. The electronic element 110 may be a plurality of light emitting parts 180 arranged in an array. Especially, this COB encapsulation module equipment is applicable to the electronic packaging of the thin type of low height or the PCBA board of paster. In particular, the maximum height of the electronic component 110 with respect to the surface of the substrate 100 (PCB) is less than 1cm. Further, the maximum height of the electronic component 110 with respect to the surface of the substrate 100 is less than 0.5mm. Each light emitting part 180 includes at least one LED chip 160. The maximum height of the LED chip 160 in the substrate 100 is less than 1mm. Further, the maximum height of the LED chip 160 on the substrate 100 is less than 0.5mm. Further, the maximum height of the LED chip 160 at the substrate 100 is less than 0.3mm. The size of the LED chip 160 is less than 300 μm, and further less than 200 μm. Mini LED backlight board or Micro LED backlight board belongs to PCBA.

In this embodiment, COB encapsulation module encapsulation equipment includes: the glue spraying assembly 10, the first moving assembly 15 and the workbench 30. The table 30 is provided on the equipment stand 4. The equipment rack 4 has a mounting platform 5 on which a table 30 is mounted. The mounting platform 5 is provided with a support frame 6 for supporting the first moving assembly 15. The support frame 6 supports the glue spraying assembly 10 and the first moving assembly 15 across the mounting platform 5, and forms a gantry-like mechanism. A supporting plate 7 is supported on the supporting frame 6, and a first moving assembly 15 is fixedly arranged on the front plate surface of the supporting plate 7.

Encapsulation equipment has equipment housing 1, spouts gluey subassembly 10, first removal subassembly 15, workstation 30 and is located equipment housing 1, avoids environmental impurity to enter into the glue solution in influence encapsulation quality. The top of equipment casing 1 has observation window 2 to observe the encapsulation condition of base plate 100, can open the equipment door 3 that observation window 2 belonged to through the handle after COB encapsulation module encapsulation finishes, move out base plate 100, and send into new base plate 100. A storage door is arranged below the device shell 1, and a storage space is formed on the inner side of the storage door.

The glue-spraying assembly 10 has a plurality of spray holes 116 for independently controlling spraying. The first moving assembly 15 is connected with the glue spraying assembly 10. The first moving assembly 15 is used for driving the glue spraying assembly 10 to linearly reciprocate along a first horizontal direction X. The table 30 is located below the nozzle holes 116. The table 30 is lower in height than the nozzle hole 116. The stage 30 has a placing surface for placing the substrate 100.

The glue spraying component 10 is fixedly provided with at least one array spray head 11. The array nozzle 11 is provided with a glue solution input joint 12 and a glue solution output joint 13 to communicate with a glue solution storage box. Each array nozzle 11 is communicated with a glue solution storage box in a one-to-one correspondence way through a glue solution input joint 12 and a glue solution output joint 13. Each array head 11 is independently supplied with the glue solution.

As shown in fig. 3, 4 and 5, the glue-spraying assembly 10 includes two

array heads

11a and 11b. The two

array heads

11a, 11b are arranged along the first horizontal direction X. The height position of the glue spraying assembly 10 in the packaging equipment is unchanged. The array head 11 is a piezoelectric array head 11. The array nozzle 11 has a glue spraying panel 115, and a plurality of parallel nozzle holes 114 are distributed on the glue spraying panel 115, that is, a plurality of parallel nozzle holes 116 are distributed on the glue spraying panel 115. As shown in fig. 7, each orifice row 114 has a plurality of independently injection-controlled orifices 116 arranged in the first direction F1. The plurality of nozzle hole rows 114 are arranged in a second direction F2 perpendicular to the first direction F1.

As shown in fig. 6 and 7, in the nozzle hole row 114, a hole interval portion 117 is provided between two adjacent nozzle holes 116. At least one orifice spacer 117 is at least partially aligned with at least one orifice 116 in another orifice row 114 along the second direction F2. Further, the hole spacer 117 is centrally aligned with a nozzle hole 116 along the second direction F2. The projection of the plurality of nozzle hole rows 114 on the glue-spraying panel 115 along the second direction F2 forms a complete straight line, so that the plurality of nozzle hole rows 114 can mutually supplement the non-glue-spraying point positions during glue spraying to form linear glue spraying.

In this way, in two adjacent nozzle hole rows 114, the nozzle holes 116 of one nozzle hole row 114a are aligned with the hole spacers 117 of the other nozzle hole row 114b along the second direction F2, and the nozzle holes 116 are staggered. Thus, the hole spacing portions 117 of the nozzle hole rows 114a are compensated by the nozzle holes 116 of the adjacent nozzle hole rows 114b in the second direction F2 (the traveling direction of the nozzle 11, i.e., the first horizontal direction X), which not only reduces the size of the nozzle holes 116, increases the number of the nozzle holes 116, and increases the accuracy of the glue spraying position, but also avoids the occurrence of un-glue-sprayed spots, so that the glue spraying is more uniform, and the packaging quality is improved. Wherein the first direction F1 is perpendicular to the first horizontal direction X. The second direction F2 is parallel to the first horizontal direction X.

As shown in fig. 5 and 8, the glue spraying assembly 10 is further fixedly provided with a curing light source 20. The curing light source 20 is an LED lamp with the wavelength of 365-395 nm. UV energy of 8000mW/cm ³ . The curing light source 20 has a curing depth of 100 to 3000 μm. The curing light source 20 is located on at least one side of the glue-spraying assembly 10 in the first horizontal direction X. The light emitting surface of the curing light source 20 is oriented perpendicular to the stage 30. The curing light source 20 is further provided with a water-cooling heat dissipation structure. The light emitting surface of the curing light source 20 is arranged vertically downward. The curing light source 20 is provided with a water-cooling input connector 21 and a water-cooling output connector 22. A power supply connector 23 (cable connector) is arranged between the water-cooling input connector 21 and the water-cooling output connector 22To input electrical energy.

As shown in fig. 4 and 5, the curing light sources 20 are respectively disposed on two sides of the glue spraying assembly 10 in the first horizontal direction X. The lower end of the glue-spraying assembly 10 has a horizontal mounting plate 25. Two curing

light sources

20a, 20b (UV lamps) are respectively mounted on the mounting plate 25 at the same level (at the same height) as the array head 11. When moving along the first horizontal direction X, the curing light source 20 at the rear side of the glue spraying component 10 in the moving direction can be turned on to realize the following curing after glue spraying, and the glue spraying and curing are performed at the same time.

As shown in fig. 8, in order to have a better curing effect and avoid the curing light source 20 from affecting the ejection of the glue solution (mainly avoid the liquid droplet being cured before contacting the substrate 100), the horizontal distance L5 between the curing light source 20 and the array head 11 is greater than 5cm. The horizontal spacing L5 between the curing light source 20 and the array head 11 is within 15 cm.

The glue-spraying assembly 10 is further provided with a positioning portion 16 for positioning the substrate 100. As shown in fig. 4, the positioning portion 16 is fixed to one side of the glue spraying assembly 10 in the first horizontal direction X. Facing fig. 4, the positioning portion 16 is fixed to the right side of the glue-jet assembly 10, adjacent to the right-side curing light source 20. The curing light source 20 does not interfere with the positioning portion 16. Specifically, the positioning portion 16 includes a visual positioning component. For example, the positioning portion 16 includes a CCD vision positioning system. The substrate 100 has a specific position point (Mark point) or predetermined electronic component 110 that can be recognized by the visual alignment assembly. The positioning part 16 positions a specific position point or a predetermined electronic component 110, and the stage 30 is adjusted according to the positioning condition, so that the substrate 100 is accurately adjusted to a predetermined glue spraying position. In other embodiments, the locator 16 may also be an ultrasonic locator.

In the present embodiment, the first moving assembly 15 includes a lead screw module. The screw rod die is provided with a servo motor and a screw rod driven by the servo motor to rotate. The screw module is provided with a slide block sliding along the screw. The glue spraying assembly 10 comprises a glue spraying support fixedly connected with the sliding block, and the glue spraying assembly 10 moves linearly and reciprocally along with the sliding block. The glue spraying component 10 forms a glue spraying support of the glue spraying shell, the plurality of array spray heads 11 are fixed in the glue spraying shell, or the array spray heads 11 are fixedly arranged at the bottom of the glue spraying support facing downwards, a glue spraying panel 115 of the array spray heads 11 is a horizontal panel, and spray holes 116 are vertically downward and perpendicular to the workbench.

In other embodiments, the first moving assembly 15 comprises an electric cylinder, a linear guide. The glue spraying assembly 10 comprises a glue spraying bracket which is slidably arranged on the linear guide rail and is driven by the electric cylinder to do reciprocating linear motion along the linear guide rail; the array nozzle 11 is fixedly arranged on the glue spraying bracket.

The moving speed of the spray head 11 is too fast, the error after curing is larger, but the speed of the spray head 11 is too low, the curing effect of the glue solution and the packaging efficiency are not expected, and in order to avoid the problems, in the glue spraying process, the moving speed of the glue spraying assembly 10 is controlled to be lower than 50mm/s, further, the moving speed of the glue spraying assembly 10 is controlled to be lower than 30mm/s, and further, the moving speed of the glue spraying assembly 10 is controlled to be lower than 20mm/s.

In this embodiment, the packaging apparatus further includes: a rotating assembly 36 and a second moving assembly 35. Wherein the rotation assembly 36 is used to drive the table 30 to rotate about a vertical axis. The second moving assembly 35 is configured to drive the worktable 30 to move in a second horizontal direction perpendicular to the first horizontal direction X. The table 30 is operably rotatably supported on a rotating assembly 36. The rotating assembly 36 may be a rotary servomotor, to the output of which the table 30 is connected, or the table 30 may be connected through a speed reducing mechanism such as a reducer.

The second moving assembly 35 can refer to the first moving assembly 15, and the repetition is not repeated. The rotating assembly 36 is disposed on the second moving assembly 35 and driven to move along a second horizontal direction. The rotating assembly 36 is moved in the second horizontal direction by the second moving assembly 35 together with the table 30, and can be positioned at a predetermined position.

Through the in-plane rotation and the height adjustment of workstation 30 to carry out the fine positioning with placing the base plate 100 on workstation 30, spout gluey position to the regulation with base plate 100 adjustment, conveniently realize the accuracy in the follow-up gluey in-process that spouts and spout gluey encapsulation. The position of the glue spraying component 10 in the second horizontal direction is fixed, and only the linear motion in the first horizontal direction X can be carried out. When the width of the substrate 100 is too large, the workbench 30 moves in the second horizontal direction when the spray head 11 cannot finish spraying once, so that the glue spraying assembly 10 sprays glue on different areas of the substrate 100 successively, and the glue spraying protection of the large-area substrate 100 is realized.

In order to realize the automatic packaging and improve the production efficiency, in one embodiment, the packaging equipment further comprises a control device connected with the glue spraying component 10 and the first moving component 15, and the control device can control the glue spraying component 10 to linearly move back and forth along the first horizontal direction X to spray the UV glue solution to the target glue spraying area of the PCBA board.

In another embodiment, the packaging device further comprises an acquisition module for acquiring the information of the glue spraying area, and a control device connected with the glue spraying assembly 10, the first moving assembly 15 and the acquisition module. The control device can control the glue spraying component 10 to spray the UV glue solution to the target glue spraying area of the PCBA board in a linear reciprocating mode in the horizontal direction X.

The acquisition module comprises a network transmission module, or drawing software, or drawing guidance software, or a data transmission interface such as a USB interface, a type-C interface and the like, so as to input or lead in the glue spraying information picture. The acquisition module can also comprise information input equipment such as a touch screen or a keyboard, so that the number of target glue spraying layers is input. The controller runs with upper computer software.

One embodiment of the present disclosure provides a piezoelectric array nozzle 11 for packaging a substrate 100, wherein the nozzle 11 has a glue spraying panel 115, and a plurality of parallel nozzle rows 114 are distributed on the glue spraying panel 115. Each orifice row 114 has a plurality of independently injection-controlled orifices 116 arranged in the first direction F1. The multi-orifice rows 114 are arranged in a second direction F2 perpendicular to the first direction F1. In the nozzle hole row 114, a hole interval portion 117 is provided between two adjacent nozzle holes 116. At least one orifice spacer 117 is at least partially aligned with at least one orifice 116 in another orifice row 114 along the second direction F2.

The piezoarray nozzle 11 can be referred to with the nozzles in the above embodiments, and the repetition points are not described again.

One orifice 116 in one orifice row 114a is at least partially offset from the nearest adjacent orifice 116 in the other orifice row 114b in the second direction F2. In two

adjacent nozzle rows

114a, 114b, each nozzle 116 is staggered along the second direction F2. The nozzle rows 114 on both sides of one nozzle row 114 are aligned one by one along the second direction F2. The glue spraying panel 115 is provided with more than 5 rows of spray holes 116. Each orifice row 114 includes at least 50 orifices 116. Further, each orifice row 114 includes at least 100 orifices 116. The spacing between two orifices 116 is less than the orifice 116 diameter. Of course, there are embodiments in which the spacing between the orifices 116 is greater than the diameter of the orifices 116.

In order to be suitable for the glue-spraying packaging of the substrate 100, the volume of a single drop of the spray hole 116 is 50 picoliters to 100 picoliters. Alternatively, the single glue spraying of the spray hole 116 is 50 picoliters to 100 picoliters. The spray hole 116 realizes continuous output of glue solution through high-frequency (high-frequency) glue spraying. Each spray hole 116 of the spray head 11 can spray more than 10000 times per second. Further, each orifice 116 of the nozzle 11 can inject up to 20000 injections per second.

As shown in fig. 7, two adjacent staggered nozzle hole rows 114 constitute a nozzle hole group 113. The glue-spraying panel 115 is arranged with a plurality of parallel nozzle hole groups 113 in the second direction F2. The plurality of

nozzle hole groups

113a, 113b are symmetrically arranged on the glue-spraying panel 115. Alternatively, the plurality of nozzle groups 113 are in a translating configuration. In the second direction F2, a spacing distance L1 between two adjacent

nozzle hole groups

113a, 113b is greater than a spacing distance L2 between two

nozzle hole rows

114a, 114b within the nozzle hole group 113. The hole spacer 117 is centrally aligned with an orifice 116 along the second direction F2.

Still another embodiment of the present disclosure provides a COB encapsulation UV glue solution suitable for the piezoelectric array nozzle 11. The viscosity range of the UV glue solution is 5-25cP at 40-50 ℃, the surface tension range is 20-40mN/m, the density range is 0.8-1.2g/cm & lt 3 & gt, and the pH value range is 6-8 (test paper test). Further, the viscosity range of the UV glue solution is 10-15cP, the surface tension range is 25-35mN/m, and the density range is 0.9-1.0g/cm3. The UV glue solution is colorless transparent or light yellow transparent glue solution (under visual inspection conditions).

The UV glue solution comprises acrylate resin (oligomer) with the concentration range of 10% -30%, acrylate monomer (reactive diluent) with the concentration range of 60% -80%, photoinitiator with the concentration range of 2% -10% and auxiliary agent with the concentration range of 0.05% -2%. The UV glue solution has 100% of solid content, has no solvent volatilization in the curing process, and has the characteristics of safety, health, environmental protection, no toxicity, no harm, no flammability, no explosion and the like.

The UV glue solution is a single-component ultra-low viscosity ultraviolet curing electronic packaging solvent-free glue solution. The UV glue solution can be cured within 10s under the irradiation condition of ultraviolet rays (365-395 nm) with certain wavelength. The cured UV glue solution has excellent performances of water resistance, moisture resistance, cold and heat shock resistance, mould resistance and the like, and is suitable for protecting PCBA welding spots, pins or discrete components which are pasted on various surfaces.

The UV glue solution has an ultralow viscosity characteristic, is suitable for being selectively sprayed and covered on the substrate 100 by adopting an ink-jet spraying mode of the piezoelectric array nozzle 11, and can emit fluorescence under ultraviolet light after being cured, so that the packaging effect inspection is convenient.

In this embodiment, the photoinitiator mainly includes a radical photoinitiator and a cationic photoinitiator. In the UV glue solution, an auxiliary agent (additive) is added to meet the use requirement, wherein the auxiliary agent can be pigment, wetting dispersant, polymerization inhibitor and the like. The effect of various auxiliary agents is obvious, which not only can obviously improve the UV performance, but also can enlarge the application range and reduce the cost.

Preferably, the auxiliary agent can be an inorganic nano material, so that the performance of the cured protective layer is improved, and the reinforced toughening performance is realized. The nano SiO2 is added into the UV glue solution, so that the bonding performance and the sealing effect are greatly improved. Specifically, the CYA-150 nano silicon dioxide is selected as an auxiliary agent, and when the mass fraction is 2%, the adhesive strength of the adhesive can be obviously improved.

The UV glue solution provided by the embodiment forms a UV curing protective layer after curing, and the UV curing protective layer has better mechanical and thermal properties. Specifically, the breaking strength of the UV-cured protective layer at 25 ℃ is 5.4Mpa, and the breaking elongation is 140%. The elastic modulus of the UV-cured protective layer is 25.2MPa. The glass transition temperature of the UV-cured protective layer was-15 ℃. The linear thermal expansion coefficient is 21.8 ppm/DEG C at-15 ℃ to 0 ℃ and 240.9 ppm/DEG C at 45 ℃ to 80 ℃.

Meanwhile, the UV curing protective layer also has excellent electrical properties, the dielectric constant of the UV curing protective layer is 5.47 (1 GHz), and the breakdown strength under the test condition of the thickness of 1.5mm is 15.8kV/mm. The volume resistivity of the UV-curable protective layer was 3.1X 1014. Omega. Cm without being soaked in water, and 1.7X 1014. Omega. Cm with being soaked in water at 23 ℃ for 168 hours. The UV-cured protective layer had a surface resistance of 4.21X 1010. Omega. At 250V.

The UV cured protective layer also has excellent environmentally reliable properties. The surface of the UV curing protective layer has no obvious change, no bubble, no rust, no crack and no peeling after being tested for 1000 hours in the environment of 85 ℃/85 and RH, and the UV curing protective layer has better high temperature and high humidity resistance. And (2) performing a thermal shock resistance test at-40 ℃/30 min-1 min-80 ℃/30min (wherein the temperature is switched for 1 minute, namely, the temperature is kept for 30 minutes at-40 ℃, then the temperature is switched to 80 ℃ within 1 minute, the temperature is kept for 30 minutes at 80 ℃, and the thermal shock resistance test is performed in sequence, wherein the surface of the UV curing protective layer has no obvious change, no crack and no peeling after the cycle is 250 hours, the UV curing protective layer has no obvious change after the test is performed for 300 hours under neutral smoke in a salt spray resistance test, and the UV curing protective layer also has the 0-grade mildew resistance under a mildew resistance test.

The test results show that the UV glue solution can be accurately controlled in the range of packaging thickness of 100-3000 micrometers by matching with the piezoelectric array nozzle 11, the cured protective layer has excellent toughness, has good resistance effects on mechanical impact, cold and hot impact, high temperature and high humidity, has higher surface resistance and volume resistance, and can provide good insulation protection for PCBA even under humid conditions.

The UV glue solution is cured by pure UV, compared with UV humidified gas curing, the curing and drying time of the UV glue solution is greatly shortened, and due to the ultralow viscosity and surface tension of the UV glue solution, the UV glue solution can be uniformly spread without bubbles, and a cured protective layer has a smooth surface and a straight and neat edge.

As shown in fig. 10 to 12, the present disclosure also provides a COB package module. For example, the COB package module may be a Mini LED backlight module or a Micro LED module. Specifically, the COB package module includes a substrate 100 and a plurality of light emitting parts 180 arranged on the substrate 100 in an array. Each light emitting part 180 includes at least one LED chip 160. The maximum height of the LED chip 160 in the substrate 100 is less than 1mm. Further, the maximum height of the LED chip 160 with respect to the surface of the substrate 100 is less than 0.5mm. Further, the maximum height of the LED chip 160 at the substrate 100 is less than 0.3mm. The size of the LED chip 160 is less than 300 μm, and further less than 200 μm. The substrate 100 is further provided with a package 170 made of a light-curable resin material for covering the light-emitting part 180.

The COB package module that this disclosed embodiment provided, LED chip 160 is in the maximum height of base plate 100 is less than 1mm, still is equipped with the packaging body 170 with the photocuring resin material of luminous part 180 cladding on the base plate 100, and photocuring resin curing efficiency is fast, and then can realize reliably encapsulating the specific area of base plate 100 fast, and production efficiency is high.

In one embodiment, as shown in fig. 10, 11, and 13 to 18, the package body 170 is a bowl-shaped structure having a spherical structure, and the light emitting portions 180 are wrapped in the package body 170 in a one-to-one correspondence. Two adjacent packages 170 are spaced apart from each other, where C in fig. 13 to 18 denotes a circumferential length, S denotes an area, D denotes a diameter, R denotes a radius, and L denotes a length.

In another embodiment, as shown in fig. 9, the encapsulation 170 of each light emitting portion 180 is fused to form an integrally cured encapsulation layer covering the substrate 100. The encapsulation layer may be provided with a convex spherical structure corresponding to each of the light emitting parts 180 one by one.

In one embodiment, as shown in fig. 12 and 19, the package body 170 has a fence 120 surrounding the light emitting part 180 and a transparent filling body (not shown) filled in the fence 120. The filling body and the fence 120 are made of different materials. The fence 120 is a rectangular frame, two adjacent fences 120 share a fence edge, and the fences 120 on the substrate 100 form a grid structure.

In the present embodiment, each light emitting part 180 includes 3 or 4 LED chips 160. Preferably, each light emitting part 180 includes 4 LED chips 160, which are an rgb LED chip and a white LED chip, respectively.

Yet another embodiment of the present disclosure provides a Mini LED display screen including a backlight panel. The backlight plate is the COB package module as described in any one of the above embodiments.

As shown in fig. 9, a still further embodiment of the present disclosure provides a method for packaging a COB package module, wherein the COB package module includes a substrate 100 and a plurality of light emitting parts 180 arranged on the substrate 100 in an array. Each light emitting part 180 includes at least one LED chip 160. The maximum height of the LED chip 160 in the substrate 100 is less than 1mm. Specifically, each light emitting part 180 includes 3 or more LED chips 160, and further, each light emitting part 180 includes 3 or 4 LED chips 160.

The packaging method comprises the following steps: the array type spray head with a plurality of spray holes 116 which can be independently controlled to spray is controlled to spray the light-curable packaging glue solution towards the light-emitting part 180 on the horizontally placed substrate 100 in a horizontally linear reciprocating manner until the packaging body 170 which covers the light-emitting part 180 is formed. The packaging glue solution is light-cured epoxy resin. The packaging method of the COB package module is suitable for reliable packaging of the substrate 100 with the low-height LED chip 160.

Specifically, the LED chip 160 is a Mini LED chip 160 or a Micro LED chip 160. The packaging method comprises the following steps: the method comprises the steps of controlling an array type spray head with a plurality of light emitting parts 180 with the maximum spray area capable of covering more than 10 light emitting parts 180 to perform horizontal linear reciprocating movement, and intermittently spraying packaging glue with a preset viscosity range capable of being cured by light towards the light emitting parts 180 on the substrate 100 horizontally placed at a preset glue spraying speed in a mode that the distance between a spray hole 116 and the substrate 100 is less than 1.5cm until a packaging body 170 for coating the light emitting parts 180 is formed. The package body 170 has a flat surface or a convex smooth spherical surface. As shown in fig. 9, the package body 170 has a flat surface; as shown in fig. 10 and 11, the package body 170 has a smooth spherical surface protruding outward.

In one embodiment, the predetermined viscosity range is 7.623cP to 21.432cP at 40 ℃ to 50 ℃. The preset glue spraying rate is that at least 10000 glue drops per second are sprayed through a single spray hole 116, and the single glue drop amount is 5-100 picoliters.

In this embodiment, the array-type nozzle forms intermittent spraying glue on any light-emitting part 180 by moving horizontally and linearly in a reciprocating manner, and the glue is stacked layer by layer in the area where the light-emitting part 180 is located to form the package 170. The array head may cover 20 or more light emitting parts 180 in a maximum ejection area. Further, the maximum ejection area of the array type head may cover more than 50 light emitting parts 180.

In one embodiment, the encapsulation method includes a fence spraying process and a fill spraying process. As shown in fig. 12, the fence spraying process is to control the array type spray head to spray the first encapsulant toward the spaced area between the adjacent light emitting parts 180 in a manner of horizontally and linearly reciprocating until the fence 120 is formed to individually surround each light emitting part 180. The filling and spraying process is to control the array type spray head to spray a second encapsulation glue solution to the surrounding area of the rail 120 in a manner of horizontal linear reciprocating movement until a package body 170 covering the light emitting part 180 is formed. The package body 170 has a flat surface.

Further, the second encapsulation glue solution is transparent glue solution, and the viscosity of the second encapsulation glue solution is lower than that of the first encapsulation glue solution. The first packaging glue solution is non-transparent glue solution, so that the problem of whitening under stray light and black light can be avoided, and the resolution can be improved. The first encapsulating glue may be a colored glue, such as black, so that the rail 120 is opaque to light, thereby forming a COB encapsulating module with regional backlight. Of course, the second encapsulating glue may be the same as the first encapsulating glue.

In the fence spraying process, the array type spray heads are controlled to spray the fence 120 forming the grid structure to the substrate 100, as shown in fig. 12. The light emitting parts 180 are located in the mesh holes in a one-to-one correspondence. The fence 120 is lower than the LED chip 160. Because the volume of the glue solution is reduced to a certain extent after the glue solution is cured, the second encapsulation glue solution is injected into the fence 120 in the filling and injecting process until the filled second encapsulation glue solution protrudes out of the fence 120, so that the second encapsulation glue solution can be leveled with the fence 120 after being cured. In other embodiments, the pens 120 can be higher than the LED chips 160, or the pens 120 are flush with the LED chips 160.

The grid enclosed by the fence 120 may be rectangular or other shapes. Preferably, as shown in fig. 19, the grid enclosed by the fence 120 is rectangular, and the length and width of the grid are 2mm to 5mm. Furthermore, the length and the width of the grid are 3mm to 4mm. Preferably, the width of the fence 120 is 0.1mm to 0.5mm. More preferably, the width of the fence 120 is 0.2mm to 0.3mm.

In an embodiment, the encapsulation method includes a first curing process of controlling a first curing light source moving together with the array type nozzle to irradiate the substrate 100 while the array type nozzle sprays the glue solution to cure the sprayed encapsulation glue solution.

Further, the packaging method further comprises the following steps: and a second curing step of controlling a second curing light source to perform secondary curing on the package 170 after the glue spraying is finished. The curing operation is not limited to curing while spraying glue, and only the second curing step may be provided instead of the first curing step, and the curing operation may be performed after spraying glue. In particular, in the filling and spraying process, glue can be sprayed first, and then curing can be carried out when the last 1-3 layers of glue are sprayed.

In one embodiment, the packaging method comprises: the array type spray head is controlled to spray the encapsulation glue solution to the substrate 100 until an encapsulation layer of an integrated curing and molding structure is formed, which covers the surface of the substrate 100 and covers all the light emitting parts 180, as shown in fig. 9. The package body 170 has a flat surface.

In a preferred embodiment, the packaging method comprises: a region acquisition step of acquiring a target encapsulation region including sub-encapsulation regions arranged in an array; the light emitting parts 180 are located in the sub-package regions in a one-to-one correspondence; and a glue spraying and packaging process, wherein the array type spray heads are controlled to spray glue to the sub-packaging areas until bowl-shaped packaging bodies 170 which correspondingly coat the light emitting parts 180 one by one are formed. Two adjacent sub-packaging areas are arranged at intervals.

In the packaging method, one glue-spraying layer is formed by one-time linear one-way movement, and two glue-spraying layers are formed by one-time linear reciprocating movement. In the packaging method of the COB packaging module, the spraying areas of at least two single-pass movements are different.

In the encapsulation method, the number of the sprayed glue layers is not more than 30, further not more than 20, further not more than 15, and particularly not more than 10. Such as the embodiments shown in fig. 9-11, each package 170 is sprayed with 10 layers of glue. And curing each glue spraying layer while spraying the glue spraying layer on the sub-packaging area, and performing secondary curing after curing the last glue spraying layer. The second curing time is much longer than the first curing time, and the package 170 is transparent and has a bowl-shaped structure.

In one embodiment, in the glue-spraying packaging process, after spraying a first number of first glue-spraying layers to the sub-packaging region, spraying a second number of second glue-spraying layers with a reduced spraying area to the first glue-spraying layer, and repeating the steps until spraying an nth glue-spraying layer with a reduced spraying area to the nth-1 glue-spraying layer to form the bowl-shaped package 170. Wherein n is a positive integer greater than 2, and the reduced spray area is that the spray area of the nth adhesive spray layer is smaller than that of the (n-1) th adhesive spray layer.

Through long-term research, even if the glue solution is sprayed to a sub-packaging area with a tiny area, and one layer is solidified per sprayed layer, the low viscosity characteristic of the glue solution still forms self-flowing, and further forms a smooth coating outer surface, and as the number of the sprayed glue layers increases, although the glue spraying area is not changed, a theoretical "cylindrical" packaging body 170 is not formed, but a bowl-shaped packaging body 170 with a smooth surface, such as shown in fig. 10 and 11, and fig. 13 to 18, is formed, and is particularly suitable for packaging Mini LEDs and Micro LEDs.

Based on the above research, in a preferred embodiment, in the glue-spraying packaging process, a predetermined number of glue-spraying layers are sprayed to the sub-packaging area and cured to form a bowl-shaped package. Wherein, the spraying area of each glue spraying layer is the same. And (3) starting a first curing light source which moves along with the array type spray head for curing while spraying the glue spraying layer on the sub-packaging area, and curing the glue spraying layer at one time through illumination (namely primary curing). That is, at least one cure is performed between every two layers of the spray. After the glue solution is sprayed, the spray head travels for a preset distance and then is subjected to illumination curing, or after the spray head sprays the glue solution towards a position point (such as a sub-packaging area), the spray head performs illumination curing at intervals of preset time; alternatively, the nozzle may irradiate light to cure the glue after spraying the glue toward a location point (e.g., a sub-package area) and before spraying the glue next time. The predetermined period is less than 30s, further less than 20s, further less than 15s, in particular less than 10s. Since the curing light source 20 moves together with the nozzle, the glue solution is cured while the glue is sprayed.

When spraying the glue, the glue spraying surface (i.e. the glue spraying panel 115) of the array type spray head has a plurality of sub glue spraying areas arranged in an array type. Each sub-glue-spraying area basically corresponds to one sub-packaging area. The spray holes 116 for spraying the glue solution are changed continuously during the movement of the spray head, but sub-glue spraying areas arranged in an array form are formed on the glue spraying surface of the spray head.

Compared with the existing COB packaging, the packaging method has the advantages that the array type spray heads are adopted, the packaging efficiency can be greatly improved, and through actual testing, the packaging efficiency can be improved by more than 2 times, even more than 3 times.

Specifically, the sub-package region is a circular region, or other desired shape. The encapsulation 170 can be sprayed with any desired bottom shape by the array spray heads, for example, the bottom surface is polygonal, elliptical, or even irregular.

The area of the sub-package region is below 1 square millimeter, further below 0.785 square millimeter, further below 0.631 square millimeter, particularly below 0.5 square millimeter. The height of the sub-package region (i.e., the distance from the highest point of the sub-package region to the substrate 100) is less than 1mm, further less than 0.75 mm, further less than 0.5mm, and particularly less than 0.3mm. The distance between two adjacent sub-packaging areas is 0.5mm to 2mm.

In one embodiment, the substrate 100 is provided with a mounting groove to receive the LED chip 160. The packaging method comprises the following steps: filling, namely controlling the array type spray head to intermittently spray glue solution into the mounting groove in a horizontal linear reciprocating movement mode until the mounting groove is filled to be flush with the surface of the substrate 100; and a packaging process of controlling the array type spray head to intermittently spray glue solution to the position of the filled mounting groove in a mode of horizontal linear reciprocating movement until the packaging body 170 is formed. The package body 170 is a stacked and cured structure. The injection area in at least the previous n times of single-pass movement in the packaging process is larger than the area of the mounting groove, and n is a positive integer less than or equal to 5.

In the packaging method, the array type nozzle intermittently sprays glue solution towards the substrate 100 in a manner of horizontal linear reciprocating movement, and further, in the moving process of the array type nozzle, glue solution of a second moving distance is sprayed every time the array type nozzle moves a first preset distance, or glue solution of a second preset time is sprayed every first preset time interval. Furthermore, one linear single-pass movement of the array type spray head forms one glue spraying layer, and one linear reciprocating movement forms two glue spraying layers. The array type nozzle sprays a predetermined number of adhesive layers to the area where each LED chip 160 is located. Further, the sprayed glue-sprayed layer is subjected to light curing before the next glue-sprayed layer is sprayed. Further, the substrate 100 is irradiated with the curing light moving together with the array type head to be cured.

It should be noted that, in the description of the present specification, the terms "first", "second", and the like are used for descriptive purposes only and for distinguishing similar objects, and no order is present therebetween, and no indication or suggestion of relative importance is to be made. Further, in the description of the present specification, "a plurality" means two or more unless otherwise specified.

Any numerical value recited herein includes all values from the lower value to the upper value, in increments of one unit, provided that there is a separation of at least two units between any lower value and any higher value. For example, if it is stated that the number of a component or a value of a process variable (e.g., temperature, pressure, time, etc.) is from 1 to 90, preferably from 20 to 80, and more preferably from 30 to 70, it is intended that equivalents such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also expressly enumerated in this specification. For values less than 1, one unit is suitably considered to be 0.0001, 0.001, 0.01, 0.1. These are only examples of what is intended to be explicitly recited, and all possible combinations of numerical values between the lowest value and the highest value that are explicitly recited in the specification in a similar manner are to be considered.

Unless otherwise indicated, all ranges include the endpoints and all numbers between the endpoints. The use of "about" or "approximately" with a range applies to both endpoints of the range. Thus, "about 20 to about 30" is intended to cover "about 20 to about 30", including at least the endpoints specified.

All articles and references disclosed, including patent applications and publications, are hereby incorporated by reference for all purposes. The term "consisting essentially of …" describing a combination shall include the identified elements, components, parts or steps as well as other elements, components, parts or steps that do not materially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe combinations of elements, components, or steps herein also contemplates embodiments that consist essentially of such elements, components, or steps. By using the term "may" herein, it is intended to indicate that any of the described attributes that "may" include are optional.

A plurality of elements, components, parts or steps can be provided by a single integrated element, component, part or step. Alternatively, a single integrated element, component, part or step may be divided into separate plural elements, components, parts or steps. The disclosure of "a" or "an" to describe an element, ingredient, component or step is not intended to foreclose other elements, ingredients, components or steps.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes. The omission in the foregoing claims of any aspect of subject matter that is disclosed herein is not intended to forego such subject matter, nor should the inventors be construed as having contemplated such subject matter as being part of the disclosed subject matter.

Claims

1. A packaging method of a COB packaging module comprises the following steps that the COB packaging module comprises a substrate and a plurality of light emitting parts arranged on the substrate in an array mode; each of the light emitting parts includes at least one LED chip; the maximum height of the LED chip on the substrate is lower than 1mm;

the packaging method comprises the following steps: and controlling an array type spray head with a plurality of spray holes which can be independently controlled to spray light-curable packaging glue solution towards the light-emitting part on the substrate which is horizontally placed in a manner of horizontal linear reciprocating movement until a packaging body for coating the light-emitting part is formed.

2. The packaging method according to claim 1, wherein the LED chip is a Mini LED chip or a Micro LED chip; the packaging method comprises the following steps: and controlling an array type spray head with a plurality of light emitting parts with the maximum spray areas capable of covering more than 10 light emitting parts to perform horizontal linear reciprocating movement, and intermittently spraying the packaging glue solution with a preset viscosity range capable of being photocured towards the light emitting parts on the horizontally placed substrate at a preset glue spraying rate in a mode that the distance between the spray holes and the substrate is less than 1.5cm until the packaging body for coating the light emitting parts is formed.

3. The encapsulation method of claim 2, wherein the predetermined viscosity range is 7.623 cP-21.432 cP at 40 ℃ to 50 ℃; the preset glue spraying speed is at least 10000 glue drops per second through a single spray hole, and the single glue drop amount is 5-100 picoliters.

4. The packaging method of claim 1, wherein the array-type nozzle intermittently sprays glue on any one of the light-emitting parts by moving horizontally and linearly in a reciprocating manner, and the glue is stacked layer by layer in the area where the light-emitting part is located to form the package body.

5. The packaging method according to claim 1, wherein the array type nozzle has a maximum spray area covering more than 20 light emitting parts.

6. The encapsulation method of claim 1, wherein the encapsulation method comprises:

7. The packaging method according to claim 6, wherein the first packaging glue solution is a non-transparent glue solution; the second packaging glue solution is transparent glue solution, and the viscosity of the second packaging glue solution is lower than that of the first packaging glue solution.

8. The encapsulation method of claim 6 wherein there is a difference in injection area for at least two single pass movements.

9. The packaging method according to claim 6, wherein in the fence spraying process, the array type spray head is controlled to spray the fence forming a grid structure to the substrate, and the light emitting parts are located in grid holes in a one-to-one correspondence manner.

10. The packaging method according to claim 6, wherein the second packaging glue is sprayed into the fence in the filling and spraying process until the filled second packaging glue protrudes out of the fence.

11. The encapsulation method of claim 1, wherein the encapsulation method comprises: and a first curing process of controlling a first curing light source moving together with the array type spray head to irradiate the substrate while the array type spray head sprays the packaging glue solution so as to cure the sprayed packaging glue solution.

12. The encapsulation method of claim 1, wherein the encapsulation method comprises: and a second curing process of controlling a second curing light source to perform secondary curing on the packaging body after the glue spraying is finished.

13. The encapsulation method of claim 1, wherein the encapsulation method comprises: and controlling the array type spray head to spray packaging glue solution to the substrate until a packaging layer of an integrated curing and forming structure which covers the surface of the substrate and covers all the light emitting parts is formed.

14. The packaging method of claim 1, wherein the packaging method comprises:

15. The encapsulation method according to claim 14, wherein one glue layer is formed by one linear single-pass movement of the array type nozzle, and two glue layers are formed by one linear reciprocating movement;

16. The packaging method according to claim 14, wherein two adjacent sub-packaging regions are disposed at intervals.

17. The packaging method according to claim 1, wherein each of the light emitting portions includes 3 or more LED chips.

18. The packaging method of claim 1, wherein the package body has a flat surface or a convex smooth spherical surface.

19. The packaging method according to claim 1, wherein the substrate is provided with a mounting groove for accommodating the LED chip; the packaging method comprises the following steps:

20. The encapsulation method according to claim 14, wherein one adhesive layer is formed by one linear single pass movement of the array type nozzle, and two adhesive layers are formed by one linear reciprocating movement;

21. A COB package module manufactured based on the packaging method of claims 1 to 20, wherein the COB package module includes a substrate, a plurality of light emitting parts arranged in an array on the substrate; each of the light emitting parts includes at least one LED chip; the maximum height of the LED chip on the substrate is lower than 1mm; the substrate is also provided with a packaging body made of light-cured resin and used for coating the light-emitting part.

22. The COB package module of claim 21, wherein the packaging is a bowl-shaped structure that has a spherical structure, and the light-emitting portions are wrapped in the packaging in a one-to-one correspondence.

23. The COB package module of claim 22, wherein adjacent two of the capsule bodies are spaced apart.

24. The COB package module of claim 21, wherein the encapsulation of each emitter section fuses to form an integrally cured encapsulation layer that overlies the substrate.

25. The COB package module of claim 24, wherein the encapsulation layer is provided with a one-to-one raised spherical structure for each of the light-emitting portions.

26. The COB package module of claim 21, wherein the package has a fence around the light-emitting portion and a transparent filler filled within the fence; the filling body and the fence are made of different materials.

27. The COB package module of claim 26, wherein the rails are rectangular frames, and two adjacent rails share a rail edge, and the rails on the substrate form a grid structure.

28. The COB package module of claim 21, wherein each luminescence portion includes 3 or 4 LED chips.

29. The COB package module of claim 21, wherein the COB package module is a Mini LED backlight module or a Micro LED module.

30. A Mini LED display screen, wherein the Mini LED display screen comprises: the COB package module of any one of claims 21-29, is a backlight.