CN115642417A - Power electronic device with power electronic component and pins - Google Patents
Power electronic device with power electronic component and pins Download PDFInfo
- Publication number
- CN115642417A CN115642417A CN202210836408.7A CN202210836408A CN115642417A CN 115642417 A CN115642417 A CN 115642417A CN 202210836408 A CN202210836408 A CN 202210836408A CN 115642417 A CN115642417 A CN 115642417A
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- China
- Prior art keywords
- power electronic
- electronic device
- longitudinal axis
- plug
- pin
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- 238000003780 insertion Methods 0.000 claims abstract description 34
- 230000037431 insertion Effects 0.000 claims abstract description 34
- 239000004020 conductor Substances 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 16
- 238000005520 cutting process Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 230000000630 rising effect Effects 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10333—Individual female type metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
The invention relates to a power electronic device comprising a power electronic assembly having a conductive sleeve and a circuit carrier, the conductive sleeve being formed in one piece and having an imaginary first longitudinal axis, the sleeve having a tubular insertion section extending around the first longitudinal axis, an end region of the sleeve being arranged on and connected in a materially bonded and electrically conductive manner to a conductor track of the circuit carrier, and the power electronic device having a conductive pin having an imaginary second longitudinal axis, the pin having a plug-in region arranged at the end region of the pin, the plug-in region having at least three outward bulges, which extend away from the second longitudinal axis and are arranged parallel to the second longitudinal axis, wherein the outward bulges in the direction around the second longitudinal axis each have a side surface, the side surfaces having convexly profiled side surfaces, at least one plug-in section of the plug-in region having been inserted into the insertion section, the side surfaces having an electrically conductive contact with an inner wall surface of the insertion section.
Description
Technical Field
The invention relates to a power electronic device with a power electronic component and a pin.
Background
DE102020114650B3 discloses a power electronic assembly having an electrically conductive sleeve formed in one piece and having an imaginary first longitudinal axis, and having a circuit carrier. The sleeve has a tubular insertion portion extending about a first longitudinal axis. The end regions of the bushings are arranged on the conductor tracks of the circuit carrier and are connected to the conductor tracks in an electrically conductive and material-bonded manner. The sleeve serves as an electrical connection means for producing an electrically conductive connection with the electrically conductive pin which is inserted into the insertion section and thus has an electrically conductive contact with the sleeve.
The cylindrical design of the conventional pins in the prior art has the disadvantage that if the diameter of the pin exceeds a narrow tolerance, smaller or larger than the inner diameter of the insertion section, due to manufacturing tolerances, the pin is either not sufficiently fixed in the sleeve or can only be inserted into the sleeve with great force, which can lead to damage to the circuit carrier.
DE102008005547A1 discloses in this respect a pin which has a substantially square cross-sectional area. The insertion section of the sleeve becomes deformed due to the rounded edges of the pins. One disadvantage with this is that the contact area between the corner edge formed when the pin is inserted into the insertion section and the insertion section is small, so that the conductive contact between the pin and the sleeve has only a small current carrying capacity.
Disclosure of Invention
It is an object of the invention to provide a power electronic device having a power electronic assembly with a bushing and a circuit carrier electrically conductively connected to the bushing, and a pin inserted into the bushing, wherein the electrically conductive contact between the pin and the bushing has a high current carrying capacity.
This object is achieved by a power electronic device having a power electronic assembly with a conductive sleeve and a circuit carrier, the conductive sleeve being formed in one piece and having an imaginary first longitudinal axis, wherein the sleeve has a tubular insertion section extending around the first longitudinal axis, wherein an end region of the sleeve is arranged on a conductor track of the circuit carrier and is connected in a materially engaging and electrically conductive manner with the conductor track, and the power electronic device has conductive pins having an imaginary second longitudinal axis, wherein the pins have a plug-in region arranged at the end regions of the pins, wherein the plug-in region has at least three outward bulges which extend away from the second longitudinal axis and are parallel to the second longitudinal axis, wherein the outward bulges have side surfaces which in a direction around the second longitudinal axis respectively have a convex contour, wherein at least one plug-in section of the plug-in region has been inserted into the insertion section, wherein the side surfaces have an electrically conductive contact with an inner wall surface of the insertion section.
It has proven advantageous if the corresponding convex contour is in the form of a circular arc. Therefore, the contour of the side surface is well matched with the contour of the inner wall surface of the insertion section.
In this respect, it has proved advantageous if the radial centre point of the respective circular arc formed by the respective convex contour lies on the second longitudinal axis. Thus, the profile of the side surface closely matches the profile of the inner wall surface of the insertion section.
Furthermore, it has proven to be advantageous if the respective side surface extends in a direction around the second longitudinal axis from a first outwardly rising edge extending in the direction of the second longitudinal axis up to a second outwardly rising edge extending in the direction of the second longitudinal axis, wherein the first outwardly rising edge and the second outwardly rising edge enclose an angle of from 20 ° to 90 °, in particular from 30 ° to 60 °, with respect to the second longitudinal axis. The plug region of the pin is therefore in electrically conductive contact with the bushing having a very high current-carrying capacity by means of its outward bulge and the convex contour of the side surface, wherein the pin can be inserted into the bushing with significantly less force in this case than in the case of a cylindrical design of the entire pin or plug region, with the result that the risk of damage to the circuit carrier is significantly reduced.
Furthermore, it has proven to be advantageous if the respective side surface extends in a direction around the second longitudinal axis from a first outwardly rising edge extending in the direction of the second longitudinal axis up to a second outwardly rising edge extending in the direction of the second longitudinal axis, wherein the outwardly rising edges of the side surfaces directly adjacent to one another in the direction around the second longitudinal axis have the same spacing from one another. Thus, the side surfaces are evenly distributed around the second longitudinal axis such that the position and orientation of the second longitudinal axis coincides with the first longitudinal axis, and thus the pin is arranged in the center of the sleeve.
Furthermore, it has proven to be advantageous if the plug-in region has three outward bulges. The plug-in region is therefore of particularly simple design.
Furthermore, it has proven to be advantageous if the plug-in region has concavely running connection faces which connect the side faces to one another. The plug-in region therefore has a mechanically particularly stable design.
Furthermore, it has proven to be advantageous if the side surface has a contour which is superimposed on the convex contour and forms a cutting edge (cutting edges), wherein the cutting edge is designed in particular to cut into the material of the insertion section. The plug-in region of the pin is thus in electrically conductive contact with a bushing having a particularly high current carrying capacity.
Furthermore, it has proven to be advantageous if the region of the pin arranged outside the plug-in region is cylindrical. The pins therefore have a particularly simple design. Furthermore, the outward bulge can be produced particularly simply from the cylindrical basic shape of the pin.
Furthermore, it has proven to be advantageous if the plug region of the pin has a lower or higher hardness than the region of the pin which is arranged outside the plug region. The deformability of the plug region of the pin can thus be adapted to the rigidity of the sleeve insertion section, so that the geometry of the plug region can be adapted to the geometry of the plug section and vice versa when the plug region is inserted into the insertion section, in order to achieve a very reliable electrically conductive contact between the plug region and the insertion section.
Furthermore, it has proven to be advantageous if the plug-in region of the pin has a different, in particular higher, hardness than the plug-in section. The deformability of the plug region of the pin can thus be adapted to the rigidity of the insertion section of the sleeve, so that the geometry of the plug region can be adapted to the geometry of the plug section when the plug region is inserted into the insertion section, or vice versa, in order to achieve a very reliable electrically conductive contact between the plug region and the insertion section.
Furthermore, it has proven to be advantageous if the pins are formed integrally. The pin therefore has a mechanically particularly stable design.
Furthermore, it has proven advantageous if the outward bulge is formed by plastic deformation of the material of the pin, in particular using a reshaping technique. The plug-in region therefore has a mechanically particularly stable design and the pins can be produced at particularly low cost.
Furthermore, it has proven to be advantageous if the pins are formed at least substantially from copper or substantially from a copper alloy. As a result, the pin has high conductivity.
Furthermore, it has proven advantageous if the circuit carrier is in the form of a substrate, in particular of a substrate of a power semiconductor module, or of a printed circuit board.
If not explicitly excluded or excluded per se or in contravention of the inventive concept, it is of course possible for features mentioned in each case in the singular, in particular the bushings and pins, to be present in the power electronics device according to the invention in the plural.
Drawings
Exemplary embodiments of the invention will be explained below with reference to the drawings, in which:
fig. 1 shows a cross-sectional view of a known power electronic component of a power electronic device according to the invention;
fig. 2 shows a perspective view of a bushing of the known power electronic assembly shown in fig. 1;
FIG. 3 shows a perspective view of a pin design of a power electronic device according to the present invention;
FIG. 4 shows a cross-sectional view of the plugging area of the pin shown in FIG. 3;
fig. 5 shows a cross-sectional view of a power electronic device according to the invention in the region of the plug-in region of the pins and the plug-in section of the sleeve shown in fig. 3, wherein the plug-in region has been inserted into the plug-in section;
fig. 6 shows a perspective view of a plug-in region of another design of a pin of a power electronic device according to the invention;
FIG. 7 shows a cross-sectional view of the plugging area of the pin shown in FIG. 6; and
fig. 8 shows a cross-sectional view of a further embodiment of the power electronics device according to the invention in the region of the plug-in region of the pins and the plug-in section of the sleeve shown in fig. 6, the plug-in region having been inserted into the plug-in section.
Like elements are provided with like reference characters (reference numerals) in the drawings.
Detailed Description
Fig. 1 shows a sectional view of a power electronics module 12 known from DE102020114650B3 of a power electronics device 21 according to the invention (see fig. 5 and 8). Fig. 2 shows a perspective view of the bushing 1 of the known power electronic assembly 12 shown in fig. 1, wherein the bushing 1 is illustrated rotated through 180 ° in the plane of the drawing compared to fig. 1. In the following context of the description relating to the power electronics 21 according to the invention (see fig. 5 and 8), the known power electronics component 12 is an example of a possible design of the power electronics component 12 of the power electronics 21 according to the invention, so that fig. 1 and 2 also relate to the power electronics 21 according to the invention.
The power electronics device 21 according to the invention (see fig. 5 and 8) has a power electronics assembly 12 (see fig. 1 and 2), which power electronics assembly 12 has a conductive sleeve 1 and a circuit carrier 5, which conductive sleeve 1 is formed in one piece and has an imaginary first longitudinal axis a. The cannula 1 has a tubular insertion section 2 extending around a first longitudinal axis a. A cylindrical passage 10 extends through the tubular insertion section 2. The end region 3 of the sleeve 1 is arranged on a conductor track 5b 'of the circuit carrier 5 and is connected to the conductor track 5b' in a materially bonded and electrically conductive manner, for example by soldering, welding, sintering or adhesive bonding (by means of an electrically conductive adhesive). In the context of the exemplary embodiment, the bushing 1 is connected to the conductor track 5b' by means of solder 11 in a materially bonded and electrically conductive manner.
The bushing 1 is preferably at least substantially formed of copper or substantially of a copper alloy. The bushing 1 may also have a nickel layer arranged on copper or a copper alloy, for example. The circuit carrier 5 is in the context of the exemplary embodiment in the form of a substrate 5, but may also be in the form of a printed circuit board, for example. The substrate 5 has a non-conductive insulating layer 5a and a first metal layer 5b, the first metal layer 5b being arranged on the insulating layer 5a and being configured to give a conductor track 5b ', wherein, in fig. 1, a separate conductor track 5b' is illustrated. The substrate 5 may have a second metal layer 5c, the second metal layer 5c being disposed on the opposite side of the insulating layer 5a from the first metal layer 5 b. For example, the insulating layer 5a may be in the form of a ceramic plate. The substrate 5 may be in the form of a direct copper bonding substrate (DCB substrate), an active metal brazing substrate (AMB substrate), or an Insulating Metal Substrate (IMS), for example. The substrate 5 may be a substrate of a power semiconductor module. In general, the power semiconductor is arranged on a substrate of the power semiconductor module.
The end region 3 preferably forms a foot section arranged around and extending away from the longitudinal axis a. The foot section extends away from the longitudinal axis a in a radial direction relative to the longitudinal axis a. The sleeve 1 has a further end region 4 which preferably forms a further foot section which extends around the longitudinal axis a and away from the longitudinal axis a. The other foot section extends away from the longitudinal axis a in a radial direction relative to the longitudinal axis a.
The power electronics 21 according to the invention also have a conductive pin 6, the conductive pin 6 having a virtual second longitudinal axis B. The design of the pins 6 is shown in fig. 3. The pin 6 has a plug-in region 8, the plug-in region 8 being arranged at the end region 7 of the pin 6, wherein the plug-in region 8 has at least three outward bulges 9, which bulges 9 extend away from the second longitudinal axis B and are arranged parallel to the second longitudinal axis B. Fig. 3 shows a sectional view of the plug region of the pin 6 shown in fig. 3. The outward bulges 9 have side surfaces 12, which side surfaces 12 each have a convex contour in the direction R1 around the second longitudinal axis B. As illustrated by way of example in fig. 5, at least one plug section 8' of the plug region 8 has been inserted into the insertion section 2, more precisely into the channel 10 extending through the insertion section 2, wherein the side surface 12 has an electrically conductive contact with the inner wall surface 13 of the insertion section 2.
Due to the special geometric design of the plug-in region 8 of the pin 6 according to the invention, which has an outward bulge 9 and a convex contour of the side surface 12, the pin 6 has an electrically conductive contact with the bushing 1 having a high current carrying capacity. Furthermore, the advantage of the special geometric design of the plug-in region 8 of the pin 6 according to the invention in relation to the cylindrical design of the entire pin or plug-in region is that the diameter of the pin 6 in the plug-in region 8, even in view of manufacturing tolerances, can always be slightly larger than the inner diameter of the insertion section 2 of the bushing 1, so that the pin 6 in the bushing 1 cannot oscillate in the bushing 1 with a high degree of reliability and can be inserted into the bushing 1 with less force than in the cylindrical design of the entire pin or plug-in region, so that the risk of damage to the circuit carrier 5 or the bushing 1 is reduced and the pin 6 is still mechanically fixed in the bushing 1.
Fig. 6 shows a perspective view of a plug-in region 8 of a further design of a pin 6 of a power electronics device 21 according to the invention. Fig. 7 shows a sectional view of the plug region 8 of the pin 6 shown in fig. 6. Fig. 8 shows a cross-sectional view of a further embodiment of a power electronics system 21 according to the invention in the region of the plug-in region 8 of the pin 6 shown in fig. 6 and of the insertion section 2 of the bushing 1, the plug-in region 8 having been inserted into the insertion section 2.
In the design of the power electronics 21 according to the invention or of the pin 6 shown in fig. 6 to 8, the side surface 12 has a profile which is superimposed on the convex profile and forms the cutting edge 14. The cutting edge 14 is preferably designed to cut into the material 16 of the insertion section 2. As shown by way of example in fig. 8, the cutting edge 14 cuts into the material 16 of the insertion section 2. It will be mentioned that the further design of the pin 6 or the power electronics 21 according to the invention shown in fig. 6 to 8 corresponds to the design of the pin 6 or the power electronics 21 according to the invention shown in fig. 3 to 5, in addition to the cutting edge 14, including advantageous design and design variants.
The corresponding convex profile of the lateral surface 12 in the direction R1 around the second longitudinal axis B is preferably in the form of a circular arc. The radial centre point R of the respective circular arc 18 formed by the respective convex contour preferably lies on the second longitudinal axis B.
The respective side surface 12 preferably extends in a direction R1 around the second longitudinal axis B from a first outwardly rising edge 19 extending in the direction of the second longitudinal axis B up to a second outwardly rising edge 20 extending in the direction of the second longitudinal axis B, wherein the first and second outwardly rising edges 19, 20 enclose an angle w from 20 ° to 90 °, in particular from 30 ° to 60 °, with respect to the second longitudinal axis B.
The respective outwardly bulging edges 19 and 20 of the side surfaces 12 directly adjacent to each other in the direction around the second longitudinal axis B preferably have the same distance c from each other.
The plug-in region 8 preferably has three outward bulges 9.
The plug-in region 8 preferably has concavely extending connecting surfaces 17, which connecting surfaces 17 connect the side surfaces 12 to one another.
As shown by way of example in fig. 3, the region 15 of the pin 6 arranged outside the plug region 8 is preferably cylindrical.
The plug-in area 8 of the pin 6 may have a lower or higher hardness than the area 15 of the pin 6 arranged outside the plug-in area 8.
The plug-in region 8 of the pin 6 can have a different, in particular higher, hardness than the plug-in section 2.
The pins 6 are preferably integrally formed.
The outward bulge 9 is preferably formed by plastic deformation of the material of the pin 6, in particular produced using reshaping techniques (reshaping techniques).
The pin 6 may have a press-fit (press-fi) section arranged on the other end region 17 arranged opposite to the end region 17 of the pin 6, and not shown in fig. 3 for clarity. The press-fit section is preferably used to form an electrically conductive press-fit connection with a printed circuit board. However, the other end region 17 of the pin 6 can also be cylindrical, for example, as shown by way of example in fig. 3, and can therefore be designed for material bonding and electrically conductive connection to a printed circuit board. For example, the material-bonded connection can be realized as a solder joint or an adhesive joint (by means of a conductive adhesive).
The pin 6 is preferably at least substantially formed of copper or substantially of a copper alloy. The pins 6 may also have a layer of nickel, for example, arranged on copper or a copper alloy. For example, a tin layer may also be provided on the nickel layer. The thickness of the nickel layer is preferably from 0.2 μm to 5 μm, in particular from 0.4 μm to 3.5. Mu.m. The thickness of the tin layer is preferably from 0.2 μm to 4 μm, in particular from 0.4 μm to 2.5. Mu.m.
It will be mentioned here that the features of the various exemplary embodiments of the invention, if these features are not mutually exclusive, can of course be combined with one another as desired without departing from the scope of the invention.
Claims (20)
1. Power electronic device having a power electronic component (12), the power electronic component (12) having an electrically conductive sleeve (1) and a circuit carrier (5), the electrically conductive sleeve (1) being formed in one piece and having an imaginary first longitudinal axis (A), wherein the sleeve (1) has a tubular insertion section (2) extending around the first longitudinal axis (A), wherein an end region (3) of the sleeve (1) is arranged on a conductor track (5B ') of the circuit carrier (5) and is connected in a material-bonded and electrically conductive manner with the conductor track (5B'), and the power electronic device has an electrically conductive pin (6), the electrically conductive pin (6) having an imaginary second longitudinal axis (B), wherein the pin (6) has a plug-in region (8) arranged at an end region (7) of the pin (6), wherein the plug-in region (8) has at least three outward bulges (9), the bulges (9) extend away from the second longitudinal axis (B) and are arranged parallel to the second longitudinal axis (B), wherein the outward bulges (9) have at least one lateral surface (12) inserted into the plug-in direction (2) of the plug-in region (8), wherein the lateral surface (12) has an electrically conductive contact with the inner wall surface (13) of the insertion section (2).
2. Power electronic device according to claim 1, characterized in that the respective convex profile is in the form of a circular arc.
3. Power electronic device according to claim 2, characterized in that the radius centre point (R) of the respective circular arc (18) formed by the respective convex contour lies on the second longitudinal axis (B).
4. A power electronic device according to any one of claims 1-3, characterised in that the respective side surface (12) extends in a direction around the second longitudinal axis (B) from a first outwardly bulging edge (19) extending in the direction of the second longitudinal axis (B) to a second outwardly bulging edge (20) extending in the direction of the second longitudinal axis (B), wherein the first outwardly bulging edge (19) and the second outwardly bulging edge (20) enclose an angle of from 20 ° to 90 ° with respect to the second longitudinal axis (B).
5. A power electronic device according to any one of claims 1-3, characterised in that the respective side surface (12) extends in a direction around the second longitudinal axis (B) from a first outwardly bulging edge (19) extending in the direction of the second longitudinal axis (B) to a second outwardly bulging edge (20) extending in the direction of the second longitudinal axis (B), wherein the outwardly bulging edges (19, 20) of the side surfaces (12) directly adjacent to each other in the direction around the second longitudinal axis (B) have the same distance (c) from each other.
6. A power electronic device according to any one of claims 1-3, characterised in that the plug area (8) has three outward bulges (9).
7. Power electronic device according to one of claims 1 to 3, characterised in that the plug-in region (8) has concavely running connection faces (17), which connection faces (17) connect the side faces (12) to one another.
8. A power electronic device according to any one of claims 1-3, characterised in that the side surface (12) has a profile which is superimposed on the convex profile and forms the cutting edge (14).
9. A power electronic device according to any one of claims 1-3, characterised in that the area (15) of the pin (6) arranged outside the plug-in area (8) is cylindrical.
10. Power electronic device according to any one of claims 1 to 3, characterised in that the plug-in area (8) of the pin (6) has a lower or higher hardness than the area of the pin (6) arranged outside the plug-in area (8).
11. Power electronic device according to any of claims 1-3, characterized in that the plug-in area (8) of the pin (6) has a different hardness than the plug-in section (2).
12. A power electronic device according to any one of claims 1-3, characterised in that the pins (6) are formed integrally.
13. A power electronic device according to any one of claims 1-3, characterised in that the outward bulge (9) is formed by plastic deformation of the material of the pin (6).
14. A power electronic device according to any one of claims 1-3, characterised in that the pin (6) is at least substantially formed of copper or substantially of a copper alloy.
15. A power electronic device according to any one of claims 1-3, characterised in that the circuit carrier (5) is in the form of a substrate or in the form of a printed circuit board.
16. Power electronic device according to claim 4, characterized in that the first outwardly bulging edge (19) and the second outwardly bulging edge (20) enclose an angle of from 30 ° to 60 ° with respect to the second longitudinal axis (B).
17. Power electronic device according to claim 8, characterized in that the cutting edge (14) is designed to cut into the material (16) of the insertion section (2).
18. Power electronic device according to claim 11, characterised in that the plug-in area (8) of the pin (6) has a higher hardness than the plug-in section (2).
19. A power electronic device according to claim 13, characterised in that the outward bulge (9) is produced using a reshaping technique.
20. Power electronic device according to claim 15, characterized in that the circuit carrier (5) is in the form of a substrate of a power semiconductor module.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DEDE102021118529.7 | 2021-07-19 | ||
DE102021118529.7A DE102021118529B3 (en) | 2021-07-19 | 2021-07-19 | Power electronic device with a power electronic assembly and a pen |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115642417A true CN115642417A (en) | 2023-01-24 |
Family
ID=82402577
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210836408.7A Pending CN115642417A (en) | 2021-07-19 | 2022-07-15 | Power electronic device with power electronic component and pins |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN115642417A (en) |
DE (1) | DE102021118529B3 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5816868A (en) | 1996-02-12 | 1998-10-06 | Zierick Manufacturing Corp. | Capillary action promoting surface mount connectors |
DE102008005547B4 (en) | 2008-01-23 | 2013-08-29 | Infineon Technologies Ag | Power semiconductor module and circuit arrangement with a power semiconductor module |
DE102011087616A1 (en) | 2011-12-02 | 2013-06-06 | Robert Bosch Gmbh | pin |
EP2903024B1 (en) | 2014-01-31 | 2022-08-03 | Vincotech GmbH | Contact element, power semiconductor module and method of fabricating same |
DE102020114650B3 (en) | 2020-06-02 | 2021-06-02 | Semikron Elektronik Gmbh & Co. Kg | Power electronic assembly with an electrically conductive sleeve and with a circuit carrier |
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2021
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