CN115632017A - Wedge-shaped error compensation device and method for wafer manufacturing - Google Patents
Wedge-shaped error compensation device and method for wafer manufacturing Download PDFInfo
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- CN115632017A CN115632017A CN202211100403.4A CN202211100403A CN115632017A CN 115632017 A CN115632017 A CN 115632017A CN 202211100403 A CN202211100403 A CN 202211100403A CN 115632017 A CN115632017 A CN 115632017A
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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Abstract
The wedge-shaped error compensation device comprises a horizontal auxiliary unit and a wedge-shaped error compensation unit, wherein the wedge-shaped error compensation unit is positioned under the horizontal auxiliary unit, a chuck unit is arranged on the wedge-shaped error compensation unit, a Z-axis lifting cylinder for lifting the wedge-shaped error compensation unit is connected under the wedge-shaped error compensation unit, and the chuck unit is contacted with the horizontal auxiliary unit under the lifting of the Z-axis lifting cylinder by the wedge-shaped error compensation unit. The invention can improve the compensation precision.
Description
Technical Field
The invention belongs to the field of semiconductor wafer processing, and particularly relates to a wedge-shaped error compensation device and a wedge-shaped error compensation method for wafer manufacturing.
Background
In semiconductor wafer processing, an advanced process requires about 300-500 process steps, and a wafer fab must ensure a process yield of 99% or more per step to be profitable and competitive. As process steps increase and process dimensions shrink, the sensitivity of the chip to any one smaller defect increases and becomes more critical. The demands on the processing capacity of the production plant are therefore increasing. With the continuous optimization of equipment, the parallelism requirements of the wafer manufacturing system and the wafer are higher and higher. The way of wedge error compensation needed to adjust parallelism.
The conventional wedge error compensation mode is that a reference plate is utilized, a group of three small balls are arranged between a chuck and the reference plate, and the three small balls are uniformly distributed on a circumference. The chuck and the reference plate are respectively contacted with the small balls by utilizing the upward movement of the lifting mechanism, and the three small balls can be respectively contacted with the chuck and the reference plate due to the flexible mechanism in the system. At the moment, the wedge block between the lifting mechanism and the chuck moves towards the direction of the circle center, and is locked after reaching a fixed position, and the adjustment is completed. The wedge is driven by cylinder or motor and moves, has increased the volume of device, and the wedge can have little change when the lock is dead, causes the precision not high.
The other is that the adjusting mode is that three air-floating supporting columns are arranged at the lower part of the chuck, the three air-floating supporting columns are uniformly distributed on the same circle, and a high-precision sensor is utilized to measure the distance between the chuck and the sensor. A group of small balls are used as a reference, the air floatation support column is ventilated and ascends, the small balls are simultaneously contacted with the plane of the processing system and the chuck, and the sensor is cleared. Subsequent adjustments are adjusted based on the values of the sensors. The control precision of the air floatation support is not high, and the stability of the whole system is not good.
Disclosure of Invention
To solve the above problems, an object of the present invention is to provide a wedge error compensation apparatus for wafer manufacturing and a method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
a wedge error compensation device for wafer manufacturing comprises a horizontal auxiliary unit and a wedge error compensation unit, wherein the wedge error compensation unit is located right below the horizontal auxiliary unit, a chuck unit is arranged on the wedge error compensation unit, a Z-axis lifting cylinder for lifting the wedge error compensation unit is connected below the wedge error compensation unit, and the wedge error compensation unit enables the chuck unit to be in contact with the horizontal auxiliary unit under the lifting of the Z-axis lifting cylinder;
the horizontal auxiliary unit comprises a circular base body, at least three high-precision sensors are arranged on the base body, the sensors are arranged at intervals of 120 degrees, a reference plate is arranged below the base body, at least three rotary cylinders are arranged above the base body, the distribution position of each rotary cylinder is consistent with the position of the sensor, each rotary cylinder is connected with one end of an elastic sheet, and a small ball which can be in contact with the reference plate is connected to the other end of the elastic sheet;
the wedge error compensation unit consists of a passive error compensation module and an active wedge error compensation module, wherein the passive error compensation module is positioned below the active wedge error compensation module and is connected with the active wedge error compensation module through a flexible assembly;
the passive error compensation module comprises a lower substrate and a middle substrate, wherein a jack for mounting a compression spring is formed in the lower substrate, the jack is internally provided with the compression spring, a damping groove for mounting a damper is formed in the lower substrate, the damping groove is internally provided with the damper, one end of the damper is connected with the middle substrate, the middle substrate is arranged on the lower substrate through a compression spring cover, a movable fixed shaft is inserted in the lower substrate, the upper end of the fixed shaft is inserted in the middle substrate, a fixed connecting plate is connected to the fixed shaft, fixed shaft springs are arranged on the left side and the right side of the fixed connecting plate respectively, the fixed shaft springs are inserted in spring grooves formed in the middle substrate, a locking cylinder for locking the fixed shaft is arranged in the lower substrate, a guide plate is arranged on the lower substrate, and a guide bearing for guiding the guide plate by contacting with the middle substrate is arranged at the upper end of the guide plate;
the active wedge-shaped error compensation module comprises an upper substrate, the upper substrate is covered on a middle substrate, a plurality of V-shaped grooves are formed in the upper substrate, extension springs are arranged on the left side and the right side of each V-shaped groove, the lower ends of the extension springs are connected with the middle substrate, and piezoelectric actuators connected with the V-shaped grooves are arranged on the middle substrate.
Preferably, the wedge error compensation device for wafer manufacturing is provided with a sensor protection column on the sensor.
Preferably, a limiting screw is connected between the middle substrate and the lower substrate.
Preferably, in the wedge-shaped error compensation device for wafer manufacturing, the fixing shaft is disposed in a fixing shaft sleeve, and the fixing shaft sleeve is mounted on the lower substrate.
Preferably, in the wedge error compensation device for wafer manufacturing, the upper substrate, the middle substrate and the lower substrate are circular ring structures.
Preferably, in the wedge-shaped error compensation device for wafer manufacturing, the number of the V-shaped grooves is 3 on the upper substrate, and the V-shaped grooves are arranged at intervals of 120 °.
Preferably, in the wedge-shaped error compensation device for wafer manufacturing, 3 sets of the damper, the compression spring, the fixed shaft and the guide bearing are arranged on the middle base plate, and each set is arranged at an interval of 120 degrees.
Preferably, the wedge error compensating apparatus for wafer manufacturing includes a flexible member including an extension spring, a compression spring, and a fixed shaft spring.
Preferably, in the wedge-shaped error compensation device for wafer manufacturing, the damper, the compression spring, the fixed shaft, the guide shaft, and the V-shaped groove are disposed on the respective base plates in a staggered manner.
A wedge error compensation method for wafer manufacturing comprises the following steps:
step 1: the rotating cylinder is opened, and the small ball rotates to a position between the chuck unit and the reference plate;
and 2, step: the Z-axis lifting cylinder ascends, the chuck unit contacts the small ball, the small ball ascends again for displacement, the elastic sheet deforms, the small ball contacts the reference plate, and the reference plate is parallel to the chuck unit;
and step 3: resetting the sensor, opening the locking cylinder and fixing the current state;
and 4, step 4: the Z-axis lifting cylinder descends to the original position, the rotating cylinder returns to the original position, and the small ball returns to the original position along with the rotation;
and 5: the Z-axis lifting cylinder rises again to the detection range of the sensor;
step 6: based on the sensor values, the three piezoelectric actuators are adjusted to eliminate the wedge angle.
By means of the scheme, the invention at least has the following advantages:
the invention solves the problem that the parallelism of the wafer and the manufacturing system is difficult to adjust when the wafer is manufactured. Meanwhile, the space is saved by adopting a circular structure, and the compensation precision and the compensation range are improved by connecting the passive wedge-shaped error compensation units and the active wedge-shaped error compensation units in series.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of a wedge error compensation unit of the present invention;
FIG. 3 is a partial perspective cut-away view of the passive error compensation module of the present invention;
FIG. 4 is a cross-sectional view of another perspective of a portion of the passive error compensation module of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present application, it should be noted that the terms "vertical", "horizontal", "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the application usually place when in use, and are used only for convenience in describing the present application and for simplification of description, but do not indicate or imply that the devices or elements that are referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used solely to distinguish one from another, and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or vertical, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Examples
As shown in fig. 1, fig. 2, fig. 3, and fig. 4, a wedge error compensation device for wafer manufacturing includes a horizontal auxiliary unit 1 and a wedge error compensation unit 3, the wedge error compensation unit 3 is located right below the horizontal auxiliary unit 1, a chuck unit 2 is disposed on the wedge error compensation unit 3, a Z-axis lifting cylinder 4 for lifting the wedge error compensation unit 3 is connected below the wedge error compensation unit 3, and the wedge error compensation unit 3 is lifted by the Z-axis lifting cylinder 4 to make the chuck unit 2 touch the horizontal auxiliary unit 1;
the horizontal auxiliary unit 1 comprises a circular base body 15, at least three high-precision sensors 11 are arranged on the base body 15 at intervals of 120 degrees, a reference plate 16 is arranged below the base body 15, at least three rotary cylinders 13 are arranged above the base body 15, the distribution position of each rotary cylinder 13 is consistent with the position of the sensor 11, the rotary cylinders 13 are connected with one end of an elastic sheet 17, and a small ball 14 capable of contacting with the reference plate is connected to the other end of the elastic sheet 17;
the wedge error compensation unit 3 is composed of a passive error compensation module and an active wedge error compensation module, wherein the passive error compensation module is positioned below the active wedge error compensation module and is connected with the active wedge error compensation module through a flexible assembly;
the passive error compensation module comprises a lower substrate 31 and a middle substrate 33, wherein an insertion hole for installing a compression spring is formed in the lower substrate 31, a compression spring 311 is arranged in the insertion hole, a damping groove for installing a damper is formed in the lower substrate 31, a damper 34 is arranged in the damping groove, one end of the damper 34 is connected with the middle substrate 33, the middle substrate 33 is covered on the lower substrate 31 through the compression spring 311, a movable fixing shaft 312 is inserted in the lower substrate 31, the upper end of the fixing shaft is inserted in the middle substrate 33, a fixing connecting plate 313 is connected to the fixing shaft 312, fixing shaft springs 314 are arranged on the left side and the right side of the fixing connecting plate 313, the fixing shaft springs 314 are inserted in the spring groove formed in the middle substrate 33, a locking cylinder 38 for locking the fixing shaft is arranged in the lower substrate 31, a guide plate 315 is arranged on the lower substrate 31, and a guide bearing 36 for guiding the guide of the middle substrate 33 in a contact manner is arranged at the upper end of the guide plate 315;
initiative wedge error compensation module includes upper substrate 32, upper substrate 32 lid is established on well base plate 33, a plurality of V type grooves 310 have been seted up on the upper substrate 32, the left and right sides in V type groove 310 is provided with extension spring 37, extension spring 37's lower extreme links to each other with well base plate 33, be provided with on the infrabasal plate 31 and be used for linking to each other piezoelectric actuator 35 with V type groove.
Wherein, the small balls are at least three, have consistent sizes and are processed with high precision. The pellet uses shell fragment and revolving cylinder to connect, and pellet and benchmark board keep the certain distance (can make the pellet rotatory), prevent to avoid the pellet to touch the benchmark board when rotatory, but when chuck contact pellet, because the shell fragment receives the power and takes place to warp, pellet and benchmark board contact. The reference plate is in contact with the small ball frequently, so that the surface hardness is high, the abrasion resistance is needed, and glass or ceramic can be selected. The level assist unit is mounted on the same mounting plate as the reference for adjustment of the wedge error unit and the manufacturing system (not shown) and is adjusted using a laser interferometer or other tool to align the reference plate with the manufacturing system during installation. The sensor is used for measuring the distance between the sensor and the bearing plate, and a capacitance sensor, a length meter, a laser sensor, an eddy current sensor or the like can be used.
The passive error compensation module is provided with upward pressure by a compression spring, a limit screw is used for limiting the height direction, and a guide bearing is used for guiding. Three dampers, three sets of compression springs, a set screw and a guide bearing stabilize the system. The damper is capable of reducing vibration, providing cushioning, and providing a resistance to initial movement of the system.
And a locking cylinder in the passive error compensation module is opened, and a piston props against a fixed shaft to fix the current posture. The fixed shaft is connected with the middle base plate through a fixed shaft spring, and the fixed shaft can only move in the Z direction through the limiting of the shaft sleeve. The locking cylinder is used for introducing compressed air into the cavity, the piston moves rightwards, the cylinder is opened, the cavity is introduced with vacuum, the piston moves leftwards, the cylinder is closed, and the sealing ring 39 is used for keeping the sealing between the cavity and the piston.
The precise dampers, compression springs, locking cylinders, guide bearings and the like in the passive error compensation unit are all three groups, and the same parts are uniformly distributed at 120 degrees on the same circumference.
The sensor 11 is provided with a sensor protection column 12.
The middle substrate 33 and the lower substrate 31 are connected with a limit screw 317 therebetween.
The fixing shaft 312 of the present invention is disposed in a fixing shaft sleeve 316, and the fixing shaft sleeve 316 is installed on the lower substrate and the middle substrate.
The upper substrate 32, the middle substrate 33 and the lower substrate 31 are circular structures.
The number of the V-shaped grooves 310 is 3, and the V-shaped grooves are arranged at intervals of 120 degrees on the upper substrate.
The damper, the compression spring, the fixed shaft and the guide bearing on the middle base plate 33 are all provided with 3 sets, and each set is arranged at intervals of 120 degrees.
The flexible assembly of the present invention includes an extension spring, a compression spring and a fixed shaft spring.
The damper, the compression spring, the fixed shaft, the guide shaft and the V-shaped groove 310 are distributed on the respective base plates in a staggered manner.
Half the stroke of the three piezoelectric actuators is used to adjust the wedge error and half is used to adjust the exact distance of the wafer to the manufacturing system. The principle of active wedge error compensation is to calculate the wedge angle according to the values of the three sensors and then calculate the adjustment values of the three piezoelectric actuators according to the wedge angle.
The piezoelectric actuator stroke is limited by its own length, typically under 100 microns.
The output axial force of the piezoelectric actuator is very large, the piezoelectric actuator can bear the very large axial force, the two sides of each piezoelectric actuator are provided with extension springs which are used for overcoming the tangential force applied to the system, and theoretically, the larger the tension of the springs in a certain range is, the more stable the system is. The extension spring provides a downward pulling force to balance the system. The active wedge error compensation module adjusts the wedge angle by using piezoelectricity, and meanwhile, a high-precision sensor is used for feedback, so that the system precision can be improved.
When in mediation, only passive is followed by active. The wedge-shaped error compensation unit is circular, the middle of the wedge-shaped error compensation unit is hollow, so that the weight is reduced, and a lifting mechanism can be added in the middle of the wedge-shaped error compensation unit, so that the subsequent automatic carrying is facilitated.
During each wafer fabrication process, the sensors are constantly active, monitoring the parallelism of the chuck and the reference plate, and if an anomaly is detected, the system needs to be readjusted.
The Z-axis lifting air cylinder 4 is used for adjusting the distance between the manufacturing system and the wafer during manufacturing, the Z-axis lifting air cylinder 4 is used for coarse adjustment, and three piezoelectric actuators are used for fine adjustment. The fine adjustment can better control the distance and obtain better effect.
The device can increase XY axes, but the speed can not exceed 1m/s in movement due to the flexible mechanism in the mechanism and certain mass.
A wedge error compensation method for wafer manufacturing comprises the following steps:
step 1: the rotating cylinder is opened, and the small ball rotates to a position between the chuck unit and the reference plate;
step 2: the Z-axis lifting cylinder ascends, the chuck unit contacts the small ball, the small ball ascends again for displacement, the elastic sheet deforms, the small ball contacts the reference plate, and the reference plate is parallel to the chuck unit;
and 3, step 3: resetting the sensor, opening the locking cylinder and fixing the current state;
and 4, step 4: the Z-axis lifting cylinder descends to the original position, the rotating cylinder returns to the original position, and the small ball returns to the original position along with the rotation;
and 5: the Z-axis lifting cylinder rises again to the detection range of the sensor;
and 6: based on the sensor values, the three piezoelectric actuators are adjusted to eliminate the wedge angle.
After the operation adjustment is completed, the adjustment can be avoided in one period. During production, the sensor is always in working state to detect the parallelism of the wafer and the manufacturing system. If the parallelism is damaged, the device can give an alarm to prompt readjustment.
In summary, the wedge error compensation device of the present invention can be used in other IC fields such as wafer inspection and wafer bonding.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, it should be noted that, for those skilled in the art, many modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A wedge error compensation device for wafer manufacturing is characterized in that: the wedge-shaped error compensation device comprises a horizontal auxiliary unit (1) and a wedge-shaped error compensation unit (3), wherein the wedge-shaped error compensation unit (3) is located under the horizontal auxiliary unit (1), a chuck unit (2) is arranged on the wedge-shaped error compensation unit (3), a Z-axis lifting cylinder (4) for lifting the wedge-shaped error compensation unit (3) is connected below the wedge-shaped error compensation unit (3), and the wedge-shaped error compensation unit (3) is lifted by the Z-axis lifting cylinder (4) to enable the chuck unit (2) to be in contact with the horizontal auxiliary unit (1);
the horizontal auxiliary unit (1) comprises a circular base body (15), at least three high-precision sensors (11) are arranged on the base body (15) at intervals of 120 degrees, a reference plate (16) is arranged below the base body (15), at least three rotary cylinders (13) are arranged above the base body (15), the distribution positions of the rotary cylinders (13) are consistent with the positions of the sensors (11), the rotary cylinders (13) are connected with one end of an elastic sheet (17), and small balls (14) capable of being in contact with the reference plate are connected to the other end of the elastic sheet (17);
the wedge error compensation unit (3) is composed of a passive error compensation module and an active wedge error compensation module, wherein the passive error compensation module is positioned below the active wedge error compensation module and is connected with the active wedge error compensation module through a flexible assembly;
the passive error compensation module comprises a lower substrate (31) and a middle substrate (33), wherein a jack for mounting a compression spring is formed in the lower substrate (31), a compression spring (311) is arranged in the jack, a damping groove for mounting a damper is formed in the lower substrate (31), a damper (34) is arranged in the damping groove, one end of the damper (34) is connected with the middle substrate (33), the middle substrate (33) is covered on the lower substrate (31) through the compression spring (311), a movable fixed shaft (312) is inserted in the lower substrate (31), the upper end of the fixed shaft is inserted in the middle substrate (33), a fixed connecting plate (313) is connected onto the fixed shaft (312), fixed shaft springs (314) are arranged on the left side and the right side of the fixed connecting plate (313), the fixed shaft springs (314) are inserted in the spring grooves formed in the middle substrate (33), a locking cylinder (38) for locking the fixed shaft is arranged in the lower substrate (31), a guide plate (315) is arranged on the lower substrate (31), and a guide bearing (36) for contacting with the middle substrate (33) is arranged at the upper end of the guide plate (315);
initiative wedge error compensation module includes upper substrate (32), upper substrate (32) lid is on well base plate (33), a plurality of V type grooves (310) have been seted up on upper substrate (32), the left and right sides in V type groove (310) is provided with extension spring (37), the lower extreme and well base plate (33) of extension spring (37) link to each other, be provided with on infrabasal plate (31) and be used for linking to each other piezoelectric actuator (35) with V type groove.
2. The apparatus of claim 1, wherein: and a sensor protection column (12) is arranged on the sensor (11).
3. The apparatus of claim 1, wherein: and a limit screw (317) is connected between the middle substrate (33) and the lower substrate (31).
4. The apparatus of claim 1, wherein: the fixed shaft (312) is arranged in a fixed shaft sleeve (316), and the fixed shaft sleeve (316) is arranged on the lower substrate.
5. The apparatus of claim 1, wherein: the upper substrate (32), the middle substrate (33) and the lower substrate (31) are of circular ring structures.
6. The apparatus of claim 1, wherein: the number of the V-shaped grooves (310) is 3, and the V-shaped grooves are arranged at intervals of 120 degrees on the upper substrate.
7. The apparatus of claim 1, wherein: the damper, the compression spring, the fixed shaft and the guide bearing on the middle base plate (33) are all provided with 3 sets, and each set is arranged at 120-degree intervals.
8. The apparatus of claim 1, wherein: the flexible assembly includes an extension spring, a compression spring, and a fixed shaft spring.
9. The apparatus of claim 1, wherein: the damper, the compression spring, the fixed shaft, the guide shaft and the V-shaped groove (310) are distributed on the respective base plates in a staggered mode.
10. A wedge error compensation method for wafer manufacturing is characterized by comprising the following steps:
step 1: the rotating cylinder is opened, and the small ball rotates to a position between the chuck unit and the reference plate;
step 2: the Z-axis lifting cylinder ascends, the chuck unit contacts the small ball, the small ball ascends again for displacement, the elastic sheet deforms, the small ball contacts the reference plate, and the reference plate is parallel to the chuck unit;
and step 3: resetting the sensor, opening the locking cylinder and fixing the current state;
and 4, step 4: the Z-axis lifting cylinder descends to the original position, the rotating cylinder returns to the original position, and the small ball returns to the original position along with the rotation of the rotating cylinder;
and 5: the Z-axis lifting cylinder rises again to the detection range of the sensor;
step 6: based on the sensor values, the three piezoelectric actuators are adjusted to eliminate the wedge angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211100403.4A CN115632017A (en) | 2022-09-09 | 2022-09-09 | Wedge-shaped error compensation device and method for wafer manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211100403.4A CN115632017A (en) | 2022-09-09 | 2022-09-09 | Wedge-shaped error compensation device and method for wafer manufacturing |
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| CN115632017A true CN115632017A (en) | 2023-01-20 |
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| CN202211100403.4A Pending CN115632017A (en) | 2022-09-09 | 2022-09-09 | Wedge-shaped error compensation device and method for wafer manufacturing |
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