CN115621373A - LED packaging structure and preparation method thereof - Google Patents

LED packaging structure and preparation method thereof Download PDF

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Publication number
CN115621373A
CN115621373A CN202211024177.6A CN202211024177A CN115621373A CN 115621373 A CN115621373 A CN 115621373A CN 202211024177 A CN202211024177 A CN 202211024177A CN 115621373 A CN115621373 A CN 115621373A
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China
Prior art keywords
layer
fluorescent glue
led chip
led
forming
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CN202211024177.6A
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Chinese (zh)
Inventor
曹祖铭
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Shenzhen Yimingyue Technology Co ltd
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Shenzhen Yimingyue Technology Co ltd
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Priority to CN202211024177.6A priority Critical patent/CN115621373A/en
Publication of CN115621373A publication Critical patent/CN115621373A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C5/00—Processes for producing special ornamental bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0025—Processes relating to coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

The invention relates to the technical field of manufacturing semiconductor packaging of electronic devices, and discloses an LED packaging structure and a preparation method thereof. The preparation method of the LED packaging structure comprises the steps of providing a carrier layer; arranging an LED chip set in a die bonding area of the carrier layer; a dam layer is formed around the periphery of the LED chip group; coating first fluorescent glue in a ring formed by the dam layer, and coating second fluorescent glue on the edge of the carrier layer; providing an appearance decorative layer, covering the appearance decorative layer on the first fluorescent glue and the second fluorescent glue, rolling the outer surface of the appearance decorative layer, and rolling the appearance decorative layer from one side coated with the second fluorescent glue to the other side to form a lamp strip membrane; the lamp area diaphragm heats and pressurizes and solidifies first fluorescent glue and second fluorescent glue, obtains the LED packaging structure who has the outward appearance decorative layer, and the outward appearance decorative layer makes LED packaging structure realize richly various, the gorgeous outward appearance effect of color and improves the experience sense that the user used.

Description

LED packaging structure and preparation method thereof
Technical Field
The invention relates to the technical field of manufacturing semiconductor packaging of electronic devices, in particular to an LED packaging structure and a preparation method thereof.
Background
The LED packaging structure is generally applied to equipment with illumination purposes, such as daily incandescent lamps, vehicles, computers, mobile phones and other equipment, along with the wider application of the LED packaging structure, people have high requirements on the appearance of the LED packaging structure, the traditional LED packaging structure can only display the natural color of fluorescent powder under the condition of no lighting, and if the fluorescent powder is yellow, the fluorescent powder is yellow and has no texture, so that the traditional LED packaging structure is not in line with the aesthetic requirements of people at present.
Disclosure of Invention
The invention mainly aims to provide an LED packaging structure and a preparation method thereof, and aims to solve the technical problem of single appearance of the LED packaging structure.
In order to achieve the above object, the present invention provides a method for manufacturing an LED package structure, including:
providing a carrier layer;
arranging an LED chip set in the die bonding area of the carrier layer;
forming a dam layer around the periphery of the LED chip group;
coating first fluorescent glue in a ring formed by the dam layer, and coating second fluorescent glue at the edge of the carrier layer;
providing an appearance decorative layer, covering the appearance decorative layer on the first fluorescent glue and the second fluorescent glue, rolling the appearance decorative layer on the outer surface of the appearance decorative layer, and rolling the appearance decorative layer from one side coated with the second fluorescent glue to the other side to form a lamp strip membrane;
and heating and pressurizing the lamp strip membrane to cure the first fluorescent glue and the second fluorescent glue.
Optionally, in an embodiment, the distance from the edges of the two sides of the LED chip group to the dam layer is equal.
Optionally, in an embodiment, the heating temperature is 80 ℃ to 100 ℃, the heating time is 10min to 30min, and the pressurizing pressure is 20KGF/CM 2 -40KGF/CM 2 。
Optionally, in an embodiment, after the forming the dam layer around the peripheral side of the LED chip set, the method further includes: providing a mold with a groove, and placing the carrier layer provided with the LED chip group and the dam layer into the groove of the mold, wherein the depth of the groove is equal to the height of the LED packaging structure.
Optionally, in an embodiment, the step of forming the appearance decorative layer includes:
providing a substrate layer;
and forming a color layer on the substrate layer.
Optionally, in an embodiment, a substrate layer is provided;
forming an optical texture layer on the substrate layer;
and forming a color layer on one side of the substrate layer, which is back to the optical texture layer.
Optionally, in an embodiment, the step of forming the appearance decorative layer includes:
providing a substrate layer;
forming an optical texture layer on the substrate layer;
forming an electroplated layer on the optical texture layer;
and forming a color protection layer on the electroplated layer.
Optionally, in an embodiment, the appearance decoration layer is made of polyurethane leather or silicone leather.
The present invention also provides an LED package structure, including:
a carrier layer;
an LED chip group disposed on the carrier layer;
the dam layer is arranged around the periphery of the LED chip group;
the fluorescent glue covers the surfaces of the dam layer, the LED chip group and the carrier layer;
and the appearance decorative layer is arranged on the fluorescent glue.
Optionally, in an embodiment, the carrier layer includes a circuit board, a reflective layer disposed on the circuit board, and a conductive layer electrically connected to the circuit board through the reflective layer.
According to the technical scheme, the LED chip set is arranged in the die bonding area of the carrier layer, the LED chip set is surrounded by a circle of surrounding dam glue around the periphery of the LED chip set to form a surrounding dam layer, the carrier layer provided with the LED chip and the surrounding dam layer is placed in the groove of the die, the first fluorescent glue is dispensed in the circle of the surrounding dam layer by the glue dispenser, the second fluorescent glue is dispensed at the edge of the carrier layer, the appearance decorative layer is covered on the first fluorescent glue and the second fluorescent glue, height limitation is performed by using the depth of the groove, the rolling is performed from one end with the second fluorescent glue by using a roller press by using the roller press and is rolled to the other end, after the rolling is completed, the fluorescent glue is uniformly coated between the appearance decorative layer and the carrier layer to form the lamp strip diaphragm (the lamp strip diaphragm does not comprise the die), the lamp strip diaphragm is cured to obtain the LED packaging structure with the appearance decorative layer, the appearance decorative layer enables the LED packaging structure to achieve rich and various appearance effects, the use experience of users is improved, and the application range of the LED packaging structure is expanded.
Drawings
One or more embodiments are illustrated in corresponding drawings which are not intended to be limiting, in which elements having the same reference number designation may be referred to as similar elements throughout the drawings, unless otherwise specified, and in which the drawings are not to scale.
Fig. 1 is a schematic flow chart of a method for manufacturing an LED package structure according to an embodiment of the present invention;
fig. 2 is a first cross-sectional partial schematic view of an LED package structure according to an embodiment of the invention;
fig. 3 is a second cross-sectional partial schematic view of an LED package structure according to an embodiment of the invention;
FIG. 4 is a top partial schematic view of an LED package structure according to one embodiment of the present invention;
fig. 5 is a schematic cross-sectional partial view of an LED package structure in a lamination apparatus according to an embodiment of the present invention.
10, an LED packaging structure; 11. an LED chip group; 110. a chip; 12. a dam layer; 13. a carrier layer; 130. a circuit board; 131. a reflective layer; 132. a conductive layer; 14. an appearance decorative layer; 15. fluorescent glue; 16. a first lamination mold; 17. a second lamination mold; 18. a first heating plate; 19. a second heating plate; 20. and (6) a groove.
Detailed Description
In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and the like as used herein are for descriptive purposes only. In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.
Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
Referring to fig. 1, an embodiment of the present invention discloses a method for manufacturing an LED package structure, where the method includes:
s1, providing a carrier layer;
optionally, the step S1 includes:
providing a circuit board;
forming a reflecting layer on the circuit board through a silk-screen process;
forming a conductive layer on the circuit board located on the same surface of the circuit board as the reflective layer by a printing process;
s2, arranging an LED chip set in a die bonding area of the carrier layer;
in this step, the LED chip group includes a plurality of LED chips for emitting light; the method comprises the steps of silk-screen printing high-reflection ink on a circuit board through a silk-screen process, forming a reflecting layer with the thickness of 0.01-0.03 mm after the high-reflection ink is solidified, printing silver paste or tin paste on the surface of the circuit board on which the reflecting layer is silk-screen printed by using a steel mesh to form a conducting layer, fixing an LED chip on the silver paste or tin paste by using a die bonder, welding and conducting the LED chip and the silver paste or tin paste through wave crest heating, enabling the LED chip to be electrically connected with the circuit board due to the fact that the silver paste or tin paste has the conducting characteristic, enabling the silver paste or tin paste to play a role in fixing the LED chip, selecting a place needing silk-screen printing according to actual conditions through the silk-screen printing process, avoiding the place (circuit of the circuit board) on the circuit board where the tin paste or silver paste needs to be printed, enabling the light source of the LED chip to be reflected to the surface to improve the brightness value on the circuit board under the condition of electrifying, and enabling the LED chip to be electrically conductive to the circuit board, wherein the circuit board can be a flexible circuit board, and the high-reflection ink can be polyester ink.
S3, forming a surrounding dam layer around the periphery of the LED chip group;
optionally, after the step S3, the method further includes:
providing a mold with a groove, and placing the carrier layer provided with the LED chip group and the dam layer into the groove of the mold, wherein the depth of the groove is equal to the height of the LED packaging structure;
in this step, the shape that LED chipset constitutes can be "C" type, "L" type and strip-type multiple shape such as, uses the point gum machine to glue with the box dam on the circuit board and encloses the LED chipset, forms the box dam layer, and a LED chipset corresponds encloses a box dam layer, and the edge of LED chipset both sides equals to the distance on box dam layer, and the material that the box dam glued can be organic silica gel, can make light distribute more evenly. The die can be a laminating die, the laminating die is provided with a groove, the depth of the groove is equal to the height of the LED packaging structure, and the circuit board provided with the LED chip group and the dam layer is placed into the groove of the laminating die for the next procedure.
S4, coating first fluorescent glue in a ring formed by the dam layer, and coating second fluorescent glue on the edge of the carrier layer;
in this step, it should be noted that the materials of the first fluorescent glue and the second fluorescent glue are the same, so as to distinguish the functions of the fluorescent glue in different steps. The method comprises the steps of mixing fluorescent powder and organic silica gel or acrylate according to a certain proportion according to a color temperature requirement to obtain fluorescent glue, dispensing a strip of fluorescent glue in a ring formed by a surrounding dam layer (an LED chip group is positioned in the surrounding dam glue) by using a dispenser to obtain first fluorescent glue, discharging bubbles generated between the first fluorescent glue and the LED chip group under the rolling of a roller press by using the first fluorescent glue, dispensing a strip of fluorescent glue at the edge of a circuit board to obtain second fluorescent glue, wherein the fluorescent glue has the functions of protecting the LED chip from radiation, water vapor, oxygen or external force damage, and enhancing the bonding strength of an appearance decorative layer and the circuit board.
S5, providing an appearance decorative layer, covering the appearance decorative layer on the first fluorescent glue and the second fluorescent glue, rolling the outer surface of the appearance decorative layer, and rolling the outer surface from one side coated with the second fluorescent glue to the other side to form a lamp strip membrane;
in the step, the prepared appearance decorative layer is covered on the fluorescent glue in a whole, a roller press is used for rolling from one end with the second fluorescent glue to the other end, the second fluorescent glue mainly plays a role in supporting, the rolling pressure is ensured to be the same when the second fluorescent glue is rolled, so that the fluorescent glue can be uniformly coated between the appearance decorative layer and the circuit board to form the lamp strip diaphragm (the lamp strip diaphragm does not comprise a die)
Optionally, step S5 includes:
providing a substrate layer;
and forming a color layer on the substrate layer.
In the step, the material of the substrate layer can be Polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), a PC composite plate or epoxy glass beads, and the thickness of the substrate layer is 0.1mm to 0.2mm; the color layer can be made of acrylate ink, polyester ink or epoxy resin ink, and the thickness of the color layer is 0.01mm-0.03mm; through offset printing, silk screen printing, or the mode of printing preparation colour layer on the substrate layer, the colour layer can be selected according to user's demand, realizes that LED packaging structure's colour is diversified, enriches LED packaging structure's outward appearance effect for LED packaging structure both can realize the function of illumination, has decorative effect again, improves the experience sense that the user used, and wherein, the substrate layer is as the carrier, is located LED packaging structure's the outside, contacts with the external world, and the colour layer is laminated with the fluorescent glue.
Optionally, step S5 further includes:
providing a substrate layer;
forming an optical texture layer on the substrate layer;
and forming a color layer on one side of the substrate layer, which is back to the optical texture layer.
In this step, the arrangement order of the substrate layer, the optical texture layer and the color layer is not limited, the optical texture layer is located on the outermost side of the LED packaging structure and is in contact with the outside, and the color layer is attached to the fluorescent glue. Taking a mold with textures, coating a layer of acrylate or polyurethane with the thickness of 0.01-0.03 mm on the mold and between the mold and the substrate layer, baking and curing the mold, separating the mold from the substrate layer, transferring the textures of the acrylate or the textures of the polyurethane onto the substrate layer to obtain the substrate layer with the textures, and electroplating colors on the texture surface by using a vacuum coating machine to make the appearance of the LED packaging structure have the textures and the colors which can be manufactured according to the requirements, so that the LED packaging structure realizes rich and various appearance effects with gorgeous colors, and the application range of the LED packaging structure is expanded.
Optionally, step S5 further includes:
providing a substrate layer;
forming an optical texture layer on the substrate layer;
forming an electroplated layer on the optical texture layer;
and forming a color protection layer on the electroplated layer.
In the step, the arrangement sequence of the substrate layer, the optical texture layer, the electroplated layer and the color protection layer is not limited, the substrate layer is located on the outermost side of the LED packaging structure and is in contact with the outside, and the color protection layer is attached to the fluorescent glue. Taking a mold with textures, coating a layer of acrylic ester or polyurethane between the mold and a substrate layer, baking and curing the mold and the substrate layer, separating the mold from the substrate layer, transferring the texture of the acrylic ester or the texture of the polyurethane onto the substrate layer to obtain the substrate layer with optical textures, electroplating metal oxide (silicon dioxide or titanium dioxide) on the texture surface by using a vacuum coating machine to form an electroplated layer with the thickness of 0.00001-0.0001mm, protecting the texture layer and realizing the dazzling color by the electroplated layer, coating polyester ink, epoxy resin ink or acrylic ester ink on the electroplated layer in a printing, spraying or coating mode, heating, baking and curing the electroplated layer to form a color protective layer with the thickness of 0.02-0.05 mm, obtaining a decorative layer, wherein the color protective layer can protect the electroplated layer and realize the ground color of the decorative layer, so that the LED packaging structure realizes rich and diverse appearance effects, and expands the application range of the LED packaging structure.
Optionally, step S5 further includes: the appearance decorative layer is made of polyurethane leather or organic silicon leather.
S6, heating and pressurizing the lamp strip membrane to cure the first fluorescent glue and the second fluorescent glue.
In this step, heat the pressurization through lamination equipment to the lamp area diaphragm and solidify fluorescent glue, make circuit board and outward appearance decorative layer bond together, then with lamp area diaphragm and lamination mould separation, obtain the packaging structure who has the outward appearance decorative layer, richen packaging structure's appearance effect, improve the experience sense that the user used, make the user can see the appearance effect of outward appearance decorative layer under the condition that LED packaging structure does not go on electric, can regard as a decoration, realize the function of illumination when LED packaging structure under the condition of circular telegram. Wherein the heating temperature is 80-100 ℃, the heating time is 10-30 min, and the pressurizing pressure is 20KGF/CM2-40KGF/CM2; the laminating equipment can prepare a plurality of LED packaging structures simultaneously, first fix first layer mould on the first hot plate of laminating equipment, place the carrier layer in the recess of first laminating mould, then in proper order on the carrier layer point fluorescence glue, cover outward appearance decorative layer and roll-in outward appearance decorative layer, then fix second laminating mould on first laminating mould, then in proper order point fluorescence glue on the carrier layer, cover outward appearance decorative layer and roll-in outward appearance decorative layer, cover the second hot plate on second laminating mould again, solidify the fluorescence glue through first hot plate and second hot plate, can prepare a plurality of LED packaging structures simultaneously, and the production efficiency is improved. Of course, according to actual production requirements, the laminating mold can be continuously added on the second laminating mold so as to optimize the efficiency of producing the LED packaging structure.
In this embodiment, this LED package structure is applied to the cell-phone, be located the back of cell-phone, the shell of cell-phone adopts transparent material, the user can see LED package structure through transparent shell, LED package structure is connected with the built-in procedure electricity of cell-phone, when the cell-phone has the caller ID demonstration, LED package structure circular telegram and light, in order to indicate the user to have the caller ID, of course LED package structure can also bind with other functions and realize other functions, for example set a number incoming telegram and correspond a light effect, when LED package structure does not circular telegram, the user can see the outward appearance effect of the outward appearance decorative layer of LED package structure through transparent shell, can regard as the decoration, increase the aesthetic feeling of cell-phone, and then improve the experience that the user used, extension LED package structure's range of application. The LED chip groups are arranged in a die bonding area of the carrier layer, the LED chip groups are surrounded by a circle of dam adhesive around the periphery of the LED chip groups to form a dam layer, the carrier layer provided with the LED chips and the dam layer is placed in a groove of a laminating die, a first fluorescent adhesive is dispensed in the circle of the dam layer by a dispenser, a second fluorescent adhesive is dispensed at the edge of the carrier layer, an appearance decorative layer covers the first fluorescent adhesive and the second fluorescent adhesive, the height is limited by the depth of the groove, a roller press is used for rolling from one end with the second fluorescent adhesive, the second fluorescent adhesive is rolled to the other end, after the rolling is completed, the fluorescent adhesive is uniformly coated between the appearance decorative layer and the carrier layer to form a lamp strip diaphragm (the lamp strip diaphragm does not comprise the die), the lamp strip diaphragm is solidified to obtain the LED packaging structure with the appearance decorative layer, the appearance decorative layer enables the LED packaging structure to achieve rich and diverse appearance effects, the experience of users is improved, and the application range of the LED packaging structure is expanded.
As shown in fig. 2-5, an embodiment of the invention discloses an LED package structure 10, where the LED package structure 10 includes a carrier layer 13, an LED chip set 11, a dam layer 12, a fluorescent glue 15, and an appearance decoration layer 14, where the carrier layer 13 includes a circuit board 130, a reflection layer 131, and a conductive layer 132, the reflection layer 131 is disposed on the circuit board 130 and is used to reflect a light source of an LED chip 110 to a surface to increase a brightness value, the conductive layer 132 penetrates through the reflection layer 131 to be electrically connected to the circuit board 130, the conductive layer 132 is used to implement a conductive loop between the LED chip 110 and the circuit board 130, the LED chip group 11 comprises a plurality of LED chips 110, the LED chips 110 are fixedly crystallized on the conductive layer 132, the LED chips 110 form the LED chip group 11, the LED chips 110 can be arranged in a row or in a parallel row, the surrounding dam layer 12 is arranged around the periphery of the LED chip group 11, the distance H from the edges of the two sides of the LED chip group 11 to the surrounding dam layer 12 is equal, the surrounding dam layer 12 is used for light equalization, the fluorescent glue 15 is coated on the surfaces of the surrounding dam layer 12, the LED chip group 11 and the carrier layer 13, and the appearance decoration layer 14 is arranged on the fluorescent glue 15. The appearance decorative layer 14 enables the LED packaging structure 10 to achieve rich and diverse appearance effects and colorful appearance effects, the experience of use of a user is improved, the application range of the LED packaging structure 10 is expanded, the laminating device can simultaneously manufacture a plurality of LED packaging structures 10, first, the first laminating die 16 is fixed on the first heating plate 18 of the laminating device, the carrier layer 13 is placed in the groove 20 of the first laminating die 16, then, fluorescent glue 15 is sequentially dispensed on the carrier layer 13, the appearance decorative layer 14 is covered and rolled, then, the second laminating die 17 is fixed on the first laminating die 16, then, fluorescent glue 15 is sequentially dispensed on the carrier layer 13, the appearance decorative layer 14 is covered and rolled, then, the second heating plate 19 is covered on the second laminating die 17, the fluorescent glue 15 is cured through the first heating plate 18 and the second heating plate 19, the plurality of LED packaging structures 10 can be simultaneously manufactured, and the production efficiency is improved. Of course, according to actual production requirements, a laminating mold can be added on the second laminating mold 17 to optimize the efficiency of producing the LED package structure 10, and it should be noted that the first laminating mold 16 and the second laminating mold 17 are the same mold to distinguish the functions of the laminating mold in different steps; the first heating plate 18 and the second heating plate 19 are identical heating plates in order to distinguish the role of the heating plates in the different steps.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; within the idea of the invention, also technical features in the above embodiments or in different embodiments may be combined, steps may be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A preparation method of an LED packaging structure is characterized by comprising the following steps:
providing a carrier layer;
arranging an LED chip set in the die bonding area of the carrier layer;
forming a dam layer around the periphery of the LED chip group;
coating first fluorescent glue in a ring formed by the dam layer, and coating second fluorescent glue at the edge of the carrier layer;
providing an appearance decorative layer, covering the appearance decorative layer on the first fluorescent glue and the second fluorescent glue, rolling the appearance decorative layer on the outer surface of the appearance decorative layer, and rolling the appearance decorative layer from one side coated with the second fluorescent glue to the other side to form a lamp strip membrane;
and heating and pressurizing the lamp strip membrane to cure the first fluorescent glue and the second fluorescent glue.
2. The method for preparing the LED chip module according to the claim 1, wherein the distance from the edges of two sides of the LED chip module to the dam layer is equal.
3. The method according to claim 1, wherein the temperature of the heating is 80 ℃ to 100 ℃, the time of the heating is 10min to 30min, and the pressure of the pressurization is 20KGF/CM 2 -40KGF/CM 2 。
4. The method of manufacturing according to claim 1, further comprising, after the forming of a dam layer around a peripheral side of the LED chip group:
providing a mold with a groove, and placing the carrier layer provided with the LED chip group and the dam layer into the groove of the mold, wherein the depth of the groove is equal to the height of the LED packaging structure.
5. The method of claim 1, wherein the step of forming the appearance finish comprises:
providing a substrate layer;
and forming a color layer on the substrate layer.
6. The method of claim 1, wherein the step of forming the appearance finish comprises:
providing a substrate layer;
forming an optical texture layer on the substrate layer;
and forming a color layer on one side of the substrate layer back to the optical texture layer.
7. The method of claim 1, wherein the step of forming the appearance finish comprises:
providing a substrate layer;
forming an optical texture layer on the substrate layer;
forming an electroplated layer on the optical texture layer;
and forming a color protection layer on the electroplated layer.
8. The method as claimed in claim 1, wherein the material of the appearance decorative layer is polyurethane leather or silicone leather.
9. An LED package structure, comprising:
a carrier layer;
an LED chip set disposed on the carrier layer;
the dam layer is arranged around the periphery of the LED chip group;
the fluorescent glue covers the surfaces of the dam layer, the LED chip group and the carrier layer;
the appearance decoration layer is arranged on the fluorescent glue.
10. The LED package structure of claim 9, wherein the carrier layer comprises a circuit board, a reflective layer disposed on the circuit board, and a conductive layer electrically connected to the circuit board through the reflective layer.
CN202211024177.6A 2022-08-24 2022-08-24 LED packaging structure and preparation method thereof Pending CN115621373A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211024177.6A CN115621373A (en) 2022-08-24 2022-08-24 LED packaging structure and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211024177.6A CN115621373A (en) 2022-08-24 2022-08-24 LED packaging structure and preparation method thereof

Publications (1)

Publication Number Publication Date
CN115621373A true CN115621373A (en) 2023-01-17

Family

ID=84856965

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211024177.6A Pending CN115621373A (en) 2022-08-24 2022-08-24 LED packaging structure and preparation method thereof

Country Status (1)

Country Link
CN (1) CN115621373A (en)

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