CN115613005A - Atomization device and thin film deposition system - Google Patents
Atomization device and thin film deposition system Download PDFInfo
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- CN115613005A CN115613005A CN202110807467.7A CN202110807467A CN115613005A CN 115613005 A CN115613005 A CN 115613005A CN 202110807467 A CN202110807467 A CN 202110807467A CN 115613005 A CN115613005 A CN 115613005A
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- 238000000427 thin-film deposition Methods 0.000 title claims abstract description 16
- 238000000889 atomisation Methods 0.000 title abstract description 30
- 239000000443 aerosol Substances 0.000 claims abstract description 63
- 230000010355 oscillation Effects 0.000 claims abstract description 53
- 238000006243 chemical reaction Methods 0.000 claims abstract description 50
- 239000012295 chemical reaction liquid Substances 0.000 claims abstract description 42
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- 239000012159 carrier gas Substances 0.000 claims description 22
- 239000007789 gas Substances 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 11
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 11
- 229910052721 tungsten Inorganic materials 0.000 claims description 11
- 239000010937 tungsten Substances 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 239000007921 spray Substances 0.000 claims description 8
- 239000010408 film Substances 0.000 abstract description 11
- 238000002360 preparation method Methods 0.000 abstract description 6
- 210000001503 joint Anatomy 0.000 abstract description 2
- 238000009688 liquid atomisation Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 238000005229 chemical vapour deposition Methods 0.000 description 10
- 238000000151 deposition Methods 0.000 description 10
- 239000000243 solution Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000000376 reactant Substances 0.000 description 7
- 238000001914 filtration Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 238000005507 spraying Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
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- 230000009286 beneficial effect Effects 0.000 description 2
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- 239000002243 precursor Substances 0.000 description 2
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 239000011882 ultra-fine particle Substances 0.000 description 2
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
Abstract
The invention relates to an atomization device and a thin film deposition system. The main body is provided with a main cavity, and the main body is also provided with an air inlet joint and an air outlet joint which are communicated with the main cavity. The gas inlet joint is used for being communicated with the gas carrying pipe, and the gas outlet joint is used for being communicated with the gas inlet of the reaction chamber. The air outlet joint is communicated with the reaction chamber through a butt joint pipe. The oscillation module is provided with a sample inlet and a sample outlet, the sample inlet is communicated with the sample tube, and the sample outlet is communicated with the main cavity. The oscillating module is used for oscillating reaction liquid entering the oscillating module so as to atomize the reaction liquid to form aerosol. The light and heat module sets up on the wall of main cavity room, and the light and heat module is used for heating the intensification to the main cavity room and handles to make and form aerosol through vibrating the reaction liquid atomization that the module enters into the main cavity room, can improve the preparation efficiency of film, operating temperature can obtain accurate control and fluctuation range less, is heated evenly.
Description
Technical Field
The invention relates to the technical field of semiconductor chip preparation, in particular to an atomization device and a thin film deposition system.
Background
The existing coating methods mainly include two major types, namely Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD), and each type of coating method is subdivided into a plurality of small types of coating methods due to factors such as material characteristics and the like. At present, CVD is one of the most widely used thin film deposition methods in the field of semiconductor chip fabrication. The technology is mainly a method for generating a film by utilizing one or more gas-phase compounds or simple substances containing film elements to perform chemical reaction on the surface of a substrate. The CVD method includes a CVD conventional deposition method and a CVD pyrolytic deposition method. The precursor of the CVD conventional deposition method is a full-gas phase substance, is input into a reaction zone of a reaction device to be heated or is excited by other physical fields to generate chemical reaction, and is deposited on the surface of a substrate. In addition, the conventional CVD pyrolytic deposition method can also be used for preparing a thin film on a substrate, wherein a precursor substance is generally prepared into a mixed solution and then placed in an atomization source, the atomization source atomizes into aerosol, then the liquid aerosol is input into a reaction chamber and then undergoes a pyrolytic reaction in a reaction region, and then a film is coated on the surface of the substrate.
CVD pyrolytic deposition requires that the reactants introduced into the reaction chamber be gaseous, but currently many reactants (such as TEOS tetraethylorthosilicate) are typically stored in liquid form, which requires that the liquid reactants be vaporized before entering the reaction chamber. According to the Boyle's law P1V1= P2V2, the atmospheric pressure is reduced by increasing the conveying pipe diameter in the atomizer, and the auxiliary resistance wire is heated, so that under the combined action of temperature and atmospheric pressure, reactants in the reaction chamber are changed from liquid state to gaseous state, and then conveyed to the reaction chamber through inert carrier gas. However, the traditional CVD pyrolytic deposition method mainly adopts resistance wires for heating and atomizing, so that the temperature rise rate of the resistance wire heater is slow, the heat engine time is long, and the THP is influenced. Some liquids cannot be completely atomized, which affects the stability of the manufacturing process; the temperature can not be controlled accurately, the fluctuation range is large, and the heating is uneven.
Disclosure of Invention
In view of the above, it is necessary to overcome the defects of the prior art and to provide an atomization device and a thin film deposition system, which can improve the efficiency of thin film production, can precisely control the working temperature, have a small fluctuation range, and can be uniformly heated.
The technical scheme is as follows: an atomization device, comprising: the main body is provided with a main chamber, and is also provided with an air inlet joint and an air outlet joint which are communicated with the main chamber, wherein the air inlet joint is communicated with a carrier gas pipe, and the air outlet joint is communicated with an air inlet of the reaction chamber; the oscillation module is provided with a sample inlet and a sample outlet, the sample inlet is communicated with a sample tube, the sample outlet is communicated with the main chamber, and the oscillation module is used for oscillating reaction liquid entering the oscillation module so as to atomize the reaction liquid to form aerosol; and the photo-thermal module is arranged on the wall of the main cavity, and the photo-thermal module is used for heating the main cavity to heat and increase the temperature, so that the vibration module enters into the atomized reaction liquid in the main cavity to form aerosol.
When the atomization device is used, the air inlet connector is communicated with the carrier gas pipe, the air outlet connector is communicated with the air inlet of the reaction chamber, the sample inlet of the oscillation module is communicated with the sample pipe, reaction liquid is added into the oscillation module through the sample pipe, the oscillation module breaks up molecular bonds of the reaction liquid through oscillation action, aerosol is formed through first heavy atomization treatment, and then the aerosol enters the main chamber; next, heat the intensification through light and heat module group to main cavity room and handle, under the heating intensification effect of light and heat module, on the one hand can carry out the not atomizing reaction liquid of vibration module second atomizing and form aerosol, on the other hand can also avoid the aerosol to condense, in addition, for the heating methods of traditional resistance wire, light and heat module adopts radiant heat, hot convection and three kinds of modes of heat-conduction heat main cavity room, the rate of rise is fast, temperature control is sensitive and the homogeneity is good, work efficiency is higher. The carrier gas introduced into the main chamber pushes the aerosol in the main chamber to enter the reaction chamber together with the aerosol. Therefore, the preparation efficiency of the film can be improved, the working temperature can be accurately controlled, the fluctuation range is small, and the heating is uniform.
In one embodiment, the oscillating module is disposed on the main body; the sample inlet is located outside the main cavity, and the sample outlet is located inside the main cavity.
In one embodiment, the oscillation frequency of the oscillation module is f, and f is 1.5MHZ to 2.0MHZ.
In one embodiment, the oscillation module is an ultrasonic oscillation module, an electromagnetic oscillation module or a microwave oscillation module.
In one embodiment, the oscillating module includes a housing, and an oscillating member and a heat conducting member disposed in the housing; the introduction port with the appearance mouth set up respectively in the relative both ends of casing, the heat-conducting piece for the vibrations piece is closer to more than in the appearance mouth.
In one embodiment, the heat conducting member is a hot water pipe, a hot gas flow pipe or an electric heating rod; the heat-conducting member is spirally arranged inside the housing.
In one embodiment, the sample outlet is provided with a spray head, and the spray surface of the spray head is provided with a plurality of spray holes.
In one embodiment, the number of the oscillation modules is two or more, and the two or more oscillation modules are arranged on the main body at intervals; the more than two oscillating modules are used for being communicated with the more than two sample tubes in a one-to-one correspondence mode.
In one embodiment, the photo-thermal module includes a plurality of light sources, and the plurality of light sources are sequentially disposed at intervals along a direction from the air inlet joint to the air outlet joint.
In one embodiment, the light source is a tungsten lamp, a laser lamp, an infrared lamp, or an ultraviolet lamp.
In one embodiment, the photo-thermal module further comprises a mounting seat; the mounting seat is arranged on the wall of the main chamber, and the plurality of luminous sources are detachably arranged on the mounting seat.
In one embodiment, the atomization device further comprises a temperature sensor and a controller; the temperature sensor is arranged on the main body and used for acquiring temperature information in the main cavity, and the temperature sensor is electrically connected with the controller; the controller is electrically connected with the mounting seat and used for controlling the light source to work according to the temperature information.
In one embodiment, the atomization device further comprises a filter screen disposed inside the main chamber; the filter screen is the heat conductor, the filter screen set up in the inside of main cavity is close to in the one end of joint of giving vent to anger.
In one embodiment, the filter screen is a heating wire, or the filter screen is in heat-conducting contact with a heat-conducting device located outside the main body.
In one embodiment, the filter screen is provided with filter holes, and the aperture of each filter hole is 0.1mm-15mm.
In one embodiment, the number of the filter screens is two or more, and the two or more filter screens are arranged at intervals in sequence along the direction from the air inlet joint to the air outlet joint.
An atomization device, comprising: the main body is provided with a main cavity, the main body is also provided with an air inlet joint and an air outlet joint which are communicated with the main cavity, the air inlet joint is communicated with a carrier gas pipe, the air outlet joint is communicated with an air inlet of the reaction cavity, and the main cavity is also communicated with a sample tube; the photothermal module is arranged on the wall of the main chamber and used for heating the main chamber to ensure that the reaction liquid entering the main chamber is atomized to form aerosol; the filter screen, the filter screen set up in inside the main cavity, the filter screen set up in the inside of main cavity is close to in the one end of joint of giving vent to anger, the filter screen is the heat conductor.
Foretell atomizing device, when using, connect air inlet and carrier pipe intercommunication, give vent to anger and connect and reaction chamber's air inlet intercommunication, main cavity still is linked together with the sample cell, reaction liquid adds into main cavity through the sample cell in, heat the main cavity heating and heat up the processing through light and heat module, under the heating intensification effect of light and heat module, can make and enter into the reaction liquid atomizing formation aerosol in the main cavity, for the heating methods of traditional resistance wire, light and heat module adopts radiant heat, three kinds of modes of thermal convection and heat-conduction heat main cavity, the rate of heating up is fast, temperature control is sensitive and the homogeneity is good, work efficiency is higher. The carrier gas introduced into the main cavity pushes the aerosol in the main cavity to enter the reaction cavity together with the aerosol. In the process that the aerosol flows through the filter screen, on one hand, the filter screen only allows the aerosol to pass through, so that residual reaction liquid drops are prevented from passing through, and the aerosol passes through the filter screen and then enters the reaction chamber through the air outlet joint; on the other hand, the filter screen atomizes the residual reaction liquid drops into aerosol through self heat, so that the atomization effect of the reaction liquid is better. Therefore, the preparation efficiency of the film can be improved, the working temperature can be accurately controlled, the fluctuation range is small, and the heating is uniform.
The utility model provides a film deposition system, film deposition system include atomizing device, film deposition system still includes carrier gas pipe, sample cell and reaction chamber, carrier gas pipe with air inlet joint is linked together, the sample cell with the introduction port or the main cavity is linked together, give vent to anger the joint with reaction chamber is linked together.
The thin film deposition system comprises the atomization device, so that the technical effect of the thin film deposition system is brought by the atomization device, and the beneficial effects of the thin film deposition system are the same as those of the atomization device, and are not described herein again.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification.
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an atomizing device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an oscillation module of the atomization device according to an embodiment of the disclosure;
fig. 3 is a schematic structural diagram of a spraying surface of an oscillating module of an atomizing device according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a filter screen of an atomizing device according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a thin film deposition system according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of an atomizing device according to another embodiment of the present invention.
10. A main body; 11. a main chamber; 12. an air inlet joint; 13. an air outlet joint; 14. mounting holes; 15. an end cap; 20. a vibration module; 201. a sample inlet; 202. a sample outlet; 21. a housing; 22. a vibrating member; 23. a heat conductive member; 24. a spray head; 241. a spraying surface; 242. spraying a hole; 25. a control panel; 30. a photo-thermal module; 31. a light emitting source; 41. a carrier gas pipe; 42. a sample tube; 50. butt-joint pipes; 60. a temperature sensor; 70. a controller; 80. a filter screen; 81. filtering holes; 90. a flow control valve.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will recognize without departing from the spirit and scope of the present invention.
Referring to fig. 1 and 5, fig. 1 illustrates a schematic structural diagram of an atomizing device according to an embodiment of the present invention, and fig. 5 illustrates a schematic structural diagram of a thin film deposition system according to an embodiment of the present invention. An embodiment of the present invention provides an atomization apparatus, including: a main body 10, a vibration module 20 and a photo-thermal module 30. The main body 10 is provided with a main chamber 11, and the main body 10 is further provided with an air inlet joint 12 and an air outlet joint 13 which are communicated with the main chamber 11. The gas inlet connector 12 is used for communicating with the carrier gas pipe 41, and the gas outlet connector 13 is used for communicating with the gas inlet of the reaction chamber (not shown in the figure). Specifically, the outlet connector 13 communicates with the reaction chamber through the interface tube 50. The oscillation module 20 is provided with a sample inlet 201 and a sample outlet 202, the sample inlet 201 is used for being communicated with the sample tube 42, and the sample outlet 202 is used for being communicated with the main chamber 11. The oscillation module 20 is used for oscillating the reaction liquid entering the oscillation module 20 so as to atomize the reaction liquid to form aerosol. The light and heat module 30 sets up on the wall of main cavity 11, and the light and heat module 30 is used for heating the temperature rise to main cavity 11 and handles to make and form aerosol through shaking the atomizing formation of the reaction liquid that the module 20 entered into in the main cavity 11.
When the atomizing device is used, the air inlet connector 12 is communicated with the carrier gas pipe 41, the air outlet connector 13 is communicated with the air inlet of the reaction chamber, the sample inlet 201 of the oscillation module 20 is communicated with the sample pipe 42, the reaction liquid is added into the oscillation module 20 through the sample pipe 42, the oscillation module 20 breaks up molecular bonds of the reaction liquid through oscillation action, aerosol is formed through first heavy atomization treatment, and then the aerosol enters the main chamber 11; then heat the intensification processing to main cavity 11 through light and heat module 30, under the heating intensification effect of light and heat module 30, on the one hand can carry out second heavy atomizing processing with the not atomizing reaction liquid of vibration module 20 and form aerosol, on the other hand can also avoid aerosol to condense, in addition, for the heating methods of traditional resistance wire, light and heat module 30 adopts radiant heat, hot convection and three kinds of modes of heat-conduction heat main cavity 11, the rate of rise is fast, temperature control is sensitive and the homogeneity is good, work efficiency is higher. The carrier gas introduced into the main chamber 11 pushes the aerosol in the main chamber 11 into the reaction chamber together with the aerosol. Therefore, the preparation efficiency of the film can be improved, the working temperature can be accurately controlled, the fluctuation range is small, and the heating is uniform.
The carrier gas introduced into the carrier gas pipe 41 is an inert gas which does not chemically react with the aerosol, and may be, for example, nitrogen gas, helium gas, nitrogen dioxide, and the like, which is not limited herein. In addition, the reaction solution is, for example, a reactant such as TEOS, and is set according to actual requirements, and is not limited herein.
Referring to fig. 1 and fig. 2, fig. 2 is a schematic structural diagram illustrating an oscillating module 20 of an atomizing device according to an embodiment of the present invention. Further, the oscillation module 20 is disposed on the main body 10. The sample inlet 201 is located outside the main chamber 11, and the sample outlet 202 is located inside the main chamber 11. Specifically, the main body 10 is provided with a mounting hole 14 penetrating through the inside of the chamber, the oscillation module 20 is disposed at the mounting hole 14, the sample inlet 201 of the oscillation module 20 is located outside the main chamber 11, and the sample outlet 202 is located inside the main chamber 11.
It should be noted that the oscillation module 20 is not limited to be disposed on the main body 10, and as some optional solutions, the oscillation module 20 may also be disposed outside the main body 10, that is, the sample outlet 202 of the oscillation module 20 may be communicated with the main chamber 11 through a communication pipe. In addition, the oscillation module 20 may also be disposed inside the main body 10, that is, the sample inlet 201 of the oscillation module 20 is communicated with a communication pipe, and the communication pipe penetrates through the wall of the main body 10 and extends to the outside of the main body 10 to be communicated with the sample tube 42.
In one embodiment, the oscillating module 20 has an oscillating frequency f ranging from 1.5MHz to 2.0MHz. Thus, at the oscillation frequency, the oscillation module 20 can better atomize the reaction liquid flowing through the inside thereof to form ultrafine particles. Of course, the oscillation frequency of the oscillation module 20 is not limited to 1.5MHZ to 2.0MHZ, and may be in other ranges, which are not limited herein.
In one embodiment, the oscillation module 20 is an ultrasonic oscillation module 20, an electromagnetic oscillation module 20, or a microwave oscillation module 20. It should be noted that the oscillation module 20 may also be other types of oscillation modules 20 as long as the oscillation frequency f can meet the preset requirement, so that the reaction solution is atomized to form the ultrafine particles.
Referring to fig. 1 and fig. 2, in an embodiment, the oscillating module 20 includes a housing 21, and a vibrating element 22 and a heat conducting element 23 disposed in the housing 21. The sample inlet 201 and the sample outlet 202 are respectively disposed at two opposite ends of the housing 21, and the heat conduction member 23 is closer to the sample outlet 202 than the vibration member 22. Thus, the high frequency vibration of the vibration member 22 can atomize the reaction solution to form aerosol, and then the heat energy heats the atomized aerosol and the un-atomized reaction solution under the heat conduction of the heat conduction member 23, so as to accelerate the brownian motion of the particles. In addition, the oscillating module 20 further includes a control board 25 disposed outside the housing 21, and the control board 25 is electrically connected to the oscillating element 22 for controlling the operation of the oscillating element 22.
In one embodiment, the heat conducting member 23 is a hot water pipe, a hot gas flow pipe, or an electric bar. In this way, when the heat-conducting material 23 comes into contact with the aerosol in the housing 21, the heat of the heat-conducting material itself can be transmitted to the aerosol in the housing 21 and the reaction liquid that has not been atomized.
In a specific embodiment, when the heat conducting member 23 is a hot water pipe or a hot air flow pipe, and both ends of the hot water pipe or the hot air flow pipe extend into the interior of the housing 21, the two ends of the hot water pipe or the hot air flow pipe extend out of the housing 21 through the housing 21 and are communicated with a hot water supply source or a hot air flow supply source. Thus, the hot water supply source continuously provides circulating hot water for the hot water pipe, and the heat of the hot water pipe is ensured to be sufficient. Likewise, the hot gas flow supply source continuously provides hot gas flow to the hot gas flow pipe, and the heat quantity of the hot gas flow pipe is ensured to be enough.
Further, the heat-conducting member 23 is spirally arranged inside the case 21. In this way, the heat conducting material 23 is spirally disposed inside the housing 21 so as to be in contact with the aerosol and the reaction liquid as much as possible, but the heat conducting material 23 is not limited to being spirally disposed inside the housing 21, and may be disposed inside the housing 21 in other manners, which are not limited herein, and may be disposed according to actual requirements. In addition, as an alternative, the heat conducting member 23 may also be disposed outside the housing 21, and the heat conducting member 23 conducts heat to the housing 21, and the heat is transferred to the aerosol and the unreacted atomized reaction liquid in the housing 21 through the housing 21. When the heat conducting member 23 is disposed outside the casing 21, the heat insulating layer wrapped around the heat conducting member 23 is disposed outside the casing 21, and the heat insulating layer prevents the heat of the heat conducting member 23 from being transferred to the environment, so that the heat of the heat conducting member 23 is transferred to the aerosol and the un-atomized reaction liquid through the casing 21 as much as possible.
Referring to fig. 1 to 3, fig. 3 is a schematic structural diagram illustrating a spraying surface 241 of an oscillation module 20 of an atomization device according to an embodiment of the present invention. In one embodiment, sample outlet 202 is equipped with a nozzle 24, and a plurality of nozzle holes 242 are formed on a spraying surface 241 of nozzle 24. Specifically, a plurality of injection holes 242 are arranged in an array on injection surface 241. In this manner, the aerosol generated by atomization in the housing 21 is ejected to the outside through the ejection holes 242 to the inside of the main chamber 11, so that the aerosol is arranged as uniformly as possible in the inside of the main chamber 11. In addition, after the reaction liquid not atomized by the vibration module is injected into the main chamber 11, the reaction liquid enters a space with a relatively smaller volume than atmospheric pressure, and is gasified to form aerosol under the heating and temperature rising effect of the photo-thermal module 30.
In order to avoid chemical reaction with the aerosol, the heat conducting member 23, the nozzle 24 and the housing 21 are made of a material that does not react with the aerosol, such as glass, ceramic, stainless steel, or silicon carbide. It is of course also possible to provide inert surface layers on the surfaces of the heat-conducting element 23, the spray head 24 and the housing 21, which inert surface layers avoid chemical reactions with the aerosol.
Referring to fig. 1 and 5 again, in one embodiment, there are more than two oscillating modules 20, and the more than two oscillating modules 20 are disposed on the main body 10 at intervals. The two or more oscillating modules 20 are used for being in one-to-one correspondence communication with the two or more sample tubes 42. So, when the reactant that need let in to main cavity 11 is more than two, vibrate module 20 and correspondingly be more than two, vibrate module 20 more than two and vibrate the atomization processing with the reaction liquid that two above sample tubes 42 let in one-to-one to inside letting in main cavity 11 with more than two kinds of aerosol. Specifically, the main body 10 is, for example, a cylindrical body, and two or more oscillation modules 20 are sequentially arranged at intervals along the direction from the air inlet joint 12 to the air outlet joint 13, so that the aerosol can be uniformly arranged in the main chamber 11. Of course, the main body 10 may have other shapes, and is not limited thereto and may be provided according to actual conditions.
In addition, it should be noted that the specific number of the oscillation modules 20 is not limited, and may be, for example, one, two, three or other numbers, and the number is set according to actual requirements. In addition, when the number of the oscillation modules 20 is two or more, the same reaction liquid can be introduced into the main chamber 11 through the two or more oscillation modules 20.
Referring to fig. 1, in one embodiment, the photo-thermal module 30 includes a plurality of light sources 31. Alternatively, the light emitting source 31 is a tungsten lamp, a laser lamp, an infrared lamp, or an ultraviolet lamp. The plurality of light emitting sources 31 are sequentially arranged at intervals along the direction from the inlet joint 12 to the outlet joint 13. So, when doing the synchronous work of individual light emitting source 31, can realize that each regional programming rate in main cavity 11 is fast, temperature control is sensitive and homogeneity is good, and work efficiency is higher.
In this embodiment, the light source 31 is specifically a tungsten lamp, and the light source of the tungsten lamp does not chemically react with the aerosol, that is, the deposition reaction of the aerosol after entering the reaction chamber is not affected. The specific shape of the tungsten lamp is not limited, and may be, for example, a cylindrical shape, a spherical shape, an ellipsoidal shape, or the like. In addition, the number of the tungsten lamps disposed inside the main chamber 11 is determined according to the size of the main chamber 11 and the required temperature, and when the number of the tungsten lamps is larger, the power required for releasing the same heat is relatively lower, and the service life of the tungsten lamp is longer. As an example, the actual operating power of the tungsten lamp is 5% -25% of its rated power, specifically 9% of its rated power, so that the number of tungsten lamps can be in a flexible range. Of course, the main chamber 11 may be heated up by the light source 31, when the liquid aerosol property is not affected by the laser lamp, the infrared lamp, the ultraviolet lamp, or the other type of light source 31.
Further, the photo-thermal module 30 further includes a mounting base (not shown). The mounting seat is arranged on the wall of the main chamber 11, and the plurality of light emitting sources 31 are detachably arranged on the mounting seat. Thus, the light emitting sources 31 are all mounted on the mounting seat, so that the photo-thermal module 30 can be integrally mounted in the main cavity 11, and the mounting operation is convenient and fast. In addition, when one of the light emitting sources 31 is out of order, the out-of-order light emitting source 31 is removed from the mounting seat for maintenance, and the entire photothermal module 30 does not need to be taken out of the main chamber 11.
Specifically, when the light emitting source 31 needs to be replaced, the end cover 15 on one side is opened, the light emitting source 31 is detached from the mounting base, and then replacement or maintenance processing is performed, and after the replacement is completed, the end cover 15 is closed. To facilitate opening of the end cap 15, the end cap 15 is provided with a fitting such as a handle or knob. In addition, in order to ensure the sealing performance of the main chamber 11, a sealing ring is wound around the outer edge of the end cover 15, or a sealing ring is arranged at the end opening of the main chamber 11, and the end cover 15 is in sealing fit with the end opening of the main chamber 11 through the sealing ring after being closed, so that the sealing performance can be ensured. It should be noted that the main body 10 may have other open and close configurations, and the present invention is not limited thereto, as long as the photothermal module 30 can be loaded into the main chamber 11 and the maintenance treatment can be performed on the main chamber 11 after the main body 10 is opened, and the main body 10 can be closed to have better air tightness.
In addition, in order to heat and raise the temperature of the aerosol in the main chamber 11 better and to make the oscillation module 20 have no time to atomize the reaction liquid, the mounting seat is located at a position opposite to the spraying surface 241, specifically, the mounting seat is disposed on the bottom wall of the main chamber 11, and the oscillation module 20 is disposed on the top wall of the main chamber 11.
Referring to fig. 1 and 5 again, in one embodiment, the atomizer further includes a temperature sensor 60 and a controller 70. The temperature sensor 60 is disposed on the main body 10 for acquiring temperature information in the main chamber 11, and the temperature sensor 60 is electrically connected to the controller 70. The controller 70 is electrically connected to the mounting base and is configured to control the light source 31 to operate according to the temperature information. So, can acquire the temperature information in the main cavity 11 through temperature sensor 60, and feed back the temperature information in the main cavity 11 to controller 70, controller 70 controls each light emitting source 31 work correspondingly according to the temperature information in the main cavity 11, increase operating power or reduce operating power, in order to realize the temperature control in the main cavity 11 at preset range, be even in the gaseous atmosphere temperature in the main cavity 11 of control, thereby realize the complete gasification to different liquid reactants, thereby reach the second and heavily atomize the effect.
Referring to fig. 1 and 4, fig. 4 is a schematic structural diagram of a filter screen 80 of an atomizing device according to an embodiment of the present invention. In one embodiment, the atomising device further comprises a filter screen 80 disposed inside the main chamber 11. The filter 80 is a heat conductor, and the filter 80 is disposed inside the main chamber 11 near one end of the air outlet joint 13. Thus, the filter screen 80 has at least the following advantages: on one hand, the filter screen 80 only allows the aerosol to pass through, so as to avoid the residual reaction liquid droplets from passing through, and the aerosol enters the reaction chamber through the air outlet joint 13 after passing through the filter screen 80; on the other hand, the filter screen 80 is a heat conductor, and the filter screen 80 can absorb the heat of the photo-thermal module 30 or atomize the residual reaction liquid droplets through the heat of the filter screen 80 to form proper aerosol, so that the atomization effect of the reaction liquid is better.
Specifically, the shape of the filter screen 80 is adapted to the shape of the inner wall of the main chamber 11. For example, when the main body 10 is a cylinder, the filter 80 is, for example, circular; when the main body 10 is a rectangular parallelepiped, the filter 80 has a square shape, for example. So that the edge of the filter screen 80 can closely fit the inner wall of the main chamber 11.
Further, the filter 80 is, for example, a heating wire, or the filter 80 is in heat conductive contact with a heat conductive device located outside the main body 10. In this way, the filter screen 80 may be powered on to increase its temperature, or may be in thermal contact with a heat conducting device located outside the main body 10.
It should be noted that, in order to avoid the chemical reaction between the filter screen 80 and the aerosol, the filter screen 80 is specifically made of a material that does not react with the aerosol, such as glass, ceramic, stainless steel, or silicon carbide. Of course, the filter screen 80 may also be made of a metal material, and an inert surface layer is disposed on the surface of the filter screen 80, and the inert surface layer can prevent chemical reaction with the aerosol.
In one embodiment, the filtering net 80 is provided with filtering holes 81, and the aperture of the filtering holes 81 is 0.1mm-15mm. The specific shape of the filtering holes 81 may be, for example, a circle, an ellipse, a square, a rhombus, a pentagon, a hexagon, etc., and is not limited herein, and may be set according to actual requirements.
In one embodiment, there are two or more filter screens 80, and the two or more filter screens 80 are sequentially spaced along the direction from the air inlet joint 12 to the air outlet joint 13. Thus, when more than two filter screens 80 are provided, a better filtering effect can be achieved. It should be noted that the specific number of the filter screens 80 is not limited, and may be, for example, one, two, three, four or other numbers, and the number is set according to actual requirements.
Referring to fig. 6, fig. 6 is a schematic structural diagram of an atomization device according to another embodiment. The atomizer shown in fig. 6 is the atomizer shown in fig. 1 and 5, and the oscillating module 20 is omitted. In one embodiment, an atomization apparatus includes a main body 10, a photo-thermal module 30, and a filter 80. The main body 10 is provided with a main chamber 11, and the main body 10 is further provided with an air inlet joint 12 and an air outlet joint 13 which are communicated with the main chamber 11. The gas inlet connector 12 is used for communicating with the carrier gas pipe 41, the gas outlet connector 13 is used for communicating with the gas inlet of the reaction chamber, and the main chamber 11 is also used for communicating with the sample pipe 42. The photo-thermal module 30 is arranged on the wall of the main chamber 11, and the photo-thermal module 30 is used for heating the main chamber 11 to atomize the reaction liquid entering the main chamber 11 to form aerosol; the filter screen 80 is disposed inside the main chamber 11, the filter screen 80 is disposed inside the main chamber 11 and close to one end of the air outlet joint 13, and the filter screen 80 is a heat conductor.
Foretell atomizing device, when using, connect 12 and carrier gas pipe 41 intercommunication with admitting air, the air inlet intercommunication of joint 13 and reaction chamber gives vent to anger, main cavity 11 still is linked together with sample cell 42, reaction liquid adds into main cavity 11 through sample cell 42 in, heat the intensification processing to main cavity 11 through light and heat module 30, under the heating intensification effect of light and heat module 30, can make the reaction liquid atomizing that enters into in main cavity 11 form aerosol, for the heating methods of traditional resistance wire, light and heat module 30 adopts radiant heat, hot convection and three kinds of modes of heat-conduction heat main cavity 11, the rate of heating is fast, temperature control is sensitive and the homogeneity is good, work efficiency is higher. The carrier gas introduced into the main chamber 11 pushes the aerosol in the main chamber 11 into the interior of the reaction chamber together with the aerosol. In the process of aerosol flowing through the filter screen 80, on one hand, the filter screen 80 only allows the aerosol to pass through to avoid residual reaction liquid droplets, and the aerosol passes through the filter screen 80 and then enters the reaction chamber through the air outlet joint 13; on the other hand, the filter screen 80 atomizes the residual droplets of the reaction solution by its own heat to obtain an aerosol, so that the atomization effect of the reaction solution is better. Therefore, the preparation efficiency of the film can be improved, the working temperature can be accurately controlled, the fluctuation range is small, and the heating is uniform.
Referring to fig. 5 again, in an embodiment, a thin film deposition system includes the atomizing device of any one of the above embodiments, the thin film deposition system further includes a carrier gas tube 41, a sample tube 42 and a reaction chamber, the carrier gas tube 41 is communicated with the gas inlet connector 12, the sample tube 42 is communicated with the sample inlet 201 or the main chamber 11, and the gas outlet connector 13 is communicated with the reaction chamber.
The thin film deposition system comprises the atomization device, so that the technical effect of the thin film deposition system is brought by the atomization device, and the beneficial effects of the thin film deposition system are the same as those of the atomization device, and are not described herein again.
Further, the gas outlet joint 13 is communicated with the reaction chamber through the butt joint pipe 50. More specifically, the flow control valves 90 are provided in the carrier gas pipe 41, the sample pipe 42, and the interface pipe 50, and the flow rate is controlled by adjusting the opening of the flow control valves 90.
It should be noted that the "air inlet joint 12 and the air outlet joint 13" may be "a part of the main body 10", that is, the "air inlet joint 12 and the air outlet joint 13" and "the other part of the main body 10" are integrally formed; or a separate member separable from the rest of the main body 10, i.e., the air inlet connector 12 and the air outlet connector 13, may be manufactured separately and combined with the rest of the main body 10 into a whole.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show several embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the second feature or the first and second features may be indirectly contacting each other through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are for purposes of illustration only and do not denote a single embodiment.
Claims (18)
1. An atomizing device, characterized in that the atomizing device comprises:
the main body is provided with a main chamber, and is also provided with an air inlet joint and an air outlet joint which are communicated with the main chamber, wherein the air inlet joint is communicated with a carrier gas pipe, and the air outlet joint is communicated with an air inlet of the reaction chamber;
the oscillation module is provided with a sample inlet and a sample outlet, the sample inlet is communicated with a sample tube, the sample outlet is communicated with the main chamber, and the oscillation module is used for oscillating reaction liquid entering the oscillation module so as to atomize the reaction liquid to form aerosol; and
the light and heat module, the light and heat module set up in on the wall of main cavity room, the light and heat module is used for right the main cavity room heats the intensification and handles, so that pass through it enters into to vibrate the module the atomizing of reaction liquid in the main cavity room forms aerosol.
2. The atomizing device of claim 1, wherein the oscillating module is disposed on the body; the sample inlet is located outside the main cavity, and the sample outlet is located inside the main cavity.
3. The atomizing device of claim 1, wherein the oscillating module has an oscillating frequency f that is 1.5MHZ to 2.0MHZ.
4. The atomizing device of claim 1, wherein the oscillating module is an ultrasonic oscillating module, an electromagnetic oscillating module, or a microwave oscillating module.
5. The atomizing device according to claim 1, wherein the oscillating module includes a housing, and an oscillating member and a heat conducting member disposed in the housing; the sample inlet with the appearance mouth sets up respectively in the relative both ends of casing, heat-conducting piece for the vibrations piece is closer to more in the appearance mouth.
6. The atomizing device of claim 5, wherein the heat-conducting member is a hot water pipe, a hot gas flow pipe, or an electric rod; the heat conducting member is spirally disposed inside the case.
7. The atomizing device of claim 5, wherein the sample outlet is provided with a nozzle, and the spray surface of the nozzle is provided with a plurality of spray holes.
8. The atomizing device according to claim 1, wherein the number of the oscillating modules is two or more, and the two or more oscillating modules are disposed on the main body at intervals; the more than two oscillating modules are used for being communicated with the more than two sample tubes in a one-to-one correspondence mode.
9. The atomizing device of claim 1, wherein the photo-thermal module includes a plurality of light sources, and the plurality of light sources are sequentially spaced along a direction from the inlet joint to the outlet joint.
10. The atomizing device of claim 9, wherein the light-emitting source is a tungsten lamp, a laser lamp, an infrared lamp, or an ultraviolet lamp.
11. The atomizing device of claim 9, wherein the photothermal module further comprises a mount; the mounting seat is arranged on the wall of the main cavity, and the plurality of luminous sources are detachably arranged on the mounting seat.
12. The atomizing device of claim 11, further comprising a temperature sensor and a controller; the temperature sensor is arranged on the main body and used for acquiring temperature information in the main cavity, and the temperature sensor is electrically connected with the controller; the controller is electrically connected with the mounting seat and used for controlling the light source to work according to the temperature information.
13. The atomizing device of claim 1, further comprising a filter screen disposed inside the main chamber; the filter screen is the heat conductor, the filter screen set up in the inside of main cavity is close to in the one end of joint of giving vent to anger.
14. The atomizing device of claim 13, wherein the filter screen is a heating wire, or the filter screen is in heat-conducting contact with a heat-conducting device located outside the body.
15. The atomizing device of claim 13, wherein the filter screen is provided with filter holes, and the aperture of the filter holes is 0.1mm-15mm.
16. The atomizing device according to claim 13, wherein the number of the filter screens is two or more, and the two or more filter screens are sequentially disposed at intervals in a direction from the air inlet joint to the air outlet joint.
17. An atomizing device, characterized in that the atomizing device comprises:
the main body is provided with a main cavity, the main body is also provided with an air inlet joint and an air outlet joint which are communicated with the main cavity, the air inlet joint is communicated with a carrier gas pipe, the air outlet joint is communicated with an air inlet of the reaction cavity, and the main cavity is also communicated with a sample tube;
the photothermal module is arranged on the wall of the main chamber and used for heating the main chamber to ensure that the reaction liquid entering the main chamber is atomized to form aerosol;
the filter screen, the filter screen set up in inside the main cavity, the filter screen set up in the inside of main cavity is close to in the one end that the joint of giving vent to anger, the filter screen is the heat conductor.
18. A thin film deposition system, comprising the atomizing device according to any one of claims 1 to 17, further comprising a gas carrier tube, a sample tube and a reaction chamber, wherein the gas carrier tube is communicated with the gas inlet connector, the sample tube is communicated with the sample inlet or the main chamber, and the gas outlet connector is communicated with the reaction chamber.
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