CN115608679B - Manipulator for silicon wafer cleaning machine - Google Patents
Manipulator for silicon wafer cleaning machine Download PDFInfo
- Publication number
- CN115608679B CN115608679B CN202211003151.3A CN202211003151A CN115608679B CN 115608679 B CN115608679 B CN 115608679B CN 202211003151 A CN202211003151 A CN 202211003151A CN 115608679 B CN115608679 B CN 115608679B
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- China
- Prior art keywords
- fixedly connected
- frame
- silicon wafer
- cleaning
- sliding
- Prior art date
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 106
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 103
- 239000010703 silicon Substances 0.000 title claims abstract description 103
- 238000004140 cleaning Methods 0.000 title claims abstract description 98
- 230000000712 assembly Effects 0.000 claims abstract description 5
- 238000000429 assembly Methods 0.000 claims abstract description 5
- 238000001514 detection method Methods 0.000 claims description 24
- 238000005406 washing Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 67
- 238000000034 method Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a manipulator for a silicon wafer cleaning machine, belonging to the technical field of silicon wafer cleaning, which comprises a manipulator body, wherein a cleaning frame is arranged at the bottom of the manipulator body, the cleaning frame is C-shaped, a limiting frame is arranged in the cleaning frame, and two arc clamping rods which are symmetrically arranged are rotationally connected to the limiting frame; the rotating shaft of the arc clamping rod is sleeved with a torsion spring for resetting the arc clamping rod; the side edges of the arc clamping rods are respectively provided with a clamping assembly, the two clamping assemblies are symmetrically arranged in a circumference manner, the cleaning frame is also provided with a driving assembly, and the driving assembly is used for driving the limiting frame to clamp the silicon wafer and then driving the limiting frame and the silicon wafer to move; the invention can make the silicon wafer move irregularly in the cleaning tank to accelerate the cleaning of the silicon wafer, and can clean the silicon wafer more thoroughly, and the invention can design the number of the limiting frames according to the actual demand, can clean the silicon wafer in batches, and can greatly improve the cleaning efficiency of the silicon wafer.
Description
Technical Field
The invention relates to the technical field of silicon wafer cleaning, in particular to a manipulator for a silicon wafer cleaning machine.
Background
After the chemical mechanical polishing of the silicon wafer is completed, a layer of active monocrystalline silicon atoms is formed on the surface of the silicon wafer, and the active silicon atoms have an unpaired electron, namely an unsaturated bond (dangling bond), and can adsorb foreign impurities such as positive charges, negative charges and the like. Therefore, an external groove type cleaning machine is used for removing impurity pollution, and the active monocrystalline silicon atom property of the surface of the silicon wafer is changed.
The prior art generally adopts placing the silicon chip into the silicon chip washs the basket of flowers in placing the basket of flowers into the washing tank and washs through placing that sprays, because the silicon chip is less at the interval in the basket of flowers, shower water can't accomplish timely spraying to the silicon chip on, so can lead to needing to carry out long-time spraying, and wash the basket of flowers and can only carry out the washing of small batch, the cleaning efficiency is lower, unsuitable batch production.
Based on the above, the invention designs a manipulator for a silicon wafer cleaning machine, so as to solve the problems.
Disclosure of Invention
The invention aims to provide a manipulator for a silicon wafer cleaning machine, which aims to solve the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: the manipulator for the silicon wafer cleaning machine comprises a manipulator body, wherein a cleaning frame is arranged at the bottom of the manipulator body, the cleaning frame is C-shaped, a limiting frame is arranged in the cleaning frame, and two arc clamping rods which are symmetrically arranged are rotationally connected to the limiting frame; the rotating shaft of the arc clamping rod is sleeved with a torsion spring for resetting the arc clamping rod; the side of arc clamping bar all is provided with clamping assembly, two clamping assembly is circumference symmetrical arrangement, still be provided with drive assembly on the washing frame, drive assembly is used for driving spacing and silicon chip removal after the spacing clamp silicon chip of drive.
As a further aspect of the present invention, the clamping assembly includes a ratchet and a detection plate; the ratchet wheel is fixedly connected to the rotating shaft of the arc-shaped clamping rod, the ratchet wheel is meshed with a pawl, the pawl is rotationally connected with a first sliding block, an inclined slideway is arranged on the side edge of the first sliding block, and the inclined slideway is fixedly connected with the limiting frame; the first sliding block is in sliding connection with the inclined slideway, a first traction rope is fixedly connected to the first sliding block, the outer end of the first traction rope penetrates through the side wall of the limiting frame and extends to the outer side of the limiting frame to be fixedly connected with a second sliding block, and the second sliding block is in sliding connection with the limiting frame in the vertical direction; the rotating shaft of the ratchet wheel is fixedly connected with a first gear, the first gear is meshed with a first rack bar, the first rack bar is in sliding connection with the limiting frame, a first pushing block capable of driving the first rack bar to move backwards is arranged on the rear side of the first rack bar, the first pushing block is rotationally connected with a first sliding rod, and the first sliding rod is in sliding connection with the cleaning frame; the detection plate is arranged above the limiting frame and is in sliding connection with the cleaning frame, and the detection plate is fixedly connected with the first sliding rod through the fixing plate.
As a further scheme of the invention, a push plate for driving the second sliding block to move is arranged above the second sliding block, the push plate is in sliding connection with the cleaning frame, a second spring for resetting the push plate is fixedly connected to the push plate, a second traction rope is fixedly connected to the push plate, and a pull block is fixedly connected to the outer end of the second traction rope.
As a further scheme of the invention, a first sponge body is fixedly connected to the front wall of the detection plate.
As a further aspect of the present invention, the driving assembly includes a third slider and a third gear; the cleaning device comprises a cleaning frame, a first sliding block, a second sliding block, a third sliding block, a limiting frame, a first spring, a second sliding block, a first gear, a second gear, a first rack bar and a second rack bar, wherein the third sliding block is in sliding connection with the cleaning frame, the third sliding block is in rotating connection with the limiting frame, a clamping groove is formed in the third sliding block, a trapezoidal pushing block which can be inserted into the clamping groove is arranged on the side edge of the clamping groove, the fourth sliding block is in sliding connection with the trapezoidal pushing block, the first spring is fixedly connected with the fourth sliding block, the fourth sliding block is in rotating connection with the sliding plate, the sliding plate is in sliding connection with the cleaning frame, a linear driving mechanism for driving the sliding plate to linearly move is arranged on the sliding plate, a one-way bearing is fixedly connected with a rotating shaft of the fourth sliding block, a second gear is fixedly connected with the outer circumferential wall of the one-way bearing, and second rack bars which can be meshed with the second rack bars are arranged on the left side and the right sides of the second gear, and the cleaning frame are fixedly connected with the cleaning frame; the third gear is fixedly connected to the rotating shaft of the limiting frame, a third rack rod capable of being meshed with the third gear is arranged on the side edge of the third gear, and the third rack rod is fixedly connected with the limiting frame.
As a further scheme of the invention, the linear driving mechanism comprises an air cylinder, wherein the air cylinder is fixedly connected to the bottom of the cleaning frame, and the output end of the air cylinder is fixedly connected with the sliding plate.
As a further scheme of the invention, a motor is fixedly connected to the manipulator body, and an output shaft of the motor is fixedly connected with the cleaning frame.
As a further scheme of the invention, the top of the inner wall of the cleaning frame is fixedly connected with a second sponge body.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, through the arrangement of the arc clamping rods and the clamping assemblies, a worker can enable the two arc clamping rods to stably clamp the silicon wafer through simple pushing, so that the silicon wafer can be more stable when moving and cleaning in the cleaning tank, and the worker can cancel clamping of the silicon wafer by pulling the first traction rope only when taking out the silicon wafer, so that the silicon wafer can be taken and put simply; through the arrangement of the driving assembly, the silicon wafer can be irregularly moved in the cleaning tank to accelerate the cleaning of the silicon wafer, and the silicon wafer can be cleaned more thoroughly.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic view of the positional relationship between a limiting frame and an arc clamping rod according to the present invention;
FIG. 3 is a schematic view of the relationship between the position of the limit stop and the pawl according to the present invention;
FIG. 4 is an enlarged view of a portion of FIG. 3 at A;
FIG. 5 is a schematic view of the positional relationship of the pawl, first gear and first rack bar of the present invention;
FIG. 6 is a schematic rear view of the general structure of the present invention;
FIG. 7 is an enlarged view of a portion of FIG. 6 at B;
FIG. 8 is a schematic cross-sectional view of a portion of the structure of the present invention;
FIG. 9 is a schematic cross-sectional view of a trapezoidal push block, a fourth slider, a first spring and a second gear according to the present invention.
In the drawings, the list of components represented by the various numbers is as follows:
the mechanical arm comprises a mechanical arm body 1, a cleaning frame 2, a limiting frame 3, an arc clamping rod 4, a ratchet wheel 5, a detection plate 6, a pawl 7, a first sliding block 8, an inclined slideway 9, a first traction rope 10, a second sliding block 11, a first gear 12, a first rack bar 13, a first push block 14, a first sliding bar 15, a fixed plate 16, a push plate 17, a second spring 18, a second traction rope 19, a pull block 20, a first sponge 21, a third sliding block 22, a third gear 23, a clamping groove 24, a trapezoid push block 25, a fourth sliding block 26, a first spring 27, a sliding plate 28, a second gear 29, a second rack bar 30, a third rack bar 31, a cylinder 32, a motor 33, a second sponge 34 and a one-way bearing 35.
Detailed Description
Referring to fig. 1-9, the present invention provides a technical solution: the manipulator for the silicon wafer cleaning machine comprises a manipulator body 1, wherein a cleaning frame 2 is arranged at the bottom of the manipulator body 1, the cleaning frame 2 is C-shaped, a limiting frame 3 is arranged in the cleaning frame 2, and two arc clamping rods 4 which are symmetrically arranged are rotationally connected to the limiting frame 3; the rotating shaft of the arc clamping rod 4 is sleeved with a torsion spring for resetting the arc clamping rod; the side of arc clamping rod 4 all is provided with clamping components, two clamping components are circumference symmetrical arrangement, still be provided with drive assembly on the washing frame 2, drive assembly is used for driving spacing 3 to press from both sides behind the tight silicon chip of drive spacing 3 and silicon chip and removes.
The clamping assembly comprises a ratchet wheel 5 and a detection plate 6; the ratchet wheel 5 is fixedly connected to the rotating shaft of the arc-shaped clamping rod 4, the ratchet wheel 5 is meshed with a pawl 7, the pawl 7 is rotatably connected with a first sliding block 8, an inclined slideway 9 is arranged on the side edge of the first sliding block 8, and the inclined slideway 9 is fixedly connected with the limiting frame 3; the first sliding block 8 is in sliding connection with the inclined slideway 9, a first traction rope 10 is fixedly connected to the first sliding block 8, the outer end of the first traction rope 10 penetrates through the side wall of the limiting frame 3 and extends to the outer side of the limiting frame 3 to be fixedly connected with a second sliding block 11, and the second sliding block 11 is in sliding connection with the limiting frame 3 in the vertical direction; the rotating shaft of the ratchet wheel 5 is fixedly connected with a first gear 12, the first gear 12 is meshed with a first rack bar 13, the first rack bar 13 is in sliding connection with the limiting frame 3, a first push block 14 capable of driving the first rack bar 13 to move backwards is arranged at the rear side of the first rack bar 13, the first push block 14 is rotationally connected with a first slide bar 15, and the first slide bar 15 is in sliding connection with the cleaning frame 2; the detection plate 6 is arranged above the limiting frame 3, the detection plate 6 is in sliding connection with the cleaning frame 2, and the detection plate 6 is fixedly connected with the first sliding rod 15 through the fixing plate 16.
When in operation, a worker manually places a silicon wafer into a notch of the limiting frame 3 and pushes the silicon wafer backwards, when the silicon wafer moves backwards to be in contact with the detection plate 6, the silicon wafer is pushed backwards again to drive the detection plate 6 to synchronously move backwards, the detection plate 6 drives the first slide rod 15 and the first push block 14 to synchronously move backwards through the fixing plate 16, as shown in figure 7, the first push block 14 drives the first rack rod 13 to synchronously move backwards, the first rack rod 13 drives the first gear 12 to rotate clockwise (based on figure 5), the first gear 12 drives the front arc clamping rod 4 to rotate upwards, when the silicon wafer moves backwards to be in contact with the rear arc clamping rod 4, the silicon wafer moves to the farthest position, at the moment, the front arc clamping rod 4 is driven by the first gear 12 to rotate to be in contact with the silicon wafer, because of the limitation of the pawl 7 to the ratchet wheel 5 (the ratchet wheel 5 can only rotate clockwise), the arc clamping rods 4 can not rotate after moving to contact with silicon wafers, the two arc clamping rods 4 can stably clamp the silicon wafers between the silicon wafers, then the silicon wafers are sequentially placed on other side-by-side limiting frames 3, the arc clamping rods 4 clamp the silicon wafers, then the manipulator body 1 drives the cleaning frame 2 to move into the cleaning tank for cleaning, the cleaning frame 2 starts a driving assembly after moving into the cleaning tank, the driving assembly firstly drives the leftmost limiting frame 3 to move rightwards, and drives the limiting frame 3 to rotate in the leftward moving process of the limiting frame 3, after the leftmost limiting frame 3 moves to the leftmost side, the driving assembly drives the second left limiting frame 3 to move leftwards and rotate, and the driving assembly is sequentially repeated until the leftmost limiting frame 3 completes moving and rotating, then the driving component drives the limit frame to move back to the initial position to complete cleaning work, then the manipulator body 1 can drive the cleaning frame 2 to move to the outer side of the cleaning tank, then a worker can drive the first slide block 8 to move obliquely upwards in the oblique slide way 9 by pulling the second slide block 11 and the first traction rope 10, the first slide block 8 can drive the pawl 7 to move synchronously, the pawl 7 can be gradually disengaged from the ratchet wheel 5, then the arc-shaped clamping rod 4 can rotate back to the inner side of the limit frame 3 under the action of the torsion spring, and then the worker can take out the silicon chip from the limit frame 3; according to the invention, through the arrangement of the arc clamping rods 4 and the clamping assemblies, a worker can enable the two arc clamping rods 4 to stably clamp the silicon wafer through simple pushing, so that the silicon wafer can be more stable when moving and cleaning in the cleaning tank, and the worker only needs to pull the first traction rope to enable the arc clamping rods 4 at the front side to cancel clamping of the silicon wafer when taking out the silicon wafer later, so that the silicon wafer can be taken and put simply; through the arrangement of the driving assembly, the silicon wafer can be irregularly moved in the cleaning tank to accelerate the cleaning of the silicon wafer, and the silicon wafer can be cleaned more thoroughly.
As a further scheme of the invention, a push plate 17 for driving the second slider 11 to move is arranged above the second slider 11, the push plate 17 is in sliding connection with the cleaning frame 2, a second spring 18 for resetting the push plate 17 is fixedly connected to the push plate 17, a second traction rope 19 is fixedly connected to the push plate 17, and a pull block 20 is fixedly connected to the outer end of the second traction rope 19.
When the silicon wafer cleaning machine works, after the silicon wafer is cleaned, a worker pulls the pulling block 20 upwards, the pulling block 20 drives the pushing plate 17 to move downwards through the second pulling rope 19, the pushing plate 17 pushes all the second sliding blocks 11 below the pushing plate to move downwards, all pawls 7 can be disengaged from the ratchet wheel 5 at the same time, the silicon wafer taking time can be greatly shortened, and the cleaning efficiency of the silicon wafer can be accelerated.
As a further aspect of the present invention, a first sponge 21 is fixedly connected to the front wall of the detection plate 6.
In operation, as shown in fig. 1, the first sponge 21 is installed on the front side wall of the detection plate 6, so that the first sponge 21 can replace the detection plate 6 to contact with the silicon wafer, hard collision between the detection plate and the silicon wafer can be avoided, damage to the silicon wafer can be avoided, and the silicon wafer can be better protected.
As a further aspect of the invention, the drive assembly comprises a third slider 22 and a third gear 23; the third sliding block 22 is in sliding connection with the cleaning frame 2, the third sliding block 22 is in rotating connection with the limiting frame 3, a clamping groove 24 is formed in the third sliding block 22, a trapezoid pushing block 25 which can be inserted into the clamping groove 24 is arranged on the side edge of the clamping groove 24, a fourth sliding block 26 is in sliding connection with the trapezoid pushing block 25, a first spring 27 is fixedly connected to the fourth sliding block 26, the first spring 27 is fixedly connected with the trapezoid pushing block 25, a sliding plate 28 is rotatably connected to the fourth sliding block 26, the sliding plate 28 is in sliding connection with the cleaning frame 2, a linear driving mechanism for driving the sliding plate 28 to linearly move is arranged on the sliding plate 28, a one-way bearing 35 is fixedly connected to the rotating shaft of the fourth sliding block 26, a second gear 29 is fixedly connected to the outer circumferential wall of the one-way bearing 35, second rack bars 30 which can be meshed with the second gear 29 are arranged on the left side and the right side of the second gear 29, and the second rack bars 30 are fixedly connected with the cleaning frame 2; the third gear 23 is fixedly connected to the rotating shaft of the limiting frame 3, a third rack bar 31 capable of being meshed with the third gear 23 is arranged on the side edge of the third gear 23, and the third rack bar 31 is fixedly connected with the limiting frame 3.
When the driving assembly works, the linear driving mechanism drives the sliding plate 28 to move rightwards firstly, the sliding plate 28 drives the fourth sliding block 26 and the trapezoid pushing block 25 to synchronously move rightwards, when the trapezoid pushing block 25 moves rightwards to be contacted with the left side wall of the leftmost third sliding block 22, the third sliding block 22 can downwards move the trapezoid pushing block 25 by pressing the inclined surface of the trapezoid pushing block 25, after the trapezoid pushing block 25 moves to the lower part in the clamping groove 24, the trapezoid pushing block 25 can be upwards inserted into the clamping groove 24 under the action of the elastic force of the first spring 27, the linear driving mechanism can start to drive the sliding plate 28 to move leftwards after the trapezoid pushing block 25 moves upwards, the sliding plate 28 can drive the fourth sliding block 26 and the trapezoid pushing block 25 to synchronously move leftwards, the trapezoid pushing block 25 can drive the third sliding block 22, the third gear 23 and the leftmost limiting frame 3 to leftwards, when the third gear 23 moves to the third rack bar 31 to be meshed, the third rack bar 31 drives the third gear 23 to rotate, the third gear 23 drives the limit frame 3 to synchronously rotate, the limit frame 3 drives the silicon wafer to rotate, the silicon wafer can receive spraying while rotating, the spraying water can spray on all side walls of the silicon wafer, the silicon wafer can be inclined more thoroughly, and can be cleaned more quickly, when the limit frame 3 moves to the leftmost side, the linear driving mechanism drives the slide plate 28 to move rightwards, the slide plate 28 drives the left second limit frame 3 to move leftwards after repeating the working process, the processes are repeated in sequence until the rightmost limit frame 3 moves leftwards to the leftmost side, then the linear driving mechanism drives the slide plate 28 and the fourth slide block 26 to move rightwards to enable the second gear 29 to be meshed with the second rack bar 30, the second gear 29 moves rightwards again and rotates 180 DEG under the action of the second rack bar 30, at this time, the second gear 29 drives the fourth slider 26 to synchronously rotate 180 ° through the one-way bearing 35, the fourth slider 26 drives the trapezoidal push block 25 to synchronously rotate, so that the wedge surface of the trapezoidal push block 25 faces to the left, and then the trapezoidal push block 25 can drive the limiting frame 3 to move rightward to return to the initial position under the action of the linear driving mechanism; according to the invention, through the arrangement of the driving component, the silicon wafer can move and rotate in the cleaning tank, so that the silicon wafer can be more fully contacted with spray water, and the silicon wafer can be cleaned more thoroughly.
As a further scheme of the invention, the linear driving mechanism comprises a cylinder 32, the cylinder 32 is fixedly connected to the bottom of the cleaning frame 2, and the output end of the cylinder 32 is fixedly connected with the sliding plate 28.
When the linear driving mechanism is operated, the linear driving mechanism is arranged as the air cylinder 32, and the air cylinder 32 can drive the sliding plate 28 to circularly move in the left-right direction.
As a further scheme of the invention, a motor 33 is fixedly connected to the manipulator body 1, and an output shaft of the motor 33 is fixedly connected with the cleaning frame 2; during operation, through the setting of motor 33, can make motor 33 drive and wash frame 2 rotation, can make spacing 3 make wash frame 2 drive spacing 3 rotation in the pivoted, can make the silicon chip wash more thoroughly.
As a further scheme of the invention, the top of the inner wall of the cleaning frame 2 is fixedly connected with a second sponge 34; in operation, the silicon wafer can be better protected from damage by the provision of the second sponge 34.
Working principle: the staff manually places the silicon chip into the notch of the limiting frame 3 and pushes the silicon chip backwards, when the silicon chip moves backwards to be in contact with the detection plate 6, the silicon chip drives the detection plate 6 to synchronously move backwards, the detection plate 6 drives the first slide rod 15 and the first push block 14 to synchronously move backwards through the fixed plate 16, as shown in fig. 7, the first push block 14 drives the first rack rod 13 to synchronously move backwards, the first rack rod 13 drives the first gear 12 to rotate clockwise (taking fig. 5 as a reference), the first gear 12 drives the front arc clamping rod 4 to rotate upwards, when the silicon chip moves backwards to be in contact with the rear arc clamping rod 4, the silicon chip moves to the farthest position, at the moment, the front arc clamping rod 4 is driven by the first gear 12 to rotate to be in contact with the silicon chip, due to the limitation of the pawl 7 on the ratchet wheel 5, (the ratchet wheel 5 can only rotate clockwise), the arc clamping rods 4 can not rotate after moving to contact with the silicon wafers, the two arc clamping rods 4 can stably clamp the silicon wafers between the silicon wafers, then the silicon wafers are sequentially placed on other side-by-side limiting frames 3, the arc clamping rods 4 clamp the silicon wafers, then the manipulator body 1 drives the cleaning frame 2 to move into the cleaning tank to clean, the cleaning frame 2 starts a driving component after moving into the cleaning tank, the driving component firstly drives the leftmost limiting frame 3 to move rightwards, drives the limiting frame 3 to rotate in the leftward moving process of the limiting frame 3, drives the leftmost limiting frame 3 to move leftwards and rotate after the leftmost limiting frame 3 moves to the leftmost limiting frame 3, sequentially repeats until the leftmost limiting frame 3 completes moving and rotating, then the driving component drives the limit frame to move back to the initial position to complete cleaning work, then the manipulator body 1 can drive the cleaning frame 2 to move to the outer side of the cleaning tank, then a worker can drive the first slide block 8 to move obliquely upwards in the oblique slide way 9 by pulling the second slide block 11 and the first traction rope 10, the first slide block 8 can drive the pawl 7 to move synchronously, the pawl 7 can be gradually disengaged from the ratchet wheel 5, then the arc-shaped clamping rod 4 can rotate back to the inner side of the limit frame 3 under the action of the torsion spring, and then the worker can take out the silicon chip from the limit frame 3; according to the invention, through the arrangement of the arc clamping rods 4 and the clamping assemblies, a worker can enable the two arc clamping rods 4 to stably clamp the silicon wafer through simple pushing, so that the silicon wafer can be more stable when moving and cleaning in the cleaning tank, and the worker only needs to pull the first traction rope to enable the arc clamping rods 4 at the front side to cancel clamping of the silicon wafer when taking out the silicon wafer later, so that the silicon wafer can be taken and put simply; through the arrangement of the driving assembly, the silicon wafer can be irregularly moved in the cleaning tank to accelerate the cleaning of the silicon wafer, and the silicon wafer can be cleaned more thoroughly.
Claims (6)
1. The utility model provides a manipulator for silicon chip cleaning machine, includes manipulator body (1), its characterized in that: the cleaning device comprises a manipulator body (1), wherein a cleaning frame (2) is arranged at the bottom of the manipulator body (1), the cleaning frame (2) is C-shaped, a limiting frame (3) is arranged in the cleaning frame (2), and two arc clamping rods (4) which are symmetrically arranged are rotationally connected to the limiting frame (3); a torsion spring for resetting the arc-shaped clamping rod (4) is sleeved on the rotating shaft; the side edges of the arc clamping rods (4) are respectively provided with a clamping assembly, the two clamping assemblies are symmetrically arranged in a circumference manner, the cleaning frame (2) is also provided with a driving assembly, and the driving assembly is used for driving the limiting frame (3) to clamp a silicon wafer and then driving the limiting frame (3) and the silicon wafer to move;
the clamping assembly comprises a ratchet wheel (5) and a detection plate (6); the ratchet wheel (5) is fixedly connected to the rotating shaft of the arc-shaped clamping rod (4), the ratchet wheel (5) is meshed with the pawl (7), the pawl (7) is rotationally connected with the first sliding block (8), an inclined slideway (9) is arranged on the side edge of the first sliding block (8), and the inclined slideway (9) is fixedly connected with the limiting frame (3); the first sliding block (8) is in sliding connection with the inclined slideway (9), a first traction rope (10) is fixedly connected to the first sliding block (8), the outer end of the first traction rope (10) penetrates through the side wall of the limiting frame (3) and extends to the outer side of the limiting frame (3) to be fixedly connected with a second sliding block (11), and the second sliding block (11) is in sliding connection with the limiting frame (3) in the vertical direction; a first gear (12) is fixedly connected to a rotating shaft of the ratchet wheel (5), a first rack bar (13) is meshed with the first gear (12), the first rack bar (13) is in sliding connection with the limiting frame (3), a first pushing block (14) capable of driving the first rack bar (13) to move backwards is arranged on the rear side of the first rack bar (13), a first sliding bar (15) is rotatably connected to the first pushing block (14), and the first sliding bar (15) is in sliding connection with the cleaning frame (2); the detection plate (6) is arranged above the limiting frame (3), the detection plate (6) is in sliding connection with the cleaning frame (2), and the detection plate (6) is fixedly connected with the first sliding rod (15) through the fixing plate (16);
the upper portion of second slider (11) is provided with push pedal (17) that are used for driving it to remove, push pedal (17) and washing frame (2) sliding connection, fixedly connected with is used for its second spring (18) that resets on push pedal (17), fixedly connected with second haulage rope (19) on push pedal (17), the outer end fixedly connected with of second haulage rope (19) draws piece (20).
2. The manipulator for a silicon wafer cleaning machine according to claim 1, wherein: the front wall of the detection plate (6) is fixedly connected with a first sponge body (21).
3. The manipulator for a silicon wafer cleaning machine according to claim 1, wherein: the drive assembly comprises a third slider (22) and a third gear (23); the cleaning device comprises a cleaning frame (2), a third sliding block (22), a limiting frame (3) and a fourth sliding block (26), wherein the third sliding block (22) is in sliding connection with the cleaning frame (2), a clamping groove (24) is formed in the third sliding block (22), a trapezoidal pushing block (25) capable of being inserted into the clamping groove is arranged on the side edge of the clamping groove (24), a first spring (27) is fixedly connected to the fourth sliding block (26), the first spring (27) is fixedly connected with the trapezoidal pushing block (25), a sliding plate (28) is rotatably connected to the fourth sliding block (26), the sliding plate (28) is in sliding connection with the cleaning frame (2), a linear driving mechanism for driving the sliding plate (28) to linearly move is arranged on the sliding plate (28), a one-way bearing (35) is fixedly connected to a rotating shaft of the fourth sliding block, a second gear (29) is fixedly connected to the outer circumferential wall of the one-way bearing (35), and the left side and the right side of the second gear (29) are both fixedly connected with a second rack bar (30) capable of being meshed with the second rack bar (30), and the second rack bar (30) is fixedly connected with the cleaning frame (2); the third gear (23) is fixedly connected to the rotating shaft of the limiting frame (3), a third rack bar (31) capable of being meshed with the third gear (23) is arranged on the side edge of the third gear (23), and the third rack bar (31) is fixedly connected with the limiting frame (3).
4. A manipulator for a silicon wafer cleaning machine as set forth in claim 3, wherein: the linear driving mechanism comprises an air cylinder (32), the air cylinder (32) is fixedly connected to the bottom of the cleaning frame (2), and the output end of the air cylinder (32) is fixedly connected with the sliding plate (28).
5. The manipulator for a silicon wafer cleaning machine according to claim 1, wherein: the manipulator body (1) is fixedly connected with a motor (33), and an output shaft of the motor (33) is fixedly connected with the cleaning frame (2).
6. The manipulator for a silicon wafer cleaning machine according to claim 1, wherein: the top of the inner wall of the cleaning frame (2) is fixedly connected with a second sponge body (34).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211003151.3A CN115608679B (en) | 2022-08-20 | 2022-08-20 | Manipulator for silicon wafer cleaning machine |
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| CN202211003151.3A CN115608679B (en) | 2022-08-20 | 2022-08-20 | Manipulator for silicon wafer cleaning machine |
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| CN115608679B true CN115608679B (en) | 2023-08-15 |
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| CN115608679A (en) | 2023-01-17 |
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Denomination of invention: A mechanical arm for silicon wafer cleaning machine Granted publication date: 20230815 Pledgee: Haining Zhejiang rural commercial bank, Limited by Share Ltd. Pledgor: Zhejiang Aike Semiconductor Equipment Co.,Ltd. Registration number: Y2024980007206 |