CN115585968A - Pneumatic pen for enhancing air tightness of front adhesive tape of wafer - Google Patents
Pneumatic pen for enhancing air tightness of front adhesive tape of wafer Download PDFInfo
- Publication number
- CN115585968A CN115585968A CN202211290322.5A CN202211290322A CN115585968A CN 115585968 A CN115585968 A CN 115585968A CN 202211290322 A CN202211290322 A CN 202211290322A CN 115585968 A CN115585968 A CN 115585968A
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- Prior art keywords
- wafer
- air
- pneumatic pen
- pneumatic
- enhancing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M3/00—Investigating fluid-tightness of structures
- G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
- G01M3/26—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors
- G01M3/32—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for containers, e.g. radiators
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of semiconductor manufacturing auxiliary devices, and particularly relates to a pneumatic pen for enhancing the air tightness of wafer front surface adhesive tape.
Description
Technical Field
The invention belongs to the technical field of semiconductor auxiliary devices, and particularly relates to a pneumatic pen for enhancing the air tightness of front surface rubberizing of a wafer.
Background
In recent years, with the rapid development of semiconductor industry with scientific progress, chips have become an essential part of production and life. In the back-end process of the wafer, the processes of thinning the wafer and evaporating metal on the back surface, the front adhesive tape is used for protecting the circuit surface so as to avoid the pollution of damage, crack, dirt and the like caused by external foreign matters. However, in actual operation, there are bubbles, adhesive failure, and edge lifting, which can cause the wafer to be pickled in the subsequent process, resulting in loss.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the pneumatic pen for enhancing the air tightness of the front surface adhesive tape of the wafer, which is used for solving the existing problems.
In order to solve the technical problems, the invention adopts the following technical scheme:
the utility model provides a pneumatic pen of positive rubberizing gas tightness of reinforcing wafer, includes hollow main part and atmospheric pressure nib, hollow main part includes air pressure regulating valve and inlet port, the atmospheric pressure nib includes hard resin doctor-bar, venthole, air current groove and links up the screw socket, the venthole is located hard resin doctor-bar downside, the atmospheric pressure nib is connected through linking the screw socket with hollow main part, hard resin doctor-bar is located the air current groove top.
Furthermore, the airflow groove is of a pipeline structure, air is fed through a horn-shaped pipe opening, and air is discharged through S-shaped folding.
Further, the hollow main body is of a hollow structure.
Furthermore, the air pressure pen point is of a hollow structure with an air flow groove arranged inside.
Furthermore, the hard resin scraper is inserted and can be replaced and connected.
Compared with the prior art, the invention has the following beneficial effects:
the adhesive tape sticking device is simple to operate, convenient to carry, easy to disassemble and clean, safe and efficient, effectively solves the problem that the adhesive tape is not stuck tightly, reduces misoperation, avoids loss, and has wide market prospect
Drawings
FIG. 1 is a cross-sectional view of an embodiment of a pneumatic pen for enhancing the hermetic sealing of a front side adhesive of a wafer according to the present invention;
reference numerals in the drawings of the specification include:
the pneumatic pen comprises a hard resin scraper 1, an air outlet 2, an airflow groove 3, a connecting screw 4, a pneumatic pen point 5, a hollow main body 6, an air pressure regulating valve 7 and an air inlet 8.
Detailed Description
In order that those skilled in the art can better understand the present invention, the following technical solutions are further described with reference to the accompanying drawings and examples.
Wherein the showings are for the purpose of illustration only and not for the purpose of limiting the same, the same is shown by way of illustration only and not in the form of limitation; for a better explanation of the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
Example (b):
as shown in fig. 1, the pneumatic pen for enhancing the air tightness of the front surface adhesive tape of the wafer of the invention comprises a hollow main body 6 and a pneumatic pen point 5, wherein the hollow main body 6 comprises an air pressure regulating valve 7 and an air inlet hole 8, the pneumatic pen point 5 comprises a hard resin scraping blade 1, an air outlet hole 2, an air flow groove 3 and a connecting screw port 4, the air outlet hole 2 is positioned at the lower side of the hard resin scraping blade 1, the pneumatic pen point 5 is connected with the hollow main body 6 through the connecting screw port 4, the hard resin scraping blade 1 is positioned at the top of the air flow groove 3, the air flow groove 3 is of a pipeline type structure, air is supplied through a horn-shaped pipe orifice and is discharged through an S-shaped folding mode, the hollow main body 6 is of a hollow structure, the pneumatic pen point 5 is of a hollow structure with a built-in air flow groove, and the hard resin scraping blade 1 is of an insertion type and can be replaced and connected.
The specific working principle and effect are as follows: connecting the tail metal air inlet hole 8 with the compressed air of the production line, and adjusting the air flow rate and the air pressure of the air outlet hole 2 through an air pressure adjusting knob at the middle section of the hollow main body 6 of the pneumatic pen; the air tightness enhancement operation process is carried out through the hard resin scraper blade 1 and the air flow groove 3, the air flow groove 3 and the contact surface form a certain angle, the air flow groove 3 and the hard resin scraper blade 1 are in contact with the surface of the unsealed adhesive tape by utilizing a mechanical extrusion matched compressed air pressure method, the adhesive force of the adhesive tape and the front surface of the wafer is enhanced, air is exhausted, and the phenomenon of pickling in the later process due to the existence of an air gap between the film and the wafer is prevented.
The foregoing are merely exemplary embodiments of the present invention, and no attempt is made to show structural details of the invention in more detail than is necessary for the fundamental understanding of the art, the description taken with the drawings making apparent to those skilled in the art how the several forms of the invention may be embodied in practice with the teachings of the invention. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several changes and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent.
The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limitations of the present patent, and the specific meanings of the terms may be understood by those skilled in the art according to specific situations.
In the description of the present invention, unless otherwise explicitly specified or limited, the term "connected" or the like, if appearing to indicate a connection relationship between the components, is to be understood broadly, for example, as being fixed or detachable or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through one or more other components or may be in an interactive relationship with one another. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Claims (5)
1. The utility model provides a pneumatic pen of positive rubberizing gas tightness of reinforcing wafer which characterized in that: the pneumatic pen point comprises a hollow main body and a pneumatic pen point, wherein the hollow main body comprises an air pressure regulating valve and an air inlet hole, the pneumatic pen point comprises a hard resin scraping blade, an air outlet hole, an air flow groove and a connecting screw, the air outlet hole is located on the lower side of the hard resin scraping blade, the pneumatic pen point is connected with the hollow main body through the connecting screw, and the hard resin scraping blade is located at the top of the air flow groove.
2. The pneumatic pen for enhancing the hermetic sealing of the front surface of the wafer as claimed in claim 1, wherein: the air flow groove is of a pipeline structure, air is fed through a horn-shaped pipe opening, and air is discharged through S-shaped folding.
3. The pneumatic pen for enhancing the hermetic sealing of the front surface of the wafer as claimed in claim 2, wherein: the hollow main body is of a hollow structure.
4. The pneumatic pen for enhancing the hermetic sealing of the front surface of the wafer as claimed in claim 3, wherein: the air pressure pen point is of a hollow structure with an air flow groove arranged inside.
5. The pneumatic pen for enhancing the hermetic sealing of the front surface of the wafer as claimed in claim 4, wherein: the hard resin scraper is inserted and can be replaced and connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211290322.5A CN115585968A (en) | 2022-10-21 | 2022-10-21 | Pneumatic pen for enhancing air tightness of front adhesive tape of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211290322.5A CN115585968A (en) | 2022-10-21 | 2022-10-21 | Pneumatic pen for enhancing air tightness of front adhesive tape of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115585968A true CN115585968A (en) | 2023-01-10 |
Family
ID=84779708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211290322.5A Pending CN115585968A (en) | 2022-10-21 | 2022-10-21 | Pneumatic pen for enhancing air tightness of front adhesive tape of wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115585968A (en) |
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2022
- 2022-10-21 CN CN202211290322.5A patent/CN115585968A/en active Pending
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