CN115581120A - 聚磺酰胺聚合物、含有聚磺酰胺聚合物的负型光敏性组合物及其应用 - Google Patents

聚磺酰胺聚合物、含有聚磺酰胺聚合物的负型光敏性组合物及其应用 Download PDF

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Publication number
CN115581120A
CN115581120A CN202080100667.2A CN202080100667A CN115581120A CN 115581120 A CN115581120 A CN 115581120A CN 202080100667 A CN202080100667 A CN 202080100667A CN 115581120 A CN115581120 A CN 115581120A
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polymer
polysulfonamide
mass
parts
film
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崔庆洲
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/30—Polysulfonamides; Polysulfonimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

本发明公开了一种聚磺酰胺聚合物、含有聚磺酰胺聚合物的负型光敏性组合物及其应用。其中所述的含有聚磺酰胺聚合物的负型光敏性组合物由下述原料按照一定重量比例组成：聚磺酰胺聚合物、光酸产生剂、交联剂、溶剂以及一些其它组分。该组合物在较低固化温度条件下(≤250℃)制备出聚磺酰胺固化物膜，该固化物膜可用做重新分布层、层间绝缘缓冲膜、覆盖涂层或表面保护膜材料。

Description

PCT国内申请，说明书已公开。

Claims (10)

  1. PCT国内申请，权利要求书已公开。
CN202080100667.2A 2020-05-19 2020-05-19 聚磺酰胺聚合物、含有聚磺酰胺聚合物的负型光敏性组合物及其应用 Pending CN115581120A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/091094 WO2021232248A1 (zh) 2020-05-19 2020-05-19 聚磺酰胺聚合物、含有聚磺酰胺聚合物的负型光敏性组合物及其应用

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CN115581120A true CN115581120A (zh) 2023-01-06

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WO (1) WO2021232248A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114995060B (zh) * 2022-08-01 2022-11-01 明士(北京)新材料开发有限公司 一种可低温固化的负性光敏性树脂组合物及其制备方法与应用

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB856310A (en) * 1958-01-10 1960-12-14 Ici Ltd Improved polysulphonamides
JPS56104941A (en) * 1980-01-25 1981-08-21 Mitsui Toatsu Chem Inc Polysulfonamide ester and preparation therefor
JPH07244375A (ja) * 1994-03-02 1995-09-19 Konica Corp 感光性平版印刷版の処理方法
US20050069812A1 (en) * 2003-09-29 2005-03-31 Fuji Photo Film Co., Ltd. Planographic printing plate precursor
CN107209459A (zh) * 2015-02-19 2017-09-26 富士胶片株式会社 感光性树脂组合物、平板印刷版原版、平板印刷版的制作方法及高分子化合物
CN108137809A (zh) * 2015-10-08 2018-06-08 日本化药株式会社 新型聚磺酰胺化合物以及含有该化合物的树脂组合物
CN109312158A (zh) * 2016-05-12 2019-02-05 丹尼尔·J·纳罗奇 聚磺酰胺再分布组合物及其使用方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000331713A (ja) * 1999-05-21 2000-11-30 Hitachi Chem Co Ltd 高分子固体電解質の製造法、高分子固体電解質及びこれを用いた電気化学的デバイス
JP3954066B2 (ja) * 2004-02-25 2007-08-08 松下電器産業株式会社 バリア膜形成用材料及びそれを用いたパターン形成方法
CN103342812A (zh) * 2013-07-01 2013-10-09 大连工业大学 芳香聚酰胺磺酰胺及其制备方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB856310A (en) * 1958-01-10 1960-12-14 Ici Ltd Improved polysulphonamides
JPS56104941A (en) * 1980-01-25 1981-08-21 Mitsui Toatsu Chem Inc Polysulfonamide ester and preparation therefor
JPH07244375A (ja) * 1994-03-02 1995-09-19 Konica Corp 感光性平版印刷版の処理方法
US20050069812A1 (en) * 2003-09-29 2005-03-31 Fuji Photo Film Co., Ltd. Planographic printing plate precursor
CN107209459A (zh) * 2015-02-19 2017-09-26 富士胶片株式会社 感光性树脂组合物、平板印刷版原版、平板印刷版的制作方法及高分子化合物
CN108137809A (zh) * 2015-10-08 2018-06-08 日本化药株式会社 新型聚磺酰胺化合物以及含有该化合物的树脂组合物
CN109312158A (zh) * 2016-05-12 2019-02-05 丹尼尔·J·纳罗奇 聚磺酰胺再分布组合物及其使用方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
YOSHIO IMAI: "Synthesis of Wholly Aromatic Polysulfonamidesfrom Aromatic Disulfonyl Chlorides and Aromatic Diamines", JOURNAL OF POLYMER SCIENCE, vol. 17, 31 December 1979 (1979-12-31), XP001204314, DOI: 10.1002/pol.1979.170170522 *

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