CN115570587A - Vacuum manipulator vacuum performance test equipment - Google Patents
Vacuum manipulator vacuum performance test equipment Download PDFInfo
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- CN115570587A CN115570587A CN202211576987.2A CN202211576987A CN115570587A CN 115570587 A CN115570587 A CN 115570587A CN 202211576987 A CN202211576987 A CN 202211576987A CN 115570587 A CN115570587 A CN 115570587A
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- 238000011056 performance test Methods 0.000 title claims description 10
- 238000012360 testing method Methods 0.000 claims abstract description 96
- 230000002093 peripheral effect Effects 0.000 claims abstract description 8
- 238000007789 sealing Methods 0.000 claims abstract description 7
- 238000001514 detection method Methods 0.000 claims description 53
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 13
- 239000004065 semiconductor Substances 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 235000012431 wafers Nutrition 0.000 description 114
- 238000004364 calculation method Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 230000001960 triggered effect Effects 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/0095—Means or methods for testing manipulators
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of vacuum manipulator performance testing, and particularly relates to vacuum manipulator vacuum performance testing equipment which comprises a testing chamber, wherein a vacuum manipulator connecting port for connecting a vacuum manipulator is formed in the bottom surface of the testing chamber, a plurality of equipment connecting ports are formed in the outer peripheral surface of the testing chamber, equipment interconnection structural members or gate valves are arranged on the outer peripheral surface of the testing chamber corresponding to each equipment connecting port, and one end, far away from the testing chamber, of each equipment interconnection structural member is connected with external equipment or a sealing cover; a wafer alignment assembly is disposed on the test chamber adjacent to one of the equipment connection ports. The invention can simulate the actual process production flow of the semiconductor industry, and the test result of the vacuum manipulator is more persuasive; the test device can flexibly and externally connect relevant semiconductor production equipment, is convenient for executing test tasks, and solves the problems of simple structure and single test action of the traditional test equipment.
Description
Technical Field
The invention belongs to the technical field of vacuum manipulator performance testing, and particularly relates to vacuum manipulator vacuum performance testing equipment.
Background
With the rapid development of the semiconductor industry, the demand of the vacuum manipulator applied to the semiconductor production process is continuously increased, and how to accurately, rapidly and efficiently realize each process flow of wafer production and automatic transportation becomes the focus of attention, so that the market demand on the vacuum manipulator and the vacuum performance test equipment thereof is increased day by day.
The research and development iteration cycle of the vacuum manipulator applied to the semiconductor industry at present is short, and the functional characteristics of miniaturization, high precision, high integration and the like need to be met. In order to detect whether the motion performance of the vacuum manipulator in a vacuum environment meets expectations, the current common means is to evaluate the performance of the manipulator by picking and placing wafers at the same position for multiple times under a vacuum condition, and the method has a single action, so that the obtained conclusion is one-sided and may have a large deviation from the actual working condition.
Disclosure of Invention
In view of the above problems, the present invention provides a vacuum performance testing apparatus for a vacuum robot.
The purpose of the invention is realized by the following technical scheme:
a vacuum manipulator vacuum performance testing device comprises a testing chamber, wherein a vacuum manipulator connecting port used for being connected with a vacuum manipulator is formed in the bottom surface of the testing chamber, a plurality of device connecting ports are formed in the outer peripheral surface of the testing chamber, a device interconnection structural member or a gate valve is mounted on the outer peripheral surface of the testing chamber corresponding to each device connecting port, and one end, far away from the testing chamber, of each device interconnection structural member is connected with an external device or a sealing cover; and a wafer calibration component is arranged on the test chamber close to one of the equipment connecting ports.
The testing device comprises a testing chamber and is characterized in that the top end of the testing chamber is opened, and an upper cover used for sealing the top end opening of the testing chamber is arranged on the testing chamber.
The outside of test chamber is equipped with the upper cover driving piece, it has the one end of swing arm to cover the rigid coupling on, the other end of swing arm with the output of upper cover driving piece is connected, the input of upper cover driving piece is connected with the hand wheel.
A limiting block is arranged on the outer side of the upper cover driving piece, a limiting pin shaft hole A is formed in the limiting block, and a limiting pin shaft hole B is formed in the swinging arm; when the swing arm swings to an appointed position, the limiting pin shaft hole A corresponds to the limiting pin shaft hole B, and the limiting pin shaft hole A and the limiting pin shaft hole B are simultaneously penetrated through a limiting pin shaft, so that the swing arm keeps fixed in position.
And a magnetic switch for detecting the opening and closing state of the upper cover is arranged between the test chamber and the upper cover and is connected with an external control system.
The wafer calibration assembly comprises a wafer calibration assembly base, a wafer tray, a wafer calibration motor and a wafer position detection correlation sensor, wherein the wafer tray is arranged on the upper side of the wafer calibration assembly base, the wafer calibration motor is installed on the bottom surface of the wafer calibration assembly base, the wafer calibration motor drives the wafer tray to rotate, a wafer calibration assembly base installation port is formed in the bottom surface of the test chamber, the wafer calibration assembly base is connected with the wafer calibration assembly base installation port, the wafer tray extends into the test chamber, and an encoding disc is arranged inside the wafer calibration motor;
the wafer position detection correlation sensor comprises a wafer position detection correlation sensor transmitting end and a wafer position detection correlation sensor receiving end, the wafer position detection correlation sensor transmitting end and the wafer position detection correlation sensor receiving end are respectively arranged on a wafer calibration assembly base and a test chamber outside a wafer tray, light penetrating openings A for penetrating correlation detection light of the wafer position detection correlation sensor are formed in the wafer calibration assembly base and the test chamber, the correlation detection light of the wafer position detection correlation sensor is parallel to the axial center line of the wafer tray, and the wafer position detection correlation sensor, a wafer calibration motor and a coding disc are respectively connected with an external control system.
And manipulator extension in-place detection sensors are arranged at the positions, close to the equipment connecting ports, of the test chamber, and each manipulator extension in-place detection sensor is connected with an external control system.
And a wafer penetrating port communicated with the adjacent equipment connecting port of the test chamber is formed in the inner side of each equipment interconnection structural member, an AWC sensor is arranged on each equipment interconnection structural member, and each AWC sensor is connected with an external control system respectively.
The invention has the advantages and positive effects that:
1. the invention can simulate the actual process production flow of the semiconductor industry, and the test result of the vacuum manipulator is more persuasive; the test device can be flexibly connected with relevant semiconductor production equipment externally, is convenient for executing test tasks, and solves the problems of simple structure and single test action of the traditional test equipment;
2. the invention is compatible with the test work of wafers with various sizes, and can flexibly adjust the main scheme adopted for correcting the deviation according to different sizes of the wafers;
3. the invention can be suitable for the test work of various vacuum manipulators in a certain size, can carry out certain adjustment on the cavity and the structure according to the stroke and the size of the manipulator, and has strong test compatibility.
Drawings
FIG. 1 is a schematic top view of a testing chamber according to the present invention;
FIG. 2 is a right-side view of the arrangement of the testing chamber of the present invention;
FIG. 3 is a schematic view of the arrangement structure of the upper cover of the present invention;
FIG. 4 is a schematic view of an arrangement structure of a wafer alignment assembly according to the present invention.
In the figure: 1 is a test chamber, 2 is an equipment interconnection structural part, 3 is a gate valve, 4 is a sealing cover, 5 is an upper cover, 6 is an upper cover driving part, 7 is a swing arm, 701 is a limiting pin shaft hole B, 8 is a hand wheel, 9 is a limiting block, 901 is a limiting pin shaft hole A, 10 is a magnetic switch, 11 is a wafer calibration assembly base, 12 is a wafer tray, 13 is a wafer calibration motor, 1401 is a wafer position detection correlation sensor transmitting end, 1402 is a wafer position detection correlation sensor receiving end, 1501 is a manipulator extension in-place detection sensor main body, and 1502 is a manipulator extension in-place detection sensor reflecting plate; 001 is a vacuum robot.
Detailed Description
The invention is described in further detail below with reference to figures 1-4.
As shown in fig. 1 to 4, the vacuum performance testing apparatus for a vacuum manipulator includes a testing chamber 1, a vacuum manipulator connection port for connecting a vacuum manipulator 001 is formed in the middle of the bottom surface of the testing chamber 1, a plurality of apparatus connection ports are formed in the outer peripheral surface of the testing chamber 1, an apparatus interconnection structure 2 or a gate valve 3 is mounted on the outer peripheral surface of the testing chamber 1 corresponding to each apparatus connection port through screws, and one end, far away from the testing chamber 1, of each apparatus interconnection structure 2 is connected with an external apparatus or a sealing cover 4 through a screw. A wafer alignment assembly is arranged on the test chamber 1 close to one of the equipment connecting ports. The test chamber 1 in this embodiment is hexagonal. In this embodiment, the test chamber 1 is provided with a connection port for connecting a vacuum pump. The external equipment connected with the equipment interconnection structure 2 comprises semiconductor related equipment such as FOUP box carrying equipment, a wafer position regulator and the like and other corresponding process cavities in actual production, wherein wafers used in testing can be provided by connecting the FOUP box carrying equipment through the equipment interconnection structure 2, and the vacuum manipulator 001 drives the wafers to sequentially move from each equipment connecting port to each connected semiconductor equipment so as to simulate the situation that the vacuum manipulator 001 drives the wafers to move to each station to execute actions in actual production. The cover 4 is used for closing the equipment connecting port corresponding to the unused equipment interconnecting structural member 2. The gate valve 3 is selectively installed to open or close the connection port of the equipment.
Specifically, in the present embodiment, the top end of the testing chamber 1 is open, and the testing chamber 1 is provided with an upper cover 5 for closing the top end of the testing chamber 1. An upper cover driving part 6 is arranged on the outer side of the testing chamber 1, one end of a swing arm 7 is fixedly connected to the upper cover 5, the other end of the swing arm 7 is connected with the output end of the upper cover driving part 6, and the input end of the upper cover driving part 6 is connected with a hand wheel 8. In this embodiment, the upper cover driving member 6 is a commercially available worm gear reducer with a self-locking function. The outside of upper cover driving piece 6 is equipped with stopper 9, has seted up spacing round pin shaft hole A901 on stopper 9, has seted up spacing round pin shaft hole B701 on swing arm 7. When the swing arm 7 swings to a designated position, in this embodiment, when the swing arm 7 drives the upper cover 5 to open ninety degrees, the limiting pin shaft hole a 901 corresponds to the limiting pin shaft hole B701, and the limiting pin shaft penetrates through the limiting pin shaft hole a 901 and the limiting pin shaft hole B701 at the same time, so that the swing arm 7 keeps fixed in position. A magnetic switch 10 for detecting the opening and closing state of the upper cover 5 is arranged between the testing chamber 1 and the upper cover 5, and the magnetic switch 10 is connected with an external control system. The magnetic switch 10 in this embodiment is a commercially available product.
Specifically, the wafer calibration assembly in this embodiment includes a wafer calibration assembly base 11, a wafer tray 12, a wafer calibration motor 13 and a wafer position detection correlation sensor, the wafer tray 12 is disposed on an upper side of the wafer calibration assembly base 11, the wafer calibration motor 13 is mounted on a bottom surface of the wafer calibration assembly base 11, the wafer calibration motor 13 drives the wafer tray 12 to rotate, a wafer calibration assembly base mounting port is formed in a bottom surface of the test chamber 1, the wafer calibration assembly base 11 is connected with the wafer calibration assembly base mounting port, the wafer tray 12 extends into the test chamber 1, and an encoding disc is disposed inside the wafer calibration motor 13. The wafer alignment motor 13 with the code disk therein in this embodiment is a commercially available product. The wafer tray 12 is used for carrying the wafer conveyed by the vacuum robot 001, and the wafer calibration motor 13 drives the wafer tray 12 to rotate. The wafer position detection correlation sensor can detect whether a notch exists on the edge of the wafer or not, detect the center of the wafer, transmit the deviation condition of the wafer to the manipulator control system in an RS232 communication mode, and the vacuum manipulator 001 adjusts the wafer taking position according to the information to realize the deviation rectifying function.
The wafer position detection correlation sensor is divided into a wafer position detection correlation sensor transmitting end 1401 and a wafer position detection correlation sensor receiving end 1402, the wafer position detection correlation sensor transmitting end 1401 and the wafer position detection correlation sensor receiving end 1402 are respectively arranged on a wafer calibration assembly base 11 and a test chamber 1 outside a wafer tray 12, light passing openings A for passing correlation detection light of the wafer position detection correlation sensor are respectively arranged on the wafer calibration assembly base 11 and the test chamber 1, the correlation detection light of the wafer position detection correlation sensor is parallel to the axial center line of the wafer tray 12, and the wafer position detection correlation sensor, the wafer calibration motor 13 and the code disc are respectively connected with an external control system. The wafer position detection correlation sensor in the embodiment is a commercially available product.
Specifically, in this embodiment, a manipulator extension in-place detection sensor is disposed at a position, close to each device connection port, of the test chamber 1, and each manipulator extension in-place detection sensor is connected to an external control system. In this embodiment, the manipulator extending-out in-place detection sensors are commercially available return reflection type sensors, and are divided into a manipulator extending-out in-place detection sensor main body 1501 and a manipulator extending-out in-place detection sensor reflector 1502 which are correspondingly arranged up and down, each manipulator extending-out in-place detection sensor reflector 1502 is mounted on the upper cover 5, each manipulator extending-out in-place detection sensor main body 1501 is mounted on the bottom surface of the test chamber 1, and the upper cover 5 and the test chamber 1 are respectively provided with a light passing hole C for the manipulator extending-out in-place detection sensor to pass through. The manipulator stretches out the setting of target in place detection sensor for whether detect vacuum manipulator 001 corresponds each equipment of equipment connector connection, also correspond and stretch out on the station.
Specifically, in this embodiment, a wafer through hole communicated with an adjacent device connection port of the test chamber 1 is formed in the inner side of each device interconnection structure 2, an AWC sensor is arranged on each device interconnection structure 2, and each AWC sensor is connected to an external control system. In this embodiment, each device interconnection structure 2 is provided with two groups of AWC sensors, each group of AWC sensors is a retro-reflection sensor, and the two groups of AWC sensors are respectively used for detecting the edge of a wafer passing through a device connection port of an adjacent test chamber 1. In the embodiment, the AWC sensor is a commercially available retro-reflective sensor for implementing an AWC (Active wave Centering) function. When the vacuum manipulator 001 bears the wafer and runs to each device connected with each device connector, namely moves to each station to execute actions, two groups of AWC sensors positioned at two sides of a station running path are triggered due to shielding of the edge of the wafer, and the AWC sensors output digital quantity signals to instruct a control system to read configuration information (information such as motor coded disc values) of the AWC station and the vacuum manipulator 001, so that the deviation correcting function is realized through calculation. In the process, whether the wafer is displaced relative to the vacuum manipulator 001 in the wafer carrying process or not can be judged through calculation, and the operation stability of the vacuum manipulator 001 is indirectly tested.
The working principle is as follows:
connecting a vacuum manipulator with the test chamber 1, respectively connecting semiconductor related equipment such as FOUP box carrying equipment, a wafer position regulator and the like with each equipment connecting port according to an actual process production flow needing to be simulated to form each station, vacuumizing the test chamber 1 after the connection is finished through a vacuum pump, and simulating an actual semiconductor process environment.
When the vacuum manipulator 001 bears the wafer and runs to each station to execute actions, the AWC sensor on the equipment interconnection structural part 2 on the station running path is triggered due to shielding of the edge of the wafer, and the AWC sensor outputs a digital quantity signal to instruct a control system to read configuration information (information such as motor coded disc values) of the AWC station and the vacuum manipulator 001 for calculation and realization of a deviation rectifying function. In the process, whether the wafer is displaced relative to the vacuum manipulator 001 or not in the wafer carrying process can be judged through calculation, and the operation stability of the vacuum manipulator 001 is indirectly tested. The manipulator stretches out the setting of target in place detection sensor for whether detect vacuum manipulator 001 corresponds each equipment of equipment interface connection, also correspond and stretch out on the station promptly.
The wafer calibration assembly is used for realizing wafer flat position calibration. When the vacuum manipulator 001 places the wafer on the wafer tray 12, the wafer position detection correlation sensor can detect whether a notch exists on the edge of the wafer, detect the center of the wafer, transmit the deviation condition of the wafer to the manipulator control system in an RS232 communication mode, and the vacuum manipulator 001 adjusts the wafer taking position according to the information to realize the function of deviation correction so as to eliminate the influence on the performance test of the vacuum manipulator 001 caused by the defects of the wafer and the like. Given the limitations of AWC functionality during deskew testing of 4, 6, 8 inch or larger wafers commonly found in the semiconductor industry, the wafer alignment assembly will assume a major deskew role when facing 8 inch and above wafers.
After the vacuum manipulator 001 drives the wafer to perform at least one round of complete process flow simulation, the vacuum manipulator 001 drives the wafer to perform deviation correction through the wafer calibration assembly, and then the vacuum manipulator 001 drives the wafer again to perform at least one round of complete process flow so as to complete the performance test of the vacuum manipulator 001.
Claims (8)
1. The utility model provides a vacuum manipulator vacuum capability test equipment which characterized in that: the testing device comprises a testing chamber (1), wherein a vacuum manipulator connecting port used for connecting a vacuum manipulator is formed in the bottom surface of the testing chamber (1), a plurality of equipment connecting ports are formed in the outer peripheral surface of the testing chamber (1), equipment interconnection structural members (2) or gate valves (3) are mounted on the outer peripheral surface of the testing chamber (1) corresponding to each equipment connecting port, and one end, far away from the testing chamber (1), of each equipment interconnection structural member (2) is connected with external equipment or a sealing cover (4); and a wafer calibration component is arranged on the testing chamber (1) close to one of the equipment connecting ports.
2. The vacuum robot vacuum performance test apparatus of claim 1, wherein: the testing device is characterized in that the top end of the testing chamber (1) is opened, and an upper cover (5) used for sealing the top end opening of the testing chamber (1) is arranged on the testing chamber (1).
3. The vacuum robot vacuum performance test apparatus of claim 2, wherein: the outside of test chamber (1) is equipped with upper cover driving piece (6), the rigid coupling has the one end of swing arm (7) on upper cover (5), the other end of swing arm (7) with the output of upper cover driving piece (6) is connected, the input of upper cover driving piece (6) is connected with hand wheel (8).
4. The vacuum robot vacuum performance testing apparatus of claim 3, wherein: a limiting block (9) is arranged on the outer side of the upper cover driving piece (6), a limiting pin shaft hole A (901) is formed in the limiting block (9), and a limiting pin shaft hole B (701) is formed in the swinging arm (7); when the swing arm (7) swings to a specified position, the limiting pin shaft hole A (901) corresponds to the limiting pin shaft hole B (701), and the limiting pin shaft hole A (901) and the limiting pin shaft hole B (701) are simultaneously penetrated through a limiting pin shaft, so that the swing arm (7) keeps fixed in position.
5. The vacuum robot vacuum performance testing apparatus of claim 2, wherein: a magnetic switch (10) used for detecting the opening and closing state of the upper cover (5) is arranged between the testing chamber (1) and the upper cover (5), and the magnetic switch (10) is connected with an external control system.
6. The vacuum robot vacuum performance test apparatus of claim 1, wherein: the wafer calibration assembly comprises a wafer calibration assembly base (11), a wafer tray (12), a wafer calibration motor (13) and a wafer position detection correlation sensor, wherein the wafer tray (12) is arranged on the upper side of the wafer calibration assembly base (11), the wafer calibration motor (13) is installed on the bottom surface of the wafer calibration assembly base (11), the wafer calibration motor (13) drives the wafer tray (12) to rotate, a wafer calibration assembly base installation port is formed in the bottom surface of the test chamber (1), the wafer calibration assembly base (11) is connected with the wafer calibration assembly base installation port, the wafer tray (12) extends into the test chamber (1), and an encoding disc is arranged inside the wafer calibration motor (13);
the wafer position detection correlation sensor comprises a wafer position detection correlation sensor transmitting end (1401) and a wafer position detection correlation sensor receiving end (1402), the wafer position detection correlation sensor transmitting end (1401) and the wafer position detection correlation sensor receiving end (1402) are respectively arranged on a wafer calibration assembly base (11) and a test chamber (1) on the outer side of a wafer tray (12), light penetrating openings A for penetrating correlation detection light of the wafer position detection correlation sensor are formed in the wafer calibration assembly base (11) and the test chamber (1), the correlation detection light of the wafer position detection correlation sensor is parallel to the axial center line of the wafer tray (12), and the wafer position detection correlation sensor, a wafer calibration motor (13) and a coding disc are respectively connected with an external control system.
7. The vacuum robot vacuum performance test apparatus of claim 1, wherein: and manipulator in-place extending detection sensors are arranged on the test chamber (1) close to each equipment connecting port, and are respectively connected with an external control system.
8. The vacuum robot vacuum performance test apparatus of claim 1, wherein: the inner side of each equipment interconnection structure (2) is provided with a wafer through hole communicated with an adjacent equipment connecting hole of the test chamber (1), each equipment interconnection structure (2) is provided with an AWC sensor, and each AWC sensor is connected with an external control system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211576987.2A CN115570587A (en) | 2022-12-09 | 2022-12-09 | Vacuum manipulator vacuum performance test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211576987.2A CN115570587A (en) | 2022-12-09 | 2022-12-09 | Vacuum manipulator vacuum performance test equipment |
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| Publication Number | Publication Date |
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| CN115570587A true CN115570587A (en) | 2023-01-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211576987.2A Pending CN115570587A (en) | 2022-12-09 | 2022-12-09 | Vacuum manipulator vacuum performance test equipment |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105655277A (en) * | 2014-11-12 | 2016-06-08 | 沈阳新松机器人自动化股份有限公司 | Positioning aligner |
| CN109240043A (en) * | 2018-09-20 | 2019-01-18 | 深圳市矽电半导体设备有限公司 | Automatic litho machine |
| CN109283807A (en) * | 2018-09-20 | 2019-01-29 | 深圳市矽电半导体设备有限公司 | Wafer calibration device and the litho machine for applying it |
| US20220059383A1 (en) * | 2020-06-30 | 2022-02-24 | Brooks Automation, Inc. | Automated teach apparatus for robotic systems and method therefor |
-
2022
- 2022-12-09 CN CN202211576987.2A patent/CN115570587A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105655277A (en) * | 2014-11-12 | 2016-06-08 | 沈阳新松机器人自动化股份有限公司 | Positioning aligner |
| CN109240043A (en) * | 2018-09-20 | 2019-01-18 | 深圳市矽电半导体设备有限公司 | Automatic litho machine |
| CN109283807A (en) * | 2018-09-20 | 2019-01-29 | 深圳市矽电半导体设备有限公司 | Wafer calibration device and the litho machine for applying it |
| US20220059383A1 (en) * | 2020-06-30 | 2022-02-24 | Brooks Automation, Inc. | Automated teach apparatus for robotic systems and method therefor |
Non-Patent Citations (1)
| Title |
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| 李学威，等: "300mm硅片高精度真空传输***设计", 《组合机床与自动化加工技术》 * |
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Application publication date: 20230106 |
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