CN115551268A - Electronic component, voltage regulation module and voltage stabilizing device - Google Patents

Abstract

The application discloses an electronic component, a voltage regulating module and a voltage stabilizing device, wherein the electronic component comprises a substrate, a first surface and a second surface which are arranged oppositely; a first electronic element embedded in the substrate and provided with a first electrical connection terminal communicated with the first surface of the substrate and a second electrical connection terminal communicated with the second surface; the second electronic element is arranged on the second surface of the substrate and is electrically connected with the second electric connection terminal; the second electronic element and the substrate are stacked in a first direction, and the first direction intersects with both the first surface and the second surface of the substrate. Through the mode, the electronic assembly can be provided, the second electronic element and the first electronic element are stacked in the first direction, and therefore the occupied area of the first electronic element and the second electronic element in the second direction intersecting with the first direction is reduced.

Description

Electronic component, voltage regulation module and voltage stabilizing device

Technical Field

The present disclosure relates to electronic component manufacturing technologies, and particularly to an electronic component, a voltage regulating module, and a voltage regulator.

Background

With the mass application of electronic components, people prefer thinner electronic component products, and therefore, the arrangement and planning of the components of the electronic component are paid more and more attention.

Generally, when a plurality of electronic components exist simultaneously, the plurality of electronic components are often tiled on the same plane, and the electronic components are spaced by a corresponding distance, so that wires can be clearly arranged among the electronic components, and the electronic components can be matched with each other to work.

Therefore, through long-term research, the inventor of the present application finds that, in the related art, generally, a plurality of electronic components are laid on the same layer, which often makes the area occupied by the electronic components on the same layer larger, and is not favorable for planning and arranging the electronic components.

Disclosure of Invention

The application provides an electronic component, a voltage regulating module and a voltage stabilizing device, which are used for solving the problems of the electronic component in the prior art.

In order to solve the above technical problem, a first technical solution adopted by the present application provides an electronic component, including: the substrate is provided with a first surface and a second surface which are opposite; a first electronic element embedded in the substrate and provided with a first electrical connection terminal communicated with the first surface of the substrate and a second electrical connection terminal communicated with the second surface; the second electronic element is arranged on the second surface of the substrate and is electrically connected with the second electric connection terminal; the second electronic element and the first electronic element are stacked in a first direction, and the first direction is intersected with the first surface and the second surface of the substrate.

Therefore, the present application can provide an electronic component in which a second electronic element is stacked with a first electronic element in a first direction, thereby reducing an area occupied by the first electronic element and the second electronic element in a second direction intersecting the first direction.

The first electronic element of the electronic component is a passive electronic element, and the second electronic element comprises an active electronic element.

The first electronic element of the electronic component is an inductance element, and the second electronic element comprises a switch element.

The substrate of the electronic component is internally provided with a containing groove, and the first electronic element is arranged in the containing groove and is electrically connected with the outside through the first electric connecting terminal.

The first surface of the substrate of the electronic component is provided with a first conductive layer, the second surface of the substrate is provided with a second conductive layer, the substrate is also provided with a first conductive hole communicated with the first conductive layer and a second conductive hole communicated with the second conductive layer, the first electric connection terminal is connected to the first conductive layer through the first conductive hole, and the second electric connection terminal is connected to the second conductive layer through the second conductive hole.

In some embodiments, the first electrical connection terminal and the second electrical connection terminal of the electronic assembly are respectively disposed on the first surface and the second surface of the first electronic component, the first surface and the second surface of the first electronic component are two opposite surfaces in the first direction, and one end of the first conductive hole in the first direction is opened and electrically connected to the first electrical connection terminal; the second conductive hole is formed at the other end along the first direction and is electrically connected with the second electric connection terminal.

In other embodiments, the first electrical connection terminal and the second electrical connection terminal of the electronic assembly are respectively led out from a third surface and a fourth surface of the first electronic element, the first surface and the second surface of the first electronic element are two side surfaces opposite to each other in a second direction, the second direction is intersected with the first direction, and one end of the first conductive hole along the first direction is provided and electrically connected with the first electrical connection terminal; the second conductive hole is formed at the other end along the first direction and is electrically connected with the second electric connection terminal.

The substrate of the electronic assembly is internally provided with a first through hole and a second through hole, the first electric connection terminal is connected to the first conductive hole through the first through hole, and the second electric connection terminal is connected to the second conductive hole through the second through hole.

The first through hole and the second through hole of the electronic component are arranged at one end of the first electronic element along the second direction and the other end of the first electronic element along the second direction, the first electric connection terminal is connected to the first conductive hole through the first through hole, and the second electric connection terminal is connected to the second conductive hole through the second through hole; wherein, the distance between the first through hole and the first electronic component is greater than or equal to 200um.

In order to solve the above technical problem, another technical solution adopted by the present application is to provide a voltage regulation module, including: the electronic component comprises a circuit board, a conductive pattern layer and an electronic component, wherein the surface of the circuit board is provided with the conductive pattern layer, the electronic component is arranged on the circuit board and is electrically connected with the conductive pattern layer of the circuit board, and the electronic component is provided by the first technical scheme; the second electronic element, the first electronic element and the circuit board are sequentially stacked in a first direction, and the first direction is intersected with the first surface and the second surface of the substrate.

A groove is formed in one side, close to the first surface, of the circuit board of the voltage adjusting module, and the groove is used for partially accommodating the substrate.

The surface of the bottom of the groove of the voltage regulating module is provided with a conductive pattern layer which is used for being electrically connected with the first electric connection terminal.

In order to solve the above technical problem, another technical solution adopted by the present application is to further provide a voltage regulator device, where the voltage regulator device includes the above electronic component.

The beneficial effect of this application is: different from the prior art, the electronic assembly can be provided, and the second electronic element and the first electronic element are stacked in the first direction, so that the area of the first electronic element and the area of the second electronic element in the second direction intersecting with the first direction are reduced, and the heat dissipation efficiency of the second electronic element is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of an electronic assembly according to an embodiment of the present application;

FIG. 2 is a schematic diagram of an embodiment of the electronic assembly of FIG. 1;

FIG. 3 is a schematic diagram of another embodiment of the electronic assembly of FIG. 1;

FIG. 4 is a schematic structural diagram of an electronic assembly in another embodiment of the present application;

FIG. 5 is a schematic view of an embodiment of the substrate shown in FIG. 1;

FIG. 6 is a schematic view of a specific structure of the substrate of FIG. 5 with blind vias formed therein;

FIG. 7 is another detailed schematic view of the internal components of the substrate of FIG. 5;

FIG. 8 is a schematic view of an embodiment of the substrate of FIG. 7 with through holes;

FIG. 9 is a schematic diagram of a voltage regulation module in another embodiment of the present application;

FIG. 10 is a schematic diagram of a specific structure of the voltage regulation module of FIG. 9;

fig. 11 is a schematic structural diagram of a voltage regulator device according to still another embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Moreover, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic component in an embodiment of the present application, and a first technical solution adopted in the present application provides an electronic component 100, where the electronic component 100 includes: the electronic device comprises a substrate 11, a first electronic element 14 and a second electronic element 2, wherein the first electronic element 14 is embedded in the substrate 11, an electric connecting terminal 15 is arranged on the first electronic element 14, and the first electronic element 14 in the substrate 11 is electrically connected with the second electronic element 2 through the electric connecting terminal 15.

The substrate 11 is a package and is provided with a first surface 12 and a second surface 13 opposite to each other, and a first direction AB is further provided according to the first surface 12 and the second surface 13 opposite to each other, where the first direction AB may be a longitudinal direction common to those skilled in the art or other directions specifically provided as required, where a is one end of the first direction AB, and B is the other end of the first direction AB, so as to provide a direction division basis for determining the arrangement and planning of the components of the electronic component 100.

The first electronic component 14 is embedded in the substrate 11 and has a first electrical connection terminal 151 connected to the first surface 12 of the substrate 11 and a second electrical connection terminal 152 connected to the second surface 13. On the one hand, the first electronic component 14 may be embedded in the substrate 11, which is conventional, and then the second electronic component 2 and the external circuit outside the electronic assembly 100 are electrically connected by filling the medium and then exposing the electrical connection terminals 15; on the other hand, the first electronic component 14 may be embedded by filling a part of the medium in the substrate, then adjusting the position of the first electronic component 14 in the substrate through the electrical connection terminal 15, so that the first electronic component 14 can be smoothly embedded in the substrate 11, then filling the medium on the first electronic component 14, and then exposing the electrical connection terminal 15 to achieve electrical connection between the second electronic component 2 and an external circuit outside the electronic assembly 100, and of course, those skilled in the art may also embed the first electronic component 14 in the substrate 11 by using an embedding method commonly used in the art, which is not limited herein.

A second electronic component 2 of the electronic assembly 100, arranged on the second surface 13 of the substrate 11 and electrically connected to the second electrical connection terminal 152; the second electronic component 2 may be electrically connected to the first electronic component 14 through the second electrical connection terminal 152 exposed out of the second surface 13 of the substrate 11, or may be electrically connected to the second electronic component 2 through the second electrical connection terminal 152 of the first electronic component 14 by electrically connecting conductive solder to the second surface 13 of the substrate 11, or may be provided according to other specific situations, which is not limited herein.

The second electronic component 2 and the substrate 11 are stacked in a first direction AB, and the first direction AB intersects with both the first surface 12 and the second surface 13 of the substrate 11, and for easier understanding and drawing, the first direction AB is drawn to intersect with both the first surface 12 and the second surface 13 perpendicularly, and of course, the first direction AB may also be set by intersecting with both the first surface 12 and the second surface 13 of the substrate 11, and does not need to intersect perpendicularly, and the present disclosure is not limited thereto.

Therefore, the present application can provide an electronic assembly 100, in which the second electronic element 2 and the first electronic element 14 are stacked in the first direction AB, so as to reduce the area of the first electronic element 14 and the second electronic element 2 in the second direction intersecting the first direction AB, and further to make the second electronic element 2 away from other circuit devices except the electronic assembly 100, so as to improve the heat dissipation efficiency of the second electronic element 2.

Further, referring to fig. 2, fig. 2 is a schematic structural diagram of the electronic component shown in fig. 1; the first electronic component 14 of the electronic assembly 100 is a passive electronic component 141 and the second electronic component 2 comprises an active electronic component 21.

Specifically, the substrate 11 is a package body, and has a thickness of 2 to 4mm, such as 2mm, 3mm, or 4mm, and the substrate 11 is provided with a first surface 12 and a second surface 13 opposite to each other. The passive electronic element 141 is embedded in the substrate 11, and has a first electrical connection terminal 151 connected to the first surface 12 of the substrate 11 and a second electrical connection terminal 152 connected to the second surface 13. And the active electronic element 21 is arranged on the second surface 13 of the substrate 11 and is electrically connected with the second electric connecting terminal 152.

Therefore, the present application can provide an electronic assembly 100, in which the passive electronic element 141 is embedded in the substrate 11, the passive electronic element 141 is electrically connected to the active electronic element 21 and is electrically connected to other circuits outside the electronic assembly 100 through the electrical connection terminal 15, and the active electronic element 21 and the substrate 11 are stacked in the first direction AB, so as to reduce the area of the substrate 11 and the active electronic element 21 in the second direction perpendicular to and intersecting the first direction AB, and further to keep the active electronic element 21 away from other circuit devices outside the electronic assembly 100, so as to improve the heat dissipation efficiency of the active electronic element 21.

Further, referring to fig. 3, fig. 3 is another specific structural diagram of the electronic component in fig. 1; the first electronic component 14 of the electronic assembly 100 may be an inductive component 1411, and the second electronic component 2 includes a switching component 211.

Specifically, the substrate 11 is a package and has a first surface 12 and a second surface 13 opposite to each other. The inductance element 1411 is embedded in the substrate 11 and has a first electrical connection terminal 151 connected to the first surface 12 of the substrate 11 and a second electrical connection terminal 152 connected to the second surface 13. And a switching element 211 disposed on the second surface 13 of the substrate 11 and electrically connected to the second electrical connection terminal 152.

Therefore, the present application can provide an electronic assembly 100, where the inductance element 1411 is embedded in the substrate 11, the inductance element 1411 is electrically connected to the switch element 211 and is electrically connected to other circuits outside the electronic assembly 100 through the electrical connection terminal 15, and the switch element 211 and the first electronic element 14 are stacked in the first direction AB, so as to reduce the area and the size of the first electronic element 14 and the switch element 211 in the second direction perpendicular to and intersecting the first direction AB, and further to keep the switch element 211 away from other circuit devices outside the electronic assembly 100, so as to improve the heat dissipation efficiency of the switch element 211.

The first electronic component embedded in the substrate 11 may be an inductance component 1411, a capacitance component, a resistance component, and other components, which are specifically selected as needed and are not limited herein. If the inductive element 1411 is used, the electronic component can be used as a part of a voltage regulator and also as an energy storage element. The selected inductance element may be a choke inductance on one hand, and may also be a patch inductance on the other hand, which is not limited herein. The application of the inductor will be described in detail when the electronic components constitute a voltage regulation module.

In addition, the first electronic component disposed on the substrate 11 in the first direction AB may be a switching element 211, such as a triode, a MOS transistor, or other semiconductor component products, and is specifically selected according to the needs and is not limited herein.

Further, referring to fig. 4, fig. 4 is another specific structural diagram of the electronic component in fig. 1; the substrate 11 of the electronic assembly 100 is provided with a receiving cavity 142 therein, and the first electronic component 14 is disposed in the receiving cavity 142 and electrically connected to the outside through a first electrical connection terminal 151. When the first electronic component 14 is disposed in the receiving groove 142, the first electronic component 14 can be quickly embedded in the substrate 11 through the receiving groove 142 and can be smoothly disposed in the substrate 11.

A first electrical connection terminal 151 of the first electronic component 14 is led out at one end of the accommodating groove 142 in the first direction AB, so that the first electrical connection terminal 151 is electrically connected to an external circuit; the second electrical connection terminal 152 of the first electronic component 14 is led out from the other end of the accommodating groove 142 in the first direction AB, so that the second electrical connection terminal 152 is electrically connected with the second electronic component 2.

Specifically, the electrical connection terminal 15 can lead out the electrical connection terminal 15 of the first electronic component 14 to or through the first surface 12 and the second surface 13 of the substrate 11 through the surface of the receiving groove 142, and can lead out the electrical connection terminal 15 of the first electronic component 14 to or from the first surface 12 and the second surface 13 of the substrate 11 through the surface of the receiving groove 142 from the inside of the receiving groove 142, so that the electrical connection terminal 15 has multiple lead-out methods, and can be selected as needed, which is not limited herein.

Further, referring to fig. 5, fig. 5 is a schematic structural diagram of the substrate shown in fig. 1; the first surface 12 of the substrate 11 of the electronic component 100 is provided with a first conductive layer 161, and the first conductive layer 161 may be a whole metal layer such as a copper layer, an aluminum layer, or a gold layer, or may be a metal layer with a conductive pattern. The second conductive layer 162 is disposed on the second surface 13 of the substrate, and the second conductive layer 162 may be a whole metal layer such as a copper layer, an aluminum layer, a gold layer, or the like, or a metal layer with a conductive pattern, specifically, for example, when an active electronic component is placed on the second surface 13, the second conductive layer 162 may be a whole metal layer; and when more than one active electronic component is placed on the second surface 13, the second conductive layer 162 may be a patterned layer.

In addition, the substrate 11 is further provided with a first conductive hole 171 communicating with the first conductive layer 161, and a second conductive hole 172 communicating with the second conductive layer 162, the first electrical connection terminal 151 being connected to the first conductive layer 161 through the first conductive hole 171, and the second electrical connection terminal 152 being connected to the second conductive layer 162 through the second conductive hole 172.

Specifically, referring to fig. 6, fig. 6 is a schematic view of a specific structure when blind holes are disposed in the substrate in fig. 5, in the embodiment of fig. 6, the first conductive hole is a first blind hole 1711, and the second conductive hole is a first blind hole 1711, that is, the substrate 11 is provided with a first blind hole 1711 connected to the first conductive layer 161 and a second blind hole 1721 connected to the second conductive layer 162. The first electrical connection terminal 151 is connected to the first conductive layer 161 through a first blind via 1711, and the second electrical connection terminal 152 is connected to the second conductive layer 162 through a second blind via 1721.

As shown in fig. 6, the cross sections of the first blind hole 1711 and the second blind hole 1721 may be respectively disposed on the first surface and the second surface of the first electronic component 14 along the first direction AB, and are in a ladder shape, specifically, the first blind hole 1711 is in a ladder shape with a large upper bottom and a small lower bottom, and is disposed on the first surface of the first electronic component 14, and may be completely disposed opposite to the first electrical connection terminal 151, or may be partially disposed opposite to the first electrical connection terminal 151, so as to be electrically connected to the first electrical connection terminal 151; the second blind hole 1721 is in a trapezoid shape with a large upper bottom and a small lower bottom, is disposed on the second surface of the first electronic component 14, and can be completely disposed opposite to the second electrical connection terminal 152, or partially disposed opposite to the second electrical connection terminal 152 to be electrically connected to the first electrical connection terminal 151. Of course, the cross-sectional shapes of the first blind hole 1711 and the second blind hole 1721 may also be other shapes, for example, as shown in fig. 5, the cross-sectional shapes of the first blind hole 1711 and the second blind hole 1721 may also be rectangular or square, and the sizes and the shapes of the first blind hole 1711 and the second blind hole 1721 may be the same or different, and are specifically selected as needed and are not limited herein.

In some embodiments, the first electrical connection terminal 151 and the second electrical connection terminal 152 of the electronic assembly 100 may be respectively disposed on a first surface and a second surface of the first electronic element 14, the first surface and the second surface of the first electronic element 14 are two opposite surfaces in the first direction AB, that is, the first electrical connection terminal 151 of the electronic assembly 100 is disposed on a first surface of one end a of the first electronic element 14 along the first direction AB, and the second electrical connection terminal 152 of the electronic assembly 100 is disposed on a second surface of the other end B of the first electronic element 14 along the first direction AB.

The first surface may be the first surface 12, or a surface intersecting the first surface 12, and the second surface may be the second surface 13, or a surface intersecting the second surface 13, which is specifically selected as needed and is not limited herein.

Specifically, when the first direction AB is a longitudinal direction, the first electrical connection terminal 151 of the electronic component 100 may be disposed on a perpendicular to the first face of the first electronic element 14 in the longitudinal direction and within the substrate 11, and the second electrical connection terminal 152 of the electronic component 100 is disposed on a perpendicular to the second face of the first electronic element 14 in the longitudinal direction and within the substrate 11.

Of course, the electrical connection terminal 15 does not necessarily have to be perpendicular to the first surface and the second surface, and the first electrical connection terminal 151 may intersect with the first surface, and the second electrical connection terminal 152 may intersect with the second surface.

The first conductive hole 171 and the second conductive hole 172 are opened along the first direction AB and electrically connected to the first electrical connection terminal 151 and the second electrical connection terminal 152, respectively. That is, one end a of the first conductive hole 171 in the first direction AB is opened and electrically connected to the first electrical connection terminal 151; the second conductive hole 172 opens along the other end B of the first direction AB and is electrically connected to the second electrical connection terminal 152.

In this way, when the first direction AB is a longitudinal direction, the first conductive hole 171 is opened along the inside of the substrate 11 at a lower portion in the longitudinal direction, so that the first conductive hole 171 is electrically connected to the first electrical connection terminal 151 at a lower end of the first electronic component 14 at the lower portion in the longitudinal direction; the second conductive via 172 is formed along the interior of the substrate 11 in the longitudinal direction, so that the second conductive via 172 is electrically connected to the second electrical connection terminal 152 at the upper end of the first electronic component 14 in the longitudinal direction.

In addition to the structure diagrams of fig. 5 and fig. 6, please refer to fig. 7, fig. 7 is another specific structure diagram of each component inside the substrate, and discloses another structure and connection manner for connecting the electric connection terminal 15 with the conductive hole 17; and is disposed in a second direction CD intersecting the first direction AB, as shown in fig. 7. The first electrical connection terminal 151 and the second electrical connection terminal 152 of the electronic assembly 100 are respectively led out from the third surface and the fourth surface of the first electronic element, and the first surface and the second surface of the first electronic element 14 are two opposite side surfaces in the second direction CD. That is, the first electrical connection terminal 151 of the electronic component 100 is led out along the third face of one end D of the second direction CD, and the second electrical connection terminal 152 of the electronic component 100 is led out along the fourth face of the other end C of the second direction CD.

The third surface may be a surface perpendicularly intersecting with the first surface 12, a surface perpendicularly intersecting with the first surface, a surface intersecting with the first surface, and a fourth surface may be a surface perpendicularly intersecting with the second surface 13, a surface perpendicularly intersecting with the second surface, and a surface intersecting with the second surface, and is specifically selected as needed and not limited herein.

Specifically, when the second direction CD is expressed as a lateral direction, the first electrical connection terminal 151 of the electronic component 100 may be disposed on a perpendicular to third face of the first electronic element 14 in the lateral direction and within the substrate 11, and the second electrical connection terminal 152 of the electronic component 100 is disposed on a perpendicular to second face of the first electronic element 14 in the lateral direction and within the substrate 11.

Of course, the electrical connection terminal 15 is not necessarily provided perpendicularly on the third surface and the fourth surface, and the first electrical connection terminal 151 may intersect the third surface, and the second electrical connection terminal 152 may intersect the fourth surface.

Specifically, the second direction CD may be perpendicular to the first direction AB, and the first and second conductive holes 171 and 172 may be opened along the first direction AB and electrically connected to the first and second electrical connection terminals 151 and 152, respectively. That is, one end a of the first conductive hole 171 along the first direction AB is opened and electrically connected to the first electrical connection terminal 151; the second conductive hole 172 is opened at the other end B along the first direction AB and electrically connected to the second electrical connection terminal 152.

In this way, when the first direction AB is a longitudinal direction and the second direction CD is a transverse direction, the first conductive hole 171 is opened along the inside of the substrate 11 below the longitudinal direction, so that the first conductive hole 171 is electrically connected to the first electrical connection terminal 151 at the lower end of the first electronic component 14 below the longitudinal direction; the second conductive via 172 is formed along the interior of the substrate 11 in the longitudinal direction, so that the second conductive via 172 is electrically connected to the second electrical connection terminal 152 at the upper end of the first electronic component 14 in the longitudinal direction.

Further, referring to fig. 8, fig. 8 is a schematic view of a specific structure of the substrate in fig. 7 having a through hole therein, a first through hole 181 and a second through hole 182 are disposed in the substrate 11, the first through hole 181 and the second through hole 182 are opened along a first direction AB, and the first electrical connection terminal 151 and the second electrical connection terminal 152 are electrically connected to the first electrical connection terminal 151 and the second electrical connection terminal 152 through the first through hole 181 and the second through hole 182, respectively.

Specifically, on the one hand, the first through hole 181 may be opened along one end a near the first direction AB, the second through hole 182 may be opened along the other end B near the first direction AB, the first electrical connection terminal 151 is connected to the first conductive hole 171 through the first through hole 181, and the second electrical connection terminal 152 is connected to the second conductive hole 172 through the second through hole 182.

In order to connect the electrical connection terminal 15 to the first surface 12 or the second surface 13 of the substrate 11 through the through hole 18 and the conductive via 17, a conductive metal layer or a conductive pattern layer on the single-sided conductive substrate 11 is formed. The first via 181 may be electrically connected to the first surface 12 on the substrate 11 by connecting the first conductive via 171, but the first via 181 does not penetrate through the substrate 11, so that the first via 181 is in single-sided conduction with the first surface 12; similarly, the second via 182 may be electrically connected to the second surface 13 on the substrate 11 by connecting the second conductive via 172, but the second via 182 does not penetrate through the substrate 11, so that the second via 182 is in single-sided conduction with the second surface 13.

In addition, on the other hand, the first through hole 181 and the second through hole 182 may be further provided at one end D in the second direction CD of the first electronic component 14 and the other end C in the second direction CD of the first electronic component 14, the first electrical connection terminal 151 is connected to the first conductive hole 171 through the first through hole 181, and the second electrical connection terminal 152 is connected to the second conductive hole 172 through the second through hole 182.

In order to better place the electrical connection terminal 15 of the first electronic component 14, the first electrical connection terminal 151 and the second electrical connection terminal 152 are exposed outside the first electronic component 14, and are at least higher than the surface 100um of the first electronic component 14, for example, higher than the surface 100um to 120um of the first electronic component 14, and the distance between the first through hole 181 and the second through hole 182 and the first electronic component 14 is greater than or equal to 200um, so that the first electrical connection terminal 151 and the first through hole 181 can be electrically connected by soldering tin, and the second electrical connection terminal 152 and the second through hole 182 can be electrically connected by soldering tin spot connection.

Further, to solve the above technical problem, another technical solution adopted by the present application is to provide a voltage regulation module, please refer to fig. 9, fig. 9 is a schematic structural diagram of the voltage regulation module in another embodiment of the present application; the voltage regulating module 200 includes a circuit board 3 and the electronic component 100 as described above, wherein the electronic component 100 is electrically connected to the circuit board 3.

Specifically, the surface of the circuit board 3 is provided with a conductive pattern layer 31, and the conductive pattern layer 31 is electrically connected to the electronic component 100 through the electrical connection terminal 15. Thus, the electronic component 100 is disposed on the circuit board 3 and electrically connected to the conductive pattern layer 31 of the circuit board 3, and the electronic component 100 may be an electronic component as described above.

The second electronic element 2, the first electronic element 14 and the circuit board 3 are stacked in sequence in a first direction AB, and the first direction AB intersects with both the first surface 12 and the second surface 13 of the substrate 11. Specifically, as shown in fig. 8, the first direction AB may perpendicularly intersect both the first surface 12 and the second surface 13 of the substrate 11.

Therefore, the present application can provide a voltage regulation module 200, in which the second electronic element 2, the first electronic element 14 and the circuit board 3 are sequentially stacked in the first direction AB, so as to reduce the area and the size of the second electronic element 2, the first electronic element 14 and the circuit board 3 in the second direction CD intersecting the first direction AB, and further to make the second electronic element 2 away from other circuit devices except the electronic component 100, for example, to make the second electronic element 2 away from the circuit board 3, so as to improve the heat dissipation efficiency of the second electronic element 2.

Further, referring to fig. 10, fig. 10 is a schematic structural diagram of the voltage regulation module in fig. 9; the circuit board 3 is provided with a recess 32 on a side thereof adjacent to the first surface 12, and the recess 32 may be used to partially receive the substrate 11. Specifically, the bottom surface of the groove 32 is provided with a conductive pattern layer 31 that can be used for electrical connection with the first electrical connection terminal 151.

When there are multiple electronic components 100, the multiple electronic components 100 may be all disposed on the circuit board 3, the groove 32 disposed on the circuit board 3 may be used to partially accommodate the substrate 11 of one electronic component 100, or partially accommodate the substrates 11 of the multiple electronic components 100 in the circuit board 3, or partially accommodate the substrates 11 of all the electronic components 100 in the circuit board 3, which is specifically selected according to the needs, and is not limited herein.

Specifically, the first electronic component 14 of the electronic assembly 100 may be an inductive component, and the second electronic component 2 includes a switching component. When the electronic component 100 is used as an inductor to form the voltage regulating module 200, the inductor element may be a part of the electronic component 100 used as the voltage regulating module 200, and may also be used as an energy storage element. When used as the voltage regulating module 200, the selected inductive element may be a choke inductor on one hand and a patch inductor on the other hand.

When the inductance element is a choke inductance, the inductance element is integrally formed and is a packaged shielding inductance. When the voltage regulating module 200 is electrically connected to an external power source and a load and the voltage across the load decreases, the external power source charges the choke inductor through the switching element, so that the load reaches a desired rated voltage. When the voltage across the load to which the voltage regulation module 200 is electrically connected rises, the choke inductance is disconnected from the external power supply by the switching action of the switching element, so as to release energy and continue to supply power to the load.

When the inductance element is a patch inductance, when the voltage regulation module 200 is electrically connected with an external power supply and a load, and the voltage at two ends of the load is reduced, the external power supply charges the patch inductance through the switch element, so that the load reaches the required rated voltage. When the voltage across the load to which the voltage regulation module 200 is electrically connected rises, the external power supply is enabled to supply power to disconnect the chip inductor through the switching action of the switching element, so as to release energy and continue to supply power to the load.

Based on the above-mentioned related technical solution, in the present application, when a chip including a transistor is exposed outside a Printed Circuit Board (PCB), the inductor 1411 is disposed above the inductor 1411, and a heat sink or a heat dissipation part is disposed on the chip, so as to solve the heat dissipation effect of the voltage regulation module 200, and although the thickness of the voltage regulation module 200 in the first direction AB is increased, the manufacturing area in the second direction CD is reduced, and considering that the blind via is limited by the dielectric thickness, the increased thickness of the voltage regulation module 200 in the first direction AB is beneficial to better disposing the blind via.

In the first direction AB, since the first electronic component 14 disposed on the substrate 11 may be an inductive component, and the inductive component may be provided with a switching component 211, such as a transistor, a MOS transistor, or other semiconductor component products, such as a capacitor or a PMIC, when the Circuit Board is a PCB motherboard, the first electronic component 14 is sunk into a Printed Circuit Board (PCB) motherboard, the PMIC, the resistor, and the capacitor are attached to the inductive unit, and heat dissipation is performed on the outer surface of the PMIC, the resistor, and the capacitor. If the PMIC is a plastic package, the PMIC does not need to be subjected to secondary plastic packaging.

In addition, for the power density U = P/S, since the area S in the first direction AB is reduced, if the power P of the voltage adjustment module 200 is not changed, the heat dissipation performance of the second electronic component 2 is improved because the power of the voltage adjustment module 200 is increased, that is, the on-off times in the Insulated Gate Bipolar Transistor (IGBT) in the second electronic component are increased, and the IGBT is a composite fully-controlled voltage-driven power semiconductor device composed of a Bipolar Junction Transistor (BJT) and an Insulated Gate field effect Transistor (MOS), which has both advantages, the power density of the voltage adjustment module 200 can be greatly improved, and the working performance of the voltage adjustment module 200 is improved, so that the voltage adjustment module has a wide application field in the fields of CPUs and GPUs.

To solve the above technical problem, another technical solution adopted by the present application is to provide a voltage regulator device 400, please refer to fig. 11, where fig. 11 is a schematic structural diagram of a voltage regulator device in another embodiment of the present application; the voltage stabilization device 400 includes the electronic component 100 described above.

The above embodiments are merely examples, and not intended to limit the scope of the present application, and all modifications, equivalents, and flow charts using the contents of the specification and drawings of the present application, or those directly or indirectly applied to other related arts, are included in the scope of the present application.

Claims (13)

1. An electronic assembly, comprising:

the substrate is provided with a first surface and a second surface which are opposite;

the first electronic element is embedded in the substrate and is provided with a first electric connecting terminal communicated with the first surface of the substrate and a second electric connecting terminal communicated with the second surface;

the second electronic element is arranged on the second surface of the substrate and is electrically connected with the second electric connection terminal;

the second electronic element and the first electronic element form a stack in a first direction, and the first direction intersects with both the first surface and the second surface of the substrate.

2. The electronic assembly of claim 1,

the first electronic component is a passive electronic component and the second electronic component includes an active electronic component.

3. The electronic component of claim 2,

the first electronic element is an inductance element, and the second electronic element comprises a switch element.

4. The electronic assembly of claim 1,

the substrate is internally provided with a containing groove, and the first electronic element is arranged in the containing groove and is electrically connected with the outside through the first electric connecting terminal.

5. The electronic component of claim 1,

the first surface of the substrate is provided with a first conducting layer, the second surface of the substrate is provided with a second conducting layer, the substrate is also provided with a first conducting hole communicated to the first conducting layer and a second conducting hole communicated to the second conducting layer, the first electric connecting terminal is connected to the first conducting layer through the first conducting hole, and the second electric connecting terminal is connected to the second conducting layer through the second conducting hole.

6. The electronic component of claim 5,

the first electric connecting terminal and the second electric connecting terminal are respectively arranged on a first surface and a second surface of the first electronic element, the first surface and the second surface of the first electronic element are two side surfaces which are opposite to each other in a first direction, and one end of the first conductive hole in the first direction is arranged and electrically connected with the first electric connecting terminal; the second conductive hole is formed at the other end in the first direction and is electrically connected with the second electric connection terminal.

7. The electronic assembly of claim 5,

the first electric connecting terminal and the second electric connecting terminal are respectively arranged on a third surface and a fourth surface of the first electronic element, the first surface and the second surface of the first electronic element are led out from two side surfaces opposite to each other in a second direction, the second direction is intersected with the first direction, and one end of the first conductive hole in the first direction is provided and electrically connected with the first electric connecting terminal; the second conductive hole is formed at the other end along the first direction and is electrically connected with the second electric connection terminal.

8. The electronic component of claim 7,

the substrate is internally provided with a first through hole and a second through hole, the first electric connection terminal is connected to the first conductive hole through the first through hole, and the second electric connection terminal is connected to the second conductive hole through the second through hole.

9. The electronic assembly of claim 8,

the first through hole and the second through hole are arranged at one end of the first electronic element along the second direction and the other end of the first electronic element along the second direction, the first electric connection terminal is connected to the first conductive hole through the first through hole, and the second electric connection terminal is connected to the second conductive hole through the second through hole;

wherein, the first through-hole and the second through-hole with first electronic component's distance is greater than or equal to 200um.

10. A voltage regulation module, comprising:

a circuit board, a conductive pattern layer is arranged on the surface of the circuit board,

and an electronic component disposed on the circuit board and electrically connected to the conductive pattern layer of the circuit board, the electronic component according to any one of claims 1 to 9;

the second electronic element, the first electronic element and the circuit board are sequentially stacked in a first direction, and the first direction intersects with both the first surface and the second surface of the substrate.

11. The voltage regulation module of claim 10, wherein a side of the circuit board proximate the first surface is provided with a recess for partially receiving the substrate.

12. The voltage regulation module of claim 11,

the surface of the bottom of the groove is provided with the conductive pattern layer which is used for being electrically connected with the first electric connection terminal.

13. A voltage regulator device characterized by comprising the electronic component set forth in any one of claims 1 to 9.

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