CN115547623A

CN115547623A - Conical inductor packaging structure and preparation method thereof

Info

Publication number: CN115547623A
Application number: CN202211146219.3A
Authority: CN
Inventors: 张超; 何林; 宋祥祎; 郭少丽
Original assignee: Forehope Electronic Ningbo Co Ltd
Current assignee: Forehope Electronic Ningbo Co Ltd
Priority date: 2022-09-20
Filing date: 2022-09-20
Publication date: 2022-12-30

Abstract

The embodiment of the invention provides a conical inductor packaging structure and a preparation method thereof, and relates to the technical field of semiconductor packaging. Meanwhile, the routing structure enables the volume of the conical inductance structure to be smaller, and the size of a final product to be smaller. And no end line is required to be reserved for square welding. More importantly, the height adjustment of the first rubber block and the second rubber block is used for controlling the included angle of the conical inductance module relative to the bearing chassis, so that the magnetic core and the bearing chassis are parallel or arranged at the included angle, the adjustment of signal strength and an isolation function is realized, and the applicability of the product is better.

Description

Conical inductor packaging structure and preparation method thereof

Technical Field

The invention relates to the technical field of semiconductor packaging, in particular to a conical inductor packaging structure and a preparation method thereof.

Background

With the development of the semiconductor industry, the micro tapered inductor has both wide bandwidth and high frequency performance, and thus is gradually applied to the fields of optical communication, bias circuits, amplification circuits, and the like. In a microwave radio frequency circuit, an inductor is usually required to be selected to isolate the radio frequency circuit from a direct current power supply circuit, so as to prevent mutual interference between signals, meanwhile, the microwave radio frequency circuit has the characteristics of wide bandwidth and high frequency, and a common inductor cannot meet the requirement of wide bandwidth, so that a tapered inductor is usually selected. Compared with a common inductor, the conical inductor can realize isolation of radio frequency signals with certain bandwidth due to a special geometric structure, the conventional conical inductor adopts a flying wire structure, great difficulty is caused in the assembly process, and automatic welding cannot be realized. Meanwhile, the existing conical inductor adopts a winding conical inductor structure due to the limitation of wire rods and a magnetic core, so that the size is large, and the final product is large. And the conical inductor adopts a winding extending mode, and an end wire needs to be reserved to ensure that two ends are welded. The welding height of the device cannot be finely controlled, so that the device can only be directly and straightly installed on a substrate during installation, and the angle change of the conical inductor cannot be adjusted according to actual conditions, so that the signal intensity and the isolation function are limited.

Disclosure of Invention

The invention aims to provide a conical inductor packaging structure and a preparation method thereof, which can finely control the mounting height and the mounting angle of the conical inductor structure, thereby conveniently adjusting the angle of the conical inductor according to actual conditions, adjusting the signal intensity and improving the isolation function. And the wire bonding is utilized to form the coil, so that the assembly is simple, the size is small, the end wire does not need to be reserved, and the problem of manually manufacturing/welding the coil is solved.

Embodiments of the invention may be implemented as follows:

in one aspect, an embodiment of the present invention provides a tapered inductor package structure, including:

a load-bearing chassis;

an IC device disposed on the carrier chassis;

the first rubber receiving block and the second rubber receiving block are arranged on the bearing chassis;

the conical inductance modules are arranged on the first rubber receiving block and the second rubber receiving block;

the tapered inductance module is electrically connected with the IC device and internally provided with a magnetic core, the tapered inductance module is close to one side of the bearing chassis is provided with a first inductance arc formed by a plurality of routing wires, the tapered inductance module is far away from one side of the bearing chassis is provided with a second inductance arc formed by a plurality of routing wires and is multiple to the first inductance arc and multiple to the second inductance arc are electrically connected with each other and form a tapered coil structure around the magnetic core, the first bearing rubber block and the second bearing rubber block are used for controlling the tapered inductance module relative to the included angle of the bearing chassis so as to enable the magnetic core to be parallel to the bearing chassis or to be arranged at the included angle.

In an optional implementation manner, an accommodating groove is formed in the carrier chassis, the IC device and the accommodating groove are arranged at an interval, the first receiving rubber block and the second receiving rubber block are respectively arranged at two ends of the accommodating groove, and the plurality of first inductor arcs are accommodated in the accommodating groove.

In an optional embodiment, the tapered inductor module includes a first inductor module and a second inductor module, the first inductor module is disposed across the accommodating groove and disposed on the first receiving block and the second receiving block, and a plurality of first conductive end points opposite to each other are disposed on one side of the first inductor module close to the bearing chassis, the plurality of first inductor arcs are connected to the plurality of first conductive end points in a staggered manner, and lengths of the plurality of first inductor arcs are gradually increased along a direction close to the first receiving block;

the second inductance module is attached to the first inductance module, a plurality of second conductive end points which are opposite in pairs are arranged on one side, away from the bearing chassis, of the second inductance module, a plurality of second inductance line arcs are connected to the second conductive end points in a staggered mode, and the lengths of the second inductance line arcs are gradually increased along the direction close to the first glue receiving block;

the magnetic core is arranged between the first inductance module and the second inductance module, the plurality of first conductive end points and the plurality of second conductive end points are in one-to-one correspondence and are electrically connected with each other, and the second conductive end points positioned at two ends of the second inductance module are electrically connected with the IC device through first connecting arcs.

In an optional implementation manner, a plurality of first conductive pillars are disposed in the first inductor module, the plurality of first conductive pillars are disposed in one-to-one correspondence with the plurality of first conductive terminals, one end of each first conductive pillar is connected to the corresponding first conductive terminal, and the other end of each first conductive pillar penetrates through a surface, which is on the first inductor module and is joined to the second inductor module, of the first inductor module;

a plurality of second conductive columns are arranged in the second inductance module, the plurality of second conductive columns and the plurality of second conductive end points are arranged in a one-to-one correspondence manner, one end of each second conductive column is connected with the corresponding second conductive end point, and the other end of each second conductive column penetrates through the surface, which is connected with the first inductance module, of the second inductance module;

the first conductive pillars and the second conductive pillars are correspondingly jointed and electrically connected one by one.

In an optional embodiment, a first placing groove is formed in a side, away from the bearing chassis, of the first inductance module, a second placing groove is formed in a side, close to the bearing chassis, of the second inductance module, the first placing groove and the second placing groove are correspondingly formed, and the magnetic core is embedded in the first placing groove and the second placing groove at the same time.

In an alternative embodiment, the magnetic core includes two sub magnetic blocks, the two sub magnetic blocks are respectively embedded in the first placing groove and the second placing groove, and the two sub magnetic blocks are in contact with each other.

In an optional implementation manner, two ends of the first inductance module, which are close to the surface of one side of the carrier chassis, are further provided with a first connecting guide plate, the first connecting guide plate is connected with the first conducting end point located at the end, a second connecting guide plate is further embedded in the first rubber receiving block and the second rubber receiving block, the second connecting guide plate is electrically connected with the first connecting guide plate, the second connecting guide plate is further connected with a second connecting arc, and the second connecting arc is electrically connected with the IC device.

In an optional embodiment, a third conductive pillar is disposed in the carrier chassis, the third conductive pillar is disposed around the IC device, and a third connecting arc is disposed on the third conductive pillar, and the third connecting arc is connected to the IC device, so that the IC device is electrically connected to the carrier chassis.

In an optional embodiment, the tapered inductor packaging structure further includes a plastic package body, and the plastic package body is disposed on the carrier chassis and covers the IC device, the tapered inductor module, the first inductor arc, and the second inductor arc.

In another aspect, an embodiment of the present invention provides a method for manufacturing a tapered inductor package structure, where the method is used to manufacture the tapered inductor package structure, and the method includes:

providing a bearing chassis;

forming a first rubber receiving block and a second rubber receiving block on the bearing chassis;

mounting an IC device on the bearing chassis;

mounting a conical inductance module on the first receiving rubber block and the second receiving rubber block;

The beneficial effects of the embodiment of the invention include, for example:

according to the conical inductor packaging structure and the preparation method thereof provided by the embodiment of the invention, the first inductor arc and the second inductor arc are arranged on the two sides of the conical inductor module in a routing manner, so that a conical coil structure is formed, the conical inductor structure is formed by matching with the magnetic core, the conventional 'flying wire' structure can be avoided by utilizing the routing manner, the conical inductor module structure is utilized, the absorption is convenient, and the automatic welding can be realized. Meanwhile, the routing structure enables the volume of the conical inductance structure to be smaller, and the size of a final product to be smaller. And no end line is required to be reserved for square welding. More importantly, set up first accepting on bearing the chassis and glue the piece with the second and accept and glue the piece to set up the both ends of toper inductance module respectively on first accepting glues the piece and the second accepts glues the piece, utilize the first height adjustment who accepts to glue the piece and the second to accept to glue the piece and control toper inductance module for bearing the contained angle size on chassis, thereby make the magnetic core parallel or be the contained angle setting with bearing the chassis, and then realized signal strength and isolation function's adjustment, make the suitability of product better. Compared with the prior art, the tapered inductor packaging structure and the preparation method thereof provided by the embodiment of the invention can finely control the mounting height and the mounting angle of the tapered inductor structure, so that the angle of the tapered inductor can be conveniently adjusted according to actual conditions, the signal strength can be adjusted, and the isolation function can be improved. And the wire bonding is utilized to form the coil, so that the assembly is simple, the size is small, the end wire does not need to be reserved, and the problem of manually manufacturing/welding the coil is solved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is an internal structural view of a tapered inductor package structure according to an embodiment of the present invention in a first view;

fig. 2 is a schematic structural diagram of a tapered inductor package structure according to an embodiment of the present invention in a second view;

fig. 3 is a schematic structural diagram of a tapered inductor package structure according to an embodiment of the present invention at a third viewing angle;

fig. 4 to fig. 6 are process flow diagrams of a method for manufacturing a tapered inductor package structure according to an embodiment of the present invention.

Icon: 100-a tapered inductor package structure; 110-a carrying chassis; 111-a receiving recess; 130-an IC device; 131-a first connecting arc; 133-a second connecting arc; 135-a third connecting arc; 150-a first receiving rubber block; 170-second glue receiving block; 180-plastic package body; 190-a tapered inductor module; 191-a magnetic core; 193-first inductor arc; 195-a second inductor arc; 197-a first inductance module; 1971-a first conductive post; 1973-first connecting guide; 1975-a second connecting guide; 199 — a second inductance module; 1991-second conductive pillars.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

As disclosed in the background art, the tapered inductor in the prior art generally adopts a "flying wire" structure, that is, a copper wire is spirally wound around a magnetic core to form a tapered coil, which generally needs to be prepared in advance, and because the formed tapered inductor structure is entirely in a special shape, it is difficult to automatically pick up the tapered inductor by a suction or gripping device of a mounting machine, so that automatic welding cannot be achieved, and the conventional means is to manually weld the tapered inductor on a substrate.

In addition, due to the wire and the magnetic core and the operation mode, the conventional wound-type conical inductor needs to be wound at the periphery, so that the overall volume of the inductor is large, the size of the final product is large, and the inductor is inconvenient to install.

In addition, the conventional conical inductor is produced in a winding mode, a coil is exposed, and the coil is easy to damage and deform in the packaging and transporting processes, so that the yield of the conical inductor when the conical inductor is installed on a substrate is influenced.

Finally, the conventional conical inductor is produced in a winding mode, end lines at two ends need to be reserved, welding is convenient to achieve, the size of the conical inductor is further increased, and the welding process is complex.

In order to solve the above problems, the present invention provides a novel tapered inductor package structure and a method for manufacturing the same, and it should be noted that, in a non-conflicting manner, features in the embodiments of the present invention may be combined with each other.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

Referring to fig. 1 to 3, the present embodiment provides a tapered inductor package structure 100, which can finely control the mounting height and the mounting angle of the tapered inductor structure, so as to conveniently adjust the angle of the tapered inductor structure according to actual conditions, adjust signal strength, and improve isolation function. And the wire bonding is utilized to form the coil, so that the assembly is simple, the size is small, the end wire does not need to be reserved, and the problem of manually manufacturing/welding the coil is solved.

The invention provides a conical inductance packaging structure 100, which comprises a bearing chassis 110, an IC device 130, a first glue receiving block 150, a second glue receiving block 170 and a conical inductance module 190, wherein the IC device 130 is arranged on the bearing chassis 110, the first glue receiving block 150 and the second glue receiving block 170 are arranged on the bearing chassis 110 at intervals, two ends of the conical inductance module 190 are respectively arranged on the first glue receiving block 150 and the second glue receiving block 170, wherein the conical inductance module 190 is electrically connected with the IC device 130, a magnetic core 191 is arranged in the conical inductance module 190, a plurality of first inductance line arcs 193 formed by wire bonding are arranged on one side, close to the bearing chassis 110, of the conical inductance module 190, a plurality of second inductance line arcs 195 formed by wire bonding are arranged on one side, far away from the bearing chassis 110, the plurality of first inductance line arcs 193 and the plurality of second inductance line arcs 195 are electrically connected with each other, a conical coil structure is formed around the conical inductance module 191, and the first glue receiving block 150 and the second glue receiving block 170 are used for controlling the conical inductance module 190 to form an included angle relative to the magnetic core 110 or be parallel to the bearing chassis 110.

In this embodiment, the carrier chassis 110 is pre-wired, the IC device 130 may be a chip, and the chip may be mounted on the carrier chassis 110 or may be flip-mounted on the carrier chassis 110 and electrically connected to the wiring layer of the carrier chassis 110.

It should be noted that in the present embodiment, the first inductance line arc 193 and the second inductance line arc 195 are wire-bonded on two sides of the tapered inductance module 190, so as to form a tapered coil structure, and the tapered inductance structure is formed by matching with the magnetic core 191, so that the conventional "flying wire" structure can be avoided by using the wire-bonding method, and the tapered inductance module 190 structure is used, so as to facilitate absorption and realize automatic welding. Meanwhile, the routing structure enables the volume of the conical inductance structure to be smaller, and the size of a final product to be smaller. And no end line is required to be reserved for square welding. More importantly, the first glue receiving block 150 and the second glue receiving block 170 are arranged on the bearing chassis 110, two ends of the tapered inductance module 190 are respectively arranged on the first glue receiving block 150 and the second glue receiving block 170, and the included angle of the tapered inductance module 190 relative to the bearing chassis 110 is controlled by utilizing the height adjustment of the first glue receiving block and the second glue receiving block, so that the magnetic core 191 is parallel to or arranged in the included angle with the bearing chassis 110, the adjustment of the signal strength and the isolation function is realized, and the applicability of the product is better.

In this embodiment, the first glue receiving block and the second glue receiving block have the same height, so that the magnetic core 191 and the carrier base plate 110 are parallel to each other, and the first glue receiving block and the second glue receiving block also have the function of fixing and bonding, so that the fixing effect of the tapered inductor module 190 is ensured, and the subsequent plastic package action is facilitated. Of course, in other preferred embodiments of the present invention, the offset angle of the tapered inductance module 190 may also be adjusted by the difference in height between the first receiving rubber block and the second receiving rubber block, so as to achieve adjustment of the signal strength and the isolation function.

In this embodiment, the receiving groove 111 is disposed on the carrier chassis 110, the ic device 130 and the receiving groove 111 are disposed at an interval, the first receiving rubber block 150 and the second receiving rubber block 170 are disposed at two ends of the receiving groove 111, and the plurality of first inductor arcs 193 are received in the receiving groove 111. Specifically, by arranging the accommodating groove 111 on the bearing chassis 110, the accommodating of the plurality of first inductor arcs 193 can be realized, so that a part of coils of the tapered inductor are embedded in the bearing chassis 110, the packaging size of the tapered inductor is reduced, and the miniaturization of a product is realized.

In this embodiment, the tapered inductor module 190 includes a first inductor module 197 and a second inductor module 199, the first inductor module 197 is disposed across the receiving groove 111 and disposed on the first receiving block 150 and the second receiving block 170, and a plurality of first conductive terminals opposite to each other are disposed on one side of the first inductor module 197 close to the carrier chassis 110, the plurality of first inductor arcs 193 are connected to the plurality of first conductive terminals in a staggered manner, and lengths of the plurality of first inductor arcs 193 are gradually increased along a direction close to the first receiving block 150.

The second inductor module 199 is attached to the first inductor module 197, and a side of the second inductor module 199 away from the carrier chassis 110 is provided with a plurality of second conductive end points opposite to each other, the plurality of second inductor wire arcs 195 are connected to the plurality of second conductive end points in a staggered manner, and lengths of the plurality of second inductor wire arcs 195 are gradually increased along a direction approaching the first receiving rubber block 150.

The magnetic core 191 is disposed between the first inductance module 197 and the second inductance module 199, the plurality of first conductive terminals and the plurality of second conductive terminals are in one-to-one correspondence and electrically connected to each other, and the second conductive terminals at two ends of the second inductance module 199 are electrically connected to the IC device 130 through the first connecting arcs 131.

It should be noted that the first inductor module 197 and the second inductor module 199 have the same structure and shape, and meanwhile, the first inductor module 197 and the first inductor loop 193 may be formed by routing in advance, and the second inductor loop 195 may also be formed by routing in advance, and when forming a tapered inductor, the first inductor module 197 or the second inductor module 199 may be sucked by a suction device, so as to realize the stacking formation of the tapered inductor module 190.

It should be noted that in the present embodiment, the plurality of first inductor arcs 193 and the plurality of second inductor arcs 195 are distributed in a spiral shape, so that the first inductor arcs 193 and the second inductor arcs 195 on the upper and lower sides can be enclosed around the magnetic core 191 to form a tapered inductor structure.

In this embodiment, a plurality of first conductive pillars 1971 are disposed inside the first inductor module 197, the first conductive pillars 1971 correspond to the first conductive terminals one by one, one end of each first conductive pillar 1971 is connected to the corresponding first conductive terminal, and the other end of each first conductive pillar 1971 penetrates through a surface of the first inductor module 197 that is joined to the second inductor module 199.

In this embodiment, a plurality of second conductive pillars 1991 are disposed in the second inductor module 199, the plurality of second conductive pillars 1991 are disposed in one-to-one correspondence with the plurality of second conductive terminals, one end of each second conductive pillar 1991 is connected to the corresponding second conductive terminal, and the other end of each second conductive pillar 1991 penetrates through a surface of the second inductor module 199, which is joined to the first inductor module 197.

The first conductive pillars 1971 and the second conductive pillars 1991 are bonded and electrically connected in a one-to-one correspondence.

It should be noted that in this embodiment, the first conductive pillars 1971 and the second conductive pillars 1991 both adopt a copper pillar structure, the copper pillar structure penetrates through two ends of the first inductance module 197 and the second inductance module 199, and specifically, a copper pillar may be formed by electroplating a copper layer after laser grooving, so as to form a conductive end point on one side and an island conductive pad on the other side, which facilitates the electrical connection between the first conductive pillars 1971 and the second conductive pillars 1991.

In this embodiment, a first placing groove is disposed on a side of the first inductance module 197 away from the carrier chassis 110, a second placing groove is disposed on a side of the second inductance module 199 close to the carrier chassis 110, the first placing groove and the second placing groove are correspondingly disposed, and the magnetic core 191 is embedded in both the first placing groove and the second placing groove. Specifically, by providing the first placement groove and the second placement groove, the magnetic core 191 can be placed reasonably, and displacement of the magnetic core 191 is avoided.

In the present embodiment, the magnetic core 191 includes two sub magnetic blocks, which are respectively embedded in the first and second placement grooves and are in contact with each other. Specifically, the two sub magnetic blocks are respectively arranged on the first inductance module 197 and the second inductance module 199, and the stacking of the first inductance module 197 and the second inductance module 199 can realize the mounting of the two sub magnetic blocks, so that the magnetic induction intensity of the tapered inductor can be greatly improved, and the performance of the tapered inductor is improved.

In this embodiment, the first inductance module 197 further has a first connecting guide 1973 disposed at two ends of a side surface thereof near the carrier chassis 110, the first connecting guide 1973 is connected to a first conductive end located at an end portion, the first receiving block 150 and the second receiving block 170 further have a second connecting guide 1975 embedded therein, the second connecting guide 1975 is electrically connected to the first connecting guide 1973, the second connecting guide 1975 is further connected to a second connecting arc 133, and the second connecting arc 133 is electrically connected to the IC device 130. Specifically, the first and second connection guides 1973 and 1975 may be copper plates to achieve a good electrical connection function and to achieve an electrical connection between the first inductance module 197 and the carrier chassis 110.

In this embodiment, the carrier chassis 110 is provided with a third conductive pillar, the third conductive pillar is disposed around the IC device 130, and the third conductive pillar is provided with a third connecting arc 135, the third connecting arc 135 is connected with the IC device 130, so that the IC device 130 is electrically connected with the carrier chassis 110. Specifically, by providing the third conductive pillar, the electrical connection between the IC device 130 and the carrier chassis 110 can be achieved. Of course, in other preferred embodiments of the present invention, the IC device 130 may also adopt a flip-chip structure, and the electrical connection is directly maintained between the pads and the carrier chassis 110.

Further, the tapered inductor package structure 100 further includes a plastic package body 180, and the plastic package body 180 is disposed on the carrier chassis 110 and covers the IC device 130, the tapered inductor module 190, the first inductor loop 193, and the second inductor loop 195. Specifically, by arranging the plastic package body 180, the conical inductance structure can be completely wrapped, the coil is prevented from being exposed, a good supporting effect is achieved, the coil is effectively protected, and the packaging-level conical inductance structure can be achieved by stacking the IC devices 130 on the bearing chassis 110, so that the functions are more, and the size is smaller.

The embodiment of the present invention further provides a method for manufacturing the tapered inductor packaging structure 100, which is used for manufacturing the tapered inductor packaging structure 100, and the method for manufacturing the tapered inductor packaging structure 100 includes the following steps:

s1: a load-bearing chassis 110 is provided.

Specifically, a carrier chassis 110 may be provided, which may be routed in advance, and the carrier chassis 110 may be electrically connected through a plurality of pad structures.

S2: a first receiving rubber block 150 and a second receiving rubber block 170 are formed on the carrier base plate 110.

Referring to fig. 4, specifically, a groove may be first dug on the carrier chassis 110 to form the accommodating groove 111, and then the first receiving rubber block 150 and the second receiving rubber block 170 may be formed at two ends of the accommodating groove 111 by a dispensing method. The heights of the first receiving rubber block 150 and the second receiving rubber block 170 may be the same or different.

S3: the IC device 130 is mounted on the carrier chassis 110.

Referring to fig. 5 in combination, specifically, mounting and fixing of the IC device 130 may be achieved by a glue layer such as an adhesive glue. The IC device 130 may adopt a normal mounting structure, and meanwhile, the third conductive pillar may be prepared in the carrier chassis 110 in advance, and the pad structure is exposed on the surface of the carrier chassis 110, so that the IC device 130 and the carrier chassis 110 may be electrically connected by subsequent routing.

S4: the first receiving rubber block and the second receiving rubber block 170 are respectively provided with a conical inductance module 190.

Referring to fig. 6 and fig. 1 in combination, specifically, before the mounting of the tapered inductor module 190, the preparation of the first inductor module 197 may be completed in advance, and wire bonding may be completed on the first inductor module 197 to form the first inductor loop 193.

In actual mounting, the first inductor module 197 may be first mounted on the first receiving rubber block and the second receiving rubber block, wherein the first inductor wire loop 193 is accommodated in the accommodating groove 111 downward. Then, the second inductance module 199 is attached to the first inductance module 197, and the first conductive pillar 1971 and the second conductive pillar 1991 are contacted to each other to realize electrical contact, so as to form the tapered inductance module 190, wherein the tapered inductance module 190 is electrically connected to the IC device 130 and has the magnetic core 191 embedded therein.

It should be noted that, here, the magnetic cores 191 are built in advance in both the first inductance module 197 and the second inductance module 199, so that the built-in magnetic cores 191 are realized after the second inductance module 199 is mounted.

After the mounting of the second inductor module 199 is completed, the wire bonding of the second inductor arc 195 on the second inductor module 199 can be completed, and at the same time, the wire bonding of the first connecting arc 131 and the second connecting arc 133 can be completed, so that the electrical connection is completed everywhere. On the finally formed conical inductance module 190, a first inductance line arc 193 formed by a plurality of routing wires is arranged on one side close to the bearing chassis 110, a second inductance line arc 195 formed by a plurality of routing wires is arranged on one side of the conical inductance module 190 far away from the bearing chassis 110, the first inductance line arc 193 and the second inductance line arc 195 are electrically connected with each other, a conical coil structure is formed around the magnetic core 191, and the first rubber receiving block 150 and the second rubber receiving block 170 are used for controlling the included angle of the conical inductance module 190 relative to the bearing chassis 110, so that the magnetic core 191 and the bearing chassis 110 are parallel or form the included angle.

S5: a plastic package body 180 is formed on the carrier chassis 110.

Referring to fig. 2, after the wire bonding is completed, a plastic package body 180 for covering a plurality of components is formed on the carrier base 110 by using a plastic package machine.

The embodiment provides a tapered inductor packaging structure 100 and a preparation method thereof, a first inductor arc 193 and a second inductor arc 195 are arranged on two sides of a tapered inductor module 190 in a routing mode, so that a tapered coil structure is formed, the tapered inductor structure is formed by matching with a magnetic core 191, a conventional 'flying wire' structure can be avoided by using the routing mode, the tapered inductor module 190 structure is used, absorption is convenient, and automatic welding can be realized. Meanwhile, the routing structure also enables the volume of the conical inductance structure to be smaller, and the size of a final product to be smaller. And no end line is required to be reserved for square welding. More importantly, the first glue receiving block 150 and the second glue receiving block 170 are arranged on the bearing chassis 110, two ends of the tapered inductance module 190 are respectively arranged on the first glue receiving block 150 and the second glue receiving block 170, and the included angle of the tapered inductance module 190 relative to the bearing chassis 110 is controlled by utilizing the height adjustment of the first glue receiving block and the second glue receiving block, so that the magnetic core 191 is parallel to or arranged in the included angle with the bearing chassis 110, the adjustment of the signal strength and the isolation function is realized, and the applicability of the product is better. Compared with the prior art, the tapered inductor packaging structure 100 and the preparation method thereof provided by the embodiment can finely control the mounting height and the mounting angle of the tapered inductor structure, so that the angle of the tapered inductor can be conveniently adjusted according to actual conditions, the signal strength can be adjusted, and the isolation function can be improved. And the wire bonding is utilized to form the coil, so that the assembly is simple, the size is small, the end wire does not need to be reserved, and the problem of manually manufacturing/welding the coil is solved.

The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims

1. A tapered inductor package structure, comprising:

a load-bearing chassis;

an IC device disposed on the carrier chassis;

wherein, toper inductance module with IC device electricity is connected to built-in has the magnetic core, just toper inductance module is close to one side of bearing the chassis is provided with the first inductance line arc that a plurality of routing formed, toper inductance module is kept away from one side of bearing the chassis is provided with the second inductance line arc that a plurality of routing formed, and is a plurality of first inductance line arc and a plurality of second inductance line arc electricity each other is connected, and form the conical coil structure around the magnetic core, first accepting gluey piece with the gluey piece is used for control is accepted to the second toper inductance module for bear the contained angle of chassis, so that the magnetic core with it is parallel or be the contained angle setting to bear the chassis.

2. The tapered inductor package structure as claimed in claim 1, wherein a receiving recess is disposed on the carrier chassis, the IC device is spaced apart from the receiving recess, the first receiving block and the second receiving block are disposed at two ends of the receiving recess, and a plurality of first inductor wire loops are received in the receiving recess.

3. The tapered inductor packaging structure according to claim 2, wherein the tapered inductor module comprises a first inductor module and a second inductor module, the first inductor module is arranged on the accommodating groove in a crossing manner and is arranged on the first receiving rubber block and the second receiving rubber block, a plurality of first conductive end points which are opposite to each other in pairs are arranged on one side, close to the bearing chassis, of the first inductor module, the first inductor line arcs are connected to the first conductive end points in a staggered manner, and the lengths of the first inductor line arcs are gradually increased along the direction close to the first receiving rubber block;

4. The package structure of claim 3, wherein a plurality of first conductive pillars are disposed in the first inductor module, the plurality of first conductive pillars are disposed in one-to-one correspondence with the plurality of first conductive terminals, one end of each first conductive pillar is connected to the corresponding first conductive terminal, and the other end of each first conductive pillar penetrates through a surface of the first inductor module, which is joined to the second inductor module;

5. The tapered inductor packaging structure according to claim 3, wherein a first placing groove is disposed on a side of the first inductor module away from the carrier chassis, a second placing groove is disposed on a side of the second inductor module close to the carrier chassis, the first placing groove and the second placing groove are correspondingly disposed, and the magnetic core is embedded in the first placing groove and the second placing groove at the same time.

6. The tapered inductor package structure of claim 5, wherein the magnetic core comprises two sub magnetic blocks, the two sub magnetic blocks are respectively embedded in the first placement groove and the second placement groove, and the two sub magnetic blocks are in contact with each other.

7. The tapered inductor packaging structure according to claim 3, wherein a first connecting guide plate is further disposed at each end of the first inductor module near one side surface of the carrier chassis, the first connecting guide plate is connected to the first conductive end located at the end, a second connecting guide plate is further embedded in the first receiving rubber block and the second receiving rubber block, the second connecting guide plate is electrically connected to the first connecting guide plate, and a second connecting wire arc is further connected to the second connecting guide plate, and the second connecting wire arc is electrically connected to the IC device.

8. The tapered inductor package structure as claimed in claim 1, wherein a third conductive pillar is disposed in the carrier chassis, the third conductive pillar is disposed around the IC device, and a third connecting arc is disposed on the third conductive pillar, the third connecting arc is connected to the IC device, so that the IC device is electrically connected to the carrier chassis.

9. The tapered inductor package structure of claim 1, further comprising a molding compound disposed on the carrier chassis and encapsulating the IC device, the tapered inductor module, the first inductor loop, and the second inductor loop.

10. A method for manufacturing a tapered inductor package structure according to any one of claims 1 to 9, comprising:

providing a bearing chassis;

mounting an IC device on the bearing chassis;