CN115529796A - Heat dissipation system and server comprising same - Google Patents
Heat dissipation system and server comprising same Download PDFInfo
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- CN115529796A CN115529796A CN202211172042.4A CN202211172042A CN115529796A CN 115529796 A CN115529796 A CN 115529796A CN 202211172042 A CN202211172042 A CN 202211172042A CN 115529796 A CN115529796 A CN 115529796A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 60
- 238000001816 cooling Methods 0.000 claims abstract description 108
- 239000007788 liquid Substances 0.000 claims abstract description 92
- 239000000110 cooling liquid Substances 0.000 claims abstract description 50
- 238000005516 engineering process Methods 0.000 claims abstract description 48
- 238000010438 heat treatment Methods 0.000 claims abstract description 43
- 239000000498 cooling water Substances 0.000 claims abstract description 24
- 239000002826 coolant Substances 0.000 claims abstract description 21
- 239000012530 fluid Substances 0.000 claims description 46
- 238000009835 boiling Methods 0.000 claims description 29
- 230000008859 change Effects 0.000 claims description 9
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 230000005514 two-phase flow Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
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- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
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- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a heat dissipation system and a server including the same, the heat dissipation system including: a cooling tower on the primary side; a coolant distribution unit on a secondary side, the coolant distribution unit including a first heat exchanger and a second heat exchanger; the low-temperature cooling water input from the cooling tower respectively flows into the first heat exchanger and the second heat exchanger, the first heat exchanger is configured to take away heat of a heating device through a two-phase liquid cooling technology, and the second heat exchanger is configured to take away heat of the heating device through a single-phase liquid cooling technology. According to the invention, two independent heat exchangers are designed in the secondary side cooling liquid distribution unit, the single-phase and two-phase liquid cooling technologies are effectively combined, and the single-phase and two-phase liquid cooling heat dissipation modes are considered in the same heat dissipation system, so that the heat dissipation efficiency of the liquid cooling plate technology is improved, and the application range of the liquid cooling plate technology is expanded.
Description
Technical Field
The present invention relates to the field of heat dissipation, and more particularly, to a heat dissipation system and a server including the same.
Background
With the rapid development of IT technology, the power consumption of electronic devices such as chips in a server is rapidly increased, and the size of the electronic devices is smaller and smaller, so that the heat flux density of the electronic devices is rapidly increased. In order to maintain the normal and stable operation of such electronic devices, it is necessary to improve the heat exchange efficiency of the heat dissipation system to rapidly dissipate the heat inside the devices. The traditional air-cooled heat dissipation system is close to the limit of heat dissipation performance, and cannot meet the heat dissipation requirement of high-power-consumption electronic devices. Therefore, there is a need to develop a new heat dissipation system. Based on research, the skilled person proposes a heat dissipation system considering the liquid-cooled plate technology, which takes away heat generated by the device by means of indirect cooling by driving a cooling liquid to flow in a pipe and enter a microchannel heat sink in contact with the surface of the electronic device. Because the sensible heat, the latent heat and the heat conductivity coefficient of the liquid are far greater than those of air, and the forced convection heat transfer coefficient of the liquid is also far greater than that of the air, the heat exchange efficiency of the cooling system based on the liquid cooling plate technology is superior to that of the traditional air cooling system. The heat dissipation system is becoming the mainstream direction for solving the heat dissipation problem of the high-power electronic device.
The heat dissipation upper limit exists in both the heat dissipation system considering the single-phase liquid cooling plate technology and the heat dissipation system considering the double-phase liquid cooling plate technology, and researches show that the highest heat flow density of the heat dissipation system is lower than 1000W/cm 2 If the heat dissipation problem of the electronic device with higher power consumption is to be solved, the measures are jet flow impact cooling or spray cooling technologies, but the technologies have higher difficulty and use cost than liquid cooling plate technologies. Therefore, the development can be realized at 1000W/cm 2 The liquid cooling plate heat dissipation system has wider application prospect.
Disclosure of Invention
In view of the above, an object of an embodiment of the present invention is to provide a heat dissipation system and a server including the same, in which two independent heat exchangers are used in a secondary side cooling liquid distribution unit (CDU) and two independent cooling liquid flow loops are designed, so that single-phase and dual-phase liquid cooling plate technologies can be considered in one heat dissipation system at the same time, thereby increasing the upper limit of heat dissipation of the liquid cooling plate heat dissipation system.
In view of the above, an aspect of the embodiments of the present invention provides a heat dissipation system, including the following steps: a cooling tower on the primary side; a coolant distribution unit on a secondary side, the coolant distribution unit including a first heat exchanger and a second heat exchanger; the low-temperature cooling water input from the cooling tower respectively flows into the first heat exchanger and the second heat exchanger, the first heat exchanger is configured to take away heat of a heating device through a two-phase liquid cooling technology, and the second heat exchanger is configured to take away heat of the heating device through a single-phase liquid cooling technology.
In some embodiments, the first heat exchanger configured to remove heat from a heat generating device via two-phase liquid cooling comprises: the low-temperature low-boiling point cooling liquid is subjected to boiling phase change through the heating device to become high-temperature gas-liquid two-phase fluid which takes away heat generated by the heating device; and the high-temperature gas-liquid two-phase fluid is changed into low-temperature low-boiling point cooling liquid by absorbing heat of low-temperature cooling water flowing into the first heat exchanger from the cooling tower.
In some embodiments, the second heat exchanger configured to remove heat from the heat generating device via single phase liquid cooling comprises: the low-temperature high-boiling-point cooling liquid and the heating device are subjected to forced convection heat exchange to become high-temperature single-phase fluid to take away heat generated by the heating device; and the high-temperature single-phase fluid absorbs heat from the low-temperature cooling water flowing into the second heat exchanger from the cooling tower and becomes low-temperature high-boiling-point cooling liquid.
In some embodiments, the coolant distribution unit includes an upper microchannel and a lower microchannel, the lower microchannel being in contact with the heat generating device, the upper microchannel being remote from the heat generating device, the microchannels having shapes including rectangular, triangular, and circular.
In some embodiments, the side of the lower microchannel in contact with the heat generating device is provided with a plurality of parallel fins.
In another aspect of the embodiments of the present invention, a server is provided, which includes a heat dissipation system, where the heat dissipation system includes: a cooling tower on the primary side; a coolant distribution unit on a secondary side, the coolant distribution unit including a first heat exchanger and a second heat exchanger; the low-temperature cooling water input from the cooling tower respectively flows into the first heat exchanger and the second heat exchanger, the first heat exchanger is configured to take away heat of a heating device through a two-phase liquid cooling technology, and the second heat exchanger is configured to take away heat of the heating device through a single-phase liquid cooling technology.
In some embodiments, the first heat exchanger configured to remove heat from a heat generating device via two-phase liquid cooling comprises: the low-temperature low-boiling point cooling liquid is subjected to boiling phase change through the heating device to become high-temperature gas-liquid two-phase fluid which takes away heat generated by the heating device; and the high-temperature gas-liquid two-phase fluid is changed into low-temperature low-boiling point cooling liquid by absorbing heat of low-temperature cooling water flowing into the first heat exchanger from the cooling tower.
In some embodiments, the second heat exchanger configured to remove heat from the heat generating device via single phase liquid cooling comprises: the low-temperature high-boiling-point cooling liquid and the heating device are subjected to forced convection heat exchange to be changed into high-temperature single-phase fluid to take away heat generated by the heating device; and the high-temperature single-phase fluid is changed into low-temperature high-boiling point cooling liquid by absorbing heat from the low-temperature cooling water flowing into the second heat exchanger from the cooling tower.
In some embodiments, the coolant distribution unit includes an upper microchannel and a lower microchannel, the lower microchannel being in contact with the heat generating device, the upper microchannel being remote from the heat generating device, the microchannels having shapes including rectangular, triangular, and circular.
In some embodiments, the side of the lower microchannel in contact with the heat generating device is provided with a plurality of parallel fins.
The invention has the following beneficial technical effects: two independent heat exchangers are designed in the secondary side CDU and respectively correspond to two independent fluid loops considering single-phase liquid cooling and two-phase liquid cooling, so that the single-phase liquid cooling technology and the two-phase liquid cooling technology are effectively combined; by considering single-phase and double-phase liquid cooling heat dissipation modes in the same heat dissipation system, the heat dissipation efficiency of the liquid cooling plate technology is improved, and the application range of the liquid cooling plate technology is expanded.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a heat dissipation system according to an embodiment of the present invention;
FIG. 2a is a schematic diagram of a two-layer rectangular microchannel heat sink according to an embodiment of the present invention;
FIG. 2b is a schematic diagram of a double-layer triangular microchannel heat sink according to an embodiment of the present invention;
FIG. 2c is a schematic view of a double-layer circular microchannel heat sink according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a two-layer rectangular microchannel heat sink with fins on the bottom of the lower layer according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it should be noted that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and they are not described in any more detail in the following embodiments.
In a first aspect of an embodiment of the present invention, an embodiment of a heat dissipation system is provided. Fig. 1 is a schematic diagram illustrating an embodiment of a heat dissipation system provided by the present invention. As shown in fig. 1, an embodiment of the present invention includes the following components:
a cooling tower on the primary side;
a coolant distribution unit on a secondary side, the coolant distribution unit including a first heat exchanger and a second heat exchanger;
the low-temperature cooling water input from the cooling tower respectively flows into the first heat exchanger and the second heat exchanger, the first heat exchanger is configured to take away heat of a heating device through a two-phase liquid cooling technology, and the second heat exchanger is configured to take away heat of the heating device through a single-phase liquid cooling technology.
In a heat dissipation system considering the single-phase liquid cooling plate technology, cooling liquid flows through a micro-channel heat sink directly contacted with a heating electronic device under the driving of a pump, and the cooling liquid and the heat sink generate heat convection to absorb heat generated by the electronic device. The sensible heat of the cooling liquid is utilized in the heat dissipation system, as the sensible heat of the cooling liquid is far greater than that of air, the cooling liquid with the same flow can take away more heat, and the heat conductivity coefficient of the cooling liquid and the forced convection heat transfer coefficient in the heat sink are far greater than that of the air, so that the heat dissipation performance of the heat dissipation system considering the single-phase liquid cooling plate technology is superior to that of the heat dissipation system considering the air cooling technology, and the heat dissipation problem of part of high-power-consumption electronic devices can be solved.
In a heat dissipation system considering the two-phase liquid cooling plate technology, the electronic device is cooled by using the latent heat of vaporization of the cooling liquid, and the heat dissipation performance of the liquid cooling plate technology is greatly improved. The cooling liquid flows through the micro-channel heat sink which is directly contacted with the heating electronic device under the driving of the pump, and the temperature of the heat sink is higher than the boiling point of the cooling liquid, so that the cooling liquid can boil in the channel, and the heat is absorbed through flowing boiling phase change to take away part of the heat. The latent heat of the cooling liquid is larger than the sensible heat of the cooling liquid, so that compared with a single-phase liquid cooling plate technology, the heat flux density in a double-phase liquid cooling plate technology is higher, and the heat dissipation problem of an electronic device with higher power consumption can be solved.
The embodiment of the invention discloses a heat dissipation system capable of simultaneously considering single-phase and double-phase liquid cooling plate technologies. As shown in fig. 1, compared with the conventional heat dissipation system considering single-phase or two-phase liquid cooling plate technology alone, the current system designs two independent heat exchangers on the secondary side, which correspond to two independent fluid circuits respectively, and the two fluid circuits transport the single-phase liquid-cooled coolant and the two-phase liquid-cooled coolant respectively, and the cooling water pipeline from the primary side is divided into two parallel branches after entering the secondary side, and transports the cooling water into the two independent heat exchangers respectively.
In the primary side circulation, low-temperature water enters the secondary side circulation from the cooling tower under the drive of the pump 1, is divided into two branches in the secondary side circulation, respectively enters two independent heat exchangers in the secondary side circulation CDU, absorbs the heat of high-temperature single-phase fluid or high-temperature gas-liquid mixed fluid in the secondary side circulation to become high-temperature water, and enters the cooling tower again after backflow to be cooled to become low-temperature water.
In some embodiments, the first heat exchanger configured to remove heat from a heat generating device via two-phase liquid cooling comprises: the low-temperature low-boiling point cooling liquid is subjected to boiling phase change through the heating device to become high-temperature gas-liquid two-phase fluid which takes away heat generated by the heating device; and the high-temperature gas-liquid two-phase fluid is changed into low-temperature low-boiling point cooling liquid by absorbing heat of low-temperature cooling water flowing into the first heat exchanger from the cooling tower.
In some embodiments, the second heat exchanger configured to remove heat from the heat generating device via single phase liquid cooling comprises: the low-temperature high-boiling-point cooling liquid and the heating device are subjected to forced convection heat exchange to be changed into high-temperature single-phase fluid to take away heat generated by the heating device; and the high-temperature single-phase fluid absorbs heat from the low-temperature cooling water flowing into the second heat exchanger from the cooling tower and becomes low-temperature high-boiling-point cooling liquid.
In the secondary side circulation, different from the traditional liquid cooling plate heat dissipation system, the embodiment of the invention is provided with two independent fluid loops which are used for respectively transmitting two cooling liquids for single-phase liquid cooling and two-phase liquid cooling, and the two cooling liquids respectively circulate in the two fluid loops under the driving of two independent pumps, so that the heat generated by electronic devices is removed in the process. The method comprises the following specific steps: as shown in fig. 1, the low-temperature cooling water input from the primary side is divided into two branches in the CDU, and flows into the heat exchanger 1 and the heat exchanger 2 respectively; for a loop corresponding to the two-phase liquid cooling plate technology, low-temperature low-boiling-point single-phase cooling liquid enters a liquid cooling plate radiator through a fluid pipeline, a large amount of heat generated by a high-power consumption electronic device during working heats the liquid cooling plate radiator, the low-boiling-point cooling liquid generates boiling phase change in the radiator, absorbs a large amount of heat, becomes high-temperature gas-liquid two-phase fluid, flows out under the driving of a pump 2, and takes away part of heat generated by the electronic device; the high-temperature two-phase fluid flows into the heat exchanger 1 under the drive of the pump 2, and the low-temperature cooling water flowing into the heat exchanger from the primary side absorbs the heat of the high-temperature two-phase fluid in an indirect heat exchange mode, is cooled by the high-temperature two-phase fluid after heat absorption to become a low-temperature low-boiling-point single-phase fluid, and continuously flows in under the drive of the pump 2, and the cycle is repeated in this way, so that the heat exchange process of the two-phase liquid cooling plate technology is realized; for a loop corresponding to the single-phase liquid cooling plate technology, low-temperature high-boiling-point single-phase cooling liquid enters a liquid cooling plate radiator through another fluid pipeline, heat is exchanged with the liquid cooling plate radiator heated by an electronic device in a forced convection heat exchange mode, the single-phase fluid after absorbing the heat is changed into high-temperature single-phase fluid, and the high-temperature single-phase fluid is discharged out of the liquid cooling plate radiator under the driving of a pump 3 to take away the heat, so that the temperature of the electronic device is further reduced; the high-temperature single-phase fluid flows into the heat exchanger 2 under the driving of the pump 3, the low-temperature cooling water flowing into the heat exchanger from the primary side absorbs the heat of the high-temperature single-phase fluid in an indirect heat exchange mode, the high-temperature single-phase fluid is cooled after absorbing the heat, the high-temperature single-phase fluid is changed into low-temperature single-phase cooling liquid, and the low-temperature single-phase cooling liquid continuously flows into the server under the driving of the pump 3, and therefore the circulation is repeated, and the heat exchange process of the single-phase liquid cooling plate technology is achieved. Therefore, the heat dissipation system can simultaneously consider the single-phase and double-phase liquid cooling plate technologies, and improve the heat dissipation performance of the liquid cooling plate technology.
In some embodiments, the coolant distribution unit includes an upper microchannel and a lower microchannel, the lower microchannel being in contact with the heat generating device, the upper microchannel being remote from the heat generating device, the shape of the microchannels including rectangular, triangular, and circular.
In some embodiments, the side of the lower microchannel in contact with the heat generating device is provided with a plurality of parallel fins.
The embodiment of the invention comprises an upper micro-channel and a lower micro-channel, wherein the lower micro-channel is in contact with a heating electronic device, and the upper micro-channel is far away from the heating electronic device. The lower micro-channel is directly contacted with a heating electronic device, the temperature of the lower micro-channel is higher, when low-temperature low-boiling-point single-phase cooling liquid flows through the lower micro-channel, phase change occurs and heat is absorbed, and considering that the latent heat of the liquid is far greater than the sensible heat of the liquid, the cooling liquid in the lower micro-channel absorbs and takes away a large amount of heat generated by the electronic device through flowing boiling heat exchange; the upper microchannel is lower in temperature than the lower microchannel, and high-boiling-point single-phase cooling liquid flows through the upper microchannel and performs forced convection heat exchange with the radiator, so that heat generated by an electronic device is taken away by sensible heat of the cooling liquid.
Figure 2a is a two-layer rectangular microchannel heat sink. As shown in FIG. 2a, heat flows from the bottom of the heat sink, the lower micro-channel performs double-phase flow boiling heat exchange, and the upper micro-channel performs single-phase forced convection heat exchange.
Figure 2b is a double layer triangular microchannel heat sink. As shown in FIG. 2b, the heat flow flows in from the bottom of the heat sink, the lower micro-channel performs double-phase flow boiling heat exchange, and the upper micro-channel performs single-phase forced convection heat exchange.
Figure 2c is a double layer circular microchannel heat sink. As shown in fig. 2c, the heat flow flows in from the bottom of the heat sink, the lower microchannel undergoes two-phase flow boiling heat exchange, and the upper microchannel undergoes single-phase forced convection heat exchange.
FIG. 3 is a two-layer rectangular microchannel heat sink but with fins on the bottom of the lower microchannels. As shown in fig. 3, the heat flows from the bottom of the heat sink, the lower microchannel undergoes two-phase flow boiling heat exchange, and the upper microchannel undergoes single-phase forced convection heat exchange. The flow boiling heat exchange of the lower micro-channel can be strengthened by adding fins at the bottom.
In the embodiment of the invention, two independent heat exchangers are designed in the secondary side CDU and respectively correspond to two independent fluid loops considering single-phase liquid cooling and double-phase liquid cooling, so that the single-phase and double-phase liquid cooling technologies are effectively combined; by considering single-phase and double-phase liquid cooling heat dissipation modes in the same heat dissipation system, the heat dissipation efficiency of the liquid cooling plate technology is improved, and the application range of the liquid cooling plate technology is expanded.
In view of the above object, according to a second aspect of the embodiments of the present invention, there is provided a server including a heat dissipation system, the heat dissipation system including: a cooling tower on the primary side; a coolant distribution unit on a secondary side, the coolant distribution unit including a first heat exchanger and a second heat exchanger; the low-temperature cooling water input from the cooling tower respectively flows into the first heat exchanger and the second heat exchanger, the first heat exchanger is configured to take away heat of a heating device through a two-phase liquid cooling technology, and the second heat exchanger is configured to take away heat of the heating device through a single-phase liquid cooling technology.
In some embodiments, the first heat exchanger configured to remove heat from a heat generating device via two-phase liquid cooling comprises: the low-temperature low-boiling point cooling liquid is subjected to boiling phase change through the heating device to become high-temperature gas-liquid two-phase fluid which takes away heat generated by the heating device; and the high-temperature gas-liquid two-phase fluid is changed into low-temperature low-boiling point cooling liquid by absorbing heat of low-temperature cooling water flowing into the first heat exchanger from the cooling tower.
In some embodiments, the second heat exchanger configured to remove heat from the heat generating device via single phase liquid cooling comprises: the low-temperature high-boiling-point cooling liquid and the heating device are subjected to forced convection heat exchange to be changed into high-temperature single-phase fluid to take away heat generated by the heating device; and the high-temperature single-phase fluid is changed into low-temperature high-boiling point cooling liquid by absorbing heat from the low-temperature cooling water flowing into the second heat exchanger from the cooling tower.
In some embodiments, the coolant distribution unit includes an upper microchannel and a lower microchannel, the lower microchannel being in contact with the heat generating device, the upper microchannel being remote from the heat generating device, the microchannels having shapes including rectangular, triangular, and circular.
In some embodiments, the side of the lower microchannel in contact with the heat generating device is provided with a plurality of parallel fins.
The foregoing are exemplary embodiments of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the present disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements of the disclosed embodiments of the invention may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.
It should be understood that, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly supports the exception. It should also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items.
The numbers of the embodiments disclosed in the above embodiments of the present invention are merely for description, and do not represent the advantages or disadvantages of the embodiments.
It will be understood by those skilled in the art that all or part of the steps for implementing the above embodiments may be implemented by hardware, or may be implemented by a program instructing relevant hardware, and the program may be stored in a computer-readable storage medium, and the above-mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, of embodiments of the invention is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of the embodiments of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.
Claims (10)
1. A heat dissipation system, comprising:
a cooling tower on the primary side;
a coolant distribution unit on a secondary side, the coolant distribution unit including a first heat exchanger and a second heat exchanger;
the low-temperature cooling water input from the cooling tower respectively flows into the first heat exchanger and the second heat exchanger, the first heat exchanger is configured to take away heat of a heating device through a two-phase liquid cooling technology, and the second heat exchanger is configured to take away heat of the heating device through a single-phase liquid cooling technology.
2. The heat dissipation system of claim 1, wherein the first heat exchanger configured to remove heat from a heat generating device via two-phase liquid cooling comprises:
the low-temperature low-boiling-point cooling liquid is subjected to boiling phase change through the heating device to become high-temperature gas-liquid two-phase fluid to take away heat generated by the heating device; and
the high-temperature gas-liquid two-phase fluid is changed into low-temperature low-boiling point cooling liquid by absorbing heat from the low-temperature cooling water flowing into the first heat exchanger from the cooling tower.
3. The heat dissipation system of claim 1, wherein the second heat exchanger configured to remove heat from the heat generating device via single phase liquid cooling comprises:
the low-temperature high-boiling-point cooling liquid and the heating device are subjected to forced convection heat exchange to be changed into high-temperature single-phase fluid to take away heat generated by the heating device; and
the high-temperature single-phase fluid absorbs heat from the low-temperature cooling water flowing from the cooling tower into the second heat exchanger and becomes low-temperature high-boiling-point cooling liquid.
4. The heat dissipating system of claim 1, wherein the coolant distribution unit comprises an upper layer of microchannels and a lower layer of microchannels, the lower layer of microchannels being in contact with the heat generating device, the upper layer of microchannels being remote from the heat generating device, the shape of the microchannels comprising rectangular, triangular and circular.
5. The heat dissipating system of claim 4, wherein a side of the lower microchannel in contact with the heat generating device is provided with a plurality of parallel fins.
6. A server comprising a heat dissipation system, the heat dissipation system comprising:
a cooling tower on the primary side;
a coolant distribution unit on a secondary side, the coolant distribution unit including a first heat exchanger and a second heat exchanger;
the low-temperature cooling water input from the cooling tower respectively flows into the first heat exchanger and the second heat exchanger, the first heat exchanger is configured to take away heat of a heating device through a two-phase liquid cooling technology, and the second heat exchanger is configured to take away heat of the heating device through a single-phase liquid cooling technology.
7. The server of claim 6, wherein the first heat exchanger configured to remove heat from the heat generating device via two-phase liquid cooling comprises:
the low-temperature low-boiling point cooling liquid is subjected to boiling phase change through the heating device to become high-temperature gas-liquid two-phase fluid which takes away heat generated by the heating device; and
the high-temperature gas-liquid two-phase fluid is changed into low-temperature low-boiling point cooling liquid by absorbing heat from the low-temperature cooling water flowing into the first heat exchanger from the cooling tower.
8. The server of claim 6, wherein the second heat exchanger configured to remove heat from the heat generating device via single phase liquid cooling comprises:
the low-temperature high-boiling-point cooling liquid and the heating device are subjected to forced convection heat exchange to be changed into high-temperature single-phase fluid to take away heat generated by the heating device; and
the high-temperature single-phase fluid is changed into a low-temperature high-boiling point cooling liquid by absorbing heat from the low-temperature cooling water flowing from the cooling tower into the second heat exchanger.
9. The server according to claim 6, wherein the cooling liquid distribution unit includes an upper layer micro channel and a lower layer micro channel, the lower layer micro channel being in contact with the heat generating device, the upper layer micro channel being remote from the heat generating device, the micro channel having a shape including a rectangle, a triangle, and a circle.
10. The server according to claim 9, wherein a side of the lower microchannel in contact with the heat generating device is provided with a plurality of parallel fins.
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| CN202211172042.4A CN115529796A (en) | 2022-09-26 | 2022-09-26 | Heat dissipation system and server comprising same |
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| CN202211172042.4A CN115529796A (en) | 2022-09-26 | 2022-09-26 | Heat dissipation system and server comprising same |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117055708A (en) * | 2023-10-10 | 2023-11-14 | 苏州元脑智能科技有限公司 | Server and liquid cooling system for server |
| CN117979658A (en) * | 2024-03-28 | 2024-05-03 | 苏州元脑智能科技有限公司 | Heat exchange system |
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2022
- 2022-09-26 CN CN202211172042.4A patent/CN115529796A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117055708A (en) * | 2023-10-10 | 2023-11-14 | 苏州元脑智能科技有限公司 | Server and liquid cooling system for server |
| CN117055708B (en) * | 2023-10-10 | 2024-01-23 | 苏州元脑智能科技有限公司 | Server and liquid cooling system for server |
| CN117979658A (en) * | 2024-03-28 | 2024-05-03 | 苏州元脑智能科技有限公司 | Heat exchange system |
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