CN115524893A - Electronic paper display module processing method, electronic paper display module and display equipment - Google Patents
Electronic paper display module processing method, electronic paper display module and display equipment Download PDFInfo
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- CN115524893A CN115524893A CN202211296834.2A CN202211296834A CN115524893A CN 115524893 A CN115524893 A CN 115524893A CN 202211296834 A CN202211296834 A CN 202211296834A CN 115524893 A CN115524893 A CN 115524893A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1675—Constructional details
- G02F1/1679—Gaskets; Spacers; Sealing of cells; Filling or closing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1675—Constructional details
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Abstract
The application relates to an electronic paper display module processing method, an electronic paper display module and display equipment. The method comprises the following steps: dividing the raw material of the electronic paper film and dispensing silver paste to form a plurality of electronic paper films; attaching a plurality of electronic paper films to the whole TFT substrate; correspondingly attaching a transparent cover plate to the plurality of electronic paper films; and cutting the whole TFT substrate to obtain a first product. The scheme that this application provided can paste through will cutting apart into small electronic paper membrane and circulate the production to whole board TFT base plate on, realizes that materials such as electronic paper membrane, transparent cover plate adopt the mode of big board circulation to circulate in process of production, reduces the consuming time input of material circulation in the traditional production process, improves production efficiency greatly.
Description
Technical Field
The application relates to the technical field of display screens, in particular to an electronic paper display module processing method, an electronic paper display module and display equipment.
Background
The electrophoretic display technology was originally proposed in the last 70 th century, and has been developed in a long time with the development of display technology, which is often used in the manufacture of electronic paper display devices, and has been greatly improved in both performance and manufacturing methods.
In the related art, the electronic paper display module generally divides the TFT glass substrate and the electronic paper film into small pieces with corresponding sizes, sequentially performs punching and plasma treatment on the small pieces of electronic paper film, and then performs one-to-one corresponding bonding and glue dispensing and edge sealing on the small pieces of TFT glass substrate and the small pieces of electronic paper film. Above-mentioned processing mode, owing to adopt be the granule processing mode, every grain electronic display module all need repeat the same processing action to still need feed and throw the material through the plastic uptake dish between different processing stations, production efficiency is low.
Disclosure of Invention
For solving or partly solving the problem that exists among the correlation technique, this application provides an electron paper display module processing method, electron paper display module and display device, can realize that the processing material adopts the mode of big board circulation to circulate in process of production, reduces the input consuming time that the material adopted the plastic sucking disc circulation in traditional production process, improves production efficiency greatly.
The application provides a first aspect of an electronic paper display module processing method, which comprises the steps of
Cutting the raw material of the electronic paper film and dispensing silver paste to form a plurality of electronic paper films;
attaching a plurality of electronic paper films to the whole TFT substrate;
correspondingly attaching a transparent cover plate to the plurality of electronic paper films;
and cutting the whole TFT substrate to obtain a first product.
In some embodiments, the attaching the transparent cover plate to the plurality of electronic paper films correspondingly includes:
cutting the raw material of the transparent cover plate into a single transparent cover plate with the size corresponding to that of the electronic paper film, and correspondingly attaching the transparent cover plate to the electronic paper film through an adhesive layer.
In some embodiments, after the attaching the plurality of electronic paper films to the entire TFT substrate, and/or after the attaching the transparent cover plate to the plurality of electronic paper films, the method includes:
and carrying out a lighting test on the electronic paper film on the whole TFT substrate.
In some embodiments, the performing the lighting test on the electronic paper film and the transparent cover plate on the whole TFT substrate includes:
and carrying out lighting test on the electronic paper film according to a preset lighting circuit on the whole TFT substrate.
In some embodiments, after the transparent cover plate is correspondingly attached to the plurality of electronic paper films, the method further includes:
and coating edge sealing glue on the periphery of the transparent cover plate.
In some embodiments, the edge tape viscosity is less than 5000cp.
In some embodiments, when the edge sealing adhesive has a tackiness of less than 5000cp, the applying the edge sealing adhesive to the periphery of the transparent cover plate includes:
and coating edge sealing glue on the periphery of the transparent cover plate in a glue dispensing mode.
In some embodiments, the method further comprises:
and carrying out post-processing treatment on the first product to obtain a second product.
The second aspect of the application provides an electronic paper display module, which is manufactured according to the processing method of the electronic paper display module of the first aspect of the application, and comprises a cover plate, an electronic paper film and a substrate; the cover plate, the electronic paper film and the substrate are sequentially overlapped from top to bottom.
A third aspect of the present application provides an electronic paper display device including: the electronic paper display module of the second aspect of the present application.
The technical scheme provided by the application can comprise the following beneficial effects:
according to the electronic paper display module processing method, the electronic paper film divided into small pieces is pasted on the whole TFT substrate for circulation production, so that materials such as the electronic paper film and the transparent cover plate can be circulated in a large plate circulation mode in the production process, the time-consuming investment of material circulation in the traditional production process is reduced, and the production efficiency is greatly improved; the TFT base plate does not cut before the laminating of electron paper membrane, transparent cover plate, effectively avoids the glass powder that the cutting produced to cause the damage to electron paper membrane, transparent cover plate, effectively improves the production quality of product.
Furthermore, according to the electronic paper display module processing method, the lighting circuit is preset on the TFT substrate, and the lighting test on all electronic paper films on the TFT substrate is realized through the preset lighting circuit before glue sealing is carried out, so that the test efficiency is greatly improved, defective products can be found in time, and material waste in the subsequent generation process is reduced; adopt the mode of gluing to carry out the banding between transparent cover plate and the TFT base plate, utilize low viscosity to seal the limit and glue and flow into in the clearance and realize the banding, effectively improve banding efficiency to reduce the material consume.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The foregoing and other objects, features and advantages of the application will be apparent from the following more particular descriptions of exemplary embodiments of the application as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the application.
Fig. 1 is a schematic flow chart of a processing method of an electronic paper display module according to an embodiment of the present disclosure;
fig. 2 is another schematic flow chart of a processing method of an electronic paper display module according to an embodiment of the present disclosure;
fig. 3 is another schematic flow chart of a processing method of an electronic paper display module according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of an electronic paper display module according to an embodiment of the present application.
Detailed Description
Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While embodiments of the present application are illustrated in the accompanying drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Among the correlation technique, what the processing mode of electronic paper display module adopted is small-sized processing mode, and every electronic display module all needs the same processing action of repetition to still need feed and throw the material through the plastic uptake dish between different processing stations, production efficiency hangs down.
To the above problem, this application embodiment provides an electronic paper display module processing method, can realize that the processing material adopts the mode of big board circulation to circulate in process of production, reduces the input consuming time that the material adopted the plastic sucking disc circulation in traditional production process, improves production efficiency greatly.
The technical solutions of the embodiments of the present application are described in detail below with reference to the accompanying drawings.
Fig. 1 is a schematic flow chart of a processing method of an electronic paper display module according to an embodiment of the present application.
Referring to fig. 1, the electronic paper display module processing method of the present application includes:
and S110, dividing the raw material of the electronic paper film and dispensing silver paste to form a plurality of electronic paper films.
In the step, the raw material of the electronic paper film is divided into preset sizes according to the size and the specification of the electronic paper display module to form a plurality of electronic paper films, and the conductive silver paste is dotted on the plurality of electronic paper films.
And S120, adhering the plurality of electronic paper films to the whole TFT substrate.
It should be understood that the electronic paper film generally has a first adhesive layer, an electronic paper film layer, a common electrode layer, and a second adhesive layer, and a release film or an aluminum foil layer is further attached to the outer surfaces of the first adhesive layer and the second adhesive layer, wherein the first adhesive layer is used for attaching to the TFT substrate, and the second adhesive layer is used for attaching to the transparent cover plate.
In this step, the plurality of electronic paper films obtained in step S110 are bonded to the entire TFT substrate, in which the bonding method is to tear off the aluminum foil layer on the electronic paper film and bond the first adhesive layer of the electronic paper film to the circuit surface of the entire TFT substrate, where the first adhesive layer may be a hot-melt adhesive layer. Wherein the carrier of a plurality of electronic paper membranes in the formation process can be regarded as to whole board TFT base plate, realizes adopting big board circulation like processing materials such as a plurality of electronic paper membranes in the formation process to remove the use of putting into operation of the plastic sucking dish that is used for material transmission among the tradition from.
In some embodiments, the size of the whole TFT substrate may be a size suitable for production circulation, for example, the width of the whole TFT substrate is suitable for transportation equipment, bonding equipment, cutting equipment and the like in the production process.
In some embodiments, the peripheral portion of the entire TFT substrate may be reserved with a lossy portion, where the lossy portion refers to a useless region, i.e., the lossy portion is cut and removed at a later stage of production. When the whole-plate TFT substrate is used for processing material circulation, the whole-plate TFT substrate needs to be switched among a plurality of devices or processing posts, the peripheral part of the whole-plate TFT substrate is easy to collide and damage due to contact with a transportation rail of the devices and the like, a loss space is reserved, and the whole quality of products is effectively guaranteed. Wherein the range of the loss part may be set according to the area of the entire TFT substrate for contacting the running rail, and the width of the loss part may be more than 1cm of the width of the area for contacting the running rail.
And S130, correspondingly attaching the transparent cover plate to the plurality of electronic paper films.
In the step, the transparent cover plate is correspondingly attached to the electronic paper films. In some embodiments, the transparent cover plate may be a single transparent cover plate divided into sizes corresponding to the plurality of electronic paper films by a transparent cover plate raw material. The transparent cover plate is corresponding to the electronic paper films in size, for example, a small piece of transparent cover plate is slightly larger than the plurality of electronic paper films, and when the transparent cover plate is attached to the plurality of electronic paper films, the transparent cover plate is correspondingly attached to the plurality of electronic paper films. It should be understood that electronic paper films typically have an adhesive layer for attachment, through which a small transparent cover plate is attached to a plurality of electronic paper films. Wherein, the adhesive layer can adopt OCA (Optically clear adhesive) optical cement, so that the attaching process is more efficient and faster.
S140, the whole TFT substrate is divided to obtain a first product.
In this step, the entire TFT substrate is divided to obtain a first product in which the TFT substrate, the electronic paper film, and the transparent cover are sequentially stacked. The first product is a semi-finished product of the electronic paper display module, and a second product corresponding to a finished product of the electronic paper display module can be obtained by subsequently further processing the first product.
In some embodiments, the first product is obtained and then subjected to a dust removal cleaning. The surface of the first product can be cleaned in a blowing mode, for example, the first product is cleaned by adopting ion wind to remove dust, and then the influence on the continuous processing of the first product caused by dust generated when the whole TFT substrate is cut is avoided.
In this embodiment, according to the technical scheme of the application, the electronic paper film divided into small pieces is pasted on the whole TFT substrate for circulation production, so that the electronic paper film, the transparent cover plate and other processing materials are circulated in a large-plate circulation mode in the production process.
In the traditional technology, a TFT glass substrate and a small electronic paper film are required to be correspondingly attached one by one, and the small electronic paper film is subjected to dispensing and edge sealing in a small particle processing mode, so that the same processing actions are required to be repeated in the production of each electronic display module, and the materials are required to be loaded and fed through a plastic sucking disc between different processing stations.
The technical scheme of this application adopts the mode of big board circulation to circulate in process of production through processing materials such as electronic paper membrane, transparent cover, effectively reduces the input consuming time of material circulation in the traditional production process, improves production efficiency greatly. And in the technical scheme of this application, the TFT base plate does not cut before electronic paper membrane, the laminating of transparent cover plate, effectively avoids the glass powder that the cutting produced to cause the damage to electronic paper membrane, transparent cover plate, effectively improves the production quality of product.
Fig. 2 is another schematic flow chart of a processing method of an electronic paper display module according to an embodiment of the present application.
Referring to fig. 2, the electronic paper display module processing method of the present application includes:
and S210, dividing the electronic paper film raw material and dispensing silver paste to form a plurality of electronic paper films.
In this step, the electronic paper film raw material is divided into a predetermined size to form a plurality of electronic paper films. In some embodiments, an automatic separation device may be used to separate the raw material of electronic paper film.
And S220, adhering the plurality of electronic paper films to the whole TFT substrate according to the preset typesetting.
In this step, the plurality of electronic paper films obtained in step S210 are attached to the entire TFT substrate according to a preset layout.
In some embodiments, in order to visually observe the attaching effect of the electronic paper film, a screen printing frame corresponding to the attaching position of the electronic paper film may be disposed on the entire TFT substrate, and the attaching effect of the electronic paper film is determined by whether the electronic paper film is attached to the screen printing frame. The size of the silk screen frame can be slightly larger than that of the electronic paper film.
In some embodiments, the whole TFT substrate is pre-fabricated with a pre-fabrication circuit corresponding to the plurality of electronic paper films, and when the plurality of electronic paper films are attached to the TFT substrate, the pre-fabrication circuit can control operations of the plurality of electronic paper films.
And S230, carrying out a lighting test on the electronic paper film on the whole TFT substrate.
In the step, the electronic paper film on the whole TFT substrate is subjected to a lighting test, wherein in the lighting test process, whether defects such as dead spots, unlighted spots and the like exist on the electronic paper film can be detected. The defective products can be marked in a marking mode when the lighting test is detected, for example, the processing positions corresponding to the defective products are directly removed in subsequent processing equipment, so that the defective products are prevented from being processed continuously in the subsequent processing process, the loss of processed materials is effectively reduced, and the production cost is reduced.
In some embodiments, the electronic paper film may be subjected to a lighting test using a lighting tester. The lighting tester can have a single testing end, namely, the lighting tester can perform lighting testing on a single electronic paper film through single testing. The lighting tester may have a plurality of test terminals, and the lighting tester simultaneously performs lighting tests on the electronic paper films at a plurality of positions through the plurality of test terminals. Of course, the test end of the lighting tester may correspond to the number of the electronic paper films on the entire TFT substrate, and the lighting tester may perform the lighting test on all the electronic paper films on the entire TFT substrate at a single time through the test end.
In some embodiments, the entire TFT substrate may be preset with a preset lighting circuit, where the preset lighting circuit corresponds to all of the plurality of electronic paper films on the entire TFT substrate, and the lighting test on all of the plurality of electronic paper films and the transparent cover plate of the entire TFT substrate may be implemented through the preset lighting circuit.
S240, the transparent cover plate raw material is divided into single transparent cover plates with the sizes corresponding to the electronic paper films, and the transparent cover plates are correspondingly attached to the electronic paper films through the adhesive layers.
In this step, the transparent cover plate material is divided into individual transparent cover plates according to the sizes corresponding to the plurality of electronic paper films, and the transparent cover plates are correspondingly bonded to the plurality of electronic paper films by using the adhesive layers on the plurality of electronic paper films.
In some embodiments, the release film on the corresponding plurality of electronic paper films may be removed before the transparent cover sheet is attached, so that the corresponding plurality of electronic paper films expose the adhesive layer. In other embodiments, the release films of all the plurality of electronic paper films may be removed uniformly before the lamination. For example, a release film is used to remove all electronic paper films at one time by using a rotating roller with viscosity. And tearing off all the release films of the electronic paper films at one time, for example, by means of vacuum suction.
And S250, coating edge sealing glue on the periphery of the transparent cover plate.
In the step, the periphery of the transparent cover plate is coated with the edge sealing glue, so that the electronic paper films are sealed, and then the sealing protection of the electronic paper films is realized. The edge sealing glue can be epoxy resin glue or photosensitive glue. The size of the transparent cover plate can be slightly larger than the plurality of electronic paper films.
In some embodiments, the edge sealing glue may be applied to the periphery of the transparent cover plate by means of dispensing. The edge sealing glue is coated in a glue dispensing mode, so that the edge sealing efficiency can be effectively improved, the glue consumption can be effectively controlled, and the sealing effect can be controlled. A gap exists between the transparent cover plate and the whole TFT substrate, edge sealing glue is dotted on the periphery of the transparent cover plate, and the edge sealing glue permeates into the gap to seal the edge of the electronic paper film.
In some embodiments, the edge sealing adhesive can adopt a viscosity smaller than 5000cp, for example, the viscosity of the edge sealing adhesive is 4000cp, so that the edge sealing adhesive has better fluidity, the smoothness of the adhesive discharging process during the adhesive dispensing is effectively improved, and the edge sealing adhesive is coated on the periphery of the transparent cover plate, so that the edge sealing adhesive can more stably permeate into the gap between the transparent cover plate and the whole TFT substrate through the good fluidity, and the sealing performance of a plurality of electronic paper films is improved. It should be noted that, the edge sealing glue with low viscosity is adopted, and when the edge sealing is carried out by adopting a glue dispensing mode, the glue discharging amount is more easily controlled in the glue dispensing process, so that the glue dispensing accuracy is improved.
And S260, segmenting the whole TFT substrate according to the preset typesetting to obtain a first product.
In the step, the whole TFT substrate is divided according to the preset typesetting to form a single TFT substrate, and thus, the electronic paper film and the transparent cover plate are respectively attached to the single TFT substrate to form a semi-finished product of the electronic paper module. Wherein the TFT substrate is reserved for IC binding positions. The whole TFT substrate is cut after the electronic paper film and the transparent cover plate are attached, so that dust generated by cutting can be effectively prevented from entering the space between the electronic paper film and the transparent cover plate or scratching the surface of the transparent cover plate, defective products are reduced, and the generation quality of products is effectively improved.
In some embodiments, after the dividing, three sides of the TFT substrate may be slightly larger than the small transparent cover plate, and the remaining one side of the TFT substrate is larger than the transparent cover plate, so as to form a reserved IC binding position for binding the IC. Wherein, being slightly greater than little transparent apron through the trilateral of TFT base plate, form the supporting part that provides the support to the banding of coating in step S250 glues, like this, can leave the banding through the supporting part and glue to improve the banding effect of banding glue to electronic paper membrane.
And S270, carrying out post-processing treatment on the first product to obtain a second product.
In this step, the semi-finished product of the electronic paper module obtained in step S260 is subjected to a plurality of post-processing steps to obtain a second product. Wherein the second product corresponds to the finished product of the electronic paper module.
The post-processing procedure may include, but is not limited to, sequentially binding an IC chip (driver chip), binding an FPC (flexible printed circuit board), coating a protective adhesive, and the like on the electronic paper module semi-finished product. Of course, after the cutting of the whole TFT substrate is completed, other processing steps are performed after the glass powder generated by the cutting is removed, so that the glass powder is prevented from affecting the processing process.
In some embodiments, the post-processing procedure may include the steps of:
(1) And binding the functional module to the TFT substrate and carrying out lighting test.
In this step, the IC chip and the FPC are bound to IC binding positions reserved on a single TFT substrate, and lighting and color measurement are performed to screen out defective products. The binding process may employ techniques including, but not limited to: COG (Chip on Glass) and FOG (Film on Glass) processes. In some embodiments, the function module may be automatically bound by placing the obtained semi-finished product of the electronic paper module into the COG device and the FOG device.
(2) And coating protective glue on the binding area of the functional module.
In this step, the binding region in step S270 is coated with a protective paste. And the protection of the IC chip and the FPC flexible circuit board on the IC binding position is realized by using the protective adhesive. The protective glue can be epoxy resin glue with high thermal conductivity.
In the embodiment, the technical scheme of the application realizes the lighting test of all electronic paper films on the TFT substrate through the preset lighting circuit before the glue sealing, so that defective products can be found in time, and the material waste in the subsequent generation process is reduced; adopt the mode of gluing to carry out the banding between transparent cover plate and the TFT base plate, utilize low viscosity to seal the limit and glue and flow into in the clearance and realize the banding, effectively improve banding efficiency to reduce the material consume.
Fig. 3 is another schematic flow chart diagram of a processing method of an electronic paper display module according to an embodiment of the present application.
Referring to fig. 3, the electronic paper display module processing method of the present application includes:
and S310, dividing the electronic paper film raw material and dispensing silver paste to form a plurality of electronic paper films.
In the step, an automatic cutting device is adopted to cut the raw material of the electronic paper film to form a plurality of electronic paper films, and conductive silver paste is dotted on the plurality of electronic paper films after cutting.
And S320, adhering the plurality of electronic paper films to the whole TFT substrate according to the preset typesetting.
In this step, according to the preset typesetting, the plurality of electronic paper films with the finished point silver paste are pasted on the corresponding positions on the whole TFT substrate. Wherein the laminating position of electron paper membrane is provided with the silk screen printing frame that is used for counterpointing, can judge whether the laminating position of electron paper membrane has the skew fast through whether electron paper membrane is located the silk screen printing frame.
And S330, carrying out lighting test on the electronic paper film according to a preset lighting circuit on the whole TFT substrate.
In this step, a preset lighting circuit is preset on the whole TFT substrate, where the preset lighting circuit corresponds to all of the plurality of electronic paper films on the whole TFT substrate, and the lighting test of all of the plurality of electronic paper films on the whole TFT substrate can be realized through the preset lighting circuit.
In some embodiments, the preset lighting circuit may have a plurality of connection terminals correspondingly communicated with all of the plurality of electronic paper films on the entire TFT substrate, wherein the lighting of the plurality of electronic paper films may be respectively implemented through the plurality of connection terminals of the preset lighting circuit. It can be understood that the lighting equipment that adopts among the test procedure of lighting, if the tester of lighting, can have a plurality of test ends, like this, a plurality of test ends through lighting equipment can satisfy and predetermine a plurality of links of lighting the circuit and be connected to the messenger can carry out the test of lighting of a plurality of electronic paper membranes simultaneously.
In some embodiments, the preset lighting circuit can have a connecting end which is communicated with all the electronic paper films on the whole TFT substrate, when the lighting test is carried out, the power supply is accessed through the same power supply access port of the preset lighting circuit, and then the lighting of all the electronic paper films is realized through the connecting end of the preset lighting circuit.
S340, cutting the raw material of the transparent cover plate into single transparent cover plates with the sizes corresponding to the electronic paper films, and correspondingly attaching the transparent cover plates to the electronic paper films through the adhesive layers.
In the step, the release film is removed from all the electronic paper films on the whole TFT substrate, the adhesive layers of the electronic paper films are exposed, the transparent cover plate raw material is divided into a single transparent cover plate according to the size corresponding to the plurality of electronic paper films, and the transparent cover plate is correspondingly attached to the plurality of electronic paper films by using the adhesive layers on the plurality of electronic paper films.
In some embodiments, after the transparent cover plate is attached to the plurality of electronic paper films, the plurality of electronic films may be subjected to a secondary lighting test. Through the test of lighting up twice, can screen the electron paper membrane that the transparent cover in-process of laminating damaged. In other embodiments, in the process of performing the secondary lighting test, appearance detection may be performed on the transparent cover plate, where the appearance detection is used to detect whether the transparent cover plate has defects such as scratches and bumps.
And S350, cutting the whole TFT substrate into small TFT substrates according to the preset typesetting to obtain the semi-finished product of the electronic paper module.
In the step, the whole TFT substrate is divided according to the preset typesetting to form a single TFT substrate, wherein the size of the TFT substrate is larger than that of the electronic paper film and the transparent cover plate, and the TFT substrate is reserved with an IC binding position.
And S360, binding the functional module to the TFT substrate and carrying out lighting test.
In this step, the IC chip and the FPC flexible wiring board are bound to the IC binding site reserved on the single TFT substrate, and lighting color measurement is performed.
And S370, coating edge sealing glue on the periphery of the transparent cover plate in a glue dispensing mode.
In the step, edge sealing glue is coated on the periphery of the transparent cover plate in a glue dispensing mode, wherein a gap exists between the transparent cover plate and the whole TFT substrate, and edge sealing glue is dispensed on the periphery of the transparent cover plate and penetrates into the gap through the edge sealing glue, so that edge sealing of the electronic paper film is achieved.
And S380, coating protective glue on the binding area of the functional module.
In this step, a protective paste is applied to the functional module binding region in the TFT substrate. And the protection of the IC chip and the FPC flexible circuit board on the IC binding position is realized by using the protective adhesive.
In some embodiments, before the glue coating in step S370 or S380 is performed, the surface of the product may be cleaned by using an ion wind, wherein the ion wind may reduce the adhesion of dust on the surface of the product, and improve the cleaning effect. The surface of the product is cleaned before gluing, so that the spreading uniformity of the glue is effectively improved, and the gluing effect is further improved.
In the present application, steps S370 and S380 may not be consecutive. Two gluing steps can be carried out simultaneously, for example, automatic gluing equipment is adopted to coat the periphery of the transparent cover plate with edge sealing glue and coat the binding area of the functional module with protective glue.
In the embodiment, the technical scheme of the application arranges the steps of coating the edge sealing glue on the transparent cover plate and coating the protective glue on the functional module at the tail end of the processing flow, so that the integration of the two steps of gluing processes is facilitated, the waiting time of dry glue can be effectively saved in the gluing process, and the production efficiency is further improved; and the product can be cleaned before gluing, so that the gluing effect of the twice gluing process is improved.
Corresponding to the embodiment of the processing method of the electronic paper display module, the application also provides the electronic paper display module and the corresponding embodiment.
Fig. 4 is a schematic structural diagram of an electronic paper display module according to an embodiment of the present application.
Referring to fig. 4, the electronic paper display module is manufactured according to the aforementioned processing method of the electronic paper display module, wherein the electronic paper display module includes a TFT substrate 510, an electronic paper film 520, and a transparent cover 530, and the TFT substrate 510, the electronic paper film 520, and the transparent cover 530 are sequentially stacked from bottom to top.
In this embodiment, the electronic paper display module is pasted to whole board TFT base plate through cutting apart into the electronic paper membrane raw and other materials and is circulated the production in the preparation process on the electronic paper membrane that the chip was cut apart, realizes that processing materials such as electronic paper membrane, transparent cover plate adopt the mode of big board circulation to circulate in process of production, reduces the consuming time input of material circulation in the traditional production process, improves production efficiency greatly.
Corresponding to the electronic paper display module processing method and the electronic paper display module embodiment, the application also provides electronic paper display equipment and a corresponding embodiment.
The electronic paper display equipment provided by the embodiment has the electronic paper display module manufactured by the electronic paper display module processing method, so that the time consumption of product generation is effectively reduced, and the production efficiency is improved.
Having described embodiments of the present application, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or improvements to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (10)
1. A processing method of an electronic paper display module is characterized by comprising the following steps:
cutting the raw material of the electronic paper film and dispensing silver paste to form a plurality of electronic paper films;
attaching a plurality of electronic paper films to the whole TFT substrate;
correspondingly attaching a transparent cover plate to the electronic paper films;
and cutting the whole TFT substrate to obtain a first product.
2. The processing method of the electronic paper display module according to claim 1, wherein the step of correspondingly attaching a transparent cover plate to the plurality of electronic paper films comprises:
cutting the raw material of the transparent cover plate into a single transparent cover plate with the size corresponding to that of the electronic paper film, and correspondingly attaching the transparent cover plate to the electronic paper film through an adhesive layer.
3. The processing method of the electronic paper display module according to claim 1, wherein after the adhering the plurality of electronic paper films to the whole TFT substrate and/or after the adhering the transparent cover plate to the plurality of electronic paper films, the method further comprises:
and carrying out a lighting test on the electronic paper film on the whole TFT substrate.
4. The processing method of the electronic paper display module according to claim 3, wherein the lighting test of the electronic paper film and the transparent cover plate on the whole TFT substrate comprises:
and carrying out lighting test on the electronic paper film according to a preset lighting circuit on the whole TFT substrate.
5. The processing method of the electronic paper display module according to claim 1, wherein after the transparent cover plate is correspondingly attached to the plurality of electronic paper films, the method further comprises:
and coating edge sealing glue on the periphery of the transparent cover plate.
6. The method of processing an electronic paper display module of claim 5, wherein the edge banding adhesive has a tack of less than 5000cp.
7. The processing method of the electronic paper display module according to claim 6, wherein when the edge sealing adhesive has a viscosity of less than 5000cp, the step of applying the edge sealing adhesive to the periphery of the transparent cover plate comprises:
and coating edge sealing glue on the periphery of the transparent cover plate in a glue dispensing mode.
8. The processing method of the electronic paper display module according to claim 1, further comprising:
and carrying out post-processing treatment on the first product to obtain a second product.
9. The utility model provides an electronic paper display module assembly which characterized in that:
the electronic paper display module is manufactured according to the processing method of the electronic paper display module of any one of claims 1 to 8, and comprises a cover plate, an electronic paper film and a substrate; the cover plate, the electronic paper film and the substrate are sequentially overlapped from top to bottom.
10. An electronic paper display device, comprising: the electronic paper display module of claim 9.
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| CN202211296834.2A CN115524893A (en) | 2022-10-21 | 2022-10-21 | Electronic paper display module processing method, electronic paper display module and display equipment |
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| CN202211296834.2A CN115524893A (en) | 2022-10-21 | 2022-10-21 | Electronic paper display module processing method, electronic paper display module and display equipment |
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| US20100144229A1 (en) * | 2008-12-09 | 2010-06-10 | Changhoon Lee | Fabrication line of electrophoretic display device and method of fabricating electrophoretic display device |
| KR20130110039A (en) * | 2012-03-28 | 2013-10-08 | 한국과학기술원 | Electronic paper display having vertical electrode structure and method for fabricating the same |
| CN111161648A (en) * | 2020-02-27 | 2020-05-15 | 亚世光电股份有限公司 | Full-page hot-pressing laminating and edge sealing process method for electronic ink screen |
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- 2022-10-21 CN CN202211296834.2A patent/CN115524893A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100144229A1 (en) * | 2008-12-09 | 2010-06-10 | Changhoon Lee | Fabrication line of electrophoretic display device and method of fabricating electrophoretic display device |
| KR20130110039A (en) * | 2012-03-28 | 2013-10-08 | 한국과학기술원 | Electronic paper display having vertical electrode structure and method for fabricating the same |
| CN111161648A (en) * | 2020-02-27 | 2020-05-15 | 亚世光电股份有限公司 | Full-page hot-pressing laminating and edge sealing process method for electronic ink screen |
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