CN115513630B - Coplanar waveguide power divider and antenna - Google Patents
Coplanar waveguide power divider and antenna Download PDFInfo
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- CN115513630B CN115513630B CN202211085667.7A CN202211085667A CN115513630B CN 115513630 B CN115513630 B CN 115513630B CN 202211085667 A CN202211085667 A CN 202211085667A CN 115513630 B CN115513630 B CN 115513630B
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- 230000005540 biological transmission Effects 0.000 claims abstract description 99
- 229910052751 metal Inorganic materials 0.000 claims abstract description 96
- 239000002184 metal Substances 0.000 claims abstract description 96
- 238000005452 bending Methods 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 230000005855 radiation Effects 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 10
- 238000004088 simulation Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005388 cross polarization Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
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- 238000012545 processing Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/18—Waveguides; Transmission lines of the waveguide type built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers
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- Waveguide Aerials (AREA)
Abstract
The invention discloses a coplanar waveguide power divider and an antenna, wherein the coplanar waveguide power divider comprises: the PCB structure is composed of a top metal layer, a dielectric substrate and a bottom metal layer, wherein the top metal layer comprises a coplanar waveguide transmission line and a reference ground metal plane, and the PCB structure further comprises: for each bending position of the coplanar waveguide transmission line, a group of bonding wires are arranged at the front section transmission line of the bending position, and a group of bonding wires are arranged at the rear section transmission line of the bending position; the bonding wire arranged at the front/rear section transmission line of the bending part spans over the front/rear section transmission line, and two ends of the bonding wire are connected to the metal plane and are perpendicular to the front/rear section transmission line. The invention can balance the transmission phase distortion of the coplanar waveguide at the bending position and improve the transmission performance of the coplanar waveguide bending transmission line at high frequency in the PCB process.
Description
Technical Field
The invention relates to the technical field of antennas, in particular to a coplanar waveguide power divider and an antenna.
Background
With the continuous development of the fields of communication, radar, personal electronic consumption and the like, the coplanar waveguide transmission line is very suitable for being applied to radio frequency circuits and antennas due to the characteristics of plane, easy processing and low cost. The problem of phase discontinuity at the bend of the coplanar waveguide transmission line is particularly pronounced in high frequency applications, greatly limiting the use of such low cost transmission lines at high frequencies. How to improve the high-frequency performance of the coplanar waveguide bending transmission line at low cost is a key problem to be solved.
Disclosure of Invention
Therefore, the invention aims to provide a coplanar waveguide power divider and an antenna, which can balance the transmission phase distortion of a coplanar waveguide at a bending position and improve the transmission performance of the coplanar waveguide bending transmission line under the PCB process at high frequency.
Based on the above object, the present invention provides a coplanar waveguide power divider, comprising: the PCB structure is composed of a top metal layer, a dielectric substrate and a bottom metal layer, wherein the top metal layer comprises a coplanar waveguide transmission line and a reference ground metal plane, and the PCB structure further comprises:
for each bending position of the coplanar waveguide transmission line, a group of bonding wires are arranged at the front section transmission line of the bending position, and a group of bonding wires are arranged at the rear section transmission line of the bending position;
the bonding wire arranged at the front/rear section transmission line of the bending part spans over the front/rear section transmission line, and two ends of the bonding wire are connected to the metal plane and are perpendicular to the front/rear section transmission line.
Wherein, a group of bonding wires specifically comprises 4-8 metal wires.
Preferably, the bonding wire is made of gold, aluminum or copper.
Further, the coplanar waveguide power divider further includes: and metal vias connected between the metal plane of the top metal layer and the bottom metal layer are arranged on two sides of the coplanar waveguide transmission line.
Preferably, the bending part of the coplanar waveguide transmission line adopts a chamfer structure.
The invention also provides an antenna comprising: the coplanar waveguide power divider comprises the coplanar waveguide power divider, a plurality of conversion structures respectively connected to output ports of the coplanar waveguide power divider, and a plurality of antenna units respectively connected with the conversion structures.
Wherein the antenna unit includes: the substrate integrated waveguide cavity is formed around the rectangular radiation caliber;
the substrate integrated waveguide cavity is formed by arranging a plurality of metal through holes connected between the top metal layer and the bottom metal layer on the periphery of the rectangular radiation caliber.
Preferably, a pair of metal patches and a pair of additional slits are arranged in the rectangular radiation caliber.
Preferably, three metal vias connected between the top metal layer and the bottom metal layer are further arranged in the substrate integrated waveguide cavity, and the three metal vias are distributed in a triangular shape.
The coplanar waveguide power divider in the technical scheme of the invention comprises: the PCB structure is composed of a top metal layer, a dielectric substrate and a bottom metal layer, wherein the top metal layer comprises a coplanar waveguide transmission line and a metal plane insulated from the coplanar waveguide transmission line, and the PCB structure further comprises: for each bending position of the coplanar waveguide transmission line, a group of bonding wires are arranged at the front section transmission line of the bending position, and a group of bonding wires are arranged at the rear section transmission line of the bending position; the bonding wire arranged at the front/rear section transmission line of the bending part spans over the front/rear section transmission line, and two ends of the bonding wire are connected to the metal plane and are perpendicular to the front/rear section transmission line. By arranging the bonding wire near the bending position of the coplanar waveguide, the transmission phase distortion of the coplanar waveguide at the bending position can be balanced, and the transmission performance of the bending transmission line of the coplanar waveguide in the high frequency process of the PCB is improved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a coplanar waveguide power divider according to a first embodiment of the present invention;
FIG. 2 is a schematic diagram of standing wave ratio of a coplanar waveguide power divider according to a first embodiment of the present invention;
FIG. 3 is a schematic diagram of power division amplitude of a coplanar waveguide power divider according to a first embodiment of the present invention;
FIG. 4 is a schematic diagram of the amplitude of power division of a power divider without phase compensation according to the prior art;
fig. 5 is a schematic structural diagram of an antenna according to a second embodiment of the present invention;
fig. 6 is a standing-wave ratio simulation result and a gain diagram of an antenna according to a second embodiment of the present invention;
fig. 7, 8 and 9 are schematic diagrams of simulation gain directions of an antenna at 50GHz, 60GHz and 70GHz according to a second embodiment of the present invention.
Detailed Description
The present invention will be further described in detail below with reference to specific embodiments and with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the present invention more apparent.
It should be noted that unless otherwise defined, technical or scientific terms used in the embodiments of the present invention should be given the ordinary meaning as understood by one of ordinary skill in the art to which the present disclosure pertains. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
The inventor of the present invention found that the problem of discontinuous phase of the coplanar waveguide transmission line at the bending position in the prior art is particularly prominent in high-frequency application, and greatly limits the application of the low-cost transmission line at high frequency; therefore, the inventor of the invention considers that when the coplanar waveguide transmission line transmits high-frequency signals, the phenomenon of inconsistent phase caused by different path lengths of signals at the bending position is particularly obvious, and by applying a bonding wire process, the bonding wire is arranged near the bending position of the coplanar waveguide, and two ends of the bonding wire are connected with the reference ground metal layers at two sides of the coplanar waveguide transmission line, the phase difference at two sides of the coplanar waveguide can be balanced, and the phase difference of the coplanar waveguide transmission line at the bending position is compensated, so that the high-frequency performance of the coplanar waveguide bending transmission line is improved.
The following describes the technical scheme of the embodiment of the present invention in detail with reference to the accompanying drawings.
Example 1
The first embodiment of the present invention provides a coplanar waveguide power divider, whose structure is shown in fig. 1, including: a PCB (printed circuit board) structure composed of a top metal layer 13, a dielectric substrate 22 and a bottom metal layer 31;
the top metal layer 13 may be a metal layer laid on the upper surface of the dielectric substrate 22, and includes: coplanar waveguide transmission line 11, and a reference ground metal plane of coplanar waveguide transmission line 11.
The bottom metal layer 31 may be a metal layer laid on the lower surface of the dielectric substrate 22; the metal plane laid in the underlying metal layer 31 is the reference ground metal plane of the coplanar waveguide transmission line 11.
The first embodiment of the invention provides a coplanar waveguide power divider, which further comprises: and a bonding wire 12 disposed near the bend of the coplanar waveguide transmission line 11.
Specifically, for each bend of the coplanar waveguide transmission line, a group of bonding wires 12 is arranged at the front section transmission line of the bend; a set of bond wires 12 is also provided at the rear section of the transmission line at the bend. That is, for each bend of the coplanar waveguide transmission line, two sets of bonding wires 12 are respectively provided at the front and rear transmission lines of the bend.
The bonding wire is arranged at the front section transmission line of the bending part, spans over the front section transmission line, and two ends of the bonding wire are connected to the metal plane and are perpendicular to the front section transmission line;
and the bonding wire is arranged at the rear section transmission line of the bending part, spans over the rear section transmission line, and two ends of the bonding wire are connected to the metal plane and are perpendicular to the rear section transmission line.
The bonding wire 12 is used as a phase compensation structure of the coplanar waveguide power divider, so that the phase of the high-frequency coplanar waveguide transmission line at the bending position can be compensated, the transmission performance of the coplanar waveguide bending transmission line at high frequency in the PCB process is improved, the performance of the coplanar waveguide power divider is effectively improved, and the broadband low-loss power division characteristic is realized.
Preferably, the bending part of the coplanar waveguide transmission line adopts a chamfer structure, and a group of bonding wires can specifically comprise 4-8 metal wires for compensating the phases of two ends of the grounded coplanar waveguide; the bonding wire can be made of gold, aluminum or copper.
Further, the coplanar waveguide power divider provided in the first embodiment of the present invention may further include: metal vias 21 connected between the metal plane of the top metal layer and the bottom metal layer are arranged on both sides of the coplanar waveguide transmission line; the metal through hole 21 is used for preventing leakage of electromagnetic waves in the dielectric substrate and reducing transmission loss of the power divider.
The coplanar waveguide power divider can be a millimeter wave broadband coplanar waveguide power divider specifically and comprises an input port and a plurality of output ports; and the output port is used for outputting radio frequency signals subjected to power distribution through the coplanar waveguide transmission line.
For example, the coplanar waveguide power divider is specifically a one-to-four power divider, is formed by a two-stage T-shaped structure, realizes constant-amplitude in-phase power division and comprises five ports; the GSG radio frequency probe feed with 200 μm or 250 μm spacing is used at the input ports, and four output ports are used for outputting four radio frequency signals.
The first embodiment of the invention provides a coplanar waveguide power divider which is a millimeter wave broadband coplanar waveguide one-to-four power divider, and the standing-wave ratio simulation result is shown in fig. 2. As can be obtained from FIG. 2, the standing-wave ratio of the power divider without the phase compensation structure is obviously deteriorated at 60-70GHz, while the standing-wave ratio of the power divider with the phase compensation structure provided by the embodiment of the invention is less than 2 within 50-75GHz, so that the performance of the power divider is effectively improved.
Fig. 3 and fig. 4 are schematic diagrams of amplitude simulation results of a millimeter wave broadband coplanar waveguide quarter-power divider plus phase compensation structure and a power divider without phase compensation structure in the prior art according to the first embodiment of the present invention. It can be seen that the power divider without the phase compensation structure in the prior art cannot realize the characteristic of power division, but the power divider with the phase compensation structure in the first embodiment of the invention can realize the broadband low-loss power division characteristic.
In summary, the millimeter wave broadband coplanar waveguide one-to-four power divider of the first embodiment of the invention has the advantages of compact structure, wide bandwidth, low loss, low cost and the like. The phase compensation structure of the coplanar waveguide bending transmission line is introduced into the power divider, so that the impedance matching and the power dividing performance of the power divider are improved; by adopting a two-stage T-shaped junction as a power division structure, the four-port approximate equal-amplitude in-phase output is realized; by adding metal through holes at two ends of the coplanar waveguide transmission line, the transmission loss is reduced.
Example two
An antenna according to a second embodiment of the present invention includes a coplanar waveguide power divider as shown in fig. 1, a plurality of switching structures respectively connected to output ports of the coplanar waveguide power divider, and a plurality of antenna units respectively connected to the switching structures.
Specifically, as shown in fig. 5, an antenna provided in a second embodiment of the present invention includes: a PCB (printed circuit board) structure composed of a top metal layer 47, a dielectric substrate 53 and a bottom metal layer 61;
the top metal layer 47 may be a metal layer laid on the upper surface of the dielectric substrate 53, and includes: a coplanar waveguide transmission line 46, and a reference ground metal plane for the coplanar waveguide transmission line 46. The coplanar waveguide transmission line 46 forms the grounded coplanar waveguide feed network of the antenna.
The bottom metal layer 61 may be a metal layer laid on the lower surface of the dielectric substrate 53; the metal plane laid in the underlying metal layer 31 is a reference ground metal plane.
An antenna provided in a second embodiment of the present invention further includes: and a bonding wire 45 disposed near the bend of the coplanar waveguide transmission line 46. Specifically, for each bending position of the coplanar waveguide transmission line, a group of bonding wires 45 are arranged at the front section transmission line of the bending position; a set of bond wires 45 are also provided at the rear section of the transmission line at the bend. That is, for each bend of the coplanar waveguide transmission line, two sets of bonding wires 45 are respectively provided at the front and rear transmission lines of the bend. The bonding wire is arranged at the front section transmission line of the bending part, spans over the front section transmission line, and two ends of the bonding wire are connected to the metal plane and are perpendicular to the front section transmission line; and the bonding wire is arranged at the rear section transmission line of the bending part, spans over the rear section transmission line, and two ends of the bonding wire are connected to the metal plane and are perpendicular to the rear section transmission line.
The bonding wire 45 is used as a phase compensation structure, so that the phase of the high-frequency coplanar waveguide transmission line at the bending position can be compensated, the transmission performance of the coplanar waveguide bending transmission line at high frequency in the PCB process is improved, the performance of the coplanar waveguide power divider is effectively improved, and the broadband low-loss power division characteristic is realized.
As can be seen from fig. 5, the coplanar waveguide power divider with the same structure as the first embodiment of the present invention can be formed by the top metal layer 47, the dielectric substrate 53, the bottom metal layer 61, the coplanar waveguide transmission line 46 and the bonding wire 45; further, the coplanar waveguide power divider of the antenna provided in the second embodiment of the present invention may further include: metal vias 52 connected between the metal plane of the top metal layer and the bottom metal layer are provided on both sides of the coplanar waveguide transmission line; the metal through hole 52 is used for preventing leakage of electromagnetic waves in the dielectric substrate and reducing transmission loss of the power divider.
A switching structure 44 is connected to each output port of the coplanar waveguide power divider; one antenna element for each switching structure 44;
an antenna unit in an antenna provided in a second embodiment of the present invention includes: a rectangular radiation aperture 43 disposed on the top metal layer 47 of the coplanar waveguide power divider and opposite to the corresponding conversion structure 44, and a substrate integrated waveguide cavity 51 formed around the rectangular radiation aperture 43;
wherein, the substrate integrated waveguide cavity 51 is formed by disposing a plurality of metal vias 52 connected between the top metal layer and the bottom metal layer at the periphery of the rectangular radiation aperture 43.
Further, three metal vias connected between the top metal layer and the bottom metal layer are further disposed in the substrate integrated waveguide cavity 51, and the three metal vias are distributed in a triangle shape. The metal via holes introduced in the substrate integrated cavity are used for improving electric field distribution in the cavity and widening the working bandwidth of the antenna.
A pair of metal patches 41 are arranged in the rectangular radiation caliber 43, and a pair of rectangular coupling gaps, namely additional gaps 42, are further arranged on the lower edge of the rectangular radiation caliber 43. A pair of rectangular patches introduced into the radiation aperture form a broadband radiation structure; and a pair of additional gaps are arranged in the radiation caliber and are used for improving the matching performance of the antenna.
The substrate integrated waveguide cavities 51 are in one-to-one correspondence with the rectangular radiation apertures 43.
If the coplanar waveguide power divider in the antenna is specifically a quarter-division power divider, the antenna includes four antenna units, that is, four rectangular radiating apertures. The four rectangular radiation apertures 43 are arranged in a 1×4 array on the upper surface of the dielectric plate 53. The millimeter wave broadband coplanar waveguide power divider is used as a feed network to perform approximately equal power distribution on the four antenna units.
Fig. 6 shows standing wave ratio simulation results and gains of a 1×4 array of millimeter wave broadband antennas according to a second embodiment of the present invention. As can be seen from fig. 6, in the frequency range of 50-75GHz, the standing wave ratio of the antenna is less than 2, the gain is greater than 9.8dBi, and the antenna has the characteristics of wide bandwidth and high gain.
Fig. 7, 8 and 9 are respectively simulation gain patterns at 50GHz, 60GHz and 70GHz according to the second embodiment of the present invention, and it can be seen from the figures that the sidelobe level of the antenna is less than-10 dB, the cross polarization is less than-30 dB at about 0 °, and the antenna has good linear polarization characteristics in the main radiation direction.
In summary, the millimeter wave broadband antenna of the second embodiment of the present invention has the advantages of wide bandwidth, high gain, low cost, and the like. The coplanar waveguide power divider of the first embodiment is adopted as a feed network, so that equal-amplitude in-phase excitation of the antenna unit is realized, and the whole structure of the antenna is compact; adopting a substrate integrated cavity to realize broadband higher-order mode resonance; by introducing a pair of metal patches and a pair of additional slits into the radiation aperture, the impedance matching of the antenna is improved, and the gain bandwidth of the antenna is widened.
Those of ordinary skill in the art will appreciate that: the discussion of any of the embodiments above is merely exemplary and is not intended to suggest that the scope of the disclosure, including the claims, is limited to these examples; the technical features of the above embodiments or in the different embodiments may also be combined within the idea of the invention, the steps may be implemented in any order and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity.
Additionally, well-known power/ground connections to Integrated Circuit (IC) chips and other components may or may not be shown within the provided figures, in order to simplify the illustration and discussion, and so as not to obscure the invention. Furthermore, the devices may be shown in block diagram form in order to avoid obscuring the invention, and also in view of the fact that specifics with respect to implementation of such block diagram devices are highly dependent upon the platform within which the present invention is to be implemented (i.e., such specifics should be well within purview of one skilled in the art). Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the invention, it should be apparent to one skilled in the art that the invention can be practiced without, or with variation of, these specific details. Accordingly, the description is to be regarded as illustrative in nature and not as restrictive.
While the invention has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of those embodiments will be apparent to those skilled in the art in light of the foregoing description.
The embodiments of the invention are intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Therefore, any omission, modification, equivalent replacement, improvement, etc. of the present invention should be included in the scope of the present invention.
Claims (10)
1. A coplanar waveguide power divider comprising: the PCB structure formed by a top metal layer, a dielectric substrate and a bottom metal layer, wherein the top metal layer comprises a coplanar waveguide transmission line and a reference ground metal plane, and the PCB structure is characterized by further comprising:
for each bending position of the coplanar waveguide transmission line, a group of bonding wires are arranged at the front section transmission line of the bending position, and a group of bonding wires are arranged at the rear section transmission line of the bending position;
the bonding wire arranged at the front/rear section transmission line of the bending part spans over the front/rear section transmission line, and two ends of the bonding wire are connected to the metal plane and are perpendicular to the front/rear section transmission line.
2. The coplanar waveguide power divider according to claim 1, wherein the set of bond wires comprises in particular 4-8 metal wires.
3. The coplanar waveguide power divider according to claim 1, wherein the bonding wire is made of gold, aluminum or copper.
4. The coplanar waveguide power divider according to claim 1, further comprising: and metal vias connected between the metal plane of the top metal layer and the bottom metal layer are arranged on two sides of the coplanar waveguide transmission line.
5. The coplanar waveguide power divider according to claim 1, wherein the coplanar waveguide transmission line has a corner cut structure at a bend.
6. The coplanar waveguide power divider according to claim 1, wherein the coplanar waveguide power divider comprises an input port and a plurality of output ports; and the output port is used for outputting radio frequency signals subjected to power distribution through the coplanar waveguide transmission line.
7. An antenna, comprising: a coplanar waveguide power divider according to any one of claims 1 to 6, a plurality of switching structures respectively connected to output ports of the coplanar waveguide power divider, and a plurality of antenna elements respectively connected to the switching structures.
8. The antenna of claim 7, wherein the antenna element comprises: the substrate integrated waveguide cavity is formed around the rectangular radiation caliber;
the substrate integrated waveguide cavity is formed by arranging a plurality of metal through holes connected between the top metal layer and the bottom metal layer on the periphery of the rectangular radiation caliber.
9. The antenna of claim 8, wherein a pair of metal patches and a pair of additional slots are disposed within the rectangular radiating aperture.
10. The antenna of claim 8, wherein three metal vias are further disposed in the substrate integrated waveguide cavity and connected between the top metal layer and the bottom metal layer, the three metal vias being distributed in a triangular shape.
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