CN115484738A - Antenna assembly and manufacturing method thereof - Google Patents
Antenna assembly and manufacturing method thereof Download PDFInfo
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- CN115484738A CN115484738A CN202110661382.2A CN202110661382A CN115484738A CN 115484738 A CN115484738 A CN 115484738A CN 202110661382 A CN202110661382 A CN 202110661382A CN 115484738 A CN115484738 A CN 115484738A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 238000002955 isolation Methods 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 56
- 230000008878 coupling Effects 0.000 description 8
- 238000010168 coupling process Methods 0.000 description 8
- 238000005859 coupling reaction Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 238000000059 patterning Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Manufacturing & Machinery (AREA)
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Abstract
The application discloses an antenna assembly and a manufacturing method thereof. The antenna assembly includes: the first circuit board comprises a first substrate and a first antenna unit layer arranged on the surface of one side of the first substrate, wherein the first antenna unit layer comprises a plurality of first antenna units which are arranged in an array; the second circuit board comprises a second substrate and a second antenna unit layer arranged on the surface of one side of the second substrate, and the second antenna unit layer comprises a plurality of second antenna units which are arranged in an array; the second circuit board is fixedly connected with the first circuit board, the second antenna unit layer is arranged on one side, away from the first antenna unit layer, of the first substrate, so that each first antenna unit is arranged opposite to one second antenna unit, and the first antenna units and the second antenna units are coupled to receive or send signals with preset frequency.
Description
Technical Field
The application belongs to the technical field of antenna devices, and particularly relates to an antenna assembly and a manufacturing method thereof.
Background
The conventional antenna arranged on the printed circuit board generally needs to be attached to the surface of the printed circuit board, and when the antenna is an antenna part with a plurality of array arrangements, the attachment processing process is complex.
In addition, for the printed circuit board, it is usually necessary to set a plurality of power amplifiers on the surface thereof to respectively correspond to at least one antenna portion, and at this time, due to the warping degree of the printed circuit board, the distance between adjacent power amplifiers needs to be set to be larger, so that the required size of the whole printed circuit board is too large, and the utilization ratio of the layout of the printed circuit board is reduced.
Disclosure of Invention
The present application provides an antenna assembly and a manufacturing method thereof to solve the above technical problems.
In order to solve the technical problem, the application adopts a technical scheme that: providing an antenna assembly, the antenna assembly comprising:
the first circuit board comprises a first substrate and a first antenna unit layer arranged on one side surface of the first substrate, wherein the first antenna unit layer comprises a plurality of first antenna units which are arranged in an array;
the second circuit board comprises a second substrate and a second antenna unit layer arranged on the surface of one side of the second substrate, and the second antenna unit layer comprises a plurality of second antenna units which are arranged in an array;
the second circuit board is fixedly connected with the first circuit board, the second antenna unit layer is arranged on one side, away from the first antenna unit layer, of the first substrate, so that each first antenna unit and one second antenna unit are arranged oppositely, and the first antenna unit and the second antenna unit are coupled and used for receiving or sending signals with preset frequency.
Optionally, a plurality of isolation holes are formed in the first circuit board, and a plurality of isolation holes are formed around the first antenna unit in the peripheral direction.
Optionally, the first circuit board is provided with a plurality of isolation holes, the isolation holes are surrounded on the first substrate to form a plurality of grids, and each first antenna unit is disposed in one of the grids.
Optionally, the isolation hole includes a through hole penetrating through the first substrate, and a conductive medium disposed in the through hole.
Optionally, a groove is formed in a side of the first substrate away from the first antenna unit layer, and at least one of the second antenna units is accommodated and arranged towards the groove.
Optionally, the second circuit board includes a second substrate and a plurality of sub-boards disposed on opposite sides of the second substrate, where each sub-board includes a sub-substrate and a conductive trace layer disposed on at least one side of the sub-substrate;
the plurality of layers of daughter boards arranged on two opposite sides of the second circuit board are arranged in mirror symmetry by taking the second circuit board as a symmetry center.
Optionally, the sub-substrates of the two sub-boards located on the two opposite sides of the second substrate and having the same distance with the second substrate are made of the same material and/or have the same thickness.
In order to solve the technical problem, the other technical scheme adopted by the application is as follows: provided is a method of manufacturing an antenna assembly, the method of manufacturing the antenna assembly including:
preparing a first circuit board and a second circuit board, wherein the first circuit board comprises a first substrate and a first antenna unit layer arranged on the surface of one side of the first substrate, and the first antenna unit layer comprises a plurality of first antenna units which are arranged in an array manner; the second circuit board comprises a second substrate and a second antenna unit layer arranged on the surface of one side of the second substrate, and the second antenna unit layer comprises a plurality of second antenna units which are arranged in an array;
and fixedly connecting the first circuit board and the second circuit board so as to oppositely arrange each first antenna unit and one second antenna unit.
Optionally, the step of fixedly connecting the first circuit board and the second circuit board includes:
and welding or adhering and fixing the first circuit board and the second circuit board.
Optionally, before the step of fixedly connecting the first circuit board and the second circuit board, the method further includes:
a groove is formed in one side, away from the first antenna unit layer, of the first circuit board;
the step of fixedly connecting the first circuit board and the second circuit board comprises:
and covering the groove on at least one first antenna unit, and fixedly connecting the first circuit board and the second circuit board.
The beneficial effect of this application is: in the scheme of this application, be a plurality of first antenna unit that the array was arranged through setting up on first circuit board, and set up a plurality of second antenna unit that are the array and arrange on the second circuit board, and then link firmly first circuit board and second circuit board, thereby can make each first antenna unit and a second antenna unit that corresponds can set up relatively, thereby can make the antenna module that forms and have a plurality of sub-antenna unit, its manufacturing approach is simple, swiftly, thereby can improve the production efficiency of antenna module. Furthermore, the daughter boards on two sides of the second substrate are arranged in a mirror symmetry mode by taking the second substrate as a symmetry center, so that the flatness of the formed second circuit board can be improved, and further the second circuit board can be enabled to deviate from one side surface of the second antenna unit layer and can be used for being attached with a plurality of electronic elements arranged in a high-density mode, after the first circuit board and the second circuit board are fixedly connected in welding or bonding directions to form an antenna assembly, the second circuit board does not interfere with the electronic elements on one side surface of the second antenna unit layer.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a schematic structural diagram illustrating an embodiment of an antenna assembly provided herein;
FIG. 2 is a top view of the antenna assembly shown in FIG. 1;
FIG. 3 is a schematic structural view of another embodiment of the antenna assembly shown in FIG. 1;
fig. 4 is a schematic flowchart of an embodiment of a method for manufacturing an antenna assembly provided by the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
It should be noted that if directional indications (such as up, down, left, right, front, back, 8230; \8230;) are referred to in the embodiments of the present application, the directional indications are only used to explain the relative positional relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present application, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, technical solutions between the embodiments may be combined with each other, but must be based on the realization of the technical solutions by a person skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope claimed in the present application.
Please refer to fig. 1-2. Fig. 1 is a schematic structural diagram of an embodiment of an antenna assembly provided herein; fig. 2 is a top view of the antenna assembly shown in fig. 1.
The antenna assembly 10 includes, among other things, a first circuit board 100 and a second circuit board 200.
The first circuit board 100 includes a first substrate 110 and a first antenna unit layer 120 disposed on a side surface of the first substrate 110, wherein the first antenna unit layer 120 includes a plurality of first antenna units 121 arranged in an array; the second circuit board 200 includes a second substrate 210 and a second antenna unit layer 220 disposed on a surface of one side of the second substrate 210, and the second antenna unit layer 220 includes a plurality of second antenna units 221 arranged in an array. The second circuit board 200 is fixedly connected to the first circuit board 100, and the second antenna unit layer 220 is disposed on a side of the first substrate 110 away from the first antenna unit layer 120, so that each of the first antenna units 121 is disposed opposite to one of the second antenna units 221, and the first antenna units 121 and the second antenna units 221 are coupled to receive or transmit signals with a predetermined frequency.
Therefore, in the scheme of the application, the plurality of first antenna units 121 arranged in an array are arranged on the first circuit board 100, the plurality of second antenna units 221 arranged in an array are arranged on the second circuit board 200, and the first circuit board 100 and the second circuit board 200 are fixedly connected, so that each first antenna unit 121 and one corresponding second antenna unit 221 can be arranged relatively, and the antenna assembly 10 with the plurality of sub-antenna units can be formed.
In this embodiment, a first antenna element 121 and a second antenna element 221 are disposed opposite to each other and coupled to form a sub-antenna unit. The plurality of first antenna units 121 arranged in an array and the plurality of second antenna units 221 arranged in an array may be disposed in a one-to-one correspondence, and form a plurality of sub-antenna units. The first antenna element 121 and the second antenna element 221 in each sub-antenna element may be coupled to transmit or receive a signal of a predetermined frequency.
The first antenna element 121 may be a conductive metal element disposed on the surface of the first substrate 110. The first antenna unit layer 120 may be formed by patterning a conductive metal layer disposed on one side surface of the first substrate 110. Specifically, the patterning process in this embodiment may be expressed as etching the conductive metal layer on the surface of one side of the first substrate 110 by using a photo development and etching process to form a plurality of metal circuit units arranged in an array, and each metal circuit unit may be expressed as one of the first antenna units 121 described above.
The second circuit board 200 may be a multi-layer circuit layer, the second antenna unit layer 220 is disposed on a surface layer of the second circuit board 200, and the second antenna unit layer 220 may also be formed by patterning a conductive metal layer disposed on the surface layer of the second circuit board 200.
Therefore, in the solution of the present application, a plurality of first antenna units 121 are formed on the first circuit board 100 and a plurality of second antenna units 221 are formed on the second circuit board 200 by means of patterning, and then the first circuit board 100 and the second circuit board 200 are connected, so that the positional accuracy of the formed plurality of sub-antenna units can be ensured.
In addition, the first antenna element 121 and the second antenna element 221 may be formed by patterning, and the first antenna element 121 and the second antenna element 221 may be formed in a predetermined shape. And the shapes of the first antenna unit 121 and the second antenna unit 221 can be adjusted according to the coupling degrees of the first antenna unit 121 and the second antenna unit 221, so that the first antenna unit 121 and the second antenna unit 221 can be matched to form a sub-antenna unit with a coupling degree meeting a preset requirement.
In this embodiment, the first antenna unit 121 may be used to transmit signals to the outside or receive signals transmitted by the outside.
Specifically, a feed line 230 is further provided on the second circuit board 200. The feeding line 230 includes a feeding line hole 231 penetrating through the second circuit board 200, a conductive layer 232 disposed in the feeding line hole 231, and a component mounting portion 233 disposed on a side surface of the second circuit board 200 facing away from the second antenna unit layer 220.
One end of the conductive layer 232 may be connected to and form an electrical connection with the second antenna unit 221; the other end of the conductive layer 232 may be connected to and electrically connected to the component mounting portion 233.
The component mounting portion 233 may be used to mount electronic devices such as a power amplifier, and the power amplifier may be connected to a predetermined control device.
Therefore, the preset control device can transmit a preset signal to an electronic device such as a power amplifier, and the preset signal can be processed by the electronic device such as the power amplifier and then transmitted to the second antenna unit 221 through the component mounting portion 233 and the conductive layer 232 in sequence, further, the first antenna unit 121 can be coupled with the second antenna unit 221 to form a coupling signal, and the formed coupling signal can be transmitted to the outside through the first antenna unit 121. The above process is a process of generating a signal having a predetermined frequency by the antenna assembly.
When the antenna assembly receives an external signal, a signal with a preset frequency transmitted from the outside can be received by the first antenna unit 121, and then the second antenna unit 221 can be coupled with the first antenna unit 121 to generate a coupling signal of the signal, and the generated coupling signal can be sequentially transmitted to an electronic device such as a power amplifier mounted on the component mounting portion 233 through the conductive layer 232 and the component mounting portion 233, so that the electronic device can perform subsequent processing on the coupling signal.
Further, in the present embodiment, a first isolation hole 130 is further disposed on the first circuit board 100. The number of the first isolation holes 130 may be multiple, and a plurality of first isolation holes 130 may be disposed around the outer circumference of each first antenna unit 121.
The plurality of first isolation holes 130 are disposed around the outer circumference of the first antenna element 121, so that electromagnetic shielding can be formed, and unstable signals received or transmitted due to interference of adjacent sub-antenna elements can be avoided.
In this embodiment, optionally, the plurality of first isolation holes 130 are disposed around the first antenna element 121, which may be expressed as that a central connecting line of the plurality of first isolation holes 130 disposed in the outer circumferential direction of each first antenna element 121 may form a closed pattern surrounding the first antenna element 121. For example, a circle or a polygon may be formed.
In other embodiments, the first isolation holes 130 in the first circuit board 100 may be arranged in multiple rows and multiple columns, and the multiple first isolation holes 130 arranged in multiple rows and multiple columns may be enclosed to form multiple grids 101, and one first antenna unit 121 may be disposed in each grid. In a preferred embodiment, the first antenna element 121 may be disposed at a center of the grid 101.
In this embodiment, the first isolation hole 130 may include a through hole 131 and a conductive medium 132 disposed in the through hole 131. The through hole 131 may be disposed through the first substrate 110, and the conductive medium 132 is a conductive metal layer disposed on an inner wall of the through hole 131.
Further, each of the first isolation holes 130 further includes a surface isolation portion 133, and the surface isolation portion 133 may be disposed on the same layer as the first antenna unit layer 120. The surface isolation portion 133 may be disposed at an opening position of the first isolation hole 130 near the first antenna unit layer 120, and the surface isolation portion 133 may be electrically connected to the conductive medium 132.
Alternatively, the surface isolation parts 133 may have the same thickness as the first antenna unit 121 and are disposed on the surface of the first substrate 110. Therefore, in the solution of the present embodiment, the surface isolation portions 133 of the first isolation holes 130 may also be disposed around the first antenna element 121, so that an electronic shield may be formed between the first antenna element 121 and the adjacent first antenna element 121, and thus, the adjacent first antenna element 121 may be prevented from generating interference on the signal transmitted or received by the first antenna element 121.
Further, correspondingly, a plurality of second isolation holes 240 may be further disposed on the second circuit board 200, and the periphery of each second antenna unit 221 may be disposed around by the plurality of second isolation holes 240. Wherein the number of the second isolation holes 240 may be equal to the number of the first isolation holes 130.
And each second isolation hole 240 may be butted against one first isolation hole 130 when the first circuit board 100 and the second circuit board 200 are fixedly connected.
Likewise, the second isolation hole 240 includes a blind hole 241 opened on the second circuit board 200 and a conductive layer 242 disposed within the blind hole 241. When the second isolation hole 240 may be butted against the first isolation hole 130, the conductive layer 242 in the second isolation hole 240 may be butted against and electrically connected to the conductive medium 132 in the first isolation hole 130. That is, the second isolation hole 240 is butted against the first isolation hole 130, thereby isolating the corresponding sub-antenna unit from surrounding.
Referring further to fig. 3, fig. 3 is a schematic structural diagram of another embodiment of the antenna element shown in fig. 1.
The difference between the antenna assembly provided in this embodiment and the aforementioned antenna assembly is that in this embodiment, a groove 111 is further formed on a side of the first substrate 110 away from the first antenna unit layer 120. Wherein the groove 111 may be located between the first antenna element 121 and the second antenna element 221, and an opening of the groove 111 is disposed toward the second antenna element 221.
In this embodiment, the groove 111 may be filled with a medium with a small dielectric constant, such as air, so that loss during coupling between the first antenna element 121 and the second antenna element 221 may be reduced, and energy conversion efficiency may be improved.
In this embodiment, the number of the grooves 111 may be one, that is, all the second antenna elements 221 in the second antenna element layer 220 are covered by the grooves 111.
Alternatively, in other embodiments, the number of the grooves 111 may also be multiple, where each groove 111 may be disposed corresponding to a sub-antenna unit formed by one first antenna unit 121 and one second antenna unit 221; or each groove 111 may be provided for at least two sub-antenna elements.
Please further refer to fig. 1 or fig. 3.
Further, in this embodiment, the second circuit board 200 may be used to dispose electronic devices such as a power amplifier, and therefore, at least two circuit layers may be included on the second circuit board 200, so as to form a corresponding functional circuit.
The second circuit board 200 may further include a multi-layer sub-board 250. The sub-board 250 may include a sub-substrate 251 and a conductive line layer 252 disposed on at least one side of the sub-substrate 251.
The multi-layer sub-boards 250 of the second circuit board 200 may be respectively disposed on two opposite sides of the second substrate 210, and the multi-layer sub-boards 250 are disposed in mirror symmetry with the second substrate 210 as a symmetry center.
Optionally, the sub-substrates 251 of the two sub-boards 250 located on the two opposite sides of the second substrate 210 and having the same distance with the second substrate 210 may have the same material and/or thickness, so that the formed second circuit board 200 has high flatness and may be used for mounting high-density components.
Further, the application also provides a manufacturing method of the antenna component. Referring to fig. 4, fig. 4 is a schematic flowchart illustrating a manufacturing method of an antenna assembly according to an embodiment of the present disclosure.
The manufacturing method of the antenna component comprises the following steps:
s110: preparing a first circuit board and a second circuit board, wherein the first circuit board comprises a first substrate and a first antenna unit layer arranged on the surface of one side of the first substrate, and the first antenna unit layer comprises a plurality of first antenna units which are arranged in an array manner; the second circuit board comprises a second substrate and a second antenna unit layer arranged on one side surface of the second substrate, and the second antenna unit layer comprises a plurality of second antenna units which are arranged in an array mode.
The specific structures of the first circuit board and the second circuit board can refer to the first circuit board 100 and the second circuit board 200 shown above, which are not described herein again.
S120: and fixedly connecting the first circuit board and the second circuit board so as to oppositely arrange each first antenna unit and each second antenna unit.
After the first circuit board and the second circuit board are manufactured, the first circuit board and the second circuit board may be further fixedly connected to set each of the first antenna units and the second antenna unit opposite to each other, so that each of the first antenna units and the second antenna unit may form a sub-antenna unit of the antenna assembly, and each of the sub-antenna units may receive and transmit signals. For the signal receiving and transmitting process of each sub-antenna unit, reference is specifically made to the foregoing description, which is not repeated herein.
Furthermore, in this embodiment, when the first circuit board is manufactured, the first circuit board may be further provided with the isolation holes as described above, and the plurality of isolation holes are circumferentially arranged in the peripheral direction of each first antenna unit, so that interference of other first antenna units around the first antenna unit to the first antenna unit may be avoided, and stability of signals received and transmitted by each sub-antenna unit may be further improved.
Further, optionally, when the first circuit board is manufactured, a groove corresponding to the first antenna unit may be formed in a side, away from the first antenna unit layer, of the first substrate on the first circuit board, so that an overall dielectric constant of a medium between the first antenna unit and the corresponding second antenna unit may be reduced, efficiency of energy transmission when the first antenna unit and the corresponding second antenna unit are coupled is improved, and energy loss is reduced.
In summary, the person skilled in the art can easily understand that the beneficial effects of the present application are: in the scheme of this application, be a plurality of first antenna unit that the array was arranged through setting up on first circuit board, and set up on the second circuit board and be a plurality of second antenna unit that the array was arranged, and then through linking firmly first circuit board and second circuit board, thereby can make each first antenna unit and a second antenna unit that corresponds can set up relatively, thereby can be so that the formation has a plurality of sub-antenna unit's antenna module, its manufacturing approach is simple, and is swift, thereby can improve the production efficiency of antenna module. Furthermore, the daughter boards on two sides of the second substrate are arranged in a mirror symmetry mode by taking the second substrate as a symmetry center, so that the flatness of the formed second circuit board can be improved, and further one side surface of the second circuit board, which deviates from the second antenna unit layer, can be attached with a plurality of electronic elements arranged in a high density mode, and after the first circuit board and the second circuit board are fixedly connected in the welding or bonding directions and form an antenna assembly, the plurality of electronic elements, which deviate from the side surface of the second antenna unit layer, of the second circuit board are free of interference.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.
Claims (10)
1. An antenna assembly, characterized in that the antenna assembly comprises:
the first circuit board comprises a first substrate and a first antenna unit layer arranged on one side surface of the first substrate, wherein the first antenna unit layer comprises a plurality of first antenna units which are arranged in an array;
the second circuit board comprises a second substrate and a second antenna unit layer arranged on the surface of one side of the second substrate, and the second antenna unit layer comprises a plurality of second antenna units which are arranged in an array;
the second circuit board is fixedly connected with the first circuit board, the second antenna unit layer is arranged on one side, away from the first antenna unit layer, of the first substrate, so that each first antenna unit and one second antenna unit are arranged oppositely, and the first antenna unit and the second antenna unit are coupled and used for receiving or sending signals with preset frequency.
2. The antenna assembly of claim 1,
a plurality of isolation holes are formed in the first circuit board, and a plurality of isolation holes are formed in the periphery of each first antenna unit in a winding mode.
3. The antenna assembly of claim 1,
the first circuit board is provided with a plurality of isolation holes, the isolation holes are arranged in a plurality of grids on the first substrate in an enclosing mode, and each first antenna unit is arranged in one grid.
4. The antenna assembly of claim 3,
the isolation hole comprises a through hole penetrating through the first substrate and a conductive medium arranged in the through hole.
5. The antenna assembly of claim 2,
a groove is formed in one side, away from the first antenna unit layer, of the first substrate, and at least one second antenna unit is arranged towards the groove in an accommodating mode.
6. The antenna assembly of claim 1,
the second circuit board comprises a second substrate and a plurality of layers of sub-boards arranged on two opposite sides of the second substrate, and each sub-board comprises a sub-substrate and a conductive circuit layer arranged on at least one side of the sub-substrate;
the plurality of layers of daughter boards arranged on two opposite sides of the second circuit board are arranged in mirror symmetry by taking the second circuit board as a symmetry center.
7. The antenna assembly of claim 6,
the sub-substrates of the two sub-boards, which are positioned on the two opposite sides of the second substrate and have the same distance with the second substrate, are made of the same material and/or have the same thickness.
8. A method of manufacturing an antenna assembly, the method comprising:
preparing a first circuit board and a second circuit board, wherein the first circuit board comprises a first substrate and a first antenna unit layer arranged on the surface of one side of the first substrate, and the first antenna unit layer comprises a plurality of first antenna units which are arranged in an array manner; the second circuit board comprises a second substrate and a second antenna unit layer arranged on the surface of one side of the second substrate, and the second antenna unit layer comprises a plurality of second antenna units which are arranged in an array;
and fixedly connecting the first circuit board and the second circuit board so as to oppositely arrange each first antenna unit and one second antenna unit.
9. The method of manufacturing an antenna assembly of claim 8,
the step of fixedly connecting the first circuit board and the second circuit board includes:
and welding or adhering and fixing the first circuit board and the second circuit board.
10. The method of manufacturing an antenna assembly of claim 8,
before the step of fixedly connecting the first circuit board and the second circuit board, the method further includes:
forming a groove on one side of the first circuit board, which is far away from the first antenna unit layer;
the step of fixedly connecting the first circuit board and the second circuit board comprises:
and covering the groove on at least one first antenna unit, and fixedly connecting the first circuit board and the second circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110661382.2A CN115484738A (en) | 2021-06-15 | 2021-06-15 | Antenna assembly and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110661382.2A CN115484738A (en) | 2021-06-15 | 2021-06-15 | Antenna assembly and manufacturing method thereof |
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| CN115484738A true CN115484738A (en) | 2022-12-16 |
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| US20200161766A1 (en) * | 2017-05-16 | 2020-05-21 | Huawei Technologies Co., Ltd. | Antenna-in-package structure and terminal |
| WO2020077617A1 (en) * | 2018-10-19 | 2020-04-23 | 华为技术有限公司 | Antenna packaging structure and manufacturing method thereof |
| WO2020124436A1 (en) * | 2018-12-19 | 2020-06-25 | 华为技术有限公司 | Packaged antenna substrate, manufacturing method therefor, packaged antenna, and terminal |
| CN112803159A (en) * | 2021-03-30 | 2021-05-14 | 成都天锐星通科技有限公司 | Feed linear array and radar antenna |
| CN215912282U (en) * | 2021-06-15 | 2022-02-25 | 深南电路股份有限公司 | Antenna assembly |
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