CN115473045B - Miniaturized high-directivity antenna based on thick film and implementation method thereof - Google Patents
Miniaturized high-directivity antenna based on thick film and implementation method thereof Download PDFInfo
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- CN115473045B CN115473045B CN202211417600.9A CN202211417600A CN115473045B CN 115473045 B CN115473045 B CN 115473045B CN 202211417600 A CN202211417600 A CN 202211417600A CN 115473045 B CN115473045 B CN 115473045B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/14—Reflecting surfaces; Equivalent structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/28—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using a secondary device in the form of two or more substantially straight conductive elements
- H01Q19/30—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using a secondary device in the form of two or more substantially straight conductive elements the primary active element being centre-fed and substantially straight, e.g. Yagi antenna
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/10—Resonant antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/20—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements characterised by the operating wavebands
- H01Q5/28—Arrangements for establishing polarisation or beam width over two or more different wavebands
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
- H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
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Abstract
A miniaturized high-directionality antenna based on a thick film and an implementation method thereof are provided, wherein the antenna comprises a first metal layer, a first ceramic dielectric substrate, a second metal layer, a second ceramic dielectric substrate, a third metal layer, a third ceramic dielectric substrate, a fourth metal layer and the like; a parasitic patch serving as a director is arranged on the first metal layer, a radiation unit is arranged on the second metal layer, and the fifth metal layer serves as a metal ground of the whole antenna; the inner conductor of the coaxial feed port is connected to the radiating element through the via hole, and the outer conductor is connected to the metal ground; a pair of opening EBG structures is arranged on the third metal layer; a pair of stop band metal patches is arranged on the fourth metal layer. The parasitic patch serving as a director, the radiation unit and the ground serving as a reflector are respectively arranged on different layers, each layer is separated by a ceramic substrate, feed is realized by adopting a through hole, the volume of the directional antenna can be greatly reduced, and the adjustment of the working frequency band and the stopband frequency band of the antenna can be realized by the open EBG structure and the stopband metal patch.
Description
Technical Field
The application relates to the technical field of microwave radio frequency and thick film processes, in particular to a miniaturized high-directivity antenna based on a thick film and an implementation method thereof.
Background
The transmission of directional energy requires highly directional antennas to be implemented. A common antenna miniaturization technique is generally implemented by using a high dielectric constant dielectric substrate, bending a radiation element, and forming a slot on the surface of the radiation element to increase a current equivalent path, and an antenna having directivity is generally implemented by loading a reflector and a director. But the effective radiation aperture can be reduced by bending the radiation unit and slotting the surface of the radiation unit, and the radiation efficiency of the antenna is reduced; loading the reflector and director significantly increases the antenna profile, volume, weight, etc., which is detrimental to miniaturization and system integration, while also adding additional design effort and complexity to the design. These are against the goals of system miniaturization trend, quality control and cost control.
Disclosure of Invention
In order to solve the defects of the prior art, the application provides a miniaturized high-directivity antenna based on a thick film and an implementation method thereof, wherein a parasitic patch serving as a guide function, a radiation unit and a ground serving as a reflecting plate are respectively arranged on different layers and are separated by a ceramic substrate, the size of a metal sheet can be reduced when the same working frequency point is kept, the size of the directivity antenna is greatly reduced, and the development of the system in the aspects of miniaturization and high integration is facilitated; and an adjustable stopband frequency band is respectively formed by the opening EBG structure and the stopband metal patch which are connected based on the thick film vertical interconnection metalized via hole.
In order to achieve the above object, the present invention employs the following techniques:
a miniaturized high-directivity antenna based on a thick film comprises a first metal layer, a first ceramic dielectric substrate, a second metal layer, a second ceramic dielectric substrate, a third metal layer, a third ceramic dielectric substrate, a fourth metal layer, a fourth ceramic dielectric substrate and a fifth metal layer which are sequentially arranged from top to bottom through a thick film multilayer circuit process;
a parasitic patch is arranged on the first metal layer, a radiation unit is arranged on the second metal layer, the parasitic patch is used for realizing the function of a director, and the fifth metal layer is used as a metal ground of the whole antenna;
a through hole penetrates through the fifth metal layer, the through hole penetrates upwards to the second metal layer, a coaxial feed port is arranged on the bottom surface of the fifth metal layer, an inner conductor of the coaxial feed port penetrates through the through hole to be connected to the radiation unit, and an outer conductor is connected to a metal ground;
a pair of opening EBG structures is arranged on the third metal layer, and the opening EBG structures are symmetrically arranged on the periphery side of the inner conductor of the coaxial feed port; a pair of stop band metal patches corresponding to the opening EBG structure in position are arranged on the fourth metal layer, and the stop band metal patches are symmetrically arranged on the periphery side of the inner conductor of the coaxial feed port; the pair of opening EBG structures are respectively and correspondingly connected with a pair of stop band metal patches through a metal hole group penetrating through the third ceramic dielectric substrate, and the stop band metal patches are respectively and correspondingly connected with a metal ground through a metal hole group penetrating through the fourth ceramic dielectric substrate.
The parasitic patch is also used for generating a new resonance with the frequency difference value of the resonance frequency point of the radiating element within a preset range. The fifth metal layer also serves as a reflector plate to reflect back radiation from the antenna. The parasitic patch, the radiating unit and the metal ground form a yagi antenna structure together for realizing the forward high-directivity radiation of the antenna
A method for realizing a miniaturized high-directivity antenna based on a thick film comprises the following steps:
providing a first ceramic dielectric substrate, a second ceramic dielectric substrate, a third ceramic dielectric substrate and a fourth ceramic dielectric substrate;
forming a first metal layer on the top surface of the first ceramic dielectric substrate through a thick film process, and printing a parasitic patch on the first metal layer for realizing the function of a director;
forming a second metal layer on the top surface of the second ceramic dielectric substrate through a thick film process, and printing a radiation unit on the second metal layer; processing a through hole on the second ceramic dielectric substrate in a penetrating way;
forming a third metal layer on the top surface of the third ceramic dielectric substrate through a thick film process, and etching the third metal layer to form a pair of opening EBG structures; through holes are processed on the third ceramic dielectric substrate and the third metal layer, a metal hole group is processed on the third ceramic dielectric substrate in a through mode, and the pair of opening EBG structures are symmetrically distributed along the through holes;
forming a fourth metal layer on the top surface of the fourth ceramic dielectric substrate through a thick film process, forming a fifth metal layer on the bottom surface of the fourth ceramic dielectric substrate through a thick film process, etching and forming a pair of stop band metal patches on the fourth metal layer, and taking the fifth metal layer as a metal ground of the whole antenna; through holes are processed on the fourth ceramic dielectric substrate, the fourth metal layer and the fifth metal layer, metal hole groups are processed on the fourth ceramic dielectric substrate, and the pair of stop band metal patches are symmetrically distributed along the through holes;
stacking and aligning the first ceramic dielectric substrate, the second ceramic dielectric substrate, the third ceramic dielectric substrate and the fourth ceramic dielectric substrate from top to bottom in sequence to align the through holes and align the metal hole groups;
providing a coaxial feed port, enabling an inner conductor of the coaxial feed port to sequentially pass through each through hole to be connected to the radiating unit, and enabling an outer conductor of the coaxial feed port to be connected with a metal ground;
and laminating and sintering the components to form a whole, so that the pair of open EBG structures are respectively and correspondingly connected with the pair of stop band metal patches through the metal hole groups.
The opening of the opening EBG structure is arranged opposite to the via hole, the opening EBG structure is used for forming a stop band frequency band at the inner conductor, and the frequency range of the stop band frequency band formed by the opening EBG structure can be adjusted by changing the total length/perimeter of the opening EBG structure and the opening distance; the stopband metal patch is used for forming another stopband frequency band at the inner conductor, and the frequency range of the stopband frequency band formed by the stopband metal patch can be adjusted by changing the size of the stopband metal patch.
The invention has the beneficial effects that:
1. the directional antenna adopting the thick film circuit process is of a multilayer three-dimensional circuit structure, and a metal parasitic patch is isolated and loaded above a radiation unit through a first ceramic dielectric substrate, and a metal ground is isolated and loaded below the radiation unit through a second ceramic dielectric substrate and is used as the ground of the antenna; and effectively reducing the waveguide wavelength by using a thick-film high-dielectric-constant ceramic substrate
，λWhich is the wavelength in the air, is,ε r a relative dielectric constant of the ceramic substrate) to reduce the size; in addition, the thick film ceramic substrate can be 0.1 mm thick, and the size and the thickness of the parallel plate capacitor are in inverse proportion (
，SIs the area of the metal, and is,kis a constant of the electrostatic force and,dis a pitch) so that equivalent capacitances are formed on both sides of the upper and lower surfaces of the substrateCIncreasing according to the inverse relation between resonant frequency point and capacitance (
，CIs an equivalent capacitance，LEquivalent inductance), a thick-film ceramic substrate which is thinner than a common dielectric plate is used, the resonance frequency point can be effectively reduced by the same metal size, and the size of a metal sheet can be reduced by keeping the same working frequency point, so that the size of the directional antenna can be greatly reduced, and the development of a system in the aspects of miniaturization and high integration is facilitated;
2. the parasitic patch, the radiation unit and the metal ground jointly form a yagi antenna structure for realizing the forward high-directivity radiation of the antenna;
3. the size of the parasitic patch is changed to generate a resonant frequency point close to the antenna radiation unit, so that the working frequency bandwidth of the antenna can be widened; the impedance of the antenna can be adjusted by changing the thicknesses of the first ceramic dielectric substrate and the second ceramic dielectric substrate;
4. the third metal layer is used for providing a metal ground for the whole antenna on one hand, and is also used as a reflecting plate to reflect backward radiation of the antenna on the other hand, so that the radiation effect of the antenna is improved;
5. a stop band frequency band can be formed at the inner conductor through the introduced opening EBG structure, and the frequency range of the stop band frequency band formed by the opening EBG structure can be adjusted by changing the radius of the opening EBG structure and the opening distance; meanwhile, another stop band frequency band can be formed at the inner conductor by introducing the stop band metal patch, and the frequency range of the stop band frequency band formed by the stop band metal patch can be adjusted by changing the size of the stop band metal patch.
Drawings
Fig. 1 is an exploded view of an antenna structure according to an embodiment of the present application.
Fig. 2 is a schematic stop band diagram according to an embodiment of the present application.
Description of the reference numerals: 1-a first metal layer, 2-a first ceramic dielectric substrate, 3-a second metal layer, 4-a second ceramic dielectric substrate, 5-a fifth metal layer, 6-a coaxial feed port, 7-a third metal layer, 71-an open EBG structure, 8-a third ceramic dielectric substrate, 9-a fourth metal layer, 91-a stop band metal patch, and 10-a fourth ceramic dielectric substrate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
The embodiment of the application provides a miniaturized high-directivity antenna based on a thick film, as shown in fig. 1, the antenna comprises a first metal layer 1, a first ceramic dielectric substrate 2, a second metal layer 3, a second ceramic dielectric substrate 4, a third metal layer 7, a third ceramic dielectric substrate 8, a fourth metal layer 9, a fourth ceramic dielectric substrate 10 and a fifth metal layer 5 which are sequentially arranged from top to bottom through a thick film multilayer circuit process.
A parasitic patch is arranged on the first metal layer 1, a radiation unit is arranged on the second metal layer 3, and the fifth metal layer 5 is used as a metal ground of the whole antenna; the parasitic patch is used to implement the director function and to generate a new resonance with a frequency difference from the resonance frequency point of the radiating element within a predetermined range.
The fifth metal layer 5 also serves as a reflector plate to reflect back radiation from the antenna.
The fifth metal layer 5 is provided with a through hole in a penetrating manner, the through hole penetrates upwards to the second metal layer 3, the bottom surface of the fifth metal layer 5 is provided with a coaxial feed port 6, an inner conductor of the coaxial feed port 6 penetrates through the through hole to be connected to the radiation unit, and an outer conductor is connected to a metal ground.
The parasitic patch, the radiating element and the metal ground jointly form a yagi antenna structure for realizing forward high-directivity radiation of the antenna.
It should be noted that the patch of the radiation unit may be rectangular, circular, triangular, or other irregular shape; the same is true of the parasitic patch shape on top of it.
The present example utilizes a thick film high dielectric constant ceramic substrate to effectively reduce the waveguide wavelength (
，λIs a wavelength in the air and is,ε r a relative dielectric constant of the ceramic substrate) to reduce the size; in addition, the thick film ceramic substrate can be 0.1 mm thick, and the size and the thickness of the parallel plate capacitor are in inverse proportion (
，SIs the area of the metal, and is,kis a constant of the electrostatic force and,ddistance) to increase the equivalent capacitance formed on both sides of the upper and lower surfaces of the substrate, according to the inverse relation between the resonance frequency point and the capacitance (
In the formula (I), the reaction is carried out,Cis an equivalent capacitance，LEquivalent inductance), the same metal size can effectively reduce the resonance frequency point by using a thick-film ceramic substrate thinner than a common dielectric plate, and the metal sheet size can be reduced by keeping the same working frequency point, so that the size of the directional antenna can be greatly reduced, and the development of the system to the aspects of miniaturization and high integration is facilitated.
A pair of open EBG structures 71 is disposed on the third metal layer 7, the open EBG structures 71 are formed on the third metal layer 7 by etching, the open EBG structures 71 are symmetrically disposed on the periphery of the inner conductor of the coaxial feed port 6, and the openings of the open EBG structures 71 are disposed opposite to the inner conductor of the coaxial feed port 6; a pair of stop band metal patches 91 corresponding to the opening EBG structure 71 are disposed on the fourth metal layer 9, the stop band metal patches 91 are formed on the fourth metal layer 9 by etching, and the stop band metal patches 91 are symmetrically disposed on the inner conductor periphery side of the coaxial feed port 6; the pair of opening EBG structures 71 are respectively connected to a pair of stopband metal patches 91 through a metal hole group penetrating through the third ceramic dielectric substrate 8, and the stopband metal patches 91 are respectively connected to a metal ground through a metal hole group penetrating through the fourth ceramic dielectric substrate 10.
The working principle of the antenna in the embodiment is as follows:
feeding signals enter the radiating element of the antenna through the coaxial feeding port 6, an inner conductor of the coaxial feeding port 6 penetrates through a through hole to be connected to the radiating element in the middle, and an outer conductor is connected to the bottom metal ground; radiating element goes out the signal radiation, and the parasitic paster of the superiors provides a new resonance, adjusts through the size, makes this resonance frequency point approach radiating element's resonance frequency point, can realize widening antenna operating frequency bandwidth's purpose.
An open EBG structure introduced in this example, i.e., an open resonant ring-shaped electromagnetic band-gap structure, (EBG); a pair of open EBG structures 71 is provided, corresponding to the introduction of the LC resonant circuit, such that a stopband is formed near the inner conductor of the coaxial feed line, the size of the stopband being determined by the perimeter of the open EBG structures 71. Specifically, the open EBG structure 71 may be an open circular ring, an open triangular ring, an open rectangular ring, or an open polygonal ring, and the total length/perimeter of the open EBG structure is only one-half wavelength corresponding to the center frequency of the stop band. If the structure is an open ring, the radius R of the resonant ring of the open EBG structure 71 increases, and the corresponding equivalent inductance increasesLIncreasing; the opening distance is increased and the corresponding equivalent capacitanceCDecreasing; the stop band frequency range can be adjusted by adjusting the size and the opening distance.
The stopband metal patch 91 formed on the fourth metal layer 9 by etching may be circular, rectangular, triangular or any polygon, and the patch also brings a stopband, and the stopband frequency band center frequency f is also determined by the size.
According to the formula:
；
whereinCIt is the speed of the light that is,ε r is a relative dielectric constant of the ceramic substrate,L eq for the equivalent size of the stop band metal patch 91, if it is rectangular, it is assumed that the stop band metal patch 91 is longLWidth isWThen, thenL eq =2(L+W) (ii) a By adjusting the size of the stopband metal patch 91, the stopband frequency range can also be adjusted. In the case of other shapes, the equivalent dimensions are only requiredL eq And (5) keeping the consistency.
The stop band schematic diagram of the present example is shown in fig. 2, wherein, when the open EBG structure 71 is not loaded, the operating frequency band of the thick film based director and reflector antenna is 1.4GHz-3.1GHz (the voltage standing wave ratio is less than the frequency band corresponding to 2); after loading the open EBG structure 71, the antenna has a stop band at 1.52GHz-2.55GHz (voltage standing wave ratio greater than 2, indicating that the band input signal will be reflected); after loading the open EBG structure 71 and the stop band metal patch 91 at the same time, the antenna exhibits a second stop band at 2.8GHz-3.0 GHz. Because the working frequency band of the antenna is determined by the size of the radiation unit, the working frequency band and the stop band frequency band of the antenna can be adjusted by adjusting corresponding sizes.
In this example, to implement the miniaturized and highly-directional antenna based on the thick film described in the above example, a thick film multi-layer circuit process is used, as shown in fig. 2, which includes the following steps:
providing a first ceramic dielectric substrate 2, a second ceramic dielectric substrate 4, a third ceramic dielectric substrate 8 and a fourth ceramic dielectric substrate 10;
forming a first metal layer 1 on the top surface of the first ceramic dielectric substrate 2 through a thick film process, and printing a parasitic patch on the first metal layer 1 for realizing the function of a director;
forming a second metal layer 3 on the top surface of a second ceramic dielectric substrate 4 through a thick film process, and printing a radiation unit on the second metal layer 3; processing a through hole on the second ceramic dielectric substrate 4 in a penetrating way;
forming a third metal layer 7 on the top surface of the third ceramic dielectric substrate 8 by a thick film process, and etching the third metal layer 7 to form a pair of opening EBG structures 71; through holes are processed on the third ceramic dielectric substrate 8 and the third metal layer 7, a metal hole group is processed on the third ceramic dielectric substrate 8 in a through mode, and the pair of opening EBG structures 71 are symmetrically distributed along the through holes;
forming a fourth metal layer 9 on the top surface of a fourth ceramic dielectric substrate 10 by a thick film process, forming a fifth metal layer 5 on the bottom surface of the fourth ceramic dielectric substrate by a thick film process, etching and forming a pair of stop band metal patches 91 on the fourth metal layer 9, and taking the fifth metal layer 5 as a metal ground of the whole antenna; through holes are processed on the fourth ceramic dielectric substrate 10, the fourth metal layer 9 and the fifth metal layer 5, metal hole groups are processed on the fourth ceramic dielectric substrate 10, and the pair of stopband metal patches 91 are symmetrically distributed along the through holes;
superposing and aligning the first ceramic dielectric substrate 2, the second ceramic dielectric substrate 4, the third ceramic dielectric substrate 8 and the fourth ceramic dielectric substrate 10 from top to bottom in sequence to align the through holes and align the metal hole groups;
providing a coaxial feed port 6, enabling an inner conductor of the coaxial feed port to sequentially pass through each through hole to be connected to the radiating unit, and enabling an outer conductor of the coaxial feed port to be connected with a metal ground;
and after lamination, pressing and sintering are carried out to form a whole, so that the pair of opening EBG structures 71 are respectively and correspondingly connected with the pair of stop band metal patches 91 through the metal hole groups.
In this embodiment, a stop band frequency band can be formed at the inner conductor by the opening EBG structure 71, and the frequency range of the stop band frequency band formed by the opening EBG structure can be adjusted by changing the radius and the opening distance of the opening EBG structure 71; another stopband frequency band can be formed at the inner conductor by the stopband metal patch 91, and the frequency range of the stopband frequency band formed by the stopband metal patch 91 can be adjusted by changing the size of the stopband metal patch 91.
In the embodiment, a thick film circuit process is adopted, the antenna is obtained to be a multilayer three-dimensional circuit structure, a metal parasitic patch is loaded on the radiation unit in an isolation mode through the first ceramic dielectric substrate 2, and a metal ground is loaded below the radiation unit in an isolation mode through the second ceramic dielectric substrate 4 and serves as a ground of the antenna, wherein the dielectric substrate is a co-fired ceramic substrate with a high dielectric constant, and the size of the antenna is remarkably reduced.
A resonance frequency point close to the antenna radiation unit can be generated by changing the size of the parasitic patch, and the working frequency bandwidth of the antenna can be widened. By changing the thickness of the first ceramic dielectric substrate 2 and the second ceramic dielectric substrate 4, the impedance of the antenna can be adjusted.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and it is apparent that those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (10)
1. A miniaturized high-directivity antenna based on a thick film is characterized by comprising a first metal layer (1), a first ceramic dielectric substrate (2), a second metal layer (3), a second ceramic dielectric substrate (4), a third metal layer (7), a third ceramic dielectric substrate (8), a fourth metal layer (9), a fourth ceramic dielectric substrate (10) and a fifth metal layer (5) which are sequentially arranged from top to bottom through a thick film multilayer circuit process;
a parasitic patch is arranged on the first metal layer (1), a radiation unit is arranged on the second metal layer (3), the parasitic patch is used for realizing the function of a director, and the fifth metal layer (5) is used as the metal ground of the whole antenna;
a through hole penetrates through the fifth metal layer (5), the through hole penetrates upwards to the second metal layer (3), a coaxial feed port (6) is arranged on the bottom surface of the fifth metal layer (5), an inner conductor of the coaxial feed port (6) penetrates through the through hole to be connected to the radiating unit, and an outer conductor is connected to a metal ground;
a pair of opening EBG structures (71) are arranged on the third metal layer (7), and the opening EBG structures (71) are symmetrically arranged on the periphery side of the inner conductor of the coaxial feed port (6); a pair of stop band metal patches (91) corresponding to the opening EBG structure (71) in position are arranged on the fourth metal layer (9), and the stop band metal patches (91) are symmetrically arranged on the periphery side of the inner conductor of the coaxial feed port (6); the pair of opening EBG structures (71) are respectively and correspondingly connected with a pair of stop band metal patches (91) through metal hole groups penetrating through the third ceramic dielectric substrate (8), and the stop band metal patches (91) are respectively connected with a metal ground through metal hole groups penetrating through the fourth ceramic dielectric substrate (10);
wherein, the open EBG structure (71) is an open resonant annular electromagnetic band gap structure, a pair of open EBG structures (71) are arranged, which is equivalent to introducing an LC resonant circuit, so that a stopband frequency band is formed near the inner conductor of the coaxial feeder line, and the size of the stopband frequency band is determined by the perimeter of the open EBG structure (71).
2. The thick film based miniaturized highly directional antenna according to claim 1, characterized in that the opening of the open EBG structure (71) is arranged facing away from the inner conductor of the coaxial feed port (6).
3. The miniaturized, highly directional antenna based on thick film according to claim 1, characterized in that the open EBG structure (71) is formed by etching on the third metal layer (7) and the stop band metal patch (91) is formed by etching on the fourth metal layer (9).
4. The miniaturized and highly directional antenna based on thick film according to claim 1, characterized in that the first ceramic dielectric substrate (2), the second ceramic dielectric substrate (4), the third ceramic dielectric substrate (8) and the fourth ceramic dielectric substrate (10) are co-fired ceramic substrates with high dielectric constant.
5. A miniaturized and highly directional antenna based on thick films according to claim 1, characterized in that the fifth metal layer (5) is also used as a reflector plate to reflect back radiation of the antenna.
6. The miniaturized and highly directional antenna based on the thick film as claimed in claim 1, wherein the parasitic patch, the radiating element and the metal ground together form a yagi antenna structure for realizing the forward high directional radiation of the antenna.
7. A miniaturized and highly directional antenna based on thick films according to claim 1, characterized in that the parasitic patch is further adapted to generate a new resonance having a frequency difference from the resonance frequency point of the radiating element within a predetermined range.
8. A method for realizing a miniaturized high-directivity antenna based on a thick film is characterized by comprising the following steps:
providing a first ceramic dielectric substrate (2), a second ceramic dielectric substrate (4), a third ceramic dielectric substrate (8) and a fourth ceramic dielectric substrate (10);
forming a first metal layer (1) on the top surface of the first ceramic dielectric substrate (2) through a thick film process, and printing a parasitic patch on the first metal layer (1) for realizing the function of a director;
forming a second metal layer (3) on the top surface of the second ceramic dielectric substrate (4) through a thick film process, and printing a radiating element on the second metal layer (3); processing a through hole on the second ceramic dielectric substrate (4) in a penetrating way;
forming a third metal layer (7) on the top surface of the third ceramic dielectric substrate (8) through a thick film process, and etching and forming a pair of opening EBG structures (71) on the third metal layer (7); through holes are processed on the third ceramic dielectric substrate (8) and the third metal layer (7) in a penetrating way, a metal hole group is processed on the third ceramic dielectric substrate (8) in a penetrating way, and a pair of opening EBG structures (71) are symmetrically distributed along the through holes; wherein, the open EBG structure (71) is an open resonant annular electromagnetic band gap structure, a pair of open EBG structures (71) is arranged, which is equivalent to introducing an LC resonant circuit, so that a stop band frequency band is formed near the inner conductor of the coaxial feeder line, and the size of the stop band frequency band is determined by the perimeter of the open EBG structure (71);
forming a fourth metal layer (9) on the top surface of a fourth ceramic dielectric substrate (10) through a thick film process, forming a fifth metal layer (5) on the bottom surface of the fourth ceramic dielectric substrate through the thick film process, etching and forming a pair of stop band metal patches (91) on the fourth metal layer (9), and taking the fifth metal layer (5) as a metal ground of the whole antenna; through holes are processed in the fourth ceramic dielectric substrate (10), the fourth metal layer (9) and the fifth metal layer (5), metal hole groups are processed in the fourth ceramic dielectric substrate (10), and the pair of stop band metal patches (91) are symmetrically distributed along the through holes;
superposing and aligning a first ceramic dielectric substrate (2), a second ceramic dielectric substrate (4), a third ceramic dielectric substrate (8) and a fourth ceramic dielectric substrate (10) from top to bottom in sequence to align the through holes and align the metal hole groups;
providing a coaxial feed port (6), enabling an inner conductor of the coaxial feed port to sequentially pass through each through hole to be connected to the radiating unit, and enabling an outer conductor of the coaxial feed port to be connected with a metal ground;
and after the overlapping, the pressing and sintering are carried out to form a whole, so that the pair of opening EBG structures (71) are respectively and correspondingly connected with the pair of stopband metal patches (91) through the metal hole group.
9. Method for realizing a miniaturized highly directional antenna based on thick films according to claim 8, characterized in that the openings of the open EBG structures (71) are placed facing away from the vias.
10. The method of claim 8, wherein the open EBG structure (71) is used to form a stopband at the inner conductor, and the frequency range of the stopband formed by the open EBG structure (71) can be adjusted by changing the total length/perimeter and the opening spacing of the open EBG structure; the stop band metal patch (91) is used for forming another stop band frequency band at the inner conductor, and the frequency range of the stop band frequency band formed by the stop band metal patch (91) can be adjusted by changing the size of the stop band metal patch.
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| CN115603691B (en) * | 2022-12-15 | 2023-02-17 | 四川斯艾普电子科技有限公司 | Multilayer thick-film integrated numerical control attenuator and implementation method thereof |
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