CN115464349A

CN115464349A - Mould processing method and system

Info

Publication number: CN115464349A
Application number: CN202211227234.0A
Authority: CN
Inventors: 王宇; 杨棋; 余建琳; 梁振兴
Original assignee: Meishan Boya New Material Co ltd
Current assignee: Meishan Boya New Material Co ltd
Priority date: 2022-06-10
Filing date: 2022-06-10
Publication date: 2022-12-13
Also published as: CN114734213A; WO2023236987A1; CN115609250A; CN114734213B

Abstract

The embodiment of the specification provides a processing method of a mold, and a standard mold comprises a mold body and a covering layer. The processing method includes acquiring first surface information of a first mold, the first mold being manufactured based on initial processing information, the first mold including a non-covering mold; obtaining compensation information based on the first surface information and target surface information; generating target machining information based on the initial machining information and the compensation information; and processing the covering layer at least based on the target processing information to obtain the standard mould. The processing method can improve the processing precision and consistency of the standard die.

Description

Mould processing method and system

Description of the cases

The application is a divisional application of an invention patent application with the application number of 202210650123.4, the application date of 2022, 06 and 10 months and the name of 'a mould processing method and a system thereof'.

Technical Field

The specification relates to the technical field of grinding and polishing processes, in particular to a die machining method and a die machining system.

Background

Polishing molds are important tools in the crystal polishing process. The service life of the polishing mould is short under the influence of factors such as the abrasion of the polishing skin, and a new polishing mould needs to be replaced after 20 to 30 crystals are polished.

The general processing method of the polishing mold needs to turn an original mold by processing equipment (such as a lathe, a carving machine and the like), and then the original mold is subjected to skin sticking and grinding to obtain the polishing mold.

On one hand, because the processing equipment generates system errors after maintenance, the original die turned by the processing equipment cannot meet the precision requirement of polished crystals. Therefore, a relatively time-consuming original mold modification procedure is required in the polishing mold processing process. The original mold correction procedure generally includes: manufacturing a coupling mould which is coupled with the original mould and is stuck with the diamond pill; correcting the coupling mold based on the qualified polishing mold to obtain a correction mold; correcting the original mold by using a correction mold; and manufacturing a polishing mould by using the corrected original mould, polishing the crystal, and detecting the polishing precision. The correction procedure has no correction standard, and usually needs repeated correction and debugging until the polishing precision of the crystal meets the requirement.

On the other hand, because the original mold skin-sticking procedure generally adopts a manual mode to press the polishing skin on the heated original mold, the polishing skin on different areas of the polishing mold can have uneven thickness under the influence of factors such as temperature control and pressure uniformity.

Due to the problems, the problems of poor consistency and processing precision of finished products, low processing technology standardization degree and the like exist in the processing of the polishing die, and the precision and the efficiency of crystal polishing are further limited. Therefore, it is desirable to provide a mold processing method and a workpiece polishing method and system thereof that can improve the processing accuracy and consistency.

Disclosure of Invention

One or more embodiments of the present disclosure provide a method of processing a mold. The method comprises the following steps: acquiring first surface information of a first mold, wherein the first mold is manufactured based on initial processing information; obtaining compensation information based on the first surface information and target surface information; generating target machining information based on the initial machining information and the compensation information; and preparing a standard die based on the target processing information, wherein the standard die comprises a die body and a covering layer.

In some embodiments, the preparing a standard mold based on the target processing information comprises: turning the initial die based on the target machining information to obtain the die body; attaching the cover layer to the mold body; and turning the covering layer based on the target machining information to obtain the standard die.

In some embodiments, said affixing said cover layer to said mold body comprises: heating the mold body; the covering layer is compacted with the heated mould body, so that the covering layer is attached to the mould body.

In some embodiments, the die body is heated by heating coils within which the die body to be heated is placed.

In some embodiments, the heating temperature of the heating coil is 160 ℃ to 200 ℃.

In some embodiments, the cover layer and the heated mold body are compacted by a pressing platen tool having a pressing surface curvature matching a bearing surface curvature of the mold body.

In some embodiments, the pressure range of the pressure applied by the pressure plate tool is 0.1Mpa to 0.8Mpa.

In some embodiments, the compensation information includes body compensation information and edge extension information; the obtaining compensation information based on the first surface information and target surface information comprises: obtaining body compensation information corresponding to the first mold body based on a comparison of the first surface information and the target surface information; based on the data trend of the first surface information, edge extension information corresponding to the first mold edge is obtained.

In some embodiments, the generating target machining information based on the initial machining information and the compensation information comprises: generating processing information to be checked based on the initial processing information and the compensation information; acquiring second surface information of a second mold, wherein the second mold is manufactured based on the processing information to be checked; judging whether the surface error of the second mold is within a preset value range or not based on the second surface information and the target surface information; and if so, determining the processing information to be checked as target processing information.

One or more embodiments of the present disclosure provide a mold tooling system. The system comprises: a surface information acquisition module configured to acquire first surface information of a first mold, the first mold being manufactured based on initial processing information; a compensation information acquisition module configured to acquire compensation information based on the first surface information and target surface information; a processing information generating module configured to generate target processing information based on the initial processing information and the compensation information; and a processing module configured to prepare a standard mold based on the target processing information, the standard mold including a mold body and a cover layer.

One or more embodiments of the present disclosure provide a method of polishing a workpiece. The workpiece polishing method includes: determining at least a first polishing area and a second polishing area of the workpiece; polishing the first polishing area by using a first polishing mold; and polishing the second polishing region using a second polishing mold; the curvature radius of the polishing surface of the first polishing mould is different from that of the polishing surface of the second polishing mould.

In some embodiments, the curvature of the surface to be polished of the first polishing region matches the curvature of the polishing surface of the first polishing mold; and the curvature of the surface to be polished in the second polishing area is matched with the curvature of the polishing surface of the second polishing mould.

In some embodiments, the first polishing mold has a first polishing parameter comprising at least a first swing parameter and a first pressure parameter; the second polishing mold has a second polishing parameter, and the second polishing parameter at least comprises a second swing parameter and a second pressure parameter; the first polishing parameter is different from the second polishing parameter.

In some embodiments, the first and/or second polishing molds are standard molds comprising a mold body and a cover layer.

In some embodiments, the preparation of the standard mold comprises: acquiring first surface information of a first mold, wherein the first mold is manufactured based on initial processing information; obtaining compensation information based on the first surface information and target surface information; generating target machining information based on the initial machining information and the compensation information; and preparing a standard die based on the target processing information, wherein the standard die comprises a die body and a covering layer.

In some embodiments, the preparing a standard mold based on the target processing information comprises: turning an initial die based on the target machining information to obtain a die body; attaching the cover layer to the mold body; and turning the covering layer based on the target machining information to obtain the standard die.

One or more embodiments of the present disclosure provide a workpiece polishing system. The system comprises: a polishing area determination module configured to determine at least a first polishing area and a second polishing area of a workpiece; a polishing module configured to polish the first polishing region using a first polishing jig, and further configured to polish the second polishing region using a second polishing jig; the curvature radius of the polishing surface of the first polishing mould is different from that of the polishing surface of the second polishing mould.

Drawings

The present description will be further explained by way of exemplary embodiments, which will be described in detail by way of the accompanying drawings. These embodiments are not intended to be limiting, and in these embodiments like numerals are used to indicate like structures, wherein:

FIG. 1 is a schematic diagram of exemplary hardware and/or software of a mold tooling system according to some embodiments herein;

FIG. 2 is a schematic diagram of exemplary hardware and/or software of a workpiece polishing system according to some embodiments herein;

FIG. 3 is an exemplary flow diagram of a method of mold tooling according to some embodiments herein;

FIG. 4 is an exemplary flow diagram of a compensation information acquisition process according to some embodiments of the present description;

FIG. 5 is an exemplary flow diagram of a target process information generation process according to some embodiments herein;

FIG. 6 is an exemplary flow diagram of a standard mold preparation process according to some embodiments of the present description;

FIG. 7 is a schematic diagram of an exemplary configuration of a platen tooling press coating die according to some embodiments herein;

FIG. 8 is an exemplary flow diagram of a method of polishing a workpiece according to some embodiments of the present description;

FIG. 9 is a schematic diagram of an exemplary configuration of a first polishing zone polishing process according to some embodiments of the present description;

FIG. 10 is a schematic diagram of an exemplary configuration of a second polishing zone polishing process according to some embodiments of the present description;

reference numerals are as follows: 10-standard mould; 10' -a starting mold; 10 "-coating die; 11-a mould body; 12-a cover layer; 20-a workpiece; 21-a first polishing zone; 22-a second polishing zone; 30-pressing a plate tool; 40-a drive device; 41-a drive rod; 10 a-a first polishing mold; 10 b-a second polishing mold; 13a, 13b-polished surface.

Detailed Description

In order to more clearly illustrate the technical solutions of the embodiments of the present specification, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only examples or embodiments of the present description, and that for a person skilled in the art, the present description can also be applied to other similar scenarios on the basis of these drawings without inventive effort. Unless otherwise apparent from the context, or stated otherwise, like reference numbers in the figures refer to the same structure or operation.

It should be understood that "system", "apparatus", "unit" and/or "module" as used herein is a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, other words may be substituted by other expressions if they accomplish the same purpose.

As used in this specification and the appended claims, the terms "a," "an," "the," and/or "the" are not to be taken in a singular sense, but rather are to be construed to include a plural sense unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that steps and elements are included which are explicitly identified, that the steps and elements do not form an exclusive list, and that a method or apparatus may include other steps or elements.

Flow charts are used in this description to illustrate operations performed by a system according to embodiments of the present description. It should be understood that the preceding or following operations are not necessarily performed in the exact order in which they are performed. Rather, the various steps may be processed in reverse order or simultaneously. Meanwhile, other operations may be added to the processes, or a certain step or several steps of operations may be removed from the processes.

Fig. 1 is a schematic diagram of exemplary hardware and/or software of a mold tooling system according to some embodiments.

As shown in fig. 1, the mold processing system 100 may include a control module 110, a surface information acquisition module 120, a compensation information acquisition module 130, a processing information generation module 140, a processing module 150, a storage module 160, a communication module 170, and an input/output module 180.

The control module 110 may be associated with other modules for processing information and data related to the mold tooling system 100. In some embodiments, the control module 110 may control the operating state of other modules (e.g., the surface information acquisition module 120, the compensation information acquisition module 130, the machining information generation module 140, the machining module 150, etc.). In some embodiments, the control module 110 may manage the data acquisition or transmission process in the communication module 170.

The surface information acquisition module 120 may be used to acquire surface information of a mold. In some embodiments, the surface information acquisition module 120 may detect the first surface information of the first mold and send the surface information of the first mold to the control module 110 and/or the compensation information acquisition module 130. In some embodiments, the surface information acquisition module 120 may detect second surface information of the second mold and transmit the surface information of the second mold to the control module 110 and/or the processing information generation module 140. In some embodiments, the surface information acquiring module 120 may send the first surface information and/or the second surface information to the storage module 160 for storage, so as to be called by other modules. In some embodiments, surface information acquisition module 120 includes a device for performing contour detection to obtain surface information, such as a contact profiler or a non-contact profiler.

The compensation information obtaining module 130 may be configured to obtain compensation information reflecting a mold machining error. In some embodiments, the compensation information obtaining module 130 may obtain the compensation information based on the first surface information and the target surface information, which is obtained by the surface information obtaining module 120 and stored in the storage module 160. In some embodiments, the compensation information acquisition module 130 may send the obtained compensation information to the control module 110. In some embodiments, the compensation information obtaining module 130 may send the obtained compensation information to the storage module 160 for storage, so as to be called by the control module 110 and/or the processing information generating module 140.

The machining information generation module 140 may be used to generate target machining information capable of correcting a mold machining error. In some embodiments, the processing information generating module 140 may call the compensation information acquired by the compensation information acquiring module 130 and the initial processing information stored in the storage module 160, and generate the processing information to be checked based on the compensation information and the initial processing information. In some embodiments, the processing information generating module 140 may adjust the second surface information obtained by the surface information obtaining module 120 and the target surface information stored in the storage module 160, where the second surface information is surface information of a second mold prepared based on the processing information to be checked, determine whether the second mold meets the error limiting requirement based on the second surface information and the target surface information, and if so, determine that the processing information to be checked is the target processing information. In some embodiments, the compensation information acquisition module 130 may transmit the generated target processing information to the control module 110. In some embodiments, the compensation information obtaining module 130 may send the generated target machining information to the storage module 160 for storage, so as to be called by the control module 110 and/or the machining module 150.

The tooling module 150 may be used for tooling of finished or semi-finished molds. In some embodiments, the processing module 150 may prepare a standard mold based on the target processing information generated by the processing information generation module 140 under the control of the control module 110. In some embodiments, machining module 150 includes a turning sub-module, a heating sub-module, and a press-fit sub-module.

The turning submodule can be used for turning the mould. In some embodiments, the control module 110 may control the turning submodule to turn the material to obtain the second mold according to the machining information to be checked sent by the machining information generating module 140. In some embodiments, the control module 110 may control the turning submodule to turn the initial mold 10' into the mold body 11 of the standard mold 10 according to the target machining information transmitted by the machining information generating module 140. In some embodiments, the turning submodule includes equipment for turning, such as lathes, cnc engraving and milling machines and the like.

The heating submodule may be used to perform heating of the mould. In some embodiments, the control module 110 may control the heating sub-module to heat the die body 11 turned by the turning sub-module to a preset temperature according to the heating parameters pre-stored in the storage module 160. In some embodiments, the heating submodule includes a device for heating, such as a high frequency induction coil or the like.

The press-fitting submodule can be used for press-fitting of the die. In some embodiments, the control module 110 may control the press-fitting sub-module to compact the mold body 11 with the cover layer 12 to produce a coated mold, based on the pressure parameters pre-stored in the storage module 160. In some embodiments, the press-fitting sub-module includes equipment for press-fitting, such as a platen tooling or the like.

The memory module 160 may be used to store instructions and/or data for the various modules of the mold tooling system 100 (e.g., the control module 110, the surface information acquisition module 120). For example, the storage module 160 may store initial process information of the process module 150. For another example, the storage module 160 may store the first surface information of the first mold and the second surface information of the second mold detected by the surface information acquiring module 120. For another example, the storage module 160 may store user input information received by the communication module 170, such as a heating parameter of the heating sub-module input by the user or an error preset value for determining the surface error of the second mold. In some embodiments, the storage module 160 may include mass storage, removable storage, volatile read-write memory, read-only memory (ROM), etc., or any combination thereof.

The communication module 170 may be used for the exchange of information or data. In some embodiments, the communication module 170 may be used for communication between components within the mold tooling system 100, such as communication between the control module 110, the surface information acquisition module 120, the compensation information acquisition module 130, the tooling information generation module 140, the tooling module 150, the storage module 160, the communication module 170, and/or the input/output module 180.

Input/output module 180 may acquire, transmit, and send signals. The input/output module 180 may be connected to or in communication with other components in the mold tooling system 100. Other components in the mold tooling system 100 may be connected or in communication via the input/output module 180. In some embodiments, the input/output module 180 may be connected to a network and obtain information over the network. In some embodiments, the input/output module 180 may obtain user input information for input through the network or the communication module 170. In some embodiments, the input/output module 180 may obtain control instructions or alerts from the control module 110 through the network or communication module 170.

It should be noted that the above description of mold tooling system 100 is for purposes of illustration and description only and is not intended to limit the scope of applicability of the present description. Various modifications and alterations to the mold tooling system 100 will be apparent to those skilled in the art in light of this description. However, such modifications and variations are intended to be within the scope of the present description. For example, the processing information generating module 140 and the processing module 150 may be one module, which may have functions of determining target processing information and preparing the standard mold 10 based on the target processing information. Such variations are within the scope of one or more embodiments of the present description.

FIG. 2 is a schematic diagram of exemplary hardware and/or software of a tooling polishing system according to some embodiments.

As shown in fig. 2, the workpiece polishing system 200 can include a control module 210, a polishing zone determination module 220, a polishing module 230, a storage module 240, a communication module 250, and an input/output module 260.

The control module 210 can be associated with other modules for processing information and data related to the workpiece polishing system 200. In some embodiments, the control module 210 may control the operational state of other modules (e.g., polishing zone determination module 220, polishing module 230, etc.). In some embodiments, control module 210 may manage the data acquisition or transmission process in communication module 250.

The polishing area determination module 220 is used for determining a sub-polishing area of the workpiece. In some embodiments, the control module 210 sends the workpiece polishing area information stored by the storage module 240 to the polishing area determination module 220, and the polishing area determination module 220 determines two or more sub-polishing areas of the workpiece based on the polishing area information.

The polishing module 230 is used to perform polishing of a workpiece. In some embodiments, the control module 210 may control the corresponding polishing mold of the polishing module 230 to polish each sub-polishing region of the workpiece according to the polishing parameters of the corresponding polishing mold according to the sub-polishing region determined by the polishing region determination module 220. Wherein the polishing parameters may be recalled from the memory module 240. In some embodiments, polishing module 230 includes a polishing apparatus, which may be one or more, for operating the polishing tool to polish the workpiece.

The memory module 240 is used to store instructions and/or data for the various modules of the workpiece polishing system 200 (e.g., the control module 210, the polishing zone determination module 220). For example, the storage module 240 may store corresponding polishing parameters for each polishing tool of the polishing module 230. For another example, the storage module 240 may store the polishing area information of the workpiece input by the user, so that the polishing area determination module 220 may call the polishing area information to determine the sub-polishing area of the workpiece. In some embodiments, the storage module 240 may include mass storage, removable storage, volatile read-write memory, read-only memory (ROM), etc., or any combination thereof. In some embodiments, storage module 240 and storage module 160 may be the same module.

The communication module 250 may be used for the exchange of information or data. In some embodiments, the communication module 250 may be used for communication between components within the workpiece polishing system 200, such as communication between the control module 210, the polishing zone determination module 220, the polishing module 230, the storage module 240, the communication module 250, and the input/output module 260. In some embodiments, the communication module 250 and the communication module 170 may be the same module.

Input/output module 260 may acquire, transmit, and send signals. The input/output module 260 can be connected to or in communication with other components in the workpiece polishing system 200. Other components in the workpiece polishing system 200 may be connected or in communication via the input/output module 260. In some embodiments, the input/output module 260 may be connected to a network and obtain information over the network. In some embodiments, the input/output module 260 may obtain user input information for input through the network or the communication module 250. In some embodiments, the input/output module 260 may obtain control instructions or alerts from the control module 210 through the network or communication module 250. In some embodiments, input/output module 260 and input/output module 180 may be the same module.

Fig. 3 is a schematic flow diagram of a mold tooling method according to some embodiments.

As shown in fig. 3, the mold tooling flow 300 may include steps 310 through 340. In some embodiments, the mold tooling flow 300 may be performed by a control device (e.g., the control module 110).

In step 310, first surface information of a first mold manufactured based on the initial processing information is acquired. In some embodiments, step 310 may be performed by surface information acquisition module 120.

The initial processing information refers to information related to the manufacturing of the mold by the processing device. In some embodiments, the initial processing information may be an initial processing program set by the processing device. In some embodiments, the initial process information may be initial operating parameters set by the processing tool.

The first mold is a mold manufactured by processing equipment without error correction. In some embodiments, the first mold may act as a carrier that presents processing tolerances for the processing equipment. For example, the processing device may be affected by maintenance, repair, or the like to generate a processing error, the first mold may be manufactured based on the initial processing information of the processing device, and the first mold may visualize the processing error of the processing device and represent a surface shape deformation of the processing surface.

The surface information refers to information reflecting the three-dimensional surface topography of an object. Correspondingly, the first surface information is information which correspondingly reflects the three-dimensional surface topography of the first mold. In some embodiments, the first surface information may include two-dimensional data characterizing an actual surface curve of the first mold. For example, the first mold is a mold manufactured by turning with a numerically controlled lathe such that a machined surface of the first mold is a surface of revolution. The first surface information includes two-dimensional data characterizing the surface of revolution, such as rotational axis, generatrix, longitude, latitude circle, and the like. In some embodiments, the first surface information may include three-dimensional data characterizing an actual face of the first mold.

In some embodiments, the first surface information may be obtained by contour detection. In some embodiments, the device capable of performing contour detection to obtain the first surface information includes a contact profiler and a non-contact profiler, for example, the contact profiler may include an inductive profiler, a piezoelectric profiler, an inductive profiler, and the like, and the non-contact profiler may include an optical profiler and the like.

In some embodiments, the first surface information may be raw surface information obtained by contour detection. In some embodiments, the first surface information may be obtained by a pre-processing based on the original surface information. Wherein the original surface information is directly detected by contour detection. In some embodiments, the control module 110 controls the contact profiler of the surface information obtaining module 120 to perform surface profile detection on the first mold to obtain two-dimensional raw surface curve data, and the surface information obtaining module 120 performs preprocessing based on the raw surface curve data to eliminate partial errors and obtain the first surface information.

In some embodiments, the pre-processing may include a filtering process. In some embodiments, the filtering process may include, but is not limited to, average filtering, high pass filtering, low pass filtering, linear interpolation, clipping filtering, or median filtering, among others.

Taking the average filtering as an example, the raw surface curve data of the first mold obtained by the surface information obtaining module 120 includes a series of data points, and the data format of each data point is (X, Y). Starting from the initial data point, the X value and the Y value of each 1000 data points are respectively averaged to replace the numerical value of the current data point, and the first surface information is obtained.

Taking high-pass filtering as an example, if the surface roughness of the first mold is lower than a first threshold (e.g., ra12.5 or ra 6.3), and the surface of the first mold is smooth, the surface information obtaining module 120 may perform filtering processing on the original surface curve data by using a high-pass filter (e.g., an ideal high-pass filter, a butterworth high-pass filter, a gaussian high-pass filter, etc.) after obtaining the original surface curve data obtained by the first mold through contour detection.

Taking low-pass filtering as an example, if the surface roughness of the first mold is higher than a first threshold (e.g., ra12.5 or Ra 6.3) and lower than a second threshold (e.g., ra100 or Ra 50), and the surface of the first mold is rough, the surface information obtaining module 120 may filter the raw surface curve data obtained by the contour detection of the first mold by using a high-pass filter and a low-pass filter (e.g., an ideal low-pass filter, a butterworth low-pass filter, a gaussian low-pass filter, etc.).

In some embodiments, the linear interpolation may include a linear interpolation, a circular interpolation, a parabolic interpolation, a spline interpolation, and the like. For example, the surface of the first mold has a defect such as a burr or a protrusion that can be detected by machine vision or visual observation, and the surface information acquisition module 120 performs linear interpolation on the original surface curve data corresponding to the defect position.

In some embodiments, the first mold is an uncoated mold. The mold processing method of some embodiments of the present description can be used for processing a polishing mold, the surface of the polishing mold has a porous flexible covering layer (such as a polishing skin) to facilitate the attachment of polishing powder, and the flexible covering layer affects the accuracy of contour detection. The first mold is a mold without a covering layer, and accurate and reliable first surface information can be obtained through contour detection.

In some embodiments, the first mold is made of a metal material, such as a pure metal material or an alloy material. The properties and processability of the metallic material are such that the first mold is easy to machine and the surface roughness is as desired to facilitate profile inspection and pre-processing of the first surface information. In some embodiments, the first mold is preferably made of brass.

In step 320, compensation information is obtained based on the first surface information and the target surface information. In some embodiments, step 320 may be performed by compensation information acquisition module 130.

The target surface information is information reflecting a three-dimensional surface topography theoretically generated by a target mold. Wherein the target mold is a theoretical generated mold. In some embodiments, the target surface information may include two-dimensional data reflecting a theoretical surface curve of the target mold. For example, the theoretical working surface of the target mold is an ellipsoid, and the target surface information may include two-dimensional data characterizing the ellipsoid, such as center coordinates, major axis, minor axis, and the like.

In some embodiments, the target surface information is generated by a mathematical predictive model based on the initial machining information. For example, the compensation information acquisition module 130 may call the initial machining information stored in the storage module 160 to generate the target surface information using a mathematical prediction model. In some embodiments, the target surface information is determined based on user input. For example, the control module 110 may receive target surface information input by a user through the input/output module 180 and store the target surface information in the storage module 160.

The compensation information refers to information related to a machining error of the machining apparatus. In some embodiments, the machining error is a systematic error. For example, a maintenance or repair factor of the processing apparatus causes a systematic error, so that the initial processing information determined before the maintenance or repair cannot be applied to the processing apparatus after the maintenance or repair, and the error between the first mold and the target mold made by the processing apparatus based on the initial processing information is out of an allowable range.

In some embodiments, the compensation information is obtained by comparing the first surface information with the target surface information. For example, the theoretical working surface of the target mold is a surface of revolution, the theoretical generatrix of the target mold is a parabola, the target surface information includes two-dimensional data representing the theoretical generatrix, and the target surface information is stored in the memory module 160. The actual generatrix of the first mold processing surface measured by the surface information obtaining module 120 is another parabola, and the first surface information includes two-dimensional data representing the actual generatrix, wherein the maximum curvature radius difference between each point on the theoretical generatrix and the actual generatrix may be greater than a preset threshold. The compensation information obtaining module 130 may use the two-dimensional data of the theoretical bus and the actual bus to perform comparison calculation, so as to obtain the compensation information.

Some embodiments of the present disclosure obtain compensation information based on the first surface information and the target surface information, and reflect a processing error of the first mold through the compensation information, so that a mold processing process can be corrected based on the compensation information, thereby improving processing accuracy.

For more on the compensation information acquisition, please refer to fig. 4 and its description.

In step 330, target machining information is generated based on the initial machining information and the compensation information. In some embodiments, step 330 may be performed by the process information generation module 140.

In some embodiments, the target machining information is generated after one or more compensations of the initial machining information. In some embodiments, the target machining information may be a target machining program or a target machining parameter.

In some embodiments, the initial machining information is an initial machining program, and the first compensation program may be generated based on the initial machining program and the compensation information. The control module 110 calls the first compensation program generated by the processing information generation module 140, controls the processing equipment of the processing module 150 to manufacture the mold, and if the mold meets the requirement of error limitation, the first compensation program is the target processing program; if the mold manufactured by the processing device of the processing module 150 using the first compensation program does not meet the error limit requirement, the

steps

320 and 330 are repeatedly executed, so that the processing information generating module 140 performs multiple iterations on the initial processing program until the target processing program is generated.

In some embodiments, the initial processing information is an initial processing parameter, and the first compensation parameter may be generated based on the initial processing parameter and the compensation information. For example, the machining apparatus is a lathe, the initial machining parameters of which may include a feed amount, a feed angle, and a feed speed, and the first compensated feed amount, the first compensated feed angle, and the first compensated feed speed may be generated based on the compensation information and the initial machining parameters. The control module 110 calls the first compensation parameter generated by the processing information generation module 140, the control module 110 resets the processing equipment of the processing module 150 and manufactures a mold based on the first compensation parameter, and if the mold manufactured after resetting the parameter meets the error limit requirement, the first compensation parameter is the target processing parameter; otherwise, step 320 and step 330 are repeatedly executed, and the initial processing parameters are updated for multiple times until the target processing parameters are generated.

For more on the target processing information generation please refer to fig. 5 and its description.

In step 340, a standard mold 10 is prepared based on the target processing information, wherein the standard mold 10 comprises a mold body 11 and a cover layer 12. In some embodiments, step 340 may be performed by the processing module 150.

The standard mold 10 refers to a mold that meets the requirements of tolerance-related limits. In some embodiments, the die body 11 of the master die 10 is made of a hard material, such as a metallic material or an alloy material. The die body 11 is used to provide structural support for the standard die 10, and the die body 11 of hard material is convenient to machine. In some embodiments, hard materials that may be used to machine the die body 11 include, but are not limited to, brass, aluminum, stainless steel, cast iron, and the like. In some embodiments, the hard material used to machine the die body 11 is preferably brass.

In some embodiments, the cover layer 12 of the standard mold 10 is made of a flexible material, such as a polymeric material. The cover layer 12 of the standard mold 10 has different functions according to its application scenario. For example, the standard mold 10 is a mold for polishing, the covering layer 12 has a function of assisting polishing, and a plurality of holes are provided in the covering layer 12 to facilitate the entry of polishing powder and the adhesion of polishing powder. In some embodiments, flexible materials that may be used to fabricate the cover layer 12 include, but are not limited to, polyurethane, damping cloth, synthetic organics, and the like. In some embodiments, the flexible material used to process the cover layer 12 is preferably polyurethane.

In some embodiments, the master mold 10 is prepared by a step-by-step process of the mold body 11 and the cover layer 12.

In some embodiments, the die body 11 is turned based on target machining information. For example, the control module 110 may call the target machining program generated by the machining information generating module 140, and the control module 110 may control a turning device of the turning submodule to turn the raw material based on the target machining program or the target machining parameters to manufacture the mold body 11.

In some embodiments, the cover layer 12 is attached to the mold body 11 and then polished through the cover layer 12 to form the standard mold 10. The control module 110 may control the processing module 150 to grind the coating 12 applied to the processing surface of the mold body 11 to reduce or eliminate wrinkles and/or undulations of the coating 12 due to the application.

In some embodiments, the cover layer 12 is attached to the mold body 11 and then turned to form the master mold 10 by turning the cover layer 12. The control module 110 may control the turning submodule of the machining module 150 to turn the cover layer 12 attached to the machining surface of the die body 11 based on the target machining information. The coating die formed by attaching the coating layer 12 to the die body 11 cannot perform error analysis and machining precision control (the flexible coating layer affects detection accuracy) through means such as contour detection, and compared with a grinding process which is difficult to perform quantitative and standardized production, standardized turning is performed based on target machining information, consistency of machining precision and die finished products can be guaranteed, and yield is improved.

For more on the standard mold preparation please see fig. 6, fig. 7 and their description.

Some embodiments of the present description prepare the standard mold based on the target processing information, so that the standard mold can realize standardized batch processing, and the processing precision and the finished product consistency are high.

Fig. 4 is an exemplary flow diagram of a compensation information obtaining process according to some embodiments.

In the process of detecting the three-dimensional surface topography of the mold using the profile detection apparatus, there may be a problem of data distortion or data loss corresponding to the edge portion of the surface topography. For example, the control module 110 controls the contact profiler of the surface information acquisition module 120 to detect the first mold. Because the contact type contourgraph carries out the profile detection based on the preset starting range, in order to enable a probe of the contact type contourgraph to be always in contact with the surface of the first mould in the detection process, the edge part of the first mould is required to be positioned outside the preset starting range. Therefore, the first surface information of the first mold obtained by the surface information obtaining module 120 lacks data related to the edge portion of the first mold, and thus causes a problem that the compensation information has an increased error at the edge portion of the first mold.

As shown in fig. 4, the compensation information obtaining process 400 may include

steps

410 and 420. In some embodiments, the compensation information obtaining process 400 may be performed by a control device (e.g., the control module 110). In some embodiments, the compensation information obtaining process 400 may compensate, expand, respectively, for the body and the edge of the first mold to reduce errors.

In step 410, body compensation information corresponding to the first mold body is obtained based on a comparison of the first surface information and the target surface information. In some embodiments, step 410 may be performed by a body compensation sub-module of the compensation information acquisition module 130.

In some embodiments, the body and the edge of the first mold may be determined based on a range of contour detection. By way of example only, the surface to be measured (machined surface) of the first mold is a surface of revolution having a cross-sectional diameter φ perpendicular to the axis of rotation in the range of 0mm to 50 mm. The detection range of the contact type contourgraph can be a surface area of which the section diameter phi of the first die is in a range of 1-49 mm, namely the surface area corresponds to a main body of the first die; the first die has a surface area with a cross-sectional diameter phi in the range of 0mm to 1mm and in the range of 49mm to 50mm, i.e., corresponding to the edge of the first die.

In some embodiments, the body of the first mold may be determined based on user input. For example, before the control module 110 controls the surface information acquisition module 120 to detect the first mold to obtain the first surface information, the user may send the start and end position information of the contour detection to the control module 110 through the input/output module 180, and the control module 110 determines the body range of the first mold based on the start and end position information input by the user and controls the surface information acquisition module 120 to perform the contour detection.

In some embodiments, the body of the first mold may be determined based on preset rules. For example, in combination with the aforementioned example that the first mold processing surface is a rotation surface, the generatrix of the rotation surface may be an arc, and the control module 110 controls the profile detector of the surface information acquisition module 120 to perform profile detection along the generatrix of the rotation surface. The control module 110 may determine, based on a preset rule, that a distance between a start position of the profile detection and the first end of the bus bar is a first predetermined value (e.g., 1mm, 3mm, 5mm, etc.), and a distance between an end position of the profile detection and the second end of the bus bar is the first predetermined value, and then an area between the start position and the end position of the profile detection corresponds to a main body of the first mold. In some embodiments, the preset rules may be stored in the storage module 160.

In some embodiments, body compensation information corresponding to the first mold body may be obtained based on a comparison of the first surface information and the target surface information. There may be an error between the first surface information and the target surface information, which may be reflected by the subject compensation information obtained by comparing the two. For example, in combination with the aforementioned example in which the first mold processing surface is a revolution surface, the first surface information includes two-dimensional curve data corresponding to the first mold main body on a generatrix of the first mold, and the target surface information includes two-dimensional curve data corresponding to the target mold main body on a generatrix of the target mold. By comparing the data of the first surface information and the target surface information, the difference value of the X value and/or the Y value of each point on the bus of the first mold and the corresponding point on the target mold can be obtained, namely the main body compensation information is obtained.

In step 420, based on the data trend of the first surface information, edge extension information corresponding to the first mold edge is obtained. In some embodiments, step 420 may be performed by an edge compensation sub-module of the compensation information acquisition module 130.

In some embodiments, the first surface information may reflect a three-dimensional topographical change of a body of the first mold, and the edge surface information corresponding to the edge of the first mold may be obtained by numerical fitting based on a data trend of the first surface information. For example, in combination with the aforementioned example that the first mold processing surface is a revolution surface, a generatrix of the revolution surface may be a broken line, and the control module 110 controls the profile detector of the surface information acquisition module 120 to perform profile detection along the generatrix of the revolution surface. The first surface information of the first mold includes curve data corresponding to the first mold body on a generatrix of the first mold, and the curve data (e.g., end data) may be used to perform a linear fit (e.g., a univariate linear regression fit) to obtain edge surface information corresponding to an edge of the first mold.

In some embodiments, the edge extension information may be further obtained based on a comparison of the edge surface information and the target surface information. There may be an error between the edge surface information and the target surface information, and the edge extension information obtained by comparing the two may reflect the error. For example, in combination with the aforementioned example that the first mold processing surface is a revolution surface, the edge surface information includes two-dimensional curve data corresponding to the first mold edge on the generatrix of the first mold, and the target surface information includes two-dimensional curve data corresponding to the target mold edge on the generatrix of the target mold. By comparing the data of the edge surface information and the target surface information, the difference value of the X value and/or the Y value of each point on the bus of the first mold and the corresponding point on the target mold can be obtained, namely the edge extension information is obtained.

Fig. 5 is an exemplary flow diagram of a target process information generation process according to some embodiments.

As shown in fig. 5, the target processing information generating process 500 may include steps 510 to 540. In some embodiments, the process 500 may be performed by a control device (e.g., the control module 110).

In step 510, processing information to be verified is generated based on the initial processing information and the compensation information. In some embodiments, step 510 may be performed by the process information generation module 140. In some embodiments, the processing information to be checked can be used for processing error verification, so that the error correction effect of the generated target processing information is ensured, and the processing precision is ensured.

In step 520, second surface information of a second mold is obtained, and the second mold is manufactured based on the processing information to be checked. In some embodiments, step 520 may be performed by surface information acquisition module 120.

In some embodiments, the second surface information refers to information reflecting a three-dimensional surface topography of the second mold. In some embodiments, the second surface information may be obtained by the surface information obtaining module 120 performing contour detection; the second mold may be made from the processing module 150. For example, the control module 110 calls the to-be-checked processing information generated by the processing information generation module 140, and controls the turning submodule of the processing module 150 to turn according to the to-be-checked processing information to obtain a second mold, wherein a processing surface obtained by turning the second mold is a revolution surface; the control module 110 controls the contact profiler of the surface information acquiring module 120 to perform surface profile detection on the machined surface of the second mold, so as to obtain two-dimensional surface curve data.

In step 530, it is determined whether the surface error of the second mold is within a preset value range based on the second surface information and the target surface information. In some embodiments, step 530 may be performed by the process information generation module 140.

In some embodiments, the second surface information and the target surface information are both two-dimensional surface curve data, and the surface error of the second mold may be calculated from data based on the second surface information and the target surface information. The surface error of the second mold refers to an error between each point or a representative series of characteristic points on the processing surface of the second mold and each corresponding point on the target mold. For example, the second surface information may include two-dimensional coordinates of a series of detected points of the second mold surface, the target surface information may include two-dimensional coordinates of a series of simulated points of the target mold surface, and the surface error value corresponding to a detected point may be obtained by calculating a distance between the detected point and the corresponding simulated point.

In some embodiments, the surface error of the second mold being within a preset value range may mean that the maximum surface error is less than a preset value. The surface errors of the second mold can be the same or different, wherein the maximum surface error is less than a specific preset value, and the second mold can be considered to meet the error limit requirement.

In some embodiments, the preset value is a default value stored in the storage module 160 and readable by the call, for example, the preset value may be 10 μm. In some embodiments, the preset value may be determined based on user input. For example, before the processing information generating module 140 determines whether the surface error of the second mold is within the preset value range, the control module 110 sends query information for whether to set the preset value to the user through the input/output module 180. After the user responds, the control module 110 obtains the preset value input by the user and sends the preset value to the processing information generating module 140.

In step 540, target processing information is determined based on the surface error determination result of the second mold. In some embodiments, step 540 may be performed by process information generation module 140.

In some embodiments, step 540 further comprises: and if the surface error of the second mold is judged to be within the preset value range, determining the processing information to be checked corresponding to the second mold as target processing information. The target processing information corrects systematic errors of the processing equipment (e.g., a lathe) of the processing module 150, so that the processing module 150 can perform high-precision and standardized mold processing based on the target processing information, and is suitable for batch processing of molds.

In some embodiments, step 540 further comprises: if the surface error of the second mold is not within the preset value range, the process 500 is terminated, and the next step 320 and process 500 are executed until the target processing information is generated. For example, if the processing information generation module 140 determines that the surface error of the second mold is not within the preset value range, the control module 110 controls the processing information generation module 140 to terminate the currently executed target processing information generation process 500. The control module 110 sends the second surface information measured by the surface information obtaining module 120 to the compensation information obtaining module 130; the control module 110 controls the compensation information obtaining module 130 to perform the step 320, obtains the compensation information a second time based on the second surface information and the target surface information, and the control module 110 transmits the compensation information obtained the second time to the machining information generating module 140 and controls the machining information generating module 140 to perform the second round of the process 500. If the second round of process 500 determines that the surface error of the third mold is not within the predetermined range, the control module 110 will terminate the second round of process 500 and continue to execute the next round of step 320 and process 500 in a loop until the target processing information is generated.

In some embodiments of the present disclosure, the target processing information generation process corrects a systematic error of a processing device (e.g., a turning sub-module of the processing module 150), and the processing device may perform die processing in batches based on the target processing information generated in the target processing information generation process, so as to improve processing accuracy and standardization.

Fig. 6 is an exemplary flow diagram of a standard mold preparation process according to some embodiments.

As shown in fig. 6, the standard mold preparation process 600 may include steps 610 through 630. In some embodiments, the process 600 may be performed by a control device (e.g., the control module 110).

In step 610, the initial mold 10' is turned based on the target machining information to produce the mold body 11. In some embodiments, step 610 may be performed by the machining module 150 (e.g., a turning sub-module).

In some embodiments, the initial mold 10' is the feedstock to be processed. For example, the primary mold 10' may be a cylindrical metal material, the surface to be machined of the primary mold 10' is a flat surface, the mold body 11 is turned based on the surface to be machined of the primary mold 10', and the machined surface of the mold body 11 is an inner spherical surface.

In some embodiments, the initial mold 10' may be directly turned based on the target machining information to produce the mold body 11. For example, the turning submodule of the machining module 150 calls the target machining program generated by the machining information generation module 140 to turn the initial mold 10', thereby obtaining the mold body 11.

In step 620, the cover layer 12 is attached to the mold body 11. In some embodiments, step 620 may be performed by the heating and pressing submodules of the process module 150.

Step 620 may further include a heating step in some embodiments. In the heating step, the mold body 11 is heated. In some embodiments, the heating step may be performed by a heating submodule of the process module 150.

In some embodiments, the mold body 11 may be heated by heating coils. Preferably, the heating coil is a high-frequency induction coil. The heating coil can form an eddy current amount in the die body 11 as an electric conductor, and rapidly heat the die body 11 by electromagnetic induction.

In some embodiments, the die body 11 to be heated is placed in a heating coil for heating. During the heating process, the heating efficiency can be improved by adjusting the position of the die body 11 on the heating coil. In some embodiments, the axis of the heating coil passes through the die body 11 to be heated. In some preferred embodiments, the mold body 11 may be a rotator, and the axis of the heating coil coincides with the axis of the mold body 11 to be heated, so as to improve the heating effect.

In some embodiments, the heating temperature of the heating coil is 160 ℃ to 200 ℃, e.g., the heating temperature can be about 160 ℃, 165 ℃, 170 ℃, 175 ℃, 180 ℃, 185 ℃, 190 ℃, 195 ℃, or 200 ℃. In some embodiments, the heating temperature of the heating coil is preferably 170 ℃ to 190 ℃. The mold body 11 is heated to a suitable temperature to facilitate bonding of the cover layer 12.

In some embodiments, step 620 further comprises a pressing step. In the pressing step, the cover layer 12 is compacted with the heated mold body 11, so that the cover layer 12 is attached to the mold body 11. In some embodiments, the pressing step may be performed by a pressing submodule of the process module 150.

In some embodiments, the cover layer 12 may be bonded to the heated mold body 11 based on the physical properties of the cover layer 12 itself. For example, the cover layer 12 is made of a flexible polymer material, such as polyurethane. Heating the mold body 11 to the melting point range of the polyurethane, melting the portion of the covering layer 12 contacting the mold body 11, and tightly bonding the melted portion with the mold body 11 to attach the covering layer 12 to the mold body 11.

In some embodiments, the heated mold body 11 is pre-provided with an adhesive medium by which the cover layer 12 is bonded to the heated mold body 11. For example, a predetermined amount of polyurethane is pre-melted and applied to the heated mold body 11, and then the cover layer 12 made of polyurethane is placed on the mold body 11 so that the cover layer 12 and the mold body 11 are bonded by the pre-melted polyurethane. In some embodiments, the adhesive medium may be the material from which the cover layer 12 is made, or the adhesive medium may be other materials having an adhesive effect, and the embodiment is not limited thereto.

In some embodiments, the overlay 12 is consolidated with the heated die body 11 by a pressurized platen tooling 30 to produce the overlay die 10". Illustratively, as shown in fig. 7, a heated mold body 11 is placed on the tooling substrate and a cover layer 12 is placed on the pressure-bearing surface of the mold body 11. The driving device 40 of the platen tool 30 is mounted above the die body 11 through a tool bracket, and the platen tool 30 is fixed on the driving rod 41 of the driving device 40. The platen tool 30, the cover layer 12, and the heated mold body 11 are aligned in the vertical direction, and the platen tool 30 is moved in the vertical direction to press the cover layer 12 and the heated mold body 11, so that the cover layer 12 and the heated mold body 11 are compacted, and the cover mold 10 ″ is manufactured.

In some embodiments, the curvature of the pressing surface of the platen tool 30 matches the curvature of the bearing surface of the die body 11. The curvature matching makes the pressing surface of the platen tool 30 and the pressure-bearing surface of the mold body 11 face right and then substantially parallel, that is, the difference between the curvature radii of each point on the pressure-bearing surface and the corresponding point on the pressing surface is within a preset threshold range (for example, not more than 1 mm), so that the covering layer 12 placed on the pressure-bearing surface of the mold body 11 is uniformly stressed at each point, and the covering layer 12 is smoothly attached to the pressure-bearing surface of the mold body 11.

In some embodiments, the pressure range for the pressing tool 30 is 0.1Mpa to 0.8Mpa. For example, the pressing surface of the platen tool 30 may apply a pressure of about 0.1Mpa, 0.2Mpa, 0.3Mpa, 0.4Mpa, 0.5Mpa, 0.6Mpa, 0.7Mpa, or 0.8Mpa to the pressure-bearing surface of the mold body 11 to press the cover layer 12 against the mold body 11. In some preferred embodiments, the pressure applied by the platen tooling 30 is in the range of 0.3Mpa to 0.6Mpa. For example, if the pressure-bearing surface (i.e., the processing surface) of the die body 11 is a revolution surface having a maximum cross-sectional diameter of 50mm or less, the pressure applied by the platen tool 30 may be about 0.3Mpa. For another example, if the pressure-receiving surface (i.e., the processing surface) of the die body 11 is a rotating surface having a maximum cross-sectional diameter of 80mm or less and a maximum cross-sectional diameter of 51mm or more, the pressure applied by the platen tool 30 may be about 0.6Mpa.

In some embodiments, the driving device 40 of the platen tool 30 may be a pneumatic cylinder or a hydraulic cylinder. In some embodiments, the driving device 40 of the platen tool 30 may be other devices having a driving function, and the present embodiment is not limited.

In step 630, the overlay layer 12 is turned based on the target machining information to produce the master mold 10. In some embodiments, step 630 may be performed by a turning sub-module of machining module 150.

In some embodiments, the surface of the cover layer 12 has unpredictable and controllable undulations after the cover layer 12 is compacted with the mold body 11. Turning the overlay layer 12 of the overlay mold 10 "based on the target machining information may reduce or eliminate the errors caused by the asperities described above. For example, the control module 110 calls the target machining program generated by the machining information generation module 140, and controls the turning submodule of the machining module 150 to turn the cover layer 12 of the cover layer mold 10 ″ by the target machining program, so as to eliminate the undulation and wrinkle of the surface of the cover layer 12 that do not meet the error limit requirements, and thus the standard mold 10 is manufactured.

In some embodiments, the turning the overlay 12 based on the target machining information to produce the master mold 10 may further include: generating coating compensation information based on the target processing information and the coating information; the overlay 12 of the overlay mold 10 "is turned based on the overlay compensation information to produce the master mold 10. The target machining information is generated with the exclusion of the influence of the overlay layer 12, and the overlay compensation information may introduce a correction corresponding to the overlay layer 12 when machining the master mold 10, avoiding the overlay layer 12 from being over-turned. For example, the processing information generation module 140 performs a coating correction (e.g., shifting the entire processing surface by a predetermined distance) on the target processing program based on the coating information (e.g., thickness) input by the user, to obtain a coating compensation program; the control module 110 calls the coating compensation program generated by the processing information generation module 140, and the coating compensation program is used for controlling the turning submodule of the processing module 150 to turn the coating layer 12 of the coating mold 10 ″ to manufacture the standard mold 10.

In the preparation process of the standard die in some embodiments of the present description, the standard die 10 is obtained by turning the covering layer 12 of the covering die 10 ″ based on the target processing information, and compared with a grinding process, the turning of the covering die 10 ″ is easier to realize standardized batch processing, the processing time is short, and the consistency of the finished product is high.

The standard die prepared by the die processing method in some embodiments of the specification can be used for polishing a workpiece, and is beneficial to standardization of a workpiece polishing process. The polishing process of the workpiece usually uses a single polishing mold to polish all polishing areas of the workpiece, and needs to be implemented by frequently adjusting polishing parameters (such as swing amplitude, pressure, etc.) of the polishing equipment. This not only makes the manufacturing of the polishing mold more difficult, but also makes the polishing precision limited because it is difficult to fully compromise the polishing of all polishing areas. In addition, frequent adjustment of polishing parameters causes great difficulty in adjusting the polishing equipment, long time and limitation on standardization of the polishing process. In some embodiments of the specification, the workpieces are polished in different regions by using a plurality of standard dies, under the condition that the polishing requirement is not changed, the polishing parameters of the polishing equipment corresponding to each standard die are not changed, the corresponding regions of the same type of workpieces can be polished in batch, in standardization and in high precision without frequently adjusting the polishing equipment, and the time cost brought by adjusting the polishing equipment is reduced. Meanwhile, the partition polishing of the plurality of standard dies can reduce the processing difficulty of a single standard die and guarantee the processing precision of the single standard die, so that the polishing precision is further improved.

FIG. 8 is a schematic flow diagram of a method of polishing a workpiece according to some embodiments.

As shown in fig. 8, the workpiece polishing flow 800 may include steps 810 through 830. In some embodiments, the workpiece polishing process 800 may be performed by a control device (e.g., the control module 210). In some embodiments, the workpiece polishing process 800 can separate the mold polishing for different polishing areas of the workpiece, thereby reducing the processing difficulty of the polishing mold and improving the polishing precision and efficiency.

In some embodiments, the workpiece 20 may include a polishing region to be zone polished, such as a polishing region where the single-sided lens includes a convex or concave surface. In some embodiments, the workpiece may include a plurality of polishing regions to be zone polished, the plurality of polishing regions not overlapping over the extent of the workpiece surface, e.g., a lenticular lens including two convex or concave polishing regions. The process 800 may be performed independently for each of one or more polishing zones of a workpiece for zone polishing.

In step 810, at least a first polishing zone 21 and a second polishing zone 22 of the workpiece 20 are determined. In some embodiments, step 810 may be performed by polishing zone determination module 220.

In some embodiments, the workpiece 20 may have two sub-polishing regions, such as a first polishing region 21 and a second polishing region 22, which may cover the polishing region of the workpiece 20. In some embodiments, the workpiece 20 can further include a third polishing zone, a fourth polishing zone, through an Nth polishing zone, with two or more sub-polishing zones of the workpiece 20 overlying the polishing zones of the workpiece 20. The number of the sub polishing regions is not limited in this embodiment.

In some embodiments, different sub-polishing zones of the workpiece 20 may be determined based on the radius of curvature of the polishing zones, such as at least a first polishing zone 21 and a second polishing zone 22.

By way of example only, the workpiece 20 is a single-sided lens to be polished, the polishing region of which is an aspheric surface of revolution (convex surface), the projection of the axial cross-section in the axial-radial coordinate system is a parabola, and the radius of curvature of the polishing region is between 5mm and 35 mm. The polishing area determining module 220 may determine the first polishing area 21 as an area having a polishing area curvature radius of 5mm to 10mm and the second polishing area 22 as an area having a polishing area curvature radius of 10mm to 35mm based on the curvature radius range of the polishing area of the workpiece 20. The curvature radius range of each sub-polishing region of the workpiece 20 can be set according to the actual processing requirement, and the embodiment is not limited.

In some embodiments, the radius of curvature of the sub-polishing regions is different for each polishing region of the workpiece 20. For example, the workpiece 20 has a polishing area, wherein the first polishing area 21 and the second polishing area 22 cover the polishing area of the workpiece 20, the first polishing area 21 and the second polishing area 22 have different curvature radius, and the polishing is performed by zone polishing so as to achieve the purpose of standardized batch polishing.

Some embodiments of the present disclosure determine different sub-polishing regions of the workpiece as a basis for the zone polishing, and if the polishing precision of the workpiece is not up to the standard, the sub-polishing region to be optimized can be accurately positioned, thereby facilitating adjustment of the polishing parameters and/or the polishing mold.

In step 820, the first polishing region 21 is polished using a first polishing jig 10 a. In some embodiments, step 820 may be performed by a first polishing sub-module of polishing module 230.

The first polishing mold 10a is used for polishing of the first polishing region 21. In some embodiments, the curvature of the polishing surface of the first polishing mold 10a matches the curvature of the surface to be polished of the first polishing region 21. Specifically, the difference between the curvature radii of each point on the polishing surface of the first polishing mold 10a and the corresponding point on the surface to be polished of the first polishing region 21 is within a preset threshold range (for example, not more than 0.01mm, 0.03mm, 0.05mm, or 0.08 mm), so that when the polishing surface 13a of the first polishing mold 10a is aligned with the surface to be polished of the first polishing region 21, the surface to be polished can be closely attached to the polishing surface 13a for polishing.

In some embodiments, the polishing of the first polishing zone 21 may be performed by at least one of axial rotation of the first polishing mold 10a, rotational oscillation of the first polishing mold 10a, and axial rotation of the workpiece 20.

Figure 9 is a schematic diagram of an exemplary configuration of a first polishing zone polishing process according to some embodiments. In a specific embodiment, as shown in fig. 9, the control module 210 controls the first polishing sub-module of the polishing module 230 to polish the first polishing region 21 of the workpiece 20. According to the control instruction of the control module 210, the first polishing sub-module controls the first polishing mold 10a to rotate and swing along the direction w1 with the origin O1, controls the first polishing mold 10a to axially rotate along the direction n'1 with the axis L2, and controls the workpiece 20 to axially rotate along the direction n1 with the axis L1. The first polishing area 21 matches with the curvature of the polishing surface 13a of the first polishing mold 10a, and during the above-mentioned rotary oscillation and axial rotation, the first polishing mold 10a continuously applies pressure P1 to the workpiece 20, so that the polishing surface 13a and the first polishing area 21 are tightly attached and rubbed, thereby achieving the effect of polishing the first polishing area 21.

In some embodiments, the first polishing mold 10a has first polishing parameters including at least a first swing parameter and a first pressure parameter. In some embodiments, the first polishing parameters may further include a first mold rotation parameter and/or a first workpiece rotation parameter.

Some embodiments of the present description use different polishing molds and polishing parameters to polish different sub-polishing regions of a workpiece, thereby reducing the difficulty in adjusting polishing equipment. Under the condition that the polishing precision of the workpiece meets the requirement, after the assembly of the polishing die is completed and the polishing parameters of the corresponding polishing die are set, the polishing equipment does not need to set the parameters again, and the influence of frequent machine adjustment on the polishing efficiency is avoided.

In step 830, the second polishing region 22 is polished by using a second polishing mold 10b, and the polishing surface 13a of the first polishing mold 10a and the polishing surface 13b of the second polishing mold 10b have different radii of curvature. In some embodiments, step 830 may be performed by a second polishing sub-module of polishing module 230.

The second polishing mold 10b is used for polishing of the second polishing region 22. In some embodiments, the curvature of the polishing surface 13b of the second polishing mold 10b matches the curvature of the surface to be polished of the second polishing zone 22. Specifically, the difference between the curvature radii of each point on the polishing surface of the second polishing mold 10b and the corresponding point on the surface to be polished of the second polishing region 22 is within a preset threshold range (for example, not more than 0.01mm, 0.03mm, 0.05mm, or 0.08 mm), so that when the polishing surface 13b of the second polishing mold 10b is aligned with the surface to be polished of the second polishing region 22, the surface to be polished can be closely attached to the polishing surface 13b for polishing.

In some embodiments, the polishing of the second polishing region 22 may be performed by at least one of axial rotation of the second polishing mold 10b, rotational oscillation of the second polishing mold 10b, and axial rotation of the workpiece 20.

Fig. 10 is a schematic diagram of an exemplary configuration of a second polishing zone polishing process according to some embodiments. In a specific embodiment, as shown in fig. 10, the control module 210 controls a second polishing sub-module of the polishing module 230 to polish the second polishing region 22 of the workpiece 20. According to the control instruction of the control module 210, the second polishing sub-module controls the second polishing mold 10b to rotate and swing along the direction w2 with the origin O2, controls the second polishing mold 10b to rotate axially along the direction n'2 with the axis L3, and controls the workpiece 20 to rotate axially along the direction n2 with the axis L1. The curvature of the second polishing region 22 matches with the curvature of the polishing surface 13b of the second polishing mold 10b, and during the above-mentioned rotary oscillation and axial rotation, the second polishing mold 10b continuously applies a pressure P2 to the workpiece 20, so that the polishing surface 13b and the second polishing region 22 are tightly attached and rubbed, thereby achieving the effect of polishing the second polishing region 22.

In some embodiments, the second polishing mold 10b has a second polishing parameter, the second polishing parameter comprising at least a second swing parameter and a second pressure parameter. In some embodiments, the second polishing parameters may further include a second mold rotation parameter and/or a second workpiece rotation parameter.

In some embodiments, the polishing parameters of the different polishing molds are different from each other, such as a first polishing parameter of the first polishing mold 10a and a second polishing parameter of the second polishing mold 10 b. The polishing parameters are different from each other, which means that at least one of the plurality of parameters of the polishing parameters is different from each other. For example, the first polishing parameter is different from the second polishing parameter, wherein the first swing parameter is different from the second swing parameter, and the first pressure parameter is the same as the second pressure parameter.

In some embodiments, the first polishing mold 10a and the second polishing mold 10b polish different sub-polishing regions of the workpiece 20, respectively, and the polishing surface 13a of the first polishing mold 10a and the polishing surface 13b of the second polishing mold 10b have different radii of curvature. For example, as shown in fig. 9 and 10, the radius of curvature of the polishing surface 13a of the first polishing jig 10a is 45mm, and the first polishing jig 10a polishes the first polishing region 21 of the workpiece 20; the radius of curvature of the polishing surface 13b of the second polishing jig 10b is 60mm, and the second polishing jig 10b polishes the second polishing region 22 of the workpiece 20.

In some embodiments, the process 800 may further include a third polishing area polishing step, a fourth polishing area polishing step, through an nth polishing area polishing step. And each polishing area uses a corresponding polishing die matched with the curvature of the surface to be polished, and polishing parameters are respectively set based on different polishing areas.

In some embodiments, a standard mold prepared by the mold processing flow 300 may be used as the polishing mold for the sub-polishing region, such as using the standard mold prepared by the flow 300 as the first polishing mold and/or the second polishing mold. Please refer to the related descriptions of fig. 3 to fig. 8 for further details regarding the structure and processing method of the standard mold that can be used as the first polishing mold and/or the second polishing mold, which are not repeated herein.

In the workpiece polishing method according to some embodiments of the present description, the workpiece is polished in a partitioned manner by using the plurality of polishing molds having different curvature radii, so that the processing difficulty of the polishing mold in each sub-polishing region is reduced. Particularly, after polishing dies and polishing parameters corresponding to a plurality of sub-polishing areas of the workpiece are determined by using the workpiece polishing method, the polishing equipment can perform standardized batch polishing on the workpiece, further equipment debugging is not needed in the process, and the polishing precision and the polishing efficiency of the workpiece are improved.

The die machining method and the workpiece polishing method disclosed in the specification may bring about beneficial effects including, but not limited to: (1) The mold processing method provided by the embodiment of the specification can be used for compensating and correcting the initial processing information for one time or multiple times to obtain target processing information, and the standard mold processed based on the target processing information can effectively reduce or eliminate the influence of system errors of processing equipment; (2) The die processing method provided by the embodiment of the specification can realize standardized batch production of dies, the consistency of finished products is good, and the die processing precision and the die processing efficiency are high; (3) The workpiece polishing method disclosed by the embodiment of the specification is used for finely polishing the workpiece according to different sub polishing areas, different polishing and different polishing parameters, and compared with the method for finishing the integral polishing of the workpiece by using a single polishing die, the fine polishing can improve the polishing precision of the workpiece; (4) Compared with the method for polishing the workpiece by using a single polishing die, the workpiece polishing method disclosed by the embodiment of the specification can be used for continuously polishing by adopting a plurality of polishing devices, and has the advantages of no need of machine adjustment in midway, reduction in polishing difficulty and improvement in polishing efficiency; (5) According to the workpiece polishing method disclosed by the embodiment of the specification, different polishing dies are used for carrying out partition polishing on the workpiece, so that the processing difficulty of a single polishing die is reduced. It is to be noted that different embodiments may produce different advantages, and in different embodiments, any one or combination of the above advantages may be produced, or any other advantages may be obtained.

It should be understood by those skilled in the art that the above examples are only illustrative and not limiting of the present invention. Any modification, equivalent replacement, and variation made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method of manufacturing a master mould, the master mould comprising a mould body and a cover layer, the method comprising:

obtaining first surface information of a first mold, the first mold being manufactured based on initial processing information, the first mold comprising a blanket-free mold;

obtaining compensation information based on the first surface information and target surface information;

generating target machining information based on the initial machining information and the compensation information;

and processing the covering layer at least based on the target processing information to obtain the standard mould.

2. The method of manufacturing as claimed in claim 1, wherein said manufacturing said master mold by processing said cover layer based on at least said target processing information comprises:

generating coating compensation information based on the target processing information and the coating information of the coating;

and turning the covering layer based on the covering layer compensation information to obtain the standard die.

3. The method of manufacturing as claimed in claim 1, wherein said manufacturing said master mold by processing said cover layer based on at least said target processing information comprises:

turning an initial die based on the target machining information to obtain a die body;

attaching the cover layer to the mold body;

and turning the covering layer at least based on the target machining information to obtain the standard die.

4. The process of claim 3, wherein said attaching the cover layer to the mold body comprises:

heating the mold body;

the covering layer is compacted with the heated mould body, so that the covering layer is attached to the mould body.

5. The process of claim 4 wherein the die body is heated by a heating coil within which the die body to be heated is placed.

6. The process of claim 5 wherein the heating coil is heated to a temperature of 160 ℃ to 200 ℃.

7. The process of claim 4 wherein said coating is compacted with said heated die body by a pressing platen tool having a pressing surface curvature matching a bearing surface curvature of said die body.

8. The machining method according to claim 7, wherein the pressure range of the pressure applied by the pressure plate tool is 0.1Mpa to 0.8Mpa.

9. The machining method according to claim 1, wherein the compensation information includes body compensation information and edge extension information; the obtaining compensation information based on the first surface information and target surface information comprises:

obtaining body compensation information corresponding to the first mold body based on a comparison of the first surface information and the target surface information;

based on the data trend of the first surface information, edge extension information corresponding to the first mold edge is obtained.

10. The machining method according to claim 1, wherein the generating target machining information based on the initial machining information and the compensation information includes:

generating processing information to be checked based on the initial processing information and the compensation information;

acquiring second surface information of a second mold, wherein the second mold is manufactured based on the to-be-checked processing information;

judging whether the surface error of the second mold is within a preset value range or not based on the second surface information and the target surface information;

and if so, determining the processing information to be checked as target processing information.