CN115424303A - SMT (surface mount technology) -based ultrathin optical screen lower fingerprint module and method - Google Patents
SMT (surface mount technology) -based ultrathin optical screen lower fingerprint module and method Download PDFInfo
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- CN115424303A CN115424303A CN202110605551.0A CN202110605551A CN115424303A CN 115424303 A CN115424303 A CN 115424303A CN 202110605551 A CN202110605551 A CN 202110605551A CN 115424303 A CN115424303 A CN 115424303A
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- lens
- fingerprint
- smt
- fingerprint chip
- fingerprint module
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- 230000003287 optical effect Effects 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 claims abstract description 9
- 230000005611 electricity Effects 0.000 claims abstract description 6
- 238000003491 array Methods 0.000 claims abstract description 3
- 239000003292 glue Substances 0.000 claims description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000003672 processing method Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000001737 promoting effect Effects 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 241000218202 Coptis Species 0.000 description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000012858 packaging process Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The invention discloses an ultra-thin optical screen lower fingerprint module and method capable of realizing SMT, which comprises a lens and a fingerprint chip; the lens is arranged on the fingerprint chip; the lens is a wafer-level optical lens, and the upper surface of the lens is provided with a plurality of micro lenses; fingerprint chip adopts CSP packaging structure, and fingerprint chip bottom is provided with the pin, and the pin is used for connecting terminal equipment's mainboard, and fingerprint chip carries out the electricity through pin and terminal equipment's mainboard and is connected. A plurality of micro lens arrays are arranged on the upper surface of the lens. Adopt CSP packaging structure's fingerprint chip, laminate camera lens and fingerprint chip, adopt SMT technology and terminal equipment's mainboard to carry out the electricity with the pin of fingerprint chip bottom and connect formation fingerprint module under the ultra-thin optical screen. Simple structure effectively reduces the height of fingerprint module, provides an implementation for promoting standardized fingerprint module, very big reduction design and manufacturing cost.
Description
Technical Field
The invention belongs to the field of electronics, and particularly relates to an ultra-thin optical underscreen fingerprint module capable of achieving SMT and a method.
Background
Nowadays, biometric identification technology is widely applied to the field of smart phones, and fingerprint identification is widely applied to terminal equipment due to mature technology and high safety. And along with the development of the times, each big intelligent mobile phone manufacturer all develops the full face screen, account for than in order to promote the screen, the fingerprint unblock has to be settled at other parts of cell-phone except the screen, and the fingerprint has just become an optimal solution under the screen, fingerprint module thickness is thicker under traditional screen, under the ultra-thin trend of cell-phone, the space of battery has been occupied, it is poor to lead to cell-phone duration, the fingerprint module in traditional field all is the customization product in addition, need the module factory to carry out the circuit board design, draw image sensor's signal through the circuit board, connect through connector and terminal equipment, it wastes time and energy to compare.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides the ultra-thin optical screen lower fingerprint module capable of being subjected to SMT and the method, the structure is simple, the height of the fingerprint module can be effectively reduced, and the design and manufacturing cost is reduced.
In order to achieve the purpose, the invention provides the following technical scheme:
an SMT (surface mount technology) -available ultrathin optical underscreen fingerprint module comprises a lens and a fingerprint chip; the lens is arranged on the fingerprint chip;
the lens is a wafer-level optical lens, and a plurality of micro lenses are arranged on the upper surface of the lens;
the fingerprint chip adopts CSP packaging structure, the fingerprint chip bottom is provided with the pin, the pin is used for connecting terminal equipment's mainboard, and the fingerprint chip carries out the electricity through pin and terminal equipment's mainboard and is connected.
Preferably, the plurality of microlens arrays are disposed on an upper surface of the lens.
Preferably, the pins are solder balls.
Preferably, the pins are connected with a main board of the terminal device through welding.
Preferably, the lens is fixed on the fingerprint chip through glue.
Preferably, the glue is water glue or DAF glue.
Preferably, the thickness of the lens is between 50 and 200um.
The processing method of the ultra-thin optical screen lower fingerprint module capable of achieving SMT comprises the following processes of adopting a fingerprint chip of a CSP packaging structure, attaching a lens and the fingerprint chip, and electrically connecting pins at the bottom of the fingerprint chip with a mainboard of a terminal device by adopting an SMT process to form the ultra-thin optical screen lower fingerprint module.
Compared with the prior art, the invention has the following beneficial technical effects:
the invention provides an ultra-thin optical screen lower fingerprint module capable of being subjected to Surface Mount Technology (SMT). A wafer-level optical lens is adopted, so that the miniaturization of a product is realized, a fingerprint chip adopts a product of a Chip Scale Package (CSP) packaging technology, pins are arranged at the bottom of the fingerprint chip, the design of a circuit board is not needed, the ultra-thin optical screen lower fingerprint module can be used as a standard electronic device, the SMT technology is adopted, the pins are directly welded to the specified position of a mainboard of terminal equipment, signals of the fingerprint chip are directly transmitted to the terminal equipment, and unnecessary structures are not needed for transmission. The invention adopts SMT process and terminal equipment connection, has simple structure, effectively reduces the height of the fingerprint module, provides an implementation mode for popularizing the standardized fingerprint module, and greatly reduces design and manufacturing cost.
Furthermore, a plurality of micro lenses are arranged on the upper surface of the lens through the array, so that the light transmission effect can be ensured, and errors in the imaging effect caused by uneven distribution of the micro lenses are avoided.
Furthermore, the lens and the fingerprint chip are connected by adopting transparent colloid such as water gel or DAF (digital addressable Lighting) glue and the like, so that the influence on transmission light rays is avoided.
Furthermore, by adopting the tin ball alloy as the pin, the welding is convenient, the process is mature, the automation is easy to realize, and the production efficiency is improved.
Drawings
FIG. 1 is a schematic structural diagram of an ultra-thin optical underscreen fingerprint module according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a conventional fingerprint module under an optical screen;
in the drawings: 1 is a lens; 2 is glue; 3 is a fingerprint chip; 4 is a microlens; 5 is a pin; 6 is filling glue; 7 is a gold thread; 8 is a retaining wall; 9 is a circuit board; 10 is conductive adhesive; 11 is a steel sheet.
Detailed Description
The present invention will now be described in further detail with reference to specific examples, which are intended to be illustrative, but not limiting, of the invention.
The invention provides an SMT (surface mount technology) -capable ultrathin optical screen lower fingerprint module, which comprises a lens 1 and a fingerprint chip 3; the lens 1 is arranged on the fingerprint chip 3; the lens 1 is a wafer-level optical lens, and the upper surface of the lens 1 is provided with a plurality of micro lenses 4; fingerprint chip 3 adopts CSP packaging structure, and 3 bottoms of fingerprint chip are provided with pin 5, and pin 5 is used for connecting terminal equipment's mainboard, and fingerprint chip 3 carries out the electricity through pin 5 and terminal equipment's mainboard and is connected.
The invention provides an ultra-thin optical screen lower fingerprint module capable of being subjected to Surface Mount Technology (SMT). A fingerprint chip 3 adopting a CSP packaging process is directly attached to a lens 1 to form the fingerprint module, the fingerprint chip 3 is directly welded to a specified position of a mainboard of terminal equipment through a pin 5, signals of the fingerprint chip are directly transmitted to the terminal equipment, redundant structures are not needed for transmission, the packaging structure is simplified, and the ultra-thin optical screen lower fingerprint module accords with the development trend of ultra-thin.
Examples
As shown in fig. 1, the invention provides an SMT ultra-thin optical screen lower fingerprint module, which includes a lens 1, glue 2 and a fingerprint chip 3; the lens 1 is fixed on the fingerprint chip 3 through glue 2.
The glue 2 is transparent glue such as water glue or DAF glue, so that the influence of a binder on light transmission is avoided, and light can be filtered well. But fingerprint module under SMT's ultra-thin optical screen in this embodiment adopts DAF to glue and connects camera lens 1 and fingerprint chip 3.
The lens 1 is a wafer-level optical lens, and the upper surface of the lens 1 is provided with a plurality of micro lenses 4; a plurality of micro-lenses 4 are arranged on the upper surface of the lens 1 in an array, the thickness range of the lens 1 is 50-200 um, and the number range of the micro-lenses 4 is 10 2 ～10 4 The micro lenses 4 are arranged on the upper surface of the lens 1 through the array, so that the light transmission effect can be ensured, and the micro lenses are prevented from being distributed unevenlyThe imaging effect caused by uniformity has errors.
The ultra-thin optical screen lower fingerprint module capable of being subjected to SMT is simple in structure, the height of the fingerprint module can be effectively reduced, meanwhile, the design of a circuit board is reduced, an SMT (Surface Mounted Technology) process and terminal equipment are adopted for connection, an implementation mode is provided for popularization of a standardized fingerprint module, and design and manufacturing costs are greatly reduced.
The fingerprint Chip in the fingerprint module under the ultrathin optical screen selects a product of a CSP (Chip Scale Package) packaging process, the lens 1 uses a wafer-level optical lens, so that the miniaturization of the product is realized, the fingerprint module under the ultrathin optical screen does not need to be designed by a circuit board, the fingerprint module can be used as a standardized electronic device, the SMT process is adopted, the fingerprint module can be directly welded to the specified position of a main board of terminal equipment, an implementation mode is provided for the standardized fingerprint module, and the design and manufacturing cost is greatly reduced.
Referring to fig. 2, a conventional fingerprint chip of a fingerprint module employs a COB package process, and the conventional structure includes a lens 1, glue 2, a fingerprint chip 3, a filling glue 6, a gold wire 7, a dam 8, a circuit board 9, a conductive glue 10, and a steel sheet 11. The traditional structure needs to connect the fingerprint chip 3 on the FPC circuit board 9 through the gold thread 7, will use the filling glue 6 to fill the gold thread 7 region simultaneously and in order to reach the purpose of protection gold thread 7, still need set up barricade 8 and prescribe a limit to filling glue 6, causes the structure comparatively complicated, and the process flow is many to the part of adoption is more, causes the thickness of product to increase, does not accord with the trend of ultra-thinization, is unfavorable for miniaturized production.
The fingerprint chip 3 in the fingerprint module under the ultrathin optical screen adopts a CSP packaging process, the lens 1 adopts a wafer-level array lens manufactured by a semiconductor process, the lens 3 and the fingerprint chip 1 are directly bonded together through the glue 2, an FPC (flexible printed circuit) board is not required for carrying, and the fingerprint chip can be directly used as a standard electronic material to be welded on terminal equipment.
In summary, the invention provides an ultra-thin optical screen lower fingerprint module capable of being subjected to SMT, which is simple in structure and capable of effectively reducing the height of the fingerprint module, meanwhile, the invention reduces the design of a circuit board, adopts SMT process and terminal equipment connection, provides an implementation mode for popularizing a standardized fingerprint module, and greatly reduces the design and manufacturing cost.
Claims (8)
1. An SMT (surface mount technology) -enabled ultrathin optical screen lower fingerprint module is characterized by comprising a lens (1) and a fingerprint chip (3); the lens (1) is arranged on the fingerprint chip (3);
the lens (1) is a wafer-level optical lens, and a plurality of micro lenses (4) are arranged on the upper surface of the lens (1);
fingerprint chip (3) adopt CSP packaging structure, fingerprint chip (3) bottom is provided with pin (5), pin (5) are used for connecting terminal equipment's mainboard, and fingerprint chip (3) carry out the electricity through pin (5) and terminal equipment's mainboard and are connected.
2. An SMT enabled ultra-thin optical underscreen fingerprint module according to claim 1, wherein the plurality of microlens (4) arrays are disposed on an upper surface of the lens (1).
3. An SMT enabled ultra-thin optical underscreen fingerprint module according to claim 1, wherein the leads (5) are solder balls.
4. An SMT (surface mount technology) ultra-thin optical underscreen fingerprint module according to claim 1, wherein the pins (5) are connected to a motherboard of a terminal device by soldering.
5. An SMT enabled ultra-thin optical underscreen fingerprint module according to claim 1, wherein the lens (1) is fixed to the fingerprint chip (3) by glue (2).
6. An SMT enabled ultra-thin optical underscreen fingerprint module according to claim 5, wherein the glue (2) is a water glue or a DAF glue.
7. An SMT (surface mount technology) -enabled ultra-thin optical underscreen fingerprint module according to claim 1, wherein the thickness of the lens (1) is in a range of 50-200 um.
8. A processing method of an ultra-thin optical screen lower fingerprint module capable of achieving SMT is characterized by comprising the following processes of adopting a fingerprint chip (3) of a CSP packaging structure, attaching a lens (1) and the fingerprint chip (3), and electrically connecting pins (5) at the bottom of the fingerprint chip (3) with a mainboard of a terminal device by adopting an SMT process to form the ultra-thin optical screen lower fingerprint module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110605551.0A CN115424303A (en) | 2021-05-31 | 2021-05-31 | SMT (surface mount technology) -based ultrathin optical screen lower fingerprint module and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110605551.0A CN115424303A (en) | 2021-05-31 | 2021-05-31 | SMT (surface mount technology) -based ultrathin optical screen lower fingerprint module and method |
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| Publication Number | Publication Date |
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| CN115424303A true CN115424303A (en) | 2022-12-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110605551.0A Pending CN115424303A (en) | 2021-05-31 | 2021-05-31 | SMT (surface mount technology) -based ultrathin optical screen lower fingerprint module and method |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109492622A (en) * | 2018-12-25 | 2019-03-19 | 上海思立微电子科技有限公司 | For shielding the recognizer component and electronic equipment of lower optical finger print |
| CN212873514U (en) * | 2020-08-25 | 2021-04-02 | 华天慧创科技（西安）有限公司 | Fingerprint module under optical screen |
| CN214955005U (en) * | 2021-05-31 | 2021-11-30 | 华天慧创科技（西安）有限公司 | But fingerprint module under ultra-thin optical screen of SMT |
-
2021
- 2021-05-31 CN CN202110605551.0A patent/CN115424303A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109492622A (en) * | 2018-12-25 | 2019-03-19 | 上海思立微电子科技有限公司 | For shielding the recognizer component and electronic equipment of lower optical finger print |
| CN212873514U (en) * | 2020-08-25 | 2021-04-02 | 华天慧创科技（西安）有限公司 | Fingerprint module under optical screen |
| CN214955005U (en) * | 2021-05-31 | 2021-11-30 | 华天慧创科技（西安）有限公司 | But fingerprint module under ultra-thin optical screen of SMT |
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