CN115406351A - Earphone assembly precision detection method and device - Google Patents
Earphone assembly precision detection method and device Download PDFInfo
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- CN115406351A CN115406351A CN202211035728.9A CN202211035728A CN115406351A CN 115406351 A CN115406351 A CN 115406351A CN 202211035728 A CN202211035728 A CN 202211035728A CN 115406351 A CN115406351 A CN 115406351A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C9/00—Measuring inclination, e.g. by clinometers, by levels
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Abstract
The invention discloses a method and a device for detecting the assembly precision of an earphone, and belongs to the technical field of earphone production. The earphone assembly precision detection method is used for detecting the assembly precision of an integrated chip in a shell of an earphone, and comprises the following steps: s1: acquiring an image through a 3D camera, and identifying the outer side of an opening of a shell in the captured image to obtain a reference surface; s2: acquiring an image through a 3D camera, identifying the surface of an integrated chip in the captured image, and obtaining a plurality of feature points; s3: acquiring a characteristic surface through each characteristic point, and acquiring a height difference between the characteristic surface and a reference surface; s4: capturing a minimum distance characteristic point and a maximum distance characteristic point between a reference surface and the surface of the integrated chip; and forming a characteristic line between the minimum distance characteristic point and the maximum distance characteristic point, and acquiring an included angle between the characteristic line and a horizontal plane. The earphone assembly precision detection device provided by the invention can be used for detecting the earphone by using the earphone assembly precision detection method, and the earphone detection efficiency can be improved.
Description
Technical Field
The invention relates to the technical field of earphone production, in particular to an earphone assembly precision detection method and device.
Background
With the development of the bluetooth headset technology, people have higher and higher requirements for the stability of the headset. The stability of the bluetooth headset includes the stability of various functions of the headset in various environments. The mounting accuracy of an integrated chip on a circuit board of the bluetooth headset has an important influence on the stability of the bluetooth headset.
In the assembling process of the Bluetooth headset, the assembling deviation of the integrated chip is easy to generate, the assembling deviation of the integrated chip is difficult to reduce by the design improvement and only by the assembling method and the assembling jig. But the existence of the deviation of the integrated chip assembly is difficult to be observed directly by naked eyes. With the conventional inspection apparatus, it takes a long time to complete the inspection.
Therefore, a method and an apparatus for detecting the assembly accuracy of the earphone are needed to solve the above problems.
Disclosure of Invention
The invention aims to provide a method for detecting the assembly precision of an earphone, which can improve the detection efficiency of the earphone.
Another object of the present invention is to provide an apparatus for detecting the assembly accuracy of an earphone, which can improve the detection efficiency of the earphone by detecting the earphone with the above method for detecting the assembly accuracy of the earphone.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method for detecting the assembly precision of an earphone is used for detecting the assembly precision of an integrated chip in a shell of the earphone and comprises the following steps:
s1: acquiring an image through a 3D camera, identifying and capturing the outer side of an opening of the shell in the image, and obtaining a reference surface;
s2: acquiring an image through a 3D camera, identifying and capturing the surface of the integrated chip in the image, and obtaining a plurality of feature points;
s3: acquiring a feature surface through each feature point, and acquiring a height difference between the feature surface and the reference surface;
s4: capturing minimum distance feature points and maximum distance feature points between the reference surface and the surface of the integrated chip; and forming a characteristic line between the minimum distance characteristic point and the maximum distance characteristic point, and acquiring an included angle between the characteristic line and a horizontal plane.
Optionally, the 3D camera captures the image by emitting a laser line to the surface of the housing and the integrated chip.
Optionally, in S1, the 3D camera emits a plurality of rays toward the outside of the opening of the housing to acquire the reference surface, and the result fed back by each ray needs to be consistent.
Optionally, the results of the detection in S3 and S4 need to both meet the standard.
Optionally, the determination result is determined by detecting an OK item or a preset range threshold.
The earphone assembly precision detection device comprises a base, a 3D camera, a position adjusting mechanism and a jig, wherein the 3D camera is arranged above the base; the position adjusting mechanism is arranged on the base; a jig is detachably positionable at the position adjustment mechanism, the jig being capable of positioning the housing, the position adjustment mechanism being configured to adjust a position of the jig to position the jig directly beneath the 3D camera.
The position adjusting mechanism of the jig comprises a Y-direction adjusting platform, a Y-direction driving component, an X-direction adjusting platform and an X-direction driving component, the Y-direction adjusting platform is arranged on the base in a sliding mode along the Y direction, the Y-direction driving component is connected to the base and the Y-direction adjusting platform respectively, and the Y-direction driving component is used for driving the Y-direction adjusting platform to move along the Y direction; the X-direction adjusting platform is arranged on the Y-direction adjusting platform in a sliding mode along the X direction, the X-direction driving assembly is connected to the base and the X-direction adjusting platform respectively, and the X-direction driving assembly is used for driving the X-direction adjusting platform to move along the X direction.
Optionally, the position adjusting mechanism further includes a positioning component, and the positioning component is disposed on the top of the X-direction adjusting platform to position the jig in the X direction and the Y direction.
Optionally, the positioning assembly includes positioning blocks disposed on two adjacent sides of the top of the X-direction adjusting platform, and the positioning blocks have a first positioning surface perpendicular to the X-direction and a second positioning surface perpendicular to the Y-direction.
Optionally, the jig comprises a first positioning seat, a second positioning seat and a clamping assembly, the first positioning seat is detachably positioned on the position adjusting mechanism, and a positioning groove is formed in the top of the first positioning seat; the second positioning seat is positioned in the positioning groove, and a positioning hole which is communicated along the Z direction is formed in the second positioning seat; the clamping assembly is arranged on the second positioning seat and used for clamping and positioning the shell in the positioning hole.
The invention has the beneficial effects that:
the method for detecting the assembly precision of the earphone comprises the steps of collecting images through a 3D camera, selecting the outer side of an opening of an inner shell of the images to obtain a reference surface, identifying the surface of an integrated chip in the captured images to obtain a plurality of feature points, obtaining the feature surfaces through the feature points, judging the installation precision of the integrated chip by calculating the height difference between the feature surfaces and the reference surface and according to the included angle between a feature line between the minimum distance feature point and the maximum distance feature point on the integrated chip and the horizontal plane, rapidly detecting the assembly precision of the integrated chip and improving the detection efficiency of the earphone.
The invention also aims to provide a device for detecting the assembly precision of the earphone, which can detect the assembly precision of the integrated chip in the earphone by using the method for detecting the assembly precision of the earphone and can improve the detection efficiency of the earphone.
Drawings
Fig. 1 is a flowchart of a method for detecting an assembly accuracy of an earphone according to an embodiment of the present invention;
fig. 2 is a perspective view of an earphone assembly accuracy detection apparatus according to an embodiment of the present invention;
fig. 3 is a perspective view of the earphone assembly precision detection apparatus provided in the embodiment of the present invention after the jig is removed;
fig. 4 is a perspective view of a jig according to an embodiment of the present invention;
FIG. 5 is a top view of a fixture according to an embodiment of the present invention;
fig. 6 isbase:Sub>A cross-sectional view taken atbase:Sub>A-base:Sub>A in fig. 5.
In the figure:
1. a base;
2. a 3D camera;
3. a position adjustment mechanism; 31. a Y-direction adjusting platform; 311. a bump; 32. a Y-direction drive assembly; 321. a Y-direction driving member; 33. an X-direction adjusting platform; 331. a chute; 34. an X-direction driving component; 341. an X-direction driving member; 35. a positioning assembly;
4. a jig; 41. a first positioning seat; 411. positioning a groove; 42. a second positioning seat; 421. positioning holes; 422. a groove; 423. a boss; 424. a limiting groove; 43. a clamping assembly; 431. a first positioning structure; 4311. a first positioning member; 43111. a guide groove; 4312. a second positioning member; 432. a second positioning structure; 4321. a clamping block; 4322. a connecting member; 43221. a guide bar; 43221. briquetting; 43223. a second bolt; 44. a cavity.
Detailed Description
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.
Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "secured" are to be construed broadly and encompass, for example, both fixed and removable connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first feature being in direct contact with the second feature, and may also include the recitation of the first feature being in contact with the second feature, but rather being in contact with the additional feature between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings 1-6.
The embodiment provides a method for detecting the assembly accuracy of an earphone, as shown in fig. 1, the method for detecting the assembly accuracy of an earphone includes the following steps:
s1, collecting images through a 3D camera, identifying the outer side of a shell opening in the captured images, and obtaining a reference surface.
Specifically, the 3D camera emits 100 rays toward the outside of the housing opening to acquire a reference plane; furthermore, if a large difference occurs between 100 rays, it is determined that the position of the headset mounted on the jig is inaccurate.
And S2, acquiring an image through a 3D camera, identifying the surface of the integrated chip in the captured image, and obtaining a plurality of characteristic points.
In one embodiment in the present application, the image captured by the 3D camera is a depth image. The distances from the 3D camera 2 to each point are different, and the colors presented by each point in the collected images are different, so that the identification capture of the reference points and the surface of the integrated chip is realized. The reference points and the surface of the integrated chip may be captured simultaneously or sequentially, and the order of recognizing the capture is not limited herein.
The specific mode is as follows, the casing after installing the integrated chip is positioned below the 3D camera, and the casing does not have the shelter to the integrated chip, then acquires overlooking the image through the 3D camera. Optionally, the 3D camera is a line laser 3D camera, the 3D camera capturing images by emitting laser lines to the surface of the housing and the integrated chip.
And S3, forming a characteristic surface through each characteristic point, and acquiring the height difference between the characteristic surface and the reference surface.
S4: capturing a minimum distance characteristic point between a reference surface and the surface of the integrated chip and a maximum distance characteristic point between the reference surface and the surface of the integrated chip; and forming a characteristic line between the minimum distance characteristic point and the maximum distance characteristic point, and acquiring an included angle between the characteristic line and a horizontal plane.
Specifically, the steps are firstly carried out on the OK product to obtain the standard height difference (H0) between the characteristic surface of the integrated chip in the OK product and the reference surface, and obtain the standard included angle between the reference line and the horizontal plane;
then recording the standard height difference (H0) and the standard included angle into a control system;
then, the steps are carried out on the test product, so that the detection height difference (H1) of the detection product is obtained; detecting an included angle; the control system can judge whether the integrated chip in the detection product is qualified or not by comparing the detection height difference (H1) with the standard height difference (H0) and comparing the detection included angle with the standard included angle;
further, if the detection height difference (H1) is within the range of the standard height difference (H0), the detected product is qualified, otherwise, the product is judged to be a defective product; if the detection included angle is within the range of the standard included angle, the product is qualified, otherwise, the product is judged to be a defective product;
furthermore, the detected product can be judged to be a good product only if the detected product meets the requirements of qualified detection height difference and qualified detection included angle, otherwise, if one item does not meet the requirements, the product is judged to be a defective product.
The image is collected through the 3D camera, the detection height difference and the detection included angle information are obtained according to the collected image, the installation precision of the integrated chip is judged, the assembling progress of the integrated chip can be rapidly detected, and the detection efficiency of the earphone is improved.
In detail, if the distance difference between the maximum distance feature point and the minimum distance feature point is large, and the included angle between the feature line formed between the two feature points and the horizontal plane is larger than or smaller than a standard value, the mounting inclination of the integrated chip is indicated, and the mounting of the integrated chip is unqualified; if the difference value between the maximum distance characteristic point and the minimum distance characteristic point is small, the included angle between the characteristic line formed between the two characteristic points and the horizontal plane is in accordance with the standard value, but the maximum distance and the minimum distance are both smaller than the standard value, the integrated chip is also indicated to be unqualified in installation. If the difference value between the maximum distance and the minimum distance is smaller, the size of the included angle meets the standard value, and meanwhile, the difference value between the maximum distance and the minimum distance is smaller, the integrated chip is qualified to be installed.
In detail, the distance judgment results of the maximum distance and the minimum distance are respectively determined by detecting the OK product or presetting a distance range threshold value. The distance range threshold is an upper limit value and a lower limit value of the distance between the surface of the integrated chip and the reference surface. And comparing and analyzing the maximum distance, the minimum distance and the upper limit value and the lower limit value of the distance to judge whether the maximum distance and the minimum distance are qualified.
And determining an angle judgment result of the angle through detecting the OK product or presetting an angle range threshold. Wherein the threshold value of the angle range is an upper limit value and a lower limit value of an included angle between the surface of the integrated chip and the reference line. And comparing and analyzing the included angle between the reference line and the characteristic line with the upper limit value and the lower limit value of the included angle, and judging whether the included angle is qualified. Further, the angular range threshold is ± 5 °.
Further, the method for detecting the assembly accuracy of the earphone further comprises the step of displaying the detection result through a display screen, so that detection personnel can judge the detection result visually.
The embodiment further provides a device for detecting the assembly accuracy of the earphone, which detects the assembly accuracy of the integrated chip in the shell of the earphone by using the detection method, as shown in fig. 2, the device for detecting the assembly accuracy of the earphone comprises a base 1, a 3D camera 2, a position adjusting mechanism 3 and a jig 4. The 3D camera 2 is disposed above the base 1. The position adjusting mechanism 3 is arranged on the base 1. The jig 4 is detachably positioned in the position adjusting mechanism 3, the jig 4 is capable of positioning the housing, and the position adjusting mechanism 3 is configured to adjust the position of the jig 4 to position the jig 4 directly below the 3D camera 2.
When the assembly precision of the integrated chip is detected, the shell is positioned with the jig 4, the jig 4 is positioned at the position adjusting mechanism 3, the position of the jig 4 is adjusted through the position adjusting mechanism 3, the shell is positioned under the 3D camera 2, images of the shell and the integrated chip are obtained through the 3D camera 2, the assembly precision of the integrated chip is detected by the earphone assembly precision detection method, and after the detection is finished, the jig 4 is taken down from the position adjusting mechanism 3 so as to be convenient for detecting the next integrated chip.
As shown in fig. 1 and fig. 2, the position adjusting mechanism 3 includes a Y-direction adjusting platform 31, a Y-direction driving assembly 32, an X-direction adjusting platform 33, and an X-direction driving assembly 34, the Y-direction adjusting platform 31 is slidably disposed on the base 1 along the Y-direction, the Y-direction driving assembly 32 is respectively connected to the base 1 and the Y-direction adjusting platform 31, and the Y-direction driving assembly 32 is used for driving the Y-direction adjusting platform 31 to move along the Y-direction. The X-direction adjusting platform 33 is arranged on the Y-direction adjusting platform 31 in a sliding mode along the X direction, the X-direction driving assembly 34 is connected to the base 1 and the X-direction adjusting platform 33 respectively, and the X-direction driving assembly 34 is used for driving the X-direction adjusting platform 33 to move along the X direction. It can be understood that the Y-direction driving assembly 32 can drive the Y-direction adjusting platform 31 to drive the X-direction adjusting platform 33 to move along the X-direction, and the X-direction driving assembly 34 can drive the X-direction adjusting platform 33 to drive the jig 4 to move along the X-direction. Thereby realizing the position adjustment of the jig 4 in the X direction and the Y direction.
Optionally, the Y-direction adjusting platform 31 is provided with a protrusion 311 at both ends along the Y-direction, the X-direction adjusting platform 33 is provided with a sliding slot 331 at both sides corresponding to the protrusion 311, and each protrusion is located in one sliding slot 331, so that the X-direction adjusting platform 33 can be guided and limited by the protrusion 311.
In order to position the jig 4 conveniently, as shown in fig. 2, the position adjusting mechanism 3 further includes a positioning component 35, and the positioning component 35 is disposed on the top of the X-direction adjusting platform 33 to position the jig 4 in the X-direction and the Y-direction.
Further, the positioning assembly 35 includes positioning blocks disposed on two adjacent sides of the top of the X-direction adjusting platform 33, and each positioning block has a first positioning surface perpendicular to the X-direction and a second positioning surface perpendicular to the Y-direction. In this embodiment, preferably, two positioning blocks are provided, and the two positioning blocks are disposed at two adjacent corners of the X-direction adjusting platform 33. Optionally, the locating block is L-shaped.
Optionally, the Y-direction driving assembly 32 includes a Y-direction driving element 321 and a first elastic element (not shown), the Y-direction driving element 321 is disposed on a first mounting seat mounted on the base 1, an execution end of the Y-direction driving element 321 can abut against the Y-direction driving element, one end of the first elastic element abuts against the Y-direction adjusting platform 31, the other end of the first elastic element abuts against the base 1, and the first elastic element can drive the Y-direction adjusting platform 31 to reset. Optionally, the Y-driver 321 is a dial knob.
The X-direction driving assembly 34 includes an X-direction driving member 341 and a second elastic member (not shown), the X-direction driving member 341 is disposed on a second mounting seat mounted on the base 1, an execution end thereof can abut against the X-direction driving member 341, one end of the second elastic member abuts against the X-direction adjusting platform 33, the other end thereof abuts against the base 1 or the Y-direction adjusting platform 31, and the second elastic member can drive the X-direction adjusting platform 33 to reset. Optionally, the X-directional driver 341 is a dial knob.
As shown in fig. 2 and fig. 4 to 6, the jig 4 includes a first positioning seat 41, a second positioning seat 42 and a clamping assembly 43, the first positioning seat 41 is detachably positioned in the position adjusting mechanism 3, and a positioning slot 411 is formed at the top of the first positioning seat 41. The second positioning seat 42 is positioned in the positioning groove 411, and the second positioning seat 42 is provided with a positioning hole 421 penetrating along the Z direction. The clamping assembly 43 is disposed on the second positioning seat 42, and the clamping assembly 43 is used for clamping and positioning the housing located in the positioning hole 421. When the housing is positioned by the jig 4, the housing is placed in the positioning hole 421, and the positioning hole 421 is clamped by the clamping assembly 43.
Further, the clamping assembly 43 includes a first positioning structure 431 and a second positioning structure 432, the first positioning structure 431 is movably disposed on the second positioning seat 42 and located at one side of the positioning hole 421, a positioning portion of the second positioning structure 432 can abut against a main body of the housing located in the positioning hole 421, the second positioning structure 432 is disposed on the second positioning seat 42, and an execution portion thereof is located below the positioning hole 421 to cooperate with the second positioning seat 42 to clamp a handle portion of the housing.
In detail, a boss 423 is convexly disposed at the top of the second positioning seat 42, the positioning hole 421 is disposed above the boss 423, a groove 422 is disposed at a position of the second positioning seat 42 corresponding to the positioning hole 421, a limiting groove 424 is disposed on the second positioning seat 42, the limiting groove 424 is disposed at one side of the boss 423, the first positioning structure 431 includes a first positioning member 4311 and a second positioning member 4312 connected to the first positioning member 4311, the first positioning member 4311 is movably disposed in the limiting groove 424, and the first positioning member 4311 can drive the second positioning member 4312 to press-contact the top of the housing located in the positioning hole 421. In detail, the first positioning element 4311 is provided with a guide groove 43111, and the first positioning element 4311 is fixed by a first bolt penetrating the guide groove 43111 and screwed to the first positioning seat 41. When the first bolt is loosened, the first positioning member 4311 can move along the bolt, so that the first positioning member 4311 can drive the first positioning member 4311 to approach or depart from the positioning hole 421.
The second positioning structure 432 includes a latch 4321, a top of the latch 4321 is located below the boss 423, and a cavity 44 penetrating through the handle of the housing is formed between the top of the latch 4321 and the bottom of the boss 423. The latch 4321 is detachably connected to the second positioning seat 42 through a connector 4322. Optionally, the connecting element 4322 includes a guide rod 43221, a pressing block 43221 having a countersunk hole, and a second bolt 43223, the second positioning seat 42 has a stepped hole, a diameter of the top end of the stepped hole is greater than a diameter of the bottom end, the pressing block 43221 is at least partially inserted into the top of the stepped hole, the clamping block 4321 has a through hole corresponding to the stepped hole, the guide rod 43221 sequentially penetrates through the through hole and the stepped hole and then is inserted into the countersunk hole, and the second bolt 43223 is inserted into the countersunk hole and is threadedly connected to the top of the guide rod 43221. The rotating guide rod 43221 can enable the fixture block 4321 to approach or leave the boss 423, when the fixture block 4321 leaves the boss 423, the handle portion of the housing can be conveniently inserted into the cavity 44, and when the fixture block 4321 approaches the boss 423, the handle portion of the housing can be clamped in the cavity 44. In detail, two opposite sides of the fixture block 4321 are respectively connected to the second positioning seat 42 through a connecting element 4322, so as to reliably connect the fixture block 4321 to the second positioning seat 42.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. A method for detecting the assembly precision of an earphone is used for detecting the assembly precision of an integrated chip in a shell of the earphone, and is characterized by comprising the following steps:
s1: acquiring an image through a 3D camera, identifying and capturing the outer side of an opening of the shell in the image, and obtaining a reference surface;
s2: acquiring an image through a 3D camera, identifying and capturing the surface of the integrated chip in the image, and obtaining a plurality of characteristic points;
s3: acquiring a feature surface through each feature point, and acquiring a height difference between the feature surface and the reference surface;
s4: capturing minimum distance feature points and maximum distance feature points between the reference surface and the surface of the integrated chip; and forming a characteristic line between the minimum distance characteristic point and the maximum distance characteristic point, and acquiring an included angle between the characteristic line and a horizontal plane.
2. The method for detecting the assembly accuracy of the earphone according to claim 1, wherein the 3D camera captures the image by emitting a laser line to the surface of the housing and the integrated chip.
3. The method for detecting the assembly accuracy of the earphone according to claim 1, wherein in S1, the 3D camera emits a plurality of rays toward the outside of the opening of the housing to obtain the reference surface, and the feedback result of each ray needs to be consistent.
4. The method for detecting the assembly accuracy of the earphone according to claim 1, wherein the results detected in S3 and S4 both need to meet a standard.
5. The method of claim 1, wherein the determination result is determined by detecting an OK item or a preset range threshold.
6. An earphone assembly accuracy detection device for detecting the assembly accuracy of an integrated chip in a housing of an earphone by using the detection method according to any one of claims 1 to 5, the earphone assembly accuracy detection device comprising:
a base (1);
a 3D camera (2) disposed above the base (1);
the position adjusting mechanism (3), the said position adjusting mechanism (3) is set up on the said base (1); and
a fixture (4) detachably positionable at the position adjustment mechanism (3), the fixture (4) being capable of positioning the housing, the position adjustment mechanism (3) being configured to adjust the position of the fixture (4) to position the fixture (4) directly below the 3D camera (2).
7. The earphone assembly accuracy detection apparatus according to claim 6, wherein the position adjustment mechanism (3) includes:
the Y-direction adjusting platform (31) is arranged on the base (1) in a sliding mode along the Y direction, the Y-direction driving assembly (32) is connected to the base (1) and the Y-direction adjusting platform (31) respectively, and the Y-direction driving assembly (32) is used for driving the Y-direction adjusting platform (31) to move along the Y direction; and
x is to adjusting platform (33) and X to drive assembly (34), X to adjusting platform (33) along X to slide set up in Y is to adjusting on the platform (31), X to drive assembly (34) connect respectively in base (1) with X is to adjusting platform (33), X is used for the drive to drive X is to adjusting platform (33) along X is to removing.
8. The device for detecting the assembly accuracy of the earphones according to claim 7, wherein the position adjusting mechanism (3) further comprises a positioning component (35), and the positioning component (35) is arranged on the top of the X-direction adjusting platform (33) to position the jig (4) in the X direction and the Y direction.
9. The earphone assembly accuracy detection device according to claim 8, wherein the positioning assembly (35) comprises positioning blocks disposed on two adjacent sides of the top of the X-direction adjustment platform (33), and the positioning blocks have a first positioning surface perpendicular to the X-direction and a second positioning surface perpendicular to the Y-direction.
10. The earphone assembly accuracy detection device according to claim 6, wherein the jig (4) comprises:
the first positioning seat (41) is detachably positioned on the position adjusting mechanism (3), and the top of the first positioning seat (41) is provided with a positioning groove (411);
the second positioning seat (42) is positioned in the positioning groove (411), and a positioning hole (421) penetrating along the Z direction is formed in the second positioning seat (42); and
the clamping assembly (43), the clamping assembly (43) is arranged on the second positioning seat (42), and the clamping assembly (43) is used for clamping and positioning the shell located in the positioning hole (421).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211035728.9A CN115406351A (en) | 2022-08-26 | 2022-08-26 | Earphone assembly precision detection method and device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211035728.9A CN115406351A (en) | 2022-08-26 | 2022-08-26 | Earphone assembly precision detection method and device |
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| CN115406351A true CN115406351A (en) | 2022-11-29 |
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| CN202211035728.9A Pending CN115406351A (en) | 2022-08-26 | 2022-08-26 | Earphone assembly precision detection method and device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116600227A (en) * | 2023-07-17 | 2023-08-15 | 深圳市丽耳科技有限公司 | Earphone shell assembling method and earphone shell assembling device |
-
2022
- 2022-08-26 CN CN202211035728.9A patent/CN115406351A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116600227A (en) * | 2023-07-17 | 2023-08-15 | 深圳市丽耳科技有限公司 | Earphone shell assembling method and earphone shell assembling device |
| CN116600227B (en) * | 2023-07-17 | 2023-10-27 | 深圳市丽耳科技有限公司 | Earphone shell assembling method and earphone shell assembling device |
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