CN115404313B - Microstructure homogenizing method and device in metal material deformation process - Google Patents
Microstructure homogenizing method and device in metal material deformation process Download PDFInfo
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- 239000007769 metal material Substances 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims abstract description 68
- 230000008569 process Effects 0.000 title claims abstract description 46
- 238000000265 homogenisation Methods 0.000 claims abstract description 52
- 238000011282 treatment Methods 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims abstract description 48
- 230000005291 magnetic effect Effects 0.000 claims abstract description 39
- 238000012360 testing method Methods 0.000 claims abstract description 22
- 238000001816 cooling Methods 0.000 claims abstract description 21
- 230000006698 induction Effects 0.000 claims abstract description 19
- 238000001931 thermography Methods 0.000 claims abstract description 11
- 238000004804 winding Methods 0.000 claims abstract description 4
- 230000000694 effects Effects 0.000 claims description 15
- 230000008859 change Effects 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 229910000601 superalloy Inorganic materials 0.000 claims description 2
- 230000009471 action Effects 0.000 abstract description 6
- 238000005265 energy consumption Methods 0.000 abstract description 5
- 230000005684 electric field Effects 0.000 abstract description 3
- 230000001360 synchronised effect Effects 0.000 abstract description 3
- 238000007664 blowing Methods 0.000 description 8
- 238000003917 TEM image Methods 0.000 description 5
- 230000001276 controlling effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000003574 free electron Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- 230000006911 nucleation Effects 0.000 description 2
- 230000027756 respiratory electron transport chain Effects 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000001994 activation Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
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- 238000007725 thermal activation Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/04—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering with simultaneous application of supersonic waves, magnetic or electric fields
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/34—Methods of heating
- C21D1/42—Induction heating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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Abstract
The invention relates to a microstructure homogenizing method in a metal material deformation process, which is used for homogenizing the metal material in the metal material deformation process and comprises the following steps: installing a metal material to be treated on a deformation testing machine, winding an induction coil around the periphery of the metal material, and connecting two ends of the induction coil with a pulse magnetic field generator; connecting two ends of a metal material with a pulse current generator through a deformation tester respectively; installing DIC equipment, a thermal imaging device and a cooling device beside the metal material; calculating initial pulse current, starting a deformation testing machine, a pulse current generator, a pulse magnetic field generator, DIC equipment and a thermal imaging instrument, and synchronously starting homogenization treatment and deformation treatment; in the treatment process, the computer controls the deformation of the sample, and controls the temperature, current density and the like in the homogenization process. The invention realizes the synchronous material homogenization treatment with no pollution, low energy consumption, low cost and simplicity by the combined action of the electric field, the force field, the magnetic field and the temperature field.
Description
Technical Field
The invention belongs to the technical field of material homogenization treatment, and particularly relates to a microstructure homogenization method and device in a metal material deformation process.
Background
The homogenization treatment can change the internal structure and performance of the material, and is more beneficial to the deformation production of the material. Since the 20 th century, homogenization treatment techniques have been greatly developed in developed countries such as the united states, japan, germany, and the united kingdom, and have become an essential treatment step before material deformation treatment, which is an important method for improving the quality of material formation, and have been widely used at present.
The homogenization treatment process is a heat activation process, namely, a heat treatment method is used for improving the internal crystal structure of the material, eliminating the casting stress and reducing segregation. The main technological parameters of homogenization treatment are heating temperature and holding time, and then heating speed and cooling speed. The homogenization treatment temperature is generally higher than the intermediate annealing temperature of the alloy, and the heat preservation time is longer.
Conventional homogenization treatment is carried out in a homogenization treatment furnace, which is currently replaced by a continuous homogenization furnace having an advanced control system, a complete automatic inspection system, and a sawing and loading system. The following disadvantages still remain: 1) The homogenization treatment furnace adopts heat treatment, and needs high temperature and high energy consumption; 2) The homogenization treatment process is complex, the cost is very high in the homogenization treatment process, the energy consumption and the environmental pollution are possibly caused, and the benefit is reduced; 3) Before the material is deformed, homogenization synchronous with deformation cannot be achieved, and a certain time is consumed.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a microstructure homogenizing method and device for a metal material deformation process, which can effectively overcome the defects by homogenizing the material under the combined action of electric field, force field, magnetic field and temperature field multi-field combination, and realize synchronous material homogenizing treatment with no pollution, low energy consumption, low cost and simplicity.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a microstructure homogenizing method for a metal material deformation process, which is used for homogenizing the metal material in the metal material deformation process, comprises the following steps:
s1, mounting a metal material to be treated on a deformation testing machine, and performing insulation treatment on a testing machine body; winding an induction coil around the periphery of the metal material, enabling the induction coil not to contact the metal material, and connecting two ends of the induction coil with a pulse magnetic field generator; connecting two ends of a metal material with a pulse current generator through a deformation tester respectively; installing DIC equipment beside the metal material for detecting material strain; a thermal imaging device and a cooling device are respectively arranged at the side of the metal material; the pulse current generator, the pulse magnetic field generator, the DIC equipment, the thermal imaging instrument and the cooling device are respectively connected with a computer;
s2, respectively obtaining the optimal current density of the metal material and the optimal current density of the magnetic field generated by the pulse magnetic field generator through a preliminary exploring test, measuring the cross-sectional area of the metal material, and calculating the initial pulse current required by the pulse power generator and the initial pulse current required by the pulse magnetic field generator; synchronously starting a deformation testing machine, a pulse current generator, a pulse magnetic field generator, DIC equipment and a thermal imaging instrument, and synchronously starting homogenization treatment and deformation treatment;
s3, in the processing process, the computer processes the strain data detected by the DIC equipment, calculates the cross-sectional area at each moment in the deformation process, and then adjusts the respective pulse current of the pulse current generator and the pulse magnetic field generator to realize the constancy of the respective current density; meanwhile, the temperature change of the metal material in the deformation process is observed in real time through a thermal imager, when the temperature exceeds the service temperature of the material, a computer controls a cooling device to start, so that the metal material is cooled, the temperature is controlled within the service temperature range of the material, and the homogenization effect is ensured; and the deformation of the material is controlled by controlling the start and stop of the testing machine, so that the desired deformation is obtained.
In the scheme, the deformation testing machine adopts a SANS universal testing machine.
In the scheme, the metal material is a difficult-to-form metal material comprising titanium alloy, nickel-based superalloy, high-strength aluminum alloy and high-strength steel.
In the scheme, the intensity range of the pulse current generated by the pulse current generator and the pulse magnetic field generator is 5A/mm 2 ～100A/mm 2 。
In the scheme, the deformation range in the material homogenization treatment process is as follows: 1% to 100% (material breakage).
In the scheme, the system also comprises a pulse current generator, an induction coil, a pulse magnetic field generator, DIC equipment, a thermal imager, a cooling device and a computer; the metal material is arranged on the deformation testing machine and is connected with the pulse current generator; the induction coil is wound on the periphery of the metal material and is not in contact with the metal material, and the induction coil is connected with the pulse magnetic field generator; the DIC equipment, the thermal imaging instrument and the cooling device are respectively arranged at the side of the sample; the pulse current generator, the pulse magnetic field generator, the DIC equipment, the thermal imaging instrument and the cooling device are all connected with the computer, so that data transmission and control are realized.
In the above-mentioned scheme, cooling device includes blast apparatus and air pump, blast apparatus is connected with the air pump, and blast apparatus installs in one side of metal material, and the air pump is connected with the computer, through the air blowing volume and the intensity of blowing of computer control air pump.
The invention has the beneficial effects that:
1. the current homogenization treatment is carried out before the material is deformed, and a certain time is wasted. The invention provides the combination of homogenization treatment and deformation, namely the deformation behavior and the homogenization treatment of the material are synchronously carried out, so that on one hand, the material deformation production flow is simplified, and a certain time is saved; on the other hand, the effect of the force field is introduced in the homogenization treatment, so that the homogenization process of the material is better promoted.
2. Conventional homogenization treatments rely solely on thermal fields to regulate the tissue within the material, generally requiring very high temperatures. The invention changes the traditional method for realizing material homogenization by only using a thermal field, proposes a method for realizing homogenization by using a treatment mode of pulse current, an electromagnetic coil and deformation force, realizes a homogenization process by using the combined action of an electromagnetic field and a thermal field, does not need high temperature in the homogenization process, has lower energy consumption and pollution-free generation, and has certain improvement on the homogenization effect.
3. The homogenization treatment equipment built by the invention is simple to build, easy to operate and low in homogenization treatment process cost. All the devices can be controlled by a computer and are mutually related, and the parameters of the devices are regulated and controlled through computer unification in the homogenizing process, so that the homogenizing process can be controlled: the deformation of the sample is controlled, and the temperature, current density and the like in the homogenization process are controlled, so that the homogenization quality and efficiency are improved.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic diagram of a conventional SANS universal tester;
FIG. 2 is a schematic structural view of a microstructure homogenizing apparatus for a metal material deformation process employed in the method of the present invention;
FIG. 3 is a topographical view of a fracture at a fracture sample in an embodiment of the present invention;
fig. 4 is a TEM image of the vicinity of a fracture sample according to an embodiment of the present invention.
In fig. 1-2: 10. SANS universal tester; 11. an upper stretching end; 12. stretching the adapter; 13. a clamping device; 14. stretching the sample; 15. a conductive bolt; 16. a lower stretching end;
20. a microstructure homogenizing device in the metal material deformation process; 21. a pulse current generator; 22. a pulsed magnetic field generator; 23. an induction coil; 24. DIC equipment; 25. a thermal imager; 26. a computer; 27. a blowing device; 28. an air pump; 29. an insulating adapter.
Detailed Description
For a clearer understanding of technical features, objects and effects of the present invention, a detailed description of embodiments of the present invention will be made with reference to the accompanying drawings.
The invention provides a microstructure homogenizing method in a metal material deformation process, which is used for homogenizing the metal material in the metal material deformation process and comprises the following steps of:
s1, mounting a metal material to be treated on a deformation testing machine, and performing insulation treatment on a testing machine body; winding an induction coil 23 around the outer circumference of the metal material, and connecting both ends of the induction coil 23 with the pulse magnetic field generator 22 without the induction coil 23 contacting the metal material; connecting two ends of the metal material with a pulse current generator 21 through a deformation tester respectively; mounting DIC equipment 24 (strain measurement system) beside the metallic material for detecting material strain; a thermal imaging device 25 and a cooling device are respectively arranged at the side of the metal material; the pulse current generator 21, the pulse magnetic field generator 22, the DIC equipment 24, the thermal imager 25 and the cooling device are respectively connected with the computer 26;
s2, respectively obtaining the optimal current density of the metal material and the optimal current density of the magnetic field generated by the pulse magnetic field generator through a preliminary exploring test, measuring the cross-sectional area of the metal material, and calculating the initial pulse current required by the pulse power generator and the initial pulse current required by the pulse magnetic field generator; synchronously starting a deformation testing machine, a pulse current generator 21, a pulse magnetic field generator 22, a DIC device 24 and a thermal imager 25, and synchronously starting homogenization treatment and deformation treatment;
s3, in the processing process, the computer 26 processes the strain data detected by the DIC equipment 24, calculates the cross-sectional area at each moment in the deformation process, and then adjusts the respective pulse current of the pulse current generator 21 and the pulse magnetic field generator 22 to realize the constancy of the respective current density; meanwhile, the temperature change of the metal material in the deformation process is observed in real time through the thermal imager 25, when the temperature exceeds the service temperature of the material, the computer 26 controls the cooling device to start, so that the metal material is cooled, the temperature is controlled within the service temperature range of the material, and the homogenization effect is ensured; and the deformation of the material is controlled by controlling the start and stop of the testing machine, so that the desired deformation is obtained.
Necessity of step S3: in the experimental process, the cross-sectional area of the sample changes at any time in the deformation process, so that the current density changes at any time and the homogenization effect can be possibly influenced, therefore, the DIC equipment 24, the pulse current generator 21 and the computer 26 are integrated, the cross-sectional area at each moment in the deformation process is calculated, the pulse current of the pulse power supply is further adjusted, and the constancy of the current density is realized. Similar to controlling the current density, the thermal imager 25, the cooling device and the computer 26 are integrated, the temperature change in the experimental process is observed through the thermal imager, the pulse current and the generated magnetic field act with the deformation experiment, the continuous temperature rise can be possibly caused, when the temperature rise is too high, the material can be possibly broken in advance, the fusing phenomenon occurs, the micro-area phase distribution is uneven, and the homogenization effect is influenced, therefore, when the temperature is too high, the computer 26 can control the cooling device to start, the purpose of controlling the temperature is achieved, and the homogenization effect is ensured.
Unlike traditional homogenizing treatment, the present invention heats material with pulse current, and pulse current is applied during deformation, and when current passes through material, the current acts to consume electric energy and produce Joule heat to raise the temperature of material. On the other hand, when the pulse current passes through the induction coil 23, a magnetic field is generated near the material, the pulse current itself also generates a magnetic effect, and the magnetic fields generated by the pulse current and the pulse current can weaken the binding force between dislocation and pinning center and promote the unpin and movement of the dislocation. When pulse current passes through the inside of the material, the free electrons move directionally to form current under the action of an external electric field, the electrons collide with atoms and cause energy transfer during electron transfer, the large amount of free electron transfer has a dragging effect on dislocation, thrust is generated on dislocation like wind, namely electron wind force, the electron wind force can promote dislocation movement, so that the dislocation is easier to get rid of pinning and entanglement, and the material is acted by a force field in the deformation process, so that the dislocation movement is greatly promoted. Therefore, the invention can realize the homogenization effect through multi-field coupling and improve the deformation capability of the material.
Referring to fig. 1, a conventional SANS universal tester 10 is shown, which includes an upper tensile end 11, a tensile adapter 12, a clamping device 13, a conductive bolt 15, and a lower tensile end 16, wherein a tensile specimen 14 is mounted between the upper tensile end 11 and the lower tensile end 16 through the clamping device 13.
As shown in fig. 2, the microstructure homogenizing device 20 in the deformation process of the metal material formed by modifying the conventional SANS universal tester 10 shown in fig. 1 is provided with an insulating adapter 29 between the tensile adapter 12 and the clamping device 13; a pulse current generator 21, an induction coil 23, a pulse magnetic field generator 22, a DIC device 24, a thermal imager 25, a cooling device and a computer 26 are added. Wherein, the metal material is arranged on the deformation testing machine and is connected with the pulse current generator 21 through the conductive bolt 15; the induction coil 23 is wound around the outer circumference of the metal material and is not in contact with the metal material, and the induction coil 23 is connected with the pulse magnetic field generator 22; the DIC facility 24, the thermal imager 25, and the cooling device are installed at the sides of the sample, respectively; the pulse current generator 21, the pulse magnetic field generator 22, the DIC equipment 24, the thermal imager 25 and the cooling device are all connected with the computer 26, so that data transmission and control are realized. Specifically, the cooling device comprises a blowing device 27 and an air pump 28, wherein the blowing device 27 is connected with the air pump 28, the blowing device 27 is arranged on one side of the metal material, the air pump 28 is connected with the computer 26, and the blowing amount and the blowing strength of the air pump 28 are controlled through the computer 26.
To verify the effectiveness of the method of the present invention, a tensile test specimen of TC11 titanium alloy was selected and clamped to the apparatus shown in FIG. 1, and a tensile deformation test was performed. Another tensile test specimen was clamped to the apparatus shown in fig. 2, and homogenization treatment and tensile deformation experiments were performed simultaneously.
Experimental parameters: pulse current density of 15A/mm 2 The method comprises the steps of carrying out a first treatment on the surface of the The deformation amount is 100%, and the deformation is to fracture.
By means of SEM and TEM, the tissue of the broken sample is observed and analyzed, and the homogenization effect is obvious.
The homogenization treatment of the material aims to improve the plasticity of the material during the subsequent deformation of the material, and the SEM detection is used for improving the plasticity of the material and analyzing the fracture morphology of a fracture sample. Fig. 3 is a graph showing the fracture morphology, wherein fig. 3 (a) shows the fracture morphology after the normal deformation treatment using the apparatus shown in fig. 1, and fig. 3 (b) shows the fracture morphology after the homogenization deformation treatment using the apparatus shown in fig. 2. As can be seen from fig. 3, compared with the fracture of the normal deformation sample, the fracture section of the homogenization deformation fracture has larger fluctuation, and under the same magnification, the ductile fossa at the fracture of the homogenization deformation fracture is smaller, and the ductile fossa is larger and deeper, which indicates that a large number of ductile fossa nucleation sites exist in the normal deformation sample, a lot of microscopic cracks are formed in the deformation process, the crack expansion speed is high, and the fracture occurs without large deformation; the number of pit nucleation positions of the samples subjected to the homogenizing deformation treatment is small, the micro-crack formation probability is reduced, and each pit is broken after undergoing large plastic deformation, so that the plasticity of the TC11 titanium alloy is improved by the homogenizing deformation treatment. The homogenization treatment method provided by the invention is proved to improve the plasticity of the material.
Fig. 4 (a) is a TEM image of a tissue near a fracture after normal deformation treatment using the apparatus shown in fig. 1, and fig. 4 (b) is a TEM image of a tissue near a fracture after homogenization deformation treatment using the apparatus shown in fig. 2. Fig. 4 (b) and (d) are enlarged views of the areas b and d in fig. 4 (a) and (c), respectively. As can be seen from fig. 4, the microstructure near the fracture of the sample is mainly composed of an alpha phase (hcp) and a beta phase (bcc). By subjecting selected areas to electron diffraction (sea), the alpha phase (bright color) and beta phase (gray) in the plot can be determined. Fig. 4 (a) and (b) show TEM images of the vicinity of the fracture of a normal deformed sample, and it can be seen from the figures that the α phase and the β phase have relatively distinct boundaries, that a large number of entangled dislocations are present in the β phase, that dislocation accumulation occurs, that the structure is not uniform, and that the forming performance of the material is poor. Fig. 4 (c) and (d) show TEM images of the vicinity of the fracture of the homogenized sample, in which the boundaries of the α phase and the β phase start to be blurred, and the entangled dislocation in the β phase is significantly reduced, because the dislocation movement is promoted by the combined action of the electromagnetic field and the thermal force field, dislocation entanglement is opened, and the thermal activation condition of the dislocation is satisfied by the combined action of the thermal effect of the pulse current, the electromigration effect and the magnetic effect, which accelerates the recombination of the dislocation accumulated in the vicinity of the grain boundary, promotes the transformation of the small-angle grain boundary to the large-angle grain boundary, thereby dynamic recrystallization occurs, the dislocation density in the material is reduced, the structure becomes more uniform, and the forming ability of the material is enhanced. The method provided by the invention can realize a good homogenization effect on the material.
The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the claims, which are to be protected by the present invention.
Claims (5)
1. A microstructure homogenizing method for a metal material deformation process, characterized in that the metal material is subjected to homogenizing treatment during the metal material deformation process, comprising the following steps:
s1, mounting a metal material to be treated on a deformation testing machine, and performing insulation treatment on a testing machine body; winding an induction coil around the periphery of the metal material, enabling the induction coil not to contact the metal material, and connecting two ends of the induction coil with a pulse magnetic field generator; connecting two ends of a metal material with a pulse current generator through a deformation tester respectively; installing DIC equipment beside the metal material for detecting material strain; a thermal imaging device and a cooling device are respectively arranged at the side of the metal material; the pulse current generator, the pulse magnetic field generator, the DIC equipment, the thermal imaging instrument and the cooling device are respectively connected with a computer;
s2, respectively obtaining the optimal current density of the metal material and the optimal current density of the magnetic field generated by the pulse magnetic field generator through a preliminary exploring test, measuring the cross-sectional area of the metal material, and calculating the initial pulse current required by the pulse power generator and the initial pulse current required by the pulse magnetic field generator; synchronously starting a deformation testing machine, a pulse current generator, a pulse magnetic field generator, DIC equipment and a thermal imaging instrument, and synchronously starting homogenization treatment and deformation treatment;
s3, in the processing process, the computer processes the strain data detected by the DIC equipment, calculates the cross-sectional area at each moment in the deformation process, and then adjusts the respective pulse current of the pulse current generator and the pulse magnetic field generator to realize the constancy of the respective current density; meanwhile, the temperature change of the metal material in the deformation process is observed in real time through a thermal imager, when the temperature exceeds the service temperature of the material, a computer controls a cooling device to start, so that the metal material is cooled, the temperature is controlled within the service temperature range of the material, and the homogenization effect is ensured; and the deformation of the material is controlled by controlling the start and stop of the testing machine, so that the desired deformation is obtained.
2. The method for homogenizing a microstructure of a metal material during deformation of the metal material according to claim 1, wherein the deformation tester is a SANS universal tester.
3. The method for homogenizing a microstructure of a metal material deformed according to claim 1, wherein the metal material is a difficult-to-form metal material including titanium alloy, nickel-based superalloy, high-strength aluminum alloy, and high-strength steel.
4. The method for homogenizing a microstructure of a metal material as claimed in claim 1, wherein the pulse current generator and the pulse magnetic field generator each generate a pulse current having an intensity in a range of 5A/mm 2 ~100A/mm 2 。
5. The method for homogenizing a microstructure of a metal material during deformation of claim 1, wherein the deformation range during the material homogenizing treatment is: 1% -100%.
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| CN104502203A (en) * | 2015-01-08 | 2015-04-08 | 哈尔滨工业大学 | Testing device for current auxiliary type micro-stretching mechanical property of metal thin plate |
| CN105057887A (en) * | 2015-08-17 | 2015-11-18 | 华南师范大学 | Pulse laser welding method and device assisted by electromagnetic force |
| CN112251597A (en) * | 2020-09-29 | 2021-01-22 | 武汉理工大学 | High-performance bearing matrix multi-energy-field co-forming manufacturing method |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3963533A (en) * | 1974-12-23 | 1976-06-15 | General Motors Corporation | Low temperature magnetic treatment of ferromagnetic materials |
| CN104502203A (en) * | 2015-01-08 | 2015-04-08 | 哈尔滨工业大学 | Testing device for current auxiliary type micro-stretching mechanical property of metal thin plate |
| CN105057887A (en) * | 2015-08-17 | 2015-11-18 | 华南师范大学 | Pulse laser welding method and device assisted by electromagnetic force |
| CN112251597A (en) * | 2020-09-29 | 2021-01-22 | 武汉理工大学 | High-performance bearing matrix multi-energy-field co-forming manufacturing method |
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