CN115396798A - Transducer and electronic equipment - Google Patents
Transducer and electronic equipment Download PDFInfo
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- CN115396798A CN115396798A CN202211045137.XA CN202211045137A CN115396798A CN 115396798 A CN115396798 A CN 115396798A CN 202211045137 A CN202211045137 A CN 202211045137A CN 115396798 A CN115396798 A CN 115396798A
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- Prior art keywords
- pad
- transducer
- connection
- electrically connected
- chip
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- 239000000758 substrate Substances 0.000 claims abstract description 57
- 238000005538 encapsulation Methods 0.000 claims abstract description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 241000218202 Coptis Species 0.000 description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
Abstract
The invention provides a transducer and electronic equipment, wherein the transducer comprises a substrate and a shell covering the substrate of a support piece, the shell of the support piece and the substrate of the support piece are enclosed to form an encapsulation cavity, an MEMS chip and an IC chip are arranged in the encapsulation cavity of the support piece, a first bonding pad is arranged on the MEMS chip of the support piece, a second bonding pad is arranged on the IC chip of the support piece, a third bonding pad and a fourth bonding pad are respectively arranged on the substrate of the support piece, the first bonding pad of the support piece and the third bonding pad of the support piece are electrically connected through a connecting column, and the second bonding pad of the support piece and the fourth bonding pad of the support piece are electrically connected. The first bonding pad and the third bonding pad are electrically connected through the connecting column, namely the MEMS chip and the substrate are connected through the connecting column, the second bonding pad and the fourth bonding pad are electrically connected, namely the IC chip and the substrate are electrically connected, and then the third bonding pad and the fourth bonding pad are connected through the substrate, so that the MEMS chip and the IC chip are electrically connected. The transducer has the advantages of low manufacturing cost and difficult failure of products.
Description
Technical Field
The invention relates to the technical field of transducers, in particular to a transducer and electronic equipment.
Background
The traditional MEMS transducer package is characterized in that an MEMS chip and an IC chip are respectively attached to the surface of a substrate, then the MEMS chip and the IC chip are respectively connected by gold wires, the IC chip is connected with a PCB, the surface of the IC chip is coated with silica gel for shielding protection, and finally a metal shell is attached to the substrate. The gold wire is high in the manufacturing cost of the transducer as a precious metal, and meanwhile, when the transducer receives a large impact force, the gold wire between the MEMS chip and the IC chip is easy to deform, so that the performance of the transducer fails.
Accordingly, there is a need for a new transducer and electronic device that solves or at least alleviates the above-mentioned drawbacks.
Disclosure of Invention
The invention mainly aims to provide a transducer and electronic equipment, and aims to solve the technical problems that in the prior art, the transducer is made of gold wires, the manufacturing cost is high, and failure risks exist.
In order to achieve the above object, according to an aspect of the present invention, the present invention provides a transducer, including a substrate and a housing covering the substrate, where the housing and the substrate enclose to form an encapsulation cavity, a MEMS chip and an IC chip are disposed in the encapsulation cavity, a first pad is disposed on the MEMS chip, a second pad is disposed on the IC chip, a third pad and a fourth pad are disposed on the substrate, the first pad and the third pad are electrically connected through a connection column, and the second pad and the fourth pad are electrically connected.
In an embodiment, a wiring layer is disposed in the substrate, and the third pad and the fourth pad are electrically connected through the wiring layer.
In an embodiment, the MEMS chip includes a sensing film and a support connected to the substrate, the sensing film is provided with the first pad, a through hole is formed at a position corresponding to the first pad, the third pad is disposed at a position corresponding to the through hole, the connection column is made of a conductive material, the connection column is disposed in the through hole, and the connection column is electrically connected to the first pad and the third pad.
In one embodiment, the connecting posts are metal connecting posts.
In one embodiment, the metal connection stud comprises a copper ring formed around an inner wall surface of the through hole.
In one embodiment, the metal connection post comprises a copper post filling the via.
In one embodiment, the connection post is electrically connected with the third bonding pad through solder paste.
In an embodiment, the MEMS chip includes a sensing film and a support connected to the substrate, the sensing film is provided with the first pad, the connection post includes a base and a first connection pad and a second connection pad respectively disposed at two ends of the base, the first connection pad is electrically connected to the first pad, the second connection pad is electrically connected to the third pad, and the first connection pad is electrically connected to the second connection pad through a wiring layer of the base.
In an embodiment, the base body is an L-shaped base body, the L-shaped base body includes a horizontal section and a vertical section which are perpendicular to each other, the first connection pad is disposed on one side of the horizontal section facing the first pad, and the second connection pad is disposed on one side of the vertical section facing the third pad.
In one embodiment, the first connection pad and the first pad, and the second connection pad and the third pad are electrically connected by solder paste.
In an embodiment, the transducer is an acoustic-electric transducer or an acoustic sensor, the second bonding pad is disposed on a side of the IC chip facing the substrate, and the second bonding pad and the fourth bonding pad are disposed facing each other.
In one embodiment, the second pad and the fourth pad are electrically connected by solder paste.
In an embodiment, the second pad and the fourth pad are electrically connected through a gold wire, and a silicone layer is disposed on one side of the IC chip on the second pad.
According to another aspect of the invention, the invention also provides an electronic device comprising a transducer as described above.
In the above scheme, the transducer comprises a substrate and a housing covering the substrate of the support piece, the housing of the support piece and the substrate of the support piece enclose to form a packaging cavity, the packaging cavity of the support piece is internally provided with an MEMS chip and an IC chip, the MEMS chip of the support piece is provided with a first bonding pad, the IC chip of the support piece is provided with a second bonding pad, the substrate of the support piece is respectively provided with a third bonding pad and a fourth bonding pad, the first bonding pad of the support piece is electrically connected with the third bonding pad of the support piece through a connecting column, and the second bonding pad of the support piece is electrically connected with the fourth bonding pad of the support piece. The first bonding pad and the third bonding pad are electrically connected through the connecting column, namely the MEMS chip and the substrate are connected through the connecting column, the second bonding pad and the fourth bonding pad are electrically connected, namely the IC chip and the substrate are electrically connected, and then the third bonding pad and the fourth bonding pad are connected through the substrate, so that the MEMS chip and the IC chip are electrically connected. The connecting column replaces a gold thread in the prior art, is relatively high in rigidity and connection strength, and is not prone to shaking or loosening to cause product failure when being impacted by the outside. Moreover, the connecting column can be made of common materials, and compared with a gold thread, the manufacturing cost is reduced. The invention has the advantages of low manufacturing cost and difficult product failure.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of a prior art transducer with gold wire short-circuit failure;
FIG. 2 is a schematic diagram of a prior art transducer with gold wires cut and broken to fail;
FIG. 3 is a schematic cross-sectional view of a transducer according to an embodiment of the invention;
FIG. 4 is a schematic diagram of a projection configuration of a transducer according to an embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view of a MEMS chip and a copper pillar according to an embodiment of the present invention;
FIG. 6 is a top view of a MEMS chip according to an embodiment of the present invention;
FIG. 7 is a schematic view of a substrate according to one embodiment of the present invention;
FIG. 8 is a schematic cross-sectional view of a transducer in accordance with an embodiment of the invention;
FIG. 9 is an enlarged view of FIG. 8 at A;
FIG. 10 is a schematic view of another projection configuration of a transducer in accordance with an embodiment of the present invention;
FIG. 11 is a schematic structural diagram of a connecting column according to an embodiment of the present invention.
The reference numbers illustrate:
1. a substrate; 2. a housing; 3. a packaging cavity; 4. an MEMS chip; 41. an induction film; 42. a support member; 5. an IC chip; 6. connecting columns; 61. a copper pillar; 62. a substrate; 621. a horizontal segment; 622. a vertical section; 63. a first connection pad; 64. a second connection pad; 8. a first pad; 9. a second bonding pad; 10. a third pad; 11. a fourth pad; 12. tin paste; 13. gold wires; 14. and (5) a silica gel layer.
The implementation, functional features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
It should be noted that all the directional indicators (such as upper and lower 8230; etc.) in the embodiments of the present invention are only used for explaining the relative positional relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, descriptions such as "first", "second", etc. in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature.
Moreover, the technical solutions in the embodiments of the present invention may be combined with each other, but it is necessary to be able to be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent, and is not within the protection scope of the present invention.
Referring to fig. 3 to 11, according to an aspect of the present invention, the present invention provides a transducer, including a substrate 1 and a housing 2 covering the substrate 1, the housing 2 and the substrate 1 enclose to form an encapsulation cavity 3, a MEMS chip 4 and an IC chip 5 are disposed in the encapsulation cavity 3, a first pad 8 is disposed on the MEMS chip 4, a second pad 9 is disposed on the IC chip 5, a third pad 10 and a fourth pad 11 are respectively disposed on the substrate 1, the first pad 8 and the third pad 10 are electrically connected through a connection post 6, and the second pad 9 and the fourth pad 11 are electrically connected.
In the prior art, referring to fig. 1 and 2, the MEMS chip 4 and the IC chip 5 are respectively connected to the substrate 1, and the MEMS chip 4 and the IC chip 5 are connected by the gold wire 13, so that when the transducer is used or the transducer is subjected to an external impact force, one end of the gold wire 13 connected to the MEMS chip 4 is easily shaken and may be cut off by the edge of the MEMS chip 4, thereby causing an open circuit; either the gold wire 13 is easily attached to the surface of the MEMS chip 4 to cause a short circuit, or the connection terminal of the gold wire 13 may be released from the MEMS chip 4. In the above embodiment, the first bonding pad 8 and the third bonding pad 10 are electrically connected through the connection post 6, that is, the MEMS chip 4 and the substrate 1 are connected through the connection post 6, the second bonding pad 9 and the fourth bonding pad 11 are electrically connected, that is, the IC chip 5 and the substrate 1 are electrically connected, and then the third bonding pad 10 and the fourth bonding pad 11 are connected through the substrate 1, so that the MEMS chip 4 and the IC chip 5 are electrically connected. This embodiment has replaced gold thread 13 among the prior art through spliced pole 6, and spliced pole 6 rigidity is great relatively, and joint strength is great, is difficult for rocking or pine to take off and cause the product to become invalid when receiving external shock. Moreover, the connecting column 6 can be made of common materials, so that the manufacturing cost is reduced compared with the expensive gold wire 13. The embodiment has the advantages of low manufacturing cost and difficulty in product failure. The transducer not only comprises a microphone, but also comprises MEMS detection devices such as ultrasonic devices and environmental parameter detection devices.
In one embodiment, a wiring layer is provided in the substrate 1, and the third pad 10 and the fourth pad 11 are electrically connected through the wiring layer. The substrate 1 may be a printed circuit board, and a wiring layer is formed to connect the third pad 10 and the fourth pad 11 when the printed circuit board is manufactured, so that the MEMS chip 4 and the IC chip 5 realize signal connection through the substrate 1, and a gold wire 13 between the MEMS chip 4 and the IC chip 5 is eliminated.
Referring to fig. 3 to 7, in an embodiment, the MEMS chip 4 includes a sensing film 41 and a supporting member 42 connected to the substrate 1, the sensing film 41 has a first pad 8 disposed thereon, the supporting member 42 has a through hole formed at a position corresponding to the first pad 8, the third pad 10 is disposed at a position corresponding to the through hole of the substrate 1, the connection post 6 is made of a conductive material, the connection post 6 is disposed in the through hole, and the connection post 6 electrically connects the first pad 8 and the third pad 10. The supporting piece 42 can be a silicon substrate, a through hole vertically arranged is dug on the silicon substrate, a first bonding pad 8 is correspondingly arranged at the top end of the through hole, a third bonding pad 10 is correspondingly arranged at the bottom end of the through hole, and then a conductive material is arranged in the through hole to enable the first bonding pad 8 and the third bonding pad 10 to be electrically connected, so that signals of the MEMS chip 4 can be conveniently transmitted to the substrate 1 and finally transmitted to the IC chip 5 through the substrate 1.
Referring to fig. 3 and 6, in one embodiment, the connection post 6 is a metal connection post. Specifically, the metal connection post comprises a copper ring formed around the inner wall surface of the via or a copper post 61 filling the via. Theoretically, as long as the metal with the conductive performance can be used as the connecting column 6, the invention integrates the conductive performance and the cost, and the connecting column 6 is made of copper or copper alloy. The connecting column 6 can be a copper column 61 filled with the through hole, so that the manufacturing process is convenient, but the manufacturing cost is high. Or only one side copper ring is arranged around the inner wall of the through hole, namely the side surface of a cylinder, so that the using amount of copper can be reduced, the manufacturing cost is reduced,
referring to fig. 3, in one embodiment, the connection stud 6 is electrically connected to the third pad 10 by solder paste 12. In order to facilitate the electrical connection between the connection post 6 and the third pad 10, and to electrically connect the connection post 6 and the third pad 10 through the solder paste 12, the solder paste 12 plays a role in connection and electrical conduction.
Referring to fig. 5, 7 to 11, in an embodiment, the MEMS chip 4 includes a sensing film 41 and a support member 42 connected to the substrate 1, the sensing film 41 is provided with a first pad 8, the connection post 6 includes a base 62 and a first connection pad 63 and a second connection pad 64 respectively disposed at two ends of the base 62, the first connection pad 63 is electrically connected to the first pad 8, the second connection pad 64 is electrically connected to the third pad 10, and the first connection pad 63 and the second connection pad 64 are electrically connected through a routing layer of the base 62. The process of providing the through-holes on the support member 42 is complicated, and therefore, the present embodiment connects the first pad 8 and the third pad 10 through one connection post 6 provided at the periphery of the chip. In particular, the third pad 10 is also arranged on the periphery of the support 42, the substrate 62 may also be a printed circuit board, and a routing layer inside the printed circuit board connects the first connection pad 63 and the second connection pad 64, thereby achieving the electrical connection between the first pad 8 and the third pad 10 through the connection post 6, and also achieving the electrical connection between the MEMS chip 4 and the substrate 1.
Referring to fig. 9 and 11, in an embodiment, the base 62 is an L-shaped base, the L-shaped base includes a horizontal segment 621 and a vertical segment 622 perpendicular to each other, a side of the horizontal segment 621 facing the first pad 8 is provided with a first connection pad 63, and a side of the vertical segment 622 facing the third pad 10 is provided with a second connection pad 64. It should be noted that the L-shape is only one form of the connecting column 6, and other shapes can be provided, such as a shape other than a vertical connection or the base 62 can include three segments of bent connections. Considering the position relation between the MEMS chip 4 and the substrate 1, the L-shaped base body is simpler to manufacture and saves materials.
Referring to fig. 8 and 9, in an embodiment, the first connection pad 63 and the first pad 8, and the second connection pad 64 and the third pad 10 are electrically connected by the solder paste 12. The solder paste 12 acts as a permanent connection and as an electrical conductor, so that an electrical connection of the first bonding pad 8 and the third bonding pad 10, i.e. of the substrate 1 to the MEMS chip 4, is achieved via the connection stud 6.
In an embodiment, the second connection pad 64 and the third pad 10 are electrically connected by a gold wire 13, and a silicone layer 14 is disposed on one side of the IC chip 5 on the second pad 9. In actual use, the gold wire 13 between the MEMS chip 4 and the IC chip 5 is mainly failed, so the replacement of the gold wire 13 between the IC chip 5 and the substrate 1 may not be considered. At this moment, the second bonding pad 9 is arranged on one side of the IC chip 5 departing from the substrate 1, a silica gel layer 14 can be arranged on one side of the second bonding pad 9, the silica gel layer 14 can play a role in shielding and can wrap the connection position of the gold wire 13 and the second bonding pad 9, and the function of preventing the gold wire 13 from loosening is achieved.
Referring to fig. 8 and 9, in an embodiment, the transducer is an acoustic transducer or an acoustic sensor, the second pads 9 are disposed on a side of the IC chip 5 facing the substrate 1, and the second pads 9 are disposed facing the fourth pads 11, the second pads 9 and the fourth pads 11 being electrically connected by solder paste 12. Second pad 9 of this embodiment sets up in the bottom of IC chip 5, sets up fourth pad 11 in the position that faces with second pad 9, then connects second pad 9 and fourth pad 11 through tin cream 12 electricity, has realized IC chip 5 and MEMS chip 4's electricity and has connected, has replaced prior art's gold thread 13 to connect, has improved joint strength and connected stability, has further reduced the product risk of failure.
According to another aspect of the invention, the invention also provides an electronic device comprising a transducer as described above. Since the electronic device includes all technical solutions of all embodiments of the transducer, at least all beneficial effects brought by the above technical solutions are obtained, and details are not described herein.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents made by the claims and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (14)
1. The utility model provides a transducer, its characterized in that is located including base plate and cover the shell of base plate, the shell with the base plate encloses to close and forms the encapsulation chamber, be provided with MEMS chip and IC chip in the encapsulation chamber, be provided with first pad on the MEMS chip, be provided with the second pad on the IC chip, be provided with third pad and fourth pad on the base plate respectively, first pad with the third pad is connected through the spliced pole electricity, the second pad with the fourth pad electricity is connected.
2. The transducer of claim 1, wherein a wiring layer is provided within the substrate, the third pad and the fourth pad being electrically connected through the wiring layer.
3. The transducer according to claim 1, wherein the MEMS chip comprises a sensing film and a support connected to the substrate, the sensing film is provided with the first pad, a through hole is formed at a position of the support corresponding to the first pad, the third pad is provided at a position of the substrate corresponding to the through hole, the connection post is made of a conductive material, the connection post is provided in the through hole, and the connection post electrically connects the first pad and the third pad.
4. The transducer of claim 3, wherein the connection posts are metal connection posts.
5. The transducer of claim 4, wherein the metal connection post comprises a copper ring formed around an inner wall surface of the through hole.
6. The transducer of claim 4, wherein the metal connection post comprises a copper post filling the via.
7. The transducer of claim 3, wherein the connection post is electrically connected to the third pad by solder paste.
8. The transducer of claim 1, wherein the MEMS chip comprises a sensing film and a support connected to the substrate, the sensing film is provided with the first pad, the connection post comprises a base and a first connection pad and a second connection pad respectively disposed at two ends of the base, the first connection pad is electrically connected to the first pad, the second connection pad is electrically connected to the third pad, and the first connection pad and the second connection pad are electrically connected through a wiring layer of the base.
9. The transducer of claim 8, wherein the base is an L-shaped base comprising a horizontal section and a vertical section perpendicular to each other, the horizontal section being provided with the first connection pad on a side facing the first pad, and the vertical section being provided with the second connection pad on a side facing the third pad.
10. The transducer of claim 8, wherein the first connection pad and the first pad, and the second connection pad and the third pad are each electrically connected by solder paste.
11. The transducer according to any one of claims 1 to 10, wherein the transducer is an acoustoelectric transducer or an acoustic sensor, the second bonding pad is disposed on a side of the IC chip facing the substrate, and the second bonding pad is disposed facing the fourth bonding pad.
12. The transducer of claim 11, wherein the second pad and the fourth pad are electrically connected by solder paste.
13. The transducer according to any one of claims 1 to 10, wherein the second pad and the fourth pad are electrically connected by gold wires, and a silicone layer is disposed on one side of the IC chip on the second pad.
14. An electronic device, characterized in that the electronic device comprises a transducer according to any of claims 1-13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211045137.XA CN115396798A (en) | 2022-08-30 | 2022-08-30 | Transducer and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211045137.XA CN115396798A (en) | 2022-08-30 | 2022-08-30 | Transducer and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115396798A true CN115396798A (en) | 2022-11-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211045137.XA Pending CN115396798A (en) | 2022-08-30 | 2022-08-30 | Transducer and electronic equipment |
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| Country | Link |
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| CN (1) | CN115396798A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1822722A (en) * | 2005-01-31 | 2006-08-23 | 三洋电机株式会社 | Semiconductor sensor |
| CN2812465Y (en) * | 2005-06-17 | 2006-08-30 | 瑞声声学科技(深圳)有限公司 | Microphone package structure for micro-electromechanical system |
| US20130105952A1 (en) * | 2011-10-27 | 2013-05-02 | Stmicroelectronics S.R.L. | Shielded encapsulating structure and manufacturing method thereof |
| CN109264662A (en) * | 2017-07-18 | 2019-01-25 | 英飞凌科技股份有限公司 | System and method for overlapping sensor encapsulation |
| CN213847006U (en) * | 2020-12-29 | 2021-07-30 | 歌尔微电子有限公司 | Sensor packaging structure and electronic equipment |
-
2022
- 2022-08-30 CN CN202211045137.XA patent/CN115396798A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1822722A (en) * | 2005-01-31 | 2006-08-23 | 三洋电机株式会社 | Semiconductor sensor |
| CN2812465Y (en) * | 2005-06-17 | 2006-08-30 | 瑞声声学科技(深圳)有限公司 | Microphone package structure for micro-electromechanical system |
| US20130105952A1 (en) * | 2011-10-27 | 2013-05-02 | Stmicroelectronics S.R.L. | Shielded encapsulating structure and manufacturing method thereof |
| CN109264662A (en) * | 2017-07-18 | 2019-01-25 | 英飞凌科技股份有限公司 | System and method for overlapping sensor encapsulation |
| CN213847006U (en) * | 2020-12-29 | 2021-07-30 | 歌尔微电子有限公司 | Sensor packaging structure and electronic equipment |
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