CN115365222B - Cleaning device for semiconductor etching - Google Patents
Cleaning device for semiconductor etching Download PDFInfo
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- CN115365222B CN115365222B CN202211300556.3A CN202211300556A CN115365222B CN 115365222 B CN115365222 B CN 115365222B CN 202211300556 A CN202211300556 A CN 202211300556A CN 115365222 B CN115365222 B CN 115365222B
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- shell
- block
- plate
- magnetic
- mesh enclosure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/02—Devices for holding articles during cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention belongs to the technical field of semiconductors, and particularly relates to a cleaning device for semiconductor etching, which comprises a shell, wherein a rotating block is rotatably arranged in the shell, a magnetic block is fixedly arranged on the surface of the rotating block, an inner plate is fixedly arranged in the magnetic block, a supporting plate is arranged above the shell, a magnetic plate is arranged above the supporting plate, an inner circular ring is fixedly arranged in the supporting plate, a through hole is formed in the shell, an air tap is arranged in the through hole, an air bag is connected below the air tap, a pressing plate is arranged on the side surface of the air bag, the pressing plate is connected with a driving block through a limiting rod, and the driving block is connected with the shell through a spring; the device drives the rivers through the magnetic path and rotates through silicon wafer inversion when using, realizes the cleaning function, can not harm silicon wafer when guaranteeing to wash to after wasing a period, can also the automatic switch-over washing liquid.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a cleaning device for semiconductor etching processing.
Background
Since a semiconductor is a basic material for manufacturing a chip and a silicon wafer needs to be etched and cleaned during semiconductor chip processing, a cleaning device for semiconductor processing needs to be used, and the existing cleaning device has some defects during use.
For example, in the cleaning device, the cleaning method, the semiconductor processing machine and the wafer processing method disclosed in publication No. CN201810583110.3, before an object to be cleaned is placed in the cleaning tank, laminar flow cleaning is performed through a laminar flow pipeline at the top of the cleaning tank, so as to remove residual particles on the surface of the cleaning tank; after the object to be cleaned is placed in the cleaning tank, the object to be cleaned is cleaned by washing from bottom to top through the upstream washing pipeline, and the object to be cleaned is cleaned by laminar flow through the laminar flow pipeline; after the cleaning of the object to be cleaned is finished and before the object to be cleaned is taken out of the cleaning tank, laminar flow cleaning is carried out on the top of the cleaning tank through a laminar flow pipeline, so that the defects on the surface of the cleaned object to be cleaned can be effectively reduced, and the output of the cleaned object to be cleaned is increased; when the cleaning device is used for cleaning, the cleaning liquid for cleaning the surface of the semiconductor is repeatedly used, secondary pollution is easily caused, and the cleaning effect is poor.
Disclosure of Invention
The present invention has been made in view of the problems occurring in the conventional semiconductor cleaning apparatus.
In order to solve the above technical problems, according to one aspect of the present invention, the present invention provides the following technical solutions: the utility model provides a belt cleaning device for semiconductor sculpture processing, includes the shell, the turning block is installed in the inside rotation of shell, the fixed surface of turning block is provided with the magnetic path, the fixed inner panel that is provided with in inside of magnetic path, the bearing board has been placed to the top of shell, the top of bearing board is provided with the magnetic sheet, and the fixed interior ring that is provided with in inside of bearing board, the through-hole has been seted up to the inside of shell, the inside of through-hole is provided with the air cock, the below of air cock is connected with the gasbag, the side of gasbag is provided with the clamp plate, the clamp plate passes through the gag lever post and links to each other with the transmission block, the transmission block passes through the spring and links to each other with the shell.
As a preferable aspect of the cleaning apparatus for semiconductor etching processing according to the present invention, wherein: the magnetic plate is characterized in that the central axes of the shell, the rotating block, the magnetic block, the inner plate and the magnetic plate are on the same straight line, the rotating block, the magnetic block and the inner plate form a rotating structure through the magnetic plate and the shell, and a groove is formed in the shell.
As a preferable scheme of the cleaning device for semiconductor etching processing of the present invention, wherein: the magnetic plate is characterized in that connecting blocks are fixedly arranged on the left side and the right side of the magnetic plate, a sliding rod is fixedly connected to the lower portion of each connecting block, and a sliding groove for sliding the sliding rod is formed in the surface of the supporting plate.
As a preferable scheme of the cleaning device for semiconductor etching processing of the present invention, wherein: fixed blocks are attached to the front side and the rear side of the upper portion of the magnetic plate, a connecting shaft is fixedly arranged between each fixed block and the corresponding adjacent fixed block, a motor is arranged above the connecting shaft, and an output shaft of the motor is connected with the connecting shaft.
As a preferable scheme of the cleaning device for semiconductor etching processing of the present invention, wherein: the inside of recess is rotated and is installed the folded plate, the front end fixedly connected with balancing weight of folded plate, the fixed barrel that is provided with in rear side of folded plate, the top of folded plate is fixed and is provided with the depression bar.
As a preferable aspect of the cleaning apparatus for semiconductor etching processing according to the present invention, wherein: the transmission device is characterized in that the compression rod is in sliding connection with the shell, the transmission block forms a sliding structure with the shell through the compression rod, the side face of the transmission block is fixedly connected with the limiting rod, the transmission block forms an elastic structure with the shell through the limiting rod and the spring, and an inner groove is formed in the bottom of the shell.
As a preferable aspect of the cleaning apparatus for semiconductor etching processing according to the present invention, wherein: the air bag is located inside the inner groove, the air nozzles are distributed on the air bag at equal angles, the rubber blocks are arranged in the middle of the through hole, a slot is formed in the middle of each rubber block, a piston is arranged in the middle of the through hole, and the piston forms a sliding structure with the shell through the pressing plate, the air bag and the air nozzles.
As a preferable aspect of the cleaning apparatus for semiconductor etching processing according to the present invention, wherein: the left and right sides on through-hole top all is provided with the rubber valve, laminate mutually between rubber valve and the adjacent rubber valve, the outside of shell is provided with the second screen panel, the rear side of second screen panel articulates there is first screen panel.
As a preferable scheme of the cleaning device for semiconductor etching processing of the present invention, wherein: the inside of first screen panel and the equal slidable mounting in inside of second screen panel have the fly leaf, the front end protrusion of fly leaf is on the right side of first screen panel and second screen panel, first screen panel and second screen panel all link to each other with the fly leaf through the pressure spring.
As a preferable aspect of the cleaning apparatus for semiconductor etching processing according to the present invention, wherein: the fixed surface of fly leaf is provided with the guide frame, the inside laminating of guide frame is provided with interior pole, the top fixedly connected with connecting pipe of interior pole, be sliding connection between connecting pipe and the first screen panel, the connecting pipe passes through fly leaf, guide frame and constitutes extending structure between interior pole and the first screen panel, and the connecting pipe is in the inside equal angular distribution of first screen panel and second screen panel, corresponds mutually between connecting pipe and the block rubber.
Compared with the prior art, the invention has the beneficial effects that:
1. magnetic path and magnetic sheet through on the device make the device can be when wasing, through invering silicon wafer for the magnetic path of below can drive the inner panel when rotatory and rotate to stir rivers and wash silicon wafer's surface, compare in directly erodeing, erode safer through the device, solved current belt cleaning device and damaged silicon wafer's defect easily when wasing silicon wafer, had the practicality.
2. Through the rotatable folded plate in the device, make the device can collect the washing liquid through the barrel at folded plate pivoted in-process, after the washing liquid accumulation is enough, the folded plate is automatic to the outside slope, thereby make the depression bar on the device can support the transmission piece, extrude the gasbag at last, with inside the device is crowded into to the washing liquid in the through-hole, make the device can wash automatic change washing liquid after a period, the convenience that the device used has been promoted, the washing liquid that can not be renewed after wasing when having solved current belt cleaning device when using automatically, produce secondary pollution's defect easily, the advantage that the result of use is better has.
3. Through the fly leaf on the device, first screen panel and second screen panel, can realize the function of first screen panel and second screen panel automatic replenishment washing liquid when merging, when merging first screen panel and second screen panel, adjacent two places fly leaf can compress tightly mutually to make the connecting pipe of a plurality of positions remove to the inside of device in step, thereby utilize the screen panel to supply the washing liquid in connecting pipe and the shell bottom through-hole, make the device can follow the different washing liquid of a plurality of positions replenishment simultaneously.
4. Through the rubber valve of device for atmospheric pressure in the through-hole only when big enough, thereby two adjacent rubber valves just can be strutted and supply the washing liquid automatically, have realized the function of relief valve, so that follow-up cooperation piston and gasbag supply different washing liquids in the position of difference, have promoted the variety that the device used.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor. Wherein:
FIG. 1 is a schematic view of the overall structure of a cleaning apparatus for semiconductor etching according to the present invention;
FIG. 2 is a schematic view of an overall disassembled structure of the cleaning device for semiconductor etching processing according to the present invention;
FIG. 3 is a schematic view of a connecting structure of a housing and a folded plate of the cleaning device for etching semiconductor according to the present invention;
FIG. 4 is a schematic structural view of a cleaning apparatus for semiconductor etching processing at the position A in FIG. 3 according to the present invention;
FIG. 5 is a schematic view of a connection structure between a housing and a first mesh enclosure of a cleaning device for semiconductor etching according to the present invention;
FIG. 6 is a schematic structural view of a cleaning apparatus for semiconductor etching processing shown at B in FIG. 5;
FIG. 7 is a schematic structural view of a cleaning apparatus for semiconductor etching processing at the point C in FIG. 5 according to the present invention;
FIG. 8 is a schematic view showing a connecting structure of a housing and a rubber block of a cleaning apparatus for etching semiconductor according to the present invention;
FIG. 9 is a schematic structural view of a cleaning apparatus for semiconductor etching processing shown in FIG. 8 at D.
The reference numbers in the figures: 1. a housing; 2. rotating the block; 3. a magnetic block; 4. an inner plate; 5. a magnetic plate; 6. connecting blocks; 7. a slide bar; 8. a support plate; 9. a chute; 10. an inner circular ring; 11. a motor; 12. a transmission block; 13. a connecting shaft; 14. a fixed block; 15. a groove; 16. folding the plate; 17. a balancing weight; 18. a pressure lever; 19. an inner tank; 20. a barrel; 21. a limiting rod; 22. a spring; 23. pressing a plate; 24. an air bag; 25. an air tap; 26. a through hole; 27. a piston; 28. a rubber block; 29. a rubber valve; 30. slotting; 31. a first mesh enclosure; 32. a second mesh enclosure; 33. a movable plate; 34. a guide frame; 35. an inner rod; 36. a connecting pipe; 37. and (5) pressing a spring.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described herein, and it will be apparent to those of ordinary skill in the art that the present invention may be practiced without departing from the spirit and scope of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Next, the present invention is described in detail with reference to the drawings, and in the detailed description of the embodiments of the present invention, the cross-sectional view illustrating the structure of the device is not enlarged partially in general scale for the convenience of illustration, and the drawings are only exemplary, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
Examples
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1 and 2, a belt cleaning device for semiconductor etching, including shell 1, turning block 2 is installed in the inside rotation of shell 1, the fixed surface of turning block 2 is provided with magnetic path 3, magnetic path 3 can drive turning block 2 and rotate, the inside fixing of magnetic path 3 is provided with inner panel 4, turning block 2 can drive inner panel 4 and rotate, thereby utilize the splash bottom to wash silicon wafer, bearing board 8 has been placed to the top of shell 1, bearing board 8's top is provided with magnetic sheet 5, magnetic sheet 5 can drive magnetic path 3 and rotate when rotating, when making the splash surface to silicon wafer wash, reduce the surface possibility of damaging the silicon wafer, the security that the device used has been promoted.
As shown in fig. 3 and 4, an inner ring 10 is fixedly arranged inside the supporting plate 8, the inner ring 10 is used for supporting a silicon wafer, the silicon wafer can be inverted, a through hole 26 is formed inside the housing 1, the through hole 26 is used for storing a cleaning solution to be replaced, an air nozzle 25 is arranged inside the through hole 26, an air bag 24 is connected below the air nozzle 25, and the air bag 24 can automatically extrude the cleaning solution in the through hole 26 into the housing 1 under the extrusion effect, so that the cleaning solution replacement function is realized; the side of the air bag 24 is provided with a pressing plate 23, the pressing plate 23 is connected with the transmission block 12 through a limiting rod 21, and the transmission block 12 is connected with the shell 1 through a spring 22.
Through clamp plate 23 on the device make the inside useless washing liquid of device collect can push down gasbag 24 automatically after enough volume to utilize the automatic new washing liquid that supplyes of atmospheric pressure, avoid producing secondary pollution, promoted the cleaning performance of device.
As shown in fig. 2, in this example, the central axes of the housing 1, the rotating block 2, the magnetic block 3, the inner plate 4 and the magnetic plate 5 are on the same straight line, the rotating block 2, the magnetic block 3 and the inner plate 4 form a rotating structure through the magnetic plate 5 and the housing 1, and a groove 15 is formed in the housing 1.
Through the rotating structure on the device for the rotation of magnetic sheet 5 can drive turning block 2, magnetic path 3 and inner panel 4 and rotate, thereby makes the rotation of inner panel 4 can drive the washing liquid in the shell 1 and splash, utilizes the washing liquid that splashes to rinse the silicon wafer of inversion on the device, has promoted the cleaning performance of device.
As shown in fig. 2, in this embodiment, connection blocks 6 are fixedly disposed on the left and right sides of the magnetic plate 5, a slide bar 7 is fixedly connected below the connection blocks 6, and a sliding groove 9 for sliding the slide bar 7 is formed on the surface of the support plate 8.
The bearing plate 8 can rotate stably through the sliding rod 7 on the device, and the stability of the device is improved.
As shown in fig. 1 and 2, in this example, fixing blocks 14 are attached to the front and rear sides above the magnetic plate 5, a connecting shaft 13 is fixedly disposed between each fixing block 14 and the adjacent fixing block 14, a motor 11 is disposed above the connecting shaft 13, and an output shaft of the motor 11 is connected to the connecting shaft 13.
The motor 11 can drive the magnetic plate 5 to rotate, so that the surface of the silicon wafer is efficiently cleaned.
As shown in fig. 2 and 3, in this example, a folded plate 16 is rotatably installed inside the groove 15, a counterweight 17 is fixedly connected to the front end of the folded plate 16, a cylinder 20 is fixedly arranged on the rear side of the folded plate 16, and a pressing rod 18 is fixedly arranged above the folded plate 16.
Through the barrel 20 of folded plate 16 rear side for after the waste cleaning liquid in the barrel 20 fills up, folded plate 16 leans out, makes things convenient for follow-up automatic change washing liquid, has promoted the convenience that the device used, and can prevent that waste cleaning liquid from causing secondary pollution to silicon wafer.
As shown in fig. 3, in this embodiment, the pressing rod 18 is slidably connected to the housing 1, the driving block 12 forms a sliding structure with the housing 1 through the pressing rod 18, the side surface of the driving block 12 is fixedly connected to the limiting rod 21, the driving block 12 forms an elastic structure with the housing 1 through the limiting rod 21 and the spring 22, and the bottom of the housing 1 is provided with an inner groove 19.
The limiting rod 21 on the device enables the pressing rod 18 to keep the transmission block 12 vertically moving up and down in the process of pushing the transmission block 12, and the spring 22 facilitates automatic reset of the subsequent transmission block 12.
As shown in fig. 4, 8 and 9, in this example, the air bag 24 is located inside the inner groove 19, the air nozzles 25 are distributed at equal angles on the air bag 24, the rubber block 28 is provided in the middle of the through hole 26, the slit 30 is provided in the middle of the rubber block 28, the piston 27 is provided in the middle of the through hole 26, and the piston 27 forms a sliding structure with the housing 1 through the pressure plate 23, the air bag 24 and the air nozzles 25.
The above mechanism enables the piston 27 to be pushed when the air pressure in the lower half of the through hole 26 is increased, thereby enabling the cleaning liquid to be automatically fed into the interior of the housing 1.
As shown in fig. 4 and 5, in the present example, the rubber valve 29 is disposed on both the left and right sides of the top end of the through hole 26, the rubber valve 29 and the adjacent rubber valve 29 are attached to each other, the second mesh enclosure 32 is disposed on the outer side of the housing 1, the first mesh enclosure 31 is hinged to the rear side of the second mesh enclosure 32, and the movable plates 33 are slidably mounted in both the first mesh enclosure 31 and the second mesh enclosure 32.
Through the movable plates 33 slidably mounted in the first mesh enclosure 31 and the second mesh enclosure 32 on the device, the movable plate 33 is automatically pushed by the device when the first mesh enclosure 31 and the second mesh enclosure 32 are attached to each other, the front ends of the movable plates 33 protrude out of the right sides of the first mesh enclosure 31 and the second mesh enclosure 32, the first mesh enclosure 31 and the second mesh enclosure 32 are both connected with the movable plate 33 through the compression springs 37, when the movable plate 33 and the adjacent movable plate 33 are pressed against each other, the movable plate 33 can be retracted into the corresponding mesh enclosure, and the compression springs 37 facilitate automatic subsequent resetting of the movable plate 33.
As shown in fig. 5, 6 and 7, in this example, a guide frame 34 is fixedly disposed on the surface of the movable plate 33, an inner rod 35 is attached to the inside of the guide frame 34, a connecting pipe 36 is fixedly connected to the top end of the inner rod 35, the connecting pipe 36 is slidably connected to the first mesh enclosure 31, the connecting pipe 36 passes through the movable plate 33, the guide frame 34, the inner rod 35 and the first mesh enclosure 31 to form a telescopic structure, the connecting pipe 36 is equiangularly distributed inside the first mesh enclosure 31 and the second mesh enclosure 32, and the connecting pipe 36 and the rubber block 28 correspond to each other.
Through the connecting pipe 36 and the rubber block 28 which are corresponding to each other on the device, when two adjacent mesh enclosures on the device are attached to each other, the connecting pipe 36 can be pushed automatically, so that the cleaning liquid can automatically flow into the shell 1 through the connecting pipe 36.
The invention is a cleaning device for semiconductor etching, and the cleaning device comprises a silicon wafer, a motor 11, a connecting shaft 13, a fixed block 14, a connecting block 6, a sliding rod 7, a sliding groove 9, a magnetic plate 5, a magnetic block 3, a rotating block 2, an inner plate 4, a cleaning liquid and a cleaning liquid, wherein the silicon wafer is arranged on the surface of an inner circular ring 10 in an inverted mode, the motor 11 is fixed, the connecting shaft 13 and the fixed block 14 are driven to rotate through the motor 11, the fixed block 14 drives the magnetic plate 5 to rotate, the connecting block 6 and the sliding rod 7 slide in the sliding groove 9 in a supporting plate 8, so that the device can drive the magnetic block 3 in a shell 1 to rotate through the magnetic plate 5, the magnetic block 3 rotates in the shell 1 through the rotating block 2, the inner plate 4 rotates synchronously, the cleaning liquid in the shell 1 can be taken up to clean the silicon wafer when the inner plate 4 rotates, the cleaning liquid can be used for cleaning the silicon wafer, the surface damage caused by overlarge impact force can be avoided, and the safety during cleaning can be improved.
The device is at abluent in-process, the washing liquid can continuously splash into the inside of barrel 20 under the rotation of inner panel 4, after the inside of barrel 20 is filled up, folded plate 16 leads to the focus to move to the left because the increase of half part's quality on the left side, thereby make folded plate 16 and balancing weight 17 rotate, make depression bar 18 rotate to the left, and support driving block 12 through the front end of depression bar 18, make driving block 12 move down through gag lever post 21, spring 22 is compressed simultaneously, can compress tightly gasbag 24 through clamp plate 23 when gag lever post 21 moves down, make gasbag 24 pressurize to the latter half of through-hole 26 through air cock 25, make piston 27 move up, the washing liquid of the first half of through-hole 26 of treating of this moment can be when atmospheric pressure is enough big enough open rubber valve 29 automatically, make the washing liquid automatic change into the inside of shell 1, realize utilizing the function of useless washing liquid automatic change new washing liquid.
After the cleaning solution is replaced, the connecting pipes 36 on the first mesh enclosure 31 and the second mesh enclosure 32 can be aligned to the slots 30 on the rubber block 28, so that the device can automatically push the rubber block 28 open when in use, so that the device can supplement the cleaning solution in time, in the supplementing process, the movable plates 33 on the first mesh enclosure 31 and the second mesh enclosure 32 are mutually contacted and extruded into the corresponding mesh enclosures, the pressure springs 37 are compressed, the movable plates 33 drive the guide frames 34 to move, the inner rod 35 and the connecting pipes 36 simultaneously move towards the circle center, so that the connecting pipes 36 at all positions can be simultaneously extruded into the through holes 26 in the shell 1, and the function of automatically supplementing the cleaning solution is realized through the external water pipes at the tail ends of the connecting pipes 36.
While the invention has been described with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the various features of the disclosed embodiments of the invention may be used in any combination, provided that no structural conflict exists, and the combinations are not exhaustively described in this specification merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (3)
1. The utility model provides a belt cleaning device for semiconductor etching, includes shell (1), turning block (2) are installed in the inside rotation of shell (1), the fixed surface of turning block (2) is provided with magnetic path (3), the inside fixed inner panel (4) that are provided with of magnetic path (3), bearing board (8), its characterized in that have been placed to the top of shell (1): a magnetic plate (5) is arranged above the bearing plate (8), an inner circular ring (10) is fixedly arranged inside the bearing plate (8), a through hole (26) is formed inside the shell (1), an air nozzle (25) is arranged inside the through hole (26), an air bag (24) is connected below the air nozzle (25), a pressing plate (23) is arranged on the side surface of the air bag (24), the pressing plate (23) is connected with the transmission block (12) through a limiting rod (21), and the transmission block (12) is connected with the shell (1) through a spring (22);
the central axes of the shell (1), the rotating block (2), the magnetic block (3), the inner plate (4) and the magnetic plate (5) are on the same straight line, the rotating block (2), the magnetic block (3) and the inner plate (4) form a rotating structure with the shell (1) through the magnetic plate (5), and a groove (15) is formed in the shell (1);
a folded plate (16) is rotatably arranged in the groove (15), the front end of the folded plate (16) is fixedly connected with a balancing weight (17), the rear side of the folded plate (16) is fixedly provided with a cylinder body (20), and a pressure lever (18) is fixedly arranged above the folded plate (16);
the pressing rod (18) is in sliding connection with the shell (1), the transmission block (12) forms a sliding structure with the shell (1) through the pressing rod (18), the side face of the transmission block (12) is fixedly connected with the limiting rod (21), the transmission block (12) forms an elastic structure with the shell (1) through the limiting rod (21) and the spring (22), and an inner groove (19) is formed in the bottom of the shell (1);
the air bag (24) is positioned in the inner groove (19), the air nozzles (25) are distributed on the air bag (24) at equal angles, a rubber block (28) is arranged in the middle of the through hole (26), a cutting seam (30) is arranged in the middle of the rubber block (28), a piston (27) is arranged in the middle of the through hole (26), and the piston (27) forms a sliding structure with the shell (1) through the pressing plate (23), the air bag (24) and the air nozzles (25);
the left side and the right side of the top end of the through hole (26) are provided with rubber valves (29), the rubber valves (29) and adjacent rubber valves (29) are mutually attached, a second mesh enclosure (32) is arranged on the outer side of the shell (1), and the rear side of the second mesh enclosure (32) is hinged with a first mesh enclosure (31);
movable plates (33) are slidably mounted in the first mesh enclosure (31) and the second mesh enclosure (32), the front ends of the movable plates (33) protrude out of the right sides of the first mesh enclosure (31) and the second mesh enclosure (32), and the first mesh enclosure (31) and the second mesh enclosure (32) are connected with the movable plates (33) through compression springs (37);
the fixed surface of fly leaf (33) is provided with guide frame (34), the inside laminating of guide frame (34) is provided with interior pole (35), the top fixedly connected with connecting pipe (36) of interior pole (35), be sliding connection between connecting pipe (36) and first screen panel (31), constitute extending structure between connecting pipe (36) through fly leaf (33), guide frame (34) and interior pole (35) and first screen panel (31), connecting pipe (36) are in the inside equal angular distribution of first screen panel (31) and second screen panel (32), correspond mutually between connecting pipe (36) and rubber block (28).
2. The cleaning device for semiconductor etching processing according to claim 1, characterized in that: the magnetic plate is characterized in that connecting blocks (6) are fixedly arranged on the left side and the right side of the magnetic plate (5), sliding rods (7) are fixedly connected to the lower portions of the connecting blocks (6), and sliding grooves (9) used for the sliding rods (7) are formed in the surface of the supporting plate (8).
3. The cleaning apparatus for semiconductor etching processing according to claim 2, characterized in that: fixed block (14) are all installed in the laminating of both sides around magnetic sheet (5) top, fixed block (14) and adjacent fixed block (14) between fixed block (14) are fixed and are provided with connecting axle (13), the top of connecting axle (13) is provided with motor (11), the output shaft of motor (11) links to each other with connecting axle (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211300556.3A CN115365222B (en) | 2022-10-24 | 2022-10-24 | Cleaning device for semiconductor etching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211300556.3A CN115365222B (en) | 2022-10-24 | 2022-10-24 | Cleaning device for semiconductor etching |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115365222A CN115365222A (en) | 2022-11-22 |
| CN115365222B true CN115365222B (en) | 2023-02-28 |
Family
ID=84073348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211300556.3A Active CN115365222B (en) | 2022-10-24 | 2022-10-24 | Cleaning device for semiconductor etching |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113909198A (en) * | 2021-09-06 | 2022-01-11 | 邱献超 | Cleaning device for wafer semiconductor processing |
| CN114653660A (en) * | 2022-05-20 | 2022-06-24 | 智程半导体设备科技(昆山)有限公司 | Magnetic clamping block and semiconductor substrate cleaning device |
| CN114792642A (en) * | 2022-04-27 | 2022-07-26 | 安徽双迈新能源科技有限公司 | Semiconductor wafer processing belt cleaning device |
| CN114843212A (en) * | 2022-04-29 | 2022-08-02 | 浙江晶睿电子科技有限公司 | Multifunctional semiconductor cavity type processing equipment |
| CN114914182A (en) * | 2022-07-18 | 2022-08-16 | 浙江晶睿电子科技有限公司 | Silicon chip processing device for semiconductor packaging processing |
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| JP4441328B2 (en) * | 2004-05-25 | 2010-03-31 | 株式会社ルネサステクノロジ | Semiconductor device and manufacturing method thereof |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113909198A (en) * | 2021-09-06 | 2022-01-11 | 邱献超 | Cleaning device for wafer semiconductor processing |
| CN114792642A (en) * | 2022-04-27 | 2022-07-26 | 安徽双迈新能源科技有限公司 | Semiconductor wafer processing belt cleaning device |
| CN114843212A (en) * | 2022-04-29 | 2022-08-02 | 浙江晶睿电子科技有限公司 | Multifunctional semiconductor cavity type processing equipment |
| CN114653660A (en) * | 2022-05-20 | 2022-06-24 | 智程半导体设备科技(昆山)有限公司 | Magnetic clamping block and semiconductor substrate cleaning device |
| CN114914182A (en) * | 2022-07-18 | 2022-08-16 | 浙江晶睿电子科技有限公司 | Silicon chip processing device for semiconductor packaging processing |
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