CN115338502B

CN115338502B - Automatic PCB assembly system

Info

Publication number: CN115338502B
Application number: CN202211042555.3A
Authority: CN
Inventors: 李玉琼; 周强; 彭吉利
Original assignee: Shenzhen Xfanic Technology Co Ltd
Current assignee: Shenzhen Xfanic Technology Co Ltd
Priority date: 2022-08-29
Filing date: 2022-08-29
Publication date: 2023-12-12
Anticipated expiration: 2042-08-29
Also published as: CN115338502A

Abstract

The invention discloses an automatic assembly system of a PCB, which comprises: frame, material feeding unit, harba welding device, soldering device, point gum device and solidification equipment. When the PCB to be assembled is placed on the feeding device, the Haba welding treatment, the soldering treatment, the dispensing treatment and the solidification can be automatically carried out, the assembled PCB is obtained, and the working efficiency and quality control are improved.

Description

Automatic PCB assembly system

Technical Field

The invention relates to the technical field of mechanical automation, in particular to an automatic PCB assembly system.

Background

The PCB board (Printed Circuit Board ) is a support for the electronic components. The PCB preparation comprises a plurality of links including plug-in, welding, pin reduction, inspection and trimming. If the wire is used for welding the PCB, the welding process can further comprise the steps of Bama welding, tin soldering, dispensing, solidifying and the like.

At present, the welding process needs manual operation, and because the PCB is provided with a plurality of components, a great deal of time is required to be spent at the stage, the production efficiency is low, and the labor cost is high. Meanwhile, the manual operation has extremely high instability, so that the quality stability of the produced PCB is low and the quality control difficulty is high.

Disclosure of Invention

The invention aims to solve the technical problems of low assembly efficiency of a PCB and provides an automatic assembly system of the PCB aiming at the defects of the prior art.

In order to solve the technical problems, the technical scheme adopted by the invention is as follows:

a PCB board automatic assembly system, the system comprising:

the PCB automatic assembly system comprises a rack, a feeding device, a Haba welding device, a soldering device, a dispensing device and a curing device;

the Haba welding device comprises a Haba welding bracket, a Haba welding moving mechanism arranged on the Ha Ba welding bracket, and a Haba welding head fixedly connected with the Ha Ba welding moving mechanism, wherein the Ha Ba welding moving mechanism drives the Haba welding head to move;

the soldering device comprises a soldering support, a soldering moving mechanism arranged on the soldering support and a soldering head fixedly connected with the soldering moving mechanism, wherein the soldering moving mechanism drives the soldering head to move;

the dispensing device comprises a dispensing bracket, a dispensing moving mechanism arranged on the dispensing bracket and a dispensing head fixedly connected with the dispensing moving mechanism, wherein the dispensing moving mechanism drives the dispensing head to move;

the curing device comprises a curing bracket and a curing lamp fixedly connected with the curing bracket;

the Haba welding device, the soldering device, the dispensing device and the curing device are arranged on the frame and are positioned beside the feeding device, and are sequentially distributed along the extending direction of the feeding device;

when the feeding device transmits the PCB to be assembled, the Haba welding device performs Haba welding on the PCB, the soldering device performs soldering on the PCB, the dispensing device performs dispensing on the PCB, and the curing device performs curing on the PCB to obtain the assembled PCB.

The PCB automatic assembly system comprises a rack, a feeding device, a Haba welding device, a soldering device and a dispensing device, wherein the rack comprises a plurality of fixed bases and a hood;

the hood is located above the fixed base and used for accommodating the Haba welding device, the soldering device, the dispensing device and/or the curing device.

The PCB automatic assembly system comprises a feeding device, a positioning device and a positioning device, wherein the feeding device comprises a Haba welding transmission track, a soldering transmission track and a dispensing transmission track;

the input end of the Ha Ba welding transmission rail is arranged at the first end part of the fixed base;

the input end of the soldering transmission track is adjacent to the output end of the Ha Ba soldering transmission track;

the input end of the dispensing transmission rail is adjacent to the output end of the soldering transmission rail;

the output end of the dispensing transmission track is arranged at the second end part of the fixed base.

The automatic PCB assembly system comprises a Habar welding device, a PCB assembly device and a PCB assembly device, wherein the Habar welding device comprises a positive Ha Ba welding module and a negative Habar welding module;

the front Haba welding module is arranged on the fixed base, and the back Haba welding module is arranged in the fixed base;

the front Haba welding module comprises a first bracket arranged on the surface of the fixed base and beside the feeding device, and a first moving mechanism arranged on the first bracket, and a first welding head fixedly connected with the first moving mechanism and facing the surface of the fixed base, wherein the first moving mechanism drives the first welding head to move;

the anti-Haba welding module comprises a second support arranged in the fixed base, and a second moving mechanism arranged on the second support, and a second welding head fixedly connected with the second moving mechanism and facing to the surface of the fixed base, wherein the second moving mechanism drives the second welding head to move.

The PCB automatic assembly system comprises a first left-right moving module for driving the first welding head to move left and right, a first front-back moving module for driving the first welding head to move back and forth, and a first up-down moving module for driving the first welding head to move up and down;

the second moving mechanism comprises a second left-right moving module for driving the second welding head to move left and right, a second front-back moving module for driving the second welding head to move back and forth, and a second up-down moving module for driving the second welding head to move up and down.

The automatic PCB assembly system comprises a soldering support, a soldering head, a first front-back moving module, a second left-right moving module and a third up-down moving module, wherein the soldering support is fixedly connected with the soldering support and drives the soldering head to move back and forth, the second front-back moving module is in sliding fit with the soldering head and drives the soldering head to move left and right, and the third up-down moving module is in sliding fit with the second left-right moving module and drives the soldering head to move up and down.

The PCB board automatic assembly system, wherein, the point is glued moving mechanism and is included the drive the first movable third of controlling of dispensing is moved about the module, drive the first back-and-forth movement of dispensing is moved about the third, and drive the first up-and-down movement of dispensing is moved about the third.

The PCB automatic assembly system further comprises a reflux device which is arranged in parallel with the feeding device;

the Haba welding device, the soldering device, the dispensing device and the curing device are arranged on the frame and located at the side of the feeding device and the side of the reflow device, and are sequentially distributed along the extending direction of the feeding device.

The PCB automatic assembly system comprises a belt framework, a transmission belt, a driving wheel and driven wheels, wherein the belt framework is arranged at intervals, the transmission belt is sleeved on the belt framework, the driving wheel is arranged below the belt framework, the driven wheels are arranged on two sides of the belt framework, and the driving wheel drives the transmission belt and the driven wheels to rotate along the extending direction of the feeding device;

the system also comprises a turnover mechanism, wherein the turnover mechanism comprises a turnover bracket, a turnover shaft arranged on the turnover bracket and a clamping piece in turnover connection with the turnover shaft;

the turnover mechanism is arranged in the fixed base, and the clamping piece is located in a spacing area between the belt frameworks.

The PCB automatic assembly system comprises a positive curing bracket, a positive curing lamp fixedly connected with the positive curing bracket, a negative curing bracket and a negative curing lamp fixedly connected with the negative curing bracket, wherein the positive curing lamp is fixedly connected with the negative curing bracket;

the positive curing bracket and the negative curing bracket are arranged on the fixed base;

the positive curing lamp set up in interval region top between the belt skeleton, the reverse curing lamp with the positive curing lamp sets up relatively and is located interval region's below.

The beneficial effects are that: the PCB automatic assembly system comprises a frame, a feeding device, a Haba welding device, a soldering device, a dispensing device and a curing device, wherein the feeding device, the Haba welding device, the soldering device, the dispensing device and the curing device are arranged on the frame. The Haba welding device, the soldering device, the dispensing device and the curing device are sequentially arranged beside the feeding device. The Haba welding device, the soldering device and the glue dispensing device all comprise a bracket, a moving mechanism and a welding head/glue dispensing head, when a PCB to be assembled passes through, haba welding, soldering, glue dispensing and solidification are sequentially and automatically realized, so that after the PCB to be assembled is placed on a feeding device, manual operation is not needed, the output of a finished product is automatically finished at an output end, the labor cost is reduced, the automation degree of production is improved, the production efficiency is improved, and the stability of the product is also improved.

Drawings

Fig. 1 is an overall structure diagram of an automatic assembly system for a PCB board provided by the present invention.

Fig. 2 is a schematic structural diagram of a whole feeding device of the automatic PCB board assembly system provided by the invention.

Fig. 3 is a schematic structural diagram of a positive Ha Ba solder module of the automatic PCB assembly system provided by the invention.

Fig. 4 is a schematic structural diagram of a first moving mechanism of the automatic PCB assembly system provided by the present invention.

Fig. 5 is a schematic structural diagram of a positive Ha Ba solder module and a negative harba solder module of the automatic PCB board assembly system provided by the invention.

Fig. 6 is a schematic structural diagram of an upper and lower positioning module of the automatic PCB assembly system provided by the present invention.

Fig. 7 is a schematic structural diagram of a soldering device of the automatic PCB assembly system provided by the invention.

Fig. 8 is a partial enlarged view of the area a in fig. 7.

Fig. 9 is a schematic structural diagram of a dispensing device of the automatic PCB assembly system provided by the invention.

Fig. 10 is a partial enlarged view of a region B in fig. 9.

Fig. 11 is a partial enlarged view of the area C in fig. 9.

Fig. 12 is a schematic structural diagram of a turnover mechanism of the automatic PCB assembly system provided by the present invention.

Fig. 13 is a schematic structural diagram of a curing device of the automatic PCB assembly system provided by the invention.

Fig. 14 is a schematic structural diagram of a soldering transmission track of the automatic PCB assembly system provided by the present invention.

Identification description:

10c, a hood; 10a, opening the box body; 10b, a movable box body; 20, a feeding device; 20a, harba welding transmission tracks; 20b, soldering the transmission track; 20c, a belt framework; 20d, a transmission belt; 20e, driving wheels; 20f, driven wheel; 20h, clamping; 30, a Haba welding device; 30a, a harba welding bracket; 30b, an inductor; 30d, a positive Ha Ba welding module; 31d, a first bracket; 32d, a first left-right moving module; 32g, first left-right moving unit; 32h, a first support cover; 32e, a first front-back moving module; 32i, a first front-rear moving unit; 32j, a second support housing; 32f, a first up-down moving module; 32k, a first up-down moving unit; 32l, moving the fixed cover; 33g, a first welding head; 30e, a reverse Habar welding module; 31e, a second bracket; 31f, a second left-right moving unit; 31g, a second front-rear moving unit; 31h, a second up-down moving unit; 31k, a second welding head; 30c, a Haba welding positioning mechanism; 34a, up-down positioning units; 34b, a fixing plate; 34c, limiting plates; 34d, through holes; 34e, an active area; 34f, front-rear positioning units; 34g, left and right positioning units; 34h, positioning the plate; 30f, cooling the air blowing pipe; 40, a soldering device; 40a, soldering a bracket; 40b, a third front-rear moving unit; 40c, soldering the belt track; 40d, soldering the sliding rail; 40e, limiting the block; 40f, soldering the protective cover; 40g, a third left-right moving module; 40h, a third up-down moving module; 40i, tin soldering head; 40j, a soldering positioning mechanism; 50, a dispensing device; 50a, a third left-right moving unit; 50b, a fourth support housing; 50c, a third front-rear moving unit; 50d, a first belt track; 50e, a first sliding track; 50f, a third up-down moving unit; 50g, a second belt track; 50h, a second sliding rail; 50i, a second connector; 50j, dispensing heads; 60, a curing device; 60a, curing the scaffold; 60b, a positive curing lamp; 60c, reversely solidifying the bracket; 60d, a reverse solidification lamp; 70, a reflow device; 80, a turnover mechanism; 80a, turning over the bracket; 80b, turning the shaft; 80c, clamping member.

Detailed Description

The invention provides an automatic assembly system for a PCB, which is used for making the purposes, the technical scheme and the effects of the invention clearer and more definite, and is further described in detail below by referring to the accompanying drawings and the embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.

As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless expressly stated otherwise, as understood by those skilled in the art. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. The term "and/or" as used herein includes all or any element and all combination of one or more of the associated listed items.

It will be understood by those skilled in the art that all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs unless defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

As shown in fig. 1, the present embodiment provides an automatic PCB board assembly system, which includes a frame, a feeding device 20, a haba welding device 30, a soldering device 40, a dispensing device 50, and a curing device 60. Hereinafter, "front" and "rear" refer to "front" and "rear" with respect to the operation of an operator or viewing the assembly situation, and "left" refers to the direction as the assembly starting point, and "right" refers to the direction of the assembly ending point with respect to the assembly starting point, and "up" and "down" refer to the relative concept of height with respect to the ground, so that the concept of azimuth such as "up" and "down" can be changed according to different needs, and is not limited to the azimuth words adopted in the present scheme.

The frame is used for accommodating the Habar welding device 30, the soldering device 40, the glue dispensing device 50 and the curing device 60. The frame comprises a plurality of fixed bases and a hood 10c, wherein the fixed bases are mainly used for providing support for devices such as the Habar welding device 30, and the hood 10c is mainly used for providing protection for the Habar welding device 30 and the like and is relatively isolated from the outside. In addition, a fan can be arranged in the fixed base so as to reduce the temperature in the frame.

As shown in fig. 1, the fixed base may be an open box 10a, mainly providing support for the start end of the transmission device; the stationary base may also include a movable case 10b having a movable door. Since the haba welding device 30 and the soldering device 40 are closely spaced, they may be disposed adjacent to each other and supported by the first movable case 10b. The second movable case 10b is for supporting the dispensing device 50 and the curing device 60. The fans may be disposed in the first movable case 10b and the second movable case 10b. Outside the harba welding device 30, the soldering device 40, the dispensing device 50 and the curing device 60, a hood 10c may be provided to protect the safe operation of these devices.

The feeding device 20 is used for conveying the PCB to be assembled, and for convenience of description, the left side is defined as the starting side of the feeding device 20, and the extending direction of the feeding device 20 is from left to right. The feeder 20 may employ a single elongated feed rail or may employ multiple sections of feed rails. According to different functions, the feeding device 20 may be divided into a haba welding transmission track 20a, a soldering transmission track 20b and a dispensing transmission track. The input end of the Ha Ba welding transmission rail 20a is arranged at the first end of the fixed base; the input end of the soldering transmission track 20b is adjacent to the output end of the Ha Ba soldering transmission track 20 a; the input end of the dispensing transmission track is adjacent to the output end of the soldering transmission track 20 b; the output end of the dispensing transmission track is arranged at the second end part of the fixed base.

In the first clock feeding apparatus 20 of the present embodiment, the feeding apparatus 20 may be a conventional belt conveyor. However, the belt conveyor can only process one side at a time, and two times of conveying are required or normal processing is realized by other structures, so in the second feeding device 20 of this embodiment, as shown in fig. 2, in order to facilitate processing of samples to be processed on the upper and lower sides, the feeding device 20 includes a belt frame 20c arranged at intervals, a conveying belt 20d sleeved on the belt frame 20c, a driving wheel 20e disposed below the conveying belt 20d, and driven wheels 20f disposed on both sides of the belt frame 20 c. The driving wheel 20e drives the transmission belt 20d and the driven wheel 20f to rotate along the extending direction of the feeding device 20, the driving wheel 20e rotates to drive the transmission belt 20d to move, and the driven wheel 20f rotates to control the movement of the transmission belt 20d along with the movement of the transmission belt 20 d. The PCB board to be assembled spans the two belt skeletons 20c to complete the transportation of the PCB board. If the PCB to be assembled is smaller, the PCB can be placed on the clamp 20h to increase the size, facilitate assembly, or adjust the interval between the belt frameworks 20c to make the distance between the belt frameworks 20c larger than the width of the PCB to be processed.

The Haba welding device 30 is used for welding objects to be welded on the PCB board, so as to achieve the purposes of light weight, thinness, shortness and smallness. The Habar welding device 30 comprises a Habar welding support 30a, a Habar welding moving mechanism arranged on the Ha Ba welding support 30a, and a Habar welding head fixedly connected with the Ha Ba welding moving mechanism, wherein the Ha Ba welding moving mechanism drives the Habar welding head to move.

As shown in fig. 3 to 5, the hash soldering device 30 may perform hash soldering from above the PCB, or may perform hash soldering from below the PCB. Therefore, the harba welding device 30 includes a positive Ha Ba welding module 30d and/or a negative harba welding module 30e depending on whether the harba welding device 30 is located above or below the PCB. The positive Ha Ba welding module 30d is used for performing Habar welding on the PCB from above and is arranged on the surface of the fixed base; the anti-harba welding module 30e performs harba welding on the PCB from below, so that the anti-harba welding module is installed in the fixed base.

The positive Ha Ba welding module 30d comprises a first bracket 31d arranged on the surface of the fixed base and beside the feeding device 20, and a first moving mechanism arranged on the first bracket 31d, and a first welding head 33g fixedly connected with the first moving mechanism and facing the surface of the fixed base, wherein the first moving mechanism drives the first welding head 33g to move. The anti-harba welding module 30e comprises a second bracket 31e arranged in the fixed base, and a second moving mechanism arranged on the second bracket 31e, and a second welding head 31k fixedly connected with the second moving mechanism and facing the surface of the fixed base, wherein the second moving mechanism drives the second welding head 31k to move.

The first moving mechanism and the second moving mechanism can adopt a combination of various moving elements to realize movement in multiple directions. For example, in fig. a (haba welding moving mechanism), the first moving mechanism may include a first left-right moving module 32d that drives the first welding head 33g to move left-right, a first front-rear moving module 32e that drives the first welding head 33g to move front-rear, and a first up-down moving module 32f that drives the first welding head 33g to move up-down. Similarly, the second moving mechanism includes a second left-right moving module that drives the second welding head 31k to move left-right, a second front-back moving module that drives the second welding head 31k to move back-forth, and a second up-down moving module that drives the second welding head 31k to move up-down.

The object of connection between the respective modules of the first moving mechanism/second moving mechanism may be arbitrarily selected as long as it can drive the first welding head 33 g/second welding head 31k to move. In this embodiment, in the first moving mechanism, the first left-right moving module 32d is disposed on the Ha Ba welding frame 30a and is disposed parallel to the feeding device 20, the first front-back moving module 32e is slidably connected above the first left-right moving module 32d, the first front-back moving module 32e is disposed in a direction perpendicular to an extending direction of the feeding device 20, and the first up-down moving module 32f is slidably connected in a direction approaching the feeding device 20 in the first front-back moving module 32 e. Further, the first left-right moving module 32d may include a first left-right moving unit 32g disposed on the first bracket 31d and sliding left-right, and a first supporting cover 32h fixedly connected to the first left-right moving unit 32 g. The first back-and-forth movement module 32e includes a first back-and-forth movement unit 32i provided on the first support cover 32h and sliding back and forth, and a second support cover 32j fixedly linked with the first back-and-forth movement unit 32 i. The first up-and-down moving module 32f includes a first up-and-down moving unit 32k provided on a side of the second support cover 32j close to the feeding device 20 and sliding up and down, and a first welding head 33g provided on a side of the first up-and-down moving unit 32k close to the feeding device 20. When the first horizontal moving unit 32g slides, the first front-rear unit is driven to move horizontally based on the first supporting cover 32h, and at the same time, the first vertical moving unit 32k also moves vertically, thereby driving the first welding head 33g to move horizontally. To fix the movement of the first up-down moving unit 32k, a moving fixing cover 32l may be provided outside the first up-down moving unit 32 k.

In the second moving mechanism, a second left-right moving module is disposed on the Ha Ba welding frame 30a and is disposed parallel to the feeding device 20, the second front-back moving module is slidably connected above the second left-right moving module, the second front-back moving module is disposed in a direction perpendicular to an extending direction of the feeding device 20, and the second front-back moving module is slidably connected in a direction approaching the feeding device 20 in the second front-back moving module. Further, the second left-right moving module may include a second left-right moving unit 31f disposed on the second bracket 31e and sliding left-right, and a third supporting cover fixedly connected to the second left-right moving unit 31 f. The second back and forth movement module includes a second back and forth movement unit 31g provided on the third support housing and sliding back and forth, and a fourth support housing 50b fixedly linked with the second back and forth movement unit 31 g. The second up-and-down moving module includes a second up-and-down moving unit 31h provided in the fourth supporting cover 50b near the feeding device 20 and sliding up and down, and a second welding head 31k provided in the second up-and-down moving unit 31h near both sides of the feeding device 20. When the second left-right moving unit 31f slides, the second front-rear unit is driven to move left and right based on the fourth supporting cover 50b, and at the same time, the second up-down moving unit 31h also moves up and down, thereby driving the second welding head 31k to move left and right. Each of the moving units in the moving mechanism may employ a structural member that can be pushed to operate, such as an air cylinder.

In addition, in order to detect whether the PCB enters the working range of the haba welding device 30, an inductor 30b may be disposed on the haba welding bracket 30a to monitor the entering of the PCB. After the harba welding head is heated and then welded, the welding head needs to be eaten up without heating and is rapidly cooled, so that the upper harba welding device 30 further comprises a cooling air blowing pipe 30f. Because the harba welding head can move, in order to cool in time after welding, the cooling blowpipe 30f is fixedly connected with the moving mechanism. Specifically, in the present embodiment, the haba horn is fixedly connected to the first up-down moving unit 32 k. In order to fix the passing PCB board for soldering, the haba soldering device 30 further includes a haba soldering positioning mechanism 30c, and the haba soldering positioning mechanism 30c can fix the passing PCB board in front-back and left-right directions, so as to ensure that no displacement occurs in the haba soldering process. The haba welding positioning mechanism 30c may include an up-down positioning module, a front-back positioning module and a left-right positioning module, where the up-down positioning module is used for fixing the position of the PCB in the up-down direction, the front-back positioning module is used for fixing the position of the PCB in the front-back direction, and the left-right positioning module is used for fixing the position of the PCB in the left-right direction.

For example, as shown in fig. 6, in this embodiment, the upper and lower positioning module includes an upper and lower positioning unit 34a, a fixing plate 34b fixedly connected to the upper and lower positioning unit 34a, and a limiting plate 34c disposed on the upper and lower positioning unit 34a and spaced from the fixing plate 34 b. The limiting plate 34c is provided with a through hole 34d corresponding to the upper and lower positioning units 34a and a movable area 34e corresponding to the Ha Ba welding head, so that the Habar welding head only moves in the movable area 34e, and the left and right positioning modules and the front and rear positioning modules are arranged below the limiting plate 34c. The front-rear positioning unit 34f includes a plurality of front-rear positioning units 34f, the front-rear positioning units 34f may be located in the same direction of the active area 34e, or may be located in two directions, and the left-right positioning module includes a positioning plate 34h located on the left side of the active area 34e, and a left-right positioning unit 34g located on the right side of the active area 34 e. When the PCB passes, the left and right positioning units 34g and 34h may be fixed in the left and right direction of the PCB, the front and rear positioning units 34f are fixed in the front and rear direction of the PCB, and the upper and lower positioning units 34a fix the PCB in the up and down direction through the through holes 34 d.

The soldering device 40 is used for soldering a PCB to be assembled, and specifically comprises a soldering support 40a, a soldering moving mechanism arranged on the soldering support 40a, and a soldering head 40i fixedly connected with the soldering moving mechanism, wherein the soldering moving mechanism drives the soldering head 40i to move. The structure of the soldering apparatus 40 may be similar to that of the haba soldering apparatus 30.

In addition, as shown in fig. 7 to 8, in the present embodiment, the soldering apparatus 40 may adopt a different mechanism from the haba soldering apparatus 30. The soldering rack 40a includes a fixing rack and a soldering slide rail disposed on the fixing rack, and an extending direction of the soldering slide rail is perpendicular to an extending direction of the feeding device 20. The soldering moving mechanism comprises a third left-right moving module 40g which is in sliding fit with the soldering sliding rail, and a third which is in sliding fit with the third left-right moving module 40 g. And the third middle part is fixedly connected with a tin soldering head 40i near the feeding device 20 side. The third left-right moving module 40g can slide back and forth on the soldering slide rail and drive the third to slide up and down, and the side, close to the feeding device 20, of the third is fixedly connected with a soldering head 40i. In order to fix the passing PCB, a soldering positioning mechanism 40j is further provided on the soldering transmission track 20b, and when the passing PCB is detected, the soldering positioning mechanism 40j is started to fix the PCB.

In one possible structure of the soldering support 40a, the soldering moving mechanism includes a third front-back moving module fixedly connected to the soldering support 40a and driving the soldering head 40i to move back and forth, a third left-right moving module 40g slidably engaged with the third front-back moving module and driving the soldering head 40i to move left and right, and a third up-down moving module 40h slidably engaged with the third left-right moving module 40g and driving the soldering head 40i to move up and down.

For the sliding fit between the moving modules, as shown in fig. 7 and 8, taking a third back-and-forth moving module as an example, the third back-and-forth moving module includes a third back-and-forth moving unit 50c40b disposed on the soldering support 40a, a soldering belt track 40c in transmission connection with the third back-and-forth moving unit 50c40b, and a soldering sliding track 40d disposed on the soldering support 40a and parallel to the soldering belt track 40c, wherein the direction of the soldering belt track 40c is perpendicular to the extending direction of the feeding device 20, and the third left-and-right moving module 40g is in sliding fit with the soldering sliding track 40d and in transmission connection with the soldering belt track 40 c. When the third back-and-forth moving unit 50c40b moves, the belt of the driving belt is driven to rotate, so that the third back-and-forth moving module is driven to move between being far from the feeding device 20 and being close to the feeding device 20 by means of the soldering sliding rail 40 d. In addition, two third front-back moving modules may be provided, which are respectively disposed at two sides of the soldering support 40a, so as to improve the support of the third left-right moving module 40g and the third up-down moving module 40h. Meanwhile, in order to restrict movement of the third left-right movement module 40g, stoppers 40e are provided at both ends of the soldering sliding rail 40 d. To protect the third back and forth movement module, the soldering support 40a may further include a soldering protecting cover 40f to protect the operation of the soldering belt track 40c and the soldering sliding track 40 d. The third left-right moving means may be connected to the soldering belt track 40c by a clamping structure.

When the PCB to be assembled enters the area corresponding to the soldering device 40, the soldering head 40i is moved to a preset soldering position (i.e. a position where soldering is required in the PCB) based on the soldering moving mechanism, and then soldering is performed, after the soldering is finished, the soldering moving mechanism lifts up the soldering head 40i, and the feeding device 20 transports the soldered PCB to the next stage.

The dispensing device 50 is used for dispensing a PCB to be assembled, and comprises a dispensing bracket, a dispensing moving mechanism arranged on the dispensing bracket, and a dispensing head 50j fixedly connected with the dispensing moving mechanism, wherein the dispensing moving mechanism drives the dispensing head 50j to move. The dispensing device 50 may also take a similar configuration as the harba welding device 30 or the soldering device 40.

As shown in fig. 9 to 11, the dispensing moving mechanism may include a third left-right moving module 40g for driving the dispensing head 50j to move left and right, a third front-back moving module for driving the dispensing head 50j to move back and forth, and a third up-down moving module 40h for driving the dispensing head 50j to move up and down. The third left-right moving module 40g includes a third left-right moving unit 50a, a fourth supporting cover 50b fixedly linked with the third left-right moving unit 50a, and a third back-and-forth moving module includes a third back-and-forth moving unit 50c40b disposed on the fourth supporting cover 50b, a first belt track 50d drivingly connected with the third back-and-forth moving unit 50c40b and disposed on the first supporting cover 32h, a first sliding track 50e disposed on the fourth supporting cover 50b, and a first connecting member drivingly engaged with the first belt track 50d and slidably engaged with the first sliding track 50 e. The third up-down moving module 40h includes a third up-down moving unit 50f, a second belt track 50g connected with the third moving unit in a transmission manner and disposed on the first connecting piece, and a second sliding track 50h disposed on the first connecting piece, a second connecting piece 50i connected with the second belt track 50g in a transmission manner and in sliding fit with the second sliding track 50h, and a dispensing head 50j disposed on one side of the second connecting piece 50i, which is close to the feeding device 20. The operation principle of the third left-right moving module 40g, the third front-rear moving module and the third up-down moving module 40h is described in the soldering apparatus 40 and the haba soldering apparatus 30, and thus is not described one by one. In order to protect the operation of the mobile modules, a cover may also be provided for each mobile module.

When the PCB to be dispensed enters the range of the dispensing device 50, the dispensing head 50j is moved to a preset dispensing position (namely, the position where the point is required to be glued in the PCB) based on the dispensing moving mechanism, then dispensing is performed, and after the dispensing is finished, the dispensing moving mechanism lifts the dispensing head 50j so that the feeding device 20 can send the PCB to the next process.

It should be noted that, although the front and back sides of the PCB board need to be glued, the difficulty of dispensing from the back side is high, so, in order to reduce the difficulty of dispensing, as shown in fig. 12, in this embodiment, the system further includes a flipping mechanism, which includes a flipping bracket 80a, a flipping shaft 80b disposed on the flipping bracket 80a, and a clamping member 80c that is in flipping connection with the flipping shaft 80 b. Since the feeding device 20 employed in the present embodiment includes the belt frames 20c arranged at intervals, the holding members 80c of the inverting mechanism can be located at the interval regions between the belt frames 20 c. When the PCB enters the range of the holding member 80c, the holding member 80c holds the PCB and turns the turning shaft 80b over based on the turning connection with the turning shaft 80b, turning the PCB upward from the front to the back.

After dispensing, curing is required to solder the dispensed component to the PCB, and the curing device 60 includes at least a curing bracket and a curing light connected to the curing bracket. In order to cure the printed circuit board after dispensing as soon as possible, as shown in fig. 13, the curing device 60 in this embodiment includes a positive curing bracket 60a, a positive curing lamp 60b fixedly connected with the positive curing bracket 60a, a negative curing bracket 60c, and a negative curing lamp 60d fixedly connected with the negative curing bracket 60 c. The positive curing bracket 60a and the negative curing bracket 60c are disposed on the fixing base, but the height of the positive curing bracket 60a is greater than that of the negative curing bracket 60c, so that the positive curing lamp 60b is disposed above the interval area between the belt frames 20c, and the negative curing lamp 60d is disposed opposite to the positive curing lamp 60b and below the interval area. As shown in fig. 12, the positive curing bracket 60a is L-shaped, one end of which is fixedly connected to the support base, and the other end of which is fixedly connected to the positive curing lamp 60 b. When the PCB to be assembled passes through the curing bracket, the positive curing lamp 60b and the negative curing lamp 60d cure the PCB after the adhesive is dispensed from the positive and negative sides, and the assembly of the PCB is completed. The curing lamp may be a UV lamp or the like.

After the assembly is completed, the PCB reaches the output end of the feeding device 20, and at the moment, a inspector can stand at the position of the output end to detect whether the assembled PCB is qualified or not, and if the assembled PCB is not qualified, the assembled PCB needs to be sent back to the input end of the feeding device 20, and then the assembled PCB enters the assembly flow again. For the convenience of the reflow of the PCB board, as shown in fig. 14, the system further includes a reflow device, which is parallel to the feeding device 20, and the haba solder device 30, the soldering device 40, the glue dispensing device 50 and the curing device 60 are all disposed on the frame and located at the lateral sides of the feeding device 20 and the reflow device, and are sequentially arranged along the extending direction of the feeding device 20. The reflow apparatus may be a conventional belt conveyor.

The whole process can realize the automatic assembly of the PCB by only placing the PCB or the clamp 20h provided with the PCB on the feeding device 20, is simple and convenient, reduces the labor cost and is easier to control.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. The automatic PCB assembly system is characterized by comprising a rack, a feeding device, a Haba welding device, a soldering device, a dispensing device and a curing device;

an inductor is arranged on the Ha Ba welding bracket and used for monitoring the entering of the PCB;

the Haba welding device also comprises a cooling air blowing pipe; the cooling air blowing pipe is fixedly connected with the Haba welding moving mechanism;

the Haba welding device also comprises a Haba welding positioning mechanism, wherein the Ha Ba welding positioning mechanism is used for fixing the passing PCB in the front-back direction and the left-right direction;

the Ha Ba welding positioning mechanism further comprises an upper positioning module, a lower positioning module, a front positioning module, a rear positioning module and a left positioning module, wherein the upper positioning module and the lower positioning module are used for fixing the position of the PCB in the upper-lower direction, the front positioning module and the rear positioning module are used for fixing the position of the PCB in the front-rear direction, and the left positioning module and the right positioning module are used for fixing the position of the PCB in the left-right direction;

the frame comprises a plurality of fixed bases and a hood, and the feeding device, the Haba welding device, the soldering device and the adhesive dispensing device are arranged on the fixed bases;

the Habar welding device comprises a positive Ha Ba welding module and a negative Habar welding module;

the anti-Haba welding module comprises a second bracket arranged in the fixed base and a second moving mechanism arranged on the second bracket, and a second welding head fixedly connected with the second moving mechanism and facing the surface of the fixed base, wherein the second moving mechanism drives the second welding head to move;

2. The automated PCB assembly system of claim 1 wherein,

3. The automatic PCB assembly system of claim 2, wherein the feeding device comprises a harba welding transmission rail, a soldering transmission rail, a dispensing transmission rail;

4. The automatic PCB assembly system of claim 2, wherein the first moving mechanism includes a first left-right moving module that drives the first soldering tip to move left-right, a first front-back moving module that drives the first soldering tip to move back-forth, and a first up-down moving module that drives the first soldering tip to move up-down;

5. The automatic assembly system of claim 1, wherein the soldering moving mechanism comprises a third front-back moving module fixedly connected with the soldering support and driving the soldering head to move back and forth, a third left-right moving module slidingly matched with the third front-back moving module and driving the soldering head to move left and right, and a third up-down moving module slidingly matched with the third left-right moving module and driving the soldering head to move up and down.

6. The automatic assembly system of claim 1, wherein the dispensing movement mechanism comprises a third left-right movement module for driving the dispensing head to move left-right, a third front-back movement module for driving the dispensing head to move back-forth, and a third up-down movement module for driving the dispensing head to move up-down.

7. The automated PCB assembly system of claim 1, further comprising a reflow device disposed parallel to the feed device;

8. The automatic PCB assembly system according to claim 1, wherein the feeding device comprises a belt framework, a transmission belt sleeved on the belt framework, a driving wheel arranged below the belt framework and driven wheels arranged on two sides of the belt framework, wherein the driving wheel drives the transmission belt and the driven wheels to rotate along the extending direction of the feeding device;

9. The automatic PCB assembly system of claim 8, wherein the curing device comprises a positive curing bracket, a positive curing lamp fixedly connected to the positive curing bracket, a negative curing bracket, and a negative curing lamp fixedly connected to the negative curing bracket;