CN115334815A

CN115334815A - Ultrahigh-density MPO/MTP case applied to data center

Info

Publication number: CN115334815A
Application number: CN202211040014.7A
Authority: CN
Inventors: 武银锋; 徐汝杰; 龚婧瑶; 康秀杰; 韦龙春
Original assignee: Kelang Photoelectric Technology Changzhou Co ltd
Current assignee: Kelang Photoelectric Technology Changzhou Co ltd
Priority date: 2022-08-29
Filing date: 2022-08-29
Publication date: 2022-11-11

Abstract

The invention discloses an ultrahigh-density MPO/MTP chassis applied to a data center, which comprises a 1U chassis, wherein the front end of the 1U chassis is provided with two groups of MPO adapter installation channels and two groups of LC adapter installation channels, each group of MPO adapter installation channels comprises 8 MPO adapter installation channels, each group of LC adapter installation channels comprises 8 LC adapter installation channels, MPO adapters are installed in the MPO adapter installation channels, 8 LC adapters are installed in the LC adapter installation channels, and the 8 LC adapters are connected with the MPO adapters through MPO-LC jumper wires. The MPO and LC wiring of the device is in one direction, and the whole circuit is attractive after construction is finished; the operation and construction are convenient, and the deployment efficiency is high; the ultra-high density is suitable for ultra-high density wiring, compared with the traditional 96 cores, the density is 1/128, the density is increased by 33.3%, and the single line space is reduced by 33.3%.

Description

Ultrahigh-density MPO/MTP case applied to data center

Technical Field

The invention relates to the technical field of MPO/MTP cabinets, in particular to an ultrahigh-density MPO/MTP cabinet applied to a data center.

Background

Through the development of over 20 years, the optical fiber connector has been developed from the original large size, difficult installation and low cost performance to the current small size, easy installation and excellent cost performance. In recent years, a 1U MPO/MTP chassis is applied to an optical fiber circuit environment which needs high-density integration, such as optical fiber backbone connection and wiring unit management in a wiring area of a large-scale data center machine room, and realizes the connection of transmitting and receiving optical modules, such as 40/100G QSFP and the like. The MPO/MTP preterminals and MPO/MTP adapter panels can be configured to be installed in 19-inch racks and cabinets. MPO/MTP optical fiber is specifically practiced in an optical fiber communication system of a dense wiring system between buildings, optical link interconnection in local area network wiring optical active equipment, optical fiber wiring in a communication base station, an industrial park machine room, a commercial building machine room, a cable television network, a telecommunication network Local Area Network (LAN), a Wide Area Network (WAN) and connection of optical fiber to a desktop (FTTX) optical signal. The related products at present have the following defects: 1. maximum configuration is only 96 cores; 2. MPO and LC wiring are arranged in the front and back directions, and the whole circuit is not attractive after construction is finished; 3. the operation and construction are inconvenient, the wiring of the panel needs to be dismantled from the back, the deployment efficiency is not high, and the operation difficulty is increased; 4. when the system is manufactured in a factory, the LC adapters only with 2 channels are installed at one time, and the production efficiency of enterprise products is not high; 5. the method is not suitable for ultrahigh density connection, and the single line density is 1/96 of 1U; 6. the whole product has a complex structure and needs to be provided with a single MPO matching box.

Disclosure of Invention

The invention aims to provide an ultrahigh-density MPO/MTP chassis applied to a data center so as to solve the problems mentioned in the background technology. In order to achieve the purpose, the invention provides the following technical scheme: the MPO/MTP chassis comprises a 1U chassis, wherein the front end of the 1U chassis is provided with two MPO adapter installation channels and two LC adapter installation channels, each MPO adapter installation channel comprises 8 MPO adapter installation channels, each LC adapter installation channel comprises 8 LC adapter installation channels, MPO adapters are installed inside the MPO adapter installation channels, 8 LC adapters are installed inside the LC adapter installation channels, the 8 LC adapters are connected with the MPO adapters through MPO-LC jumpers, and the MPO-LC jumpers are arranged inside the 1U chassis in order.

Preferably, 1U machine case includes quick-witted box and case lid, the lateral wall of quick-witted box passes through the screw connection case lid, the engaging lug is installed to the case lid front end, the engaging lug passes through the screw connection quick-witted box front end.

Preferably, lateral lugs are connected to two sides of the 1U case.

Preferably, the two sets of MPO adapter installation channels and the two sets of LC adapter installation channels are distributed in parallel up and down, each set of MPO adapter installation channels are on the same horizontal line, and each set of LC adapter installation channels are on the same horizontal line.

The invention has the technical effects and advantages that: the MPO and LC wiring of the device is in one direction, and the whole circuit is attractive after construction is finished; the operation and construction are convenient, and the deployment efficiency is high; when the device is manufactured in a factory, LC adapters with 8 channels can be installed at one time, so that the production efficiency of enterprise products is improved; the ultra-high density is suitable for ultra-high density wiring, compared with the traditional 96 cores, the density is 1/128, the density is increased by 33.3 percent, and the space of a single line is reduced by 33.3 percent; the whole product structure is simpler, and the direct installation is finished on the panel without the need of a redundant MPO matching box.

Drawings

FIG. 1 is an internal structural layout of the present invention;

FIG. 2 is an exploded view of the 1U enclosure of the present invention;

fig. 3 is a front view of the housing of the present invention.

In the figure: the system comprises a 1-1U case, a 2-MPO adapter installation channel, a 3-LC adapter installation channel, a 4-MPO adapter, a 5-8 LC adapter, a 6-MPO-LC jumper, a 7-case body, an 8-case cover, a 9-connecting lug and a 10-side lug.

Detailed Description

In the description of the present invention, it should be noted that unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, either fixedly connected, detachably connected, integrally connected, mechanically connected, or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements.

Examples

As shown in fig. 1 to fig. 3, the ultrahigh-density MPO/MTP chassis applied to the data center includes a 1U chassis 1, where two groups of MPO adapter installation channels 2 distributed up and down and two groups of LC adapter installation channels 3 distributed up and down are opened at the front end of the 1U chassis 1, each group of MPO adapter installation channels 2 includes 8 MPO adapter installation channels 2 distributed on the same horizontal line, and each group of LC adapter installation channels 3 includes 8 LC adapter installation channels 3 distributed on the same horizontal line; an MPO adapter 4 is installed inside the MPO adapter installation channel 2, 8 LC adapters 5 are installed inside the LC adapter installation channel 3, the 8 LC adapters 5 are connected with the MPO adapter 4 through an MPO-LC jumper 6, and the MPO-LC jumpers 6 are regularly arranged inside the 1U chassis 1, so that 128 cores are realized;

wherein, 1U machine case 1 includes quick-witted box 7 and case lid 8, the lateral wall of quick-witted box 7 passes through screw connection case lid 8, three engaging lug 9 is installed to 8 front ends of case lid, engaging lug 9 passes through screw connection quick-witted box 7 front ends, 1U machine case 1 both sides are connected with side ear 10, and side ear 10 is used for installing MPO MTP quick-witted case.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The MPO/MTP case with ultrahigh density applied to the data center comprises a 1U case and is characterized in that: the front end of the 1U case is provided with two groups of MPO adapter installation channels and two groups of LC adapter installation channels, each group of MPO adapter installation channels comprises 8 MPO adapter installation channels, each group of LC adapter installation channels comprises 8 LC adapter installation channels, MPO adapters are installed inside the MPO adapter installation channels, 8 LC adapters are installed inside the LC adapter installation channels, the 8 LC adapters are connected with the MPO adapters through MPO-LC jumpers, and the MPO-LC jumpers are orderly arranged inside the 1U case.

2. The ultra-high density MPO/MTP enclosure for data center application as claimed in claim 1, wherein: the 1U machine case comprises a machine case body and a case cover, the side wall of the machine case body is connected with the case cover through screws, a connecting lug is installed at the front end of the case cover, and the connecting lug is connected with the front end of the machine case body through screws.

3. The ultra-high density MPO/MTP enclosure for data center application as claimed in claim 2, wherein: and the two sides of the 1U case are connected with side lugs.

4. The ultra-high density MPO/MTP enclosure for data center application as claimed in claim 1, wherein: the two groups of MPO adapter mounting channels and the two groups of LC adapter mounting channels are distributed in parallel up and down, each group of MPO adapter mounting channels are on the same horizontal line, and each group of LC adapter mounting channels are on the same horizontal line.