CN115332135A - Semiconductor wafer thickness measuring equipment and method - Google Patents
Semiconductor wafer thickness measuring equipment and method Download PDFInfo
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- CN115332135A CN115332135A CN202211235934.4A CN202211235934A CN115332135A CN 115332135 A CN115332135 A CN 115332135A CN 202211235934 A CN202211235934 A CN 202211235934A CN 115332135 A CN115332135 A CN 115332135A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/04—Sorting according to size
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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Abstract
The invention relates to the technical field of semiconductor production, in particular to a semiconductor wafer thickness measuring device and a semiconductor wafer thickness measuring method. Has the advantages that: compared with the prior art, the wafer positioning and clamping device has higher detection efficiency, can position, clamp and detect wafers with different sizes, has wider application range, can automatically perform sorting, automatically control clamping force and has higher automation degree.
Description
Technical Field
The invention relates to the technical field of semiconductor production, in particular to a semiconductor wafer thickness measuring device and method.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. High-purity polycrystalline silicon is doped into a silicon crystal seed crystal after being dissolved and then is slowly pulled out to form cylindrical monocrystalline silicon, a semiconductor wafer is a main raw material of an LED, parameters such as brightness, voltage, wavelength, length, thickness, width and the like of the semiconductor wafer need to be detected in the production and manufacturing process of the semiconductor wafer, thickness measurement is carried out on the semiconductor wafer in a mode of carrying out reflectivity measurement and fluorescence measurement on the semiconductor wafer through thickness measurement equipment, whether the semiconductor wafer is qualified or not is judged, manual position adjustment is needed in the measuring process of the existing semiconductor wafer thickness measurement equipment, the central point of the semiconductor wafer can be aligned to be detected, however, manual adjustment cannot be carried out for rapid positioning, and therefore convenience of the semiconductor wafer thickness detection equipment is reduced.
The traditional invention patent, such as the Chinese invention patent with the application number of CN202210025646.X, the publication number of 2022-04-08, named as semiconductor chip thickness measuring equipment, mainly comprises a circular detection mechanism, a detection box, a protective shell, a first driving motor, a first rotating shaft and a gear, a circulating toothed plate, a box body and the like, and automatically adsorbs and positions a semiconductor wafer in the detection process, so that the thickness of the central point of the wafer can be conveniently measured, and the accuracy of the thickness measurement of the equipment can be improved.
In this scheme, detect and select separately through the reciprocal mode of straight line, this kind of mode stroke is long for detection efficiency is lower, and the size of a dimension of holding mechanism is fixed, only can fix a position the holding to single size semiconductor wafer, and the application scope is comparatively narrow and small, and if need examine time measuring to the wafer of not unidimensional, then need change holding mechanism, comparatively loaded down with trivial details.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a semiconductor wafer thickness measuring device and method.
In order to achieve the purpose, the invention adopts the following technical scheme:
a semiconductor wafer thickness measuring device comprises a base, wherein a fixed column is fixedly connected to the upper surface of the base, the fixed column is connected with a rotary table in a penetrating and rotating mode through a bearing, a clamping permanent magnet and a loosening permanent magnet are fixedly connected to the side wall of the fixed column, a gear ring is fixedly connected to the lower surface of the rotary table through a support, a servo motor is fixedly connected to the upper surface of the base, a gear is in interference fit with an output shaft of the servo motor, the gear is meshed with the gear ring, the side wall of the fixed column is fixedly connected with thickness measuring equipment through the support, and four groups of positioning mechanisms are arranged in the rotary table;
every group positioning mechanism is including offering inspection hole, the liquid groove in the carousel, four sliding trays have been seted up to the inspection hole inside wall, sealed sliding connection has the slider in the sliding tray, sealed sliding connection has the ejector pad in the liquid groove, fixed surface is connected with the drive permanent magnet under the ejector pad, liquid inslot inside wall fixedly connected with keeps off the ring, four feed pipes of fixedly connected with are run through to the carousel, the feed pipe will correspond sliding tray and liquid groove intercommunication, the inspection hole inside wall is connected with two layer boards through the hinge rotation, fill hydraulic oil between ejector pad and the slider.
Further, every group positioning mechanism is including seting up the mounting groove at the slider lateral wall, sliding connection has the T-shaped piece in the mounting groove, the T-shaped piece is located the outside one end fixedly connected with locating piece of mounting groove, mounting groove inner wall fixedly connected with force sensing resistor, the control flume has all been seted up to two inside walls that the ejector pad is relative, end wall fixedly connected with electric putter I in the control flume, electric putter I establishes ties with force sensing resistor, electric putter I's output fixedly connected with resistance piece.
Further, four opening and closing mechanisms are arranged in the rotary disc, each opening and closing mechanism comprises an annular cavity arranged in the rotary disc, the rotary disc penetrates through two sliding sleeves fixedly connected with, one end of each sliding sleeve penetrates through and extends into the annular cavity, the other end of each sliding sleeve penetrates through and extends to the outside of the rotary disc, each sliding sleeve is connected with a sliding column in a sealing and sliding mode, one end, located at the outside of each sliding sleeve, of each sliding column is fixedly connected with the lower surface of the corresponding supporting plate, a concave block is fixedly connected with the lower surface of the rotary disc, a control block is connected in a sealing and sliding mode in the concave block, an electric push rod II is fixedly connected with the side wall of the rotary disc, the output end of the electric push rod II is fixedly connected with the lower surface of the control block, the rotary disc and the concave block jointly penetrate through a fixedly connected connecting pipe, the annular cavity is communicated with the concave block through the connecting pipe, and hydraulic oil is filled between the control block and the sliding column.
Further, a control mechanism is arranged in the fixed column and comprises a function groove formed in the side wall of the fixed column, an electric push rod III is fixedly connected to the inner end wall of the function groove, a conductive block III is fixedly connected to the output end of the electric push rod III, four conductive blocks I are fixedly embedded in the inner side wall of the rotary table, the conductive blocks I are electrically connected with the corresponding electric push rods II through wires, a conductive block II is fixedly embedded in the side wall of the fixed column, the conductive blocks II and the conductive blocks III are connected with a power supply through wires, the conductive blocks II and the conductive blocks III are in contact with the conductive blocks I, so that the corresponding electric push rods II can be powered on, and the electric push rods III are electrically connected with the thickness measuring equipment through wires.
Furthermore, the upper surface of the base is fixedly connected with two collecting barrels, and the side wall of the fixing column is fixedly connected with four silicon steel sheets.
Further, each liquid supply pipe is internally provided with a pressure release valve, the section of the positioning block is arc-shaped, and the arc surface is provided with a rubber pad.
The invention also provides a thickness measuring method of the semiconductor wafer, which comprises the following steps:
s1, feeding: placing a semiconductor wafer to be monitored in the detection hole on the left side;
s2, positioning: the servo motor drives the gear to rotate, the gear is meshed with the gear ring, the rotary table rotates 90 degrees intermittently, when the semiconductor wafer to be monitored rotates to the position below the thickness measuring equipment, the push block slides upwards through magnetic force, the push block drives the positioning blocks to slide through hydraulic oil, the semiconductor wafer is clamped and pushed to the center of the detection hole to be positioned, and clamping force automatically stops clamping after reaching a certain value;
s3, detection: after positioning and clamping are completed, the semiconductor wafer to be monitored rotates to the position below the thickness measuring equipment along with the rotation of the rotary table, the thickness measuring equipment is detected, the electric push rod III is powered off if the thickness measuring equipment is qualified, and the electric push rod III is powered on if the thickness measuring equipment is not qualified;
s4, sorting: and when the rotary table continues to rotate, the semiconductor wafer rotates to the conductive block III when the semiconductor wafer is qualified, the supporting plate does not rotate, the unqualified semiconductor wafer rotates to the conductive block III, the electric push rod II is electrified, the unqualified semiconductor wafer falls, and the qualified semiconductor wafer rotates to the conductive block II and falls.
The invention has the following advantages:
1. feeding detection is carried out in a rotary reciprocating mode, and compared with the feeding detection mode of linear reciprocating in the prior art, once positioning, feeding detection and sorting can be synchronously completed only by rotating the turntable by 90 degrees, so that the detection efficiency is higher during continuous detection;
2. the four sliders are used for driving the positioning blocks to clamp and position the semiconductor wafer, and the positions of the sliders are different, so that the four positioning blocks are different in position, positioning and clamping of wafers with different sizes can be completed, the equipment can be suitable for detecting wafers with different sizes, and the application range of the equipment is wider;
3. in the clamping and positioning process, the clamping force is sensed through the force-sensitive resistor, and then the thrust of the electric push rod I is controlled through the change of the resistance value of the force-sensitive resistor, so that the resistance of the push block during movement is controlled, when the clamping force reaches a certain value, the resistance of the push block during sliding also reaches a certain value, so that the position of the push block is fixed, namely the clamping force is determined, further, in the clamping and positioning process, the clamping force can be automatically controlled, stable clamping and positioning are ensured, meanwhile, the wafer is prevented from being damaged due to overlarge clamping force, and the automation degree of equipment is higher;
4. after the detection is finished, the break-through point of the electric push rod III is controlled through the detection mechanism, and the semiconductor wafer can be automatically controlled to fall into which collecting barrel, so that after the detection is finished, the qualified products and the unqualified products are automatically sorted, sorting by follow-up manpower is not needed, and the detection efficiency is further improved.
Drawings
FIG. 1 is a schematic structural diagram of a semiconductor wafer thickness measuring apparatus according to the present invention;
FIG. 2 is an enlarged view taken at A in FIG. 1;
FIG. 3 is an enlarged view of FIG. 1 at B;
FIG. 4 is a cross-sectional view taken at C-C of FIG. 1;
FIG. 5 is an enlarged view of FIG. 4 at D;
FIG. 6 is an enlarged view at E in FIG. 4;
FIG. 7 is a cross-sectional view taken along line F-F of FIG. 1;
fig. 8 is a top view of a semiconductor wafer thickness measuring apparatus according to the present invention.
In the figure: the device comprises a base 1, a fixed column 2, a rotary table 3, a detection hole 4, a sliding groove 5, a sliding block 6, a positioning block 8, a liquid groove 9, a pushing block 10, a driving permanent magnet 11, a retaining ring 12, a clamping permanent magnet 13, a loosening permanent magnet 14, a silicon steel sheet 15, a mounting groove 16, a block 17T, a force sensitive resistor 18, a control groove 19, an electric push rod I20, a resistance block 21, a gear ring 22, a servo motor 23, a gear 24, a liquid supply pipe 25, a pressure release valve 26, a supporting plate 27, a ring cavity 28, a sliding sleeve 29, a sliding column 30, a concave block 31, a connecting pipe 32, a control block 33, an electric push rod II 34, a conductive block I35, a functional groove 36, an electric push rod III 37, a conductive block III 38, a conductive block II 39, thickness measuring equipment 40 and a collecting barrel 41.
Detailed Description
Referring to fig. 1-8, a semiconductor wafer thickness measuring device comprises a base 1, wherein a fixed column 2 is fixedly connected to the upper surface of the base 1, the fixed column 2 is connected with a rotary table 3 in a penetrating and rotating manner through a bearing, a clamping permanent magnet 13 and a loosening permanent magnet 14 are fixedly connected to the side wall of the fixed column 2, the clamping permanent magnet 13 generates magnetic repulsion to a driving permanent magnet 11, the loosening permanent magnet 14 generates magnetic attraction to the driving permanent magnet 11, and the magnetic force of the loosening permanent magnet 14 is larger, so that a push block 10 can still reset through the magnetic force under the condition of larger sliding resistance, a gear ring 22 is fixedly connected to the lower surface of the rotary table 3 through a bracket, a servo motor 23 is fixedly connected to the upper surface of the base 1, an intermittent current is introduced into the servo motor 23 to enable the servo motor 23 to intermittently rotate, the gear 24 can be intermittently rotated through the intermittent rotation of the servo motor 23, each intermittent rotation of the gear 24 can enable the gear ring 22 to drive the rotary table 3 to rotate by an interference 90 degrees, an output shaft of the servo motor 23 is matched with the gear 24, the gear 24 is meshed with the gear 22, the side wall of the fixed column 2, a thickness measuring device 40 is fixedly connected to the side wall of the fixed column 2 through the bracket, and four groups of the rotary table 3 are provided with four positioning mechanisms;
each group of positioning mechanisms comprises a detection hole 4 and a liquid groove 9 which are arranged in a turntable 3, four sliding grooves 5 are arranged on the inner side wall of the detection hole 4, a sliding block 6 is connected in the sliding groove 5 in a sealing and sliding way, a push block 10 is connected in the liquid groove 9 in a sealing and sliding way, a driving permanent magnet 11 is fixedly connected on the lower surface of the push block 10, a baffle ring 12 is fixedly connected on the inner side wall of the liquid groove 9, four liquid supply pipes 25 are fixedly connected with the turntable 3 in a penetrating way, the corresponding sliding grooves 5 are communicated with the liquid groove 9 through the liquid supply pipes 25, two supporting plates 27 are rotatably connected on the inner side wall of the detection hole 4 through hinges, hydraulic oil is filled between the push block 10 and the sliding block 6, during each 90 deg. rotation of the turntable 3, when the driving permanent magnet 11 is rotated above the clamping permanent magnet 13, under the action of magnetic repulsion force, the push block 10 slides upwards, hydraulic oil is pumped into the sliding groove 5, so that the four sliding blocks 6 slide out synchronously, the wafer in the detection hole 4 is positioned to the center of the detection hole 4, simultaneously, the wafer is clamped and fixed, the positions of the four positioning blocks 8 are different due to different positions of the slide block 6, the positioning and clamping of wafers with different sizes can be completed, so that the equipment can be suitable for detecting wafers with different sizes, the application range of the equipment is wider, and when the equipment is rotated to the position above the released permanent magnet 14, namely, under the action of magnetic attraction, the permanent magnet 11 is driven to drive the push block 10 to reset, so that the slide block 6 resets and releases clamping, simultaneously under the intermittent type rotation of carousel 3, fix a position, material loading detects, selects separately, carries out the pay-off through rotating reciprocal mode and detects, compares in prior art through the reciprocal pay-off detection mode of straight line, only needs carousel 3 to rotate 90 and can accomplish once fixing a position, material loading detection, select separately in step for when detecting in succession, detection efficiency is higher.
Each group of positioning mechanism comprises a mounting groove 16 arranged on the side wall of the sliding block 6, a T-shaped block 17 is connected in the mounting groove 16 in a sliding manner, one end of the T-shaped block 17 positioned outside the mounting groove 16 is fixedly connected with a positioning block 8, the inner wall of the mounting groove 16 is fixedly connected with a force sensitive resistor 18, the resistance value of the force sensitive resistor 18 is reduced along with the increase of the pressure applied to the force sensitive resistor, two opposite inner side walls of the push block 10 are respectively provided with a control groove 19, the inner end wall of the control groove 19 is fixedly connected with an electric push rod I20, the electric push rod I20 is connected with the force sensitive resistor 18 in series, the electric push rod I20 is a servo electric push rod which can change the thrust according to the current, the prior art is omitted, the output end of the electric push rod I20 is fixedly connected with a resistance block 21, the surface of the resistance block 21 is a frosted layer, the friction force is large when the resistance is generated during sliding, when the sliding block 6 drives the positioning block 8 to contact with the side surface of a wafer in the clamping and positioning process, at this moment, a certain clamping is carried out on the wafer, the clamping force reacts on the force sensitive resistor 18 through the positioning block 8 and the T-shaped block 17, so that the resistance value of the force sensitive resistor 18 is changed, the resistance value of the force sensitive resistor 18 is gradually reduced along with the increase of the clamping force, so that the passing current of the electric push rod I20 is gradually increased, namely the thrust of the electric push rod I20 is gradually increased, the pressure of the resistance block 21 and the inner side wall of the liquid groove 9 is gradually increased when the thrust is gradually increased, so that the resistance is larger when the whole push block 10 slides, until the clamping force reaches a certain value, the thrust of the electric push rod I20 reaches a certain value, the friction force generated by the pressure of the resistance block 21 on the inner side wall of the liquid groove 9 at this moment makes the push block 10 unable to continuously slide under the action of the magnetic force, so that the clamping force is fixed at this moment, and then make the centre gripping location in-process, the size of clamping-force can automatic control, when guaranteeing stable centre gripping location, avoids the too big wafer of clamping-force to damage for the degree of automation of equipment is higher.
Four sets of opening and closing mechanisms are arranged in the rotary table 3, each set of opening and closing mechanism comprises an annular cavity 28 arranged in the rotary table 3, the rotary table 3 is fixedly connected with two sliding sleeves 29 in a penetrating way, one end of each sliding sleeve 29 extends into the annular cavity 28 in a penetrating way, the other end extends to the outside of the rotary table 3 in a penetrating way, each sliding sleeve 29 is connected with a sliding column 30 in a sealing and sliding way, one end of each sliding column 30 positioned outside the corresponding sliding sleeve 29 is fixedly connected with the lower surface of the corresponding supporting plate 27, the lower surface of the rotary table 3 is fixedly connected with a concave block 31, a control block 33 is connected in the concave block 31 in a sealing and sliding way, the side wall of the rotary table 3 is fixedly connected with an electric push rod II 34, the electric push rod II 34 is electrified to retract and is extended out in a power-off way, the prior art is provided, the output end of the electric push rod II 34 is fixedly connected with the lower surface of the control block 33, the rotary disc 3 and the concave block 31 jointly penetrate through a connecting pipe 32 which is fixedly connected with, the connecting pipe 32 is communicated with the annular cavity 28 and the concave block 31, hydraulic oil is filled between the control block 33 and the sliding column 30, the electric push rod II 34 is powered on and powered off, when the electric push rod II 34 is powered on, the electric push rod II 34 retracts to drive the control block 33 to slide downwards, so that the hydraulic oil is pumped into the concave block 31 in the sliding sleeve 29, the sliding column 30 slides to drive the supporting plate 27 to rotate, the supporting plate 27 is opened, otherwise, when the electric push rod II 34 is powered off and extends out, the hydraulic oil is pumped back into the sliding sleeve 29 at the moment, the sliding column 30 slides out, and the supporting plate 27 is driven to rotate and close.
A control mechanism is arranged in the fixed column 2, the control mechanism comprises a functional groove 36 arranged on the side wall of the fixed column 2, the inner end wall of the functional groove 36 is fixedly connected with an electric push rod III 37, the output end of the electric push rod III 37 is fixedly connected with a conductive block III 38, four conductive blocks I35 are fixedly embedded in the inner side wall of the rotary table 3, the conductive blocks I35 are electrically connected with corresponding electric push rods II 34 through leads, the side wall of the fixed column 2 is fixedly embedded with conductive blocks II 39, the conductive blocks II 39 and the conductive blocks III 38 are both connected with a power supply through leads, the conductive blocks II 39 and the conductive blocks III 38 are contacted with the conductive blocks I35 to electrify the corresponding electric push rods II 34, the electric push rods III 37 are electrically connected with the thickness measuring equipment 40 through leads, after the thickness measuring equipment 40 is detected, if the detection is qualified, the electric push rods III 37 are powered off and retracted, and if the detection is unqualified, the electric push rods III 37 are electrified and extended, in the prior art, when the detection is finished, the electric push rod III 37 is extended and retracted to perform sorting, when the detection is qualified, the electric push rod III 37 shows that when the detected wafer rotates to the position of the conductive block III 38 along with the turntable 3, the conductive block I35 corresponding to the detected wafer does not contact with the conductive block III 38 when the detected wafer passes through the rotation, the opening and closing mechanism does not open the supporting plate 27 at the moment, and the rotating mechanism continues to rotate along with the turntable 3, when the detected wafer rotates to the position of the conductive block II 39, the corresponding conductive block I35 contacts with the conductive block II 39 at the moment, so that the supporting plate 27 is opened, the wafer falls into a collecting barrel 41 for collecting good products, if the detection is unqualified correspondingly, the supporting plate 27 is opened at the position of the conductive block III 38, so that the wafer falls into a collecting barrel 41 for collecting unqualified products, and then the sorting of the qualified products and the unqualified products is automatically finished after the detection is finished, and subsequent manual sorting is not needed, so that the detection efficiency is further improved.
Two collecting vessel 41 of fixed surface are connected with on base 1, as shown in fig. 7, a collecting vessel 41 is located right-hand, be used for collecting the substandard product, another collecting vessel 41 is located under, be used for collecting the yields, four silicon steel sheets 15 of 2 lateral walls fixedly connected with of fixed column, four silicon steel sheets 15 separate centre gripping permanent magnet 13 with relax permanent magnet 14, there is silicon steel sheet 15 to have higher magnetic conductivity, consequently it has certain magnetism effect that separates, setting through silicon steel sheet 15, carry out certain shielding to centre gripping permanent magnet 13 and relax permanent magnet 14 magnetic field, avoid the magnetic field mutual influence of the two.
All be provided with relief valve 26 in every feed pipe 25, the rated value of relief valve 26 is less, only need have certain pressure, can make relief valve 26 open, the setting of relief valve 26, make when ejector pad 10 pumps hydraulic oil, when keeping supplying with hydraulic oil in four feed pipes 25, synchronous supply, thereby guarantee the synchronous roll-off of four slider 6, locating piece 8's cross-section is the arc, and the cambered surface is provided with the rubber pad, curved locating piece 8 more adds the circular shape semiconductor wafer of centre gripping of being convenient for, 8 fish tail wafers of locating piece are avoided on the one hand to the rubber pad, on the other hand increases frictional force, avoid holding the location back with, the phenomenon of skidding appears, influence the location effect.
The invention also provides a thickness measuring method of the semiconductor wafer, which comprises the following steps:
s1, feeding: placing a semiconductor wafer to be monitored in the detection hole 4 on the left side;
s2, positioning: the servo motor 23 drives the gear 24 to rotate, the gear 24 is meshed with the gear ring 22, the rotary table 3 intermittently rotates by 90 degrees, when the semiconductor wafer to be monitored rotates to the position below the thickness measuring equipment 40, the push block 10 slides upwards through magnetic force, the push block 10 drives the positioning blocks 8 to slide through the four slide blocks 6 through hydraulic oil, the semiconductor wafer is clamped and pushed to the center of the detection hole 4 to be positioned, and the clamping force automatically stops clamping after reaching a certain value;
s3, detection: after positioning and clamping are completed, the semiconductor wafer to be monitored rotates to the position below the thickness measuring equipment 40 along with the rotation of the rotary table 3, the thickness measuring equipment is detected, if the thickness measuring equipment is qualified, the electric push rod III 37 is powered off, and if the thickness measuring equipment is not qualified, the electric push rod III 37 is powered on;
s4, sorting: with the continuous rotation of the turntable 3, when the semiconductor wafer is qualified, the supporting plate 27 rotates to the conductive block III 38, while the unqualified semiconductor wafer rotates to the conductive block III 38, the electric push rod II 34 is electrified, so that the unqualified semiconductor wafer falls down, and the qualified semiconductor wafer rotates to the conductive block II 39 and falls down.
According to the invention, a wafer to be inspected is placed in the left detection hole 4, the supporting plate 27 is in a closed state and is placed on the supporting plate 27, the servo motor 23 rotates at the moment, the rotary table 3 rotates 90 degrees through the meshing of the gear 24 and the gear ring 22, the driving permanent magnet 11 originally located in the left liquid groove 9 is opposite to the clamping permanent magnet 13 in the rotating process, the clamping permanent magnet 13 generates magnetic repulsion force on the driving permanent magnet 11 at the moment, the driving permanent magnet 11 drives the push block 10 to slide upwards under the action of the magnetic repulsion force, so that hydraulic oil in the liquid groove 9 is pumped into the corresponding sliding groove 5 through the liquid supply pipe 25, the four sliding blocks 6 in the detection hole 4 drive the positioning block 8 to slide out synchronously, the wafer is pushed to be aligned with the center of the detection hole 4 through the positioning block 8, and the wafer is clamped at the same time.
In the clamping process, when the slider 6 drives the locating block 8 to contact with the side face of the wafer, certain clamping is carried out on the wafer at the moment, the clamping force can react on the force sensitive resistor 18 through the locating block 8 and the T-shaped block 17, the resistance value of the force sensitive resistor 18 is changed, along with the increase of the clamping force, the resistance value of the force sensitive resistor 18 is gradually reduced, the passing current of the electric push rod I20 is gradually increased, the thrust is gradually increased, the pressure of the inner side wall of the resistance block 21 and the inner side wall of the liquid groove 9 is gradually increased, the whole push block 10 is made to slide to enable the resistance to be larger, when the clamping force reaches a certain value, the thrust of the electric push rod I20 reaches a certain value at the moment, the friction force generated by the pressure of the resistance block 21 on the inner side wall of the liquid groove 9 at the moment is made to enable the push block 10 to continuously slide under the action of the magnetic force, and the clamping force at the moment is made to be fixed.
After clamping and positioning are completed, the wafer to be detected rotates to the position below the thickness measuring device 40 along with the rotary table 3 for detection, after detection is completed, when the rotary table 3 continues to rotate, the permanent magnet 11 is driven to rotate to be opposite to the loosening permanent magnet 14, the loosening permanent magnet 14 generates magnetic attraction on the permanent magnet 11, the permanent magnet 11 is driven to drive the push block 10 to slide downwards and reset, the slide block 6 slides towards the sliding groove 5 to reset, clamping on the wafer is removed, if the detection result is unqualified, the electric push rod III 37 is electrified and extends out, the electric conductive block III 38 is electrified and extends out, when the detected wafer rotates to the position of the conductive block III 38 along with the rotary table 3, the corresponding conductive block I35 is in contact with the conductive block III 38, at the moment, even if the electric push rod II 34 is electrified and retracts, the control block 33 is driven to slide downwards, hydraulic oil is pumped into the concave block 31 through the sliding sleeve 29, the sliding column 30 slides, the supporting plate 27 is driven to rotate, the supporting plate 27 is opened, and defective wafers fall down from the detection hole 4 and fall into the collecting barrel 41 for storing defective wafers.
If the wafer is qualified, the electric push rod III 37 is in a power-off retraction state, when the wafer which is detected at the moment rotates to the position, the corresponding conductive block I35 is not released from the conductive block III 38, the supporting plate 27 is in a closed state, and along with the continuous rotation of the subsequent rotary plate 3, the wafer continuously rotates along with the rotary plate 3 until the wafer rotates to the point that the corresponding conductive block I35 is contacted with the conductive block II 39, and the electric push rod II 34 is electrified, so that the supporting plate 27 rotates to be opened, and the wafer falls into a collecting barrel 41 for collecting good products.
And with the continuous rotation of the rotary table 3, the conductive block I35 is separated from the conductive block II 39, the electric push rod II 34 is powered off again, the supporting plate 27 is closed, the wafer to be detected is continuously placed into the detection hole 4 at the moment, and the detection is continuously completed according to the steps.
Claims (7)
1. The semiconductor wafer thickness measuring equipment comprises a base (1) and is characterized in that the upper surface of the base (1) is connected with a fixed column (2), the fixed column (2) is connected with a rotary table (3) through rotation, the side wall of the fixed column (2) is fixedly connected with a clamping permanent magnet (13) and a loosening permanent magnet (14), the lower surface of the rotary table (3) is fixedly connected with a gear ring (22) through a support, the upper surface of the base (1) is fixedly connected with a servo motor (23), an output shaft of the servo motor (23) is in interference fit with a gear (24), the gear (24) is meshed with the gear ring (22), the side wall of the fixed column (2) is fixedly connected with thickness measuring equipment (40) through the support, and four groups of positioning mechanisms are arranged in the rotary table (3);
every group positioning mechanism is including offering inspection hole (4), liquid groove (9) in carousel (3), four sliding tray (5) have been seted up to inspection hole (4) inside wall, sliding tray (5) internal seal sliding connection has slider (6), liquid groove (9) internal seal sliding connection has ejector pad (10), fixed surface is connected with drive permanent magnet (11) under ejector pad (10), liquid groove (9) inside wall fixedly connected with keeps off ring (12), four feed pipes (25) of fixedly connected with run through in carousel (3), feed pipe (25) will correspond sliding tray (5) and liquid groove (9) intercommunication, inspection hole (4) inside wall rotates through the hinge and is connected with two layer boards (27), fill hydraulic oil between ejector pad (10) and slider (6).
2. The semiconductor wafer thickness measuring device according to claim 1, wherein each positioning mechanism comprises a mounting groove (16) formed in a side wall of the slider (6), a T-shaped block (17) is slidably connected in the mounting groove (16), a positioning block (8) is fixedly connected to one end, located outside the mounting groove (16), of the T-shaped block (17), a force sensitive resistor (18) is fixedly connected to an inner wall of the mounting groove (16), control grooves (19) are formed in two opposite inner side walls of the push block (10), an electric push rod I (20) is fixedly connected to an inner end wall of each control groove (19), the electric push rods I (20) are connected with the force sensitive resistor (18) in series, and a resistance block (21) is fixedly connected to an output end of the electric push rod I (20).
3. The semiconductor wafer thickness measuring device according to claim 2, wherein four sets of opening and closing mechanisms are arranged in the rotary table (3), each set of opening and closing mechanism comprises an annular cavity (28) arranged in the rotary table (3), the rotary table (3) is fixedly connected with two sliding sleeves (29) in a penetrating manner, one ends of the sliding sleeves (29) extend into the annular cavity (28) in a penetrating manner, the other ends of the sliding sleeves extend out of the rotary table (3) in a penetrating manner, the sliding sleeves (29) are connected with sliding columns (30) in a sealing and sliding manner, one ends of the sliding columns (30) located outside the sliding sleeves (29) are fixedly connected with the lower surfaces of the corresponding supporting plates (27), a concave block (31) is fixedly connected with the lower surface of the rotary table (3), a control block (33) is connected in the concave block (31) in a sealing and sliding manner, an electric push rod II (34) is fixedly connected with the side wall of the rotary table (3), the output end of the electric push rod II (34) is fixedly connected with the lower surface of the control block (33), the rotary table (3) and the concave block (31) are fixedly connected with a connecting pipe (32) in a penetrating manner, and the connecting pipe (32) is used for communicating the concave block (28) with the control block (31) and filling hydraulic oil between the sliding columns (30).
4. The semiconductor wafer thickness measuring equipment according to claim 3, wherein a control mechanism is arranged in the fixed column (2), the control mechanism comprises a functional groove (36) formed in a side wall of the fixed column (2), an electric push rod III (37) is fixedly connected to an inner end wall of the functional groove (36), an output end of the electric push rod III (37) is fixedly connected with a conductive block III (38), four conductive blocks I (35) are fixedly embedded in an inner side wall of the rotary table (3), the conductive blocks I (35) are electrically connected with the corresponding electric push rods II (34) through conducting wires, a conductive block II (39) is fixedly embedded in a side wall of the fixed column (2), the conductive blocks II (39) and the conductive block III (38) are both connected with a power supply through conducting wires, the conductive blocks II (39) and the conductive block III (38) are in contact with the conductive blocks I (35) so that the corresponding electric push rods II (34) are electrified, and the electric push rods III (37) are electrically connected with the thickness measuring equipment (40) through conducting wires.
5. The semiconductor wafer thickness measuring equipment according to claim 4, wherein two collecting barrels (41) are fixedly connected to the upper surface of the base (1), and four silicon steel sheets (15) are fixedly connected to the side walls of the fixing columns (2).
6. The apparatus of claim 5, wherein a pressure relief valve (26) is disposed in each of the liquid supply tubes (25), the positioning block (8) has an arc-shaped cross section, and the arc-shaped surface is provided with a rubber pad.
7. A thickness measuring method using the semiconductor wafer thickness measuring apparatus according to claim 6, comprising the steps of:
s1, feeding: placing a semiconductor wafer to be monitored in the detection hole (4) on the left side;
s2, positioning: the servo motor (23) drives the gear (24) to rotate, the gear (24) is meshed with the gear ring (22) to enable the turntable (3) to intermittently rotate by 90 degrees, when a semiconductor wafer to be monitored rotates to the position below the thickness measuring equipment (40), the push block (10) slides upwards through magnetic force, the push block (10) enables the four sliders (6) to drive the positioning block (8) to slide through hydraulic oil, the semiconductor wafer is clamped and pushed to the center of the detection hole (4) for positioning, and clamping force automatically stops clamping after reaching a certain value;
s3, detection: after positioning and clamping are completed, the semiconductor wafer to be monitored rotates to the position below the thickness measuring equipment (40) along with the rotation of the turntable (3), and the thickness measuring equipment detects the semiconductor wafer, if the semiconductor wafer is qualified, the electric push rod III (37) is powered off, and if the semiconductor wafer is not qualified, the electric push rod III (37) is powered on;
s4, sorting: with the continuous rotation of the turntable (3), when the semiconductor wafer is qualified, the semiconductor wafer rotates to the conductive block III (38), the supporting plate (27) does not rotate, the unqualified semiconductor wafer rotates to the conductive block III (38), the electric push rod II (34) is electrified, the unqualified semiconductor wafer falls, and the qualified semiconductor wafer rotates to the conductive block II (39) and falls.
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| CN117153758A (en) * | 2023-10-30 | 2023-12-01 | 江苏希太芯科技有限公司 | Positioning structure for semiconductor wafer thickness detector |
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| CN114496875A (en) * | 2022-02-16 | 2022-05-13 | 董保全 | High altitude wafer transport case |
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| CN117104775A (en) * | 2023-10-20 | 2023-11-24 | 江苏希太芯科技有限公司 | Infrared detection device for detecting thickness of semiconductor wafer |
| CN117104775B (en) * | 2023-10-20 | 2023-12-26 | 江苏希太芯科技有限公司 | Infrared detection device for detecting thickness of semiconductor wafer |
| CN117153758A (en) * | 2023-10-30 | 2023-12-01 | 江苏希太芯科技有限公司 | Positioning structure for semiconductor wafer thickness detector |
| CN117153758B (en) * | 2023-10-30 | 2023-12-22 | 江苏希太芯科技有限公司 | Positioning structure for semiconductor wafer thickness detector |
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