CN115297619A - Printed circuit board centre gripping material feeding unit - Google Patents

Printed circuit board centre gripping material feeding unit Download PDF

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Publication number
CN115297619A
CN115297619A CN202211206725.7A CN202211206725A CN115297619A CN 115297619 A CN115297619 A CN 115297619A CN 202211206725 A CN202211206725 A CN 202211206725A CN 115297619 A CN115297619 A CN 115297619A
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CN
China
Prior art keywords
rod
clamping
circuit board
rods
moving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202211206725.7A
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Chinese (zh)
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CN115297619B (en
Inventor
李清华
刘竹
牟玉贵
胡志强
杨海军
邓岚
孙洋强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sichuan Vocational and Technical College
Inno Circuits Ltd
Original Assignee
Sichuan Vocational and Technical College
Inno Circuits Ltd
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Application filed by Sichuan Vocational and Technical College, Inno Circuits Ltd filed Critical Sichuan Vocational and Technical College
Priority to CN202211206725.7A priority Critical patent/CN115297619B/en
Publication of CN115297619A publication Critical patent/CN115297619A/en
Application granted granted Critical
Publication of CN115297619B publication Critical patent/CN115297619B/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating
    • C23C18/1628Specific elements or parts of the apparatus
    • C23C18/163Supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating
    • C23C18/1632Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A printed circuit board clamping and feeding device comprises: two first tracks, two fixture, transfer mechanism, positioning mechanism. The first rails are arranged on two sides of the copper deposition pool in the length direction, and the outer sides of the first rails are also provided with second rails which are oval; the clamping mechanisms are respectively arranged at two ends of the copper deposition pool in the length direction and comprise rotating rods, and a plurality of clamping modules with uniform intervals are arranged on the rotating rods and used for clamping and overturning the circuit board; the transfer mechanism comprises a plurality of transfer units moving along the track of the first track, each transfer unit comprises a connecting rod, two ends of each connecting rod are respectively and rotatably arranged on the corresponding connecting block in a penetrating mode, the connecting blocks are arranged on the first track, and the connecting rods are provided with a plurality of transfer modules used for clamping the circuit board; the positioning mechanism comprises a plurality of positioning components moving along the track of the second rail and used for positioning the transfer unit. The circuit board is automatically clamped and transferred, workers are prevented from contacting with liquid medicine, health of the workers is guaranteed, meanwhile, a plurality of circuit boards are clamped, and production efficiency is improved.

Description

Printed circuit board centre gripping material feeding unit
Technical Field
The invention relates to the technical field of printed circuit board production, in particular to a clamping and feeding device for a printed circuit board.
Background
In the structure of the circuit board, different circuit layers are connected through metallized holes, a thin layer of chemical copper is deposited on a drilled hole wall base material which is not conductive, the chemical copper is used as a substrate for electroplating copper at the back, the circuit board needs to be soaked in a citric acid water solution before and after copper deposition treatment, so that the copper foil on the surface of the circuit board and the copper layer in the hole are prevented from being oxidized and influencing the quality, in the copper deposition process, the circuit board is taken down from a copper deposition device or placed on the copper deposition device in a manual mode, in the process, the copper deposition liquid medicine and the citric acid water solution are inevitably contacted, water has certain acidity, workers can influence the health of the workers if grasping the board for a long time, and meanwhile, manual operation can only grasp one circuit board at a time, and the rapid production is not facilitated.
Disclosure of Invention
To the not enough of above-mentioned relevant prior art, this application provides a printed circuit board centre gripping material feeding unit, can carry out the centre gripping and transfer to heavy copper pond to the circuit board automatically to shift out from the pond transfer, avoid the contact between workman and the liquid medicine as far as possible, guarantee that the workman is healthy, and centre gripping polylith circuit board simultaneously improves production efficiency at this in-process.
In order to achieve the above object, the present invention employs the following techniques:
the utility model provides a printed circuit board centre gripping material feeding unit, locates on the heavy copper bath, includes: the device comprises a first track, two clamping mechanisms, a transfer mechanism and a positioning mechanism.
The two first rails are respectively arranged on two sides of the copper deposition pool in the length direction, the outer side of each first rail is also provided with a second rail, and the first rail and the second rail are elliptic; the two clamping mechanisms are respectively arranged at two ends of the length direction of the copper deposition pool and comprise rotating rods which move along the horizontal direction and the vertical direction and rotate around the axes of the rotating rods, and a plurality of clamping modules which are uniformly spaced are arranged on the rotating rods and are used for clamping and overturning the circuit board; the transfer mechanism comprises a plurality of transfer units which are arranged on the first track and move along the track of the first track, each transfer unit comprises a connecting rod, two ends of each connecting rod respectively penetrate through the connecting blocks in a rotatable mode, the connecting blocks are arranged on the first track and driven by the first power modules, and the connecting rods are provided with a plurality of transfer modules for clamping and transferring the circuit board on one clamping mechanism; the positioning mechanism comprises a plurality of positioning components arranged on the second track, and the positioning components are driven by the second power module to move along the track of the second track and are used for positioning the transfer unit.
Further, the clamping module comprises two moving rings which are symmetrically arranged and move in opposite directions, the moving rings are sleeved on the rotating rod, the rotating rod is hollow and is provided with one end in a penetrating mode, a lead screw is arranged inside the rotating rod, one end of the lead screw penetrates out of the rotating rod and is connected onto the supporting frame, one end of the lead screw is connected with the second motor, the second motor is installed on the supporting frame, and the supporting frame is installed on the rotating rod.
Further, the dwang lateral wall is equipped with two sets of symmetrical arrangement's logical groove between two removal circles, every group leads to the groove and has two, and symmetrical arrangement, the inside first baffle that is equipped with a plurality of intervals even of dwang, and first baffle is located between two adjacent logical grooves, first baffle separates the screw thread of lead screw for the multistage, and the revolve of two adjacent screw threads is opposite, it is equipped with the lug of two symmetries to remove the circle inner wall, the lug slides and locates logical inslot, be connected with the movable plate between the lug, the movable plate is located inside the dwang, and overlap respectively and locate on the multistage screw thread of lead screw, both ends all are equipped with two symmetrical arrangement's first splint about the removal circle, first splint be L shape and with remove between the circle through articulated being connected, be used for centre gripping circuit board.
Further, the clamping module still includes the protruding pole of two symmetrical arrangement, and the protruding pole is installed on the dwang, and the protruding pole both sides all are equipped with the pin of two symmetrical arrangement, and the pin includes oblique section and straight section, and wherein the oblique section is installed on the protruding pole, and first splint are located between two pins, and during the application, the lateral wall of first splint contacts with the oblique section of pin.
Furtherly, both ends still are equipped with the flange about the removal circle, and the flange both sides all are equipped with the spring, and the spring other end is connected with first splint, and the spring is in compression state all the time.
Further, the dwang both ends wear to locate respectively on the installation piece, and the installation piece is installed in the removal end of first telescopic link, and the stiff end of first telescopic link is connected on the removal end of horizontal linear mechanism, and horizontal linear mechanism installs in the one end in heavy copper pond, and the dwang other end is connected first motor, and first motor is installed on the installation piece.
Furthermore, the transfer module comprises two symmetrically-arranged moving blocks which move oppositely, a plurality of second partition plates with uniform intervals are arranged on the connecting rod, the moving blocks are sleeved on the connecting rod and are positioned between every two adjacent second partition plates, two symmetrically-arranged limiting grooves are formed in the connecting rod between every two adjacent second partition plates, the limiting grooves are arranged in a vertically-penetrating mode, a U-shaped frame is arranged at the lower end of each moving block, a screw rod is arranged in the U-shaped frame, a polish rod at the upper end of the screw rod penetrates through the moving blocks, and the polish rod penetrates through the limiting grooves; the movable block below still is equipped with the second splint of two symmetrical arrangement, the U-shaped frame both sides are located respectively to the second splint and connect on the movable block through articulated, the second splint are L shape, and the vertical section of second splint is equipped with the slope that leans out, the levelness of second splint is located the below of U-shaped frame, the cover is equipped with the oppression frame on the screw rod, be equipped with the spacing hole of two symmetrical arrangement on the oppression frame, the vertical section of second splint is worn to locate in spacing hole, during the application, the lower limb in spacing hole and the oblique section contact of oppression frame.
Furthermore, one side, close to the second partition plate, of the top surface of the moving block is also provided with a through hole, a limiting rod penetrates through the through hole, a stop block is arranged at the upper end of the limiting rod and used for abutting against the top surface of the moving block, and a clamping groove is formed in the inner side of the limiting rod in the vertical direction and used for limiting the side edge of the circuit board.
Further, the transfer mechanism still includes two lifter plates, the lifter plate is located heavy copper bath length direction both ends respectively, the lifter plate is connected in the expansion end of second telescopic link, first track top is equipped with the diaphragm, the stiff end of second telescopic link is installed on the diaphragm, be equipped with a plurality of rectangular holes along its length direction on the lifter plate, wear to be equipped with the pivot in the rectangular hole, rectangular hole both sides still are equipped with the spout that runs through, wear to be equipped with in the spout and remove the frame, the pivot both ends are all worn to locate on removing the frame, the third motor is connected to the pivot upper end, the third motor is installed on removing the frame, the pivot lower extreme is equipped with the cross round pin, the top of screw rod is equipped with the cross recess, when using, cross round pin and cross recess cooperation.
Further, the lifter plate bottom surface still is equipped with the even third telescopic link in a plurality of intervals along its length direction, the expansion end of third telescopic link is equipped with the push rod, the push rod side is equipped with first T-slot along its length direction, it is equipped with the second T-slot along the width direction of lifter plate to remove the frame bottom surface, the shape piece is worn to be equipped with in the second T-slot, the shape piece is equipped with the L-shaped piece, the back of L-shaped piece is equipped with branch, branch one end is equipped with the ring, the ring slides and locates first T-slot, be equipped with the couple on the dog, during the application, the L-shaped piece penetrates in the couple.
Further, locating component includes the horizontal pole, and the horizontal pole both ends are connected in the orbital removal end of second, wears to be equipped with the even locating lever in a plurality of intervals on the horizontal pole, and locating lever one end is connected on even board, still is equipped with the retaining ring on the locating lever for the horizontal pole is received to the butt, is equipped with a plurality of locating holes that run through on the connecting rod, and during the application, the locating lever is worn to locate in the locating hole.
Furthermore, the two sides of the length direction of the copper deposition pool are respectively provided with two symmetrically-arranged fourth telescopic rods, and the fourth telescopic rods are located on the inner side of the second track and used for penetrating through the cross rod and jacking the connecting plate.
The invention has the beneficial effects that:
1. the circuit board can be automatically clamped and transferred to the copper deposition tank and automatically transferred out of the tank by matching of the clamping mechanism and the transfer mechanism, contact between workers and liquid medicine is avoided as much as possible, so that the health of the workers is ensured, in the process, the clamping mechanism and the transfer mechanism can simultaneously clamp a plurality of circuit boards, the clamping and transferring efficiency of the circuit boards is greatly improved, the production efficiency is further improved, and when the transfer mechanism clamps the circuit boards to perform the copper deposition process in the copper deposition tank, the positioning mechanism is used for positioning the connecting rod, so that the circuit boards are always kept in a vertical state, and the copper deposition effect is ensured;
2. the stop lever is arranged on the rotating rod to force the two first clamping plates to move oppositely, so that the circuit board can be clamped, and the clamped circuit boards are positioned close to the center, so that the first clamping plates can clamp circuit boards with different sizes, and after clamping is finished, the first clamping plates can be automatically separated under the action of the springs, and the next clamping is ensured to be carried out smoothly;
3. a plurality of transfer modules in the transfer mechanism can also simultaneously clamp and transfer a plurality of circuit boards, can also adapt to circuit boards with different sizes, and simultaneously limit the side edge of the circuit board by using a limit rod in the process of transferring the circuit board so as to ensure that the circuit board cannot deform when moving in a copper deposition pool;
4. one end of the supporting rod is arranged in a first T-shaped groove of the push rod in a sliding mode, and when the push rod moves, the supporting rod is guaranteed to be well connected with the push rod, so that the L-shaped plate can smoothly enter a hook above the limiting rod;
5. the two ends of the second track are provided with telescopic rods used for jacking the connecting plate, so that the positioning rods can smoothly enter the positioning holes of the connecting rod, and the limiting rods are always kept in a vertical state.
Drawings
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Fig. 1 is a perspective view of an embodiment of the present application.
Fig. 2 is a perspective view of a clamping mechanism according to an embodiment of the present application.
Fig. 3 is an enlarged schematic view of a portion a of fig. 2.
Fig. 4 is a schematic cross-sectional structure perspective view of a clamping mechanism according to an embodiment of the present application.
Fig. 5 is a perspective view of a moving ring according to an embodiment of the present application.
Fig. 6 is a perspective view of a transfer unit according to an embodiment of the present application.
Fig. 7 is a perspective view of a moving block according to an embodiment of the present application.
Fig. 8 is a schematic perspective view of a lifting plate according to an embodiment of the present application.
Fig. 9 is a perspective view of the floor of the lifter plate according to the embodiment of the present application.
Fig. 10 is an enlarged schematic view of fig. 9 at B.
Fig. 11 is a perspective view of a positioning mechanism according to an embodiment of the present application.
Fig. 12 is a perspective view of a positioning assembly according to an embodiment of the present application.
Description of reference numerals: 100-first track, 200-clamping mechanism, 300-transfer mechanism, 400-positioning mechanism, 500-copper precipitation tank, 101-second track, 102-horizontal plate, 201-rotating rod, 202-installation block, 203-first telescopic rod, 204-first motor, 205-screw rod, 206-support frame, 207-second motor, 208-moving ring, 209-through groove, 210-lug, 211-moving plate, 212-first clapboard, 213-first clamping plate, 214-lug, 215-stop rod, 216-lug plate, 217-spring, 301-connecting rod, 302-connecting block, 303-moving block, 304-second clapboard, 305-limiting groove, 306-U-shaped frame, U-shaped frame 307-screw rod, 308-second splint, 309-oppression frame, 310-spacing hole, 311-through hole, 312-spacing rod, 313-dog, 314-draw groove, 315-second telescopic link, 316-lifter plate, 317-rectangular hole, 318-pivot, 319-spout, 320-removal frame, 321-third motor, 322-cross pin, 323-cross groove, 324-third telescopic link, 325-push rod, 326-first T-shaped groove, 327-second T-shaped groove, 328-I-shaped block, 329-L-shaped block, 330-branch, 331-ring, 332-locating hole, 401-horizontal rod, 402-locating rod, 403-connecting plate, 404-retaining ring, 405-fourth telescopic link.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
As shown in fig. 1 to 12, an embodiment of the present application provides a printed circuit board clamping and feeding device, which is disposed on a copper deposition tank 500, and includes: a first track 100, two clamping mechanisms 200, a transfer mechanism 300, a positioning mechanism 400, etc.
The two first rails 100 are respectively arranged on two sides of the copper deposition pool 500 in the length direction, the second rail 101 is further arranged on the outer side of the first rail 100, the first rail 100 and the second rail 101 are in an elliptical shape and respectively comprise two straight line sections and two semicircular sections, and two ends of the two straight line sections are respectively connected with the two semicircular sections; the two clamping mechanisms 200 are respectively arranged at two ends of the length direction of the copper deposition pool 500 and comprise rotating rods 201 which move along the horizontal direction and the vertical direction and rotate around the axes of the rotating rods, and a plurality of clamping modules with uniform intervals are arranged on the rotating rods 201 and used for clamping and overturning the circuit board; the transfer mechanism 300 comprises a plurality of transfer units which are arranged on the first track 100 and move along the track of the first track, each transfer unit comprises a connecting rod 301, two ends of each connecting rod 301 are respectively and rotatably arranged on the corresponding connecting block 302 in a penetrating manner, the corresponding connecting block 302 is arranged on the first track 100 and is driven by a first power module, a plurality of transfer modules are arranged on each connecting rod 301 and are used for clamping and transferring the circuit board on one clamping mechanism 200 into the copper deposition pool 500, and the corresponding connecting rod 301 can freely rotate relative to the corresponding connecting block 302, so that the corresponding transfer module always keeps a direction under the action of the gravity of the corresponding transfer module, and one clamping mechanism 200 is used for clamping the circuit board which is subjected to copper deposition on the corresponding transfer module; the positioning mechanism 400 includes a plurality of positioning components mounted on the second track 101, the positioning components are driven by the second power module to move along the track of the second track 101 for positioning the transfer unit, and the cooperation between the first track 100 and the first driving module and the cooperation between the second track 101 and the second driving module can adopt a common arc-shaped guide rail system.
Specifically, as shown in fig. 1 to fig. 5, the clamping module includes two moving rings 208 that are symmetrically disposed and move in opposite directions, the moving rings 208 are sleeved on the rotating rod 201, the rotating rod 201 is hollow and penetrates one end of the rotating rod 201, a screw rod 205 is installed inside the rotating rod 201, one end of the screw rod 205 penetrates through the rotating rod 201 and is connected to a support frame 206, one end of the screw rod 205 is connected to a second motor 207, the second motor 207 is installed on the support frame 206, the screw rod 205 is driven by the second motor 207 to rotate, the support frame 206 is installed on the rotating rod 201, two sets of symmetrically disposed through slots 209 are formed on a side wall of the rotating rod 201 between the two moving rings 208, each set of through slots 209 is symmetrically disposed, a plurality of first partition plates 212 with uniform intervals are disposed inside the rotating rod 201, and the first partition plates 212 are located between two adjacent through slots 209, the first partition 212 divides the screw thread of the screw rod 205 into multiple sections, the turning directions of two adjacent screw threads are opposite, two symmetrical lugs 210 are arranged on the inner wall of the movable ring 208, the lugs 210 are slidably arranged in the through groove 209, the through groove 209 can limit the lugs 210, so that the movable ring 208 can only move along the axial direction of the rotating rod 201, a movable plate 211 is connected between the lugs 210, the movable plate 211 is positioned inside the rotating rod 201 and is respectively sleeved on the multiple sections of screw threads of the screw rod 205, when the screw rod 205 rotates, the two movable rings 208 of each clamping module can move in opposite directions, because two first clamping plates 213 which are symmetrically arranged are arranged at the upper end and the lower end of the movable ring 208, the first clamping plates 213 are L-shaped and are connected with the movable ring 208 through hinges, and the first clamping plates 213 on the two movable rings 208 can also move in opposite directions for clamping the circuit board.
Specifically, as shown in fig. 2 to fig. 4, the clamping module further includes two symmetrically arranged protruding rods 214, the protruding rods 214 are mounted on the rotating rod 201, two symmetrically arranged blocking rods 215 are disposed on two sides of the protruding rods 214, the blocking rods 215 include an inclined section and a straight section, one end of the inclined section is mounted on the protruding rods 214, and the other end of the inclined section is inclined away from the axis of the rotating rod 201, the first clamping plate 213 is located between the two blocking rods 215, when the two moving rings 208 of the clamping module are at the farthest distance, the first clamping plate 213 is located at the straight section of the blocking rods 215, and when a circuit board needs to be clamped, the two moving rings 208 both move towards the protruding rods 214, and the side wall of the first clamping plate 213 will contact with the inclined sections of the blocking rods 215, so that the distance between the two first clamping plates 213 located on the same moving ring 208 is forced to be closer and closer, thereby clamping the circuit board.
More specifically, as shown in fig. 3 to 5, the upper and lower ends of the movable ring 208 are further provided with protruding plates 216, two sides of each protruding plate 216 are provided with springs 217, the other end of each spring 217 is connected with the first clamping plate 213, and the springs 217 are always in a compressed state, so that after the circuit board is clamped, the two first clamping plates 213 can be automatically separated under the elastic force of the springs 217 to wait for the next clamping.
Specifically, as shown in fig. 1-2, wear to locate the installation piece 202 respectively with the both ends of dwang 201, and installation piece 202 is installed in the removal end of first telescopic link 203, thereby realize reciprocating to dwang 201, the stiff end of first telescopic link 203 is connected on the removal end of horizontal linear mechanism, horizontal linear mechanism installs in the one end of heavy copper bath 500, horizontal linear mechanism also can adopt the structure of motor lead screw to drive, first motor 204 is connected to the dwang 201 other end, first motor 204 is installed on installation piece 202, first motor 204 orders about dwang 201 and rotates, the angle of rotation at every turn is 180 degrees, so that the centre gripping module carries out the centre gripping to the circuit board.
Specifically, as shown in fig. 6 to 7, the transfer module includes two symmetrically arranged moving blocks 303 which move in opposite directions, a plurality of second partition plates 304 with uniform intervals are arranged on the connecting rod 301, each second partition plate 304 separates adjacent transfer modules, the moving blocks 303 are sleeved on the connecting rod 301 and located between two adjacent second partition plates 304, two symmetrically arranged limiting grooves 305 are arranged between two adjacent second partition plates 304 of the connecting rod 301, the limiting grooves 305 are arranged in a vertically penetrating manner, a U-shaped frame 306 is arranged at the lower end of the moving block 303, a screw 307 is arranged in the U-shaped frame 306, a polish rod at the upper end of the screw 307 penetrates through the moving block 303 and penetrates through the limiting groove 305, so that when the moving block 303 moves, a polish rod part at the upper end of the screw 307 can also move in the limiting groove 305; the moving block 303 is further provided with two second clamping plates 308 which are symmetrically arranged below the moving block 303, the second clamping plates 308 are respectively arranged on two sides of the U-shaped frame 306 and are connected to the moving block 303 through hinges, the second clamping plates 308 are L-shaped, the vertical sections of the second clamping plates 308 are provided with inclined portions which incline outwards, the levelness of the second clamping plates 308 is located below the U-shaped frame 306, the screw 307 is sleeved with a pressing frame 309, the pressing frame 309 is provided with two limiting holes 310 which are symmetrically arranged, the vertical sections of the second clamping plates 308 penetrate through the limiting holes 310, when the circuit board needs to be clamped, the screw 307 rotates, the pressing frame 309 moves downwards, the lower edge of the limiting hole 310 of the pressing frame 309 is in contact with the inclined sections of the pressing frame 309, and the two second clamping plates 308 on the moving block 303 are forced to move in opposite directions, so that the circuit board on the clamping module is clamped.
More specifically, as shown in fig. 1 and 6-7, a through hole 311 is further formed in one side, close to the second partition 304, of the top surface of the moving block 303, a limiting rod 312 penetrates through the through hole 311, a stop 313 is arranged at the upper end of the limiting rod 312 and used for abutting against the top surface of the moving block 303, a clamping groove 314 is formed in the inner side of the limiting rod 312 in the vertical direction, the limiting rod 312 can move downwards after the circuit board is clamped by the second clamping plate 308, the edge of the circuit board can be clamped in the clamping groove 314 of the limiting rod 312, therefore, the circuit board can be limited on the side edge, and the circuit board cannot deform in the process of moving in the copper deposition pool 500.
Specifically, as shown in fig. 1 and 7 to 10, the transfer mechanism 300 further includes two lifting plates 316, the lifting plates 316 are respectively located at two ends of the copper deposition pool 500 in the length direction, the lifting plates 316 are connected to the movable end of the second telescopic rod 315, a transverse plate 102 is disposed above the first track 100, the fixed end of the second telescopic rod 315 is mounted on the transverse plate 102, a plurality of elongated holes 317 are disposed on the lifting plates 316 along the length direction thereof, a rotating shaft 318 is disposed in each elongated hole 317, sliding grooves 319 are further disposed on two sides of each elongated hole 317, a moving frame 320 is disposed in each sliding groove 319, two ends of each rotating shaft 318 are disposed on the moving frame 320, the upper end of each rotating shaft 318 is connected to a third motor 321, the third motor 321 is mounted on the moving frame 320, the moving frame 320 can move in the sliding grooves 319 to adapt to the position of the moving block 303, a cross pin 322 is disposed at the lower end of the rotating shaft 318, a cross groove 323 is disposed at the top of the screw 307, when the transfer mechanism is applied, the cross pin 322 is matched with the cross groove 323, the third motor 321 drives the rotating shaft 318 to rotate, and the cross pin 322 is matched with the cross groove 323, so as to rotate the screw 307.
Specifically, as shown in fig. 6 to 10, the bottom surface of the lifting plate 316 is further provided with a plurality of third telescopic rods 324 at even intervals along the length direction thereof, a movable end of each third telescopic rod 324 is provided with a push rod 325, a side surface of each push rod 325 is provided with a first T-shaped groove 326 along the length direction thereof, the bottom surface of the movable frame 320 is provided with a second T-shaped groove 327 along the width direction of the lifting plate 316, an i-shaped block 328 penetrates through the second T-shaped groove 327, the i-shaped block 328 is provided with an L-shaped block 329, a support rod 330 is arranged on the back surface of the L-shaped block 329, one end of the support rod 330 is provided with a ring 331, the ring 331 is slidably arranged in the first T-shaped groove 326, after the movable frame 320 is moved, the ring 331 at one end of the support rod 330 also moves in the first T-shaped groove 326, so as to ensure good connection between the support rod 330 and the push rod 325, when the push rod 325 is driven by the third telescopic rods 324 to move, the i-shaped block 328 at one end of the support rod 330 can be smoothly driven to move along the first T-shaped groove 326, and the stop 313 is provided with a hook, and the L-shaped block 329 is inserted into the stop 312 and lifted up when it is applied.
Specifically, as shown in fig. 1, 6, 11 to 12, the positioning assembly includes a cross bar 401, two ends of the cross bar 401 are connected to the moving end of the second track 101, a plurality of positioning rods 402 with uniform intervals penetrate through the cross bar 401, one end of each positioning rod 402 is connected to a connecting plate 403, when the cross bar 401 moves from the lowest point to the highest point of the second track 101, the cross bar 401 can turn over by 180 degrees, the connecting plate 403 can also change from a state above the cross bar 401 to a state below the cross bar 401, a retaining ring 404 is further disposed on each positioning rod 402 and used for abutting against the cross bar 401 to prevent the connecting plate 403 from falling off the cross bar 401 when being below the cross bar 401, a plurality of penetrating positioning holes 332 are disposed on the connecting bar 301, and when the positioning rods 402 penetrate through the positioning holes 332 during application, so that the circuit board is always kept in a vertical state to ensure a copper deposition effect.
More specifically, as shown in fig. 1, 6, and 12, two symmetrically arranged fourth telescopic rods 405 are disposed on both sides of the copper deposition pool 500 in the length direction, and the fourth telescopic rods 405 are located inside the second rail 101, and when the cross rod 401 is located at both ends of the lowest point of the second rail 101, the cross rod 401 passes through the cross rod 401 and jacks up the connecting plate 403, so that the positioning rod 402 can smoothly pass through the positioning hole 332 of the connecting rod 301.
The detailed operation steps of transferring and copper deposition are carried out on the circuit board by using the device as follows:
firstly, a circuit board soaked in a citric acid aqueous solution is placed below a clamping mechanism 200, a horizontal linear mechanism is started to enable a rotating rod 201 to move to the position above the circuit board, then a first telescopic rod 203 is started to enable the rotating rod 201 to descend, at the moment, the circuit board is located between two first clamping plates 213, a second motor 207 is started to drive a screw rod 205 to rotate, two moving rings 208 of each clamping module move oppositely, the first clamping plates 213 gradually approach under the action of inclined sections of stop rods 215 to clamp the circuit board, then the first telescopic rod 203 is started again to enable the rotating rod 201 with the circuit board clamped to ascend, then a first motor 204 is started to drive the rotating rod 201 to rotate 180 degrees, at the moment, the circuit board clamped by the first clamping plates 213 is overturned to the upward direction from the downward direction, then the first telescopic rod 203 is started to descend for a preset distance, and the horizontal linear mechanism is started to enable the rotating rod 201 to move towards a connecting rod 301;
before that, the second telescopic rod 315 is started to lower the lifting plate 316 to make the bottom surface of the L-shaped block 329 flush with the top surface of the stop block 313, then the third telescopic rod 324 is started to make the push rod 325 drive the supporting rod 330 to move along the second T-shaped groove 327, the horizontal section of the L-shaped block 329 enters the hook of the stop block 313, and then the second telescopic rod 315 is started again to make the lifting plate 316 rise, so that the limiting rod 312 is driven to move upwards for a distance until the lower end of the limiting rod 312 is higher than the bottom surface of the U-shaped frame 306;
when the circuit board is clamped by the first clamping plate 213 on the rotating rod 201 and moves to the lower part of the connecting rod 301, the first telescopic rod 203 is started to move the rotating rod 201 upwards for a distance, the upper part of the circuit board enters between the two second clamping plates 308, at this time, the second telescopic rod 315 is started again to lower the lifting plate 316, the edge of the circuit board enters into the clamping groove 314 of the limiting rod 312, so that the side limit of the circuit board is realized, the cross pin 322 at the lower end of the rotating shaft 318 is matched with the cross groove 323 at the top of the screw 307, the third motor 321 is started, the rotating shaft 318 drives the screw 307 to rotate, so that the pressing frame 309 is lowered, the lower edge of the limiting hole 310 of the pressing frame 309 is contacted with the inclined section of the pressing frame 309, so that the two second clamping plates 308 on the moving block 309 are forced to move towards each other, and the circuit board on the clamping module is clamped, at this time, the first telescopic rod 203 drives the rotating rod 201 to descend for a certain distance and to be away from the copper deposition pool 500, the circuit board is continuously clamped, the lifting plate 316 ascends, the transfer module clamps the circuit board to move along the track of the first rail 100, so that the circuit board enters the copper deposition pool 500, at this time, the fourth telescopic rod 405 is started to jack up the connecting plate 403, when the transfer module moves to the lowest point of the first rail 100, the connecting rod 301 is located right below the cross rod 401, the connecting plate 403 falls down, the positioning rod 402 below the connecting plate enters the positioning hole 332 of the connecting rod 301, the cross rod 401 moves along with the connecting rod 301, and when the transfer module moves to the other end of the first rail 100, the connecting plate 403 is jacked up by the fourth telescopic rod 405 again, the positioning rod 402 is moved out of the positioning hole 332 of the connecting rod 301, and then the other clamping mechanism 200 clamps and transfers the circuit board after copper deposition by the reverse steps.
The above is only a preferred embodiment of the present invention and is not intended to limit the present invention, and it is apparent that those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (10)

1. The utility model provides a printed circuit board centre gripping material feeding unit which characterized in that includes:
the two first rails (100) are respectively arranged on two sides of the length direction of the copper deposition pool (500), the second rail (101) is further arranged on the outer side of the first rail (100), and the first rail (100) and the second rail (101) are elliptic;
the two clamping mechanisms (200) are respectively arranged at two ends of the length direction of the copper deposition pool (500), and comprise rotating rods (201) which move along the horizontal direction and the vertical direction and rotate around the axes of the rotating rods, and a plurality of clamping modules with uniform intervals are arranged on the rotating rods (201) and are used for clamping and overturning the circuit board;
the transfer mechanism (300) comprises a plurality of transfer units which are arranged on the first track (100) and move along the track of the first track, each transfer unit comprises a connecting rod (301), two ends of each connecting rod (301) are respectively and rotatably arranged on a connecting block (302) in a penetrating manner, each connecting block (302) is arranged on the first track (100) and driven by a first power module, and a plurality of transfer modules are arranged on the connecting rods (301) and used for clamping and transferring the circuit board on one clamping mechanism (200);
the positioning mechanism (400) comprises a plurality of positioning components arranged on the second track (101), and the positioning components are driven by a second power module to move along the track of the second track (101) and are used for positioning the transfer unit.
2. The printed circuit board clamping and feeding device according to claim 1, wherein the clamping module comprises two moving rings (208) which are symmetrically arranged and move in opposite directions, the moving rings (208) are sleeved on the rotating rod (201), the rotating rod (201) is hollow and penetrates through one end, a lead screw (205) is installed inside the rotating rod (201), one end of the lead screw (205) penetrates out of the rotating rod (201) and is connected to a supporting frame (206), one end of the lead screw (205) is connected with a second motor (207), the second motor (207) is installed on the supporting frame (206), and the supporting frame (206) is installed on the rotating rod (201);
dwang (201) lateral wall is two remove the logical groove (209) that is equipped with two sets of symmetrical arrangement between circle (208), every group lead to groove (209) and have two, and symmetrical arrangement, dwang (201) inside is equipped with first baffle (212) that a plurality of intervals are even, just first baffle (212) are located adjacent two lead to between the groove (209), first baffle (212) will the screw thread of lead screw (205) is separated for the multistage, and adjacent two screw threads revolve to opposite, removal circle (208) inner wall is equipped with lug (210) of two symmetries, lug (210) slide locate lead to in the groove (209), be connected with between lug (210) (211), movable plate (211) are located inside dwang (201) to overlap respectively and locate on the multistage screw thread of lead screw (205),
remove circle (208) upper and lower both ends and all be equipped with first splint (213) of two symmetrical arrangement, first splint (213) be L shape and with remove and connect through articulated between circle (208) for the centre gripping circuit board.
3. The printed circuit board clamping and feeding device according to claim 2, wherein the clamping module further comprises two symmetrically arranged protruding rods (214), the protruding rods (214) are mounted on the rotating rod (201), two symmetrically arranged stop rods (215) are arranged on two sides of each protruding rod (214), each stop rod (215) comprises an inclined section and a straight section, the inclined section is mounted on the protruding rods (214), the first clamping plate (213) is located between the two stop rods (215), and when in use, the side wall of the first clamping plate (213) is in contact with the inclined section of each stop rod (215).
4. The printed circuit board clamping and feeding device as claimed in claim 2, wherein the upper and lower ends of the moving ring (208) are further provided with a protruding plate (216), two sides of the protruding plate (216) are provided with springs (217), the other ends of the springs (217) are connected with the first clamping plate (213), and the springs (217) are always in a compressed state.
5. The printed circuit board clamping and feeding device according to claim 1, wherein two ends of the rotating rod (201) are respectively arranged on the mounting block (202) in a penetrating manner, the mounting block (202) is mounted at the moving end of the first telescopic rod (203), the fixed end of the first telescopic rod (203) is connected to the moving end of the horizontal linear mechanism, the horizontal linear mechanism is mounted at one end of the copper deposition pool (500), the other end of the rotating rod (201) is connected with the first motor (204), and the first motor (204) is mounted on the mounting block (202).
6. The printed circuit board clamping and feeding device according to claim 1, wherein the transfer module comprises two symmetrically arranged moving blocks (303) which move in opposite directions, a plurality of second partition plates (304) with uniform intervals are arranged on the connecting rod (301), the moving blocks (303) are sleeved on the connecting rod (301) and located between two adjacent second partition plates (304), two symmetrically arranged limiting grooves (305) are arranged between two adjacent second partition plates (304) of the connecting rod (301), the limiting grooves (305) are arranged in a vertically penetrating manner, a U-shaped frame (306) is arranged at the lower end of the moving block (303), a screw rod (307) is arranged in the U-shaped frame (306), a polish rod at the upper end of the screw rod (307) penetrates through the moving block (303), and the polish rod penetrates through the limiting grooves (305);
the movable block (303) below still is equipped with two symmetrical arrangement's second splint (308), second splint (308) are located respectively U-shaped frame (306) both sides and through articulated connect in on the movable block (303), second splint (308) are L shape, just the vertical section of second splint (308) is equipped with the slope portion that leans out, the levelness of second splint (308) is located the below of U-shaped frame (306), the cover is equipped with oppression frame (309) on screw rod (307), be equipped with two symmetrical arrangement's spacing hole (310) on oppression frame (309), the vertical section of second splint (308) is worn to locate in spacing hole (310), during the application, the lower limb of spacing hole (310) with the oblique section contact of oppression frame (309).
7. The printed circuit board clamping and feeding device as claimed in claim 6, wherein a through hole (311) is further formed in one side, close to the second partition plate (304), of the top surface of the moving block (303), a limiting rod (312) penetrates through the through hole (311), a stop block (313) is arranged at the upper end of the limiting rod (312) and used for abutting against the top surface of the moving block (303), and a clamping groove (314) is formed in the inner side of the limiting rod (312) in the vertical direction and used for limiting the side edge of a circuit board.
8. The printed circuit board clamping and feeding device of claim 7, wherein the transfer mechanism (300) further comprises two lifting plates (316), the lifting plates (316) are respectively located at two ends of the length direction of the copper deposition pool (500), the lifting plates (316) are connected to the movable end of a second telescopic rod (315), a transverse plate (102) is arranged above the first rail (100), the fixed end of the second telescopic rod (315) is installed on the transverse plate (102), a plurality of strip holes (317) are formed in the lifting plates (316) along the length direction of the lifting plates, a rotating shaft (318) penetrates through the strip holes (317), through sliding grooves (319) are formed in two sides of the strip holes (317), a moving frame (320) penetrates through the sliding grooves (319), two ends of the rotating shaft (318) penetrate through the moving frame (320), the upper end of the rotating shaft (318) is connected with a third motor (321), the third motor (321) is installed on the moving frame (320), a cross pin (322) is arranged at the lower end of the rotating shaft (318), and a cross groove (323) is matched with the cross-shaped groove (323).
9. The printed circuit board clamping and feeding device of claim 8, wherein a plurality of third telescopic rods (324) are further arranged on the bottom surface of the lifting plate (316) along the length direction of the lifting plate, a push rod (325) is arranged at the movable end of each third telescopic rod (324), a first T-shaped groove (326) is formed in the side surface of each push rod (325) along the length direction of the push rod, a second T-shaped groove (327) is formed in the bottom surface of the moving frame (320) along the width direction of the lifting plate (316), a workpiece block (328) penetrates through the second T-shaped groove (327), an L-shaped block (329) is arranged on the workpiece block (328), a support rod (330) is arranged on the back surface of the L-shaped block (329), a circular ring (331) is arranged at one end of the support rod (330), the circular ring (331) is slidably arranged in the first T-shaped groove (326), a hook is arranged on the stop block (313), and when in use, the L-shaped block (329) penetrates into the hook.
10. The printed circuit board clamping and feeding device of claim 1, wherein the positioning assembly comprises a cross rod (401), two ends of the cross rod (401) are connected to the moving end of the second rail (101), a plurality of positioning rods (402) with uniform intervals are arranged on the cross rod (401), one ends of the positioning rods (402) are connected to a connecting plate (403), a retainer ring (404) is arranged on the positioning rods (402) and used for abutting against the cross rod (401), a plurality of through positioning holes (332) are arranged on the connecting rod (301), and when in use, the positioning rods (402) are arranged in the positioning holes (332);
two sides of the length direction of the copper deposition pool (500) are respectively provided with two symmetrically-arranged fourth telescopic rods (405), and the fourth telescopic rods (405) are located on the inner side of the second track (101) and used for penetrating through the cross rods (401) and jacking the connecting plate (403).
CN202211206725.7A 2022-09-30 2022-09-30 Printed circuit board centre gripping material feeding unit Active CN115297619B (en)

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CN202211206725.7A CN115297619B (en) 2022-09-30 2022-09-30 Printed circuit board centre gripping material feeding unit

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116647981A (en) * 2023-06-19 2023-08-25 明光瑞智电子科技有限公司 Halogen-free high-TG low-loss copper-clad plate and preparation device
CN117915575A (en) * 2024-03-20 2024-04-19 苏州市亿利华电子有限公司 Gold melting device and gold melting process for six-sided copper plating of PCB
CN118175743A (en) * 2024-05-13 2024-06-11 四川英创力电子科技股份有限公司 Pressfitting circuit board transfer device

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CN113365435A (en) * 2021-08-10 2021-09-07 四川英创力电子科技股份有限公司 PCB cleaning and transferring device
CN215325376U (en) * 2021-04-02 2021-12-28 浙江万里学院 Automatic circuit board turning device
CN114227809A (en) * 2022-02-25 2022-03-25 四川英创力电子科技股份有限公司 Presser foot replacing device for drilling of circuit board
CN114538065A (en) * 2022-04-25 2022-05-27 四川英创力电子科技股份有限公司 Soak circuit board transfer device
CN114655667A (en) * 2022-05-25 2022-06-24 四川英创力电子科技股份有限公司 Automatic appearance transfer device of transferring of printed circuit board

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Publication number Priority date Publication date Assignee Title
JPH10329935A (en) * 1997-05-27 1998-12-15 Matsushita Electric Ind Co Ltd Inversing device for printed board
DE10214347A1 (en) * 2002-03-11 2003-09-25 Georg Rudolf Sillner Device for processing and handling semiconductor chips, has work stations to remove and transfer chips and transfer modules with pick-up elements.
CN206286744U (en) * 2016-11-02 2017-06-30 天津学知无涯教育信息咨询有限公司 A kind of positioning fixture for being easy to welding circuit board
JP2020019116A (en) * 2018-08-02 2020-02-06 株式会社荏原製作所 Jig for polishing device
CN215325376U (en) * 2021-04-02 2021-12-28 浙江万里学院 Automatic circuit board turning device
CN113365435A (en) * 2021-08-10 2021-09-07 四川英创力电子科技股份有限公司 PCB cleaning and transferring device
CN114227809A (en) * 2022-02-25 2022-03-25 四川英创力电子科技股份有限公司 Presser foot replacing device for drilling of circuit board
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116647981A (en) * 2023-06-19 2023-08-25 明光瑞智电子科技有限公司 Halogen-free high-TG low-loss copper-clad plate and preparation device
CN116647981B (en) * 2023-06-19 2023-10-20 明光瑞智电子科技有限公司 Halogen-free high-TG low-loss copper-clad plate and preparation device
CN117915575A (en) * 2024-03-20 2024-04-19 苏州市亿利华电子有限公司 Gold melting device and gold melting process for six-sided copper plating of PCB
CN117915575B (en) * 2024-03-20 2024-05-14 苏州市亿利华电子有限公司 Gold melting device and gold melting process for six-sided copper plating of PCB
CN118175743A (en) * 2024-05-13 2024-06-11 四川英创力电子科技股份有限公司 Pressfitting circuit board transfer device
CN118175743B (en) * 2024-05-13 2024-07-09 四川英创力电子科技股份有限公司 Pressfitting circuit board transfer device

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