CN115295656A - Manufacturing method of battery assembly - Google Patents
Manufacturing method of battery assembly Download PDFInfo
- Publication number
- CN115295656A CN115295656A CN202211220896.5A CN202211220896A CN115295656A CN 115295656 A CN115295656 A CN 115295656A CN 202211220896 A CN202211220896 A CN 202211220896A CN 115295656 A CN115295656 A CN 115295656A
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- low
- welding strip
- adhesive tape
- temperature
- battery
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000003466 welding Methods 0.000 claims abstract description 55
- 239000002390 adhesive tape Substances 0.000 claims abstract description 33
- 239000002313 adhesive film Substances 0.000 claims abstract description 21
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052709 silver Inorganic materials 0.000 claims abstract description 16
- 239000004332 silver Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000011521 glass Substances 0.000 claims abstract description 12
- 238000010030 laminating Methods 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 9
- 239000002131 composite material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052797 bismuth Inorganic materials 0.000 claims description 5
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 abstract description 7
- 230000004907 flux Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 230000032683 aging Effects 0.000 abstract description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 abstract description 2
- 230000007774 longterm Effects 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- 239000010409 thin film Substances 0.000 abstract description 2
- 238000004383 yellowing Methods 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0488—Double glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
The invention discloses a method for manufacturing a battery pack, which comprises the following steps: s1, fixing a low-temperature welding strip, S2, laying an adhesive film, S3, laying glass and a cover plate, S4 laminating and S5, assembling components. Compared with the traditional connection of the main grid and the welding strip, the manufacturing method saves the main grid, reduces the consumption of silver paste, adopts the adhesive tape to replace, greatly reduces the cost, ensures the strength and improves the power. Compared with the traditional welding of the main grid and the welding strip, the low-temperature welding strip is adopted, and the welding strip can be directly heated during lamination and is more convenient. The flux is not needed, and the yellowing risk caused by outdoor long-term aging of the flux and other materials is reduced. High-temperature infrared welding and low-temperature interconnection processes are eliminated, interconnection of the thin-film cells can be achieved, and the use amount of crystalline silicon is reduced.
Description
Technical Field
The invention relates to the field of battery pack manufacturing, in particular to a battery pack manufacturing method.
Background
In photovoltaic power generation, a photovoltaic module plays a role in receiving sunlight and converting electric energy. In practice, a battery is not a whole piece, but a plurality of batteries are spliced together to ensure the output power of the assembly, the battery pieces are connected through a welding strip, the welding strip comprises an inner copper base material and an outer soldering tin alloy layer, the melting point of the soldering tin alloy is low, the soldering tin alloy is convenient to melt, no matter the soldering tin alloy or the copper is not well connected with the battery, the adhesive force is low, therefore, in general, a silver paste is laid on the battery and is also called a main grid, the welding strip is placed on the main grid, the soldering tin alloy can be better fused with the main grid, and the firm strength is improved, however, a problem exists here, the silver paste is expensive, the proportion of the silver paste in the cost of the battery assembly is not small and reaches more than 20%, for enterprises, the cost is reduced under the condition of ensuring the power generation efficiency and the strength, and the pursuit goal is that how to improve the technology and reduce the usage amount of the silver paste, and the problem is urgently needed to be solved by technical personnel in the field.
Disclosure of Invention
The present invention is directed to a method for manufacturing a battery pack to solve the above problems.
In order to achieve the purpose, the invention provides the following technical scheme: a battery pack manufacturing method comprises the following steps:
s1: fixing the low-temperature welding strip: through the sticky tape, weld the area with low temperature and fix at the battery openly and the back, form the base member of installation, fixed for the main grid, sticky tape snap-on has avoided the main grid to use, has reduced the silver thick liquid quantity, has practiced thrift the cost, and is specific including following step: (a) preparation of a composite: bonding a low-temperature solder tape and an adhesive tape to form a composite body, (b) connecting a battery: adhering the complex to a battery to form a matrix, wrapping a low-temperature welding belt by using an adhesive tape from the outer side, and adhering two sides of the adhesive tape to the battery;
s2: laying an adhesive film: paving adhesive films on the upper surface and the lower surface of the substrate in the step S1;
s3: laying glass and cover plates: laying glass on the upper layer of adhesive film, and laying a cover plate on the lower layer of adhesive film;
s4: laminating: laminating the combined body formed in the step S3 through a laminating machine, and heating at the same time;
s5: assembly of the components: the relevant assembly and the laminated product in step S4 are assembled. Lamination is performed by a laminator.
Preferably, the middle of the low-temperature solder strip is made of copper, the outer side of the low-temperature solder strip is made of solder alloy, and the solder alloy at least comprises one or more of lead, bismuth, silver and indium. The melting point of the solder strip can be reduced, and the low-temperature solder strip is formed.
Preferably, the lamination temperature in the step S4 is 120 to 160 ℃. The specific lamination temperature is determined by the presence or absence or the content of lead, bismuth, silver, and indium in the solder alloy.
Preferably, the adhesive tape can be in the following four forms: the low-temperature welding strip comprises (1) a strip along the length direction of the low-temperature welding strip, (2) a tape perpendicular to the low-temperature welding strip and crossing a plurality of parallel low-temperature welding strips, (3) the tape is in a block shape and is arranged on each low-temperature welding strip along the length direction, and (4) the tape is in a whole block shape covering all the low-temperature welding strips, and the length of the tape is not more than that of a battery piece.
Preferably, when the adhesive tape is in a whole block shape, the adhesive tape is uniformly provided with air holes. Preventing the generation of bubbles.
Preferably, the adhesive film is POE, EVA or EPE.
Preferably, the cover plate is glass or a back plate.
Preferably, the thickness of the battery is 70-150 um.
Compared with the prior art, the invention has the beneficial effects that:
1. compared with the traditional connection of the main grid and the welding strip, the manufacturing method saves the main grid, reduces the consumption of silver paste, adopts the adhesive tape for replacement, greatly reduces the cost, ensures the strength and improves the power;
2. compared with the traditional welding of the main grid and the welding strip, the low-temperature welding strip is adopted, and the direct heating can be realized during lamination, so that the welding is more convenient;
3. the flux is not needed, so that the yellowing risk caused by outdoor long-term aging of the flux and other materials is reduced;
4. high-temperature infrared welding and low-temperature interconnection processes are eliminated, interconnection of the thin-film cells can be achieved, and the use amount of crystalline silicon is reduced.
Drawings
FIG. 1 is a schematic flow chart of a first embodiment of the present invention;
FIG. 2 is a drawing diagram of a general solder strip welded with a main grid;
FIG. 3 is a drawing diagram of a battery after the tape has been secured in accordance with the present invention;
fig. 4 is a schematic view of the connection between the battery and the adhesive tape according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1, the present invention provides a method for manufacturing a battery pack, comprising: a battery pack manufacturing method comprises the following steps:
s1: fixing the low-temperature welding strip: fixing the low-temperature welding strip on the front surface and the back surface of the battery through the adhesive tape to form a mounted matrix, and specifically comprising the following steps of: (a) preparation of a composite: bonding a low-temperature solder tape and an adhesive tape to form a composite body, (b) connecting a battery: and adhering the complex body to the battery to form a matrix, wrapping the low-temperature welding strip by using the adhesive tape from the outer side, and adhering the two sides of the adhesive tape to the battery. For the main grid is fixed, the sticky tape snap-on has avoided the main grid to use, has reduced silver thick liquid quantity, has practiced thrift the cost. The middle of the low-temperature welding strip is made of copper, the outer side of the low-temperature welding strip is made of soldering tin alloy, and the soldering tin alloy at least comprises one or more of lead, bismuth, silver and indium. The melting point of the solder strip can be reduced, and the low-temperature solder strip is formed. The adhesive tape can be in the following four forms: the low-temperature welding strip comprises (1) a strip along the length direction of the low-temperature welding strip, (2) a tape perpendicular to the low-temperature welding strip and crossing a plurality of parallel low-temperature welding strips, (3) the tape is in a block shape and is arranged on each low-temperature welding strip along the length direction, and (4) the tape is in a whole block shape covering all the low-temperature welding strips, and the length of the tape is not more than that of a battery piece. When the adhesive tape is in a whole block shape, the adhesive tape is uniformly provided with air holes. Preventing the generation of bubbles. The thickness of the battery is 70-150 um.
S2: laying an adhesive film: and (5) paving adhesive films on the upper surface and the lower surface of the base body in the step (S1). The glue film is POE, EVA or EPE.
S3: laying glass and cover plates: glass is laid on the upper layer of adhesive film, and a cover plate is laid on the lower layer of adhesive film. The cover plate is glass or a back plate.
S4: laminating: the combined product formed in step S3 is laminated by a laminator while being heated. The laminating temperature is 120-160 ℃. The specific lamination temperature is determined by the presence or absence or the content of lead, bismuth, silver, and indium in the solder alloy.
S5: assembly of components: the relevant assembly and the laminated product in step S4 are assembled. Lamination is performed by a laminator.
Test 1
A 180 ° tensile test was performed by a tensile machine:
for a common welding strip combined main grid, pad represents a welding pad point, and a welding pull test after welding is performed is shown in fig. 2;
the results of the battery after tape fixation by sampling at multiple positions are shown in fig. 3:
it can be seen from the comparison above that, the pulling force that the sticky tape produced is overall all to be greater than the intensity of welding area and main bars lug connection, that is to say, for being connected of original welding area and silver thick liquid, the joint strength of sticky tape and battery is higher, and under the condition of cost reduction, intensity still increases.
For the connection of solder strip to main grid and solder strip to tape, the same battery and lighting environment, we measured the power as follows (test conditions: 1000W/m2, 25 ℃):
| technique of | Diameter/mm of welding strip | Number of welding strips/root | Pmax（W） | Voc（V） | Isc（A） | Rs（Ω） | FF（%） | Im（A） | Vm（V） |
| Prior Art | 0.35 | 12 | 659.15 | 49.303 | 17.30 | 0.2509 | 77.29 | 16.51 | 39.93 |
| After optimization | 0.20 | 25 | 669.54 | 49.312 | 17.26 | 0.2081 | 78.66 | 16.50 | 40.57 |
Comparing the above figures, we find that the test power is changed from 659.15 to 669.54 and is also improved compared with the existing connection of solder strip and main grid, and the connection of adhesive tape and low-temperature solder strip. The composite loss of the main grid silver paste is not reduced, and the voltage is increased. The number of the solder strips is increased, the transmission distance from the auxiliary grid to the solder strips is reduced, and the resistance is reduced. Thus increasing component power.
In conclusion, in tests 1 and 2, compared with the original connection of the solder strip and the main grid, the amount of silver paste is reduced through the connection of the adhesive tape and the low-temperature solder strip, and meanwhile, the tensile strength and the power are both increased, thereby achieving three purposes.
As shown in fig. 4, a specific connection relationship between the adhesive tape and the battery includes a complex, the complex is disposed on the battery 1 to form a substrate, the substrate is covered with an upper adhesive film 4 and a lower adhesive film 4, the upper adhesive film 4 is provided with glass 5, the lower adhesive film 4 is provided with a cover plate 6, the complex includes a solder strip 2 disposed on the battery 1 and an adhesive tape 3 for fixing the solder strip 2, specifically, from top to bottom, the glass 5, the adhesive film 4, the adhesive tape 3, the solder strip 2, the battery 1, the solder strip 2, the adhesive tape 3, the adhesive film 4 and the cover plate 6.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A method for manufacturing a battery pack, comprising the steps of:
s1: fixing the low-temperature welding strip: fixing the low-temperature welding strip on the front surface and the back surface of the battery through the adhesive tape to form a mounted matrix, and specifically comprising the following steps of: (a) preparation of a composite: bonding a low-temperature solder tape and an adhesive tape to form a composite body, (b) connecting a battery: adhering the complex to a battery to form a matrix, wrapping a low-temperature welding strip by using an adhesive tape from the outer side, and adhering two sides of the adhesive tape to the battery;
s2: paving an adhesive film: paving adhesive films on the upper surface and the lower surface of the base body in the step S1;
s3: laying glass and cover plates: laying glass on the upper layer of adhesive film, and laying a cover plate on the lower layer of adhesive film;
s4: laminating: laminating the combined body formed in the step S3 through a laminating machine, and heating at the same time;
s5: assembly of components: the relevant assembly and the laminated product in step S4 are assembled.
2. The method of claim 1, wherein: the low-temperature welding strip is characterized in that the middle of the low-temperature welding strip is made of copper, the outer side of the low-temperature welding strip is made of soldering tin alloy, and the soldering tin alloy at least comprises one or more of lead, bismuth, silver and indium.
3. The method of claim 1, wherein: the laminating temperature in the step S4 is 120-160 ℃.
4. The method of claim 1, wherein: the adhesive tape can be in the following four forms: the low-temperature welding strip comprises (1) a strip along the length direction of the low-temperature welding strip, (2) an adhesive tape which is vertical to the low-temperature welding strip and spans a plurality of parallel low-temperature welding strips, (3) the adhesive tape is blocky and is arranged on each low-temperature welding strip along the length direction, and (4) the adhesive tape is in a monoblock shape covering all the low-temperature welding strips, and the length of the adhesive tape is not more than that of a battery piece.
5. The method of claim 4, wherein: when the adhesive tape is in a whole block shape, air holes are uniformly formed in the adhesive tape.
6. The method of claim 1, wherein: the adhesive film is POE, EVA or EPE.
7. The method of claim 1, wherein: the cover plate is glass or a back plate.
8. The method of claim 1, wherein: the thickness of the battery is 70-150 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211220896.5A CN115295656A (en) | 2022-10-08 | 2022-10-08 | Manufacturing method of battery assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211220896.5A CN115295656A (en) | 2022-10-08 | 2022-10-08 | Manufacturing method of battery assembly |
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| Publication Number | Publication Date |
|---|---|
| CN115295656A true CN115295656A (en) | 2022-11-04 |
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| CN202211220896.5A Pending CN115295656A (en) | 2022-10-08 | 2022-10-08 | Manufacturing method of battery assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102800713A (en) * | 2012-08-27 | 2012-11-28 | 英利能源（中国）有限公司 | Solar cell sheet and solar cell |
| CN109728131A (en) * | 2018-12-06 | 2019-05-07 | 中建材浚鑫科技有限公司 | A kind of preparation process of high density imbrication component |
| CN110993733A (en) * | 2019-12-04 | 2020-04-10 | 通威太阳能（合肥）有限公司 | Photovoltaic module manufacturing method |
| CN114068735A (en) * | 2021-11-11 | 2022-02-18 | 任佳新 | Manufacturing method of heterojunction photovoltaic cell assembly |
| CN114068734A (en) * | 2021-11-11 | 2022-02-18 | 任佳新 | Manufacturing method of photovoltaic cell assembly |
| CN114220879A (en) * | 2021-12-13 | 2022-03-22 | 任佳新 | Laminated cell assembly without main grid line electrode and preparation method thereof |
| WO2022143109A1 (en) * | 2020-12-30 | 2022-07-07 | 东方日升新能源股份有限公司 | Packaging method for solar cell module, connection method for solar cell string, solar cell module, and preparation method therefor |
-
2022
- 2022-10-08 CN CN202211220896.5A patent/CN115295656A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102800713A (en) * | 2012-08-27 | 2012-11-28 | 英利能源（中国）有限公司 | Solar cell sheet and solar cell |
| CN109728131A (en) * | 2018-12-06 | 2019-05-07 | 中建材浚鑫科技有限公司 | A kind of preparation process of high density imbrication component |
| CN110993733A (en) * | 2019-12-04 | 2020-04-10 | 通威太阳能（合肥）有限公司 | Photovoltaic module manufacturing method |
| WO2022143109A1 (en) * | 2020-12-30 | 2022-07-07 | 东方日升新能源股份有限公司 | Packaging method for solar cell module, connection method for solar cell string, solar cell module, and preparation method therefor |
| CN114068735A (en) * | 2021-11-11 | 2022-02-18 | 任佳新 | Manufacturing method of heterojunction photovoltaic cell assembly |
| CN114068734A (en) * | 2021-11-11 | 2022-02-18 | 任佳新 | Manufacturing method of photovoltaic cell assembly |
| CN114220879A (en) * | 2021-12-13 | 2022-03-22 | 任佳新 | Laminated cell assembly without main grid line electrode and preparation method thereof |
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