CN115287657A - Etching liquid medicine for cleaning copper teeth - Google Patents
Etching liquid medicine for cleaning copper teeth Download PDFInfo
- Publication number
- CN115287657A CN115287657A CN202210802891.7A CN202210802891A CN115287657A CN 115287657 A CN115287657 A CN 115287657A CN 202210802891 A CN202210802891 A CN 202210802891A CN 115287657 A CN115287657 A CN 115287657A
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- CN
- China
- Prior art keywords
- copper
- parts
- acid
- cleaning
- teeth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 64
- 239000010949 copper Substances 0.000 title claims abstract description 64
- 238000004140 cleaning Methods 0.000 title claims abstract description 31
- 238000005530 etching Methods 0.000 title claims abstract description 27
- 239000007788 liquid Substances 0.000 title claims abstract description 13
- 239000003814 drug Substances 0.000 title claims abstract description 11
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 44
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000654 additive Substances 0.000 claims abstract description 6
- 230000000996 additive effect Effects 0.000 claims abstract description 6
- 239000002738 chelating agent Substances 0.000 claims abstract description 6
- 239000003223 protective agent Substances 0.000 claims abstract description 6
- 239000003381 stabilizer Substances 0.000 claims abstract description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 24
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 24
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 15
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 12
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims description 10
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 8
- BAERPNBPLZWCES-UHFFFAOYSA-N (2-hydroxy-1-phosphonoethyl)phosphonic acid Chemical compound OCC(P(O)(O)=O)P(O)(O)=O BAERPNBPLZWCES-UHFFFAOYSA-N 0.000 claims description 6
- WTDHULULXKLSOZ-UHFFFAOYSA-N Hydroxylamine hydrochloride Chemical compound Cl.ON WTDHULULXKLSOZ-UHFFFAOYSA-N 0.000 claims description 6
- 229920002873 Polyethylenimine Polymers 0.000 claims description 6
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 6
- -1 amine nitrogen compounds Chemical class 0.000 claims description 6
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 6
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 5
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 5
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 claims description 5
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 5
- 239000001630 malic acid Substances 0.000 claims description 5
- 235000011090 malic acid Nutrition 0.000 claims description 5
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 claims description 4
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 claims description 4
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 3
- DJCYDDALXPHSHR-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethanol Chemical compound CCCOCCOCCO DJCYDDALXPHSHR-UHFFFAOYSA-N 0.000 claims description 3
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 claims description 3
- 239000005695 Ammonium acetate Substances 0.000 claims description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 3
- DMXWTKIBMJYERL-UHFFFAOYSA-N OC(=O)CCC(P(=O)=O)(C(O)=O)CC(O)=O Chemical compound OC(=O)CCC(P(=O)=O)(C(O)=O)CC(O)=O DMXWTKIBMJYERL-UHFFFAOYSA-N 0.000 claims description 3
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 3
- 229940043376 ammonium acetate Drugs 0.000 claims description 3
- 235000019257 ammonium acetate Nutrition 0.000 claims description 3
- 235000015165 citric acid Nutrition 0.000 claims description 3
- 229910001431 copper ion Inorganic materials 0.000 claims description 3
- 238000005336 cracking Methods 0.000 claims description 3
- 229960000789 guanidine hydrochloride Drugs 0.000 claims description 3
- PJJJBBJSCAKJQF-UHFFFAOYSA-N guanidinium chloride Chemical compound [Cl-].NC(N)=[NH2+] PJJJBBJSCAKJQF-UHFFFAOYSA-N 0.000 claims description 3
- 229910017464 nitrogen compound Inorganic materials 0.000 claims description 3
- PYOZTOXFQNWBIS-UHFFFAOYSA-N phenol;sodium Chemical compound [Na].OC1=CC=CC=C1 PYOZTOXFQNWBIS-UHFFFAOYSA-N 0.000 claims description 3
- 239000011780 sodium chloride Substances 0.000 claims description 3
- 229960002668 sodium chloride Drugs 0.000 claims description 3
- SIXNTGDWLSRMIC-UHFFFAOYSA-N sodium;toluene Chemical compound [Na].CC1=CC=CC=C1 SIXNTGDWLSRMIC-UHFFFAOYSA-N 0.000 claims description 3
- 230000000087 stabilizing effect Effects 0.000 claims description 3
- 239000011975 tartaric acid Substances 0.000 claims description 3
- 235000002906 tartaric acid Nutrition 0.000 claims description 3
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims 1
- PPSSQRUPSRPZON-UHFFFAOYSA-N nitrobenzene;sodium Chemical compound [Na].[O-][N+](=O)C1=CC=CC=C1 PPSSQRUPSRPZON-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- AOGZVMRBCYZTOI-UHFFFAOYSA-N 4-nitrobenzenesulfonic acid;sodium Chemical compound [Na].OS(=O)(=O)C1=CC=C([N+]([O-])=O)C=C1 AOGZVMRBCYZTOI-UHFFFAOYSA-N 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- HHGDLPTYJQQMKT-UHFFFAOYSA-M sodium;4-nitrobenzenesulfonate Chemical compound [Na+].[O-][N+](=O)C1=CC=C(S([O-])(=O)=O)C=C1 HHGDLPTYJQQMKT-UHFFFAOYSA-M 0.000 description 2
- 239000001384 succinic acid Substances 0.000 description 2
- 235000011044 succinic acid Nutrition 0.000 description 2
- 241001268993 Heterochrosis Species 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- KVCGISUBCHHTDD-UHFFFAOYSA-M sodium;4-methylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1 KVCGISUBCHHTDD-UHFFFAOYSA-M 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention relates to an etching liquid medicine for cleaning copper teeth, which comprises the following components in parts by weight: 6-11 parts of hydrogen peroxide, 2-15 parts of sulfuric acid, 0.1-2 parts of hydrogen peroxide stabilizer, 0.01-1 part of copper chelating agent, 0.01-3 parts of copper cleaning tooth accelerator, 0.01-2 parts of copper protecting agent, 0-0.1 part of additive and 60.9-95.87 parts of water. The invention has the advantages that: the copper teeth can be removed completely in a lower copper biting amount, so that the precision degree of the circuit is increased, the qualified rate of finished products is improved, and the manufacturing cost is reduced.
Description
Technical Field
The invention relates to an etching liquid medicine for cleaning copper teeth, and belongs to the field of etching liquid medicines.
Background
The circuit board is composed of three parts of glass fiber cloth, resin and copper foil, wherein the glass fiber cloth and the resin are base materials of the circuit board, and generally have a three-layer or five-layer mechanism, such as a single-sided board or a double-sided board, wherein the base material of the circuit board is positioned in the middle, and the copper foil layer is bonded through a bonding layer, and the bonding layer is generally a compound of epoxy resin series, phenolic series, acrylic series, imine series, amino series and the like.
The copper foil has two surfaces, namely a smooth surface and a rough surface, the rough surface has larger roughness, the roughness is often called copper teeth, and the copper teeth are embedded into resin to increase the contact surface and the bonding force between the copper foil and the resin. The remainder of the copper foil from which the copper teeth are removed is referred to herein as solid copper.
Generally, copper foil etches solid copper longitudinally from outside to inside in an etching liquid, and then copper teeth are etched. The copper teeth are embedded into the resin of the copper-clad plate, the exchange of copper etching liquid in the area is relatively difficult, and the efficiency of etching the copper teeth is low compared with the efficiency of etching solid copper. At present, the copper teeth are etched mainly by increasing the thickness of the copper biting amount, but the size loss of the circuit is larger, the fine degree of the circuit is reduced, the qualified rate of finished products is reduced, and the manufacturing cost is increased. At present, the development of an etching solution with strong and effective copper tooth cleaning capability is urgently needed.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides an etching liquid medicine for cleaning copper teeth, and the technical scheme of the invention is as follows:
an etching liquid medicine for cleaning copper teeth comprises the following components in parts by weight: 6-11 parts of hydrogen peroxide, 2-15 parts of sulfuric acid, 0.1-2 parts of hydrogen peroxide stabilizer, 0.01-1 part of copper chelating agent, 0.01-3 parts of copper cleaning tooth accelerator, 0.01-2 parts of copper protecting agent, 0-0.1 part of additive and 60.9-95.87 parts of water.
The hydrogen peroxide stabilizer is used for reducing the cracking of hydrogen peroxide and comprises one or a mixture of more of p-hydroxybenzene sodium sulfonate, p-nitrobenzenesulfonic acid sodium, p-methylbenzene sodium sulfonate, diethylene glycol butyl ether, diethylene glycol propyl ether and 1, 4-butanediol according to any proportion.
The copper chelating agent is used for stabilizing the copper biting amount along with the increase of copper ions, and comprises one or a mixture of more of malic acid, citric acid, tartaric acid, succinic acid and malonic acid according to any proportion.
The copper protecting agent is adsorbed on the surface of metal to form a thin film, plays a role in preventing the copper surface from being heterochromous, and mainly refers to amine nitrogen compounds, specifically imidazole and derivatives thereof, and polyethyleneimine.
The copper tooth cleaning accelerator is used for accelerating the cleaning of copper teeth, and mainly comprises one or a mixture of more of phosphoric acid, aminotrimethylene phosphonic acid, hydroxyethylidene diphosphonic acid, diethylenetriamine penta methylene phosphoric acid, 2-phosphobutane-1, 2, 4-tricarboxylic acid and ethylene diamine tetramethylene phosphoric acid according to any proportion.
The additive comprises one or a mixture of more of hydroxylamine hydrochloride, guanidine hydrochloride, polyhexamethylene guanidine, sodium chloride, ammonium acetate and dilute hydrochloric acid according to any proportion. The invention has the advantages that: the copper teeth can be removed completely in a lower copper biting amount, so that the precision degree of the circuit is increased, the qualified rate of finished products is improved, and the manufacturing cost is reduced.
Detailed Description
The invention will be further described with reference to specific embodiments, and the advantages and features of the invention will become apparent as the description proceeds. These examples are illustrative only and do not limit the scope of the present invention in any way. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention, and that such changes and substitutions are intended to be within the scope of the invention.
Example 1: an etching liquid medicine for cleaning copper teeth comprises 11 parts of hydrogen peroxide (wherein the mass percentage concentration of the hydrogen peroxide is 35%), 10 parts of sulfuric acid, 0.04 part of 1, 4-butanediol, 0.15 part of malic acid, 1 part of phosphoric acid, 1 part of hydroxyethylidene diphosphonic acid, 0.06 part of aminotrimethylene phosphonic acid, 0.1 part of imidazole and 60.9 parts of water.
Example 2: an etching liquid medicine for cleaning copper teeth comprises 6 parts of hydrogen peroxide, 10 parts of sulfuric acid, 0.2 part of sodium p-nitrobenzenesulfonate, 1.5 parts of citric acid, 2 parts of hydroxyethylidene diphosphonic acid, 0.01 part of polyethyleneimine, 0.1 part of imidazole and 70 parts of water.
Example 3: an etching liquid medicine for cleaning copper teeth comprises 8 parts of hydrogen peroxide (35%), 15 parts of sulfuric acid, 1 part of sodium p-toluenesulfonate, 1 part of malonic acid, 2 parts of diethylenetriamine pentamethylene phosphoric acid, 0.01 part of polyethyleneimine, 0.1 part of imidazole and 95.87 parts of water.
Example 4: (comparative example, increase amount of hydrogen peroxide compared to example 1): 15 parts of hydrogen peroxide (35%), 10 parts of sulfuric acid, 0.04 part of 1, 4-butanediol, 0.15 part of malic acid, 1 part of phosphoric acid, 1 part of hydroxyethylidene diphosphonic acid, 0.06 part of aminotrimethylene phosphonic acid, 0.1 part of imidazole and 80 parts of water. .
According to the addition of hydrogen peroxide, the etching speed is controlled, the hydrogen peroxide can be controlled to be 2-16 parts, but 6-11 parts, and the copper tooth cleaning effect is optimal.
Example 5 (comparative example, no copper tooth cleaning accelerator was added compared to example 2), an etching solution for cleaning copper teeth includes 6 parts of hydrogen peroxide (35%), 10 parts of sulfuric acid, 0.2 part of sodium p-nitrobenzenesulfonate, 1.5 parts of citric acid, 0.01 part of polyethyleneimine, 0.1 part of imidazole, and 90 parts of water. .
In order to control the etching speed, the hydrogen peroxide is controlled to be between 6 and 11 parts, and the copper tooth cleaning effect is optimal.
The hydrogen peroxide stabilizer is used for reducing the cracking of hydrogen peroxide and comprises one or a mixture of more of p-hydroxybenzene sodium sulfonate, p-nitrobenzenesulfonic acid sodium, p-methylbenzene sodium sulfonate, diethylene glycol butyl ether, diethylene glycol propyl ether and 1, 4-butanediol according to any proportion.
The copper chelating agent is used for stabilizing the copper biting amount along with the increase of copper ions, and comprises one or a mixture of more of malic acid, citric acid, tartaric acid, succinic acid and malonic acid according to any proportion.
The copper protecting agent is adsorbed on the surface of metal to form a thin film which plays a role of no heterochrosis on the surface of the metal, and the amine nitrogen compounds specifically comprise imidazole and derivatives thereof and polyethyleneimine.
The copper tooth cleaning accelerator is used for accelerating the copper tooth cleaning, and comprises one or a mixture of more of phosphoric acid, aminotrimethylene phosphonic acid, hydroxyethylidene diphosphonic acid, diethylenetriamine penta methylene phosphoric acid, 2-phosphobutane-1, 2, 4-tricarboxylic acid and ethylene diamine tetramethylene phosphoric acid according to any proportion. The additive comprises one or a mixture of more of hydroxylamine hydrochloride, guanidine hydrochloride, polyhexamethylene guanidine, sodium chloride, ammonium acetate and dilute hydrochloric acid according to any proportion.
The amount of sulfuric acid added must be 5 parts or more, and too low an amount results in too low an etching rate. When the amount is more than 15 parts, the copper tooth cleaning capability is reduced due to excessive increase.
Wherein Table 1 is a table comparing examples of the present invention with comparative examples.
Table 1:
based on the data, the etching solution has the advantages of strong copper tooth cleaning effect, controllable etching speed, good stability, high precision and the like, and can greatly improve the qualification rate of final finished products and reduce the manufacturing cost.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered as the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (6)
1. An etching liquid medicine for cleaning copper teeth is characterized by comprising the following components in parts by weight: 6-11 parts of hydrogen peroxide, 2-15 parts of sulfuric acid, 0.1-2 parts of hydrogen peroxide stabilizer, 0.01-1 part of copper chelating agent, 0.01-3 parts of copper cleaning tooth accelerator, 0.01-2 parts of copper protecting agent, 0-0.1 part of additive and 60.9-95.87 parts of water.
2. The etching solution for cleaning copper teeth as claimed in claim 1, wherein the hydrogen peroxide stabilizer is used for reducing the cracking of hydrogen peroxide, and comprises one or more of p-hydroxy benzene sodium sulfonate, p-nitrobenzene sodium sulfonate, p-methyl benzene sodium sulfonate, diethylene glycol butyl ether, diethylene glycol propyl ether, and 1, 4-butanediol in any proportion.
3. The etching solution for cleaning copper teeth as claimed in claim 1 or 2, wherein the copper chelating agent is used for stabilizing the effect of copper biting amount with the increase of copper ions, and comprises one or more of malic acid, citric acid, tartaric acid, succinic acid, malonic acid in any ratio.
4. The etching solution for cleaning copper teeth as claimed in claim 1 or 2, wherein the copper protecting agent is adsorbed on the metal surface to form a thin film, which has no color difference on the copper surface, and mainly refers to amine nitrogen compounds, specifically imidazole and its derivatives, and polyethyleneimine.
5. The etching solution for cleaning copper teeth according to claim 1 or 2, wherein the copper tooth cleaning accelerator is used for accelerating the effect of cleaning copper teeth, and mainly comprises one or more of phosphoric acid, aminotrimethylene phosphonic acid, hydroxyethylidene diphosphonic acid, diethylenetriamine pentamethylene phosphoric acid, 2-phosphobutane-1, 2, 4-tricarboxylic acid, and ethylenediamine tetramethylene phosphoric acid in any proportion.
6. The etching solution for cleaning copper teeth as claimed in claim 2, wherein the additive comprises one or more of hydroxylamine hydrochloride, guanidine hydrochloride, polyhexamethylene guanidine, sodium chloride, ammonium acetate and diluted hydrochloric acid in any proportion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210802891.7A CN115287657A (en) | 2022-07-09 | 2022-07-09 | Etching liquid medicine for cleaning copper teeth |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210802891.7A CN115287657A (en) | 2022-07-09 | 2022-07-09 | Etching liquid medicine for cleaning copper teeth |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115287657A true CN115287657A (en) | 2022-11-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210802891.7A Pending CN115287657A (en) | 2022-07-09 | 2022-07-09 | Etching liquid medicine for cleaning copper teeth |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115287657A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116770306A (en) * | 2023-06-28 | 2023-09-19 | 珠海市板明科技有限公司 | Rapid etching additive for carrier plate and application thereof |
| CN116770306B (en) * | 2023-06-28 | 2024-08-02 | 珠海市板明科技有限公司 | Rapid etching additive for carrier plate and application thereof |
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| WO2018070837A1 (en) * | 2016-10-14 | 2018-04-19 | 주식회사 이엔에프테크놀로지 | Etching solution composition |
| JP6443649B1 (en) * | 2018-03-23 | 2018-12-26 | パナソニックＩｐマネジメント株式会社 | Etching solution for copper thick film |
| CN109652804A (en) * | 2019-01-30 | 2019-04-19 | 湖南互连微电子材料有限公司 | A kind of novel PCB subtracts copper etchant solution and manufacture craft |
| CN111647889A (en) * | 2020-05-27 | 2020-09-11 | 湖北兴福电子材料有限公司 | Copper etching solution with stable etching rate |
| CN115458413A (en) * | 2022-09-21 | 2022-12-09 | 天水华洋电子科技股份有限公司 | Surface treatment process for integrated circuit lead frame |
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2022
- 2022-07-09 CN CN202210802891.7A patent/CN115287657A/en active Pending
Patent Citations (7)
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|---|---|---|---|---|
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