CN115284097B

CN115284097B - Polishing device

Info

Publication number: CN115284097B
Application number: CN202211179299.2A
Authority: CN
Inventors: 王宇; 余建琳
Original assignee: Meishan Boya New Material Co ltd
Current assignee: Meishan Boya New Material Co ltd
Priority date: 2022-09-27
Filing date: 2022-09-27
Publication date: 2023-02-17
Anticipated expiration: 2042-09-27
Also published as: CN116000724A; CN115945982A; CN116100398A; CN115284097A

Abstract

The embodiment of this specification provides a burnishing device, relates to grinding technical field, and burnishing device includes: the clamp is used for adsorbing a workpiece; the driving mechanism is used for driving the clamp to move; a polishing pad for polishing a workpiece; the polishing disc comprises a base, a first elastic layer and a second elastic layer, wherein the first elastic layer is arranged between the base and the second elastic layer, and the elastic modulus of the first elastic layer is smaller than that of the second elastic layer. The polishing device can improve the polishing efficiency of the ultrathin glass and reduce the damage of the ultrathin glass during polishing.

Description

Polishing device

Technical Field

The specification relates to the technical field of grinding, in particular to an ultrathin glass polishing device.

Background

With the rapid development of science and technology, some photoelectric products used by people in daily life are increasingly developed to be light, thin and light, and the ultrathin glass becomes an important basic material due to excellent characteristics of good thermal stability, chemical stability, optical performance and the like. The ultra-thin glass belongs to a brittle material, and is very easy to break in the precision machining processes of cutting, polishing and the like due to the very low thickness. Therefore, how to achieve precise polishing of the surface of the ultra-thin glass is a problem of great concern in the industry, and there is a need to provide an efficient and safe polishing device, which can improve the polishing efficiency of the ultra-thin glass and reduce the damage to the ultra-thin glass.

Disclosure of Invention

One of the embodiments of the present specification provides a polishing apparatus including: the clamp is used for adsorbing a workpiece; the driving mechanism is used for driving the clamp to move; a polishing disk for polishing the workpiece; the polishing disc comprises a base, a first elastic layer and a second elastic layer, the first elastic layer is arranged between the base and the second elastic layer, and the elastic modulus of the first elastic layer is smaller than that of the second elastic layer.

In some embodiments, the ratio of the elastic modulus of the first elastic layer in the direction perpendicular to the polishing surface to the elastic modulus of the second elastic layer in the direction perpendicular to the polishing surface is in the range of 11 to 17 to 1.

In some embodiments, the elastic modulus of the first elastic layer in a direction perpendicular to the polishing surface ranges from 35mpa to 55mpa.

In some embodiments, the elastic modulus of the second elastic layer in a direction perpendicular to the polishing surface ranges from 70mpa to 85mpa.

In some embodiments, when the thickness of the first elastic layer ranges from 15mm to 25mm, the elastic modulus of the first elastic layer ranges from 35MPa to 55MPa.

In some embodiments, the first elastic layer has a smaller elastic modulus in a direction perpendicular to the polishing surface than in a direction parallel to the polishing surface.

In some embodiments, the second resilient layer comprises a fibrous structure capable of stretching in a direction parallel to the polishing surface.

In some embodiments, the fixture includes one or more first holes through which a negative pressure is provided to the fixture that adsorbs the workpiece.

In some embodiments, the one or more first holes have a hole diameter in the range of 0.3mm to 1mm.

In some embodiments, the ratio of the aperture of the one or more first holes to the thickness of the workpiece ranges from 3.

In some embodiments, the one or more first holes are uniformly distributed on the adsorption surface of the clamp, and the distance between adjacent first holes ranges from 2mm to 3.5mm.

In some embodiments, at least one of the one or more first wells comprises a flexible membrane covering the adsorption end of at least one of the one or more first wells.

In some embodiments, the clamp further comprises a gas interface, the one or more first holes being in communication with the gas interface.

In some embodiments, the fixture further comprises one or more second holes and an air storage cavity, the one or more second holes are communicated with one end of the air storage cavity, and the other end of the air storage cavity is communicated with the air interface; and the air storage cavity is internally provided with an air volume adjusting structure.

In some embodiments, the air volume adjusting structure includes a piston and an elastic member connected to the piston, and when the elastic member is in an initial state, a preset distance is provided between the piston and one end of the air storage cavity, which is communicated with the air interface.

In some embodiments, the preset distance is no less than half of the length of the gas reservoir.

In some embodiments, the one or more second holes are evenly distributed on the suction surface of the clamp.

In some embodiments, the clamp includes one or more valves that control the opening and closing of the gas interface.

In some embodiments, the number of valves comprises two.

In some embodiments, the polishing apparatus further comprises a polishing liquid filter screen.

The beneficial effects that may be brought by the embodiments of the present description include, but are not limited to: (1) The first elastic layer is additionally arranged between the base of the polishing disc and the second elastic layer, the elastic modulus of the first elastic layer is smaller than that of the second elastic layer, the first elastic layer is easier to deform than the second elastic layer, the second elastic layer is integrally deformed during polishing without local deformation displacement, and workpieces and the second elastic layer can be prevented from being scratched independently. (2) The adsorption plane of anchor clamps sets up a plurality of first holes to rationally set up the interval between the adjacent first hole, make anchor clamps when adsorbing the work piece, can provide even invariable adsorption affinity, thereby avoid the work piece damaged. (3) The adsorption plane of anchor clamps still sets up a plurality of second holes, and the structure is adjusted through the tolerance discharges and deposits the intracavity gas, can provide the malleation of release work piece, can realize the automatic release of work piece.

Drawings

The present description will be further explained by way of exemplary embodiments, which will be described in detail by way of the accompanying drawings. These embodiments are not intended to be limiting, and in these embodiments like numerals are used to indicate like structures, wherein:

FIG. 1 is a schematic diagram of the structure of an exemplary polishing apparatus according to some embodiments herein;

FIG. 2 is a schematic diagram of a portion of the exemplary polishing apparatus shown in FIG. 1;

FIG. 3 is a schematic diagram of exemplary chuck, polishing disk, drive configurations according to some embodiments of the present disclosure;

FIG. 4 is a schematic diagram of an exemplary clamp shown in accordance with some embodiments of the present description;

FIG. 5 isbase:Sub>A cross-sectional block diagram ofbase:Sub>A plane A-A according to the exemplary fixture shown in FIG. 4;

FIG. 6 is a partial schematic structural view of an exemplary clip according to some embodiments herein;

FIG. 7 is a schematic diagram of an exemplary fixture according to further embodiments of the present disclosure.

Reference numerals:

1000 is a polishing device, 100 is a fixture, 110 is an adsorption plate, 111 is a first hole, 112 is a second hole, 120 is a substrate, 121 is a bump, 130 is a gas port, 131 is a gas channel, 140 is a valve, 141 is a mounting plate, 150 is a workpiece, 160 is a gas storage cavity, 170 is a gas amount adjusting structure, 171 is a piston, and 172 is an elastic piece;

200 is a polishing pad, 210 is a base, 220 is a first elastic layer, and 230 is a second elastic layer;

300 is a driving mechanism, 310 is a polishing arm, 320 is a motor, and 330 is an air cylinder;

a frame 400, a table 410, and an operation panel 420.

Detailed Description

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only examples or embodiments of the present description, and that for a person skilled in the art, the present description can also be applied to other similar scenarios on the basis of these drawings without inventive effort.

As used in this specification and the appended claims, the terms "a," "an," "the," and/or "the" are not intended to be inclusive in the singular, but rather are intended to be inclusive in the plural, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that steps and elements are included which are explicitly identified, that the steps and elements do not form an exclusive list, and that a method or apparatus may include other steps or elements.

The embodiments described in this specification are only intended to illustrate the principles of the embodiments of the specification. Other variations are also possible within the scope of the present description. Thus, by way of example, and not limitation, alternative configurations of the embodiments of the specification can be considered consistent with the teachings of the specification. Accordingly, the embodiments of the present description are not limited to only those embodiments explicitly described and depicted herein.

Ultra-thin glasses (glasses with a diameter to thickness ratio greater than 10) present many challenges in the polishing process. On the one hand, ultra-thin glass, due to its very thin thickness, is often held by the upper plate (i.e. the glass to be processed is held in the disc-shaped station) during grinding and polishing. However, the upper disc is usually complicated and time-consuming, resulting in low polishing efficiency, and the ultra-thin glass is easily damaged during the upper disc and the disassembly process. On the other hand, when grinding and polishing, the ultra-thin glass needs to be very attached to the polishing disk, and because the flatness of the ultra-thin glass is not enough, the felt with better elasticity is generally adopted as the polishing disk so as to improve the attachment degree of the polishing disk and the glass. However, in the polishing process, when the fixture drives the ultra-thin glass to move, the glass may be scratched and rubbed with the felt, so that the ultra-thin glass is separated from the fixture, and the glass is damaged or has safety accidents.

In order to realize safe clamping of the ultrathin glass and efficient polishing of the ultrathin glass, the embodiment of the specification provides the polishing device for the ultrathin glass, the clamp adsorbs the ultrathin glass through vacuum, the ultrathin glass can be stably clamped, damage to the ultrathin glass is reduced, quick feeding and discharging of the ultrathin glass can be realized, and polishing efficiency is improved. Further, the polishing disk comprises a base, a first elastic layer and a second elastic layer which are sequentially stacked, and the elastic modulus of the first elastic layer is smaller than that of the second elastic layer. Set up the less first elastic layer of elastic modulus between base and the second elastic layer, deformation takes place for first elastic layer more than the second elastic layer, drives ultra-thin glass at anchor clamps and removes and carry out the polishing in-process, and deformation displacement takes place earlier for first elastic layer than the second elastic layer, and the second elastic layer is whole along with first elastic layer produces deformation, and the second elastic layer can not produce local deformation displacement, can avoid glass and second elastic layer to take place alone to cut to pieces to rub.

The polishing apparatus according to the embodiment of the present disclosure will be described in detail below with reference to fig. 1 to 7. It should be noted that the following examples are only for explaining the present specification and are not to be construed as limiting the present specification.

FIG. 1 is a schematic diagram of an exemplary polishing apparatus, according to some embodiments herein; FIG. 2 is a schematic view of a portion of the structure of the exemplary polishing apparatus shown in FIG. 1; figure 3 is a schematic diagram of exemplary chuck, polishing disk, drive configurations according to some embodiments of the present disclosure. In some embodiments, as shown in fig. 1, the polishing apparatus 1000 may include a fixture 100, a polishing disc 200, and a driving mechanism 300, the fixture 100 may be used to fix the workpiece 150, the driving mechanism 300 may drive the fixture 100 to move, and during the fixture 100 drives the workpiece 150 to move, the workpiece and the polishing disc 200 are in contact with each other and rub, so that the polishing disc 200 polishes the workpiece 150. The workpiece may refer to a part to be processed, and may include ultra-thin glass, for example. In some embodiments, the thickness of the ultra-thin glass may be 0.3mm to 0.06mm.

In some embodiments, as shown in fig. 3, the polishing disk 200 may include a base 210, a first elastic layer 220, and a second elastic layer 230, the first elastic layer 220 being disposed between the base 210 and the second elastic layer 230, the first elastic layer 220 having a smaller elastic modulus than the second elastic layer 230. In the process that the fixture 100 drives the workpiece 150 to move for polishing, the second elastic layer 230 with a large elastic modulus is attached to the workpiece 150 for polishing, the elastic modulus of the first elastic layer 220 is small, the first elastic layer 220 is easier to deform than the second elastic layer 230, when the workpiece 150 and the polishing disc 200 move for polishing relatively, the first elastic layer 220 deforms and displaces earlier than the second elastic layer 230, the second elastic layer 230 integrally deforms along with the first elastic layer 220, and the second elastic layer 230 cannot locally deform and displace, so that the workpiece 150 and the second elastic layer 230 are prevented from being scratched separately.

In some polishing devices, when a driving mechanism drives a workpiece to move, because the torque is not constant, the pressure on the workpiece in the polishing process is possibly not constant, and the workpiece and a felt of a polishing disc are easy to scratch. In some embodiments, as shown in fig. 2 and 3, the driving mechanism 300 may include a polishing arm 310, a motor 320, and an air cylinder 330, wherein a distal end of the polishing arm 310 may be fixedly mounted to the clamp 100, the motor 320 and the air cylinder 330 are used to drive the polishing arm 310 to move, and the motor 320 and the air cylinder 330 may combine to make an output torque constant, so as to drive the polishing arm 310 to smoothly move the clamp 100. In some embodiments, the polishing arm 310 may be provided with a hollow structure, one end of the hollow structure of the polishing arm 310 is connected to a vacuum device, and the other end is connected to the clamp 100, so that the vacuum device controls the suction and exhaust of the clamp 100, thereby sucking and releasing the workpiece 150.

In some embodiments, as shown in fig. 1 and 2, the polishing apparatus 1000 may include a frame 400, the frame 400 may include a table 410 and an operation panel 420, and the jig 100, the polishing platter 200, and the driving mechanism 300 may be disposed on the table 410. In some embodiments, at least two clamps 100, at least two polishing disks 200 and at least two driving mechanisms 300 may be disposed on the working table 410, and one clamp 100, one polishing disk 200 and one driving mechanism 300 may cooperate to form a group of polishing units. In some embodiments, as shown in fig. 1 and 2, the polishing apparatus 1000 may include four clamps 100, four polishing disks 200, and four driving mechanisms 300, including four sets of polishing units, so as to implement batch polishing. In some embodiments, the fixtures 100, polishing disks 200, and drive mechanisms 300 may be equal in number and in one-to-one correspondence. In some embodiments, the number of the clamps 100 and the number of the driving mechanisms 300 may be equal to one, and the number of the polishing trays 200 may be smaller than or equal to the number of the clamps 100, and the next workpiece may be polished on the polishing tray 200 during the previous workpiece polishing completion transfer discharge. In some embodiments, the suction surface of the fixture 100 may simultaneously suck more than two workpieces 150 to achieve batch processing.

In some embodiments, the first elastic layer 220 is fixed relative to the second elastic layer 230, and the second elastic layer 230 covers the first elastic layer 220. The elastic modulus of the first elastic layer 220 cannot be too small, if the elastic modulus of the first elastic layer 220 is too small, the rigidity of the first elastic layer 220 is too small (i.e., the first elastic layer is too soft), and the deformation of the first elastic layer 220 is too large in the polishing process, which may cause relative movement between the first elastic layer 220 and the second elastic layer 230, so that the second elastic layer 230 cannot deform along with the first elastic layer 220 (i.e., the second elastic layer may independently deform), which causes the second elastic layer 230 not to deform as a whole, and further causes the second elastic layer 230 to rub against the workpiece 150 alone. Therefore, the ratio of the elastic modulus of the first elastic layer 220 to the elastic modulus of the second elastic layer 230 needs to satisfy a certain range.

In some embodiments, the ratio of the elastic modulus of the first elastic layer 220 in the direction perpendicular to the polishing surface (i.e., the longitudinal elastic modulus, or young's modulus) to the elastic modulus of the second elastic layer 230 in the direction perpendicular to the polishing surface may be in the range of 11 to 11. In some embodiments, the ratio of the elastic modulus of the first elastic layer 220 in the direction perpendicular to the polishing surface to the elastic modulus of the second elastic layer 230 in the direction perpendicular to the polishing surface may range from 11 to 17 to 1. In some embodiments, the ratio of the elastic modulus of the first elastic layer 220 in the direction perpendicular to the polishing surface to the elastic modulus of the second elastic layer 230 in the direction perpendicular to the polishing surface may range from 11 to 18 to 11. In some embodiments, the ratio of the elastic modulus of the first elastic layer 220 in the direction perpendicular to the polishing surface to the elastic modulus of the second elastic layer 230 in the direction perpendicular to the polishing surface may range from 11 to 19 to 11.

In some embodiments, the elastic modulus of the first elastic layer 220 in a direction perpendicular to the polishing surface may range from 30mpa to 50mpa. In some embodiments, the elastic modulus of the first elastic layer 220 in a direction perpendicular to the polishing surface may range from 35mpa to 55mpa. In some embodiments, the elastic modulus of the first elastic layer 220 in a direction perpendicular to the polishing surface may range from 40mpa to 50mpa. In some embodiments, the elastic modulus of the first elastic layer 220 in a direction perpendicular to the polishing surface may range from 43mpa to 48mpa.

In some embodiments, the elastic modulus of the second elastic layer 230 in the direction perpendicular to the polishing surface may range from 65mpa to 90mpa. In some embodiments, the elastic modulus of the second elastic layer 230 in a direction perpendicular to the polishing surface may range from 70mpa to 85mpa. In some embodiments, the elastic modulus of the second elastic layer 230 in a direction perpendicular to the polishing surface may range from 65mpa to 80mpa. In some embodiments, the elastic modulus of the second elastic layer 230 in a direction perpendicular to the polishing surface may range from 70mpa to 75mpa.

The modulus of elasticity of the first elastic layer 220 is related to the thickness of the first elastic layer 220. In some embodiments, the greater the thickness of the first elastic layer 220, the smaller the modulus of elasticity of the first elastic layer 220 may be; the thinner the thickness of the first elastic layer 220, the greater the elastic modulus of the first elastic layer 220 needs to be. In some embodiments, when the thickness of the first elastic layer 220 ranges from 15mm to 25mm, the elastic modulus of the first elastic layer 220 ranges from 30MPa to 60MPa. In some embodiments, when the thickness of the first elastic layer 220 ranges from 15mm to 25mm, the elastic modulus of the first elastic layer 220 ranges from 35mpa to 55mpa. In some embodiments, when the thickness of the first elastic layer 220 ranges from 15mm to 25mm, the elastic modulus of the first elastic layer 220 ranges from 40mpa to 50mpa. In some embodiments, when the thickness of the first elastic layer 220 ranges from 18mm to 22mm, the elastic modulus of the first elastic layer 220 ranges from 35mpa to 55mpa. In some embodiments, when the thickness of the first elastic layer 220 ranges from 18mm to 22mm, the elastic modulus of the first elastic layer 220 ranges from 40mpa to 50mpa.

In some embodiments, the first elastic layer 220 has a smaller elastic modulus in a direction perpendicular to the polishing surface than in a direction parallel to the polishing surface, and the first elastic layer 220 is easily deformed in the direction perpendicular to the polishing surface when the workpiece is rubbed against the polishing pad 200. In some embodiments, the first resilient layer 220 may be made of a resilient material such as EVA foam. In some embodiments, the first elastic layer 220 may have a thickness in the range of 15mm to 25mm.

In some embodiments, the second elastic layer 230 includes a fibrous structure that is capable of stretching in a direction parallel to the polishing surface. In some embodiments, the second elastic layer 230 may be a felt layer, which may have better wear resistance. In some embodiments, the felt layer may be made of natural fibers (e.g., cow's hair, wool, etc.) or synthetic fibers (e.g., polyester, polypropylene, viscose, etc.). In some embodiments, the thickness of the felt layer may range from 1 to 1.5mm.

In some embodiments, the polishing apparatus may fix the workpiece by using a vacuum adsorption type fixture, the adsorption surface of the fixture is provided with an air hole, and the vacuum pumping apparatus provides negative pressure for adsorbing the workpiece through the air hole. In some embodiments, the air holes of the vacuum suction type clamp are arranged in the central area of the suction surface, when vacuum suction is performed, the air pressure at the positions of the air holes and the air pressure at the periphery of the air holes are greatly different, so that the suction force is unbalanced, and for fragile and thin workpieces such as ultra-thin glass and the like, the workpieces are cracked during processing due to different suction forces. To this end, some embodiments of the present disclosure provide a fixture that is more suitable for holding ultra-thin workpieces.

FIG. 4 is a schematic diagram of an exemplary clamp shown in accordance with some embodiments of the present description; FIG. 5 isbase:Sub>A cross-sectional block diagram ofbase:Sub>A plane A-A according to the exemplary fixture shown in FIG. 4. In some embodiments, as shown in fig. 4 and 5, the fixture 100 may include a substrate 120 and an absorption plate 110, the substrate 120 may be used to assemble mechanical components, and the absorption plate 110 is disposed on a surface layer of the substrate 120. When the jig 100 sucks and clamps the workpiece 150, the suction plate 110 is attached to the workpiece 150, the suction plate 110 may be provided with a plurality of first holes 111, and negative pressure for sucking the workpiece 150 may be supplied to the jig 100 through the plurality of first holes 111. In some embodiments, the substrate 120 may be made of a material that is light and not easily deformed, and can meet the assembly requirements of mechanical components, for example, the substrate 120 may be made of an aluminum alloy. In some embodiments, the adsorption plate 110 may be made of a non-metal material, which has a small deformation amount and is not prone to scratch a polished product, for example, the adsorption plate 110 may be made of teflon.

In some embodiments, the first holes 111 may be uniformly distributed on the adsorption surface of the adsorption plate 110 of the fixture 100, and a range of a distance between adjacent first holes 111 may be 2mm to 3.5mm. In some embodiments, the distance between adjacent first holes 111 may range from 1.5mm to 3.0mm. In some embodiments, the distance between adjacent first holes 111 may range from 2.0mm to 2.5mm. First hole 111 evenly distributed is in the adsorption plane to rationally set up the interval between the adjacent first hole 111, make anchor clamps 100 when adsorbing work piece 150, can provide even invariable adsorption affinity, thereby avoid work piece 150 damaged.

In some embodiments, the first hole 111 may have a hole diameter ranging from 0.2mm to 1.2mm. In some embodiments, the first hole 111 may have a hole diameter ranging from 0.3mm to 1mm. In some embodiments, the diameter of the first hole 111 may be in a range of 0.4mm to 0.9mm. In some embodiments, the first hole 111 may have a hole diameter in the range of 0.5mm to 0.8mm. In some embodiments, the first hole 111 may have a hole diameter ranging from 0.6mm to 0.7mm.

The aperture of the first hole 111 is related to the thickness of the workpiece 150, and the thinner the workpiece 150 is, the smaller the aperture of the first hole 111 can be set to reduce the negative pressure in the single first hole 111 for vacuum pumping, thereby avoiding the damage caused by the excessive local adsorption force of the workpiece 150. In some embodiments, the ratio of the aperture diameter of the first hole 111 to the thickness of the workpiece 150 may range from 3 to 1. In some embodiments, the ratio of the aperture of the first hole 111 to the thickness of the workpiece 150 may range from 3. In some embodiments, the ratio of the aperture diameter of the first hole 111 to the thickness of the workpiece 150 may range from 3.

In some embodiments, at least one first hole 111 is provided with a flexible membrane (not shown in the figures) covering the suction end of the first hole 111. In some embodiments, the flexible membrane may be a layer of soft breathable film. When the workpiece 150 is adsorbed by the first hole 111, the flexible film can increase the contact surface between the workpiece 150 and the adsorption end of the first hole 111, so that the adsorption force is dispersed, and the workpiece 150 is supported at the hole position of the first hole 111, thereby preventing the workpiece 150 from generating large deformation at the hole position of the first hole 111, and further reducing the risk of damage to the workpiece 150.

In some embodiments, when the vacuum is pumped, the flexible film may be attached to cover the suction end of the first hole 111, the workpiece 150 is attached to the flexible film, and the suction pressure in the first hole 111 is uniformly transmitted to the workpiece 150 through the flexible film. Compared with the suction method in which the workpiece 150 is directly sucked through the first hole 111, the flexible film can increase the supporting surface for sucking the workpiece 150, thereby further preventing the workpiece 150 from being damaged. In some embodiments, when the workpiece 150 is released by inflation, the positive pressure air in the first hole 111 is uniformly blown to the workpiece 150 through the flexible film, so as to prevent the workpiece 150 from being damaged due to over-large local stress on the workpiece 150 caused by rapid application of strong air flow to the workpiece 150.

In some embodiments, the flexible film may be a breathable film, for example, the flexible film may include an EPTFE (polytetrafluoroethylene) film, a PE (polyethylene) film, a TPU (thermoplastic polyurethane) film, or the like. In some embodiments, the flexible membrane may be provided with a plurality of small-diameter air holes, and the air holes are uniformly distributed. In some embodiments, the pore size of the gas permeable pores of the flexible membrane is much smaller than the pore size of the first pores 111. In some embodiments, the ratio of the pore diameter of the vent to the pore diameter of the first pore 111 can range from 1. In some embodiments, the ratio of the pore diameter of the vent to the pore diameter of the first pore 111 can range from 1. In some embodiments, the ratio of the pore diameter of the vent to the pore diameter of the first pore 111 can range from 1.

In some embodiments, the flexible membrane may be a plurality of small-sized thin films, one flexible membrane covering one first aperture 111, and the shape and size of each flexible membrane may match the shape and size of each first aperture 111. In some embodiments, the flexible membrane edge may be secured to the first aperture 111 edge such that the flexible membrane covers the suction end of the first aperture 111. For example, the edge of the flexible membrane may be adhesively secured to the edge of the first aperture 111. In some embodiments, the flexible film may cover a plurality of first apertures 111 within a single area. In some embodiments, the flexible membrane may cover the entire adsorbent face. In some embodiments, the edge of the flexible membrane covering an area of the patch may be secured to, e.g., adhered to, the suction surface. In some embodiments, a flexible membrane covering an area of a sheet may be secured to the edges of the first apertures 111 at the location of each first aperture 111.

In some embodiments, as shown in fig. 4 and 5, the fixture 100 may further include a gas interface 130, and each of the first holes 111 communicates with the gas interface 130. In application, the gas interface 130 may be connected to a vacuum device, and when the vacuum device draws a vacuum through the gas interface 130, a negative pressure may be formed in each first hole 111, and the plurality of first holes 111 may uniformly distribute the suction force. In some embodiments, as shown in fig. 5, at least one air channel 131 may be disposed in the substrate 120, the adsorption plate 110 may have a plurality of first holes 111 disposed therethrough, and the first holes 111 may communicate with the gas interface 130 through the air channel 131. In some embodiments, as shown in fig. 5, two air passages 131 may be provided in the substrate 120, one of the air passages 131 may be used for sucking and releasing the workpiece by air suction, and the other air passage 131 may be used for maintaining the sucking pressure during polishing to fix the workpiece. In some embodiments, an air channel 131 may be disposed in the substrate 120, and the air channel 131 may be used to suck the workpiece, and the air channel 131 may be used to inflate the workpiece after polishing.

In some embodiments, a gas flow channel may be disposed between the substrate 120 and the adsorption plate 110, and during the vacuum pumping, gas enters from the plurality of first holes 111, passes through the gas flow channel, then converges on the gas channel 131 on the substrate 120, and is finally pumped away by a vacuum device through the gas interface 130, so as to form a negative pressure in each first hole 111. FIG. 6 is a partial schematic structural view of an exemplary clip according to some embodiments of the present description. In some embodiments, as shown in fig. 5 and 6, a plurality of bumps 121 may be disposed on a surface of the substrate 120 contacting the adsorption plate 110, so that a gap for gas to flow through is formed between the substrate 120 and the adsorption plate 110. In some embodiments, the airflow passage may be provided in other forms as long as the first hole 111 can communicate with the air passage 131.

FIG. 7 is a schematic diagram of an exemplary fixture according to further embodiments of the present disclosure. In some embodiments, as shown in fig. 7, the fixture 100 may further include a plurality of second holes 112 and a gas storage chamber 160, the plurality of second holes 112 being in communication with one end of the gas storage chamber 160, and the other end of the gas storage chamber 160 being in communication with the gas interface 130; an air volume adjusting structure 170 is disposed in the air storage chamber 160, and the air volume adjusting structure 170 can be used for adjusting the volume of the air storage chamber 160. In some embodiments, when a vacuum is pumped through the gas interface 130, the gas in the gas storage chamber 160 communicating with the gas interface 130 is also pumped away, and the gas amount adjustment structure 170 may be contracted; when the vacuum pumping is stopped, the air volume adjusting structure 170 may be expanded to automatically extrude the air stored in the air storage chamber 160, thereby generating a positive pressure capable of releasing the workpiece in the second hole 112.

In some embodiments, as shown in fig. 7, the air quantity adjusting structure 170 may include a piston 171 and a resilient member 172 connected to the piston, and when the resilient member 172 is in an initial state, the piston 171 has a predetermined distance from one end of the air storage chamber 160, which communicates with the air interface 130. The piston 171 has a travel stroke of a predetermined distance within the gas trap chamber 160 such that the piston 171 moves to draw and expel a predetermined volume of gas into and out of the gas trap chamber 160, wherein the predetermined volume of gas is capable of generating a positive pressure sufficient to release the workpiece. In some embodiments, when the vacuum is applied to the workpiece, the elastic member 172 is stretched, and the piston 171 moves to the end of the gas storage chamber 160 communicating with the gas port 130, and then a certain amount of gas is sucked into the gas storage chamber 160. Further, when the workpiece needs to be released, the vacuum pumping is stopped, the elastic member 172 returns to the original state, the piston 171 moves to the original position, partial air in the air storage chamber 160 is squeezed out, and positive pressure is formed in the second hole 112, so that the workpiece is automatically released.

The predetermined distance may be set according to the cross-sectional area of the inner cavity of the gas storage chamber 160, as long as the piston 171 returns to the initial position, and a predetermined volume of gas is extruded (predetermined volume = predetermined distance × cross-sectional area of the inner cavity), so that the workpiece can be released. For example, if the cross-sectional area of the inner cavity of the gas storage chamber 160 is small, a large predetermined distance is required to ensure that a predetermined volume of gas can be discharged when the piston 171 is returned to the initial position. For another example, if the cross-sectional area of the inner cavity of the gas storage chamber 160 is large, a small predetermined distance may be set, i.e., a predetermined volume of gas may be discharged. In some embodiments, the predetermined distance is not less than half the length of the air reservoir cavity 160.

In some embodiments, the plurality of second holes 112 are uniformly distributed on the suction surface of the clamp 100, and the uniformly distributed plurality of second holes 112 can generate uniform positive pressure release, so as to prevent the workpiece from being damaged due to excessive local stress. In some embodiments, the spacing between adjacent second apertures 112 may be set according to the thickness of the workpiece. For example, if the thickness of the workpiece is thin, the spacing between adjacent second holes 112 may be set smaller in order to avoid excessive positive pressure in a single second hole 112. For another example, if the thickness of the workpiece is thick, the pitch between adjacent second holes 112 may be set to be large. In some embodiments, the spacing of adjacent second apertures 112 may be set with reference to the spacing of adjacent first apertures 111. In some embodiments, the spacing of adjacent second apertures 112 may be greater than or equal to the spacing of adjacent first apertures 111.

In some embodiments, a flexible film may be disposed at the outlet end of the second hole 112, when the exhaust releases the workpiece 150, the airflow in the air storage chamber 160 is uniformly blown to the workpiece 150 through the flexible film, so as to prevent the airflow from being applied to the workpiece 150 rapidly, which may cause the workpiece 150 to be damaged due to an excessively large local stress. In some embodiments, the content of the flexible film at the first hole 111 can be referred to in the related art of the flexible film at the second hole 112, which is not described herein.

In some embodiments, the clamp 100 may include one or more valves that may control the opening and closing of the gas interface 130. In some embodiments, as shown in fig. 3 and 4, the fixture 100 may include two valves 140, two air passages 131 may be disposed in the substrate 120, the two valves 140 are respectively communicated with the two air passages 131, and the two valves 140 may respectively control opening and closing of the two air passages 131. In some embodiments, as shown in fig. 4, one of the valves 140 is in communication with the gas port 130 and can control the opening and closing of the gas port 130. In some embodiments, as shown in fig. 3, the valve 140 is mounted on the wall of the substrate 120 away from the adsorption plate 110 by a mounting plate 141.

In some embodiments, the clamp 100 can be used separately from a polishing apparatus, the clamp 100 being used to clamp a workpiece and the polishing apparatus being used to polish the workpiece. In some embodiments, the fixture 100 is connected to a vacuum-pumping device through one of the valves 140 (which may be referred to as a first valve), and the vacuum-pumping device performs vacuum-pumping on the first hole 111 through one of the air passages 131 (which may be referred to as a first air passage) to perform adsorption material-taking on the workpiece. Further, after the material is taken, the clamp 100 moves to the polishing apparatus and is connected to the polishing arm 310, another valve 140 (which may be called a second valve) is communicated with the gas interface 130, the gas interface 130 is communicated with the hollow structure of the polishing arm 310, and the gas pressure control component on the polishing apparatus controls the gas pressure of the gas interface 130 through the second valve, so as to realize the adsorption clamping of the workpiece. In some embodiments, the gas pressure control assembly controls the negative pressure of the first hole 111 through the gas port 130 during the polishing process, so as to achieve a constant pressure suction clamping of the workpiece. Further, during polishing, the first valve is closed, so that the first air passage is disconnected from the vacuum-pumping device. In some embodiments, as shown in fig. 5, the clamp 100 may simultaneously suction-clamp two or more workpieces 150, thereby improving polishing efficiency.

In some embodiments, after polishing, the gas interface 130 may be separated from the hollow structure of the polishing arm 310, the first valve is opened to communicate the first gas channel with the vacuum pumping device, and after the polishing arm 310 transfers the workpiece to the storage place, negative pressure adsorption is stopped, and since polishing liquid may remain between the workpiece and the adsorption surface of the fixture 100, the workpiece is not easily separated from the adsorption surface due to liquid suction, and the workpiece may be released by applying positive pressure to the first hole 111. In some embodiments, the fixture 100 is provided with the second hole 112 and the gas storage cavity 160, after the workpiece is transferred to the storage place, the negative pressure adsorption is stopped, and the gas amount adjusting structure 170 can automatically discharge the gas stored in the gas storage cavity 160, so as to generate positive pressure in the second hole 112, and automatically release the workpiece.

In some embodiments, during the polishing process, the polishing apparatus may add the polishing solution to the workpiece and the second elastic layer, and a filter screen may be disposed at the polishing solution recovery port to filter impurities in the polishing solution, so that the polishing solution may be recycled.

It is to be noted that different embodiments may produce different advantages, and in different embodiments, any one or combination of the above advantages may be produced, or any other advantages may be obtained.

Having thus described the basic concept, it will be apparent to those skilled in the art that the foregoing detailed disclosure is to be considered as illustrative only and not limiting, of the present invention. Various modifications, improvements and adaptations to the present description may occur to those skilled in the art, although not explicitly described herein. Such modifications, improvements and adaptations are proposed in the present specification and thus fall within the spirit and scope of the exemplary embodiments of the present specification.

Also, the description uses specific words to describe embodiments of the description. Reference throughout this specification to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with at least one embodiment of the specification is included. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, some features, structures, or characteristics of one or more embodiments of the specification may be combined as appropriate.

It should be noted that in the foregoing description of embodiments of the present specification, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the embodiments. This method of disclosure, however, is not intended to imply that more features than are expressly recited in a claim. Indeed, the embodiments may be characterized as having less than all of the features of a single disclosed embodiment.

Claims

1. A polishing apparatus, comprising:

the clamp is used for adsorbing a workpiece;

the driving mechanism is used for driving the clamp to move;

a polishing disk for polishing the workpiece;

the polishing disc comprises a base, a first elastic layer and a second elastic layer, wherein the first elastic layer is arranged between the base and the second elastic layer, and the elastic modulus of the first elastic layer is smaller than that of the second elastic layer;

the clamp includes one or more first apertures through which the clamp provides negative pressure to the workpiece;

at least one of the one or more first wells comprises a flexible membrane covering an adsorption end of at least one of the one or more first wells; the flexible film is a breathable film;

the clamp further comprises a gas interface, the one or more first holes being in communication with the gas interface;

the clamp further comprises one or more second holes and an air storage cavity, the one or more second holes are communicated with one end of the air storage cavity, and the other end of the air storage cavity is communicated with the air interface; the air storage cavity is internally provided with an air quantity adjusting structure;

the air quantity adjusting structure comprises a piston and an elastic piece connected with the piston, and when the elastic piece is in an initial state, a preset distance is reserved between the piston and one end, communicated with the air interface, of the air storage cavity.

2. A polishing apparatus according to claim 1, wherein the ratio of the elastic modulus of the first elastic layer in the direction perpendicular to the polishing surface to the elastic modulus of the second elastic layer in the direction perpendicular to the polishing surface is in the range of 11 to 17 to 1.

3. The polishing apparatus according to claim 1, wherein the elastic modulus of the first elastic layer in a direction perpendicular to the polishing surface is in a range of 35mpa to 55mpa.

4. The polishing apparatus according to claim 1, wherein the elastic modulus of the second elastic layer in a direction perpendicular to the polishing surface is in a range of 70mpa to 85mpa.

5. The polishing apparatus as claimed in claim 1, wherein when the thickness of the first elastic layer ranges from 15mm to 25mm, the elastic modulus of the first elastic layer ranges from 35mpa to 55mpa.

6. The polishing apparatus as recited in claim 1, wherein the first elastic layer has a smaller elastic modulus in a direction perpendicular to the polishing surface than in a direction parallel to the polishing surface.

7. The polishing apparatus as recited in claim 1, wherein the second resilient layer comprises a fibrous structure capable of stretching in a direction parallel to the polishing surface.

8. The polishing apparatus of claim 1, wherein the one or more first holes have a hole diameter in the range of 0.3mm to 1mm.

9. The polishing apparatus according to claim 1, wherein a ratio of the aperture of the one or more first holes to the thickness of the workpiece is in a range of 3 to 1.

10. The polishing device according to claim 1, wherein the one or more first holes are uniformly distributed on the adsorption surface of the jig, and a distance between adjacent first holes ranges from 2mm to 3.5mm.

11. A polishing apparatus according to claim 10, wherein said predetermined distance is not less than half the length of said gas trap chamber.

12. The polishing apparatus of claim 1, wherein the one or more second holes are evenly distributed on the suction surface of the holder.

13. The polishing apparatus of claim 1, wherein the clamp includes one or more valves that control the opening and closing of the gas interface.

14. A polishing apparatus according to claim 13, wherein the number of valves includes two.

15. The polishing apparatus as recited in claim 1, further comprising a polishing liquid filter screen.