CN115275653A - Electronic device and buckle ring structure - Google Patents

Electronic device and buckle ring structure Download PDF

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Publication number
CN115275653A
CN115275653A CN202211031115.8A CN202211031115A CN115275653A CN 115275653 A CN115275653 A CN 115275653A CN 202211031115 A CN202211031115 A CN 202211031115A CN 115275653 A CN115275653 A CN 115275653A
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CN
China
Prior art keywords
ring structure
electronic device
conductive element
body part
body portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211031115.8A
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Chinese (zh)
Inventor
刘国光
朱育辰
李健玮
谢铭原
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USI Electronics Shenzhen Co Ltd
Original Assignee
USI Electronics Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USI Electronics Shenzhen Co Ltd filed Critical USI Electronics Shenzhen Co Ltd
Priority to CN202211031115.8A priority Critical patent/CN115275653A/en
Priority to TW111134248A priority patent/TWI829336B/en
Publication of CN115275653A publication Critical patent/CN115275653A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals

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  • Buckles (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The invention discloses an electronic device and a buckle ring structure. The electronic device comprises a shell element, a conducting element, a substrate element and a retaining ring structure. The conducting element is arranged through the shell element. A substrate member is located within the interior of the chassis member. The buckle ring structure is provided with a body part which is in an arc shape, two ends of the body part respectively extend outwards to form extension parts, and one side edge of the body part protrudes outwards to form a plurality of clamping parts; the retaining ring structure clamps the conductive element through the clamping parts so as to be fixed on the conductive element, and the extending parts are used for abutting against the substrate element. Therefore, the electronic device and the buckle ring structure can reduce the use of space and reduce cost expenditure.

Description

Electronic device and buckle ring structure
Technical Field
The present invention relates to an electronic device and a buckle structure, and more particularly, to an electronic device and a buckle structure capable of reducing the use of an internal space and reducing the cost.
Background
Under the continuous development and progress of science and technology, electronic devices become one of indispensable articles of daily use for people, such as mobile phones, notebook computers, 8230, and the like. Electronic devices also need to have sufficient power or be provided with electrical energy to be used by people.
In the design of the internal structure of the electronic equipment, a distance exists between the external power receiving port and the circuit board; the current solution is to use a plurality of components in contact with each other and disposed between the external power receiving port and the circuit board as a medium for power transmission. However, this solution occupies a lot of space inside the electronic device, and the cost is relatively increased.
Therefore, how to overcome the above-mentioned drawbacks by improving the structural design has become one of the important issues to be solved in the art.
Disclosure of Invention
The present invention provides an electronic device and a buckle structure for overcoming the drawbacks of the prior art.
In order to solve the above technical problem, an embodiment of the present invention provides an electronic device, which includes a housing element, at least one conductive element, a substrate element, and at least one retaining ring structure. At least one conductive element is disposed through the housing element. A substrate element is located in the interior of the chassis element. The at least one retaining ring structure is provided with a body part, the body part is arc-shaped, two ends of the body part respectively extend outwards to form extension parts, and one side edge of the body part protrudes outwards to form a plurality of clamping parts; the at least one buckle structure clamps the at least one conductive element through the plurality of clamping parts so as to be fixed on the at least one conductive element, and the plurality of extending parts are used for abutting against the substrate element.
Preferably, a first predetermined included angle is formed between each extending portion and the main body portion, and the first predetermined included angle is between 30 degrees and 60 degrees.
Preferably, one of the faces of the main body protrudes outward to form a plurality of protruding portions, and the plurality of protruding portions are used for abutting against the chassis component.
Preferably, one end of each of the extending portions is connected to the body portion, the other end of each of the extending portions is bent to form a bent portion, one surface of each of the bent portions protrudes outward to form a contact portion, and the contact portion is configured to contact the substrate member.
Preferably, a second predetermined included angle is formed between the bending portion and the main body portion, and the second predetermined included angle is between 80 degrees and 90 degrees.
In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a buckle structure, which includes a body portion, wherein the body portion is arc-shaped, two ends of the body portion respectively extend outward to form an extension portion, and one side of the body portion protrudes outward to form a plurality of engaging portions; the retaining ring structure clamps the conductive element through the clamping parts so as to be fixed on the conductive element, and the extending parts are used for abutting against the substrate element.
Preferably, a first predetermined included angle is formed between each extending portion and the main body portion, and the first predetermined included angle is between 30 degrees and 60 degrees.
Preferably, one of the faces of the body portion protrudes outward to form a plurality of protruding portions.
Preferably, one end of each of the extension portions is connected to the body portion, the other end of each of the extension portions is bent to form a bent portion, one surface of each of the bent portions protrudes outward to form a contact portion, and the contact portion is configured to contact the substrate member.
Preferably, a second predetermined included angle is formed between the bending portion and the main body portion, and the second predetermined included angle is between 80 degrees and 90 degrees.
One of the advantages of the present invention is that the electronic device provided by the present invention can be disposed in the housing element by "at least one conducting element passing through the housing element. A substrate element is located in the interior of the chassis element. The at least one retaining ring structure is provided with a body part, the body part is arc-shaped, two ends of the body part respectively extend outwards to form extension parts, and one side edge of the body part protrudes outwards to form a plurality of clamping parts; the at least one retaining ring structure clamps the at least one conductive element through the plurality of clamping parts so as to be fixed on the at least one conductive element, and the plurality of extending parts are used for abutting against the substrate element ", so that the use of space is reduced and the cost expenditure is reduced.
The buckle ring structure provided by the invention has the beneficial effects that the buckle ring structure can be provided with the body part which is in an arc shape, two ends of the body part respectively extend outwards to form the extending parts, and one side edge of the body part protrudes outwards to form a plurality of clamping parts; the retaining ring structure is fixed on the conductive element by clamping the conductive element through the clamping parts, and the extending parts are used for abutting against the substrate element ", so that the use of space is reduced and the cost expenditure is reduced.
For a better understanding of the features and technical content of the present invention, reference is made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.
Drawings
Fig. 1 is a schematic partial structure diagram of an electronic device according to a first embodiment of the invention.
Fig. 2 is a partially exploded view of an electronic device according to a first embodiment of the invention.
Fig. 3 is a partial cross-sectional view of an electronic device according to a first embodiment of the invention.
Fig. 4 is a perspective view of a first embodiment of a buckle structure according to the present invention.
Fig. 5 is a perspective view of another view of the buckle structure according to the first embodiment of the present invention.
FIG. 6 is a side view of the buckle structure according to the first embodiment of the present invention.
Fig. 7 is a perspective view of a second embodiment of the buckle structure according to the present invention.
Fig. 8 is a perspective view of another view of the buckle structure according to the second embodiment of the present invention.
FIG. 9 is a rear view of the buckle structure according to the second embodiment of the present invention.
Fig. 10 is a partial cross-sectional view of an electronic device according to a second embodiment of the invention.
Detailed Description
The following description is provided for the embodiments of the present disclosure relating to "electronic device and buckle structure" by specific embodiments, and those skilled in the art can understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modifications and various changes in detail without departing from the spirit and scope of the present invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments are further detailed to explain the technical matters related to the present invention, but the disclosure is not intended to limit the scope of the present invention.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used primarily to distinguish one element from another. Additionally, the term "or" as used herein is intended to include any one or combination of the associated listed items, as the case may be.
First embodiment
Fig. 1 to 6 are a schematic partial structure diagram, a schematic partial exploded view, a schematic partial cross-sectional view, a schematic perspective view of a view angle of a buckle structure, a schematic perspective view of another view angle of the buckle structure, and a schematic side view of the buckle structure of the first embodiment of the invention, respectively. As shown in the drawings, the first embodiment of the invention provides an electronic device Z, which includes a housing component 1, at least one conducting component 2, a substrate component 3, and at least one retaining ring structure D. The electronic device Z of the present invention can be any type of electronic device with a charging function, such as a mobile phone, a notebook computer 8230, etc., but not limited thereto.
As shown in fig. 1 to 3, the housing element 1 may be a structure of a main body of the electronic device Z. The housing element 1 may be a hollow structure made of plastic or metal. Further, the housing element 1 has an accommodating space 10, one of the side walls 1a of the housing element 1 has a plurality of through holes 11, and each through hole 11 communicates the accommodating space 10 with the outside of the housing element 1.
Next, as shown in fig. 1 to 3, at least one conductive element 2 may be inserted into the housing element 1. For example, the conductive element 2 may be a metal pin structure; the conductive element 2 may have a cylindrical or mushroom-shaped structure, but not limited thereto. In the present embodiment, a plurality of conductive elements 2 are taken as a preferred example, wherein one conductive element 2 may serve as a positive terminal, and the other conductive element 2 may serve as a negative terminal. Each of the conductive elements 2 may be provided with one of the perforations 11, i.e. the number of conductive elements 2 may be the same as the number of perforations 11. Also, the outer edge of one end of each conductive element 2 may be recessed inwardly to form an annular groove 20.
Next, as shown in fig. 2 and 3, the substrate member 3 is located inside the housing member 1. The substrate element 3 may be, for example, a circuit board or other type of circuit substrate. The substrate element 3 is located in the interior of the case element 1, i.e. the substrate element 3 can be located in the accommodating space 10.
Next, as shown in fig. 1 to 6, at least one of the buckle structures D may have a main body D1, the main body D1 is arc-shaped, two ends of the main body D1 respectively extend outward to form an extension portion D2, and one side of the main body D1 protrudes outward to form a plurality of engaging portions D3. The retaining ring structure D can clamp the conductive element 2 through the plurality of engaging portions D3 to be fixed to the conductive element 2, and the plurality of extending portions D2 are used for abutting against the substrate element 3. For example, the body portion D1 may be arc-shaped, semicircular or C-shaped, and the body portion D1 may be thin plate-shaped. In the present embodiment, a plurality of clasp structures D are taken as a preferred example, and the number of the clasp structures D may be the same as the number of the conducting elements 2. Two ends of the body portion D1 extend outwards to form two symmetrical extending portions D2. The body portion D1 and the two extension portions D2 may be an integrated single member. The retaining ring structure D may be made of elastic metal material or conductive material. The clasp structure D is movably inserted into the annular groove 20 of the conductive element 2 through a plurality of engaging portions D3 to clamp the conductive element 2. The number of the clamping parts D3 is preferably three, and two clamping parts D3 adjacent to the extension part D2 are symmetrically arranged; one of the engaging portions D3 may be substantially trapezoidal, and the other two engaging portions D3 may be substantially triangular. The assembly method of the snap ring structure D is to insert the conductive element 2 into the housing element 1, and then the snap ring structure D is inserted from top to bottom to snap the annular groove 20 of the conductive element 2.
Further, as shown in fig. 4 to 6, a first predetermined included angle α 1 may be formed between each of the extending portions D2 and the main body portion D1, the first predetermined included angle α 1 may be between 30 degrees and 60 degrees, and the first predetermined included angle α 1 may preferably be 45 degrees. And, one end of each extension D2 is connected to the body portion D1, the other end of each extension D2 is bent to form a bent portion D20, one surface of each bent portion D20 protrudes outward to form a contact portion D200, and the contact portion D200 is used for contacting the substrate member 3. The other surface of each bent portion D20 may be inwardly recessed to form a first recessed portion D201. A second predetermined included angle α 2 may be formed between one of the surfaces of the bending portion D20 and one of the surfaces of the main body portion D1, the second predetermined included angle α 2 may be between 80 degrees and 90 degrees, and the second predetermined included angle α 2 may preferably be 90 degrees.
Therefore, in the practical use of the electronic device Z of the present invention, as shown in fig. 1 to 6, when at least one external power supply device (such as a charging transmission line, but not limited thereto; not shown in the figures) contacts the conductive element 2, the conductive element 2 can be electrically connected to the substrate element 3 through the retaining ring structure D, and power provided by the at least one external power supply device is supplied to the substrate element 3, so that the substrate element 3 can obtain power.
Therefore, the electronic device Z of the present invention can easily transfer the electric energy provided by at least one external power supply device to the conductive element 2 to the substrate element 3 by providing the single retaining ring structure D between the conductive element 2 and the substrate element 3 according to the above technical solution. Moreover, the structure of the retaining ring D is simple, which not only can reduce the space occupied in the electronic device Z, but also can reduce the expenditure of manufacturing cost.
Further, as shown in fig. 1 and fig. 2, one of the side walls 1a of the housing element 1, corresponding to the inner wall surface of the accommodating space 10, may protrude outward to form a plurality of first limiting portions 12; each of the first position-limiting portions 12 may be a long strip structure. Therefore, when the plurality of engaging portions D3 of the retaining ring structure D are clamped to the conductive element 2, each of the position-limiting portions 12 can abut against one of the engaging portions D3 to limit the position of the retaining ring structure D, so as to prevent the retaining ring structure D from rotating and prevent the contact portion D200 from correctly contacting the substrate element 3, thereby achieving the positioning effect.
In addition, according to the above disclosure, the present invention further provides a buckle structure D, which includes a main body D1, the main body D1 is arc-shaped, two ends of the main body D1 respectively extend outward to form an extension portion D2, and one side of the main body D1 protrudes outward to form a plurality of engaging portions D3; the retaining ring structure D is fixed to the conductive element by clamping the conductive element through the plurality of clamping portions D3, and the plurality of extending portions D2 are configured to abut against the substrate element.
However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.
Second embodiment
Fig. 7 to fig. 10 are a schematic perspective view of one viewing angle of a buckle structure, a schematic perspective view of another viewing angle of the buckle structure, a schematic rear view of the buckle structure, and a schematic partial cross-sectional view of an electronic device according to a second embodiment of the present invention, and also refer to fig. 1 to fig. 6. As shown in the drawings, the electronic device Z of the present embodiment is substantially similar to the electronic device Z of the previous embodiment, and therefore, the arrangement or operation of the same elements will not be described herein again. The difference between the electronic device Z of the present embodiment and the electronic device Z of the first embodiment is that in the present embodiment, one surface of the main body D1 (i.e. a surface of the main body D1 opposite to the extension portion D2 or a surface of the main body D1 facing one side wall 1a of the housing element 1) may protrude outward by a plurality of protruding portions D10.
For example, as shown in fig. 8 to 10, the number of the protrusions D10 may be preferably three. When the buckle structure D is clamped on the conductive element 2, the buckle structure D can abut against the wall surface of the housing element 1 through the plurality of protrusions D10, so that the entire surface of the buckle structure D can be free from contacting the wall surface of the housing element 1, the friction force during assembly can be reduced, and meanwhile, the buckle structure D can also achieve the effect of contact balance with the side wall 1a of the housing element 1 through the three protrusions D10.
Further, as shown in fig. 7, the buckle structure D may have a plurality of second concave portions D11, and the plurality of second concave portions D11 correspond to one of the engaging portions D3. For example, the other surface of the body portion D1 (i.e. the surface of the body portion D1 facing the extension portion D2) of the buckle structure D of the present invention may be recessed inward to form a plurality of second recessed portions D11; wherein the number of the second recesses D11 is the same as the number of the protrusions D10.
However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.
Advantageous effects of the embodiments
One of the advantages of the present invention is that the electronic device Z provided by the present invention can be inserted into the housing element 1 through "at least one conducting element 2. The substrate element 3 is located in the interior of the cabinet element 1. At least one buckle ring structure D is provided with a body part D1, the body part D1 is arc-shaped, two ends of the body part D1 respectively extend outwards to form an extension part D2, and one side edge of the body part D1 protrudes outwards to form a plurality of clamping parts D3; the at least one retaining ring structure D is fixed to the at least one conductive element 2 by clamping the at least one conductive element 2 by the plurality of clamping portions D3, and the plurality of extending portions D2 are configured to abut against the substrate element 3 ″ to reduce space usage and cost expenditure.
The buckle ring structure D provided by the invention has the advantages that the buckle ring structure D has the main body D1, the main body D1 is arc-shaped, two ends of the main body D1 respectively extend outwards to form the extending portions D2, and one side of the main body D1 protrudes outwards to form the plurality of engaging portions D3; the retaining ring structure D is fixed to the conductive element by clamping the conductive element through the plurality of clamping portions D3, and the plurality of extending portions D2 are configured to abut against the substrate element ", so as to reduce space usage and reduce cost expenditure.
Furthermore, the power supplied from at least one external power supply device to the conductive element 2 can be easily transferred to the substrate member 3 by providing a single snap ring structure D between the conductive element 2 and the substrate member 3. Moreover, the structure of the retaining ring D is simple, which not only can reduce the space occupied in the electronic device Z, but also can reduce the expenditure of manufacturing cost.
The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.

Claims (10)

1. An electronic device, comprising:
a housing element;
at least one conductive element, at least one said conductive element passing through said housing element;
a substrate element located in an interior of the chassis element; and
the buckle structure comprises at least one buckle ring structure, at least one buckle ring structure and a plurality of clamping parts, wherein the buckle ring structure is provided with a body part which is in an arc shape, two ends of the body part respectively extend outwards to form an extending part, and one side edge of the body part protrudes outwards to form a plurality of clamping parts; the at least one retaining ring structure clamps the at least one conductive element through the plurality of clamping parts so as to be fixed on the at least one conductive element, and the plurality of extending parts are used for abutting against the substrate element.
2. The electronic device of claim 1, wherein each of the extending portions has a first predetermined angle with the main body portion, and the first predetermined angle is between 30 degrees and 60 degrees.
3. The electronic device of claim 1, wherein one of the faces of the body portion protrudes outward to form a plurality of protruding portions, and the plurality of protruding portions are configured to abut against the housing element.
4. The electronic device of claim 1, wherein one end of each of the extension portions is connected to the body portion, and the other end of each of the extension portions is bent to form a bent portion, and one surface of each of the bent portions protrudes outward to form a contact portion for contacting the substrate member.
5. The electronic device of claim 4, wherein the bending portion and the body portion have a second predetermined angle therebetween, and the second predetermined angle is between 80 degrees and 90 degrees.
6. A buckle ring structure is characterized by comprising a body part, wherein the body part is arc-shaped, two ends of the body part respectively extend outwards to form an extension part, and one side edge of the body part protrudes outwards to form a plurality of clamping parts; the retaining ring structure clamps the conductive element through the clamping parts so as to be fixed on the conductive element, and the extending parts are used for abutting against the substrate element.
7. The clasp of claim 6 wherein each of the extensions has a first predetermined angle with the body portion, the first predetermined angle being between 30 and 60 degrees.
8. The clasp of claim 6 wherein one of the faces of the body portion projects outwardly from the plurality of projections.
9. The clasp of claim 6 wherein one end of each of said extensions is connected to said body portion and the other end of each of said extensions is bent to form a bend, one of said faces of each of said bends projecting outwardly to form a contact portion for contacting said base member.
10. The clasp of claim 9 wherein the bend portion and the body portion have a second predetermined angle therebetween, the second predetermined angle being between 80 and 90 degrees.
CN202211031115.8A 2022-08-26 2022-08-26 Electronic device and buckle ring structure Pending CN115275653A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202211031115.8A CN115275653A (en) 2022-08-26 2022-08-26 Electronic device and buckle ring structure
TW111134248A TWI829336B (en) 2022-08-26 2022-09-12 Electronic device and buckle structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211031115.8A CN115275653A (en) 2022-08-26 2022-08-26 Electronic device and buckle ring structure

Publications (1)

Publication Number Publication Date
CN115275653A true CN115275653A (en) 2022-11-01

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Application Number Title Priority Date Filing Date
CN202211031115.8A Pending CN115275653A (en) 2022-08-26 2022-08-26 Electronic device and buckle ring structure

Country Status (2)

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CN (1) CN115275653A (en)
TW (1) TWI829336B (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI278270B (en) * 2005-06-08 2007-04-01 Delta Electronics Inc Securing device for auxiliary securing metal assembly to circuit board
DE102006008015B3 (en) * 2006-02-21 2007-04-12 Harting Electronics Gmbh & Co. Kg Circuit board plug set and group has plastic body by the board having two contact groups with contacts to the board on the same side of the body and plug ends on mutually opposite sides
CN102456959A (en) * 2010-10-18 2012-05-16 启碁科技股份有限公司 Electronic device
GB201118159D0 (en) * 2011-10-20 2011-11-30 Sarantel Ltd Radiofrequency circuit assembly
CN104053332B (en) * 2013-03-15 2016-12-28 英业达科技有限公司 Support holder structure and use the server cabinet handler of this structure
TWI642331B (en) * 2017-06-02 2018-11-21 台達電子工業股份有限公司 Printed circuit board assembly and assembling method thereof

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TWI829336B (en) 2024-01-11

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