CN115274538B - Wafer laminating device - Google Patents
Wafer laminating device Download PDFInfo
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- CN115274538B CN115274538B CN202211169097.XA CN202211169097A CN115274538B CN 115274538 B CN115274538 B CN 115274538B CN 202211169097 A CN202211169097 A CN 202211169097A CN 115274538 B CN115274538 B CN 115274538B
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- 238000010030 laminating Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 230000007246 mechanism Effects 0.000 claims description 79
- 230000005540 biological transmission Effects 0.000 claims description 26
- 239000003292 glue Substances 0.000 claims description 15
- 238000009434 installation Methods 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 238000009423 ventilation Methods 0.000 abstract description 4
- 238000003475 lamination Methods 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 description 94
- 238000000034 method Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 11
- 238000004891 communication Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of wafer lamination, and particularly relates to a wafer lamination device. When the wafer is sucked one by the plurality of suction nozzles, the plurality of suction nozzles can move in position, the ventilation paths of the suction nozzles which are not used temporarily can be blocked, the wafer at other positions is prevented from being adsorbed by mistake, the layout of the wafer is disturbed, the ventilation paths of the suction nozzles are opened in sequence when the wafer is sucked one by one, suction force is generated at the suction nozzles to suck the wafer, after the wafer is attached to the wafer, the suction nozzles can be switched to be connected with external air after the wafer is contacted with the substrate, so that suction force is not generated at the suction nozzles, the wafer is separated from the suction of the suction nozzles, and the attaching precision of the wafer is not influenced by moving the suction nozzles.
Description
Technical Field
The invention belongs to the technical field of wafer bonding, and particularly relates to a wafer bonding device.
Background
The die bonding is also called or chip mounting, i.e. bonding a wafer to a designated area of a bracket through a colloid (generally conductive adhesive or insulating adhesive for an LED) to form a thermal path or an electrical path, providing conditions for subsequent wire bonding, and the die bonding process is completed through a die bonder, wherein the wafer bonding process is one of the most important processes in the die bonding step, generally, a dispensing head firstly deposits the colloid on a substrate, then uses a suction nozzle to suck the wafer onto the substrate, and presses down the bonded wafer.
The suction nozzles are communicated with the air pump, the plurality of suction nozzles can be connected through the air pump, the number of wafers sucked in a single movement period is increased, the suction nozzles can be started simultaneously, the layout of the wafers is easy to be disturbed, the requirement on the positions of wafer bonding on the substrate is met, the problem that electromagnetic valves are added to the positions of gas transmission pipes corresponding to the suction nozzles is solved, the communication between the single suction nozzle and the air pump is blocked after the electromagnetic valves are started, the communication between the suction nozzle and the air pump is blocked when bonding procedures are bonded, the internal air pressure of the suction nozzle is smaller than that of the outside, the wafers can still be sucked, at the moment, although the suction force of the suction nozzle is not large, the wafers can still be bonded on the substrate after being contacted with the dispensing positions on the substrate, the suction nozzles can drive the wafers to move in a small range when rising, further the subsequent wafer bonding is misplaced, and the bonding precision of the wafers can be influenced to a certain extent.
Disclosure of Invention
The invention aims to provide a wafer laminating device, when a plurality of suction nozzles absorb wafers one by one, the plurality of suction nozzles can move in position, the ventilation paths of the suction nozzles which are not used temporarily can be blocked, the wafer at other positions is prevented from being absorbed by mistake, the layout of the wafers is disturbed, the ventilation paths of the suction nozzles are sequentially opened when the wafers are absorbed one by one, suction force is generated at the suction nozzles to absorb the wafers, after the wafers are laminated, the suction nozzles can be switched to be communicated with outside air after the wafers are contacted with a substrate, so that suction force is not generated at the suction nozzles, the wafers are separated from the absorption of the suction nozzles, and the laminating precision of the wafers is not influenced by moving the suction nozzles.
The technical scheme adopted by the invention is as follows:
the wafer attaching device comprises an installing table, a dispensing mechanism, a substrate loading assembly and a wafer loading mechanism, wherein the substrate loading assembly and the wafer loading mechanism are assembled above the installing table, side frames are assembled at two ends of the top end of the installing table, a moving mechanism is assembled at the top ends of the two side frames, the moving mechanism comprises a first moving frame and a first moving table, the first moving frame is assembled at the top ends of the two side frames, the first moving table is assembled at one side of the first moving frame, the first moving table is in sliding connection with the first moving frame, and the dispensing mechanism is assembled at one side of the first moving table;
the surface mounting mechanism is assembled on one side of the first mobile station and comprises a first mounting seat, an air pump, a first air pipe, a second air pipe, a branch plate and a branch pipe;
the first mounting seat is assembled on one side of the first mobile station, the first mounting seat is in sliding connection with the first mobile station, the air pump is assembled on the top end of one end of the first mounting seat, the first air pipe is arranged at the output end of the air pump, the second air pipe is assembled at the bottom of the first air pipe, the second air pipe is rotationally connected with the first air pipe, the branch disc is arranged at the bottom end of the second air pipe, a plurality of branch pipes are uniformly arranged on the periphery of the branch disc, a suction nozzle is arranged below the branch pipes, a connecting column is further fixed at the bottom end of the branch pipe, a lifting plate is connected inside the connecting column in a sliding manner, the lifting plate is fixed with the suction nozzle, a second motor is fixed inside the connecting column, and a transmission screw rod is fixed at the output end of the second motor and is in threaded connection with the transmission screw rod.
In a preferred scheme, paster mechanism still includes first motor and switching disc, the middle part of bleeder is provided with the circle coil pipe, first motor installs in one side of circle coil pipe, the switching disc sets up in the circle coil pipe, the output and the switching disc of first motor are connected, just the gas pocket has been seted up to one side of circle coil pipe, T type through-hole has been seted up to the inside of switching disc.
In a preferred scheme, the paster mechanism still includes driven gear, extension board, fourth motor and drive gear, driven gear sets up in the tracheal outside of second, the extension board assembly is in one side of first mount pad, the fourth motor assembly is on the top of extension board, drive gear fixes the output at the fourth motor, just drive gear is connected with driven gear meshing.
In a preferred scheme, the moving mechanism further comprises a first motor and a first screw rod, wherein the first motor is fixed at one end of the first moving frame, the first screw rod is assembled in the first moving frame and is in threaded connection with the first moving table, and one end of the first screw rod is connected with the output end of the first motor;
the mobile station is characterized in that two sliding grooves are formed in the first mobile station, the first mounting seat is assembled in one sliding groove, a second motor and a third motor are respectively installed at the top end of the first mobile station and located in the two sliding grooves, a second screw rod and a third screw rod are assembled in the two sliding grooves, the second screw rod is in threaded connection with the first mounting seat, the top end of the second screw rod is fixed with the output end of the second motor, and the output end of the third screw rod is fixed with the third motor.
In a preferred scheme, the dispensing mechanism comprises a second mounting seat, a glue tank and a dispensing hose, wherein the second mounting seat is assembled in the other chute of the first mounting seat, the second mounting seat is in sliding connection with the first mounting seat, the second mounting seat is in threaded connection with a third screw rod, the glue tank is assembled at the top end of one end of the second mounting seat, and the dispensing hose is assembled at the bottom of the glue tank.
In a preferred scheme, the base plate loading assembly comprises a cross electric sliding table, a mounting bracket and a first loading table, wherein the cross electric sliding table is assembled on the upper surface of the mounting table, the mounting bracket is mounted on the top end of the cross electric sliding table, and the first loading table is fixed on the top end of the mounting bracket.
In a preferred scheme, the base plate loading assembly further comprises a distance adjusting table, a first electric push rod and a second electric push rod, wherein a moving block is arranged at the bottom end of the distance adjusting table and is in sliding connection with the first loading table, two first electric push rods are arranged in the distance adjusting table and the first loading table respectively, the second electric push rod is fixedly connected with the output end of the first electric push rod, and a positioning block is fixed at the output end of the second electric push rod.
In a preferred scheme, one side of the installing support is fixed with a fifth motor, a fourth screw rod is assembled in the middle of the installing support, the output end of the fifth motor is fixed with the fourth screw rod, the moving block is installed on the fourth screw rod, and the moving block is in threaded connection with the fourth screw rod.
In a preferred scheme, wafer loading mechanism includes single track electronic slip table, supporting seat and second loading platform, single track electronic slip table assembly is at the upper surface of mount table, the top at single track electronic slip table is installed to the supporting seat, the internally mounted of supporting seat has step motor, the second loading platform assembly is at the top of supporting seat, just the second loading platform is fixed with step motor's output.
In a preferred scheme, the receiver is equipped with to the one end of installing support, connect through the angle steel between receiver and the installing support.
The invention has the technical effects that:
the chip mounting mechanism is provided with a plurality of suction nozzles which are driven by the same air pump, the suction nozzles are annularly arranged and can be rotationally adjusted, a switching disc is arranged at each suction nozzle to switch the air passages communicated with the suction nozzles, when the process of sucking the chip is carried out, the switching disc can seal the air passages communicated with all the suction nozzles and the air pump, when the chip is sucked, all the suction nozzles suck the chip at one time, the suction nozzles for sucking the chip are communicated with the air pump, when the suction nozzles are attached, the suction nozzles suck the chip, the air passages of the suction nozzles are aligned with the dispensing position on the substrate one by one, after the air passages of the suction nozzles are switched to be communicated with the outside air through the switching disc, at the moment, the suction nozzles can not generate suction force, the internal air pressure is balanced with the outside air pressure, the chip is separated from the suction nozzles, and then the chip is not influenced by moving, and compared with the conventional normal suction mode, the chip mounting method can be better placed, and the chip mounting accuracy is better;
when the wafer bonding process is carried out, the wafer is bonded on the substrate, the wafer is separated from the adsorption of the wafer, the suction nozzle is positioned above the wafer, and the suction nozzle is matched with the second motor, the transmission screw rod, the lifting plate and other structures, so that the suction nozzle can be pressed down, pressure is generated on the wafer, and the wafer and the substrate are bonded more tightly.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of the moving mechanism of the present invention;
FIG. 3 is a schematic diagram of the connection of the moving mechanism, the patch mechanism and the dispensing mechanism of the present invention;
FIG. 4 is an exploded view of the patch mechanism of the present invention;
FIG. 5 is a schematic cross-sectional view of the patch mechanism of the present invention;
FIG. 6 is a schematic diagram of the connection of a branching pipe and a switching tray of the present invention;
fig. 7 is a schematic structural view of a substrate loading assembly of the present invention;
fig. 8 is a partial structural schematic view of a substrate loading assembly of the present invention;
fig. 9 is a schematic view of the wafer loading mechanism of the present invention.
In the drawings, the list of components represented by the various numbers is as follows:
1. a mounting table; 2. a side frame; 3. a storage box; 4. angle steel; 10. a moving mechanism; 11. a first moving frame; 12. a first motor; 13. a first screw rod; 14. a first mobile station; 15. a second motor; 16. a third motor; 17. a second screw rod; 18. a third screw rod; 20. a patch mechanism; 21. a first mount; 22. an air pump; 23. a first air tube; 24. a second air pipe; 25. a driven gear; 26. a branching tray; 27. a branch pipe; 28. a first motor; 29. a switching plate; 30. a connecting column; 31. a suction nozzle; 32. an extension plate; 33. a fourth motor; 34. a transmission gear; 35. a second motor; 36. a transmission screw rod; 37. a lifting plate; 40. a dispensing mechanism; 41. a second mounting base; 42. a glue tank; 43. dispensing a rubber tube; 50. a substrate loading assembly; 51. a cross-shaped electric sliding table; 52. a mounting bracket; 53. a first loading table; 54. a fifth motor; 55. a fourth screw rod; 56. a moving block; 57. a distance adjusting table; 58. a first electric push rod; 59. a second electric push rod; 60. a wafer loading mechanism; 61. monorail electric sliding table; 62. a support base; 63. and a second loading table.
Detailed Description
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present invention is not limited to the specific embodiments disclosed below.
Further, reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic can be included in at least one implementation of the invention. The appearances of the phrase "in one preferred embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
Further, in describing the embodiments of the present invention in detail, the cross-sectional view of the device structure is not partially enlarged to a general scale for convenience of description, and the schematic is only an example, which should not limit the scope of protection of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
Example 1
Referring to fig. 1 to 6, a first embodiment of the present invention provides a wafer bonding apparatus, which includes a mounting table 1, a dispensing mechanism 40, a substrate loading assembly 50 and a wafer loading mechanism 60, wherein the substrate loading assembly 50 and the wafer loading mechanism 60 are all mounted above the mounting table 1, two ends of the top end of the mounting table 1 are provided with side frames 2, the top ends of the two side frames 2 are provided with a moving mechanism 10, the moving mechanism 10 includes a first moving frame 11 and a first moving table 14, the first moving frame 11 is mounted on the top ends of the two side frames 2, the first moving table 14 is mounted on one side of the first moving frame 11, the first moving table 14 is slidably connected with the first moving frame 11, and the dispensing mechanism 40 is mounted on one side of the first moving table 14;
the patch mechanism 20, the patch mechanism 20 is assembled on one side of the first movable platform 14, the patch mechanism 20 includes the first mount pad 21, the air pump 22, the first air pipe 23, the second air pipe 24, the branch dish 26, the branch pipe 27, the first mount pad 21 is assembled on one side of the first movable platform 14, and the first mount pad 21 is slidably connected with the first movable platform 14, the air pump 22 is assembled on the top of one end of the first mount pad 21, the first air pipe 23 is set up at the output end of the air pump 22, the second air pipe 24 is assembled at the bottom of the first air pipe 23, and the second air pipe 24 is rotatably connected with the first air pipe 23, the branch dish 26 is set up at the bottom of the second air pipe 24, a plurality of branch pipes 27 are uniformly arranged on the circumference of the branch dish 26, the suction nozzle 31 is installed below the branch pipe 27, the bottom of the branch pipe 27 is also fixed with the spliced pole 30, the inside of the spliced pole 30 is slidably connected with the lifter 37, the lifter 37 is fixed with the suction nozzle 31, the inside of the spliced pole 30 is fixed with the second motor 35, the output end of the second motor 35 is fixed with the transmission screw rod 36, the transmission screw rod 36 is screwed with the transmission screw rod 36;
when the wafer is attached, the air pump 22 is started to drive air flow to enter the branch pipe 27 through the suction nozzle 31 and blow out from the output end of the air pump 22 after passing through the branch disk 26, the second air pipe 24 and the first air pipe 23, at the moment, the suction nozzle 31 is provided with suction force, the wafer can be sucked up when the suction nozzle 31 is close to the wafer, the sucked up wafer is controlled to move through the moving mechanism 10, the substrate loading assembly 50 is matched, the wafer is attached to the substrate, the attaching work is completed, the branch disk 26 is adopted to divide the air flow, and a plurality of branch pipes 27 are arranged on the periphery of the branch disk 26, so that more wafers can be sucked up quickly, and the purpose of accelerating the attaching process of the wafer is achieved;
further, when the wafer is attached, the second motor 35 drives the transmission screw rod 36 to rotate, so that the lifting plate 37 and the suction nozzle 31 fixed by the lifting plate can be driven to descend together, the wafer adsorbed by the suction nozzle 31 can be attached to the substrate, and a certain pressure is applied downwards by the suction nozzle 31, so that the attaching fixity of the wafer is ensured.
Referring to fig. 5 and 6, the patch mechanism 20 further includes a first motor 28 and a switching plate 29, a circular coil is disposed in the middle of the branch pipe 27, the first motor 28 is mounted on one side of the circular coil, the switching plate 29 is disposed in the circular coil, an output end of the first motor 28 is connected with the switching plate 29, an air hole is formed in one side of the circular coil, and a T-shaped through hole is formed in the switching plate 29.
In this embodiment, the initial state of the T-shaped through hole in the switching disc 29 is the connection state of the blocking suction nozzle 31 and the branch pipe 27, when the wafer is sucked, the wafer is aligned with one suction nozzle 31, and at this time, the first motor 28 which is a group with this suction nozzle 31 is controlled to drive the switching disc 29 to rotate, the suction nozzle 31 and the branch pipe 27 are communicated, and the air pump 22 is started, after the whole paster mechanism 20 is controlled to descend, the aligned wafer can be sucked, after the rest suction nozzles 31 are adjusted to be aligned with the wafer one by one to finish the sucking work, after the wafer is moved to the substrate, the wafer is aligned with the die bonding position of the substrate, and then the suction nozzle 31 is pushed to be pressed down, so that the wafer is bonded on the substrate, and as a plurality of wafers are simultaneously carried to the substrate, the bonding work of a plurality of wafers can be completed in one movement cycle, and the bonding efficiency is increased;
further, when the wafer is attached, after the wafer is pressed down and attached to the dispensing position on the substrate, the first motor 28 corresponding to the current suction nozzle 31 drives the switching disc 29 to rotate, the T-shaped through hole of the switching disc 29 is adjusted to be communicated with the suction nozzle 31 and the air hole, at the moment, the air pressure inside the suction nozzle 31 is equal to the external air pressure, the wafer can be attached to the substrate without suction, in this way, after the wafer is placed on the substrate, the wafer cannot move along with the suction nozzle 31, and compared with the current suction mode, the deviation of the wafer is not easy to be caused, and the processing precision is improved.
Next, referring to fig. 4 again, the patch mechanism 20 further includes a driven gear 25, an extension plate 32, a fourth motor 33 and a transmission gear 34, wherein the driven gear 25 is disposed on the outer side of the second air tube 24, the extension plate 32 is assembled on one side of the first mounting seat 21, the fourth motor 33 is assembled on the top end of the extension plate 32, the transmission gear 34 is fixed on the output end of the fourth motor 33, and the transmission gear 34 is in meshed connection with the driven gear 25;
in the process of sucking the wafer and attaching the wafer, the extension plate 32 can drive the transmission gear 34 to rotate and engage the transmission driven gear 25 to rotate, so that the plurality of branch pipes 27 rotate to change positions, and the switching of different suction nozzles 31 can be completed in the process of sucking the wafer and attaching the wafer.
Next, referring to fig. 2 and 3 together, the moving mechanism 10 further includes a first motor 12 and a first screw rod 13, the first motor 12 is fixed at one end of the first moving frame 11, the first screw rod 13 is assembled in the first moving frame 11, the first screw rod 13 is in threaded connection with the first moving table 14, and one end of the first screw rod 13 is connected with the output end of the first motor 12;
two sliding grooves are formed in the first mobile station 14, a first mounting seat 21 is assembled in one sliding groove, a second motor 15 and a third motor 16 are respectively installed at the top end of the first mobile station 14 and positioned in the two sliding grooves, a second screw rod 17 and a third screw rod 18 are assembled in the two sliding grooves, the second screw rod 17 is in threaded connection with the first mounting seat 21, the top end of the second screw rod 17 is fixed with the output end of the second motor 15, and the output end of the third screw rod 18 is fixed with the third motor 16;
above-mentioned, when driving first lead screw 13 rotatory by first motor 12, can make first mobile station 14 translation on first removal frame 11 under the screw drive, and then drive paster mechanism 20 and some glued mechanism 40 together translation, and then drive paster mechanism 20 under screw drive's effect and carry out the slip from top to bottom when second motor 15 drives second lead screw 17 rotation, realize the biax regulation to paster mechanism 20, make things convenient for paster mechanism 20 to absorb the operation of wafer and laminating wafer.
Referring to fig. 3, the dispensing mechanism 40 includes a second mounting seat 41, a glue tank 42 and a dispensing tube 43, the second mounting seat 41 is assembled in another chute of the first mounting seat 21, the second mounting seat 41 is slidably connected with the first mounting seat 21, the second mounting seat 41 is in threaded connection with the third screw rod 18, the glue tank 42 is assembled at the top end of one end of the second mounting seat 41, and the dispensing tube 43 is assembled at the bottom of the glue tank 42.
The third motor 16 drives the third screw rod 18 to rotate, and under the action of the screw transmission, the patch mechanism 20 can be driven to slide up and down (this is a common mode in a conventional mode, which is not described in detail herein), and the patch mechanism is used with the moving mechanism 10, so that the dual-shaft transmission of the dispensing mechanism 40 is realized, and the dispensing operation is conveniently performed on the surface of the substrate through the dispensing tube 43.
Next, referring to fig. 9, the wafer loading mechanism 60 includes a single rail electric sliding table 61, a supporting seat 62 and a second loading table 63, the single rail electric sliding table 61 is assembled on the upper surface of the mounting table 1, the supporting seat 62 is installed on the top end of the single rail electric sliding table 61, a stepper motor is installed in the supporting seat 62, the second loading table 63 is assembled on the top end of the supporting seat 62, and the second loading table 63 is fixed with the output end of the stepper motor.
The wafer loading mechanism 60 is integrally used with the moving mechanism 10, the second loading platform 63 is used for placing the wafer to be used, and in the process of sucking the wafer, the position of the second loading platform 63 can be adjusted by the single-rail electric sliding platform 61, and the second loading platform 63 is controlled to rotate by the stepping motor, so that the alignment of the wafer and the suction nozzle 31 can be adjusted, and all the wafers placed on the second loading platform 63 can be ensured to complete the sucking process at the same position.
Example 2
Referring to fig. 7 and 8, a second embodiment of the present invention is shown, which is based on the previous embodiment.
The substrate loading assembly 50 comprises a cross electric sliding table 51, a mounting bracket 52 and a first loading table 53, wherein the cross electric sliding table 51 is assembled on the upper surface of the mounting table 1, the mounting bracket 52 is arranged at the top end of the cross electric sliding table 51, and the first loading table 53 is fixed at the top end of the mounting bracket 52;
the first loading table 53 is mainly used for loading substrates as a carrying member of the substrates, and is configured to complete biaxial movement by the cross electric sliding table 51 provided below, and to cooperate with the moving mechanism 10 for completing wafer bonding.
Referring to fig. 8, the substrate loading assembly 50 further includes a distance adjusting table 57, a first electric push rod 58 and a second electric push rod 59, wherein a moving block 56 is assembled at the bottom end of the distance adjusting table 57, the moving block 56 is slidably connected with the first loading table 53, two first electric push rods 58 are respectively installed in the distance adjusting table 57 and one side of the first loading table 53, the second electric push rod 59 is fixedly connected with the output end of the first electric push rod 58, and a positioning block is fixed at the output end of the second electric push rod 59;
above-mentioned, the distance adjusting platform 57 sets up on first loading platform 53 to can slide on first loading platform 53, slide distance adjusting platform 57 can adjust the interval between distance adjusting platform 57 and the first loading platform 53, this interval is the size of one of the length and width of mounting substrate, through adjusting the interval between distance adjusting platform 57 and the first loading platform 53, can be convenient for the substrate loading of different specifications, and still accessible first electric putter 58 drives the whole size of second electric putter 59 flexible regulation loading space, and the locating piece that second electric putter 59 output set up then can play the effect of location to the base plate, the accurate counterpoint when having guaranteed the base plate installation.
Next, referring to fig. 8 again, a fifth motor 54 is fixed to one side of the mounting bracket 52, a fourth screw 55 is mounted in the middle of the mounting bracket 52, an output end of the fifth motor 54 is fixed to the fourth screw 55, a moving block 56 is mounted on the fourth screw 55, and the moving block 56 is in threaded connection with the fourth screw 55.
The fifth motor 54 is used to drive the fourth screw 55 to rotate, and when the fourth screw 55 rotates, the moving block 56 and the distance adjusting table 57 mounted on the moving block 56 can be driven to move together under the transmission of the screw, so as to complete the adjustment control of the position of the distance adjusting table 57.
Next, referring to fig. 8 again, one end of the mounting bracket 52 is provided with a storage box 3, and the storage box 3 is connected with the mounting bracket 52 through angle steel 4;
above-mentioned, after the wafer laminating of base plate finishes, second electric putter 59 control locating piece is retrieved, puts into new base plate and promotes the substrate that has laminated and move forward, and the substrate of forward moving can slide to the receiver 3 in this moment accomplish the temporary storage, need not every base plate and all need the manual removal, and the operation is more smooth.
The working principle of the invention is as follows: when the wafer bonding process is carried out, the moving mechanism 10 drives the dispensing mechanism 40 to glue on the wafer bonding site on the substrate, then the moving mechanism 10 drives the bonding mechanism 20 to move to the position of the wafer loading mechanism 60, the bonding mechanism 20 is started, the moving mechanism 10 is matched with the wafer loading mechanism 60 to be used, the bonding mechanism 20 can be aligned with the wafer loaded on the wafer loading mechanism 60, the air pump 22 is started, the first motors 28 control the communication state of the branch pipes 27 and the suction nozzles 31, the wafer is sucked at the suction nozzles 31 and driven by the fourth motor 33 to rotate by the transmission gears 34, the positions of the suction nozzles 31 are adjusted, after the wafer is sucked at the suction nozzles 31, the bonding mechanism 20 is moved to the position above the substrate by the moving mechanism 10, the wafer under the suction nozzles 31 is aligned with the dispensing position of the substrate by the matching of the moving mechanism 10 and the substrate loading assembly 50, then the second motor 35 drives the transmission screw 36 to push the wafer to descend, the first motor 28 controls the switching disk 29 to rotate again after the wafer contacts the glue, the wafer is regulated to be 31, the suction force of the wafer can be applied to the wafer bonding pressure can be more tightly bonded.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention. Structures, devices and methods of operation not specifically described and illustrated herein, unless otherwise indicated and limited, are implemented according to conventional means in the art.
Claims (9)
1. Wafer laminating device, its characterized in that: the device comprises an installation table (1), a dispensing mechanism (40), a substrate loading assembly (50) and a wafer loading mechanism (60), wherein the substrate loading assembly (50) and the wafer loading mechanism (60) are assembled above the installation table (1), side frames (2) are assembled at two ends of the top end of the installation table (1), a moving mechanism (10) is assembled at the top ends of the two side frames (2), the moving mechanism (10) comprises a first moving frame (11) and a first moving table (14), the first moving frame (11) is assembled at the top ends of the two side frames (2), the first moving table (14) is assembled at one side of the first moving frame (11), the first moving table (14) is in sliding connection with the first moving frame (11), and the dispensing mechanism (40) is assembled at one side of the first moving table (14);
a patch mechanism (20), wherein the patch mechanism (20) is assembled on one side of the first mobile station (14), and the patch mechanism (20) comprises a first mounting seat (21), an air pump (22), a first air pipe (23), a second air pipe (24), a branch plate (26) and a branch pipe (27);
the device comprises a first mounting seat (21), a first air pump (22), a first air pipe (23), a second air pipe (24), a second motor (36), a first screw rod (36) and a transmission screw rod (35), wherein the first mounting seat (21) is assembled on one side of a first movable table (14), the first mounting seat (21) is in sliding connection with the first movable table (14), the air pump (22) is assembled on the top end of one end of the first mounting seat (21), the first air pipe (23) is arranged at the output end of the air pump (22), the second air pipe (24) is assembled on the bottom of the first air pipe (23), the second air pipe (24) is in rotary connection with the first air pipe (23), a branch disc (26) is arranged at the bottom end of the second air pipe (24), a plurality of branch pipes (27) are uniformly arranged on the periphery of the branch disc (26), suction nozzles (31) are arranged below the branch pipes (27), connecting columns (30) are also fixed on the bottom ends of the branch pipes (27), lifting plates (37) are fixedly connected with the suction nozzles (31) in a sliding manner, the interiors of the connecting columns (30), the lifting plates (37) are fixedly connected with the suction nozzles (31), the interiors of the connecting columns (30) respectively, the second motor (36) are fixedly connected with the transmission screw rods (36), and the transmission screw rods (36) respectively.
The patch mechanism (20) further comprises a first motor (28) and a switching disc (29), a circular coil pipe is arranged in the middle of the branch pipe (27), the first motor (28) is arranged on one side of the circular coil pipe, the switching disc (29) is arranged in the circular coil pipe, the output end of the first motor (28) is connected with the switching disc (29), an air hole is formed in one side of the circular coil pipe, and a T-shaped through hole is formed in the switching disc (29).
2. A wafer bonding apparatus according to claim 1, wherein: the patch mechanism (20) further comprises a driven gear (25), an extension plate (32), a fourth motor (33) and a transmission gear (34), wherein the driven gear (25) is arranged on the outer side of the second air pipe (24), the extension plate (32) is assembled on one side of the first mounting seat (21), the fourth motor (33) is assembled on the top end of the extension plate (32), the transmission gear (34) is fixed at the output end of the fourth motor (33), and the transmission gear (34) is meshed with the driven gear (25).
3. A wafer bonding apparatus according to claim 1, wherein: the moving mechanism (10) further comprises a first motor (12) and a first screw rod (13), the first motor (12) is fixed at one end of the first moving frame (11), the first screw rod (13) is assembled in the first moving frame (11), the first screw rod (13) is in threaded connection with the first moving table (14), and one end of the first screw rod (13) is connected with the output end of the first motor (12);
two sliding grooves are formed in the first mobile station (14), the first installation seat (21) is assembled in one sliding groove, a second motor (15) and a third motor (16) are respectively installed at the top end of the first mobile station (14) and located in the two sliding grooves, a second screw rod (17) and a third screw rod (18) are assembled in the two sliding grooves, the second screw rod (17) is in threaded connection with the first installation seat (21), the top end of the second screw rod (17) is fixed with the output end of the second motor (15), and the output end of the third screw rod (18) is fixed with the third motor (16).
4. A wafer bonding apparatus according to claim 1, wherein: the glue dispensing mechanism (40) comprises a second mounting seat (41), a glue tank (42) and a glue dispensing tube (43), wherein the second mounting seat (41) is assembled in the other chute of the first mounting seat (21), the second mounting seat (41) is slidably connected with the first mounting seat (21), the second mounting seat (41) is in threaded connection with a third screw rod (18), the glue tank (42) is assembled at the top end of one end of the second mounting seat (41), and the glue dispensing tube (43) is assembled at the bottom of the glue tank (42).
5. A wafer bonding apparatus according to claim 1, wherein: the substrate loading assembly (50) comprises a cross electric sliding table (51), a mounting bracket (52) and a first loading table (53), wherein the cross electric sliding table (51) is assembled on the upper surface of the mounting table (1), the mounting bracket (52) is mounted on the top end of the cross electric sliding table (51), and the first loading table (53) is fixed on the top end of the mounting bracket (52).
6. The wafer bonding apparatus according to claim 5, wherein: the substrate loading assembly (50) further comprises a distance adjusting table (57), first electric pushing rods (58) and second electric pushing rods (59), wherein the bottom end of the distance adjusting table (57) is provided with a moving block (56), the moving block (56) is in sliding connection with the first loading table (53), the first electric pushing rods (58) are two, the first electric pushing rods (58) are respectively arranged in the distance adjusting table (57) and in one side of the first loading table (53), the second electric pushing rods (59) are fixedly connected with the output ends of the first electric pushing rods (58), and positioning blocks are fixedly arranged at the output ends of the second electric pushing rods (59).
7. The wafer bonding apparatus according to claim 6, wherein: a fifth motor (54) is fixed on one side of the mounting bracket (52), a fourth screw rod (55) is assembled in the middle of the mounting bracket (52), the output end of the fifth motor (54) is fixed with the fourth screw rod (55), a moving block (56) is mounted on the fourth screw rod (55), and the moving block (56) is in threaded connection with the fourth screw rod (55).
8. A wafer bonding apparatus according to claim 1, wherein: the wafer loading mechanism (60) comprises a single-rail electric sliding table (61), a supporting seat (62) and a second loading table (63), wherein the single-rail electric sliding table (61) is assembled on the upper surface of the mounting table (1), the supporting seat (62) is installed at the top end of the single-rail electric sliding table (61), a stepping motor is installed in the supporting seat (62), the second loading table (63) is assembled at the top end of the supporting seat (62), and the second loading table (63) is fixed with the output end of the stepping motor.
9. The wafer bonding apparatus according to claim 5, wherein: one end of the mounting bracket (52) is provided with a storage box (3), and the storage box (3) is connected with the mounting bracket (52) through angle steel (4).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211169097.XA CN115274538B (en) | 2022-09-26 | 2022-09-26 | Wafer laminating device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211169097.XA CN115274538B (en) | 2022-09-26 | 2022-09-26 | Wafer laminating device |
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| CN115274538A CN115274538A (en) | 2022-11-01 |
| CN115274538B true CN115274538B (en) | 2023-04-28 |
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| CN109786311B (en) * | 2019-01-28 | 2020-04-03 | 深圳新益昌科技股份有限公司 | Mini-LED high-speed die bonder and die bonding method |
| CN110299312A (en) * | 2019-07-04 | 2019-10-01 | 深圳市诺泰自动化设备有限公司 | A kind of rotary type tower bonder |
| CN112838044A (en) * | 2021-02-09 | 2021-05-25 | 深圳市卓兴半导体科技有限公司 | Running device and wafer bonding device |
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