CN115260924A - Heat-conducting adhesive film and preparation method thereof - Google Patents
Heat-conducting adhesive film and preparation method thereof Download PDFInfo
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- CN115260924A CN115260924A CN202210956595.2A CN202210956595A CN115260924A CN 115260924 A CN115260924 A CN 115260924A CN 202210956595 A CN202210956595 A CN 202210956595A CN 115260924 A CN115260924 A CN 115260924A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
Abstract
The invention relates to the field of adhesive film materials, in particular to a heat-conducting adhesive film which comprises the following components in parts by weight: 40-70 parts of a film matrix; 20-35 parts of a conductive material; 10-20 parts of flame-retardant smoke suppressor; 5-10 parts of a binder; 1-8 parts of a curing agent. The conductive material is added, and the conductive material does not sink but floats on the film in the curing process, and the diluted film matrix film is covered to prevent the conductive material from falling off, so that the conductive network is protected, and the conductive effect of the invention is improved; the heat-conducting adhesive film with a three-layer structure is prepared by adopting a room-temperature tape casting method, and has the advantages of excellent performance, low cost, light weight, stable structure, high tensile strength and strong operability.
Description
Technical Field
The invention relates to the field of adhesive film materials, in particular to a heat-conducting adhesive film and a preparation method thereof.
Background
With the development of flexible electronics, conductive film materials become an indispensable component of flexible sensors. The traditional rigid conductive material cannot meet the requirement of novel flexible equipment, research and development of a light, thin, high-conductivity and stable-mechanical-property conductive film is a research hotspot in the field of current flexible electronics, and the conductive film can be widely applied to the fields of smart phones, electronic skins, strain sensors, supercapacitors, flexible solar cells and the like. The flexible piezoresistive tactile sensor takes a conductive polymer as a sensitive element, and when a contact is pressed and deformed by contacting with an external object, the conductive polymer is pressed to change the resistance of the contact, so that the current flowing through the conductive polymer is changed.
The existing conductive film material has poor heat conduction and conductivity, and is not beneficial to the use and popularization of products.
Disclosure of Invention
In order to solve the technical problems, the invention provides a heat-conducting adhesive film with good electric conduction effect and excellent performance.
The invention also provides a preparation method of the heat-conducting adhesive film, which is simple and convenient in process.
The invention adopts the following technical scheme:
a heat-conducting adhesive film comprises the following components in parts by weight: 40-70 parts of a film matrix; 20-35 parts of a conductive material; flame-retardant smoke suppressor 10-20 parts; 5-10 parts of a binder; 1-8 parts of a curing agent.
The technical proposal is further improved in that the film substrate is one of polyester, thermoplastic polyurethane and polydimethylsiloxane.
The technical proposal is further improved in that the conductive material is one of a metal material or a carbon material.
The technical proposal is further improved in that the metal material is at least one of silver nanowires, silver nanoparticles, gold and copper.
The technical proposal is further improved in that the carbon material is graphene or carbon nano tubes.
The technical proposal is further improved that the flame-retardant smoke suppressor is compounded by magnesium hydroxide and calcium carbonate.
The technical proposal is further improved in that the mass ratio of the magnesium hydroxide to the calcium carbonate is 1-2:1.
the technical proposal is further improved that the adhesive is acrylic adhesive; the curing agent is one of aromatic sulfonium salt, aromatic diazonium salt, iodonium salt, aromatic isocyanate and aliphatic isocyanate.
A preparation method of a heat-conducting adhesive film comprises the following steps: adding the film substrate, the conductive material and the binder into a stirrer according to the proportion, stirring, fully stirring to obtain a mixed solution with certain fluidity, firstly adding the curing agent, stirring for 0.5-1min, adding the flame-retardant smoke suppressor, quickly stirring uniformly, casting to a template, curing at room temperature for 2-3h, casting a layer of diluted film substrate film on the surface of the film substrate under the condition that the interior is not completely cured, and curing at room temperature for 13-20h to obtain the heat-conductive adhesive film.
The technical proposal is further improved in that the thickness of the heat-conducting adhesive film is 0.5-10 μm.
The invention has the beneficial effects that:
the conductive material is added, and the conductive material does not sink but floats on the surface in the curing process, and the diluted film-substrate film is covered to prevent the conductive material from falling off, so that the conductive network is protected, and the conductive effect of the invention is improved; the heat-conducting adhesive film with the three-layer structure is prepared by adopting a room-temperature tape casting method, and has the advantages of excellent heat conduction and electric conduction performance, low cost, light weight, stable structure, high tensile strength and strong operability.
Detailed Description
The present invention is further described below with reference to specific embodiments, and it should be noted that, without conflict, any combination between the embodiments or technical features described below may form a new embodiment.
A heat-conducting adhesive film comprises the following components in parts by weight: film substrate 40-70 parts; 20-35 parts of a conductive material; 10-20 parts of flame-retardant smoke suppressor; 5-10 parts of a binder; 1-8 parts of a curing agent.
Further, the film substrate is one of polyester, thermoplastic polyurethane and polydimethylsiloxane.
Further, the conductive material is one of a metal material or a carbon material.
Further, the metal material is at least one of silver nanowires, silver nanoparticles, gold and copper.
Further, the carbon material is graphene or carbon nanotubes.
Furthermore, the flame-retardant smoke suppressor is compounded by magnesium hydroxide and calcium carbonate.
Further, the mass ratio of the magnesium hydroxide to the calcium carbonate is 1-2:1.
further, the binder is an acrylic binder; the curing agent is one of aromatic sulfonium salt, aromatic diazonium salt, iodonium salt, aromatic isocyanate and aliphatic isocyanate.
A preparation method of a heat-conducting adhesive film comprises the following steps: adding the film substrate, the conductive material and the binder into a stirrer according to the proportion, stirring, fully stirring to obtain a mixed solution with certain fluidity, firstly adding the curing agent, stirring for 0.5-1min, adding the flame-retardant smoke suppressor, quickly and uniformly stirring, casting to a template, curing at room temperature for 2-3h, casting a layer of diluted film substrate film on the surface of the film substrate under the condition that the interior is not completely cured, and curing at room temperature for 13-20h to obtain the heat-conducting adhesive film.
Further, the thickness of the heat-conduction and electric-conduction adhesive film is 0.5-10 μm.
Example 1
A preparation method of a heat-conducting adhesive film comprises the following steps: adding 40 parts of thermoplastic polyurethane, 20 parts of silver nanoparticles and 5 parts of binder into a stirrer for stirring, fully stirring to obtain a mixed solution with certain fluidity, adding 1 part of curing agent, stirring for 1min, adding 5 parts of flame-retardant smoke suppressor, quickly stirring uniformly, casting to a template, curing at room temperature for 2h, casting a layer of diluted film matrix film on the surface of the film matrix film under the condition that the interior of the film matrix film is not completely cured, and curing at room temperature for 13h to obtain a heat-conducting type adhesive film; the thickness of the heat and electric conduction adhesive film is 1 μm.
Example 2
A preparation method of a heat-conducting adhesive film comprises the following steps: adding 50 parts of polydimethylsiloxane, 25 parts of silver nanowires and 6 parts of binder into a stirrer for stirring, fully stirring to obtain a mixed solution with certain fluidity, adding 5 parts of curing agent, stirring for 0.5min, adding 7 parts of flame-retardant smoke suppressor, quickly and uniformly stirring, casting to a template, curing at room temperature for 2.5h, casting a layer of diluted film-substrate film on the surface of the template under the condition that the interior of the template is not completely cured, and curing at room temperature for 15h to obtain a heat-conductive adhesive film; the thickness of the heat-conductive adhesive film is 3 μm.
Example 3
A preparation method of a heat-conducting adhesive film comprises the following steps: adding 60 parts of polyester, 30 parts of graphene and 8 parts of binder into a stirrer for stirring, fully stirring to obtain a mixed solution with certain fluidity, adding 3 parts of curing agent, stirring for 1min, adding 6 parts of flame-retardant smoke suppressor, quickly stirring uniformly, casting to a template, curing at room temperature for 2h, casting a layer of diluted film matrix film on the surface of the film matrix film under the condition that the interior of the film matrix film is not completely cured, and curing at room temperature for 17h to obtain a heat-conducting adhesive film; the thickness of the heat-conducting adhesive film is 4 μm.
Example 4
A preparation method of a heat-conducting adhesive film comprises the following steps: adding 70 parts of polyester, 35 parts of graphene and 10 parts of binder into a stirrer for stirring, fully stirring to obtain a mixed solution with certain fluidity, firstly adding 8 parts of curing agent, stirring for 1min, adding 10 parts of flame-retardant smoke suppressor, quickly and uniformly stirring, casting to a template, curing at room temperature for 3h, casting a layer of diluted film-substrate film on the surface of the template under the condition that the interior of the template is not completely cured, and curing at room temperature for 20h to obtain the heat-conducting adhesive film; the thickness of the heat-conducting adhesive film is 5 μm.
Comparative example 1
Comparative example 1 a conventional conductive adhesive film was used; the thickness of the conductive adhesive film was 0.3. Mu.m.
The examples 1 to 4 and comparative example 1 were subjected to the performance test, and the test results are shown in the following table.
1. And (3) conductivity testing: pre-sticking the conductive adhesive film on the front main grid of the solar cell by using a hot press (the pre-sticking temperature is 70 ℃, the pre-sticking pressure is 0.2MPa, and the pre-sticking time is 0.5 s), tearing off the upper release film, locally pressing the welding strip, the conductive adhesive film and the cell (the local pressing temperature is 70 ℃, the local pressing pressure is 0.2MPa, and the local pressing time is 10 s), and testing the resistance value of two adjacent main grids by using a micro-resistance meter.
2. Bond Strength measurement (N/1.5 mm) A cell sheet was prepared by hot pressing at 180 ℃ under 2MPa for 10 seconds, the end of the solder ribbon was bent at 180 degrees, and the resultant was fixed to a jig of a tensile machine, and the peel strength was measured by stretching at 180 degrees at a stretching speed of 30 mm/s. At this time, if the peel force is 0.8N/1.5mm or more, the test is passed.
The conductive material is added, and the conductive material does not sink but floats on the film in the curing process, and the diluted film matrix film is covered to prevent the conductive material from falling off, so that the conductive network is protected, and the conductive effect of the invention is improved; the heat-conducting adhesive film with the three-layer structure is prepared by adopting a room-temperature tape casting method, and has the advantages of excellent heat conduction and electric conduction performance, low cost, light weight, stable structure, high tensile strength and strong operability.
The embodiments of the present invention have been described in detail, but the description is only for the purpose of describing the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All the equivalent changes and modifications made according to the scope of the invention are within the scope of the patent coverage of the invention.
Claims (10)
1. A heat-conducting adhesive film is characterized by comprising the following components in parts by weight: 40-70 parts of a film matrix; 20-35 parts of a conductive material; 10-20 parts of flame-retardant smoke suppressor; 5-10 parts of a binder; 1-8 parts of a curing agent.
2. The thermally conductive adhesive film according to claim 1, wherein the film substrate is one of polyester, thermoplastic polyurethane, and polydimethylsiloxane.
3. The adhesive film according to claim 1, wherein the conductive material is one of a metal material and a carbon material.
4. The adhesive film according to claim 3, wherein the metal material is at least one of silver nanowires, silver nanoparticles, gold, and copper.
5. The adhesive film of claim 3, wherein the carbon material is graphene or carbon nanotubes.
6. The thermally conductive adhesive film according to claim 1, wherein the flame retardant and smoke suppressant is compounded from magnesium hydroxide and calcium carbonate.
7. The adhesive film according to claim 6, wherein the mass ratio of magnesium hydroxide to calcium carbonate is 1-2:1.
8. the thermally conductive adhesive film according to claim 1, wherein the adhesive is an acrylic adhesive; the curing agent is one of aromatic sulfonium salt, aromatic diazonium salt, iodonium salt, aromatic isocyanate and aliphatic isocyanate.
9. The preparation method of the heat-conducting adhesive film is characterized by comprising the following steps of: adding the film substrate, the conductive material and the binder into a stirrer according to the proportion, stirring, fully stirring to obtain a mixed solution with certain fluidity, firstly adding the curing agent, stirring for 0.5-1min, adding the flame-retardant smoke suppressor, quickly stirring uniformly, casting to a template, curing at room temperature for 2-3h, casting a layer of diluted film substrate film on the surface of the film substrate under the condition that the interior is not completely cured, and curing at room temperature for 13-20h to obtain the heat-conductive adhesive film.
10. The method for preparing the adhesive film according to claim 9, wherein the adhesive film has a thickness of 0.5 μm to 10 μm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210956595.2A CN115260924A (en) | 2022-08-10 | 2022-08-10 | Heat-conducting adhesive film and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210956595.2A CN115260924A (en) | 2022-08-10 | 2022-08-10 | Heat-conducting adhesive film and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101629057A (en) * | 2009-08-22 | 2010-01-20 | 漳立冰 | Nano conductive adhesive and preparation method thereof |
| CN106753025A (en) * | 2016-12-16 | 2017-05-31 | 吴中区穹窿山天仲高分子材料技术研究所 | A kind of graphene composite conductive glue |
| CN113851421A (en) * | 2020-06-28 | 2021-12-28 | 京东方科技集团股份有限公司 | Substrate, maintenance method thereof and display device |
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- 2022-08-10 CN CN202210956595.2A patent/CN115260924A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101629057A (en) * | 2009-08-22 | 2010-01-20 | 漳立冰 | Nano conductive adhesive and preparation method thereof |
| CN106753025A (en) * | 2016-12-16 | 2017-05-31 | 吴中区穹窿山天仲高分子材料技术研究所 | A kind of graphene composite conductive glue |
| CN113851421A (en) * | 2020-06-28 | 2021-12-28 | 京东方科技集团股份有限公司 | Substrate, maintenance method thereof and display device |
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