CN115254781B - Megasonic cleaning device for semiconductor wafer capable of avoiding surface damage - Google Patents
Megasonic cleaning device for semiconductor wafer capable of avoiding surface damage Download PDFInfo
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- CN115254781B CN115254781B CN202211205891.5A CN202211205891A CN115254781B CN 115254781 B CN115254781 B CN 115254781B CN 202211205891 A CN202211205891 A CN 202211205891A CN 115254781 B CN115254781 B CN 115254781B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 80
- 239000004065 semiconductor Substances 0.000 title claims abstract description 35
- 239000007788 liquid Substances 0.000 claims abstract description 135
- 235000012431 wafers Nutrition 0.000 claims abstract description 93
- 230000007246 mechanism Effects 0.000 claims abstract description 64
- 239000002699 waste material Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000000746 purification Methods 0.000 claims abstract description 12
- 230000003014 reinforcing effect Effects 0.000 claims description 39
- 238000011084 recovery Methods 0.000 claims description 18
- 238000004064 recycling Methods 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 3
- 101100167360 Drosophila melanogaster chb gene Proteins 0.000 claims 2
- 238000002955 isolation Methods 0.000 abstract description 2
- 230000009347 mechanical transmission Effects 0.000 abstract description 2
- 239000002585 base Substances 0.000 description 10
- 238000003860 storage Methods 0.000 description 9
- 230000002265 prevention Effects 0.000 description 7
- 230000009471 action Effects 0.000 description 6
- 238000005406 washing Methods 0.000 description 5
- 239000012535 impurity Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- 229910021654 trace metal Inorganic materials 0.000 description 1
- 229910021655 trace metal ion Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a megasonic cleaning device for semiconductor wafers, which avoids surface damage and comprises an assembly shell, wherein an energy generation mechanism and an azimuth adjustment mechanism are respectively arranged inside the assembly shell, a material conveying mechanism is arranged on one side of the outer wall of the assembly shell, a waste liquid purification mechanism is fixedly arranged at the bottom of the energy generation mechanism, a liquid conveying mechanism is arranged on the front surface of the assembly shell, the energy generation mechanism comprises an inner connecting plate, a round hole is preset inside the inner connecting plate, a cleaning tank is arranged on the inner surface wall of the round hole, the azimuth adjustment mechanism comprises a connecting frame, and the mechanism suspends a wafer to be cleaned and the inside of cleaning liquid in a mechanical transmission mode, so that the surface of the wafer is not directly contacted with the inside of the cleaning tank, the isolation of energy generated by an ultrasonic component and the wafer is realized, the shaking impact generated on the surface of the wafer and the inner wall of the cleaning tank is avoided, and the probability of the surface damage of the wafer is reduced.
Description
Technical Field
The invention relates to the technical field of wafer cleaning equipment, in particular to a megasonic cleaning device for a semiconductor wafer, which can avoid surface damage.
Background
With respect to semiconductor wafers, it is first understood that the materials of which the wafers are made, are composed primarily of silicon, which is a gray, brittle, tetravalent nonmetallic chemical element that is also the primary source of most semiconductor and microelectronic chips, and that silicon itself is not very conductive, however, its resistivity can be precisely controlled by the addition of suitable dopants, and that prior to the manufacture of semiconductors it must be converted to a wafer, starting with the growth of a silicon ingot, which is a solid with atoms formed periodically in a three-dimensional spatial pattern that extends throughout the material, with polycrystalline silicon being a large number of small single crystals of different crystallographic orientation formed alone and not usable as semiconductor circuits, and must be melted to a single crystal in order to be processed into wafers for semiconductor applications.
In the prior art, as in the chinese patent application No.: CN 208271837U discloses a cleaning apparatus for wafers; the structure of the ultrasonic probe comprises an ultrasonic groove and a lifting mechanism; the ultrasonic groove is of a cuboid structure, a heat conducting plate is arranged at the lower end of the ultrasonic groove, and the heat conducting plate and the side surface of the ultrasonic groove are arranged in a sealing manner; a heating device is arranged between the heat conducting plate and the inner side of the bottom surface of the ultrasonic groove; the lifting mechanism comprises a telescopic rod, a telescopic oil cylinder and a motor; the telescopic rod penetrates through the top surface of the ultrasonic groove and extends into the ultrasonic groove; the bottom end of the telescopic rod is fixedly connected with the commodity shelf, and the top end of the telescopic rod is connected with the output end of the motor; the motor is arranged on the supporting plate, and both sides of the bottom surface of the supporting plate are fixedly connected with the output end of the telescopic oil cylinder through fixing blocks; the telescopic oil cylinder is fixedly arranged on the connecting plate; the connecting plate and the top surface of the ultrasonic groove are arranged in a sliding mode; the equipment can simultaneously perform vertical reciprocating motion and rotation in the horizontal direction, so that the wafers are cleaned in all directions, the cleaning speed is increased, the cleaning quality is improved, and the equipment maintenance is facilitated.
However, the above patents have the following disadvantages:
after the semiconductor wafer is manufactured, fine dust, micro metal elements, organic impurities and the like are doped on the surface of the semiconductor wafer, and then the semiconductor wafer needs to be fully cleaned before being used, so that the phenomenon that the internal circuit of the wafer is damaged in the later period, the failure of an integrated circuit is caused, and the formation of geometric characteristics is influenced is avoided.
1) However, in the apparatus disclosed in the above patent, when the wafer is cleaned, the wafer is directly placed in the cleaning tank, and the energy emitted from the ultrasonic component in the apparatus is directly applied to the surface of the wafer, so that the wafer is shaken strongly on the inner wall of the cleaning tank, and the wafer is easily cracked on the surface of the wafer due to the low hardness and fragile characteristics of the wafer.
2) Because the internal structure of the equipment related to the patent is single, the waste liquid after cleaning can not be effectively treated.
We have therefore proposed a megasonic cleaning apparatus for semiconductor wafers that avoids surface damage in order to solve the problems set forth above.
Disclosure of Invention
The invention aims to provide a megasonic cleaning device for semiconductor wafers, which avoids surface damage, and comprises an energy generating mechanism and a direction adjusting mechanism which are connected with an assembly shell, wherein after cleaning liquid is poured into a cleaning tank, an ultrasonic assembly is started, ultrasonic energy generated by the ultrasonic assembly is converted by a transducer and is diffused to the inside of the cleaning liquid from the surface of a vibrating rod in the form of mechanical vibration waves, a plurality of vibrating rods are evenly distributed in the cleaning tank, the generated vibration waves can be fully converged at the middle part of the cleaning tank, and an electric telescopic rod A is further started to slowly drive a wafer in a bearing tank to move downwards, so that the wafer is suspended in the cleaning liquid.
In order to achieve the purpose, the invention provides the following technical scheme: a megasonic cleaning device for semiconductor wafers capable of avoiding surface damage comprises an assembly shell, wherein an energy generation mechanism and an azimuth adjustment mechanism are respectively arranged inside the assembly shell, a material conveying mechanism is arranged on one side of the outer wall of the assembly shell, a waste liquid purification mechanism is fixedly arranged at the bottom of the energy generation mechanism, and a liquid conveying mechanism is arranged on the front surface of the assembly shell;
the energy generation mechanism comprises an inner connecting plate, a round hole is preset in the inner connecting plate, a cleaning tank is arranged on the inner surface wall of the round hole, a reinforcing lantern ring is fixedly sleeved on the outer surface wall of the cleaning tank, the bottom of the reinforcing lantern ring is fixedly mounted at the top of the inner connecting plate through a group of screws, a group of rectangular grooves are formed in the inner connecting plate, ultrasonic assemblies are fixedly connected to the insides of the group of rectangular grooves, transducers are fixedly connected to the output ends of the group of ultrasonic assemblies, vibrating rods are fixedly connected to the output ends of the group of transducers, the group of vibrating rods are arranged in the cleaning tank, and a liquid inlet hole and a group of liquid outlet holes are formed in the bottom of the cleaning tank respectively;
position adjustment mechanism includes the link, the inside fixed inserting of link is equipped with a set of electric telescopic handle A, and is a set of fixed cover is equipped with the linkage board between electric telescopic handle A's the output, the inside fixed inserting of linkage board is equipped with servo motor, servo motor's output welding has U type frame A, U type frame A's bottom fixed mounting has the tray, fretwork groove, bearing groove and breach have been preset respectively to the inside of tray, the annular has been seted up at the inner wall top of assembly shell, the inner wall top fixedly connected with of annular is a set of infrared solid laser.
Preferably, the material conveying mechanism comprises a reinforcing plate A, the outer wall of the reinforcing plate A is fixedly mounted on one side of the outer wall of the assembling shell, a grafting plate A is welded to the outer wall of the reinforcing plate A, a track groove is formed in the top of the grafting plate A, and a turntable is movably arranged inside the track groove.
Preferably, the top fixed mounting of carousel has the bracing piece, the top fixed mounting of bracing piece has the diaphragm, the inside fixed mounting of diaphragm has a set of installation sleeve, and is a set of installation telescopic inner surface wall fixed mounting has electric telescopic handle B, and is a set of fixed cover is equipped with the bracket between electric telescopic handle B's the output.
Preferably, the bottom of the grafting plate a is fixedly provided with a steering motor, an output end of the steering motor penetrates through the bottom of the grafting plate a and is fixedly inserted into the turntable, and a feeding window is formed in one side of the outer wall of the assembling shell.
Preferably, the waste liquid purification mechanism includes two reinforcing plates B, two the welding has U type frame B between reinforcing plate B's the bottom, the equal fixed mounting in inner wall both sides of U type frame B has the board of locking, two fixed mounting has the recovery drum between the relative one side of board of locking.
Preferably, the top of recovery cylinder is fixed the intercommunication and is had a set of backflow pipeline, and is a set of backflow pipeline feed liquor end is linked together with the flowing back hole respectively, and is a set of backflow pipeline's inside all is provided with electric valve.
Preferably, an inner connecting ring is fixedly mounted on the inner surface wall of the recycling cylinder, a filter plate is arranged inside the inner connecting ring, a wiring board is fixedly mounted at the bottom of the inner wall of the recycling cylinder, a group of contact bases are fixedly connected to the top of the wiring board, and conductive rods are fixedly connected inside the contact bases.
Preferably, liquid conveying mechanism includes reinforcing plate C, reinforcing plate C's exterior wall fixed mounting is on the positive surface of assembling the shell, reinforcing plate C's exterior wall welding has grafting board B, grafting board B's inside fixed mounting has the connection lantern ring A, the interior table wall fixed insertion of connection lantern ring A is equipped with booster pump A, the positive fixed surface mounting of assembling the shell has the liquid reserve tank, the fixed intercommunication in bottom of liquid reserve tank has fortune liquid pipeline A, fortune liquid pipeline A's play liquid end and booster pump A's input are linked together, booster pump A's the fixed intercommunication in output has fortune liquid pipeline B, fortune liquid pipeline B's play liquid end runs through the exterior wall of assembling shell and recovery cylinder to be linked together with the feed liquor hole.
Preferably, the outer wall one side fixed mounting who assembles the shell has reinforcing plate D, reinforcing plate D's exterior wall welding has grafting board B, grafting board B's inside fixed mounting has a set of connecting sleeve ring B, and is a set of connecting sleeve ring B's interior table wall is all fixed to be inserted and is equipped with booster pump B, and is a set of booster pump B's input is all fixed the intercommunication and is had fortune liquid pipeline C, and is a set of fortune liquid pipeline C's feed liquor end all runs through the outer table wall of assembly shell and recovery drum to be linked together, a set of with the inside of recovery drum booster pump B's output all is fixed the intercommunication and has fortune liquid pipeline D, and is a set of fortune liquid pipeline D's play liquid end all runs through the exterior wall of liquid reserve tank to be linked together with the inside of liquid reserve tank.
Preferably, the outer surface wall of the inner connecting plate is fixedly installed on the inner surface wall of the assembling shell, the top of the connecting frame is fixedly installed on the top of the inner wall of the assembling shell, a door frame is arranged on the front surface of the assembling shell, a movable door is placed inside the door frame, the movable door is connected with the assembling shell through a group of hinges, a handle is fixedly installed on the front surface of the movable door, a group of inner connecting rods are fixedly inserted into the bottom of the assembling shell, and rubber bases are fixedly sleeved on the outer surface walls of the group of inner connecting rods.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention is provided with the energy generating mechanism and the direction adjusting mechanism, when the cleaning solution is filled into the cleaning tank, the ultrasonic assembly is started, the ultrasonic energy generated by the ultrasonic assembly is converted by the transducer and is diffused from the surface of the vibrating rod to the inside of the cleaning solution in the form of mechanical vibration wave, the vibrating rods are evenly distributed in the cleaning tank, the generated vibration wave can be fully converged at the middle part of the cleaning tank, the electric telescopic rod A is further started to slowly drive the wafer in the bearing tank to move downwards and is finally inserted into the cleaning solution, at the moment, the micro bubble nuclei in the cleaning solution vibrate, grow and continuously gather the sound field energy under the action of the mechanical vibration wave, when the energy reaches the maximum value, the cavitation bubbles collapse and close rapidly, and can release huge energy when collapsing, and under the action of the impact force, the particles attached to the surface of the wafer can be stripped into the cleaning solution, the cleaning liquid used by the equipment is alkaline liquid, the main components of the cleaning liquid are caustic alkali, phosphate, silicate, carbonate, chelating agent and surfactant, the liquid is not easy to corrode after contacting with the surface of the wafer, and the liquid has better emulsifying performance, so that the impurity can be effectively prevented from being remained again after the wafer is cleaned, the electric telescopic rod A is opened again to draw the wafer out of the interior of the cleaning liquid, the driving part in the direction adjusting mechanism is started, the wafer is rotated at high speed, the liquid remained on the surface of the wafer is dried rapidly, meanwhile, the infrared solid laser is started, a plurality of beams of infrared energy are emitted in the interior of the assembly shell, the light range is 2.2 mu m and 3.9 mu m, the generated high temperature accelerates the drying rate of the surface of the wafer, and the mechanism suspends the wafer to be cleaned in the interior of the cleaning liquid in a mechanical transmission manner, the wafer surface is not directly contacted with the inside of the cleaning tank, the isolation of the energy generated by the ultrasonic component and the wafer is realized, the shaking impact generated on the wafer surface and the inner wall of the cleaning tank is avoided, the defects in the patent are effectively overcome, and the probability of wafer surface damage is reduced.
2. According to the invention, through arranging the material conveying mechanism, when the wafer to be cleaned is placed in the assembly shell, the wafer is placed in the bracket firstly, the extension direction of the wafer is adjusted by utilizing the driving part in the mechanism, so that the wafer is aligned with the feeding window, the electric telescopic rod B is started to slowly drive the wafer to move to the interior of the assembly shell, and finally the wafer is placed in the bearing groove.
3. According to the invention, by arranging the waste liquid purification mechanism, after the wafer to be cleaned is cleaned, the waste liquid in the cleaning tank continuously enters the interior of the recovery cylinder through the conveying of the backflow pipeline, the waste liquid firstly vertically penetrates through the interior of the filter plate in the process, dust and impurities in the waste liquid are adsorbed, and the waste liquid is converged to the bottom of the recovery cylinder, and then the conducting rod is electrified, and the conducting rod can release equivalent charges in the waste liquid, so that charged trace metal ions contained in the waste liquid are adsorbed by utilizing an electrostatic adsorption principle, and the waste liquid can be sufficiently purified so as to reach the recyclable condition.
Drawings
FIG. 1 is a perspective view of a front view of a megasonic cleaning apparatus for semiconductor wafers with surface damage prevention according to the present invention;
FIG. 2 is a perspective view of a bottom side structure of the megasonic cleaning apparatus for semiconductor wafers with surface damage prevention according to the present invention;
FIG. 3 is an enlarged perspective view of the structure of the energy generating mechanism of the megasonic cleaning apparatus for semiconductor wafers with surface damage prevention according to the present invention;
FIG. 4 is an enlarged perspective view of an orientation adjustment mechanism of the megasonic cleaning apparatus for semiconductor wafers with surface damage prevention according to the present invention;
FIG. 5 is an enlarged perspective view of a material conveying mechanism of the megasonic cleaning apparatus for semiconductor wafers with surface damage prevention according to the present invention;
FIG. 6 is an enlarged perspective view of a waste liquid purification mechanism of the megasonic cleaning apparatus for semiconductor wafers with surface damage prevention according to the present invention;
FIG. 7 is an enlarged perspective view of a liquid delivery mechanism of a megasonic cleaning apparatus for semiconductor wafers with surface damage avoidance according to the present invention;
FIG. 8 is an enlarged perspective view of a portion of a megasonic cleaning apparatus for semiconductor wafers with less surface damage in accordance with the present invention;
fig. 9 is an enlarged perspective view of a megasonic cleaning apparatus for semiconductor wafers with surface damage prevention according to the present invention, taken from a position a of fig. 6.
In the figure:
1. assembling the shell;
2. an energy generating mechanism; 201. an inner connecting plate; 202. a cleaning tank; 203. a reinforcing collar; 204. a rectangular groove; 205. an ultrasonic assembly; 206. a transducer; 207. a vibrating rod; 208. a liquid inlet hole; 209. a liquid drainage hole;
3. an orientation adjustment mechanism; 301. a connecting frame; 302. an electric telescopic rod A; 303. a connector tile; 304. a servo motor; 305. a U-shaped frame A; 306. a tray; 307. hollowing out the grooves; 308. a bearing groove; 309. a notch; 310. a ring groove; 311. an infrared solid-state laser;
4. a material conveying mechanism; 401. a reinforcing plate A; 402. a grafting plate A; 403. a track groove; 404. a turntable; 405. a support bar; 406. a transverse plate; 407. installing a sleeve; 408. an electric telescopic rod B; 409. a bracket; 410. a steering motor; 411. a feeding window;
5. a waste liquid purification mechanism; 501. a reinforcing plate B; 502. a U-shaped frame B; 503. locking the plate; 504. a recovery cylinder; 505. a return line; 506. an electrically operated valve; 507. an inner connecting ring; 508. a filter plate; 509. a wiring board; 510. a contact base; 511. a conductive rod;
6. a liquid delivery mechanism; 601. a reinforcing plate C; 602. a grafting plate B; 603. a connecting lantern ring A; 604. a booster pump A; 605. a liquid storage tank; 606. a liquid conveying pipeline A; 607. a liquid conveying pipeline B; 608. a reinforcing plate D; 609. a grafting plate B; 610. a connecting lantern ring B; 611. a booster pump B; 612. a liquid conveying pipeline C; 613. a liquid conveying pipeline D;
7. a door frame;
8. a hinge;
9. a movable door;
10. a handle;
11. an inner connecting rod;
12. a rubber base.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-9, the present invention provides a technical solution: the utility model provides a avoid surface damage's megasonic belt cleaning device for semiconductor wafer, includes assembly shell 1, and the inside of assembly shell 1 is provided with energy generation mechanism 2 and position adjustment mechanism 3 respectively, and outer wall one side of assembly shell 1 is provided with material conveying mechanism 4, and the bottom fixed mounting of energy generation mechanism 2 has waste liquid purification mechanism 5, and the positive surface of assembly shell 1 is provided with liquid conveying mechanism 6.
According to fig. 3, energy generation mechanism 2 includes interior fishplate bar 201, the round hole has been preset to the inside of interior fishplate bar 201, and washing tank 202 has been placed to the interior table wall of round hole, the fixed cover of exterior wall of washing tank 202 is equipped with the enhancement lantern ring 203, the top of fishplate bar 201 including the bottom of strengthening the lantern ring 203 is through a set of screw fixed mounting, a set of rectangle recess 204 has been seted up to the inside of interior fishplate bar 201, the inside fixedly connected with supersound subassembly 205 of a set of rectangle recess 204, the equal fixedly connected with transducer 206 of the output of a set of supersound subassembly 205, the equal fixedly connected with vibrating arm 207 of the output of a set of transducer 206, the inside of washing tank 202 is all arranged in to a set of vibrating arm 207, feed liquor hole 208 and a set of flowing back hole 209 have been seted up respectively to the bottom of washing tank 202.
According to fig. 1, 2 and 4, the direction adjusting mechanism 3 comprises a connecting frame 301, a group of electric telescopic rods a302 is fixedly inserted into the connecting frame 301, connecting plates 303 are fixedly sleeved between output ends of the group of electric telescopic rods a302, a servo motor 304 is fixedly inserted into the connecting plates 303, a U-shaped frame a305 is welded at an output end of the servo motor 304, a tray 306 is fixedly installed at the bottom of the U-shaped frame a305, hollow grooves 307, bearing grooves 308 and notches 309 are respectively preset in the tray 306, a ring groove 310 is formed in the top of the inner wall of the assembling shell 1, and a group of infrared solid lasers 311 is fixedly connected to the top of the inner wall of the ring groove 310.
According to fig. 1 and 5, the material conveying mechanism 4 comprises a reinforcing plate a401, the outer wall of the reinforcing plate a401 is fixedly installed on one side of the outer wall of the assembly housing 1, a grafting plate a402 is welded on the outer wall of the reinforcing plate a401, a track groove 403 is formed in the top of the grafting plate a402, a turntable 404 is movably arranged in the track groove 403, and conditions can be provided for rotation of the bracket 409 by utilizing the movable connectivity of the track groove 403 and the turntable 404.
According to the illustration in fig. 5, a support rod 405 is fixedly installed on the top of the turntable 404, a horizontal plate 406 is fixedly installed on the top of the support rod 405, a set of installation sleeves 407 is fixedly installed inside the horizontal plate 406, electric telescopic rods B408 are fixedly installed on the inner surface walls of the set of installation sleeves 407, a bracket 409 is fixedly sleeved between the output ends of the set of electric telescopic rods B408, and by arranging the electric telescopic rods B408, a wafer placed in the bracket 409 can be stably moved into the assembly housing 1.
According to the drawings of fig. 1 and 5, a steering motor 410 is fixedly installed at the bottom of the grafting board a402, the output end of the steering motor 410 penetrates through the bottom of the grafting board a402 and is fixedly inserted into the turntable 404, a feeding window 411 is formed in one side of the outer wall of the assembly housing 1, and the steering motor 410 is arranged to provide power support for the orientation change of the bracket 409.
According to fig. 3 and fig. 6, the waste liquid purification mechanism 5 comprises two reinforcing plates B501, a U-shaped frame B502 is welded between the bottoms of the two reinforcing plates B501, locking plates 503 are fixedly mounted on two sides of the inner wall of the U-shaped frame B502, a recovery cylinder 504 is fixedly mounted between the opposite sides of the two locking plates 503, and by arranging the recovery cylinder 504, after the wafer is cleaned, the wafer is conveyed through a plurality of pipelines to continuously flow into the recovery cylinder 504, so that conditions can be provided for purification of waste liquid.
According to fig. 6 and 9, a set of return pipes 505 are fixedly communicated with the top of the recycling bin 504, liquid inlet ends of the set of return pipes 505 are respectively communicated with the liquid discharge holes 209, electric valves 506 are respectively arranged inside the set of return pipes 505, and the electric valves 506 can control the closing and opening of the return pipes 505 and provide conditions for discharging waste liquid in the cleaning tank 202.
As shown in fig. 6, an inner ring 507 is fixedly installed on the inner surface wall of the recycling cylinder 504, a filter plate 508 is installed inside the inner ring 507, a wiring board 509 is fixedly installed at the bottom of the inner wall of the recycling cylinder 504, a group of contact bases 510 is fixedly connected to the top of the wiring board 509, a plurality of conductive rods 511 are fixedly connected to the inside of the group of contact bases 510, the conductive rods 511 are divided into two groups, the plurality of conductive rods 511 are positive electrode conductive rods, the plurality of conductive rods are negative electrode conductive rods, after the conductive rods 511 are energized, the conductive rods are divided into the plurality of positive electrode conductive rods and the plurality of negative electrode conductive rods, and the plurality of positive electrode conductive rods and the plurality of negative electrode conductive rods are opposite electrodes, so that an electric field is formed, when waste liquid enters a space formed by positive and negative electrodes, the waste liquid is acted by the electric field when flowing between the positive and negative electrodes, charged ions in water migrate to the conductive rods 511 with opposite charges, and are adsorbed on the conductive rods 511.
As shown in fig. 1, 2, 6 and 7, the liquid delivery mechanism 6 includes a reinforcing plate C601, an outer surface wall of the reinforcing plate C601 is fixedly installed on a front surface of the mounting case 1, a grafting plate B602 is welded on the outer surface wall of the reinforcing plate C601, a connection collar a603 is fixedly installed inside the grafting plate B602, a booster pump a604 is fixedly inserted into an inner surface wall of the connection collar a603, a liquid storage tank 605 is fixedly installed on the front surface of the mounting case 1, a liquid conveying pipe a606 is fixedly communicated with a bottom of the liquid storage tank 605, a liquid outlet end of the liquid conveying pipe a606 is communicated with an input end of the booster pump a604, an output end of the booster pump a604 is fixedly communicated with a liquid conveying pipe B607, and a liquid conveying pipe B607 penetrates through the outer surface walls of the mounting case 1 and the recycling cylinder 504 and is communicated with the liquid inlet hole 208, and by providing the liquid conveying pipe a606 and the liquid conveying pipe B607, under the action of the booster pump a604, the cleaning liquid in the liquid storage tank 605 can be continuously delivered into the interior of the cleaning tank 202, thereby providing conditions for cleaning the wafer.
According to the fig. 1, 2, 6 and 7, a reinforcing plate D608 is fixedly installed on one side of the outer wall of the assembling shell 1, a grafting plate B609 is welded on the outer wall of the reinforcing plate D608, a group of connecting collars B610 is fixedly installed inside the grafting plate B609, a boosting pump B611 is fixedly inserted into the inner wall of the group of connecting collars B610, liquid conveying pipelines C612 are fixedly communicated with the input ends of the group of boosting pumps B611, the liquid inlet ends of the group of liquid conveying pipelines C612 penetrate through the outer wall of the assembling shell 1 and the outer wall of the recycling cylinder 504 and are communicated with the inside of the recycling cylinder 504, liquid conveying pipelines D613 are fixedly communicated with the output ends of the group of boosting pumps B611, the liquid outlet ends of the group of liquid conveying pipelines D613 penetrate through the outer wall of the liquid storage tank 605 and are communicated with the inside of the liquid storage tank 605, and the liquid purified in the recycling cylinder 504 can be continuously conveyed into the inside of the liquid storage tank 605 under the action of the boosting pump B611 through the liquid conveying pipelines C612 and D613, thereby providing conditions for reuse of the cleaning liquid.
As shown in fig. 1, fig. 2, fig. 3 and fig. 4, an outer surface wall of an inner connecting plate 201 is fixedly installed on an inner surface wall of an assembly housing 1, a top of a connecting frame 301 is fixedly installed on a top of an inner wall of the assembly housing 1, a door frame 7 is arranged on a front surface of the assembly housing 1, a movable door 9 is placed inside the door frame 7, the movable door 9 is connected with the assembly housing 1 through a set of hinges 8, a handle 10 is fixedly installed on the front surface of the movable door 9, a set of inner connecting rods 11 are fixedly inserted into a bottom of the assembly housing 1, and rubber bases 12 are fixedly sleeved on the outer surface walls of the set of inner connecting rods 11 to determine a connection relationship between the inner connecting plate 201 and the connecting frame 301 and the whole device, and by using characteristics of the hinges 8, when a wafer to be cleaned is processed, the handle 10 is forcefully pulled to rapidly change an angle of the movable door 9, and the wafer in a bearing groove 308 is taken out of the interior of the assembly housing 1.
The effect that its whole mechanism reached does: firstly, the device is moved to a designated working area, the bottom of the rubber base 12 is fully contacted with the ground, then a wafer to be cleaned is placed in the bracket 409, the steering motor 410 is started, the wafer in the bracket 409 is quickly driven to change the angle by utilizing the movable connection of the track groove 403 and the turntable 404, finally the wafer is aligned with the feeding window 411, the electric telescopic rod B408 in the mounting sleeve 407 is further started, and the wafer is slowly driven to enter the interior of the assembly shell 1.
After the wafer hangs in the top of tray 306, start electric telescopic handle A302, drive tray 306 and continue upwards move, when some wafers set up the inside of bearing groove 308 in the embedding, start electric telescopic handle B408 again, pull out the inside of bearing groove 308 from breach 309 with bracket 409 gradually, make the wafer fully place in the inside of bearing groove 308 finally.
Further starting the internal impeller of the booster pump a604 in the connecting collar a603 to rotate, the generated adsorption effect continuously extracts the cleaning liquid in the liquid storage tank 605, and the cleaning liquid is continuously poured into the cleaning tank 202 through the conveying pipeline a606 and the conveying pipeline B607.
When the liquid in the cleaning tank 202 reaches a designated liquid level, the ultrasonic assembly 205 in the rectangular groove 204 is turned on to generate megasonic energy within the range of 800-2000Hz, and after the conversion of the transducer 206, the formed mechanical vibration waves are released from the surface of the vibration rod 207 into the interior of the cleaning liquid to accelerate the rupture of bubbles in the liquid, and at the same time, the electric telescopic rod A302 in the connecting frame 301 is turned on to slowly drive the wafer in the bearing tank 308 to be vertically inserted into the interior of the cleaning liquid, so that the wafer is finally suspended in the interior of the liquid, and after the wafer is contacted with the liquid, dust and other substances on the surface of the wafer are continuously peeled off into the interior of the cleaning liquid under the action of megasonic energy.
After the wafer is cleaned, the electric telescopic rod a302 is started to quickly draw the wafer out of the liquid, meanwhile, the servo motor 304 in the connecting plate 303 is started and acts on the tray 306, so that the wafer in the bearing groove 308 rotates at a high speed to continuously swing the liquid away from the surface of the wafer, the infrared solid laser 311 in the ring groove 310 is further started, and if the infrared solid laser 311 is of the type CME-L1047 (manufactured by foshan pacos laser technology ltd), the generated infrared light waves are continuously emitted into the assembly shell 1 to increase the internal temperature of the assembly shell 1, and the purpose of drying the wafer is achieved.
Further open electric valve 506, open the inside passage of backflow pipeline 505, the waste liquid in washing tank 202 can last the inside that gets into recovery cylinder 504 through the transport of backflow pipeline 505 this moment, the waste liquid is under the action of gravity this moment, and drop to the bottom of assembly shell 1, the inside of filter 508 is passed perpendicularly earlier to this in-process waste liquid, at first adsorb the solid impurity of doping in the waste liquid, collect servo motor 304's bottom again, switch on a plurality of contact bases 510 this moment, make conducting rod 511's surface last release equivalent electric charge in to the waste liquid, and adsorb the surface of conducting rod 511 with the trace metal element in the waste liquid fast.
When the waste liquid purification is completed, the booster pump B611 in the connection collar B610 is activated to quickly draw the purified liquid in the recovery cylinder 504, and the liquid is conveyed through the liquid conveying pipe C612 and the liquid conveying pipe D613 to be continuously returned into the interior of the liquid storage tank 605.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for some of the features thereof, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A megasonic cleaning apparatus for semiconductor wafers that avoids surface damage, comprising: the device comprises an assembly shell (1), wherein an energy generation mechanism (2) and an azimuth adjustment mechanism (3) are respectively arranged inside the assembly shell (1), a material conveying mechanism (4) is arranged on one side of the outer wall of the assembly shell (1), a waste liquid purification mechanism (5) is fixedly installed at the bottom of the energy generation mechanism (2), and a liquid conveying mechanism (6) is arranged on the front surface of the assembly shell (1);
the energy generation mechanism (2) comprises an inner connecting plate (201), a round hole is preset in the inner portion of the inner connecting plate (201), a cleaning groove (202) is placed on the inner surface wall of the round hole, a reinforcing lantern ring (203) is fixedly sleeved on the outer surface wall of the cleaning groove (202), the bottom of the reinforcing lantern ring (203) is fixedly installed at the top of the inner connecting plate (201) through a group of screws, a group of rectangular grooves (204) are formed in the inner portion of the inner connecting plate (201), a group of ultrasonic assemblies (205) are fixedly connected with the inner portion of the rectangular grooves (204), a group of energy transducers (206) are fixedly connected with the output ends of the ultrasonic assemblies (205), a group of vibration rods (207) are fixedly connected with the output ends of the energy transducers (206), a group of vibration rods (207) are arranged in the cleaning groove (202), and a liquid inlet hole (208) and a group of liquid discharge holes (209) are respectively formed in the bottom of the cleaning groove (202);
position adjustment mechanism (3) are including link (301), the inside fixed inserting of link (301) is equipped with a set of electric telescopic handle A (302), and is a set of fixed cover is equipped with linking board (303) between the output of electric telescopic handle A (302), the inside fixed inserting of linking board (303) is equipped with servo motor (304), the output welding of servo motor (304) has U type frame A (305), the bottom fixed mounting of U type frame A (305) has tray (306), hollow groove (307), bearing groove (308) and breach (309) have been preset respectively to the inside of tray (306), annular (310) have been seted up at the inner wall top of assembly shell (1), the inner wall top fixedly connected with a set of infrared solid laser (311) of annular (310).
2. A megasonic cleaning apparatus for semiconductor wafers with surface damage avoidance as set forth in claim 1 wherein: material conveying mechanism (4) include reinforcing plate A (401), the exterior wall fixed mounting of reinforcing plate A (401) is in outer wall one side of assembling shell (1), the exterior wall welding of reinforcing plate A (401) has grafting board A (402), orbit groove (403) have been seted up at the top of grafting board A (402), the inside activity of orbit groove (403) is provided with carousel (404).
3. A megasonic cleaning apparatus for semiconductor wafers with surface damage avoidance as set forth in claim 2 wherein: the top fixed mounting of carousel (404) has bracing piece (405), the top fixed mounting of bracing piece (405) has diaphragm (406), the inside fixed mounting of diaphragm (406) has a set of installation sleeve (407), and is a set of the interior table wall fixed mounting of installation sleeve (407) has electric telescopic handle B (408), and is a set of fixed cover is equipped with bracket (409) between the output of electric telescopic handle B (408).
4. A megasonic cleaning apparatus for semiconductor wafers with surface damage avoidance as set forth in claim 2 wherein: the bottom fixed mounting of grafting board A (402) has to turn to motor (410), the output that turns to motor (410) runs through the bottom of grafting board A (402) to fixedly insert and establish the inside at carousel (404), feeding window (411) have been seted up to outer wall one side of assembly shell (1).
5. The megasonic cleaning apparatus for semiconductor wafers with avoidance of surface damage of claim 1, wherein: waste liquid purification mechanism (5) include two reinforcing plates B (501), two the welding has U type frame B (502) between the bottom of reinforcing plate B (501), the equal fixed mounting in inner wall both sides of U type frame B (502) has a board of locking (503), two fixed mounting has recovery drum (504) between the relative one side of board of locking (503).
6. The megasonic cleaning apparatus for semiconductor wafers with avoidance of surface damage of claim 5, wherein: the top of recovery drum (504) is fixed the intercommunication has a set of return line (505), and is a set of the feed liquor end of return line (505) is linked together with flowing back hole (209) respectively, and is a set of the inside of return line (505) all is provided with electrically operated valve (506).
7. The megasonic cleaning apparatus for semiconductor wafers with surface damage avoided as set forth in claim 5, wherein: the inner surface wall of the recycling cylinder (504) is fixedly provided with an inner connecting ring (507), the inner part of the inner connecting ring (507) is provided with a filter plate (508), the bottom of the inner wall of the recycling cylinder (504) is fixedly provided with a wiring board (509), the top of the wiring board (509) is fixedly connected with a group of contact bases (510), and the contact bases (510) are all fixedly connected with conductive rods (511).
8. The megasonic cleaning apparatus for semiconductor wafers with avoidance of surface damage of claim 1, wherein: liquid conveying mechanism (6) include reinforcing plate C (601), the exterior wall fixed mounting of reinforcing plate C (601) is on the positive surface of assembly shell (1), the exterior wall welding of reinforcing plate C (601) has grafting board B (602), the inside fixed mounting of grafting board B (602) has connecting lantern ring A (603), the interior surface wall of connecting lantern ring A (603) is fixed to be inserted and is equipped with booster pump A (604), the positive fixed surface mounting of assembly shell (1) has liquid reserve tank (605), the fixed intercommunication in bottom of liquid reserve tank (605) has fortune liquid pipeline A (606), the play liquid end of fortune liquid pipeline A (606) and the input of booster pump A (604) are linked together, the output fixed intercommunication of booster pump A (604) has fortune liquid pipeline B (607), the play liquid end of fortune liquid pipeline B (607) runs through the exterior wall of assembly shell (1) and recovery cylinder (504) to be linked together with feed liquor hole (208).
9. The megasonic cleaning apparatus for semiconductor wafers with avoidance of surface damage of claim 8, wherein: the outer wall one side fixed mounting of assembly shell (1) has reinforcing plate D (608), the exterior wall welding of reinforcing plate D (608) has grafting board B (609), the inside fixed mounting of grafting board B (609) has a set of connection lantern ring B (610), and is a set of the interior table wall of connection lantern ring B (610) all fixedly inserts and is equipped with booster pump B (611), and is a set of the input of booster pump B (611) all fixedly communicates has fortune liquid pipeline C (612), and is a set of the feed liquor end of fortune liquid pipeline C (612) all runs through the exterior wall of assembly shell (1) and recovery drum (504), and is linked together with the inside of recovery drum (504), and is a set of the output of booster pump B (611) all fixedly communicates has fortune liquid pipeline D (613), and is a set of the play liquid end of fortune liquid pipeline D (613) all runs through the exterior wall of liquid reserve tank (605), and is linked together with the inside of liquid reserve tank (605).
10. The megasonic cleaning apparatus for semiconductor wafers with avoidance of surface damage of claim 1, wherein: the utility model discloses a building structure, including inner fishplate bar (201), link plate (1), door frame (7), movable door (9) have been placed to the inside of door frame (7), movable door (9) and assembly shell (1) are connected through a set of hinge (8), the positive fixed surface of movable door (9) installs handle (10), the bottom of assembly shell (1) is fixed to be inserted and is equipped with a set of extension bar (11), and is a set of the outer wall of extension bar (11) all is fixed the cover and is equipped with rubber base (12).
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| CN115646938B (en) * | 2022-11-19 | 2023-06-13 | 苏州智程半导体科技股份有限公司 | Method for cleaning silicon wafer by utilizing nano bubbles with film coating to strengthen megasonic |
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