CN115254648A

CN115254648A - Sorting method and device for chip detection

Info

Publication number: CN115254648A
Application number: CN202210964584.9A
Authority: CN
Inventors: 李瑞青; 王林梓; 路膨; 马铁中
Original assignee: Ongkun Vision Beijing Technology Co ltd
Current assignee: Ongkun Vision Beijing Technology Co ltd
Priority date: 2022-08-11
Filing date: 2022-08-11
Publication date: 2022-11-01

Abstract

The invention discloses a sorting method and a device for chip detection, the sorting method quickly conveys a control tray to the position for carrying detected chips and the position for carrying and marking NG chips, the chips are directly conveyed to an empty tray after being detected in the process of detecting the chips one by one, the conveying times are reduced, the efficiency is improved, the sorting operation of OK and NG pieces is quickly carried out by taking data detected by the chip detection positions as reference, the sorting can be efficiently and quickly carried out no matter the yield of the chips is, the whole OK or NG piece is output, the sorting efficiency and the sorting accuracy are improved by matching with the tray, the sorting efficiency and the sorting accuracy can be adapted to the detection beat of the chips, and the overall efficiency of the chip detection is improved.

Description

Sorting method and device for chip detection

Technical Field

The present disclosure relates to chip detection technologies, and in particular, to a sorting method and apparatus for chip detection.

Background

In chip production, usually, the chip in the material tray needs to be manually detected, and whether the product is damaged or not needs to be visually judged, so that the detection efficiency is limited to be low, and the detection speed of the product is influenced. The existing detection mode is to detect the chips one by one through a probe, record unqualified chips, consume time for a long time, have low efficiency, improve the pollution probability of the wafer through manual work and contact of various mechanical equipment during wafer packaging, and is not ideal.

In the process of chip detection, the opportunity and probability of detecting NG (unqualified) or OK (qualified) pieces are unknown, empty trays and trays containing chips to be detected are manually placed one by one to different positions before detection, meanwhile, in order to match the beat of detection processing, after NG or OK pieces are detected, chip positions marked by a manual reference detection mechanism are often operated one by one until NG and OK pieces are placed in different trays, the process is low in efficiency, the labor intensity of operators is high, the frequency of misoperation of the operators is greatly increased under long-time repeated operation, a plurality of stations which are manually participated in operation are required to be arranged around a detection area, and efficient detection processing of the chips is not facilitated.

Disclosure of Invention

Aiming at the defects in the prior art, the application provides a sorting method and a sorting device for chip detection, so as to solve the problems of low efficiency and more misoperation in material tray laying and chip sorting under manual operation in the prior art.

The above purpose of the invention is mainly realized by the following technical scheme:

a sorting method for chip detection, comprising:

moving at least two empty trays on the first track until the empty trays are positioned below a moving path of a second transfer mechanism on the first transverse frame body;

the second transfer mechanism grabs an empty tray to the second track until the empty tray moves to a position below the moving path of the first transfer mechanism and is used for receiving the NG pieces;

the second transfer mechanism grabs another empty tray to the fourth rail so as to move to a station for receiving the detected chip;

taking a material tray with chips on a third rail for conveying to a chip detection station for detection, placing the detected chips in an empty material tray on a fourth rail, and conveying the material tray with the detected chips on the fourth rail to the position below a moving path of a second transfer mechanism;

the second transfer mechanism grabs the material tray loaded with the detected chip to the fifth track and drives the material tray to move to the position below the moving path of the first transfer mechanism on the fifth track;

the first transfer mechanism grabs the NG pieces in the material tray on the fifth rail, moves and places the NG pieces on the empty material tray on the second rail;

a second material tray provided with chips enters a chip detection station from a third rail for detection, the detected chips are placed in an empty material tray on a fourth rail, and the material tray provided with the detected chips is conveyed to the position below the moving path of the first transfer mechanism on the fourth rail;

and the first transfer mechanism grabs the NG pieces in the material tray on the fourth track, moves and places the NG pieces on the empty material tray on the second track, then grabs the OK pieces in the material tray on the fifth track, and moves the OK pieces to the positions of the chips emptied by the NG pieces removed in the material tray on the fourth track until the material tray on the fourth track is full of the OK pieces.

Further, when all OK parts in the material tray on the fifth track are supplemented to the vacant positions of the NG parts in the subsequent material trays after the NG parts are removed, the material tray on the fifth track moves to the first track again and is used as a new vacant material tray.

Based on the same inventive concept, the present application further provides a sorting apparatus for chip detection, configured to perform the above sorting method for chip detection, including:

a first rail, a second rail, a third rail, a fourth rail and a fifth rail which are arranged in parallel with each other;

a first transverse frame body erected on the first rail, the second rail, the third rail, the fourth rail and the fifth rail;

install first transportation track and the second of first horizontal support body both sides are transported the track, be equipped with first transportation mechanism on the first transportation track, first transportation mechanism includes displacement subassembly and chip and snatchs the subassembly, the second is transported and is equipped with second transportation mechanism on the track, second transportation mechanism includes displacement subassembly and charging tray and snatchs the subassembly, two the displacement subassembly is established respectively first transportation track with the second transports on the track and removes, the chip snatchs the subassembly and is used for snatching the chip and follows the displacement subassembly removes, the charging tray snatchs the subassembly and is used for snatching the charging tray and follows the displacement subassembly removes.

Further, the length extending direction of the first transverse frame body is perpendicular to the length extending direction of the first track.

Further, two ends of the first rail, the second rail, the third rail, the fourth rail and the fifth rail respectively extend to two sides of the first transverse frame body.

Further, the displacement subassembly includes driving motor, be provided with the gear on driving motor's the output shaft, first transfer orbit with be equipped with on the second transfer orbit be used for with gear engagement's dogtooth.

Further, the chip grabbing assembly comprises a sucker, the two ends of the sucker are communicated with each other, one end of the sucker is connected with a piston used for vacuumizing, and the other end of the sucker is used for sucking the chip.

Furthermore, one end, far away from the piston, of the sucker is provided with a buffer piece.

Furthermore, the charging tray grabbing assembly comprises two clamping plates which are used for extending to two sides of the charging tray, a push-pull component is arranged between the two clamping plates, and the push-pull component is used for driving the two clamping plates to be close to or far away from each other.

Further, the first track, the second track, the third track, the fourth track and the fifth track are respectively provided with a tray placing mechanism on the side away from the chip detection position, and the tray placing mechanism comprises: the supporting device comprises a jacking rod and a supporting component, wherein one end of the jacking rod extends to below the material tray, the other end of the jacking rod is provided with a push-pull component used for driving the jacking rod to lift, the supporting component is arranged on two sides of the material tray, a supporting groove is arranged at the bottom of the material tray, and the supporting component can stretch into the supporting groove and support the telescopic end of the material tray.

Compared with the prior art, the invention has the advantages that:

the invention can quickly convey the control tray to the position for bearing the detected chip and the position for bearing and marking the NG chip before chip detection, directly convey the detected chip to the empty tray after chip detection is completed in the process of chip one by one detection, reduce conveying times and improve efficiency, separate the NG and OK chips to different trays after chip detection, supplement the subsequently detected OK chips to the tray after NG removal along with continuous processing detection until the tray full of OK chips is obtained, transfer all OK chips transferred by the tray to the subsequent operation position for operation, transfer the NG full of the tray of the NG chips to the subsequent operation position for operation, use the data detected by the chip detection position as reference, quickly perform sorting operation of the NG and OK chips, and avoid quick sorting operation of the NG and NG chips, improve the efficiency of chip detection and improve the accuracy of chip detection.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a chip detection system according to an embodiment of the present disclosure;

FIG. 2 is a top view of a chip inspection system provided in an embodiment of the present application;

FIG. 3 is a schematic view of the area 1-1 in FIG. 2 according to an embodiment of the present application;

FIG. 4 is a schematic view of area 2-2 of FIG. 2 according to an embodiment of the present application;

FIG. 5 is a schematic view of the area 3-3 in FIG. 2 according to an embodiment of the present application;

FIG. 6 is a schematic structural diagram of a first platform region according to an embodiment of the present disclosure;

FIG. 7 is an enlarged, fragmentary view at A of FIG. 6 according to an exemplary embodiment of the present disclosure;

FIG. 8 is an enlarged, fragmentary view at F in FIG. 6 according to an exemplary embodiment of the present application;

FIG. 9 is an enlarged partial view of FIG. 6 at G according to an embodiment of the present application;

fig. 10 is an elevation view of a first transverse frame provided in accordance with an embodiment of the present application;

FIG. 11 is an enlarged view of a portion of FIG. 10 at B according to an embodiment of the present application;

FIG. 12 is an enlarged, fragmentary view at C of FIG. 10 according to an exemplary embodiment of the present disclosure;

fig. 13 is a rear view of a first transverse frame provided in accordance with an embodiment of the present application;

fig. 14 is a schematic diagram of a second directional structure at the first platform area according to an embodiment of the present application;

fig. 15 is a schematic structural view of a second transverse frame according to an embodiment of the present disclosure;

FIG. 16 is an enlarged, fragmentary view at D of FIG. 15 according to an embodiment of the present application;

FIG. 17 is an enlarged, fragmentary view at E in FIG. 15 according to an exemplary embodiment of the present application;

FIG. 18 is a schematic structural diagram of a part of a component at a detection turntable according to an embodiment of the present disclosure;

FIG. 19 is a drawing provided by an embodiment of the present application a part of parts of the blanking mechanism are schematically shown in the structural diagram;

FIG. 20 is an enlarged, fragmentary view at F of FIG. 19 according to an embodiment of the present application;

FIG. 21 is a schematic diagram illustrating a partial component structure of a fifth inspection assembly according to an embodiment of the present disclosure;

FIG. 22 is a cross-sectional view of a portion of a component of a calibration motor according to an embodiment of the present application;

FIG. 23 is a cross-sectional view of a chip provided in an embodiment of the present application;

FIG. 24 is a cross-sectional view of a cleaning device provided in accordance with an embodiment of the present application;

in the figure:

101-a first track; 102-a second track; 103-a third track; 104-a fourth track; 105-a fifth track; 106-sixth track; 107-seventh track; 108-eighth track; 110-a first transverse frame; 111-a first transfer track; 112-a first transfer mechanism; 113-a second transfer track; 114-a second transport mechanism; 115-a first detection component; 116-a second detection component; 120-a second transverse frame; 121-a third transfer track; 122-a third transport mechanism; 123-a first back inspection mechanism; 124-a fourth transfer track; 125-a fourth transfer mechanism; 130-a displacement assembly; 131-a chip grasping assembly; 132-a suction cup; 133-a piston; 134-a buffer; 135-a tray gripping assembly; 136-a clamping plate; 137-push-pull components; 138-longitudinal lifting means; 140-a tray placing mechanism; 141-a limiting plate; 142-a lifting rod; 143-a support member; 144-a telescoping end; 145-a jaw; 146-a first splint; 147-a second splint; 148-a drive gear; 149-a clamping motor; 151-a first motor; 152-a first screw; 153-a slide block; 154-a second electric machine; 155-a second screw; 160-a cleaning device; 161-cleaning liquid bin; 162-a liquid outlet mechanism; 163-cleaning cloth; 164-an addition port; 165-a reflow tray; 170-a tray; 171-a support groove; 172-primary region; 180-chip; 181-a first detection face; 182-a second detection surface; 183-third detection face; 184-a fourth detection surface; 185-fifth detection plane; 190-a first land area; 191-a second land area; 192-a third land area; 200-detecting the turntable; 201-detection disc; 210-a blanking mechanism; 211-a swivel arm; 221-a third detection component; 222-a fourth detection component; 223-a fifth detection component; 230-a correction motor; 240-a second back inspection mechanism; 251-a sorbent tube; 252-a vacuum generator; 260-an adjustment assembly; 261-a first adjustment part; 262-a second adjustment part; 263-grating scale assembly; 264-sweeping the wharf; 265-grating scale body.

Detailed Description

The invention is further described with reference to the following figures and specific embodiments. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. Specific structural and functional details disclosed herein are merely illustrative of example embodiments of the invention. This invention may, however, be embodied in many alternate forms and should not be construed as limited to the embodiments set forth herein.

At present, chips are a general term for semiconductor device products, also called integrated circuits, or microcircuits, microchips, chips/chips, are a way to miniaturize circuits (mainly including semiconductor devices, also including passive components, etc.) in electronics, and are often fabricated on the surface of semiconductor wafers. Only in the latter half century of its development, integrated circuits have become ubiquitous, and computers, mobile phones, and other digital appliances have become an indispensable part of social structures. This is because modern computing, communication, manufacturing, and transportation systems, including the internet, all rely on the presence of integrated circuits. Even the digital revolution brought by integrated circuits is considered by many scholars to be the most important event in human history. The maturity of the IC will bring technological progress, and both of them are closely related in terms of technology of design or breakthrough of semiconductor process, so the requirements for processing and manufacturing of chips are increasing day by day, but the process steps of chips are very numerous, one of them is the microscopic examination to eliminate some defective products in the chips, but the microscopic examination staff usually examines through a high power microscope, and long-time work not only makes the microscopic examination staff tired by naked eyes, and the working strength and damage are also large, and it is easy to make mistakes at the same time. In the existing chip detection device, although an adjusting system is added, the manpower is reduced, but when a chip image is collected, an inspector is often required to carry out manual focusing, the focusing efficiency is low, and the detection time is long.

As shown in fig. 1 to 24, a chip detection system comprises a sorting system, a preprocessing system and a detection system, wherein the sorting system is used for placing a tray 170 containing chips 180 into the detection system and performing sorting operation in coordination with the production cycle, and comprises the arrangement of the tray 170 with empty detection, the arrangement of the tray 170 with chips 180, and the sorting operation of NG piece removal and the like performed on the tray 170 with chips 180 after detection; the pretreatment system is used for pre-positioning and primarily detecting the chip 180 on the tray 170 to be detected and provided with the chip 180; the detection system is used for accurately detecting the chip 180 subjected to pre-positioning and preliminary detection and accurately detecting to distinguish the NG piece and the OK piece, the detected chip 180 is conveniently sorted again through the sorting system until the chip 180 on the charging tray 170 is the OK piece, and then the subsequent operation is carried out.

In order to maintain the operational consistency of the chips 180 during the inspection operation, a platform for the processing operation may be provided on which the sorting system, the pre-treatment system, and the inspection system are respectively disposed, the platform including a first platform region 190, a second platform region 191, and a third platform region 192.

Specifically, the sorting system includes a first transverse frame 110 disposed on the first platform area 190, and a first rail 101, a second rail 102, a third rail 103, a fourth rail 104, and a fifth rail 105 disposed in parallel, wherein the first transverse frame 110 is disposed on the first rail 101, the second rail 102, the third rail 103, the fourth rail 104, and the fifth rail 105, and a length extending direction of the first transverse frame 110 is perpendicular to a length extending direction of the first rail 101.

The two sides of the first transverse frame body 110 are provided with a first transfer track 111 and a second transfer track 113, that is, the first transfer track 111 and the second transfer track 113 are both perpendicular to the first track 101, and two ends of the first track 101, the second track 102, the third track 103, the fourth track 104 and the fifth track 105 respectively extend to the first transfer track 111 side and the second transfer track 113 side of the first transverse frame body 110.

The first transfer rail 111 is provided with a first transfer mechanism 112, the first transfer mechanism 112 includes a set of displacement components 130 and a set of chip grabbing components 131, the displacement components 130 and the first transfer rail 111 are matched with each other, the first transfer mechanism 112 integrally moves on the first transfer rail 111 along the length direction of the first transfer rail 111 under the driving of the displacement components 130, the first transfer mechanism 112 is stopped above the first rail 101, the second rail 102, the third rail 103, the fourth rail 104 or the fifth rail 105 corresponding to the operation to be performed through the displacement components 130, and the chip grabbing components 131 perform grabbing and moving operations on the chips 180 in the trays 170 on the first rail 101, the second rail 102, the third rail 103, the fourth rail 104 or the fifth rail 105.

It should be noted that the displacement assembly 130 may adopt a driving motor, a gear is disposed on an output shaft of the driving motor, a row of convex teeth engaged with the gear is disposed on the first transfer rail 111, and the displacement assembly 130 and the first transfer mechanism 112 are moved on the first transfer rail 111 along with the forward and reverse rotation of the gear, or the displacement assembly 130 is disposed in another structural form, and is used for driving the first transfer mechanism 112 to move on the first transfer rail 111 and to stay at the corresponding grabbing position, it should be noted that in this application, a plurality of displacement assemblies 130 with different specifications may be disposed, and the displacement assemblies 130 with different specifications may be disposed at different rails or operating positions to implement the displacement operation, and the other displacement assemblies 130 are not described again.

This chip snatchs subassembly 131 can include sucking disc 132, be linked together the setting between the both ends of sucking disc 132, and install the piston 133 of evacuation in the one end of sucking disc 132, the other end of sucking disc 132 is equipped with bolster 134, snatch subassembly 131 when the chip and move to chip 180 on, the piston 133 work of sucking disc 132 one end, and the inside vacuum suction of sucking disc 132, chip 180 that is located the lower part of bolster 134 this moment moves towards sucking disc 132 direction with the air, until sucking disc 132 and bolster 134 contact, thereby accomplish the action of snatching of chip 180, after chip snatchs subassembly 131 and chip 180 and moves the target position together, piston 133 stop work for the vacuum adsorption usefulness, chip 180 and bolster 134 separation, accomplish the action of placing of chip 180.

It is worth mentioning that the buffer member 134 is installed at one end of the suction cup 132, so as to effectively prevent the chip 180 from contacting with the soft suction nozzle which needs to be deformed, and further prevent the suction nozzle from polluting the surface of the chip 180, specifically, the buffer member 134 can be made of polyether ether ketone (PEEK) material, and the buffer member 134 made of the PEEK material has the advantages of high mechanical strength, high temperature resistance, impact resistance, flame retardance, acid and alkali resistance, hydrolysis resistance, wear resistance, fatigue resistance, irradiation resistance and good electrical performance.

Correspondingly, a second transfer mechanism 114 is arranged on the second transfer track 113, the second transfer mechanism 114 also includes a set of displacement components 130 and a set of tray gripping components 135, the displacement components 130 and the second transfer track 113 are matched with each other, under the driving of the displacement components 130, the whole second transfer mechanism 114 moves on the second transfer track 113 along the length direction of the second transfer track 113, the second transfer mechanism 114 is stopped above the first track 101, the second track 102, the third track 103, the fourth track 104 or the fifth track 105 which are correspondingly required to operate through the displacement components 130, and the trays 170 on the first track 101, the second track 102, the third track 103, the fourth track 104 or the fifth track 105 are gripped and moved through the tray gripping components 135.

The first rail 101, the second rail 102, the third rail 103, the fourth rail 104 and the fifth rail 105 are all provided with a displacement assembly 130 for supporting the tray 170 to move, the displacement assembly 130 may be configured as the structural form of the driving motor, or may be configured as another driving device, such as an air cylinder or a linear driver, which is not further described herein, and the tray 170 on the first rail 101, the second rail 102, the third rail 103, the fourth rail 104 and the fifth rail 105 stays at a designated operation position according to an operation progress under the driving action of the displacement assembly 130, so as to improve the overall operation efficiency.

Since the tray 170 moves along with the displacement assembly 130 and it is necessary to keep the tray 170 moving smoothly when the chip 180 is loaded on the tray 170, the jaws 145 are provided on each displacement assembly 130 that carries the tray 170, the tray 170 is held stationary by the jaws 145 during the movement of the tray 170, and after the grippers are released, the tray 170 can be separated from the displacement assembly 130 without constraint.

Specifically, the clamping jaw 145 includes two first clamping plates 146, two second clamping plates 147, a driving gear 148 and a clamping motor 149, an output shaft of the clamping motor 149 is connected with the driving gear 148, the two first clamping plates 146 are respectively engaged with the driving gear 148 and drive the two first clamping plates 146 to approach or separate from each other under the rotation action of the driving gear 148, one ends of the two first clamping plates 146 extend to two opposite side surfaces of the tray 170 respectively, the two second clamping plates 147 are respectively engaged with the driving gear 148 and drive the two second clamping plates 147 to approach or separate from each other under the rotation action of the driving gear 148, and one ends of the two second clamping plates 147 extend to the other two opposite side surfaces of the tray 170 respectively.

The first clamping plate 146 and the second clamping plate 147 are vertically arranged, and in order to reasonably arrange the space between the material tray 170 and the displacement assembly 130, the driving gear 148 can be arranged to include a plurality of meshed gears, the combination of the plurality of meshed gears can effectively transmit the output power of the clamping motor 149, and the first clamping plate 146 and the second clamping plate 147 can be kept to simultaneously move through reasonable arrangement, so that when the material tray 170 is clamped, the two first clamping plates 146 and the two second clamping plates 147 can simultaneously move until the four sides of the material tray 170 are stably clamped.

The first track 101 is used for loading the empty tray 170, and the empty tray 170 on the first track 101 is conveyed to the second track 102 and the fourth track 104 under the driving action of the second transfer mechanism 114.

The third rail 103 is used for loading the tray 170 loaded with the chip 180, and the tray 170 loaded with the chip 180 is moved to the detection position to perform the detection operation under the driving of the displacement assembly 130 on the third rail 103.

The fourth rail 104 is arranged at one side of the third rail 103 in parallel, the empty tray 170 transferred from the first rail 101 to the fourth rail 104 is used for loading the chips 180 after detection in sequence, and the tray 170 loaded with the chips 180 after detection is moved to the lower part of the moving path of the first transfer mechanism 112 by the driving of the displacement assembly 130 on the fourth rail 104.

When the empty tray 170 is placed on the second track 102 under the operation of the tray grabbing assembly 135 on the second transfer mechanism 114 and moves to the position below the moving path of the first transfer mechanism 112 under the driving of the displacement assembly 130 on the second track 102, at this time, a part of NG pieces and a part of OK pieces exist on the tray 170 which is located at the lower part of the moving path of the first transfer mechanism 112 and is provided with the detected chips 180, wherein the NG pieces are grabbed by the chip grabbing assembly 131 of the first transfer mechanism 112 and move to the empty tray 170 on the second track 102 along with the displacement assembly 130 of the first transfer mechanism 112, so that the detected chips 180 are removed to the empty tray 170 one by one, and when the empty tray 170 on the second track 102 is filled with the NG pieces, a new empty tray 170 is cyclically filled for facilitating the subsequent processing of the NG pieces.

The fifth track 105 is used for placing the tray 170 on the fourth track 104 after the NG pieces are removed by the third transfer mechanism 122, only the OK pieces remain on the tray 170, and the OK pieces in the tray 170 shifted to the fifth track 105 are used for filling the chip 180, which is next in the tray 170 on the fourth track 104 and is removed from the NG pieces, in a hollow state, so that after the NG pieces are removed from the chips 180 on the subsequent tray 170, the tray 170 can be filled with the OK pieces, the tray 170 with the OK pieces on the whole tray is obtained on the fifth track 105, and the subsequent operation is facilitated.

It should be noted that, in order to facilitate the entire tray 170 after the NG pieces are removed from the fourth track 104 to move to the fifth track 105, the second transfer mechanism 114 further includes a tray grabbing assembly 135, and the tray grabbing assembly 135 can fix and lift the entire tray 170, and then the entire tray 170 is moved by the displacement assembly 130 on the second transfer mechanism 114.

Specifically, the tray grabbing assembly 135 comprises two clamping plates 136, a push-pull component 137 is arranged between the two clamping plates 136, the push-pull component 137 is used for driving the two clamping plates 136 to approach or separate from each other, when the two clamping plates 136 extend to two sides of the tray 170 and approach each other under the driving of the push-pull component 137 until the two clamping plates are clamped at two sides of the tray 170, the whole tray 170 is clamped, the two clamping plates 136 are separated from each other under the driving of the push-pull component 137, and when the distance between the two clamping plates 136 is larger than the width of the tray 170, the tray 170 is separated from the tray grabbing assembly 135.

It should be noted that the push-pull member 137 may be an air cylinder or a linear actuator, and the maximum stroke of the push-pull member 137 may be adjusted to be adapted to the width of the tray 170 through parameter presetting, so that higher efficiency may be obtained when the tray 170 is grabbed.

In order to reduce misoperation and avoid mutual interference between structures during operation, the vertical lifting device 138 is arranged on the tray grabbing component 135 and the chip grabbing component 131, and the tray grabbing component 135 and the chip grabbing component 131 are driven by the vertical lifting device 138 to carry out lifting operation.

Specifically, when the empty tray 170 or the tray 170 loaded with the chips 180 is placed and moved to the lower part of the tray grabbing assembly 135 and the chip grabbing assembly 131, or the tray grabbing assembly 135 and the chip grabbing assembly 131 are moved to the upper part of the chips 180 or the upper part of the tray 170, the tray grabbing assembly 135 or the chip grabbing assembly 131 is driven by the longitudinal lifting device 138 to move towards the tray 170 or the chips 180 until the tray grabbing assembly 135 grabs the tray 170 and the chip grabbing assembly 131 grabs the chips 180, and when the tray grabbing assembly 135 and the chip grabbing assembly 131 do not operate on the tray 170 and the chips 180, the tray grabbing assembly 135 and the chip grabbing assembly 131 can be driven by the longitudinal lifting device 138 to move away from the tray 170, so that the tray 170 and the chips 180 can not be blocked by the tray grabbing assembly 135 or the chip grabbing assembly 131, and the smoothness in the moving process of the tray 170 is improved.

The above-mentioned longitudinal lifting device 138 can be set up as linear actuator, lead screw or cylinder to be used for driving the charging tray and snatch subassembly 135 and chip and snatch subassembly 131 and can follow straight reciprocating motion, it should be noted that, can set up the longitudinal lifting device 138 of a plurality of different specifications in this application, and install the longitudinal lifting device 138 of different specifications in different tracks or operating position, in order to realize that the drive takes place the purpose of longitudinal lifting displacement, and other longitudinal lifting device 138 do not expand the description again.

In actual operation, the process of the sorting system includes:

1. two empty trays 170 are prepared and placed on the first rail 101, and the two empty trays 170 are moved one by one to a position below the moving path of the second transfer mechanism 114 on the first transversal frame 110 by the displacement assembly 130 on the first rail 101.

2. After an empty tray 170 is picked by the tray pickup assembly 135 of the second transfer mechanism 114, the empty tray 170 is driven by the displacement assembly 130 of the second transfer mechanism 114 to move along the second transfer track 113 until the empty tray 170 moves above the second track 102, the empty tray 170 is lowered onto the second track 102 by the tray pickup assembly 135 of the second transfer mechanism 114 again, and the empty tray 170 moves below the moving path of the first transfer mechanism 112 under the driving of the displacement assembly 130 of the second track 102 to receive NG pieces.

3. After another empty tray 170 is picked by the tray pickup assembly 135 of the second transfer mechanism 114, the empty tray 170 is moved along the second transfer rail 113 by the driving of the displacement assembly 130 of the second transfer mechanism 114 until the empty tray 170 moves above the fourth rail 104, the empty tray 170 is lowered onto the fourth rail 104 by the tray pickup assembly 135 of the second transfer mechanism 114 again, and the empty tray 170 is moved to a station for receiving the inspected chip 180 by the driving of the displacement assembly 130 of the second rail 102.

4. The tray 170 with the chips 180 is prepared on the third rail 103, and the tray 170 with the chips 180 is conveyed to the chip 180 detection station for detection through the displacement assembly 130 on the third rail 103.

5. The detected chips 180 are placed into the empty trays 170 on the fourth rail 104 one by one, and the trays 170 containing the detected chips 180 are conveyed to the lower part of the moving path of the second transfer mechanism 114 through the displacement assembly 130 on the fourth rail 104.

6. The tray 170 with the inspected chip 180 is picked up by the tray pickup assembly 135 of the second transfer mechanism 114, driven by the displacement assembly 130 of the second transfer mechanism 114 until the tray 170 is positioned above the fifth rail 105, the tray 170 is lowered onto the fifth rail 105 by operating the tray pickup assembly 135 of the second transfer mechanism 114, and then the tray 170 is moved to below the moving path of the first transfer mechanism 112 by the displacement assembly 130 on the fifth rail 105.

7. The NG pieces are sucked by the chip grabbing component 131 of the first transfer mechanism 112 according to the detection result of the chip 180 of the tray 170 on the fifth track 105, and are driven by the displacement component 130 of the first transfer mechanism 112 to move and place on the empty tray 170 on the second track 102.

8. When the second tray 170 with the chips 180 enters the chip 180 detection station from the third rail 103 for detection, and the detected chips 180 are placed into the empty trays 170 on the fourth rail 104 one by one, the tray 170 with the detected chips 180 is conveyed to the lower part of the moving path of the first transfer mechanism 112 by the displacement assembly 130 on the fourth rail 104.

9. The operation of the above 7 is repeated, then the OK member in the tray 170 on the fifth track 105 is grabbed by the chip grabbing component 131 of the first transfer mechanism 112, and the OK member is moved to the chip 180 position left by the NG member removal in the tray 170 on the fourth track 104 under the driving of the displacement component 130 of the first transfer mechanism 112 until all the OK members are in the tray 170 on the fourth track 104.

It should be emphasized that the above processing procedures do not have a unique sequence of operations, and on the premise of not affecting the operation logic, the processing procedures can be exchanged to a certain extent, and other different processing sequences are not listed and expanded one by one.

It should be noted that when all OK pieces in the tray 170 on the fifth track 105 are used as a supplement to NG pieces in the subsequent tray 170 after being removed, that is, there are no chips 180 in the tray 170 on the fifth track 105, the tray 170 can be moved to the first track 101 at the working gap of the first transfer mechanism 112 and recycled as a new empty tray 170.

It should be noted that, when the empty tray 170 is placed on the first rail 101, for convenience of operation, one end of the first rail 101, the second rail 102, the third rail 103, the fourth rail 104 and the fifth rail 105 may be arranged flush, and one end of the first rail 101, the second rail 102, the third rail 103, the fourth rail 104 and the fifth rail 105 far away from the chip 180 detection station may be used as an operation end for convenience of operation of an operator and a working machine.

Meanwhile, in order to enhance the one-time stacking and the one-by-one conveyance of the plurality of trays 170, tray placement mechanisms 140 are respectively provided on the operation end sides of the first rail 101, the second rail 102, the third rail 103, the fourth rail 104, and the fifth rail 105, and the tray placement mechanisms 140 include: the tray 170 can be placed at a set position, alignment of the position of the tray 170 can be completed by directly pushing one end of the tray 170 against the limiting plate 141, the lifting rod 142 is movably installed at the bottom of the rail, one end of the lifting rod 142 extends below the tray 170, the other end of the lifting rod 142 is provided with a push-pull component 137, the lifting rod 142 is driven by the push-pull component 137 to ascend or descend to support the tray 170 to move up and down, the lifting rod 142 is arranged at four positions and distributed at four corners of the bottom of the tray 170 to improve stability of the lifting rod 142 in the lifting process of the tray 170, the supporting components 143 are provided with at least two supporting brackets 171, the supporting components 143 are provided with telescopic ends 144, the bottom of the tray 170 is provided with supporting brackets 171 for accommodating the telescopic ends 144, when the supporting components 143 work, the telescopic ends 144 are driven to move close to the tray 170 until the tray 170 extends to two sides of the tray 170, and the telescopic ends of the supporting brackets 171 are arranged as telescopic end drivers.

In the actual use process of the tray placing mechanism 140, for example, a plurality of empty trays 170 can be placed on the first rail 101 at one time, and a plurality of trays 170 containing chips 180 can be placed on the third rail 103 at one time, where a plurality of trays 170 containing chips 180 are placed on the third rail 103 for specific description: the third rail 103 is provided with a plurality of trays 170 containing the chips 180, and the plurality of trays 170 are stacked, at this time, one tray 170 needs to be conveyed to the chip 180 detection position through the first rail 101, the push-pull member 137 is operated to drive the lifting rod 142 to ascend until the second tray 170 from bottom to top is located above the horizontal plane of the supporting member 143, the first tray 170 from bottom to top is located below the horizontal plane of the supporting member 143, then the supporting member 143 is driven, the plurality of telescopic ends 144 extend into the supporting groove 171 on the second tray 170 from bottom to top, then the push-pull member 137 is operated to drive the lifting rod 142 to descend, so that the first tray 170 from bottom to top is located on the rail and moves to the detection position through the rail, after the first tray 170 from bottom to top is taken away, when the second tray 170 from bottom to top needs to descend, the above operation process is repeated, when the plurality of trays 170 are correspondingly stacked on other rails, the operation mode is the same as that the operation mode of the trays 170 on each rail is not repeated, and the operation mode of the trays 170 on each rail is not explained here one by one.

Specifically, the pretreatment system includes a first transverse frame 110 and a second transverse frame 120 disposed on the second platform area 191, the first transverse frame 110 and the second transverse frame 120 are disposed in parallel, the first transverse frame 110 is the first transverse frame 110 disposed on the first track 101, the second track 102, the third track 103, the fourth track 104 and the fifth track 105, and the second transverse frame 120 is disposed at a side close to the second transfer track 113 on the first transverse frame 110.

A first detection assembly 115 and a second detection assembly 116 are further disposed on the second transfer mechanism 114 of the first transverse frame 110, and the first detection assembly 115 and the second detection assembly 116 move synchronously with the second transfer mechanism 114.

The two sets of tray grabbing components 135 are respectively arranged on two sides of the first detection component 115 and the second detection component 116, so that the tray grabbing components 135 can grab and move the trays 170 on two sides of the first detection component 115 and the second detection component 116 without crossing the first detection component 115 and the second detection component 116.

The first detection assembly 115 is used for shooting from above the tray 170, after the chip 180 is mounted on the tray 170 and moves to the lower part of the moving path of the second transfer mechanism 114, the first detection assembly 115 moves onto the tray 170 and is limited by the limitation of the lens field range, the first detection assembly 115 is set to have a larger field range, and a single shot image can include more chips 180, so that the information of the chips 180 shot by the first detection assembly 115 can be preliminarily analyzed, and further the number of the chips 180 in each row and each column on the tray 170 and the condition of whether vacant positions exist for not placing the chips 180 can be obtained, and the information is used for planning the shooting path of the second detection assembly 116.

The second detection assembly 116 is also used for shooting from above the tray 170, except that after the chip 180 is mounted on the tray 170 and moves to the lower part of the moving path of the second transfer mechanism 114, the second detection assembly 116 moves onto the tray 170 and shoots one by one according to the moving path of the second detection assembly 116 planned by the first detection assembly 115 according to the acquired chip 180 information, so that a clearer image of the chip 180 is shot each time through the second detection assembly 116, meanwhile, shooting of empty positions by the second detection assembly 116 is avoided, deviation of detection data output is reduced, unnecessary shooting operation is avoided, a shorter moving path is obtained, and the whole detection operation efficiency is improved.

Specifically, in the process of preprocessing the chip 180, the tray 170 with the chip 180 is prepared to be placed on the third rail 103, and the tray 170 with the chip 180 is conveyed to the chip 180 detection station for detection through the displacement assembly 130 on the third rail 103.

After the tray 170 with the chip 180 is moved to the lower part of the moving path of the second transfer mechanism 114, the tray stops moving forward, the first detection component 115 is moved to the tray 170 with the chip 180 by the displacement component 130 of the second transfer mechanism 114, the tray 170 is shot by the first detection component 115, and the chip 180 in the shooting range is preliminarily positioned.

It should be noted that the area where the chips 180 are loaded on the tray 170 may be divided into three primary areas 172, and the flat plate on which the chips 180 are placed is placed in the primary area 172, because the sizes and specifications of the chips 180 are not consistent, the flat plate in the three primary areas 172 may be used as a standard specification reference, and the chips 180 with different specifications may be placed on the flat plate at different densities, so that the tray 170 and the flat plate may have universal and relatively fixed sizes, and further, the placement density of the chips 180 on the flat plate may reasonably adapt to different specifications of the chips 180, however, because the sizes and specifications of the chips 180 are different, the chips 180 need to be repositioned in the following detection processes, such as grabbing, detection and the like, so as to ensure that the chips 180 to be detected may be accurately grabbed and effectively detected, and after the first detection assembly 115 shoots and positions the primary areas 172 on the tray 170, the quantity information of the chips 180 in the primary areas 172 is obtained.

Then, with the continuous operation of the displacement assembly 130 of the second transfer mechanism 114, the first detection assembly 115 is removed from the tray 170 containing the chips 180, the space required for the movement of the second detection assembly 116 is provided, and then the second detection assembly 116 moves onto the tray 170 containing the chips 180, and the chips 180 on the tray 170 are detected again by the second detection assembly 116.

It should be noted that, different from the first detecting component 115, when the second detecting component 116 moves to the tray 170 with the chips 180, the second detecting component 116 first detects the first row of chips 180 on the tray 170, and performs the image capture of the chips 180 one by one along the arrangement of the first row of chips 180, for convenience of description, the length extending direction of the third track 103 is taken as the length direction of the tray 170, and is also the column direction of the chips 180 loaded on the tray 170, that is, the tray 170 stopped at this time is taken by the second detecting component 116 in a row unit to perform the image capture of the chips 180, and after the second detecting component 116 detects one chip 180 each time, the second transferring mechanism 114 moves a corresponding distance according to the distance information between two adjacent chips 180 acquired by the first detecting mechanism, and the second detecting component 116 moves to the top of the next chip 180 to be captured together with the second transferring mechanism 114 to perform the image capture operation.

After the second detecting assembly 116 finishes shooting the first row of chips 180 on the tray 170 in a row unit, the tray 170 with the chips 180 moves towards the detecting position by a distance of one row of chips 180 through the displacement assembly 130 on the third track 103, the distance can be adjusted according to the distance information between two adjacent rows of chips 180 acquired by the first detecting mechanism, so that the chips 180 in the second row on the tray 170 are located at the lower part of the moving path of the second detecting assembly 116, and simultaneously the second detecting assembly 116 is driven by the displacement assembly 130 of the second transfer mechanism 114 to shoot the chips 180 in the second row on the tray 170, and after the chips 180 in the second row are shot by the second detecting assembly 116, the above operations are repeated until the chips 180 on the tray 170 are completely shot.

In order to improve the shooting efficiency of the second detection assembly 116 and reduce the working frequency of the displacement assembly 130 of the second transfer mechanism 114, after the second detection assembly 116 finishes shooting the first row of chips 180 on the tray 170 in the first direction, the tray 170 with the chips 180 is moved by the displacement assembly 130 of the second transfer mechanism 114 in a process of being reset in a direction opposite to the first direction, by the distance of the row of chips 180, the tray 170 with the chips 180 is moved by the displacement assembly 130 on the third track 103, so that the second detection assembly 116 can be controlled to shoot the second row of chips 180 on the tray 170 in a process of being reset in a direction opposite to the first direction, the detection efficiency is improved, the path of each movement of the second detection assembly 116 is effectively utilized, and the shooting operation beat is reasonably planned.

And a second transverse frame body 120 arranged in parallel with the first transverse frame body 110, wherein a third transfer rail 121 is arranged on one side of the second transverse frame body 120, the third transfer rail 121 is arranged in parallel with the first transfer rail 111, and the third transfer rail 121 is arranged on one side of the second transverse frame body 120 close to the second transfer rail 113.

The third transfer track 121 is provided with a third transfer mechanism 122, the third transfer mechanism 122 includes a set of displacement assembly 130 and a set of chip grabbing assembly 131, the displacement assembly 130 and the third transfer track 121 are matched with each other, and under the driving of the displacement assembly 130, the third transfer mechanism 122 integrally moves on the third transfer track 121 along the length direction of the third transfer track 121.

It should be noted that the chip 180 has five surfaces to be detected, which are a first detection surface 181, a second detection surface 182, a third detection surface 183, a fourth detection surface 184, and a fifth detection surface 185, when the chip 180 is placed in the tray 170 on the third track 103, the first detection surface 181 and the fourth detection surface 184 on the chip 180 face away from the third track 103, the third detection surface 183 and the fifth detection surface 185 face the third track 103, and the second detection surface 182 is an interlayer surface.

The first back inspection mechanism 123 is disposed below the third transfer track 121, the first back inspection mechanism 123 is located below the third transfer track 121 and faces the bottom surface of the chip 180 for shooting, that is, the third detection surface 183 and the fourth detection surface 184 on the chip 180 are shot, in the actual operation process, the chip 180 is moved to the lower portion of the third transfer track 121 in the tray 170 on the third track 103, and after the chip is grabbed by the chip grabbing component 131 on the third transfer mechanism 122, the chip is moved to the upper portion of the first back inspection mechanism 123 along with the third transfer mechanism 122, it is worth noting that the first back inspection mechanism 123 is disposed at a position below the grabbed chip 180, and further, the shooting can be directly performed on the premise that the chip 180 is not turned over, so as to obtain images of the third detection surface 183 and the fifth detection surface 185, and further improve the operation efficiency.

The chips 180 detected line by the second detecting assembly 116 move to the moving path of the third transfer mechanism 122 along with the tray 170, so that the chips 180 are lifted and separated from the tray 170 after being grabbed by the chip grabbing assembly 131 of the third transfer mechanism 122, the chips 180 are moved to the first back detection mechanism 123 under the driving of the displacement assembly 130 of the third transfer mechanism 122, the back detection of the chips 180 is completed on the premise that the chips 180 are not separated from the chip grabbing assembly 131 of the third transfer mechanism 122, and the chips 180 detected by the first back detection mechanism 123 are put back to the tray 170 through the cooperation of the displacement assembly 130 of the third transfer mechanism 122 and the chip grabbing assembly 131 after the detection is completed.

It should be noted that, because the chips 180 on the tray 170 are not of a single size, when the chip 180 is grabbed on the tray 170, the chip 180 needs to be reasonably adjusted according to the arrangement of each row of the chips 180, so that after the size of the chip 180 to be detected is changed, the operation accuracy and the detection effectiveness can be improved through corresponding adjustment.

In order to enable the chip grabbing component 131 to have flexible adaptability and high-efficiency carrying operation capability, the chip grabbing component 131 further includes a first distance adjusting device on the basis of including the suckers 132, the pistons 133 and the buffers 134, wherein one sucker 132, one piston 133 and one buffer 134 are set as a group, and multiple groups are arranged to enable the suckers 132 to grab multiple chips 180 at a time, so that the efficiency is improved, but because the sizes of the chips 180 are different, and the densities of the chips 180 arranged on the tray 170 are different, the distance between the suckers 132 needs to be adjusted according to different placement conditions of the chips 180, and at this time, the distance between the suckers 132 is adjusted by the first distance adjusting device to adapt to the processing processes of different chip 180 specifications, each sucker 132 can accurately grab the chip 180, and the detection efficiency of the first back inspection mechanism 123 is improved.

The structure and connection relationship of the suction cup 132, the piston 133 and the buffer 134 will not be described repeatedly.

The first distance adjusting device comprises a first motor 151 and a first screw 152, the first screw 152 is connected with an output shaft of the first motor 151 and is driven by the first motor 151 to rotate, two suckers 132 are fixed on the first screw 152 through a sliding block 153 in threaded connection, and when the first screw 152 rotates, the two suckers 132 move close to each other or move away from each other on the first screw 152, so that the distance between the two suckers 132 is adjusted.

In order to further improve the suction efficiency of the chip 180, the chip grabbing assembly 131 further comprises a second distance adjusting device, the second distance adjusting device comprises a second motor 154 and a second screw 155, the second screw 155 is connected with an output shaft of the second motor 154 and is driven by the second motor 154 to rotate, two suction cups 132 are fixed on the second screw 155 through a sliding block 153 in threaded connection, and when the second screw 155 rotates, the two suction cups 132 move close to each other or move away from each other on the second screw 155, so that the distance between the two suction cups 132 is adjusted.

The fixed suction cup 132 is disposed between the two suction cups 132 moving on the first screw 152, and when the first screw 152 rotates, the distance between the two suction cups 132 moving on the first screw 152 and the fixed suction cup 132 is always the same, so as to satisfy the same gap preset between the adjacent chips 180.

In addition, the two suction cups 132 moving on the second screw 155 are disposed at both sides of the suction cup 132 fixedly disposed with respect to the first screw 152, and when the second screw 155 rotates, the distance between the two suction cups 132 moving on the second screw 155 and the fixed suction cup 132 is always the same to satisfy the same gap preset between the adjacent chips 180.

In the specific operation, the number of the chips 180 in one row on the tray 170 is at most ten according to the width of the tray 170 and the specification range of the chips 180, and in order to balance the operation efficiency and the component arrangement space, the suction cups 132 may be set to five, that is, one row of the chips 180 may be completely grasped by performing two more operations, and the following description will be given by setting ten chips 180 in one row on the tray 170.

The chip grabbing component 131 includes two suction cups 132 on the first screw 152, the suction cups 132 on the second screw 155, and the suction cups 132 fixedly disposed between the two suction cups 132 on the first screw 152, that is, the chip grabbing component 131 includes five suction cups 132, and under the driving of the first screw 152 and the second screw 155, the same distance is ensured between the adjacent suction cups 132, so that on the premise that the chips 180 are placed at different positions, the first screw 152 is driven by the first motor 151, and the second screw 155 is driven by the second motor 154, so that the suction cups 132 correspondingly suspend above the chips 180 respectively.

At this time, under the operation of the five suction cups 132, five chips 180 are sucked, and the five chips 180 are sucked at intervals relative to ten chips 180 in a row on the tray 170, and are driven by the displacement assembly 130 of the third transfer mechanism 122, so that the first back inspection mechanism 123 performs the inspection of the chips 180 one by one, that is, the remaining five chips 180 in the row on the tray 170 wait for the five suction cups 132 to put back the inspected chips 180, and are inspected again by the five suction cups 132 in the above process, thereby completing the back inspection of the chips 180 in a row.

The chips 180 after the back detection are put back into the tray 170, and it should be noted that, at this time, after the first back detection mechanism 123 detects and identifies the chips 180 loaded on the tray 170 in units of rows, the tray 170 with the chips 180 is moved by the displacement assembly 130 on the third track 103 by a distance of one row of chips 180, the distance is set by taking the detection information of the first detection assembly 115 as a reference, so that the chips 180 in the second row on the tray 170 are located under the third transfer track 121, and the chip grabbing assembly 131 on the third transfer mechanism 122 is driven by the displacement assembly 130 of the third transfer mechanism 122 again to detect the chips 180 in the second row on the tray 170, and after the chips 180 in the second row are detected by the first back detection mechanism 123, the above operations are repeated, so that the chips 180 on the tray 170 are detected row by row, and the chips 180 loaded on the tray 170 sequentially pass through the detection of the first back detection mechanism 123.

Since the trays 170 with the chips 180 are sequentially placed on the third track 103 for detection, that is, the chip grabbing assemblies 131 on the third transfer track 121 need to grab the chips 180 on the trays 170 one by one, in order to avoid the chips 180 from being contaminated due to contamination generated in the contact process between the suction cups 132 or the buffers 134 and the different chips 180 and affecting the accuracy of the detection result of the chips 180, the cleaning device 160 may be disposed below the third track 103.

After all the chips 180 in the tray 170 on the third track 103 are detected by the chip picking assembly 131 through the first back inspection mechanism 123, the suction cups 132 or the buffer members 134 of the chip picking assembly 131 on the third transfer track 121 are moved to the cleaning device 160 for cleaning by the driving of the displacement assembly 130 on the third transfer track 121.

Specifically, the cleaning device 160 includes: clean fluid storage tank 161, play liquid mechanism 162 and cleaning cloth 163, the inside cavity setting of clean fluid storage tank 161, just be equipped with the interpolation mouth 164 that is used for adding the cleaning liquid on the clean fluid storage tank 161 lateral wall, go out liquid mechanism 162 and locate clean fluid storage tank 161 bottom, just it includes compressed air output device to go out liquid mechanism 162, what compressed air output device's output was linked together extends to inside the clean fluid storage tank 161, clean fluid storage tank 161 top is equipped with the liquid outlet, the liquid outlet coats and is stamped cleaning cloth 163.

After the cleaning liquid is added into the cleaning liquid bin 161, the compressed air output device works, compressed air is output from the output end, the compressed air enters the cleaning liquid bin 161, the cleaning agent in the cleaning liquid bin is pressed to be sprayed out from the liquid outlet and infiltrates the cleaning cloth 163, at the moment, the chip grabbing assembly 131 on the third transfer rail 121 moves to the upper portion of the cleaning device 160 along the third transfer rail 121, the suction cup 132 and the buffer 134 are driven to descend and contact with the cleaning cloth 163, so that the cleaning liquid adsorbed on the cleaning cloth 163 contacts the suction cup 132 and the buffer 134 to complete cleaning operation, the cleanness degree of the suction cup 132 and the buffer 134 in the next operation period is maintained, the cleaning frequency can be reasonably set according to the efficiency of the chip 180 operation, the cleaning frequency is reduced on the premise that the cleanness meets the requirement, and the operation efficiency is prevented from being influenced by the cleaning operation.

The cleaning device 160 further comprises a flow control device, the flow control device is arranged at the output end of the compressed air output device to adjust the ejection flow rate of the compressed air in the output end of the compressed air output device, specifically, the flow control device can be set as a valve body, and the flow rate of the compressed air introduced into the cleaning liquid bin 161 is controlled by adjusting the flow rate of the valve body, so as to reduce the control requirement of the compressed air output device.

Cleaning device 160 still includes liquid level control device, sets up inside cleaning fluid storehouse 161 to detect the liquid level of the inside cleaning fluid of cleaning fluid storehouse 161, and then realize more accurate interpolation operation, avoid the cleaning fluid to use up the back, do not in time supply, specific can set up liquid level control device into level gauge or liquid sensor, and set up audible-visual annunciator and be connected with liquid level control device electricity, realize reminding the purpose.

The cleaning device 160 further includes a backflow mechanism, since the amount of cleaning liquid that can be adsorbed on the cleaning cloth 163 is limited, when a certain amount of cleaning liquid is already present on the cleaning cloth 163, or the cleaning liquid is not completely absorbed by the cleaning cloth 163 after being sprayed each time, there is an overflow of the cleaning liquid around the cleaning cloth 163, in order to avoid an uncontrollable overflow of the cleaning liquid, the backflow mechanism is disposed on the cleaning liquid bin 161 to collect the excessive cleaning liquid, specifically, the backflow mechanism includes a backflow tray 165, the backflow tray 165 is disposed on the cleaning liquid bin 161, and an opening on one side of the backflow tray 165 extends to below the cleaning cloth 163, and an opening on the other side of the backflow tray 165 extends to the cleaning liquid recovery portion, so as to collect and guide the excessive cleaning liquid at the cleaning cloth 163 until the excessive cleaning liquid is collected in the cleaning liquid recovery portion, and reduce the operation cost by recycling.

After passing through the above pretreatment system, the tray 170 with the chips 180 is moved to a subsequent station on the third rail 103 for detection.

Specifically, the detection system includes a first turntable detection area disposed on the third platform area 192, and the first turntable detection area includes a detection turntable 200, a blanking mechanism 210, a third detection assembly 221, a fourth detection assembly 222, and a fifth detection assembly 223.

The detection system further includes a fourth transfer track 124 disposed on the second transverse frame 120, a fourth transfer mechanism 125 is disposed on the fourth transfer track 124, the fourth transfer mechanism 125 includes a displacement component 130 and a chip grabbing component 131, the displacement component 130 and the fourth transfer track 124 are matched with each other, and under the driving of the displacement component 130, the fourth transfer mechanism 125 integrally moves on the fourth track 104 along the length direction of the fourth transfer track 124, and the fourth transfer mechanism 125 can stay above the third track 103 requiring operation through the displacement component 130, and grabs the chip 180 in the tray 170 on the third track 103 through the chip grabbing component 131.

The fourth transfer rail 124 is disposed at a side of the second traverse frame 120 far from the third transfer rail 121.

The detection turntable 200 is mounted on one side of the third rail 103, and a rotation assembly is arranged on the detection turntable 200, and the rotation assembly is fixedly arranged on the third platform region 192 and is used for driving the detection turntable 200 to rotate.

At least five detection discs 201 are arranged on the detection rotary disc 200, each detection disc 201 is used for placing a chip 180, the chips 180 in the detection discs 201 rotate along with the detection rotary disc 200 along with the rotation of the detection rotary disc 200, when the detection rotary disc 200 stops rotating, one detection disc 201 is located at an upper material level, one detection disc 201 is located at a lower material level, and the other three detection discs 201 are respectively used for corresponding to the third detection assembly 221, the fourth detection assembly 222 and the fifth detection assembly 223.

When five detection discs 201 are arranged, the five detection discs 201 are uniformly distributed on the detection turntable 200 along the circumferential direction of the rotation axis of the detection turntable 200, that is, the central angles of every two adjacent detection discs 201 on the detection turntable 200 are the same, that is, as long as one detection disc 201 is located at a feeding position, one detection disc 201 is located at a discharging position, and at the same time, three detection discs 201 are respectively corresponding to the third detection assembly 221, the fourth detection assembly 222 and the fifth detection assembly 223, when the rotation of the detection turntable 200 is controlled, the angle of each rotation of the detection turntable 200 is kept to be the same as the central angles of every two adjacent detection discs 201 on the detection turntable 200, so that after five rotations of the detection turntable 200 are kept, one chip 180 passes through the third detection assembly 221, the third detection assembly 222 and the discharging position, and is accompanied by the continuous rotation of the detection turntable 200, and after each chip 180 is placed in the detection disc 201 at the feeding position, the chip 180 passes through the third detection assembly 221, the fourth detection assembly 222 and the fifth detection assembly 222, and moves until all detection discs 180 are detected.

The third detection assembly 221 is fixedly arranged on the third platform area 192 and is used for shooting the chip 180 rotating to the lower side of the third detection assembly 221 and judging the defect of the chip 180 through the shot chip 180 image, the third detection assembly 221 adopts a dark field light source to detect the chip 180, namely, the chip 180 is whitened or brightened through the dark field light source, the background of the chip 180 is blackened or darkened, the chip 180 is shot under the condition of the light source, and the defect of the chip 180 displayed by the image is analyzed.

The fourth detection assembly 222 is fixedly arranged on the third platform area 192, and is configured to shoot the chip 180 that rotates to the lower side of the third detection assembly 221, and judge the defect of the chip 180 through the shot chip 180 image, and the third detection assembly 221 can shoot the second detection surface 182 of the chip 180 through a preset focal segment, and analyze the defect of the chip 180 shown by the image.

The fifth detection component 223 is fixedly arranged on the third platform area 192 and is used for shooting the chip 180 which rotates to the position below the fifth detection component 223, and judging the defect of the chip 180 through the shot chip 180 image, the fifth detection component 223 adopts a bright-field light source to detect the chip 180, namely, the chip 180 is blackened or darkened through the bright-field light source, the background of the chip 180 is whited or brightened, under the condition of the light source, shooting of the chip 180 is carried out, and the defect of the chip 180 displayed by the image is analyzed.

After the chip grabbing component 131 grabs the chips 180, the displacement component 130 drives the chip grabbing component 131 to grab the chips 180 and move to the position above the loading position, the chip grabbing component 131 releases the chips 180 to the detection disc 201 on the detection turntable 200, and after the detection turntable 200 rotates by a unit angle, the chips 180 move to the position below the third detection component 221, and while the detection turntable 200 rotates, the chip grabbing component 131 cooperates with the displacement component 130 to grab one chip 180 in the tray 170 on the third track 103 again, and after the detection turntable 200 stops rotating, the chip 180 is placed down to the detection disc 201 at the loading position again, and the operations are continuously repeated, so that the step-by-step detection of the chips 180 in the tray 170 is completed.

The blanking mechanism 210 is fixed on the third platform area 192, the blanking mechanism 210 comprises a rotating arm 211 and a chip grabbing component 131, the chip grabbing component 131 is fixed at one end of the rotating arm 211, the other end of the rotating arm 211 is rotatably arranged relative to the third platform area 192, the rotating arm 211 drives the chip grabbing component 131 to rotate, the chip grabbing component 131 can move to the upper portion of the blanking position and the upper portion of the fourth track 104, and when the blanking mechanism is specifically arranged, the rotating power source of the rotating arm 211 can be a stepping motor or other power driving parts to drive the rotating part to reciprocate, so that the chip grabbing component 131 is driven to reciprocate above the third track 103 and the fourth track 104.

A longitudinal lifting device 138 is disposed between the rotating arm 211 and the chip grabbing assembly 131, and the chip grabbing assembly 131 can move back and forth in a direction perpendicular to the third platform area 192 by the driving of the longitudinal lifting device 138, and the longitudinal lifting device 138 is described in detail in the foregoing, and will not be further described herein.

After the chip 180 passes through the third detecting component 221, the fourth detecting component 222 and the fifth detecting component 223 from the feeding position on the detecting turntable 200 and is detected, the chip grabbing component 131 is driven by the rotating arm 211 to move to the discharging position, the chip grabbing component 131 moves to the position above the chip 180 at the discharging position under the driving of the longitudinal lifting device 138, the chip grabbing component 131 moves to the position above the chip 180 at the discharging position, the chip 180 is grabbed and moved to the empty tray 170 on the fourth rail 104 under the driving of the rotating arm 211 after the chip 180 is grabbed, the chip 180 grabber is driven by the longitudinal lifting device 138 again to place the detected chip 180 onto the empty tray 170, and the detection of the chip 180 is completed.

In order to further adapt to the production rhythm, after the chip 180 is placed on the empty tray 170, the rotating arm 211 is controlled to drive the chip grabbing assembly 131 to move to the position above the blanking position of the detection turntable 200 to wait.

Still be equipped with the correction subassembly on the chip snatchs subassembly 131, the correction subassembly includes correction motor 230, the output shaft and the chip of correction motor 230 snatch the subassembly 131 and be connected, and be used for driving the chip and snatch the subassembly 131 rotation, because be provided with a plurality of one-level regions 172 on the charging tray 170, and can directly place the loading board that suits with one-level region 172 size in every one-level region 172, arrange a plurality of chips 180 on every loading board, and because chip 180 has long limit and the difference of short side on length, in order to unify the direction that chip 180 put, and make the long limit and the short side of chip 180 and the long limit and the short side adaptation of detection module visual field, can snatch between the chip 180 on the fourth transport mechanism 125 and absorb chip 180 after, the correction subassembly drives this chip and snatchs subassembly 131 rotation, until the long limit and the short side of chip 180 and the long limit and the terminal surface direction of detection module visual field are unanimous.

And since the chip 180 after the rotational alignment needs to be placed on the detection disc 201 on the detection turntable 200, in order to avoid secondary errors, the position and angle of the detection disc 201 can be adjusted to be consistent with the position and direction of the field of view of the detection assembly in advance, that is, when the detection disc 201 is located at the lower part of the third detection assembly 221, the detection disc 201 and the chip 180 in the detection disc 201 are consistent with the field of view of the third detection assembly 221, and the chip 180 is centered in the field of view of the third detection assembly 221.

The third platform area 192 is further provided with a second back inspection mechanism 240, the second back inspection mechanism 240 is located between the discharging position and the third track 103, when the chip 180 on the third track 103 is captured by the chip capture assembly 131 of the fourth transfer mechanism 125, and driven by the displacement assembly 130, the chip 180 passes above the second back inspection mechanism 240 in the process of moving toward the discharging position on the fourth transfer track 124 by the fourth transfer mechanism 125, and during the stopping process, the second back inspection mechanism 240 is located below the fourth track 104 and shoots towards the bottom surface of the chip 180, during the actual operation, the chip 180 is moved to the lower part of the fourth transfer track 124 in the tray 170 on the third track 103, and after being captured by the chip capture assembly 131 on the fourth transfer mechanism 125, the chip 180 is moved to the upper part of the second back inspection mechanism 240 along with the fourth transfer mechanism 125, the second back inspection mechanism 240 is located at a position which is ensured to be below the captured chip 180, and further, the chip 180 can be directly shot in a state of correcting the long side image and the short side image 180, and can be directly shot by the second back inspection mechanism 180, and the chip 180 can be directly shot by the long side image analysis mechanism 180.

Meanwhile, after the second back inspection mechanism 240 performs back inspection shooting on the chip 180, image comparison between the third detection surface 183 and the fifth detection surface 185 can be performed again after the first back inspection mechanism 123 performs back inspection, secondary back defect screening can be completed while the long side direction and the short side direction of the chip 180 are judged, the detection accuracy is improved, meanwhile, when one of the first back inspection mechanism 123 and the second back inspection mechanism 240 is damaged, the other one can complete back inspection operation, and the stability of the whole detection process is improved.

The detection turntable 200 is further provided with an adsorption positioning assembly, the adsorption positioning assembly comprises adsorption tubes 251 and vacuum generators 252, the vacuum generators 252 are arranged at one ends of the adsorption tubes 251 and are communicated with the adsorption tubes 251, the quantity of the adsorption tubes 251 is the same as that of the detection discs 201, the other ends of the adsorption tubes 251 extend to the end faces, used for bearing the chips 180, of the detection discs 201, and after the chips 180 are placed on the detection discs 201, the vacuum generators 252 work, the vacuum generators 252 generate negative pressure by using a positive pressure gas source, the negative pressure is generated at one ends, close to the chips 180, of the adsorption tubes 251 and the chips 180 are adsorbed on the detection discs 201, even if the detection turntable 200 shakes to a certain degree in the rotating process, or the chips 180 are subjected to inertia when the detection turntable 200 starts to rotate and stops rotating, the chips 180 can still be stably adsorbed at fixed positions of the detection discs 201, on the one hand, the chips 180 are kept at the optimal positions of the shooting fields of the detection assemblies all the chips 180, on the other hand, the chip 180 is prevented from falling off to cause damage, the stability of the detection process is improved, and the detection process range can be adjusted flexibly according to the rotating speed while the stable positions of the turntable 200.

An adjusting assembly 260 is respectively arranged between the third detecting assembly 221, the fourth detecting assembly 222, the fifth detecting assembly 223 and the third platform region 192, and the adjusting assembly 260 includes: a first adjusting part 261, a second adjusting part 262 and a longitudinal lifting device 138.

The longitudinal lifting device 138 is used to drive the third detecting component 221, the fourth detecting component 222, or the fifth detecting component 223 toward or away from the third platform region 192, so as to achieve the purpose of focus adjustment when detecting the chip 180 on the turntable 200.

Since the sizes and the sizes of the chips 180 to be detected cannot be kept uniform, the chips 180 within a certain size range can be covered by the field of view of the third detecting component 221, the fourth detecting component 222 and the fifth detecting component 223, that is, after the longitudinal heights of the third detecting component 221, the fourth detecting component 222 and the fifth detecting component 223 are adjusted by the longitudinal lifting device 138, the chips 180 can be covered and detection shooting without missing can be realized, but if the chips 180 to be detected are large, the third detecting component 221, the fourth detecting component 222 and the fifth detecting component 223 cannot realize single shooting.

The driving path of the first adjusting part 261 on the third platform region 192 is perpendicular to the driving path of the second adjusting part 262 on the third platform region 192, so that the first adjusting part 261 and the second adjusting part 262 are formed to drive the third detecting component 221, the fourth detecting component 222 or the fifth detecting component 223 to move on the third platform region 192, and further the third detecting component 221, the fourth detecting component 222 or the fifth detecting component 223 can perform region shooting on the chip 180 on the detecting turntable 200, and after the images shot by multiple additional regions are spliced by a processing system, a complete shot image is formed, and the applicability of detection on chips 180 with different specifications is improved.

The first adjustment part 261 and the second adjustment part 262 may adopt a linear actuator or an air cylinder to drive the third detection assembly 221, the fourth detection assembly 222 or the fifth detection assembly 223 to perform a linear reciprocating motion on the third platform region 192.

When the third detection element 221, the fourth detection element 222, and the fifth detection element 223 perform area division shooting on the chip 180, for example, the chip 180 is equally divided into nine areas, and images shot by the nine areas are respectively spliced to obtain a shot image of the entire area of the chip 180, but since there is no fixed characteristic point on the chip 180 at most, that is, taking the fifth detection element 223 as an example, in the process of moving a shot area of the fifth detection element 223 to an adjacent next area on the chip 180 through the first adjustment part 261 and the second adjustment part 262 after shooting a certain area on the chip 180, there is no characteristic point or a boundary reference in the shot area, at this time, it cannot be known that there is a displacement amount generated by the fifth detection element 223 by driving the first adjustment part 261 and the second adjustment part 262, since the first adjustment part 261 and the second adjustment part 262 are both mechanical transmission parts, there is a large relative error in comparison with the optical accuracy of the fifth detection element 223, and the adjustment cost of the adjustment part 261 and the second adjustment part 263 is increased, and the adjustment part is also included in order to solve the problem of adjusting the adjustment cost of the optical grating element 260.

The grating scale assembly 263 comprises a scanning head 264 and a grating scale main body 265, the scanning head 264 is clamped on the grating scale main body 265 and moves along the length extending direction of the grating scale, taking the fifth detection assembly 223 as an example, when the first adjusting part 261 drives the fifth detection assembly 223 to reciprocate, the scanning head 264 and the fifth detection assembly 223 are connected and move synchronously, the scanning head 264 moves on the grating scale main body 265 and converts the linear displacement into a pulse through an optical signal, so that a more accurate displacement distance of the fifth detection assembly 223 is obtained, reference in the moving process of the fifth detection assembly 223 is realized according to the displacement distance, and the shooting precision is improved.

Because the first detection assembly 115 and the second detection assembly 116 are arranged on the second transfer mechanism 114 erected on the third track 103, and meanwhile, the third detection assembly 221, the fourth detection assembly 222 and the fifth detection assembly 223 are arranged on one side of the detection turntable 200, and correspondingly, the total time of the third detection assembly 221, the fourth detection assembly 222 and the fifth detection assembly 223 for detecting the chip 180 is longer than the total time of the first detection assembly 115 and the second detection assembly 116 for detecting, that is, the detection speed of the chip 180 at the second transfer mechanism 114 is higher than the detection speed on the detection turntable 200, then the chip 180 detected by the first detection assembly 115 and the second detection assembly 116 will be detained before the detection turntable 200, that is, more chips 180 are left on the third track 103, a certain potential safety hazard exists, and the progress of the detection operation on the detection turntable 200 is interrupted.

In order to improve the matching degree of the detection beat of the whole detection system under different detection positions, the detection system is also provided with a second group of first turntable detection areas, a sixth track 106, a seventh track 107 and an eighth track 108.

The first turntable detection area and the second group of first turntable detection area are symmetrically arranged, and the structures and relative position relations of the detection turntable 200, the blanking mechanism 210, the third detection assembly 221, the fourth detection assembly 222 and the fifth detection assembly 223 in the second group of first turntable detection area are the same as those of the first turntable detection area.

One end of the fifth track 105 extends into the second group of first carousel detection areas, when the tray 170 filled with the chips 180 on the third track 103 moves to the lower part of the third transfer track 121 on the second transversal frame 120, the tray 170 is grabbed by the tray grabbing component 135 on the third transfer mechanism 122, and is driven by the displacement component 130 on the third transfer mechanism 122, the tray 170 moves to the upper part of the fifth track 105, is then lowered onto the fifth track 105, and moves into the second group of first carousel detection areas under the drive of the displacement component 130 on the fifth track 105 to perform chip-by-chip 180 detection.

The sixth track 106 is arranged in parallel with the fourth track 104, the first track 101 is used for loading empty trays 170, the empty trays 170 are conveyed to the third track 103 under the driving of the tray grabbing assemblies 135 and the displacement assemblies 130 on the second transfer mechanism 114, the control trays 170 are moved to the lower part of the third transfer track 121 on the third track 103, the control trays 170 are conveyed to the sixth track 106 under the driving of the tray grabbing assemblies 135 and the displacement assemblies 130 on the third transfer mechanism 122, the control trays 170 are moved to the blanking mechanisms 210 in the second group of first tray detection areas under the driving of the displacement assemblies 130 on the sixth track 106, and the blanking mechanisms 210 in the areas wait for the chips 180 to be grabbed into the empty trays 170 on the sixth track 106 one by one.

After the inspected chips 180 are loaded on the tray 170 on the sixth track 106, the tray 170 loaded with the inspected chips 180 is moved to the lower portion of the moving path of the first transfer mechanism 112 by the driving of the moving unit 130 on the sixth track 106.

The seventh rail 107 is arranged in parallel with the sixth rail 106, the empty tray 170 conveyed from the first rail 101 through the second transfer mechanism 114 is placed on the seventh rail 107, the empty tray 170 moves to the position below the moving path of the first transfer mechanism 112 under the driving of the displacement assembly 130 on the seventh rail 107, at this time, a part of NG pieces and a part of OK pieces exist on the tray 170 loaded with the detected chips 180 on the sixth rail 106 and the position below the moving path of the first transfer mechanism 112, wherein the NG pieces are grabbed by the chip grabbing assembly 131 of the first transfer mechanism 112 and move together with the displacement assembly 130 of the first transfer mechanism 112 to the empty tray 170 on the seventh rail 107, so that the detected chips 180 are removed one by one onto the empty tray 170, and when the empty tray 170 on the seventh rail 107 is filled with NG pieces, a new empty tray 170 is cyclically used for loading with NG pieces for subsequent processing of NG pieces.

Furthermore, tray placing devices can be respectively arranged at one end of the second rail 102 and one end of the seventh rail 107, and when the empty tray 170 is filled with NG pieces, the empty tray 170 is stacked by the tray placing devices, so that the tray 170 filled with NG pieces can be conveniently stacked and then subjected to centralized processing, and the processing efficiency is improved.

To clearly illustrate the stacking process of a plurality of trays 170 filled with NG pieces, the process of stacking a plurality of trays 170 filled with NG pieces is expanded by the processing process of one end of the second rail 102, when one tray 170 on the second rail 102 is filled with NG pieces, the displacement assembly 130 on the second rail 102 moves the tray 170 to the tray placement device until one side of the tray 170 contacts the position-limiting plate 141, at this time, the lifting rod 142 is driven to lift the tray 170 to the height corresponding to the support member 143, then the telescopic end 144 is driven to extend into the support groove 171 of the tray 170, after the lifting rod 142 descends, the tray 170 filled with NG pieces is moved to the tray placement device by the displacement assembly 130 on the second rail 102 again, and is lifted by the lifting rod 142 again, until after two trays 170 are stacked, the telescopic end 144 of the support member 143 is separated from the tray 170, then the lifting rod 142 lifts the tray 170 again until the support member 171 on the tray 170 on the lower tray 170 corresponds to the telescopic end 144 of the support member 143, and the telescopic end 144 is driven to extend into the support member 170 on the lower tray 170 again, and the holding tray 171 is lifted, and the tray 170 is stacked together with the tray 170, and the holding tray 170 is loaded with NG pieces, and the tray 170 is repeatedly stacked.

The eighth track 108 and the seventh track 107 are arranged in parallel, the eighth track 108 is used for placing the tray 170 with the NG pieces removed on the sixth track 106 through the third transfer mechanism 122, only the OK pieces are left on the tray 170, and the OK pieces in the tray 170 shifted to the eighth track 108 are used for filling the chips 180 which are next in the tray 170 with the NG pieces removed and are located on the sixth track 106, so that after the NG pieces are removed from the chips 180 on the subsequent tray 170, the OK pieces can be used for filling, the tray 170 with the OK pieces filled in the whole tray is obtained on the sixth track 106, and the subsequent operation is facilitated.

It should be noted that the feeding process, the detecting process and the discharging process in the second set of first turntable detecting areas are the same as those in the first turntable detecting areas.

Carry out the interoperation through two sets of first carousel detection areas, evenly transport the charging tray 170 that loads chip 180 on the third track 103 and carry out simultaneous detection processing in two sets of first carousel detection areas, improve detection efficiency to improve detection speed and detect the beat with the transportation on the multitrack and cooperate through two sets of detection carousels 200, avoid appearing the part and detect the position or transport the position and have wait for or the phenomenon of detaining.

Claims

1. A sorting method for chip detection, comprising:

and the first transfer mechanism grabs the NG pieces in the material tray on the fourth track, moves and places the NG pieces on the empty material tray on the second track, then the first transfer mechanism grabs the OK pieces in the material tray on the fifth track, and moves the OK pieces to positions of chips which are emptied out due to the elimination of the NG pieces in the material tray on the fourth track until the material tray on the fourth track is full of the OK pieces.

2. The sorting method for chip inspection according to claim 1, wherein: when all OK parts in the material tray on the fifth track are supplemented into the vacant positions of the NG parts in the subsequent material trays after the NG parts are removed, the material tray on the fifth track moves to the first track again and is used as a new vacant material tray.

3. A sorting apparatus for chip inspection for performing the sorting method for chip inspection according to claims 1-2, comprising:

4. The sorting apparatus for chip inspection according to claim 3, wherein: the length extending direction of the first transverse frame body is perpendicular to the length extending direction of the first track.

5. The sorting apparatus for chip inspection according to claim 3, wherein: the two ends of the first rail, the second rail, the third rail, the fourth rail and the fifth rail respectively extend to the two sides of the first transverse frame body.

6. The sorting apparatus for chip inspection according to claim 3, wherein: the displacement assembly comprises a driving motor, a gear is arranged on an output shaft of the driving motor, and the first transfer track and the second transfer track are provided with convex teeth which are used for being meshed with the gear.

7. The sorting apparatus for chip inspection according to claim 3, wherein: the chip grabbing assembly comprises a sucker, the two ends of the sucker are communicated with each other, one end of the sucker is connected with a piston used for vacuumizing, and the other end of the sucker is used for sucking the chip.

8. The sorting apparatus for chip inspection according to claim 7, wherein: and a buffer piece is arranged at one end of the sucker, which is far away from the piston.

9. The sorting apparatus for chip inspection according to claim 3, wherein: the charging tray grabbing component comprises two clamping plates which are used for extending to two sides of the charging tray, a push-pull component is arranged between the two clamping plates, and the push-pull component is used for driving the two clamping plates to be close to or far away from each other.

10. The sorting apparatus for chip inspection according to claim 3, wherein: the first track, the second track, the third track, the fourth track and the fifth track are equipped with respectively and put a set mechanism in keeping away from one side that the chip detected the position, it includes to put a set mechanism: the tray comprises a jacking rod and a supporting component, one end of the jacking rod extends to the position below the tray, a push-pull component used for driving the jacking rod to lift is installed at the other end of the jacking rod, the supporting component is installed on two sides of the tray, a supporting groove is formed in the bottom of the tray, and the supporting component is provided with a telescopic end capable of extending into the supporting groove and supporting the tray.