CN115241104A - Deviation rectifying structure and chip component production and conveying equipment - Google Patents
Deviation rectifying structure and chip component production and conveying equipment Download PDFInfo
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- CN115241104A CN115241104A CN202210823883.0A CN202210823883A CN115241104A CN 115241104 A CN115241104 A CN 115241104A CN 202210823883 A CN202210823883 A CN 202210823883A CN 115241104 A CN115241104 A CN 115241104A
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- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 230000005540 biological transmission Effects 0.000 claims abstract description 38
- 208000032369 Primary transmission Diseases 0.000 claims abstract description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 19
- 239000010703 silicon Substances 0.000 claims abstract description 19
- 208000032370 Secondary transmission Diseases 0.000 claims abstract description 18
- 238000009434 installation Methods 0.000 claims abstract description 13
- 238000001179 sorption measurement Methods 0.000 claims description 14
- 238000012545 processing Methods 0.000 claims description 6
- 210000003437 trachea Anatomy 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims description 3
- 230000005693 optoelectronics Effects 0.000 abstract description 6
- 230000009471 action Effects 0.000 abstract description 3
- 230000001360 synchronised effect Effects 0.000 abstract description 2
- 238000012937 correction Methods 0.000 description 9
- 239000000306 component Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the related technical field of optoelectronic devices, in particular to a deviation rectifying structure which comprises an installation platform, a primary transmission structure, a secondary transmission structure, a primary deviation rectifying part, a secondary deviation rectifying part and a plate taking and clamping assembly, wherein the installation platform is a rectangular platform, a mounting seat of the installation platform is provided with rectangular grooves, and the rectangular grooves are arranged in two groups in a cross shape; through setting up by the mount table, the one-level transmission structure, the second grade transmission structure, the one-level piece of rectifying, the second grade rectifies the structure of rectifying that the piece and get the combination of board centre gripping subassembly and constitute, and through with the one-level transmission structure, the second grade transmission structure all sets up to constitute by drive screw and bevel gear combination, and set up opposite direction's one-level lead screw thread and second grade lead screw thread respectively at drive screw's both ends, thereby can drive both sides through it and rectify a reverse motion, and realize the one-level piece of rectifying through bevel gear, the synchronous motion of the piece is rectified to the second grade, thereby through the one-level piece of rectifying, the combined action of the piece is rectified to the second grade, in order to realize the counterpoint of rectifying to the silicon chip.
Description
Technical Field
The invention relates to the related technical field of optoelectronic devices, in particular to a deviation rectifying structure and chip component production and conveying equipment.
Background
The photoelectronic device is various functional devices made by utilizing the electricity-photon conversion effect, the design principle of the photoelectronic device is based on the change of the external field to the propagation mode of guided wave light, and the photoelectronic device is also different from the early-stage photoelectric devices which are used by people; the optoelectronic device is a key and core component of the optoelectronic technology, is the leading research field of modern optoelectronic technology and microelectronic technology, and is an important component of information technology;
the main basic structure of the optoelectronic device is a silicon wafer, when the traditional sliced silicon wafer is conveyed to a processing platform, the sliced silicon wafer is clamped and moved to the processing platform from a material platform by adopting a clamping structure, and the silicon wafer is easy to deviate in the positioning process when the sliced silicon wafer is conveyed to the material platform by a conveying belt, so that a clamping device has a certain position deviation on the clamping position of the clamping device, and the subsequent processing precision of the clamping device is influenced.
Disclosure of Invention
The invention aims to provide a deviation rectifying structure and chip component production and conveying equipment to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a deviation rectification structure, comprising:
the mounting platform is a rectangular platform, rectangular grooves are formed in mounting bases of the mounting platform, the rectangular grooves are arranged in two groups in a cross shape, a primary mounting base and a secondary mounting base are arranged on the upper surface of the mounting platform, the primary mounting base and the secondary mounting base are symmetrically arranged in one group, a primary guide rod is arranged between the primary mounting bases, a secondary guide rod is arranged between the secondary mounting bases, a connecting rod is arranged on the upper surface of the mounting platform, the top end of the connecting rod is connected with a connecting plate, and the connecting plate is connected with a mechanical arm on processing equipment;
the primary transmission structure is arranged on the primary mounting seat;
the secondary transmission structure is arranged on the secondary mounting seat;
the primary deviation correcting part is driven by a primary transmission structure;
the secondary deviation correcting part is driven by a secondary transmission structure, and a guide rod hole and a screw hole are formed in the primary deviation correcting part and the secondary deviation correcting part;
get board centre gripping subassembly, the lower surface mounting of mount table has flexible electric jar, get board centre gripping subassembly and install the telescopic link tip at flexible electric jar, and the silicon chip is got through getting board centre gripping subassembly and getting the clamp.
Preferably, the primary transmission structure and the secondary transmission structure are formed by combining a transmission screw rod and a bevel gear, the transmission screw rods on the primary transmission structure and the secondary transmission structure are respectively rotatably installed on the primary installation seat and the secondary installation seat, and the bevel gears on the primary transmission structure and the secondary transmission structure are meshed with each other.
Preferably, driven gear is installed to the one end of the last transmission lead screw of one-level drive structure, install the motor support on the lateral wall of one-level mount pad, fixed mounting has servo motor on the motor support, install drive gear on servo motor's the rotor, set up for meshing mutually between driven gear and the drive gear.
Preferably, one-level lead screw thread and second grade lead screw thread have been seted up respectively at drive screw's both ends, one-level lead screw thread and second grade lead screw thread set up opposite direction, and one-level piece, the equal symmetry of second grade piece of rectifying is provided with a set ofly, and for the symmetry setting between the one-level piece, the second grade of rectifying of organizing, just the one-level piece, the second grade of rectifying of organizing are located the one-level lead screw thread and the position of second grade lead screw thread at drive screw both ends respectively and set up.
Preferably, the one-level deviation correcting part and the second-level deviation correcting part penetrate through the rectangular groove to be arranged, the lower ends of the one-level deviation correcting part and the second-level deviation correcting part are provided with push plates, and the one-level guide rod, the second-level guide rod, the one-level transmission structure and the second-level transmission structure are arranged in a staggered mode.
Preferably, get board centre gripping subassembly and constitute by absorption seat, piezo-resistor, reset spring, fly leaf, bracing piece, backup pad, elastic support piece and footstock combination, the absorption seat is the body structure that a top was sealed, and reserves on the absorption seat has trachea connector and trough, piezo-resistor carries out electric signal connection through the PLC control module on wire and the equipment, the trachea connector is connected with air extraction equipment through the trachea.
Preferably, the piezo-resistor sets up on the roof of adsorbing the seat, the fly leaf activity sets up among the inner chamber of adsorbing the seat, and the fly leaf is connected with the roof of adsorbing the seat through reset spring, the bracing piece is connected with the side on the fly leaf, the backup pad is connected with the upper end of bracing piece, elastic support spare and backup pad fixed connection, the lower fixed surface of roof and fly leaf is connected, the open slot has been seted up to the plate body border position of fly leaf, and the side of fly leaf and the inboard wall of adsorbing the seat lean on to set up mutually.
Preferably, the lower terminal surface of absorption seat is provided with rubber seal ring, the lower surface of footstock is provided with the elasticity rubber slab.
Preferably, the lower surface of the elastic rubber plate is lower than the lower surface of the rubber sealing ring, when the return spring is in the return state, the elastic support part of the return spring is not in contact with the piezoresistor, and when the elastic rubber plate is stressed, the elastic support part of the return spring is abutted to the piezoresistor.
A chip component production conveying device is provided with the deviation rectifying structure.
Compared with the prior art, the invention has the beneficial effects that:
1. the silicon wafer correcting device is provided with a correcting structure formed by combining an installation table, a primary transmission structure, a secondary transmission structure, a primary correcting part, a secondary correcting part and a plate taking and clamping assembly, the primary transmission structure and the secondary transmission structure are formed by combining a transmission screw and a bevel gear, and a primary screw thread and a secondary screw thread which are opposite in direction are respectively arranged at two ends of the transmission screw, so that the correcting parts at two sides can be driven to move reversely through the correcting structure, the synchronous movement of the primary correcting part and the secondary correcting part is realized through the bevel gear, and the correcting and aligning of the silicon wafer are realized through the combined action of the primary correcting part and the secondary correcting part;
2. and constitute by adsorption seat, piezo-resistor, reset spring, fly leaf, bracing piece, backup pad, elastic support piece and footstock combination through setting to getting board centre gripping subassembly to press from both sides the silicon chip through the form of negative pressure and get, it compares in traditional direct centre gripping structure, and it can be better protects the silicon chip.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of the position distribution of the primary transmission structure and the secondary transmission structure of the present invention;
FIG. 3 is a schematic view of a primary rectifying member structure according to the present invention;
FIG. 4 is a schematic view of a primary drive configuration of the present invention;
FIG. 5 is a half cross-sectional view of the plate removal clamping assembly of the present invention;
FIG. 6 is an enlarged view of the structure at A in FIG. 5;
fig. 7 is a diagram illustrating the effect of the present invention in practice.
In the figure: the device comprises an installation table 1, a primary transmission structure 2, a secondary transmission structure 3, a primary deviation correcting part 4, a secondary deviation correcting part 5, a plate taking and clamping assembly 6, a rectangular groove 7, a primary installation seat 8, a secondary installation seat 9, a primary guide rod 10, a secondary guide rod 11, a telescopic electric cylinder 12, a connecting rod 13, a connecting plate 14, a push plate 15, a guide rod hole 16, a screw rod hole 17, a transmission screw rod 18, a bevel gear 19, a driven gear 20, a primary screw rod thread 21, a secondary screw rod thread 22, a motor support 23, a servo motor 24, an adsorption seat 25, a piezoresistor 26, a return spring 27, a movable plate 28, a support rod 29, a support plate 30, an elastic support member 31, a top seat 32, an air pipe connector 33, a wiring groove 34, a lead 35, a rubber sealing ring 36, an elastic rubber plate 37 and a silicon wafer 38.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to make the objects, technical solutions and advantages of the present invention clear and fully described, embodiments of the present invention are further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are illustrative of some, but not all, embodiments of the invention and are not to be construed as limiting the scope of the invention, as those skilled in the art will recognize and appreciate that many other embodiments can be made without inventive faculty.
In the description of the present invention, it should be noted that the terms "center", "middle", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "a," "an," "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
For the purposes of simplicity and explanation, the principles of the embodiments are described by referring mainly to examples. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. It will be apparent, however, to one skilled in the art that the embodiments may be practiced without these specific details. In some instances, well-known methods and structures have not been described in detail so as not to unnecessarily obscure the embodiments. In addition, all embodiments may be used in combination with each other.
Example one
Referring to fig. 1-7, the present invention provides a technical solution: the utility model provides a structure of rectifying, the structure of rectifying includes mount table 1, one-level transmission structure 2, second grade transmission structure 3, one-level piece 4 of rectifying, second grade piece 5 of rectifying, get board centre gripping subassembly 6, mount table 1 is the rectangle platform, rectangular channel 7 has been seted up on its mount table, rectangular channel 7 is the cross and is provided with two sets ofly, and the upper surface of mount table 1 is provided with one-level mount table 8 and second grade mount table 9, one-level mount table 8 and second grade mount table 9 all symmetry are provided with a set ofly, and be provided with one-level guide arm 10 between the one-level mount table 8, be provided with second grade guide arm 11 between the second grade mount table 9, the upper surface of mount table 1 is provided with connecting rod 13, the top of connecting rod 13 is connected with connecting plate 14, connecting plate 14 is connected with the arm on the processing equipment, one-level transmission structure 2 sets up on one-level mount table 8, second grade transmission structure 3 sets up on second grade mount table 9, one-level piece 4 of rectifying drives through one-level transmission structure 2, second grade piece 5 drives through second grade transmission structure 3, and one-level piece 4, and the lower surface of second grade piece 5 has all seted up guide rod hole 17 and has the wire hole 12 of the lower surface of the clamp of fixing of the centre gripping subassembly of rectifying and has installed at the clamp and has the flexible clamp of the telescopic link of the clamp 6, and has carried out telescopic link of the telescopic link 38 of getting.
The primary transmission structure 2 and the secondary transmission structure 3 are formed by combining a transmission screw 18 and a bevel gear 19, the transmission screw 18 on the primary transmission structure 2 and the transmission screw 18 on the secondary transmission structure 3 are respectively rotatably installed on the primary installation seat 8 and the secondary installation seat 9, and the bevel gears 19 on the primary transmission structure 2 and the secondary transmission structure 3 are meshed with each other.
A driven gear 20 is installed at one end of a transmission screw 18 on the primary transmission structure 2, a motor support 23 is installed on the outer side wall of the primary mounting seat 8, a servo motor 24 is fixedly installed on the motor support 23, a transmission gear is installed on a rotor of the servo motor 24, and the driven gear 20 and the transmission gear are meshed.
One-level lead screw thread 21 and second grade lead screw thread 22 have been seted up respectively to drive screw 18's both ends, one-level lead screw thread 21 and second grade lead screw thread 22 set up opposite direction, and one-level piece 4, the equal symmetry of second grade piece 5 of rectifying is provided with a set ofly, and the one-level piece 4 of rectifying of the same group, be the symmetry setting between the second grade piece 5 of rectifying, and the one-level piece 4 of rectifying of the same group, the position that second grade piece 5 of rectifying is located one-level lead screw thread 21 and second grade lead screw thread 22 at drive screw 18 both ends respectively sets up.
The one-level piece 4, the second grade piece 5 of rectifying all pass rectangular channel 7 and set up, and the one-level piece 4, the second grade piece 5 of rectifying all are provided with push pedal 15, and are the dislocation set between one-level guide arm 10, second grade guide arm 11, one-level transmission structure 2, the second grade transmission structure 3.
The working principle is as follows: the silicon wafer 38 is corrected and aligned through the combined action of the first-stage correction part 4 and the second-stage correction part 5 under the driving of the servo motor 24, the first-stage transmission structure 2 and the second-stage correction transmission structure 3 are driven to drive the first-stage transmission structure 2 and the second-stage correction transmission structure 3, the first-stage correction part 4 and the second-stage correction part 5 move synchronously, and the silicon wafer 38 is pushed to a specified position under the driving of the servo motor 24 during actual use, so that the first-stage transmission structure 2 and the second-stage correction transmission structure 3 are driven to drive the first-stage correction part 4 and the second-stage correction part 5 to move in a closing manner, and the silicon wafer 38 is pushed to the specified position, so that the silicon wafer 38 can be corrected.
Example two
On the basis of the first embodiment, the plate taking and clamping assembly 6 is formed by combining an adsorption seat 25, a piezoresistor 26, a return spring 27, a movable plate 28, a support rod 29, a support plate 30, an elastic support member 31 and a top seat 32, the adsorption seat 25 is a pipe body structure with a sealed top, a gas pipe connector 33 and a wiring groove 34 are reserved on the adsorption seat 25, the piezoresistor 26 is in electrical signal connection with a PLC control module on equipment through a wire 35, and the gas pipe connector 33 is connected with air extraction equipment through a gas pipe.
The piezoresistor 26 is arranged on the top wall of the adsorption seat 25, the movable plate 28 is movably arranged in the inner cavity of the adsorption seat 25, the movable plate 28 is connected with the top wall of the adsorption seat 25 through a return spring 27, the support rod 29 is connected with the upper side surface of the movable plate 28, the support plate 30 is connected with the upper end of the support rod 29, the elastic support member 31 is fixedly connected with the support plate 30, the top seat 32 is fixedly connected with the lower surface of the movable plate 28, an open slot is formed in the edge position of the plate body of the movable plate 28, and the side edge of the movable plate 28 is arranged in a manner of being close to the inner side wall of the adsorption seat 25.
The lower end face of the adsorption seat 25 is provided with a rubber sealing ring 36, the lower surface of the top seat 32 is provided with an elastic rubber plate 37, the lower surface of the elastic rubber plate 37 is lower than the lower surface of the rubber sealing ring 36, when the reset spring 27 is in a reset state, the elastic support member 31 is not in contact with the piezoresistor 26, and when the elastic rubber plate 37 is stressed, the elastic support member 31 is in contact with the piezoresistor 26, the plate taking and clamping assembly 6 is formed by combining the adsorption seat 25, the piezoresistor 26, the reset spring 27, the movable plate 28, the support rod 29, the support plate 30, the elastic support member 31 and the top seat 32, so that the silicon wafer 38 is clamped through a negative pressure mode, and compared with a traditional direct clamping structure, the silicon wafer 38 can be better protected.
EXAMPLE III
On the basis of the second embodiment, the chip component production and conveying equipment is provided with the deviation rectifying structure.
Although the illustrative embodiments of the present application have been described above to enable those skilled in the art to understand the present application, the present application is not limited to the scope of the embodiments, and various modifications within the spirit and scope of the present application defined and determined by the appended claims will be apparent to those skilled in the art from this disclosure.
Claims (10)
1. A structure of rectifying, its characterized in that: the structure of rectifying includes:
the mounting platform comprises a mounting platform (1), wherein the mounting platform (1) is a rectangular platform, rectangular grooves (7) are formed in a mounting seat of the mounting platform, the rectangular grooves (7) are arranged in two groups in a cross shape, a primary mounting seat (8) and a secondary mounting seat (9) are arranged on the upper surface of the mounting platform (1), the primary mounting seat (8) and the secondary mounting seat (9) are symmetrically arranged in one group, a primary guide rod (10) is arranged between the primary mounting seats (8), a secondary guide rod (11) is arranged between the secondary mounting seats (9), a connecting rod (13) is arranged on the upper surface of the mounting platform (1), the top end of the connecting rod (13) is connected with a connecting plate (14), and the connecting plate (14) is connected with a mechanical arm on processing equipment;
the primary transmission structure (2), the primary transmission structure (2) is arranged on the primary mounting seat (8);
the secondary transmission structure (3) is arranged on the secondary mounting seat (9);
the primary deviation correcting piece (4), the primary deviation correcting piece (4) is driven by the primary transmission structure (2);
the secondary deviation correcting part (5) is driven by the secondary transmission structure (3), and a guide rod hole (16) and a screw hole (17) are formed in the primary deviation correcting part (4) and the secondary deviation correcting part (5);
get board centre gripping subassembly (6), the lower surface mounting of mount table (1) has flexible electric jar (12), get board centre gripping subassembly (6) and install the telescopic link tip at flexible electric jar (12), and silicon chip (38) are got through getting board centre gripping subassembly (6) and press from both sides.
2. The structure of claim 1, wherein: the primary transmission structure (2) and the secondary transmission structure (3) are formed by combining a transmission lead screw (18) and a bevel gear (19), the transmission lead screws (18) on the primary transmission structure (2) and the secondary transmission structure (3) are respectively rotatably installed on the primary installation seat (8) and the secondary installation seat (9), and the bevel gears (19) on the primary transmission structure (2) and the secondary transmission structure (3) are meshed with each other.
3. The deviation rectifying structure according to claim 2, wherein: driven gear (20) are installed to the one end of transmission lead screw (18) on one-level transmission structure (2), install motor support (23) on the lateral wall of one-level mount pad (8), fixed mounting has servo motor (24) on motor support (23), install drive gear on the rotor of servo motor (24), set up for meshing mutually between driven gear (20) and the drive gear.
4. A deviation rectifying structure according to claim 3, characterized in that: one-level lead screw thread (21) and second grade lead screw thread (22) have been seted up respectively to the both ends of drive screw (18), the one-level lead screw thread (21) and second grade lead screw thread (22) set up opposite direction, and one-level piece (4), the equal symmetry of second grade piece (5) of rectifying is provided with a set ofly, and rectifies for the symmetry setting between piece (5) with the one-level of group, second grade, and rectifies piece (4), second grade piece (5) and be located the position of one-level lead screw thread (21) and second grade lead screw thread (22) at drive screw (18) both ends respectively with the one-level of group and rectify.
5. The deviation rectifying structure according to claim 1, wherein: one-level piece (4), the second grade of rectifying a deviation (5) all pass rectangular channel (7) and set up, and the one-level piece (4), the lower extreme of rectifying a deviation (5) of second grade all are provided with push pedal (15), and are dislocation set between one-level guide arm (10), second grade guide arm (11), one-level transmission structure (2), second grade transmission structure (3).
6. The deviation rectifying structure according to claim 1, wherein: get board centre gripping subassembly (6) and constitute by adsorption seat (25), piezo-resistor (26), reset spring (27), fly leaf (28), bracing piece (29), backup pad (30), elastic support piece (31) and footstock (32) combination, adsorption seat (25) are the body structure that a top was sealed, and reserve on adsorption seat (25) and have trachea connector (33) and trough (34), piezo-resistor (26) carry out electric signal connection through wire (35) and the PLC control module on the equipment, trachea connector (33) are connected with air extraction equipment through the trachea.
7. The deviation rectifying structure according to claim 6, wherein: piezo-resistor (26) set up on the roof of adsorbing seat (25), fly leaf (28) activity sets up in the inner chamber of adsorbing seat (25), and fly leaf (28) are connected with the roof of adsorbing seat (25) through reset spring (27), the side is connected on bracing piece (29) and fly leaf (28), backup pad (30) are connected with the upper end of bracing piece (29), elastic support piece (31) and backup pad (30) fixed connection, the lower fixed surface of footstock (32) and fly leaf (28) is connected, the open slot has been seted up to the plate body border position of fly leaf (28), and the side of fly leaf (28) and the inboard wall of adsorbing seat (25) lean on to set up.
8. The deviation rectifying structure according to claim 7, wherein: the lower terminal surface of adsorbing seat (25) is provided with rubber seal ring (36), the lower surface of footstock (32) is provided with elasticity rubber slab (37).
9. The deviation rectifying structure according to claim 8, wherein: the lower surface of the elastic rubber plate (37) is lower than the lower surface of the rubber sealing ring (36), when the return spring (27) is in a return state, the elastic supporting piece (31) and the piezoresistor (26) are not contacted, and when the elastic rubber plate (37) is stressed, the elastic supporting piece (31) and the piezoresistor (26) are abutted.
10. A chip component production conveying equipment is characterized in that: the chip component production and conveying equipment is provided with the deviation rectifying structure of any one of the claims 1 to 9.
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| CN202210823883.0A CN115241104A (en) | 2022-07-13 | 2022-07-13 | Deviation rectifying structure and chip component production and conveying equipment |
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| CN202210823883.0A CN115241104A (en) | 2022-07-13 | 2022-07-13 | Deviation rectifying structure and chip component production and conveying equipment |
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| CN115241104A true CN115241104A (en) | 2022-10-25 |
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| CN115816302A (en) * | 2023-02-20 | 2023-03-21 | 淄博市技师学院(淄博市文化旅游学校) | Automatic workpiece positioning clamp for grinding machine |
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| CN116093009A (en) * | 2022-12-16 | 2023-05-09 | 苏州赛森电子科技有限公司 | Cleaning mechanism and silicon wafer decontamination machine |
| CN116276585A (en) * | 2022-12-12 | 2023-06-23 | 苏州赛森电子科技有限公司 | Positioning assembly and silicon wafer polishing machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115881424A (en) * | 2022-12-02 | 2023-03-31 | 常州市精特电工机械有限公司 | Winding structure for producing fine enameled wire |
| CN115881424B (en) * | 2022-12-02 | 2024-05-03 | 常州市精特电工机械有限公司 | Winding structure for production of fine enameled wire |
| CN116276585A (en) * | 2022-12-12 | 2023-06-23 | 苏州赛森电子科技有限公司 | Positioning assembly and silicon wafer polishing machine |
| CN116276585B (en) * | 2022-12-12 | 2024-01-30 | 苏州赛森电子科技有限公司 | Positioning assembly and silicon wafer polishing machine |
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| CN116913840A (en) * | 2023-09-13 | 2023-10-20 | 无锡市爱维丝科技有限公司 | Automatic solar cell arranging device |
| CN116913840B (en) * | 2023-09-13 | 2023-12-05 | 无锡市爱维丝科技有限公司 | Automatic solar cell arranging device |
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Application publication date: 20221025 |