CN115226303A

CN115226303A - Manufacturing method of packaging structure with electromagnetic shielding effect

Info

Publication number: CN115226303A
Application number: CN202110413575.6A
Authority: CN
Inventors: 陈盈儒; 杨景筌; 鞠彦章
Original assignee: Avary Holding Shenzhen Co Ltd; Qing Ding Precision Electronics Huaian Co Ltd
Current assignee: Avary Holding Shenzhen Co Ltd; Qing Ding Precision Electronics Huaian Co Ltd
Priority date: 2021-04-16
Filing date: 2021-04-16
Publication date: 2022-10-21
Also published as: TW202243188A; TWI767866B

Abstract

A manufacturing method of a packaging structure with electromagnetic shielding effect comprises the following steps: providing a circuit board, including a circuit substrate and at least one electronic component assembly arranged on the circuit substrate; providing at least one packaging body, wherein one side of each packaging body is inwards sunken to form a containing groove, and the containing groove is similar to the integral structure of the electronic component assembly; performing chemical plating on the inner wall of the containing groove of each packaging body to form a metal film on the inner wall of the containing groove; and fixing the packaging body provided with the metal film on the circuit board, wherein each electronic component assembly is accommodated in an accommodating groove of the packaging body provided with the metal film, so as to carry out packaging.

Description

Manufacturing method of packaging structure with electromagnetic shielding effect

Technical Field

The invention relates to the field of packaging, in particular to a manufacturing method of a packaging structure with an electromagnetic shielding effect.

Background

With the miniaturization of electronic products, the arrangement of components on the circuit board in the electronic products also tends to be high-density. In order to protect the components, prevent dust from polluting the components and reduce interference among the components, the components need to be packaged. The manufacturing process of the prior thermoplastic sealing technology comprises the following steps: after a PCB is subjected to Surface Mount Technology (SMT) component feeding, a Printed Circuit Board Assembly (PCBA) is manufactured, plastic packaging materials are filled in the upper surface of the PCBA to form a mold packaging layer (Molding), the mold packaging layer is solidified and then cut to form a SiP (System in Package) module, and other auxiliary films or substances do not exist on electronic components welded on the PCB any more. The electromagnetic shielding is generally achieved by attaching a metal cover to the plastic-encapsulated SiP module or forming a metal layer by sputtering, spraying, coating and the like. However, the way of attaching the metal cover is not favorable for the miniaturization of the package structure.

Disclosure of Invention

In view of the above, it is desirable to provide a method for manufacturing a package structure that solves the above problems.

A manufacturing method of a packaging structure with electromagnetic shielding effect comprises the following steps:

providing a circuit board which comprises a circuit substrate and at least one electronic component assembly arranged on the circuit substrate;

providing at least one packaging body, wherein one side of each packaging body is inwards sunken to form a containing groove, and the containing groove is in contour shape with the integral structure of the electronic component assembly;

forming a metal film on the inner wall of the accommodating groove; and

and fixing the packaging body provided with the metal film on the circuit board, wherein each electronic component assembly is accommodated in an accommodating groove of the packaging body provided with the metal film, so as to carry out packaging.

According to the manufacturing method of the packaging structure with the electromagnetic shielding effect, the packaging body provided with the accommodating groove which is copying to the overall structure of the electronic component assembly is provided, and then the metal film is formed on the inner wall of the accommodating groove, so that the formed metal film is favorably attached to the electronic component assembly to be packaged, and the electromagnetic shielding effect is favorably improved.

Drawings

Fig. 1 to 15 illustrate a method for manufacturing a package structure with an electromagnetic shielding effect according to an embodiment of the present invention.

Description of the main elements

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments and features of the embodiments described below can be combined with each other without conflict.

Referring to fig. 1 to fig. 6, a method for manufacturing a package structure with an electromagnetic shielding effect according to an embodiment of the present invention includes the following steps:

step S1, referring to fig. 1, a circuit board 10 is provided, wherein the circuit board 10 includes a circuit substrate 11 and at least one electronic component assembly 13 disposed on the circuit substrate 11.

In the present embodiment, the circuit board 10 includes a plurality of electronic component assemblies 13 arranged at intervals. In some embodiments, the circuit substrate 11 may further include an alignment mark region 15 in a spacing region between any two adjacent electronic component assemblies 13.

Each of the electronic component assemblies 13 includes at least one electronic component 131. In the present embodiment, each of the electronic component modules 13 includes a plurality of electronic components 131.

Step S2, referring to fig. 2, providing at least one package 30, wherein one side of each package 30 is recessed inward to form a receiving slot 301, wherein the receiving slot 301 is similar to an overall structure of the electronic component assembly 13, and a volume of the receiving slot 301 is greater than or equal to a volume of a space occupied by the electronic component assembly 13.

In the present embodiment, the package body 30 may be, but not limited to, a plastic material.

In step S3, referring to fig. 3, a metal film 32 is formed on the inner wall of the accommodating groove 301.

The metal film 32 can be formed by, but not limited to, electroless plating, evaporation, sputtering, vapor deposition, and the like. Preferably, the inner wall of the receiving groove 301 of each package 30 is chemically plated to form the metal film 32. The uniformity of the metal film 32 formed by the chemical plating is good, and the chemical plating does not affect the metal film formed at the corner of the inner wall of the accommodating groove 301, thereby being beneficial to improving the continuity of the metal film 32.

Step S4, referring to fig. 4, the package 30 with the metal film 32 is fixed to the circuit board 10, wherein each electronic component assembly 13 is accommodated in an accommodating groove 301 of the package 30 with the metal film 32, so as to obtain the package structure 100.

If the circuit board 10 includes a plurality of electronic component assemblies 13 arranged at intervals, when the packages 30 are fixed corresponding to the electronic component assemblies 13, the alignment mark sections 15 are exposed between two adjacent packages 30.

In some embodiments, referring to fig. 4 and 5, the package 30 with the metal film 32 may be fixed to the circuit board 10 by gluing. Specifically, glue 51 is disposed at a joint between the circuit board substrate 11 and the package 30, so as to fix the package 30 and the circuit board 10.

In some embodiments, referring to fig. 5, before the package 30 with the metal film 32 is fixed to the circuit board 10, a gap between the electronic component assembly 13 and the circuit substrate 11 may be filled with glue 53, so as to further strengthen the structural stability of the electronic component assembly 13. Preferably, the height of the glue in the gap in the electronic component assembly 13 does not exceed the electronic component 131 with the lowest height in the electronic component assembly 13.

In some embodiments, after step S4, the method for manufacturing the package structure may further include step S5, referring to fig. 6, cutting the circuit substrate 11 along the alignment mark region 15 on the circuit board 10 in the package structure 100, so as to divide the package structure into a plurality of package structures 100a.

The manufacturing method of the packaging structure with the electromagnetic shielding effect, provided with the packaging body 30 of the accommodating groove 301 copying with the overall structure of the electronic component assembly 13, then the inner wall of the accommodating groove 301 is formed with the metal film 32 which has good uniformity, is not influenced by the wall body shape and has continuity in a chemical plating mode, thereby being beneficial to improving the subsequent electromagnetic shielding effect. Meanwhile, the porosity of the electroless-plated metal film 32 is smaller than that of the plating layer formed by electroplating, and at the same time, has good corrosion resistance and wear resistance. Furthermore, the chemical plating method is not limited to the material of the package 30. Furthermore, providing the package 30 having the receiving groove 301 that is similar to the overall structure of the electronic component assembly 13 is advantageous in adhering the shape of the formed metal film 32 to the shape of the electronic component assembly 13 to be packaged, and thus in improving the electromagnetic shielding effect.

In some embodiments, the package body 30 can be formed by, but not limited to, injection molding, and the specific steps are as follows:

step S21, please refer to fig. 7, providing an injection mold 20, wherein the injection mold 20 includes a male mold 21 and a female mold 23. The male mold 21 and the female mold 23 cooperate to form an injection molding cavity 25. The region of the female mold 23 facing the injection mold cavity 25 and the male mold 21 is provided with a protrusion 230 that is contoured to the overall structure of the electronic component assembly 13, and the protrusion 230 extends toward the male mold 21.

The injection mold 20 is provided with an entrance port 27, and the entrance port 27 is communicated with the injection molding cavity 25 and the outside and used for injecting molding materials into the injection molding cavity 25 through the entrance port 27.

Specifically, in the present embodiment, one side of the female mold 23 is recessed inward to form a receiving groove 231, and a protrusion 230 is disposed on a bottom wall of the receiving groove 231. The protruding portion 230 is formed to be similar to the whole structure of the electronic component assembly 23, and the height of the protruding portion 230 is smaller than the depth of the accommodating cavity 231. The entrance port 27 is disposed on the mother die 23 and communicates with the accommodating groove 231.

The male mold 21 is provided with one side of the female mold 23 provided with the accommodating groove 231, so that the accommodating groove 231 correspondingly forms the injection molding cavity 25.

In some embodiments, the structures of the male mold 21 and the female mold 23 are not limited to the above description, and it is only necessary to ensure that the female mold 23 includes the protrusion 230 corresponding to the injection molding cavity 25, which is similar to the integral structure of the electronic component assembly 23.

Step S22, referring to fig. 8 and fig. 2, injecting a molding material into the injection molding cavity 25 through the incident port 27, and demolding after molding to obtain the package 30. The package 30 has a receiving groove 301 corresponding to the protrusion 230 and following the overall structure of the electronic component assembly 13.

In some embodiments, referring to fig. 9, the step S22 may further include cutting off a waste region formed corresponding to the entrance port 27 after the demolding. It will be appreciated that the scrap may be removed by grinding when the scrap zone is relatively short.

The method of manufacturing the package 30 is simple.

In some embodiments, the electroless plating on the inner wall of the receiving groove 301 of the package 30 to form the metal film 32 may be achieved by, but is not limited to, the following steps:

step S31, please refer to fig. 10 and 11, providing a carrying mold 40, where the carrying mold 40 includes a supporting plate 41 and a limiting plate 43 detachably disposed on a surface of the supporting plate 41. The position-limiting plate 43 is formed with at least one through-going position-limiting groove 430, and the supporting plate 41 is partially exposed from the position-limiting plate 43.

In some embodiments, the supporting plate 41 may be provided with a positioning member 410, the limiting plate 43 may be provided with a positioning hole 430, and the supporting plate 41 and the limiting plate 43 are fixed by the cooperation of the positioning member 410 and the positioning hole 430.

Step S32, please refer to fig. 11, to accommodate each of the package bodies 30 in one of the limiting grooves 430, wherein the side of the package body 30 having the accommodating groove 301 is away from the supporting plate 41.

In this embodiment, the limiting groove 430 can just receive the package 30. In some embodiments, the limiting groove 430 may also be slightly larger than the package body 30.

In step S33, referring to fig. 12, chemical plating is performed on the inner wall of the accommodating groove 301 of the package body 30 disposed in the limiting groove 430 to form a metal film 32 on the inner wall of the accommodating groove 301.

Step S34, referring to fig. 13, a side of the limiting plate 43 away from the supporting plate 41 is covered with an adhesive tape 61, wherein the adhesive tape 61 adheres the limiting plate 43 and the package 30 in the limiting groove 430.

In step S35, please refer to fig. 14, the carrying mold 40 with the adhesive tape 61 is turned upside down, and the supporting plate 41 is removed to expose the package 30 with the metal film 32.

Step S36, please refer to fig. 15 and fig. 3, the package 30 is sucked out of the limiting groove 430 by an adsorption manner, so as to obtain the package 30 with the metal film 32.

Specifically, the adsorbing member 63 is adsorbed on a side of the package 30 away from the adhesive tape 61, and the package 30 is taken out from the limiting groove 430.

The method of taking out the package 30 from the steps S34 to S36 is advantageous to avoid damaging the metal film 32 when the package 30 is taken out from the limiting groove 430.

In some embodiments, steps S34 to S36 may be omitted, and the package body 30 may be taken out of the limiting groove 430 by other methods.

Specifically, the electroless plating for forming the metal film 32 includes the steps of:

first, the package 30 is subjected to a pretreatment such as degreasing, etching, cleaning, or the like, thereby improving the surface roughness, cleanliness, hydrophilicity, or the like of the inner wall of the housing groove 301 of the package 30.

Secondly, the inner wall of the accommodating groove 301 of the package 30 after the pretreatment is sensitized to form a reducing liquid film with reducing effect.

In some embodiments, the package 30 is generally disposed in a sensitizing solution (such as, but not limited to, a mixed solution of a stannous chloride solution and a hydrochloric acid solution).

Third, the inner wall of the housing groove 301 of the sensitized package 30 is activated.

In some embodiments, palladium chloride may be used as an activator, and palladium ions are reductively deposited to the inner wall by tin in the reducing liquid film to form an activation center.

Fourthly, the sensitized package 30 is placed in an electroless plating solution, so that a nano-scale metal is deposited on the inner wall of the accommodating groove 301 to form the metal film 32.

Fifthly, the package 30 with the metal film 32 is cleaned and heat treated to reduce the brittleness of the plating layer and the package.

Although the present invention has been described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present invention.

Claims

1. A manufacturing method of a packaging structure with electromagnetic shielding effect comprises the following steps:

forming a metal film on the inner wall of the accommodating groove; and

2. The method of claim 1, wherein a glue is disposed at a connection between the circuit substrate and the package body to fix the package body and the circuit board.

3. The method for manufacturing a package structure having an electromagnetic shielding effect according to claim 1, wherein a gap exists between the electronic component assembly and the circuit substrate, and the method for manufacturing a package structure further comprises filling a glue into the gap between the electronic component assembly and the circuit substrate before the fixing of the electronic component assembly provided with the metal film to the circuit board.

4. The method of manufacturing a package structure with electromagnetic shielding effect according to claim 3, wherein the electronic component assembly includes a plurality of electronic components, and a height of the glue in the gap between the electronic component assembly and the circuit substrate does not exceed a height of a lowest electronic component in the electronic component assembly.

5. The method of claim 1, wherein the circuit board includes a plurality of electronic component assemblies spaced apart from each other, the circuit board further includes an alignment mark region in a spacing region between any two adjacent electronic component assemblies, and the alignment mark region is exposed between two adjacent packages when the circuit board is fixed to the circuit board.

6. The method for manufacturing a package structure with electromagnetic shielding effect as claimed in claim 5, further comprising:

and cutting the circuit board along the alignment mark region exposed between two adjacent packaging bodies so as to divide the circuit board into a plurality of packaging structures.

7. The method for manufacturing a package structure with electromagnetic shielding effect as claimed in claim 1, wherein the package body is manufactured by the following method:

providing an injection mold, wherein the injection mold comprises a male mold and a female mold, the male mold and the female mold are matched to form an injection molding cavity, a protruding part which is copying with the integral structure of the electronic component assembly is arranged in the region of the female mold facing the injection molding cavity and the male mold, and the protruding part extends towards the male mold; and

and injecting a molding material into the injection molding cavity, and obtaining the packaging body after molding and demolding, wherein the packaging body corresponds to the bulge part to form the accommodating groove which is copying with the overall structure of the electronic component assembly.

8. The method for manufacturing a package structure with electromagnetic shielding effect as claimed in claim 7, wherein one side of the female mold is recessed inward to form a receiving cavity, and a bottom wall of the receiving cavity is provided with a protrusion, the protrusion is conformal to the whole structure of the electronic component assembly, and the height of the protrusion is smaller than the depth of the receiving cavity; the male die is arranged on one side of the female die, which is provided with the containing groove, so that the containing groove correspondingly forms the injection molding cavity.

9. The method as claimed in claim 1, wherein the inner wall of the receiving cavity of each package is deposited by electroless plating, evaporation, sputtering or vapor deposition to form the metal film on the inner wall of the receiving cavity.

10. The method for manufacturing a package structure with electromagnetic shielding effect as claimed in claim 1, wherein the step of forming a metal film on the inner wall of the receiving groove comprises:

providing a bearing mold, wherein the bearing mold comprises a support plate and a limiting plate detachably arranged on one surface of the support plate, the limiting plate is provided with at least one penetrating limiting groove, and the support plate partially exposes out of the limiting plate;

accommodating each packaging body in one limiting groove, wherein one side of each packaging body, provided with the accommodating groove, deviates from the supporting plate;

forming a metal film on the inner wall of the accommodating groove of the packaging body arranged in the limiting groove;

covering gummed paper on one side of the limiting plate, which is far away from the supporting plate, wherein the gummed paper is adhered to the limiting plate and the packaging body in the limiting groove;

inverting the bearing mold provided with the gummed paper, and removing the supporting plate to expose the packaging body with the metal film in the limiting groove; and

and adsorbing one side of the packaging body, which is far away from the gummed paper, so as to take the packaging body out of the limiting groove, thereby obtaining the packaging body with the metal film.