CN115219550A - Non-contact detection equipment and method for heat pipe - Google Patents
Non-contact detection equipment and method for heat pipe Download PDFInfo
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Abstract
The invention provides a non-contact detection device and a non-contact detection method for a heat pipe. The invention controls the infrared heating module to heat the heat pipe to be measured based on the heating parameters, and controls the infrared temperature measuring module to measure the measured temperature data of the heat pipe to be measured. During the heating process, the temperature slope of the measured temperature data is monitored, and when the temperature slope converges to the stop slope, a score is determined based on the temperature slope, and the quality of the heat pipe is determined according to the score. The invention can effectively judge the quality of the conductivity of the heat pipe.
Description
Technical Field
The present invention relates to heat pipe inspection, and more particularly to non-contact heat pipe inspection.
Background
At present, most of heat pipes are detected by adopting a contact type detection mode. Specifically, the contact detection method is to heat the heating block to a constant temperature, and then contact the heating block with the heat pipe to heat the heat pipe through heat conduction until the temperature of the heat pipe reaches a steady state. Then, the contact temperature sensor is used to contact two points on the heat pipe to measure the temperature of the two points, and determine whether the conduction effect of the heat pipe is good or not according to the temperature difference of the two points.
The existing contact detection mode at least has the following problems:
1. the contact detection method must heat the heating block to a constant temperature and wait for the temperature of the heat pipe to reach a steady state, thereby greatly increasing the detection time.
2. The heating block has a problem of heat dissipation, and the different contact forces or areas between the heating block and the heat pipe may cause different heating powers, so that it is impossible to provide a stable heating power to the heat pipe.
3. The temperature of the contact temperature sensor is usually lower than the temperature of the heated heat pipe, so that when the contact temperature sensor contacts the heat pipe, the temperature difference causes measurement errors; in addition, the magnitude of the contact force also affects the thermal resistance, and the measurement results are different for different thermal resistances.
4. The difference in temperature between two points on the heat pipe can be different due to different heating powers, so that the detection result can not be used for judging the conduction effect.
Therefore, the conventional contact detection method has the above problems, and a solution to be more effective is urgently proposed.
Disclosure of Invention
The main objective of the present invention is to provide a non-contact detection device and method for heat pipe, which uses non-contact heating and temperature measurement, and can complete the detection without reaching the steady temperature of the heat pipe.
The invention provides a non-contact detection method of a heat pipe, which is applied to a non-contact detection device comprising an infrared heating module and an infrared temperature measuring module, and comprises the following steps: a) Acquiring a heating parameter and object information of a heat pipe to be measured; b) Calculating a stopping slope based on an infrared heating parameter of the infrared heating module and an object heating parameter of the heat pipe to be tested; c) Controlling the infrared heating module to heat the heat pipe to be measured based on the heating parameters, and controlling the infrared temperature measuring module to measure a measurement temperature data of the heat pipe to be measured; d) Monitoring a temperature slope of the measured temperature data during the heating process; e) When a stop condition is monitored to be met, performing a scoring process based on the temperature slope to determine a score for detecting the heat pipe to be detected, wherein the stop condition comprises that the temperature slope converges to the stop slope; and f) when the grade of the heat pipe to be tested is better than a grade threshold, judging that the heat pipe to be tested is a good product, and when the grade is not better than the grade threshold, judging that the heat pipe to be tested is a poor product.
The invention also provides non-contact detection equipment of the heat pipe, which comprises an infrared heating module, an infrared temperature measuring module and a control module electrically connected with the infrared heating module and the infrared temperature measuring module. The infrared heating module is configured to heat a conduit to be heated based on a heating parameter; the infrared temperature measurement module is configured to measure a measured temperature data of the heat pipe to be measured; the control module is configured to obtain a heating parameter and an object information of the heat pipe to be tested, the control module is configured to calculate a stop slope based on an infrared heating parameter of the infrared heating module and an object heating parameter of the heat pipe to be tested, the control module is configured to monitor a temperature slope of the measured temperature data during heating, and determine a score of the heat pipe to be tested based on the temperature slope when a stop condition is satisfied, the control module is configured to determine that the heat pipe to be tested is inferior when the score of the heat pipe to be tested is superior to a score threshold, and determine that the heat pipe to be tested is inferior when the score is not superior to the score threshold, wherein the stop condition includes convergence of the temperature slope to the stop slope.
The invention can effectively judge the quality of the conductivity of the heat pipe.
Drawings
Fig. 1 is an architecture diagram of a non-contact detection apparatus according to an embodiment of the present invention.
Fig. 2 is an architecture diagram of a non-contact detection device according to another embodiment of the invention.
FIG. 3 is an architecture diagram of a processor according to another embodiment of the invention.
FIG. 4 is a flowchart illustrating a non-contact detection method according to an embodiment of the invention.
FIG. 5 is a partial flowchart of a non-contact detection method according to another embodiment of the invention.
FIG. 6 is a partial flowchart of a non-contact detection method according to another embodiment of the invention.
FIG. 7 is a partial flowchart of a non-contact detection method according to another embodiment of the invention.
FIG. 8 is a schematic diagram of a non-contact detection arrangement according to an embodiment of the present invention.
Fig. 9 is an external view of one surface of a heat pipe according to an embodiment of the invention.
Fig. 10 is another external view of the heat pipe of fig. 9.
FIG. 11 is a graph of heating power versus voltage according to an embodiment of the present invention.
FIG. 12 is a graph of temperature slope versus time in accordance with an embodiment of the present invention.
Description of reference numerals:
1: non-contact detection device
10: control module
11: infrared heating module
12: infrared temperature measuring module
10: control module
100: processor with a memory having a plurality of memory cells
101: communication device
102: human-machine interface
103: storage device
11: infrared heating module
110: heating element
12: infrared temperature measuring module
120: measuring element
121: measuring element
20: operation platform
21: positioning jig
210-212: mounting structure
213: base seat
22: heat pipe
30: heating control module
31: measurement control module
32: stop monitoring module
33: grading module
34: heating scoring module
35: conductance scoring module
36: convection scoring module
37: threshold calculation module
38: initialization module
A1-A3, T1, T2, H: position of
L1, L2: distance between two adjacent plates
D1-D3: area of
S10-S15: heating and detecting steps
S20-S23: initialization step
S30-S33: grading step
S40-S45: judging step
S50-S51: threshold obtaining step
Detailed Description
The following detailed description of a preferred embodiment of the present invention will be made with reference to the accompanying drawings.
The invention provides non-contact detection equipment and a method, which realize non-contact heating and temperature measurement by infrared heating and infrared temperature measurement, thereby providing stable heating power and avoiding the problem of measurement error caused by the temperature difference between a contact temperature sensor and a heat pipe.
In addition, the invention evaluates the heat conductivity of the heat pipe based on the slope of the temperature change, not only has high accuracy, but also can finish the detection without waiting for the heat pipe to reach the steady temperature, and can greatly reduce the detection time.
Fig. 1 is a schematic diagram of a non-contact detection apparatus according to an embodiment of the invention.
The non-contact detection device 1 of the present embodiment includes an infrared heating module 11, an infrared temperature measuring module 12, and a control module 10 electrically connected to the modules.
An infrared heating module 11, such as a halogen heater, a short wave infrared heater, a fast medium wave infrared heater, a carbon medium wave infrared heater, a (carbon dioxide) laser heater, or other type of infrared heater, is controlled to heat the article based on the heating parameters.
It is worth mentioning that compared with the hot blast stove which carries out indirect heating through hot air convection, the heating efficiency is poorer, the infrared heating module 11 of the invention carries out direct heating through the infrared radiation heat pipe, and can provide better heating efficiency.
An infrared temperature measuring module 12, such as a single-point infrared thermometer, a multi-point infrared thermometer, a laser thermometer, or other types of infrared thermometers, is used to continuously measure the surface temperature of the heat pipe.
A control module 10 (e.g. a computer, a processor, a microcontroller, a control box, etc.) is used to control the non-contact detection device 1 to implement the non-contact detection of the present invention.
Fig. 2 is a schematic diagram of a non-contact detection apparatus according to another embodiment of the invention.
As shown in fig. 2, the control module 10 may be a computer system (e.g., a general-purpose computer system such as a personal computer, a tablet computer, a smart phone, a notebook computer, etc.), and is connected to the infrared heating module 11 and the infrared temperature measuring module 12 through a communication device 101.
The control module 10 may include a communication device 101, a human-machine interface 102, a storage device 103, and a processor 100 (e.g., a central processing unit) electrically connected to the device.
The communication device 101 (a communication interface such as a network card, a Wi-Fi interface, a bluetooth interface, a USB interface, an ethernet interface, a ZigBee interface, an RS232 interface, or any combination thereof) is used to connect an external device for communication.
The human-machine interface 102 (any combination of input devices such as a keyboard, a mouse, and a touch pad, output devices such as a display, a speaker, a buzzer, and an indicator, or input and output devices such as a touch screen) is used for receiving user input and outputting information.
The storage device 103 (e.g., a hard disk, a solid state drive, a flash memory, a RAM, an EEPROM, etc.) is used for storing data.
The processor 100 is used for operating the devices and modules to implement the non-contact detection of the present invention (described in detail later).
Please refer to fig. 3, which is a diagram illustrating an architecture of a processor according to another embodiment of the present invention. The processor 100 of the present invention may include all or some of the following modules 30-38, with each of the modules 30-38 being configured to perform a different function.
1. The heating control module 30: is configured to control the infrared heating module 11.
2. The measurement control module 31: is configured to control the infrared temperature measurement module 12.
3. The stop monitoring module 32: is configured to monitor whether a preset stop condition is met.
4. The scoring module 33: is configured to score the test.
In one embodiment, scoring module 33 may include a heating scoring module 34, a conduction scoring module 35, and a convection scoring module 36. The heating scoring module 34 is configured to score the heating status detected this time. The conductivity scoring module 35 is configured to score the conductivity of the heated conductive object. The convection scoring module 36 is configured to score the environmental condition (e.g., thermal convection) detected this time.
5. The threshold calculation module 37: configured to calculate scoring thresholds (e.g., a heating scoring threshold, a conduction scoring threshold, and a convection scoring threshold) that are used as criteria for determining whether a heating state, an environmental state, or a conductivity property is good or bad.
6. The initialization module 38: is configured to perform initialization setting before detection.
The aforementioned modules 30-38 are interconnected (e.g., electrically and information connected), and may be a hardware module (e.g., an electronic circuit module, an integrated circuit module, soC, etc.), a software module (e.g., firmware, operating system or application), or a mixture of both.
It should be noted that when the modules 30-38 are software modules (e.g., application programs), the storage device 103 may include a non-transitory computer-readable recording medium storing a computer program having computer-executable program codes, and the functions of the modules 30-38 can be realized when the processor 100 executes the program codes.
Referring to fig. 2, in an embodiment, the control module 10 is only used for controlling the heating of the infrared heating module 11 and the temperature measurement of the infrared temperature measuring module 12, but does not perform the scoring process.
Specifically, the modules 33-38 may be built on the computing platform 20 (e.g., a cloud computing service platform or a remote server), and the control module 10 may connect to the computing platform 20 through the communication device 101 to obtain initialization related data (e.g., a rating threshold, a stop condition, etc. described later), and upload the collected data (e.g., temperature measurement data or slope data) to the computing platform 20, so that the computing platform 20 performs computing processing to obtain various ratings. Therefore, since the high load calculation is executed by the computing platform 20, the control module 10 only needs to have general processing capability, and can use a lower-order processor.
In one embodiment, the infrared heating module 11 may include one or more heating elements (fig. 2 shows one heating element 110 as an example), such as a combination of an infrared light source and a lens. Each heating element 110 may heat a single point or a small area (the heating area depends on the projected area of the infrared rays) on the heat pipe. Thus, when multiple heating elements 110 are provided, multiple points or large areas on the heat pipe 22 can be heated simultaneously, thereby increasing the heating power.
In one embodiment, the infrared temperature measurement module 12 may include one or more measurement elements (two measurement elements 120-121 are illustrated in FIG. 2). Each of the measurement elements 120-121 may be, for example, a set of infrared thermometers that measure the temperature of a single point on the heat pipe 22. Thus, when multiple measuring elements 120-121 are provided, temperature measurements can be made at multiple points on the heat pipe at the same time, and more temperature measurement data can be obtained.
In an embodiment, the non-contact detection apparatus 1 further includes a positioning fixture 21. The positioning fixture 21 is used to fix the heat pipe 22 to be measured, so that during the heating process, the infrared heating module 11 can continuously heat the same position of the heat pipe 22, and the infrared temperature measuring module 12 can continuously measure the temperature of the same position of the heat pipe 22.
Please refer to fig. 8, which is a schematic diagram illustrating a non-contact detection configuration according to an embodiment of the present invention. As shown, the positioning fixture 21 may include a first mounting structure 211, a second mounting structure 212, a third mounting structure 210 disposed between the first mounting structure 211 and the second mounting structure 212, and a base 213.
When the heat pipe 22 to be tested is to be tested, the heating element 110 of the infrared heating module 1 is fixedly mounted on the first mounting structure 211, the measuring elements 120-121 of the infrared temperature measuring module 12 are fixedly mounted on the second mounting structure 212, and the heat pipe 22 to be tested is fixedly clamped on the third mounting structure 210.
Thus, the heating element 110 can heat the heating position A1 on one surface of the heat pipe 22, and the measuring elements 120 to 121 can measure the temperature of the plurality of measuring positions A2 and A3 on the other surface (different surface) of the heat pipe 22.
In one embodiment, one of the measurement positions A2 is located right behind the heating position A1 to measure the temperature near the heating point, and at least one of the measurement positions A3 is located right behind the heating position A1 to measure the temperature far from the heating point. With the above arrangement, the present invention can obtain the temperature difference between the measurement locations A2 and A3, and use the temperature difference to score the conductivity of the heat pipe 22 (described in detail later).
In one embodiment, the heat pipe 22 is coated with dark color radiation paint on the heating position A1 and the measuring positions A2 and A3, and the dark color radiation paint can improve the absorption of radiation heat and the heating efficiency, and improve the success rate and accuracy of temperature measurement.
In one embodiment, the coated area of the dark color radiation paint at the heating position A1 is larger than the (laser) infrared ray irradiation area D1 of the heating element 110, so that the heating infrared ray can be completely irradiated on the dark color radiation paint. Furthermore, the application area of the dark radiation paint at each measuring position A2, A3 is larger than the measuring areas D2, D3 of the measuring elements 120, so that the temperature measuring infrared rays can be completely irradiated on the dark radiation paint.
In one embodiment, the distance L1 (the first distance) between the heating element 110 and the heat pipe 22 is adjusted based on the focal length of the lens of the heating element 110, such as equal to the focal length of the lens, so that the thermal infrared rays can be effectively focused at the heating position A1.
In addition, the distance L2 (second distance) between the measuring elements 120 and 121 and the heat pipe 22 is adjusted based on the focal length of the lenses of the measuring elements 120 and 121, such as equal to the focal length of the lenses, so that the temperature measuring infrared rays can be effectively focused at the measuring positions A2 and A3.
In one embodiment, the second distance between the measuring elements 120 and 121 and the heat pipe 22 is equal, such as the distance L2, thereby eliminating temperature measurement errors caused by different measuring distances.
Referring to fig. 9 and 10, fig. 9 is a schematic view of one side of a heat pipe according to an embodiment of the invention, and fig. 10 is a schematic view of another side of the heat pipe of fig. 9.
The invention is especially suitable for the heat conduction detection of the ultrathin soaking plate (VC). Specifically, the present invention can heat the heating position H (fig. 10) on one side of the ultra-thin soaking plate and measure the temperature of the measurement positions T1 and T2 on the other side, wherein the measurement position T1 is located on the front and back sides of the heating position H.
And when the heating position H of the ultrathin soaking plate is heated, the liquid below the wall surface at the end of the heating position H absorbs heat and turns into vapor and goes to other positions (such as the end of the measuring position T2) with low pressure, the liquid is condensed again after contacting the wall surface at the end of the measuring position T2 to absorb heat and then flows back to the end of the heating position H to form heat circulation, and the heat dissipation function is realized.
Please refer to fig. 4, which is a flowchart illustrating a non-contact detection method according to an embodiment of the invention.
Step S10: the processor 100 obtains heating parameters, a stopping slope, and object information for the heat pipe 22 under test.
The heating parameter is used to control the heating power output by the infrared heating module 11. The stop slope is used to determine whether to stop the detection. The item information may include, but is not limited to, mass, area, specific heat capacity, target temperature, etc. of the heat pipe 22.
The heating parameter, the stop slope and the object information may be preset and stored in the storage device 103, or may be manually input by a user, without limitation.
In one embodiment, the processor 100 may obtain the infrared heating parameters of the infrared heating module 11 (i.e. the heating capacity of the infrared heating module 11) and the object heating parameters of the heat pipe 22 (i.e. the temperature variation capacity of the heat pipe 22), and calculate the stop slope according to the infrared heating parameters and the object heating parameters.
Step S11: the processor 100 controls the infrared heating module 11 to heat the heat pipe 22 through the heating control module 30 based on the heating parameters, and controls the infrared temperature measurement module 12 to continuously measure the temperature of the heat pipe 22 under heating through the measurement control module 31 to obtain measured temperature data of the measurement location.
In one embodiment, processor 100 may control the plurality of measurement elements 120-121 of IR temperature measurement module 12 to simultaneously measure a plurality of measurement locations A2-A3 of heat pipe 22 to obtain a plurality of measured temperature data for the plurality of measurement locations A2-A3.
Step S12: during the heating process, the processor 100 obtains the measured temperature data of the infrared temperature measuring module 12 through the measurement control module 31, and monitors the temperature slope of the measured temperature data in real time, for example, calculates the slope corresponding to the temperature change between two consecutive time points (e.g. 0.5 second, 1 second, 5 seconds, 10 seconds, etc.).
Step S13: the processor 100 monitors whether a preset stop condition is satisfied by the stop monitoring module 32.
In one embodiment, the stopping condition includes that the temperature slope converges to a stopping slope (e.g., the temperature slope gradually decreases to the stopping slope), i.e., the stopping monitoring module 32 determines to stop the detection when the real-time temperature slope converges to the stopping slope.
In one embodiment, the stop condition includes that the accumulated heating time (i.e., the heating duration) reaches the upper limit of the detection time (e.g., 1 minute, 5 minutes, 30 minutes, etc.), and the stop monitoring module 32 determines to stop the detection when the accumulated heating time is detected to be exceeded.
In one embodiment, the stop conditions include the temperature slope converging to the stop slope and the accumulated heating time, i.e., the temperature slope converging to the stop slope or the accumulated heating time being exceeded, the stop monitoring module 32 determines to stop the detection.
If the stop condition is not satisfied, step S13 is repeatedly executed to continue heating, measuring the temperature, monitoring the temperature gradient, and monitoring whether the stop condition is satisfied.
If the stop condition is satisfied, execute step S14: the processor 100 controls the infrared heating module 11 to stop heating through the heating control module 30, and controls the infrared temperature measuring module 12 to stop temperature measurement through the measurement control module 31.
It should be noted that step S14 is not an essential step. In one embodiment, the present invention can continue to heat and measure the temperature after the stop condition is satisfied, and directly execute step S15 to score the heat pipe 22 with the data before the stop condition is satisfied.
Step S15: processor 100, via scoring module 33, performs a scoring process based on the temperature slope of the measured temperature data to determine a score for detecting heat pipe 22. The score may be a numerical value, with the magnitude of the numerical value indicating a preference for a property (e.g., conduction, convection, or heating), with a greater numerical value indicating a better preference, or a smaller numerical value indicating a better preference.
In an embodiment, the scoring module 33 may further compare the score of the detected heat pipe 22 with a predetermined score threshold, and determine that the heat pipe 22 is good when the score is better than the score threshold, and determine that the heat pipe 22 is bad when the score is not better than the score threshold. The score may be set such that a larger value indicates better quality, or a smaller value indicates better quality, and is not limited thereto.
In one embodiment, the scoring module 33 may compare one or more temperature slopes (slope data) of the measured temperature data with one or more predetermined good product slopes, and score the score according to the degree of conformity.
In one embodiment, when the cumulative heating time is exceeded, this indicates that the heat pipe 22 may not be able to find a significant conduction characteristic within the specified time due to poor conductivity. In this regard, the scoring module 33 may directly give the heat pipe 22 a poor score (e.g., a poor grade score) or directly determine as a poor product.
Therefore, the invention can detect the conductivity of the heat pipe in a non-contact detection mode.
Referring to fig. 4 and 5, fig. 5 is a partial flowchart of a non-contact detection method according to another embodiment of the invention. Compared to the embodiment of fig. 4, the step S10 of the embodiment of fig. 5 further includes specific initialization steps S20 to S23, wherein the execution sequence of the steps S21 to S23 can be arbitrarily changed or executed simultaneously according to the user' S requirement.
Step S20: the processor 100 sets the object information and the target temperature through the initialization module 38.
In one embodiment, the user may directly input object information (e.g., mass, size, material, specific heat capacity, single or full area, etc.) of the heat pipe 22 via the human-machine interface 102 and may input a target temperature (e.g., 60, 70, or 80 degrees Celsius, etc.).
In an embodiment, the initialization module 38 can read a plurality of pre-stored object information and a plurality of pre-stored target temperatures from the storage device 103 and display the object information and the target temperatures on the human-machine interface 102 for the user to select by using the human-machine interface 102.
Step S21: the processor 100 calculates the heating parameters of the infrared heating module 11 through the initialization module 38.
In one embodiment, the heating parameters include a heating input voltage of the infrared heating module 11, and the heating power output by the infrared heating module 11 can be adjusted by adjusting the heating input voltage.
Specifically, the initialization module 38 may obtain an object heating parameter for the heat pipe 22 based on the mass and specific heat capacity of the heat pipe 22, and then calculate the heating input voltage as the heating parameter based on the object heating parameter and the infrared heating parameters (such as the infrared heater power, the infrared emissivity and the radiation attenuation rate) of the infrared heating module 11.
In one embodiment, the object heating parameter P is applied to the heat pipe 22 VC Can be based on infrared heater power P IR Infrared ray emissivity E IR All or part of the factors such as the radiation attenuation factor σ are calculated, but the calculation is not limited thereto.
In one embodiment, the object heating parameter P is applied to the heat pipe 22 VC Can also be based onThe mass m of the heat pipe 22, the specific heat capacity cp of the heat pipe 22, and the measured temperature T1 of the heat pipe 22 are calculated as a whole or a part of the factors, but are not limited thereto.
Therefore, by the above relationship, the present invention can obtain the infrared emissivity E IR 。
In one embodiment, the initialization module 38 may calculate the infrared heater power based on the following equations (equation one) and (equation two).
P VC ＝P IR ×E IR X sigma- (formula one)
Wherein, P VC Is an article heating parameter for the thermally conductive article 22; p IR Infrared heater power; e IR Is the infrared emissivity; sigma is the radiation attenuation rate; m is the mass of the thermally conductive article 22; cp is the specific heat capacity of the thermally conductive article 22; t1 is the measured temperature of the thermally conductive member 22.
Fig. 11 is a graph showing a relationship between heating power and voltage according to an embodiment of the present invention. After calculating the power of the infrared heater, the initialization module 38 can calculate the corresponding heating input voltage as the heating parameter according to the specification of the infrared heating module 11 (see fig. 11). For example, when the infrared heater power is 10W, the heating input voltage is 7.5V.
Referring back to fig. 5, step S22: the processor 100 calculates the upper detection time limit via the initialization module 38. The aforementioned upper detection time limit may be used as part of the stop condition.
Specifically, the initialization module 38 obtains the set target temperature, and calculates the upper limit of the detection time based on the temperature difference between the target temperature and the ambient temperature, the object information of the heat pipe 22, the object heating parameter, and the ambient convection parameter.
In one embodiment, the upper limit of time T is detected max May be based on the mass m of the heat pipe 22, the specific heat capacity Cp of the heat pipe 22, the target temperature SV, the ambient temperature T env To heatArticle heating parameter P of conduit 22 VC The single-side area A of the heat pipe 22 vc The ambient convection coefficient H (generally between
) And (d) or the like, but is not limited thereto.
In one embodiment, the initialization module 38 may calculate the upper detection time limit based on the following equation (three).
Wherein, T max Is the upper limit of detection time; m is the mass of the thermally conductive article 22; cp is the specific heat capacity of the thermally conductive article 22; SV is the target temperature; t is a unit of env Is ambient temperature; p VC Is an article heating parameter for the thermally conductive article 22; a. The vc Is the single-sided area of the thermally conductive member 22; h is the ambient convection coefficient, generally between
Step S23: the processor 100 calculates the stop slope via the initialization module 38. The aforementioned stopping slope is used as part of the stopping condition.
Please refer to fig. 12, which is a graph of temperature slope versus time according to an embodiment of the present invention.
Specifically, the initialization module 38 may calculate a time-temperature simulation variation of the heat pipe 22 (as shown in fig. 12) based on the temperature difference between the target temperature and the ambient temperature, the object information of the heat pipe to be tested, and the object heating parameter and the ambient convection parameter simulation, and set a stop slope based on the time-temperature simulation variation and the upper limit of the detection time. For example, slope 4 (corresponding to time 50 seconds) or slope 2.8 (corresponding to time 100 seconds) may be selected.
In one embodiment, the stop slope is greater than 1, i.e., the detection is terminated before the temperature of the heat pipe 22 reaches steady state.
Therefore, the invention can complete initialization setting.
Referring to fig. 4 and fig. 6 together, fig. 6 is a partial flowchart of a non-contact detection method according to another embodiment of the invention. Compared to the embodiment of fig. 4, step S15 of the embodiment of fig. 6 further includes specific initialization steps S30 to S33, wherein the execution sequence of steps S31 to S33 can be arbitrarily changed or executed simultaneously according to the user' S requirement.
Step S30: processor 100 calculates slope data of the acquired measured temperature data by using scoring module 33, where the slope data includes a plurality of slopes, and the plurality of slopes respectively correspond to temperature variation degrees of heat pipe 22 at different time intervals during the heating process.
Step S31: the processor 100 calculates the heating score of the infrared heating module 11 in the current test by the heating scoring module 34 based on a plurality of slopes of the slope data.
In one embodiment, the heating score module 34 may select all or a portion (e.g., a designated time interval) of the slopes of the slope data and calculate an average of the selected slopes to obtain the heating score.
In one embodiment, as shown in FIG. 8, when the plurality of measurements of the heat pipe 22 are performed at the same time, the heating score module 34 may select the temperature measurement data of the measurement position A2 right behind (or closest to) the heating position A1 to calculate the heating score, so that the heating score is closer to the heating performance of the infrared heating module 11.
Step S32: processor 100 calculates a convection score for the detection environment via convection scoring module 36.
Step S33: processor 100 calculates a conduction score for heat pipe 22 via conduction scoring module 35.
In one embodiment, as shown in fig. 8, when the measurement positions A2 and A3 are measured to obtain the temperature measurement data of the measurement positions A2 and A3 (e.g., when heating is started until the stop condition is satisfied, two sets of temperature curves of the measurement positions A2 and A3 in the period, or heating is started for a specified period (e.g., 3 seconds after heating is started) until the stop condition is satisfied, two sets of temperature curves of the measurement positions A2 and A3 in the period), the processor 100 calculates the temperature difference data between the measurement temperature data (e.g., performs subtraction on the two sets of measurement temperature data to obtain the temperature difference data between the measurement positions A2 and A3) by the convection scoring module 36 and the conduction scoring module 35, and then calculates the convection scoring and the conduction scoring based on the slope data and the temperature difference data.
In one embodiment, the convection scoring module 36 and the conduction scoring module 35 divide the slope data by the temperature difference data to obtain characteristic data (e.g., convection characteristic data or conduction characteristic data), then calculate a regression (e.g., least squares) on the characteristic data to obtain an exponential decay equation (e.g., fitting the characteristic data to a set of curves to obtain an exponential decay equation of the curves), and determine the convection score and the conduction score based on the exponential decay equation.
Further, as shown in fig. 8, when there are a plurality of measurement positions A2 and A3, the calculation is to obtain characteristic data by dividing the slope data of the temperature measurement data of the measurement position A2 right behind (or closest to) the heating position A1 by the temperature difference data, but the invention is not limited thereto, and the temperature measurement data of the measurement position A2 located farther away may be used.
It should be noted that the exponential decay formula includes a base portion and an exponential portion, and the present invention determines the conduction score based on the base portion and determines the convection score based on the exponential portion.
Therefore, the invention can determine different types of scores.
In the embodiment of fig. 6, S40-S45 for determining the detection result based on the score is further included, wherein the execution sequence of steps S40-S42 can be changed arbitrarily according to the user' S requirement, or be executed simultaneously.
Step S40: processor 100, via heat scoring module 34, determines whether the heat score is worse than a predetermined heat score threshold.
If the heating score is worse than the heating score threshold, executing step S44: the processor 100 sends an alert through the human machine interface 102 to prompt the user to heat up in a poor state.
If the heating score is better than the heating score threshold, it indicates that the heating state is good (if the heating power is stable), step S41 is executed: processor 100 determines whether the convection score is worse than a predetermined convection score threshold by convection scoring module 36.
If the convection score is worse than the convection score threshold, step S44 is executed: the processor 100 issues an alert through the human machine interface 102 to indicate to the user that the environmental state (especially the convection state) is not good.
After performing step S44, the processor 100 may then perform step S42 to continuously determine whether the conducted score is qualified, but is not limited thereto.
In another embodiment, the detected conduction score may not accurately reflect the good or bad conductivity of the heat pipe 22 when the heating or environmental conditions are not good. In this regard, the processor 100 may end the detection after step S4 without evaluating the quality of the heat pipe 22.
If the convection score is better than the convection score threshold, it indicates that the current environment state is good, execute step S42: the processor 100 determines whether the score (conduction score) of the heat pipes 22 is higher than the score threshold (conduction score threshold) by the scoring module 33 (conduction score module 35) to determine whether the heat pipes 22 are good or bad (defective).
If the conduction score is worse than the conduction score threshold, indicating poor conduction, step S43 is executed: the processor 100 determines that the heat pipe 22 is defective via the conduction scoring module 35 and may further display a defective notification via the human machine interface 102.
If the conduction score is better than the conduction score threshold, indicating good conduction, step S45 is performed: processor 100 determines that heat pipe 22 is good through conduction scoring module 35 and may further display a good notification through human machine interface 102.
The present invention can effectively detect the conductivity of the heat pipe 22 and automatically generate a detection result.
In addition, the invention can simultaneously detect the heating state and the environment state so as to avoid the misjudgment of the detection result caused by poor heating state or environment state.
Referring to fig. 4-7, fig. 7 is a partial flowchart of a non-contact detection method according to another embodiment of the invention. Compared with the embodiment of fig. 4, the embodiment of fig. 7 further provides a function of calculating the score threshold, and the score threshold corresponding to good products can be obtained by detecting good products of the same type. The method of this embodiment further comprises the following steps.
Step S50: the user can perform multiple inspections (by performing steps S10-S15 at least twice) on the non-contact inspection apparatus 1 on the good heat pipes of the same type as the heat pipes 22 to be inspected to obtain multiple good scores (by performing steps S30-S33), such as multiple heating good scores, multiple convection good scores, and multiple conduction good scores obtained by multiple inspections.
Step S51: the processor 100 obtains the good scores through the threshold calculation module 37, and sets a score threshold based on the good scores.
In one embodiment, the threshold calculating module 37 calculates a heating score threshold based on a plurality of heating good scores, calculates a convection score threshold based on a plurality of convection good scores, and calculates a conduction score threshold based on a plurality of conduction good scores.
In one embodiment, the threshold calculation module 37 calculates an average (e.g., a weighted average or a general average) of the good scores and adjusts the average appropriately.
For example, if a higher score indicates better, the score threshold may be set in a range of 20%, 10%, or ± 10% of the mean value.
In another example, if a lower score indicates better, the score threshold may be set to a range of 20% improvement, 10% improvement, or ± 15% improvement in the mean.
Therefore, the invention can effectively set the scoring threshold of each type, thereby being beneficial to judging the usability of the detection result.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, so that equivalent variations using the teachings of the present invention are all included within the scope of the present invention, and it is obvious that the present invention is not limited thereby.
Claims (20)
1. A non-contact detection method of a heat pipe is applied to a non-contact detection device comprising an infrared heating module and an infrared temperature measuring module, and comprises the following steps:
a) Acquiring a heating parameter and object information of a heat pipe to be measured;
b) Calculating a stopping slope based on an infrared heating parameter of the infrared heating module and an object heating parameter of the heat pipe to be tested;
c) Controlling the infrared heating module to heat the heat pipe to be measured based on the heating parameters, and controlling the infrared temperature measuring module to measure a measurement temperature data of the heat pipe to be measured;
d) Monitoring a temperature slope of the measured temperature data during the heating process;
e) When a stop condition is monitored to be met, performing a scoring process based on the temperature slope to determine a score for detecting the heat pipe to be detected, wherein the stop condition comprises that the temperature slope converges to the stop slope; and
f) When the grade of the heat pipe to be tested is better than a grade threshold, the heat pipe to be tested is judged to be good, and when the grade is not better than the grade threshold, the heat pipe to be tested is judged to be inferior.
2. The method of claim 1, wherein the step a) comprises the steps of:
g1 Obtaining the heating parameter of the object based on the mass and specific heat capacity of the heat pipe to be measured; and
g2 Obtain a heating input voltage of the infrared heating module as the heating parameter based on the object heating parameter and the infrared heating parameter.
3. The method of claim 1, wherein the stop condition comprises an accumulated heating time reaching an upper detection time limit;
wherein, the step c) also comprises the following steps before:
h1 Setting a target temperature based on a user operation; and
h2 The upper detection time limit is obtained based on a temperature difference between the target temperature and an ambient temperature, the object information, the object heating parameter, and an ambient convection parameter.
4. The method of claim 1, wherein the step b) comprises the steps of:
i1 Simulating and calculating a time-temperature simulation variation of the heat pipe to be tested based on a temperature difference between a target temperature and an ambient temperature, the object information, the object heating parameter, the infrared heating parameter and an ambient convection parameter; and
i2 The stop slope is set based on the time-temperature analog change and the upper detection time limit, wherein the stop slope is greater than 1.
5. The method of claim 1, further comprising, before the step e), the steps of:
j1 Based on the heating parameters, controlling the infrared heating module to heat a good product heat pipe of the same type as the heat pipe to be measured, and controlling the infrared temperature measuring module to measure a measured temperature data of the good product heat pipe;
j2 Calculating a good product score for the good product heat pipe based on the measured temperature data of the good product heat pipe;
j3 Repeating the steps j 1) and j 2) at least twice to obtain a plurality of good scores; and
j4 Set the score threshold based on the plurality of good scores.
6. The method of claim 1, wherein the scoring process comprises:
k1 Calculating a slope data of the measured temperature data; and
k2 Calculating a heating score based on a plurality of slopes of the slope data, wherein the plurality of slopes respectively correspond to different time intervals of the heating process;
wherein, the step e) comprises a step l 1) of sending out a warning to prompt that the heating state is poor when the heating score is less than a heating score threshold.
7. The method as claimed in claim 1, wherein the step c) controls the infrared temperature measurement module to measure a plurality of measurement positions of the heat pipe to be measured to obtain the plurality of measurement temperature data of the plurality of measurement positions;
wherein the scoring process comprises:
m 1) calculating a slope data of the measured temperature data;
m 2) calculating temperature difference data among the plurality of measured temperature data; and
m 3) calculating a convection score and a conduction score based on the slope data and the temperature difference data;
wherein, the step e) comprises the following steps:
n 1) when the convection score is worse than a convection score threshold, sending out an alarm to prompt that the environment state is not good;
n 2) when the conduction score is superior to a conduction score threshold, judging that the heat pipe to be tested is good; and
n 3) when the conduction score is worse than the conduction score threshold, judging the heat pipe to be tested as a poor product.
8. The method of claim 7, wherein the step m 3) divides the slope data by the temperature difference data to obtain a characteristic data, calculates regression on the characteristic data to obtain an exponential decay formula, and determines the convection score and the conduction score based on the exponential decay formula.
9. The method as claimed in claim 1, wherein said step c) controls said infrared heating module to heat a heating position of one side of said heat pipe to be measured, and controls said infrared temperature measuring module to measure a plurality of measuring positions of another side of said heat pipe to be measured to obtain said plurality of measured temperature data of said plurality of measuring positions;
the heating position is located right behind one of the measuring positions, the heating position and the measuring positions are coated with dark color radiation paint, the area of the dark color radiation paint at the heating position is larger than the laser illumination area of the infrared heating module, and the area of the dark color radiation paint at each measuring position is larger than the measuring area of the infrared heating module.
10. The method as claimed in claim 9, wherein the heat pipe to be tested is an ultra-thin heat spreader, and the step c) is to heat the heating position of the heat pipe to be tested, so that the liquid under the wall surface of the heating position absorbs heat and turns into vapor and goes to other positions with low pressure, and the vapor is condensed back to the liquid again after contacting the wall surface of other positions to absorb heat and then flows back to the heating position to form a heat cycle.
11. A non-contact inspection apparatus for a heat pipe, comprising:
an infrared heating module configured to heat a conduit to be heated based on a heating parameter;
an infrared temperature measurement module configured to measure a measured temperature data of the heat pipe to be measured; and
a control module electrically connected to the infrared heating module and the infrared temperature measuring module, configured to obtain a heating parameter and an object information of the heat pipe to be measured, the control module being configured to calculate a stop slope based on an infrared heating parameter of the infrared heating module and an object heating parameter of the heat pipe to be measured, the control module being configured to monitor a temperature slope of the measured temperature data during heating, and determine a score of the heat pipe to be measured based on the temperature slope when a stop condition is satisfied, the control module being configured to determine that the heat pipe to be measured is good when the score of the heat pipe to be measured is better than a score threshold, and determine that the heat pipe to be measured is inferior when the score is not better than the score threshold, wherein the stop condition includes convergence of the temperature slope to the stop slope.
12. The non-contact sensing device of claim 11, wherein the control module comprises: an initialization module configured to obtain the object heating parameter based on the mass and specific heat capacity of the heat pipe to be tested, and obtain a heating input voltage of the infrared heating module as the heating parameter based on the object heating parameter and the infrared heating parameter, the initialization module configured to calculate a time-temperature simulation change of the heat pipe to be tested based on a temperature difference between a target temperature and an ambient temperature, the object information, the object heating parameter, and an ambient convection parameter simulation, and set the stop slope based on the time-temperature simulation change and the detection time upper limit, wherein the stop slope is greater than 1.
13. The non-contact detection device of claim 11, wherein the stop condition further comprises the cumulative heating time reaching an upper detection time limit;
wherein, this control module includes:
an initialization module configured to set a target temperature based on a user operation, and obtain an upper detection time limit based on a temperature difference between the target temperature and an ambient temperature, the object information, the object heating parameter, and an ambient convection parameter.
14. The non-contact sensing device of claim 11, wherein the control module comprises:
a heating control module configured to control the infrared heating module to heat;
a measurement control module configured to control the infrared temperature measurement module to perform temperature measurement;
a stop monitoring module configured to monitor whether the stop condition is satisfied;
a scoring module configured to calculate the score and configured to compare the score to the score threshold; and
a threshold calculation module configured to perform multiple heating detections on a good product heat pipe of the same type as the heat pipe to be detected through the heating control module, the measurement control module, the stop monitoring module and the scoring module to obtain multiple scores of the good product, and set a scoring threshold based on the multiple scores of the good product.
15. The non-contact sensing device of claim 11, wherein the control module comprises:
a heating scoring module configured to calculate a heating score based on a plurality of slopes of a slope data of the measured temperature data, and send an alert to prompt a bad heating state when the heating score is worse than a heating score threshold, wherein the plurality of slopes respectively correspond to different time intervals of the heating process.
16. The non-contact sensing apparatus of claim 11, wherein the infrared temperature measuring module comprises a plurality of measuring elements for measuring a plurality of measuring positions of the heat pipe under test to obtain the plurality of measured temperature data of the plurality of measuring positions;
wherein, this control module includes:
a conduction score module configured to calculate a conduction score based on a slope data of the measured temperature data and a temperature difference data between the plurality of measured temperature data, determine that the heat pipe to be tested is good when the conduction score is better than a conduction score threshold, and determine that the heat pipe to be tested is poor when the conduction score is worse than the conduction score threshold; and
and the convection scoring module is configured to calculate a convection score based on the slope data and the temperature difference data, and send out an alarm to prompt that the environment state is poor when the convection score is worse than a convection score threshold.
17. The non-contact detection apparatus of claim 11, further comprising a positioning fixture, the positioning fixture comprising:
the first mounting structure is used for mounting the infrared heating module so that the infrared heating module heats a heating position on one surface of the heat pipe to be tested;
a second mounting structure for mounting the infrared temperature measurement module so that a plurality of measurement elements of the infrared temperature measurement module measure a plurality of measurement positions of the other surface of the heat pipe to be measured; and
a third mounting structure, disposed between the first mounting structure and the second mounting structure, for fixing the heat pipe to be tested;
the infrared heating module installed on the first installation structure and the infrared temperature measuring module installed on the second installation structure are respectively arranged on different surfaces of the heat pipe to be tested, which are placed on the third installation structure, in the facing direction.
18. The non-contact sensing apparatus of claim 17, wherein the heating position is directly behind one of the measuring positions, at least one of the measuring positions being directly behind a position away from the heating position;
the heating device comprises a heating position, a plurality of measuring positions and a heat pipe to be measured, wherein the heating position and the measuring positions are coated with dark color radiation paint, the area of the dark color radiation paint at the heating position is larger than the laser illumination area of the infrared heating module, and the area of the dark color radiation paint at each measuring position is larger than the measuring area of the infrared heating module.
19. The non-contact detection apparatus as claimed in claim 17, wherein a first distance between the infrared heating module mounted on the first mounting structure and the heat pipe to be tested mounted on the third mounting structure is adjusted based on a focal length of a lens of the infrared heating module;
wherein, a second distance between the infrared temperature measuring module installed on the second installation structure and the heat pipe to be measured placed on the third installation structure is adjusted based on a preset measuring distance of the infrared temperature measuring module.
20. The non-contact detection apparatus as claimed in claim 11, wherein the heat pipe to be detected is an ultra-thin soaking plate, the infrared heating module is used to heat the heating position of the heat pipe to be detected, so that the liquid under the wall surface of the heating position absorbs heat and turns into vapor and goes to other positions with low pressure, and the vapor is condensed back to the liquid again after contacting the wall surface of other positions to absorb heat and then flows back to the heating position to form a thermal cycle.
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| CN202110424876.9A CN115219550A (en) | 2021-04-20 | 2021-04-20 | Non-contact detection equipment and method for heat pipe |
| US17/410,981 US11774385B2 (en) | 2021-04-20 | 2021-08-24 | Contactless inspection apparatus of heat pipe and method thereof |
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| JP2000230914A (en) * | 1999-02-12 | 2000-08-22 | Hitachi Cable Ltd | Method for inspecting temperature of heat pipe |
| US8029186B2 (en) | 2004-11-05 | 2011-10-04 | International Business Machines Corporation | Method for thermal characterization under non-uniform heat load |
| TWI310833B (en) | 2005-02-04 | 2009-06-11 | Hon Hai Prec Ind Co Ltd | Device and method for measuring thermal conductivity |
| TWI669502B (en) | 2017-12-04 | 2019-08-21 | 行政院原子能委員會核能研究所 | Apparatus of heat pipe quality detection by using infrared thermal imager and method thereof |
| RU2680178C1 (en) * | 2018-03-01 | 2019-02-18 | федеральное государственное бюджетное образовательное учреждение высшего образования "Новгородский государственный университет имени Ярослава Мудрого" | Method for quality control of heat pipe |
| RU2685804C1 (en) * | 2018-05-07 | 2019-04-23 | Акционерное общество "ОКБ-Планета" (АО "ОКБ-Планета") | Method for quality control of heat pipe |
| CN213956088U (en) * | 2020-09-07 | 2021-08-13 | 福建龙净环保股份有限公司 | Monitoring device and monitoring system for heat pipe exchanger |
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