CN115213507B - 一种钴基金刚石复合球齿的真空钎焊方法 - Google Patents
一种钴基金刚石复合球齿的真空钎焊方法 Download PDFInfo
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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Abstract
本发明公开了一种钴基金刚石复合球齿的真空钎焊方法,包括将硬质合金基体进行去污处理;在基体粉末中加入增强体粉末,其中,基体相为Ag‑Cu‑Zn,增强相为质量分数为1‑10%的TiC、0‑2%的CeO;将基体粉末和增强体粉末混合球磨;在粉状混合料中加入钎剂制成膏状,均匀涂敷在钴基金刚石复合球齿及硬质合金基体表面;将涂敷钎料的球齿和硬质合金基体置于真空炉中钎焊。本发明通过加入微米级TiC增强相,极大提高了基体与金刚石的结合强度并强化钎料组织,同时,TiC存在会降低钎焊过程中金刚石的热损伤。加入微米级CeO,不仅可以作为原位形核点形核生长,细化钎料晶粒,还能促进TiC在钎料中的弥散分布,减少应力集中,进一步强化钎料组织。
Description
技术领域
本发明涉及焊接技术领域,尤其涉及一种钴基金刚石复合球齿的真空钎焊方法。
背景技术
目前所发现的天然物质中,金刚石由于其极高的硬度和耐磨性,极低的摩擦系数和热膨胀系数等优良的物理化学性能,广泛应用于切削加工,地质勘探等领域;金刚石磨削工具性能主要由金刚石承载负荷的能力决定,这与金刚石本身强度和连结剂对金刚石的固定能力相关;目前钎焊技术是实现硬质合金基体与金刚石增强体连接技术中最为成熟的一种;应用较为广泛的钎料有Ag-Cu-Zn、Ni-Cr、Cu-Sn-Ti等钎料,可以实现金刚石与硬质合金基体形成良好的冶金结合;但由于Ni-Cr熔点较高,钎焊过程难免会对金刚石产生较大热损伤,降低其使用寿命;而Cu-Sn-Ti虽然熔点低,对金刚石热损伤小,但是与金刚石连接强度低,在钻头工作环境下极易造成球齿脱落,从而致使工件失效,造成的经济损失是极为严重的;碳化物陶瓷相的加入可以解决金刚石与基体结合强度不高,金刚石在工作环境下容易脱落的问题,而且能够减少钎焊过程中金刚石的热损伤,稀土氧化物由于其本身的特性,会使晶粒更细小,碳化物分布更均匀,从而减少焊接处的应力集中,进一步提高其结合强度和冲击韧性,提高其使用寿命。
例如,申请公布号为CN 111299905A的发明专利所公开的一种同时含WC和ZrC的复合钎料及其制备方法、进行钎焊的方法,其采用CuSnTi合金相为基体相,其质量百分比分别为铜70-75%、锡15-20%和钛5~10%,增强相采用WC和ZrC混合粉末,机械混合一段时后,再以5%的丙烯酸和95%的对二甲苯为原料制成钎剂,置于真空钎焊炉中进行真空钎焊;进行磨削实验发现,粘结剂对金刚石的固定效果有一定的改善,但仍无法解决晶粒粗大,焊接处应力集中等问题,其冲击韧性也较差。
发明内容
为了克服现有技术中相关产品的不足,本发明提出一种钴基金刚石复合球齿的真空钎焊方法。
本发明提供了一种钴基金刚石复合球齿的真空钎焊方法,包括如下步骤:
步骤1,基体处理:将硬质合金基体进行去污处理;
步骤2,配料:在基体粉末中加入增强体粉末,其中,基体相为Ag-Cu-Zn,增强相为质量分数为1-10%的TiC、0-2%的CeO;
步骤3,球磨:将基体粉末和增强体粉末混合球磨,球磨过程中采用5mm的磨球,以球磨比为10:1在转速为400rpm下球磨3小时制得;
步骤4,涂敷:在粉状混合料中加入钎剂制成膏状,均匀涂敷在钴基金刚石复合球齿及硬质合金基体表面;
步骤5,真空钎焊:将涂敷钎料的球齿和硬质合金基体置于真空炉中,钎焊温度为700-800℃,保温10-20分钟;
所述基体相为质量百分比的Ag 50-70%,Cu 10-30%,Zn 10-20%,所述TiC粉末的粒径为30-70μm,所述CeO粉末的粒径为10-30μm。
在本发明的某些实施方式中,步骤4中,粉状混合料与钎剂按质量比95:5混合,所述钎剂为5%丙烯酸与95%二甲苯。
在本发明的某些实施方式中,步骤4中,涂敷的焊料厚度为1mm。
在本发明的某些实施方式中,步骤1中,采用丙酮对硬质合金基体进行去污处理。
与现有技术相比,本发明有以下优点:
1、本发明通过加入微米级TiC增强相,极大提高了基体与金刚石的结合强度并强化钎料组织,同时,TiC存在会降低钎焊过程中金刚石的热损伤;加入微米级CeO,不仅可以作为原位形核点形核生长,细化钎料晶粒,还能促进TiC在钎料中的弥散分布,减少应力集中,进一步强化钎料组织。
2、本发明通过在Ag-Cu-Zn基体相中加入TiC增强颗粒,与不添加增强相相比,TiC增强颗粒的加入可以减少成本较高Ag粉的添加量,不仅提高钎料性能,还能降低成本,并且通过控制微米级的粉末粒径,以实现最佳的润湿性及工艺性能。
具体实施方式
为了使本技术领域的人员更好地理解本发明方案,下面将对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例;本发明可以以许多不同的形式来实现,并不限于本文所描述的实施例,相反地,提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面;基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围;本领域技术人员显式地和隐式地理解的是,本文所描述的实施例可以与其它实施例相结合。
实施例1
本发明提供一种钴基金刚石复合球齿的真空钎焊方法,包括:
按质量百分比将54.5%的Ag粉、25%的Cu粉、15%的Zn粉均匀混合,得到Ag-Cu-Zn基体相;在Ag-Cu-Zn基体相中加入质量分数为5%的TiC粉和0.5%的CeO粉,球磨比为10:1,在球磨罐中以400rpm球磨3小时得到复合钎料;将复合钎料与钎剂(5%丙烯酸+95%二甲苯)按质量比95:5混合至膏状,放入烘箱中在80℃下干燥30分钟;将30CrMo基体和钴基金刚石钻头球齿打磨抛光,用丙酮清洗表面油污;在30CrMo基体和钴基金刚石钻头球齿待焊面上分别均匀涂敷前述中烘干的焊料,厚度为1mm,将钴基金刚石钻头球齿放置在30CrMo基体上制得待焊试样;将得到的待焊试样置于真空钎焊炉中,抽真空至8x10-3Pa,以20℃/min的加热速度将焊件升温至900℃,保温15分钟后以5℃/min的速度降温至150℃,然后随炉冷却至室温,即制得本实施例的复合钎料连接钴基金刚石钻头球齿。
实施例2
按质量百分比将55%的Ag粉、24%的Cu粉、15%的Zn粉均匀混合,得到Ag-Cu-Zn基体相;在Ag-Cu-Zn基体相中加入质量分数为5%的TiC粉和1%的CeO粉,球磨比为10:1,在球磨罐中以400rpm球磨3小时得到复合钎料;将复合钎料与钎剂(5%丙烯酸+95%二甲苯)按质量比95:5混合至膏状,放入烘箱中在80℃下干燥30分钟;将30CrMo基体和钴基金刚石钻头球齿打磨抛光,用丙酮清洗表面油污;在30CrMo基体和钴基金刚石钻头球齿待焊面上分别均匀涂敷前述中烘干的焊料,厚度为1mm,将钴基金刚石钻头球齿放置在30CrMo基体上制得待焊试样;将得到的待焊试样置于真空钎焊炉中,抽真空至8x10-3Pa,以20℃/min的加热速度将焊件升温至900℃,保温15分钟后以5℃/min的速度降温至150℃,然后随炉冷却至室温,即制得本实施例的复合钎料连接钴基金刚石钻头球齿。
本说明书中未作详细描述的内容属于本领域专业技术人员公知的现有技术;以上仅为本发明的实施例,但并不限制本发明的专利范围,尽管参照前述实施例对本发明进行了详细的说明,对于本领域的技术人员来而言,其依然可以对前述各具体实施方式所记载的技术方案进行修改,或者对其中部分技术特征进行等效替换;凡是利用本发明说明书内容所做的等效替换,直接或间接运用在其他相关的技术领域,均同理在本发明专利保护范围之内。
Claims (4)
1.一种钴基金刚石复合球齿的真空钎焊方法,其特征在于,包括如下步骤:
步骤1,基体处理:将硬质合金基体进行去污处理;
步骤2,配料:在基体粉末中加入增强体粉末,其中,基体相为Ag-Cu-Zn,增强相为质量分数为1-10%的TiC、0-2%的CeO;
步骤3,球磨:将基体粉末和增强体粉末混合球磨,球磨过程中采用5mm的磨球,以球磨比为10:1在转速为400rpm下球磨3小时制得;
步骤4,涂敷:在粉状混合料中加入钎剂制成膏状,均匀涂敷在钴基金刚石复合球齿及硬质合金基体表面;
步骤5,真空钎焊:将涂敷钎料的球齿和硬质合金基体置于真空炉中,钎焊温度为700-800℃,保温10-20分钟;
所述基体相为质量百分比的Ag 50-70%,Cu 10-30%,Zn 10-20%,所述TiC粉末的粒径为30-70μm,所述CeO粉末的粒径为10-30μm。
2.根据权利要求1所述的钴基金刚石复合球齿的真空钎焊方法,其特征在于:步骤4中,粉状混合料与钎剂按质量比95:5混合,所述钎剂为5%丙烯酸与95%二甲苯。
3.根据权利要求1所述的钴基金刚石复合球齿的真空钎焊方法,其特征在于:步骤4中,涂敷的焊料厚度为1mm。
4.根据权利要求1所述的钴基金刚石复合球齿的真空钎焊方法,其特征在于:步骤1中,采用丙酮对硬质合金基体进行去污处理。
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